CN204810807U - An electromagnetic shielding copper clad laminate and its application in high-speed FPC circuit board - Google Patents

Abstract

The utility model belongs to the technical field of circuit boards, and specifically relates to an electromagnetic shielding copper-clad plate and its application in high-speed FPC circuit boards, including a polyimide substrate layer, a copper foil layer and an absorbing material layer, wherein the absorbing material layer is directly attached to the copper foil layer. The utility model has a simple structure, does not require an isolation layer, has a thickness controlled below 0.1 mm, and has an unaffected bending life. In addition, it does not require grounding, does not need to consider the grounding position, and has no antenna effect. At the same time, it absorbs electromagnetic wave interference from the outside to avoid affecting FPC signal transmission. It can achieve good transmission of single-channel 25Gbps signals. It can be widely used in high-speed communications and other application fields that require high-speed data transmission.

Description

An electromagnetic shielding copper clad laminate and its application in high-speed FPC circuit board

technical field

The utility model belongs to the technical field of circuit boards, in particular to an electromagnetic shielding copper-clad board and its application in high-speed FPC circuit boards.

Background technique

With the development of science and technology and the electronic industry, various electronic equipment applications are increasing, and electromagnetic wave radiation has become a new social hazard. Electromagnetic interference (EMI) caused by electromagnetic wave radiation will not only affect the normal operation of electronic equipment, but with the continuous improvement of communication speed, electromagnetic interference will have more and more influence on the normal operation of electronic and electrical equipment. It is estimated that the world's annual The economic losses caused by electromagnetic interference affecting the operation of equipment amounted to 500 million US dollars.

Scientific research has confirmed that long-term exposure to electromagnetic radiation will seriously affect the health of the body. Therefore, electromagnetic shielding technology is particularly important. As the carrier of high-speed signals, FPC circuit boards are increasingly sensitive to electromagnetic interference as the speed continues to increase. The traditional electromagnetic shielding method is shown in Figure 1. Silver conductor film or paste is used. In addition to the polyimide substrate layer 1, an insulating layer 3 is required to isolate the signal copper wire layer 2 from the silver conductor shielding layer 4, increasing the If the board thickness is increased, the FPC is difficult to bend, or the bending life is reduced. At the same time, it is necessary to conduct the ground wire and the shielding layer. The selection of the conduction position and density is more complicated, which may easily cause poor shielding or antenna effect.

Utility model content

In order to solve the above problems, the purpose of this utility model is to provide an electromagnetic shielding copper clad laminate and its application in high-speed FPC circuit boards; Isolation ensures that the thickness of the FPC does not increase, the bending life is not affected, and there is no need for grounding to cause antenna effects.

The utility model is achieved through the following technical solutions:

An electromagnetic shielding copper-clad board, which comprises a wave-absorbing material layer, a copper foil layer and a polyimide substrate layer laminated in sequence, and the thickness of the copper-clad board is ≤0.1mm.

Preferably, the electromagnetic shielding copper-clad laminate includes a first wave-absorbing material layer, a first copper foil layer, a polyimide substrate layer, a second copper foil layer and a second wave-absorbing material layer stacked in sequence. Among them, the wave-absorbing material layer is preferably a magnetic material of TDK.

Preferably, there is at least one hole connected to the conduction element between the first copper foil layer and the second copper foil layer, one end of the hole is against the first copper foil layer, and the other end passes through the poly The imide substrate layer is offset against the second copper foil layer.

A high-speed FPC circuit board is characterized in that it is obtained by etching different circuits according to different requirements of the electromagnetic shielding copper clad laminate. Of course, the exposed copper outer surface can also be covered with a conductive layer to prevent its oxidation, such as nickel plus gold, or other coatings.

The utility model comprises a polyimide base material layer, a copper foil layer and a wave-absorbing material layer, and the wave-absorbing material layer is directly attached to the copper foil layer. Compared with the prior art, the utility model not only has a simple structure, but also does not need an isolation layer, and the thickness of the prepared FPC is controlled below 0.1mm, and the bending life is not affected. And there is no need for grounding, no need to consider the grounding position, and no antenna effect. The absorbing material can absorb electromagnetic waves from inside the product, so as not to affect the operation of peripheral devices, and at the same time absorb electromagnetic wave interference from the outside, so as not to affect FPC signal transmission. It can realize good transmission of single channel 25Gbps signal. It can be widely used in high-speed communication and other application fields that require high-speed data transmission.

Description of drawings

Fig. 1 is the structure diagram of prior art,

Fig. 2 is a structural schematic diagram of the utility model.

Detailed ways

The utility model will be further described in detail below in conjunction with specific embodiments, so as to help those skilled in the art understand the utility model.

A high-speed FPC circuit board is obtained by etching different circuits according to different requirements of electromagnetic shielding copper clad laminates. The electromagnetic shielding copper clad laminate includes a first wave absorbing material layer 31 , a first copper foil layer 21 , a polyimide substrate layer 11 , a second copper foil layer 22 and a second wave absorbing material layer 32 stacked in sequence. The copper foil layer is preferably rolled copper foil, and there is at least one hole 4 connecting the conductive element between the first copper foil layer and the second copper foil layer. One end of the hole 4 is against the first copper foil layer 21, and the other end is Through the polyimide substrate 11 layer and against the second copper foil layer 22 . The holes 4 can be provided in multiples according to actual needs, and besides conducting signals between the first copper foil layer 21 and the second copper foil layer 22 , they can also be connected with electronic components where necessary. According to needs, the hole 4 can only pass through the first absorbing material layer 31, the first copper foil layer 21, the polyimide substrate layer 11 and the second copper foil layer 22, or only through the first copper foil layer 21. , polyimide substrate layer 11 , second copper foil layer 22 and second absorbing material layer 32 . The first wave absorbing material layer 31 , the first copper foil layer 21 , the polyimide substrate layer 11 , the second copper foil layer 22 and the second wave absorbing material layer 32 may also be penetrated.

The utility model adopts the process of developing, exposing, etching, etc., and adopts modified epoxy resin as the interlayer pressing material, and is formed by vacuum pressing.

The above-described embodiments are only preferred embodiments of the present utility model, and are not intended to limit the scope of implementation of the present utility model, so all equivalent changes or modifications made with the features and principles described in the claims of the present utility model should include Within the scope of the claims of the utility model.

Claims (4)

1. An electromagnetic shielding copper clad laminate, characterized in that the electromagnetic shielding copper clad laminate comprises a wave absorbing material layer, a copper foil layer and a polyimide substrate layer stacked in sequence, and the thickness of the copper clad laminate is ≤0.1mm. 2. The electromagnetic shielding copper clad laminate according to claim 1, characterized in that, the electromagnetic shielding copper clad laminate comprises a first wave-absorbing material layer, a first copper foil layer, a polyimide substrate layer, a second A copper foil layer and a second wave-absorbing material layer. 3. The electromagnetic shielding copper clad laminate according to claim 2, characterized in that, at least one hole connected to the conduction element is provided between the first copper foil layer and the second copper foil layer, and one end of the hole is connected to the second copper foil layer. One copper foil layer is against each other, and the other end passes through the polyimide substrate layer and is against the second copper foil layer. 4. An application of an electromagnetic shielding copper clad laminate in a high-speed FPC circuit board, characterized in that it is obtained by etching different lines according to different requirements of the electromagnetic shielding copper clad laminate according to any one of claims 1-3.