CN204405900U - A kind of parallel light transceiver component of multi-wavelength multiplex/demultiplexing - Google Patents

Abstract

The utility model is applicable to the field of optical communication, and provides a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly, four laser emitting chips or detector receiving chips placed on a PCB circuit board are on a straight line; four The four collimating lenses are respectively located directly above the four laser emitting chips or the detector receiving chips, and the apex spot is aligned with the center of the photosensitive surface of the four detector receiving chips or the four laser emitting chips respectively; the four wavelength division multiplexing solutions The multiplexing filters are placed directly above the four collimating lenses, and the four wavelength division multiplexing and demultiplexing filters are parallel to each other, the reflection surface is downward and the included angle with the PCB circuit board is 45 degrees; The five collimating lenses are located on one side of the reflective surface of the wavelength division multiplexing and demultiplexing filter, and the optical path between the fifth collimating lens and the wavelength division multiplexing and demultiplexing filter is connected with the wavelength division multiplexing and demultiplexing filter. The light path between the light sheet and the laser emitting chip or the detector receiving chip is vertical. Multiple channels only need to share one optical fiber for communication transmission, which greatly saves the cost of optical fiber.

Description

A Parallel Optical Transceiver Component for Multi-Wavelength Multiplexing/Demultiplexing

technical field

The utility model belongs to the field of optical communication, in particular to a multi-wavelength multiplexing/demultiplexing parallel optical transceiver component.

Background technique

With the comprehensive popularization of the information industry, the explosive growth of the global data volume, the construction of global data centers is in full swing. Parallel optical modules are favored by the industry due to their large communication capacity and low energy consumption, and have developed rapidly in recent years. The parallel optical module refers to the realization of one-to-one transmission of multi-channel lasers and multi-channel detectors through multiple optical fibers in one module. The low power consumption brought about by device integration and miniaturization makes the parallel optical module generate and dissipate much less heat than multiple discrete devices. Parallel optical modules mainly rely on high-density integration of optical devices.

For example, in the QSFP SR4 short-distance transmission module, four channels of transmission and four channels of reception are integrated, and the optical port is realized by a standard 12-core MPO standard array fiber. The VECSEL laser die is surface-emitting, and there is a 90-degree deflection between the outgoing beam and the optical port. At present, the commonly used solution is to use a lens to achieve optical path deflection, as shown in Figure 1 and Figure 2. Fig. 1 is an implementation of multiple parallel transmitting optical paths; Fig. 2 is an implementation of multiple parallel receiving optical paths. This solution requires optical fiber array transmission and a dedicated MPO optical interface for connection. The fiber array and MPO optical interface are the main cost issues restricting this solution, and they are not compatible with the existing single fiber network.

Utility model content

The purpose of the embodiment of the utility model is to provide a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly to solve the problem that the prior art parallel optical transceiver assembly cannot be compatible with the existing single optical fiber network.

The embodiment of the utility model is achieved in this way, a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly, the parallel optical transceiver assembly includes: a laser transmitting chip, a detector receiving chip, an integrated body, a PCB circuit board, A wavelength division multiplexing and demultiplexing filter, wherein the integrated body includes several collimating lenses. For clarity of description, the part of the emitting light path is defined as a light emitting component; the part of the receiving light path is defined as a light receiving component.

The integrated body, the laser emitting chip and the detector receiving chip are arranged on the PCB circuit board, and the collimating lens and the wavelength division multiplexing and demultiplexing filter are arranged on the integrated body superior;

The laser transmitting chip and the detector receiving chip correspond to the working wavelengths of the laser transmitting chip or the detector receiving chip as λ1, λ2, λ3 and λ4 respectively, and λ1, λ2, λ3 and λ4 are not equal to each other;

Both the light emitting assembly and the light receiving assembly include 4 wavelength division multiplexing and demultiplexing filters and 5 collimating lenses; the integrated body of the light emitting assembly includes one for emitting An optical port of the optical path, the integrated body of the light receiving component includes an optical port for receiving the optical path;

The four laser emitting chips or detector receiving chips placed on the PCB circuit board are in a straight line; the four collimating lenses are respectively located directly above the four laser emitting chips or detector receiving chips , the vertex light spot is respectively aligned with the center of the photosensitive surface of the four detector receiving chips or the four laser emitting chips;

The four wavelength division multiplexing and demultiplexing filters are respectively placed directly above the four collimating lenses, and the four wavelength division multiplexing and demultiplexing filters are parallel to each other, and the reflection surface is downward and The included angles with the PCB circuit board are all 45°; the four wavelength division multiplexing and demultiplexing filters reflect the light of the working wavelength of the corresponding laser emitting chip or detector receiving chip, and transmit other three wavelengths of light;

The fifth collimating lens is located on one side of the reflective surface of the wavelength division multiplexing and demultiplexing filter, and the optical path between the fifth collimating lens and the wavelength division multiplexing and demultiplexing filter is in line with the wavelength division multiplexing and demultiplexing filter. The optical path between the wavelength division multiplexing demultiplexing filter and the laser emitting chip or detector receiving chip is vertical.

In the first preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver component provided by the utility model: in the optical transmitting component:

The first collimating lens 401, the second collimating lens 402, the third collimating lens 403 and the fourth collimating lens 404 are used to convert the divergent beam emitted by the laser emitting chip into a collimated beam;

The fifth collimating lens 405 is used to convert the light beams collimated by the collimating lenses 401-404 into converging light, so as to be received by the optical fiber;

The laser emitting chip is a vertical cavity surface emitting laser, and is passively mounted with the PCB circuit board 105 through high-precision placement equipment; the circuit connection of the PCB circuit board 105 is realized by gold wire bonding;

The alignment between the integrated body and the laser emitting chip is realized by using high-precision patch equipment in a passive or active alignment manner;

Observation by an infrared CCD makes the vertex spot of the first collimating lens 401 aligned with the first laser emitting chip 101, the vertex spot of the second collimating lens 402 is aligned with the second laser emitting chip 102, and the vertex spot of the second collimating lens 402 is aligned with the second laser emitting chip 102. The vertex spot of the three collimating lenses 403 is aligned with the third laser tube core 103, and the vertex spot of the fourth collimating lens 404 is aligned with the fourth laser tube core 104; the laser emitting chip is aligned with the integrated body After the alignment of the collimating lens described in the above, the integrated body is fixed on the PCB circuit board 105, pre-fixed with ultraviolet glue, and then reinforced and fixed with epoxy resin glue; finally, the sealing cover plate 106 is passed through the sealing Glue is fixed on the integrated body to realize device sealing.

In the second preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the parallel optical transceiver assembly also includes a first adjustable bracket 301, a second adjustable bracket 302, The third adjustable bracket 303 and the fourth adjustable bracket 304;

The four adjustable brackets are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, for respectively installing the four wavelength division multiplexing and demultiplexing filters, and the adjustable brackets are designed with handles, It is convenient for clamping or suction head adsorption operation; the adjustable bracket and the integrated body are fixed with ultraviolet glue;

When the optical component requires a higher coupling efficiency, the adjustment bracket is adjusted separately through a single channel to control the vertical displacement of the wavelength division multiplexing and demultiplexing filter, so that the light emitted by the laser chip (101-104) passes through the After the filter is reflected, as much coupling as possible into the pin; after the laser emitting chip emits the light beam, after being collimated by the corresponding collimating lens, it is incident on the corresponding wavelength division multiplexing demultiplexing Use the optical filter to monitor the output light power at the optical port or use a beam quality analyzer to monitor the light spot, adjust the corresponding adjustable bracket, and fix the adjustable bracket when the monitoring effect is optimal.

In the third preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the parallel optical transceiver assembly also includes a second adjustable bracket 302, a third adjustable bracket 303 and The fourth adjustable bracket 304;

The adjustable bracket is provided with a 45-degree slope relative to the horizontal plane of the PCB circuit board, for installing the second wavelength division multiplexing demultiplexing filter 108 and the third wavelength division multiplexing demultiplexing filter respectively. sheet 109 and the fourth wavelength division multiplexing demultiplexing filter 110, the adjustable bracket is designed with a handle, which is convenient for clamping or suction head adsorption operation; the first wavelength division multiplexing demultiplexing filter 107 is fixed on the integrated body; the adjustable brackets 302-304 and the integrated body are fixed with ultraviolet glue;

When the optical component requires higher coupling efficiency, the second laser emitting chip 102, the third laser emitting chip 103, and the The position of the reflected light beam after the fourth laser emitting chip 104 passes through the corresponding filter:

After the laser emitting chip emits light beams, after being collimated by the corresponding collimating lenses, it is incident on the corresponding wavelength division multiplexing and demultiplexing filters, and the output light power at the monitoring optical port or Use a beam quality analyzer to monitor the light spot, adjust its corresponding adjustable bracket, and fix the adjustable bracket when the monitoring effect is optimal.

In the fourth preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the first laser transmitting chip 101, the second laser transmitting chip 102, the third laser transmitting chip 103 and the The corresponding working bands of the four laser emitting chips 104 are 820nm, 850nm, 880nm, 910nm or 1250nm, 1280nm, 1310nm, 1340nm respectively.

In the fifth preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver component provided by the utility model: in the optical receiving component:

The sixth collimating lens 406 is used to shape the light beam transmitted by the optical fiber into collimated light;

The seventh collimating lens 407, the eighth collimating lens 408, the ninth collimating lens 409 and the tenth collimating lens 410 are used to convert the collimated light beam shaped by the sixth collimating lens 406 into converging light ;

The detector receiving chip and the PCB circuit board 105 are passively mounted by high-precision patch equipment, and the circuit connection with the PCB circuit board 105 is realized by gold wire bonding;

The alignment between the integrated body and the detector receiving chip is achieved by using high-precision patch equipment in a passive or active alignment manner:

Observe by infrared CCD so that the vertex spot of the seventh collimating lens 407 is aligned with the center of the photosensitive surface of the first detector receiving chip 201, and the vertex spot of the eighth collimating lens 408 is aligned with the photosensitive surface of the second detector receiving chip 202. The center of the surface is aligned, the vertex spot of the ninth collimating lens 409 is aligned with the center of the photosensitive surface of the third detector receiving chip 203, and the vertex spot of the tenth collimating lens 410 is aligned with the photosensitive surface of the fourth detector receiving chip 204 Align the center of the surface; after the detector receiving chip is aligned with the collimator lens in the integrated body, the integrated body is fixed on the PCB circuit board 105, pre-fixed with ultraviolet glue, and then Reinforce and fix with epoxy resin; finally, fix the sealing cover plate 106 on the integrated body with sealant to realize device sealing.

In the sixth preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the parallel optical transceiver assembly further includes a first adjustable bracket 301, a second adjustable bracket 302, The third adjustable bracket 303 and the fourth adjustable bracket 304;

The four adjustable brackets are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, for respectively installing the four wavelength division multiplexing and demultiplexing filters, and the adjustable brackets are designed with handles, It is convenient for clamping or suction head adsorption operation; the adjustable bracket and the integrated body are fixed with ultraviolet glue;

When the optical component requires higher coupling efficiency, the first adjustable bracket 301, the second adjustable bracket 302, and the third adjustable bracket are sequentially adjusted and fixed by adjusting the up and down displacement of the wavelength division multiplexing and demultiplexing filter through a single channel. Adjustable bracket 303 and fourth adjustable bracket 304:

The optical fiber transmits the light beam, and the adjustable bracket is adjusted so that the light beam of one wavelength is reflected at the corresponding wavelength division multiplexing and demultiplexing filter. By monitoring the responsivity, the light beam can be incident on its corresponding The photosensitive surface of the detector receiving chip is used to fix the adjustable bracket.

In the seventh preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the parallel optical transceiver assembly also includes a second adjustable bracket 302, a third adjustable bracket 303 and The fourth adjustable bracket 304;

The adjustable bracket is provided with a 45-degree slope relative to the horizontal plane of the PCB circuit board, for installing the second wavelength division multiplexing demultiplexing filter 108 and the third wavelength division multiplexing demultiplexing filter respectively. sheet 109 and the fourth wavelength division multiplexing demultiplexing filter 110, the adjustable bracket is designed with a handle, which is convenient for clamping or suction head adsorption operation; the first wavelength division multiplexing demultiplexing filter 107 is fixed on the integrated body; the adjustable brackets 302-304 and the integrated body are fixed with ultraviolet glue;

When the optical component requires higher coupling efficiency, adjust the corresponding filter to control the reflected beam by adjusting the second adjustable bracket 302, the third adjustable bracket 303 and the fourth adjustable bracket 304 in one way. Location:

The optical fiber transmits the light beam, and the adjustable bracket is adjusted so that the light beam of one wavelength is reflected at the corresponding wavelength division multiplexing and demultiplexing filter. By monitoring the responsivity, the light beam can be incident on its corresponding The photosensitive surface of the detector receiving chip is used to fix the adjustable bracket.

In the eighth preferred embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model: the first detector receiving chip 201, the second detector receiving chip 202, the third detector The corresponding working bands of the receiving chip 203 and the fourth detector receiving chip 204 are 820nm, 850nm, 880nm, 910nm or 1250nm, 1280nm, 1310nm, 1340nm respectively.

The beneficial effects of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver component provided by the embodiment of the present invention include:

1. The utility model provides a parallel optical transceiver component, which is suitable for the application of QSFP modules, meets the demand for high-speed bandwidth, and has the function of wavelength division multiplexing. The transmitting end shares an optical port, and the receiving end shares an optical port. The optical fiber array and MPO connector are omitted, and a standard multimode fiber jumper can be inserted directly into the optical port to achieve a stable optical connection. This component can be widely used in cloud computing and data centers. , enterprise network, local area network (LAN) and storage area network (SAN) and other application fields; the application of optical fiber array is omitted, and multiple channels only need to share one optical fiber for communication transmission, which greatly saves the cost of optical fiber;

2. There is no need for MPO connectors, and it has a standard LC single-optical port, which can realize the plug-in connection of a single multi-mode optical fiber, which is convenient for application;

3. It can meet the diversity of customer application requirements. This structure has the function of wavelength division multiplexing &demultiplexing; this scheme is simple and easy to implement, suitable for mass production, and can effectively improve the yield and reduce costs.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the following will briefly introduce the accompanying drawings that are required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only the practical For some novel embodiments, those skilled in the art can also obtain other drawings based on these drawings without any creative work.

Fig. 1 is a schematic diagram of the optical path of a parallel transmission optical emission component commonly used in the prior art;

Fig. 2 is a schematic diagram of the light path of a parallel transmission light receiving component commonly used in the prior art;

Fig. 3 is a schematic structural diagram of the first and second embodiments of a multi-wavelength multiplexing/demultiplexing parallel light emitting assembly provided by an embodiment of the present invention;

Fig. 4 is a schematic structural view of the first and second embodiments of a multi-wavelength multiplexing/demultiplexing parallel light receiving component provided by the present invention;

Fig. 5 is a schematic structural view of the third and fourth embodiments of a multi-wavelength multiplexing/demultiplexing parallel light emitting assembly provided by the present invention;

Fig. 6 is a schematic structural diagram of the third and fourth embodiments of a multi-wavelength multiplexing/demultiplexing parallel optical receiving component provided by the utility model;

Fig. 7 is a schematic structural view of the fifth and sixth embodiments of a multi-wavelength multiplexing/demultiplexing parallel light emitting assembly provided by the present invention;

Fig. 8 is a schematic diagram of the appearance and structure of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver component provided by an embodiment of the present invention;

Wherein 001 is the laser die; 002 is the lens body; 003 is the multimode fiber; 004 is the detector die; 101 is the first laser emitting chip; 102 is the second laser emitting chip; 103 is the third laser emitting chip; 104 105 is a PCB circuit board; 106 is a sealing cover; 107 is a first wavelength division multiplexing demultiplexing filter; 108 is a second wavelength division multiplexing demultiplexing filter; 109 is the third wavelength division multiplexing and demultiplexing filter; 110 is the fourth wavelength division multiplexing and demultiplexing filter; 111 is an integrated body; 201 is the first detector receiving chip; 202 is the second detector receiving chip; 203 is the third detector receiving chip; 204 is the fourth detector receiving chip; 206 is the sealing cover; 211 is the integrated body; 301 is the first adjustable bracket; 302 is the second adjustable bracket; 303 is the second Three adjustable brackets; 304 is the fourth adjustable bracket; 311 is the integrated body; 401 is the first collimating lens; 402 is the second collimating lens; 403 is the third collimating lens; 404 is the fourth collimating lens; 405 is the fifth collimating lens; 406 is the sixth collimating lens; 407 is the seventh collimating lens; 408 is the eighth collimating lens; 409 is the ninth collimating lens; 410 is the tenth collimating lens; The laser emitting part; 502 is the detector receiving part.

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

In order to illustrate the technical solution described in the utility model, the following specific examples will be used for illustration.

As shown in Figure 1, it is a structural schematic diagram of a multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model. The parallel optical transceiver assembly includes: a laser emitting chip, a detector receiving chip, an integrated body, and a PCB circuit plate, wavelength division multiplexing and demultiplexing filter, wherein the integrated body includes ten collimating lenses. For clarity of description, the part of the emitting light path is defined as a light emitting component; the part of the receiving light path is defined as a light receiving component.

The parallel optical transceiver component includes a light emitting component and a light receiving component. Both the light emitting component and the light receiving component include: an integrated body, a PCB circuit board, a collimating lens and a wavelength division multiplexing and demultiplexing filter, the light transmitting component also includes a laser emitting chip, and the light receiving component also includes a detector receiving chip.

The integrated body, the laser emitting chip and the detector receiving chip are arranged on the PCB circuit board, and the collimating lens and the wavelength division multiplexing and demultiplexing filter are arranged on the integrated body.

The number of laser emitting chip, detector receiving chip and wavelength division multiplexing demultiplexing filter is four respectively, and the corresponding working wavelengths of laser emitting chip or detector receiving chip are λ1, λ2, λ3 and λ4, λ1 , λ2, λ3 and λ4 are not equal to each other.

Both the light-emitting component and the light-receiving component contain 4 wavelength division multiplexing and demultiplexing filters and 5 collimating lenses; the integration described in the light-emitting component and the light-receiving component can be separate or a common integration , but each of the collimator lens and the optical port part is independent. The four laser emitting chips or detector receiving chips placed on the PCB circuit board are in a straight line; the four collimating lenses are respectively located directly above the four laser emitting chips or detector receiving chips, and the four detector receiving chips The center of the photosensitive surface or the four laser emitting chips are respectively aligned.

The four wavelength division multiplexing and demultiplexing filters are respectively placed directly above the above four collimating lenses, and the four wavelength division multiplexing and demultiplexing filters are parallel to each other, and the wavelength division multiplexing and demultiplexing filters The included angle between the reflective surface of the sheet and the PCB circuit board is 45° to achieve a 90° turning of the optical path. The four wavelength division multiplexing and demultiplexing filters reflect the light of the working wavelength of the corresponding laser emitting chip or detector receiving chip, and transmit the light of the other three wavelengths among λ1, λ2, λ3 and λ4.

The fifth collimating lens is located on one side of the reflection surface of the wavelength division multiplexing and demultiplexing filter, and the optical path between the fifth collimating lens and the wavelength division multiplexing and demultiplexing filter is consistent with the wavelength division multiplexing and demultiplexing filter. The optical path between the optical filter and the laser emitting chip or the detector receiving chip is vertical.

Taking the light emitting component as an example, the first wavelength division multiplexing and demultiplexing filter reflects the corresponding first laser emitting chip to emit the λ1 wavelength beam, but transmits the other three channel laser emitting chips to emit the beam (λ2, λ3, λ4 ); the second wavelength division multiplexing and demultiplexing filter reflects its corresponding second laser emitting chip to emit the λ2 wavelength beam, but transmits the other three channel laser emitting chip emitting beams (λ1, λ3, λ4); the third The wavelength division multiplexing demultiplexing filter reflects the corresponding third laser emitting chip to emit the λ3 wavelength beam, but transmits the other three channel laser emitting chip emitting beams (λ1, λ2, λ4); the fourth wavelength division multiplexing The demultiplexing filter reflects the λ4 wavelength beam emitted by the corresponding fourth laser emitting chip, but transmits the emitted beams (λ1, λ2, λ3) of the other three channel laser emitting chips. The same optical filter used in the optical path of the detector is the same or similar part as the optical filter used in the laser.

There are two adapter ports in the integrated body, one is used for the transmitting light path, and the other is used for the receiving light path. The two adapter ports have no ferrules and ceramic sleeves that act as a tight grip. Through processing accuracy and internal spigots, the alignment of the inserted optical fiber connection is ensured to achieve stable transmission of the optical path.

The embodiment of the utility model omits the application of the optical fiber array, and multiple channels only need to share one optical fiber for communication transmission, which greatly saves the cost of the optical fiber; no MPO connector is required, and the standard LC single optical port can realize single multi-mode The plug-in connection of optical fiber is convenient for application; it can meet the diversity of customer application requirements, and the structure has the function of wavelength division multiplexing &demultiplexing; the solution is simple and easy, suitable for mass production, and can effectively improve the yield and reduce costs.

Embodiment one

Embodiment 1 provided by the utility model is the first embodiment of a multi-wavelength multiplexing/demultiplexing parallel light emitting component provided by the utility model, as shown in FIG. The structural diagram of the first embodiment of the parallel optical transmitting assembly of multiplexing/demultiplexing, as can be seen from Figure 3, in the embodiment of the parallel optical transmitting and receiving assembly of multi-wavelength multiplexing/demultiplexing provided by the utility model:

The corresponding working bands of the first laser emitting chip 101, the second laser emitting chip 102, the third laser emitting chip 103 and the fourth laser emitting chip 104 are respectively 820nm, 850nm, 880nm, 910nm, or other wavelengths and wavelength intervals near 850nm .

The first collimating lens 401 and the second collimating lens respectively corresponding to the first laser emitting chip 101, the second laser emitting chip 102, the third laser emitting chip 103 and the fourth laser emitting chip 104 above the four laser emitting chips 402. The third collimating lens 403 and the fourth collimating lens 404 are used to transform the divergent beam emitted by the laser emitting chip into a collimated beam.

The first wavelength division multiplexing and demultiplexing filters respectively corresponding to the first collimating lens 401, the second collimating lens 402, the third collimating lens 403 and the fourth collimating lens 404 above the four collimating lenses 107 . The second wavelength division multiplexing and demultiplexing filter 108 , the third wavelength division multiplexing and demultiplexing filter 109 , and the fourth wavelength division multiplexing and demultiplexing filter 110 .

This first wavelength division multiplexing and demultiplexing filter 107 reflects the light beams emitted by the corresponding first laser 101 with a wavelength of 820nm, but transmits the light beams emitted by the other three channel laser emitting chips (wavelengths are 850nm, 880nm, 880nm, 910nm); The second wavelength division multiplexing and demultiplexing filter 108 reflects the light beam that the wavelength emitted by its corresponding second laser 102 is 850nm, but transmits the light beams emitted by other three channel laser emission chips (wavelength is 820nm, 880nm, 910nm); The third wavelength division multiplexing and demultiplexing filter 109 reflects the light beam that the wavelength emitted by its corresponding third laser 103 is the light beam of 880nm, but transmits the light beam emitted by other three channel laser emission chips (wavelength is 820nm, 850nm, 910nm); the fourth wavelength division multiplexing demultiplexing filter 110, reflecting the light beam of the wavelength of 910nm emitted by its corresponding fourth laser 104, but transmitting the light beams emitted by other three channel laser emission chips ( The wavelength is 820nm, 850nm, 880nm).

The fifth collimating lens 405 is used to convert the light beams collimated by the collimating lenses 401-404 into converging light so as to be received by the optical fiber.

The laser emitting chips 101-104 may be Vertical Cavity Surface Emitting Lasers (VCSEL, Vertical Cavity Surface Emitting Laser), and the PCB circuit board 105 is passively mounted by high-precision chip placement equipment. The gold layer area of the chip and the detector die, and with a fixed-pitch patch positioning mark, so the placement accuracy of the laser emitting chip is guaranteed by the alignment pattern accuracy of the PCB bottom plate design and the placement equipment accuracy. The circuit connection between the laser emitting chips 101-104 and the PCB circuit board 105 is realized by gold wire bonding, and the arc of the gold wire is required to be low, and the length of the gold wire is as short as possible to reduce the introduction of parasitic parameters.

The alignment between the integrated body 111 and the laser emitting chips 101-104 is achieved by using high-precision patch equipment in a passive or active alignment method:

Observation by infrared CCD makes the vertex spot of the first collimating lens 401 align with the first laser emitting chip 101, the vertex spot of the second collimating lens 402 aligns with the second laser emitting chip 102, and the vertex spot of the third collimating lens 403 The vertex spot is aligned with the third laser die 103, and the vertex spot of the fourth collimating lens 404 is aligned with the fourth laser die 104; after the laser emitting chip is aligned with the collimating lens in the integrated body 111 in the above-mentioned manner, The integrated body 111 is fixed on the PCB circuit board 105, pre-fixed with ultraviolet glue, and then reinforced and fixed with epoxy resin glue. Finally, the sealing cover plate 106 is fixed on the integrated body 111 by a sealant to realize device sealing.

Embodiment two

The second embodiment provided by the utility model is the first embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical receiving component provided by the utility model, the first embodiment of the parallel optical receiving component is the same as that provided by the utility model The first embodiment of the parallel light emitting assembly is used in conjunction with the first embodiment of the parallel light emitting assembly, as shown in FIG. 4 It can be seen that in the embodiment of the multi-wavelength multiplexing/demultiplexing parallel optical transceiver assembly provided by the utility model:

The sixth collimating lens 406 is used to shape the light beam transmitted by the optical fiber into collimated light.

The first wavelength division multiplexing and demultiplexing filter 107 reflects the light beam that the wavelength emitted by its corresponding first laser 101 is 820nm, but transmits the light beams emitted by other three channel laser emission chips (wavelength is 850nm, 880nm, 910nm ); the second wavelength division multiplexing and demultiplexing filter 108 reflects the light beam that the wavelength emitted by its corresponding second laser 102 is 850nm, but transmits the light beams emitted by other three channel laser emission chips (wavelength is 820nm, 880nm , 910nm); the third wavelength division multiplexing and demultiplexing filter 109 reflects the light beam that the wavelength emitted by its corresponding third laser 103 is 880nm, but transmits the light beams emitted by other three channel laser emission chips (wavelength is 820nm , 850nm, 910nm); the fourth wavelength division multiplexing and demultiplexing filter 110 reflects the light beam of the wavelength of 910nm emitted by its corresponding fourth laser 104, but transmits the light beams emitted by other three channel laser emission chips (wavelength 820nm, 850nm, 880nm).

Located below the four wavelength division multiplexing demultiplexing filters and the first wavelength division multiplexing demultiplexing filter 107, the second wavelength division multiplexing demultiplexing filter 108, the third wavelength division multiplexing demultiplexing filter The seventh collimating lens 407, the eighth collimating lens 408, the ninth collimating lens 409 and the tenth collimating lens 410 corresponding to the multiplexing filter 109 and the fourth wavelength division multiplexing and demultiplexing filter 110 respectively , for converting the collimated light beam shaped by the sixth collimating lens 406 into convergent light.

The first detector receiving chip 201 and the second detector corresponding to the seventh collimating lens 407, the eighth collimating lens 408, the ninth collimating lens 409 and the tenth collimating lens 410 are located below the four collimating lenses. The receiving chip 202 , the third detector receiving chip 203 and the fourth detector receiving chip 204 correspond to working bands of 820nm, 850nm, 880nm, 910nm, or other wavelengths and wavelength intervals near 850nm.

The detector receiving chips 201-204 and the PCB circuit board 105 are passively mounted by high-precision patch equipment. The PCB circuit board is provided with a gold layer area for mounting the above-mentioned laser die and detector die, and has a fixed Pitch patch positioning marks, so the placement accuracy of the detector receiving chip is guaranteed by the alignment pattern accuracy of the PCB bottom plate design and the placement equipment accuracy. The circuit connection between the detector receiving chips 201-204 and the PCB circuit board is realized by gold wire bonding, the requirement for the curvature of the gold wire is low, and the length of the gold wire is as short as possible to reduce the introduction of parasitic parameters.

The alignment between the integrated body 111 and the detector receiving chips 201-204 is realized by using high-precision patch equipment in a passive or active alignment method:

Observation by the infrared CCD makes the vertex spot of the seventh collimating lens 407 aligned with the center of the photosensitive surface of the first detector receiving chip 201, and the vertex spot of the eighth collimating lens 408 is aligned with the center of the photosensitive surface of the second detector receiving chip 202 , the vertex light spot of the ninth collimating lens 409 is aligned with the center of the photosensitive surface of the third detector receiving chip 203, and the vertex light spot of the tenth collimating lens 410 is aligned with the center of the photosensitive surface of the fourth detector receiving chip 204; by the above method After the detector receiving chip is aligned with the collimator lens in the integrated body 111, the integrated body 111 is fixed on the PCB circuit board 105, pre-fixed with ultraviolet glue, and then reinforced and fixed with epoxy resin glue. Finally, the sealing cover plate 106 is fixed on the integrated body 111 by a sealant to realize device sealing.

Embodiment Three

The third embodiment provided by the utility model is the second embodiment of a multi-wavelength multiplexing/demultiplexing parallel light emitting component provided by the utility model, as shown in FIG. The structure schematic diagram of the second embodiment of the parallel light emitting assembly of multiplexing/demultiplexing, the structure and principle of the second embodiment of the light emitting assembly provided by the utility model are the same as the first embodiment of the light emitting assembly, the first The corresponding operating wavelength bands of the laser emitting chip 101, the second laser emitting chip 102, the third laser emitting chip 103 and the fourth laser emitting chip 104 are 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths and wavelength intervals near 1310nm. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

Embodiment Four

The fourth embodiment provided by the utility model is the second embodiment of a multi-wavelength multiplexing/demultiplexing parallel light receiving component provided by the utility model, the second embodiment of the parallel light receiving component is the same as the parallel light emitting component used in conjunction with the second embodiment, as shown in Figure 4 is a schematic structural diagram of the first embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical transmitting assembly provided by the present invention, the second optical receiving assembly The embodiment is the same in structure and principle as the first embodiment of the light receiving assembly provided by the utility model, the first detector receiving chip 201, the second detector receiving chip 202, the third detector receiving chip 203 and the fourth detector receiving chip The corresponding working wavelength bands of the chip 204 are 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths and wavelength intervals near 1310nm. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

Embodiment five

The fifth embodiment provided by the utility model is the third embodiment of a multi-wavelength multiplexing/demultiplexing parallel light emission component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the third embodiment of the multiplexing/demultiplexing parallel light emitting assembly. Compared with the first embodiment of the light emitting assembly provided by the utility model, the third embodiment of the light emitting assembly also includes a first adjustable The bracket 301 , the second adjustable bracket 302 , the third adjustable bracket 303 and the fourth adjustable bracket 304 .

The adjustable brackets 301-304 are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, and are used for installing the wavelength division multiplexing and demultiplexing filters 107-110. At the same time, the adjustable brackets are designed with handles for easy clamping or suction. adsorption operation. The adjustable brackets 301-304 and the integrated body 211 are fixed with ultraviolet glue.

When the optical component requires higher coupling efficiency, it can be compensated by adjusting the up and down displacement of the wavelength division multiplexing and demultiplexing filter in a single channel. The beam displacement caused by the thickness of the filter itself or the placement accuracy problem caused by equipment or operation . The specific implementation method is as follows:

The first laser emitting chip 101 emits a light beam with a wavelength of λ1. After being collimated by the collimator lens 401, it is incident on the wavelength division multiplexing and demultiplexing filter 107. By monitoring the output optical power at the optical port or using the beam quality analysis The instrument monitors the spot, adjusts the adjustable bracket 301 with the filter 107, and fixes the adjustable bracket 301 when the monitoring effect is the best; then couples the second channel, and fixes the adjustable bracket 302 in the same way; then adopts the same method to fix the adjustable bracket 302 Adjust the bracket 303; finally fix the adjustable bracket 304. λ1, λ2, λ3, and λ4 are 820nm, 850nm, 880nm, and 910nm, respectively.

Embodiment six

Embodiment 6 provided by the utility model is the third embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical receiving component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the third embodiment of the multiplexing/demultiplexing parallel light receiving component. Compared with the first embodiment of the light receiving component provided by the utility model, the third embodiment of the light receiving component also includes a first adjustable The bracket 301 , the second adjustable bracket 302 , the third adjustable bracket 303 and the fourth adjustable bracket 304 .

The adjustable brackets 301-304 are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, and are used for installing the wavelength division multiplexing and demultiplexing filters 107-110. At the same time, the adjustable brackets are designed with handles for easy clamping or suction. adsorption operation. The adjustable brackets 301-304 and the integrated body 211 are fixed with ultraviolet glue.

When the optical component requires higher coupling efficiency, it can be compensated by adjusting the up and down displacement of the wavelength division multiplexing and demultiplexing filter in a single channel. The beam displacement caused by the thickness of the filter itself or the placement accuracy problem caused by equipment or operation . The specific implementation method is as follows:

Light beams (wavelengths λ1, λ2, λ3, and λ4) transmitted by the optical fiber are adjusted to adjust the adjustable bracket 301 so that the light beam λ1 is reflected at the wavelength division multiplexing and demultiplexing filter 107, and the light beam λ1 is evenly distributed by monitoring the responsivity. It can be incident on the photosensitive surface of the detector receiving chip 201, and the adjustable bracket 301 is fixed. The same method is used to fix the adjustable brackets 302, 303, 304 in turn. Explanation: The adjusting brackets 301-304 in the optical path of the laser and the adjusting brackets 301-304 in the optical path of the detector are the same or similar parts. λ1, λ2, λ3, and λ4 are 820nm, 850nm, 880nm, and 910nm, respectively.

Embodiment seven

Embodiment 7 provided by the utility model is the fourth embodiment of a multi-wavelength multiplexing/demultiplexing parallel light emitting component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the fourth embodiment of the multiplexing/demultiplexing parallel light emitting assembly, the structure and principle of the fourth embodiment of the light emitting assembly are the same as that of the third embodiment of the light emitting assembly provided by the present invention, the first The corresponding operating wavelength bands of the first laser emitting chip 101, the second laser emitting chip 102, the third laser emitting chip 103 and the fourth laser emitting chip 104 are 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths and wavelength intervals near 1310nm. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

Embodiment eight

The eighth embodiment provided by the utility model is the fourth embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical receiving component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the fourth embodiment of the multiplexing/demultiplexing parallel light receiving assembly, the structure and principle of the fourth embodiment of the light receiving assembly are the same as that of the third embodiment of the light receiving assembly provided by the utility model, the first The corresponding working bands of the first detector receiving chip 201, the second detector receiving chip 202, the third detector receiving chip 203 and the fourth detector receiving chip 204 are 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths near 1310nm and wavelength interval. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

Embodiment nine

Embodiment 9 provided by the utility model is the fifth embodiment of a multi-wavelength multiplexing/demultiplexing parallel light emitting component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the fifth embodiment of the multiplexing/demultiplexing parallel light emitting assembly. Compared with the first embodiment of the light emitting assembly provided by the utility model, the fifth embodiment of the light emitting assembly also includes a second adjustable The bracket 302 , the third adjustable bracket 303 and the fourth adjustable bracket 304 .

The adjustable brackets 302-304 are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, and are used to install the wavelength division multiplexing and demultiplexing filters 108-110. At the same time, the adjustable brackets are designed with handles for easy clamping or suction. adsorption operation. The first wavelength division multiplexing and demultiplexing filter 107 is fixed on the integrated body 311 , and the adjustable supports 302 - 304 and the integrated body 311 are fixed with ultraviolet glue.

When the optical component requires higher coupling efficiency, it can be compensated by adjusting the up and down displacement of the wavelength division multiplexing and demultiplexing filter in a single channel. The beam displacement caused by the thickness of the filter itself or the placement accuracy problem caused by equipment or operation . The specific implementation method is as follows:

The laser emitting chip has a wavelength of 102 and emits a light beam with a wavelength of λ2. After being collimated by the collimating lens 402, it is incident on the wavelength division multiplexing and demultiplexing filter 108. By monitoring the output optical power at the optical port or using beam quality analysis The instrument monitors the light spot, adjusts the adjustable bracket 302 with the filter 108, and fixes the adjustable bracket 301 when the monitoring effect is the best; then couples the second channel, and fixes the adjustable bracket 303 in the same way; finally fixes the adjustable bracket 304 . λ1, λ2, λ3, and λ4 are 820nm, 850nm, 880nm, and 910nm, respectively.

Embodiment ten

The tenth embodiment provided by the utility model is the fifth embodiment of a multi-wavelength multiplexing/demultiplexing parallel light receiving component provided by the utility model. The fifth embodiment of the light receiving component is compared with the one provided by the utility model The first embodiment of the light receiving assembly further includes a second adjustable bracket 302 , a third adjustable bracket 303 and a fourth adjustable bracket 304 .

The adjustable brackets 302-304 are provided with a 45-degree inclined plane relative to the horizontal plane of the PCB circuit board, and are used to install the wavelength division multiplexing and demultiplexing filters 108-110. At the same time, the adjustable brackets are designed with handles for easy clamping or suction. adsorption operation. The wavelength division multiplexing demultiplexing filter 107 is fixed on the integrated body 311, and the adjustable brackets 302-304 and the integrated body 311 are fixed with ultraviolet glue.

When the optical component requires higher coupling efficiency, it can be compensated by adjusting the up and down displacement of the wavelength division multiplexing and demultiplexing filter in a single channel. The beam displacement caused by the thickness of the filter itself or the placement accuracy problem caused by equipment or operation . The specific implementation method is as follows:

Light beams (wavelengths λ1, λ2, λ3, and λ4) transmitted by the optical fiber are adjusted to adjust the adjustable bracket 302 so that the light beam λ2 is reflected at the wavelength division multiplexing and demultiplexing filter 108, and the light beam λ2 is evenly distributed by monitoring the responsivity. It can be incident on the photosensitive surface of the detector receiving chip 202, and the adjustable bracket 302 is fixed. The same method is used to fix the adjustable brackets 303 and 304 sequentially. Explanation: The adjusting brackets 302-304 in the optical path of the laser and the adjusting brackets 302-304 in the optical path of the detector are the same or similar parts. λ1, λ2, λ3, and λ4 are 820nm, 850nm, 880nm, and 910nm, respectively.

Embodiment Eleven

Embodiment 7 provided by the utility model is the sixth embodiment of a multi-wavelength multiplexing/demultiplexing parallel optical emission component provided by the utility model, as shown in FIG. Schematic diagram of the structure of the sixth embodiment of the multiplexing/demultiplexing parallel light emitting assembly, the structure and principle of the sixth embodiment of the light emitting assembly is the same as that of the fifth embodiment of the light emitting assembly provided by the present invention, the first The corresponding operating wavelength bands of the first laser emitting chip 101, the second laser emitting chip 102, the third laser emitting chip 103 and the fourth laser emitting chip 104 are 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths and wavelength intervals near 1310nm. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

Embodiment 12

The eighth embodiment provided by the utility model is the sixth embodiment of a multi-wavelength multiplexing/demultiplexing parallel light receiving component provided by the utility model. The structure and principle of the fifth embodiment of the light receiving component are the same, the corresponding working bands of the first detector receiving chip 201, the second detector receiving chip 202, the third detector receiving chip 203 and the fourth detector receiving chip 204 are respectively 1250nm, 1280nm, 1310nm, 1340nm, or other wavelengths and wavelength intervals around 1310nm. The optical filters 107-110 are multiplexing & demultiplexing optical filters corresponding to the above-mentioned bands respectively.

The utility model provides an embodiment of a plurality of light-emitting components and light-receiving components in a parallel optical transceiver component. The light-emitting components and light-receiving components of the same wave band are mutually matched and used, that is, the working wave bands are 820nm, 850nm, 880nm, 910nm, or other wavelengths and wavelength intervals around 850nm, the light-emitting components (embodiment one, embodiment five and embodiment nine) and light-receiving components (embodiment two, embodiment six and embodiment ten) are used in conjunction with each other arbitrarily , the working bands are respectively 1250nm, 1280nm, 1310nm, 1340nm, or light emitting components (embodiment three, embodiment seven and embodiment eleven) and light receiving components (embodiment four, embodiment Eighth and Embodiment 12) are used in conjunction with each other arbitrarily.

This patent includes another situation: the integrated body described in the light-emitting component and the light-receiving component can be a part, but the collimating lens used by the two is independent, and the integrated body includes two optical ports , one of the optical ports is used for the light emitting part, and the other optical port is used for the light receiving part.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (9)

1. a parallel light transceiver component for multi-wavelength multiplex/demultiplexing, is characterized in that, described parallel light transceiver component comprises light emission component and optical fiber receive module; Described light emission component and optical fiber receive module include: conglomerate, PCB, collimation lens and wavelength-division multiplex demultiplexing optical filter; Described light emission component also comprises laser instrument transmitting chip; Described optical fiber receive module also comprises detector receiving chip;

Described conglomerate and described laser instrument transmitting chip and described detector receiving chip are arranged in described PCB, and described collimation lens and described wavelength-division multiplex demultiplexing optical filter are arranged on described conglomerate;

Described laser instrument transmitting chip and described detector receiving chip number are respectively four, and it is unequal mutually that described laser instrument transmitting chip and operation wavelength corresponding to detector receiving chip are respectively λ 1, λ 2, λ 3 and λ 4, λ 1, λ 2, λ 3 and λ 4;

Described light emission component and described optical fiber receive module respectively comprise 4 described wavelength-division multiplex demultiplexing optical filters and 5 described collimation lenses; The conglomerate of described light emission component comprises one for launching the light mouth of light path, and the conglomerate of described optical fiber receive module comprises a light mouth for receiving light path;

Be placed in described four laser instrument transmitting chips in described PCB or detector receiving chip point-blank; Four described collimation lenses lay respectively at directly over described four laser instrument transmitting chips or detector receiving chip, and photosurface center or described four laser instrument transmitting chips of summit hot spot and described four detector receiving chips are aimed at respectively;

Described four wavelength-division multiplex demultiplexing optical filters are placed in directly over described four collimation lenses respectively, and described four wavelength-division multiplex demultiplexing optical filters are parallel to each other, and reflecting surface downwards and be 45 ° with the angle of described PCB; Described four wavelength-division multiplex demultiplexing optical filters reflect the light of the described laser instrument transmitting chip of its correspondence or the operation wavelength of detector receiving chip, the light of other three wavelength of transmission;

5th collimation lens is positioned at described wavelength-division multiplex demultiplexing optical filter reflecting surface side, and light path between described 5th collimation lens and described wavelength-division multiplex demultiplexing optical filter is vertical with the light path between described wavelength-division multiplex demultiplexing optical filter and described laser instrument transmitting chip or detector receiving chip.

2. parallel light transceiver component as claimed in claim 1, is characterized in that, in described light emission component:

First collimation lens (401), the second collimation lens (402), the 3rd collimation lens (403) and the 4th collimation lens (404) are collimated light beam for laser instrument transmitting chip being sent change diverging light beams;

Described 5th collimation lens (405), for being converted to converging light by via the light beam after described collimation lens collimation, thus is received by optical fiber;

Described laser instrument transmitting chip is vertical cavity surface emitting laser, carries out passive attachment with described PCB (105) by high precision patch device; The circuit of described PCB (105) connects employing gold wire bonding mode and realizes;

Contraposition between described conglomerate and described laser instrument transmitting chip, adopts high precision patch device to realize with passive or active alignment so;

Being observed by infrared CCD makes the summit hot spot of described first collimation lens (401) aim at the first laser instrument transmitting chip (101), the summit hot spot of described second collimation lens (402) is aimed at second laser transmitting chip (102), the summit hot spot of described 3rd collimation lens (403) is aimed at the 3rd laser tube core (103), and the summit hot spot of described 4th collimation lens (404) is aimed at the 4th laser tube core (104); After collimation lens contraposition described in described laser instrument transmitting chip and described conglomerate, described conglomerate is fixed in described PCB (105), after pre-fixing by ultraviolet glue, then is reinforced by epoxide-resin glue fixing; Finally, seal cover board (106) is fixed on described conglomerate by fluid sealant, realizes device sealing.

3. parallel light transceiver component as claimed in claim 2, it is characterized in that, described parallel light transceiver component also comprises the first adjustable support (301), the second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304);

Described four adjustable supports are provided with 45 degree of inclined-planes of relatively described PCB surface level, for installing described four wavelength-division multiplex demultiplexing optical filters respectively, described adjustable support are designed with handle, are convenient to clamping or suction nozzle adsorption operations; Ultraviolet glue is adopted to fix between described adjustable support and described conglomerate;

When optical assembly requires higher coupling efficiency, regulate described adjustment support to control the upper and lower displacement of described wavelength-division multiplex demultiplexing optical filter respectively by single channel, the light that described chip of laser (101 ~ 104) is launched is coupled in contact pin by as much as possible after optical filter reflection; After described laser instrument transmitting chip transmitted beam, after the described collimation lens collimation of its correspondence, incide on the described wavelength-division multiplex demultiplexing optical filter of its correspondence, by monitor optical mouth place emergent light power or use beam quality analysis instrument monitoring hot spot, regulate the adjustable support of its correspondence, fix described adjustable support when monitoring effect is best.

4. parallel light transceiver component as claimed in claim 2, it is characterized in that, described parallel light transceiver component also comprises the second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304);

Described adjustable support is provided with 45 degree of inclined-planes of relatively described PCB surface level, for installing described second wavelength-division multiplexing and demultiplexing optical filter (108), the 3rd wavelength-division multiplex demultiplexing optical filter (109) and the 4th wavelength-division multiplex demultiplexing optical filter (110) respectively, described adjustable support is designed with handle, is convenient to clamping or suction nozzle adsorption operations; Described first wavelength-division multiplexing and demultiplexing optical filter (107) is fixed on described conglomerate; Ultraviolet glue is adopted to fix between described adjustable support and described conglomerate;

When optical assembly requires higher coupling efficiency, the upper and lower displacement of described wavelength-division multiplex demultiplexing optical filter is regulated to regulate described second laser transmitting chip (102), described 3rd laser instrument transmitting chip (103) and described 4th laser instrument transmitting chip (104) transmitted beam position after respective filter successively by single channel:

After described laser instrument transmitting chip transmitted beam, after the described collimation lens collimation of its correspondence, incide on the described wavelength-division multiplex demultiplexing optical filter of its correspondence, by monitor optical mouth place emergent light power or use beam quality analysis instrument monitoring hot spot, regulate the adjustable support of its correspondence, fix described adjustable support when monitoring effect is best.

5. parallel light transceiver component as claimed in claim 2, it is characterized in that, the corresponding service band of the first laser instrument transmitting chip (101), second laser transmitting chip (102), the 3rd laser instrument transmitting chip (103) and the 4th laser instrument transmitting chip (104) is respectively 820nm, 850nm, 880nm, 910nm or is respectively 1250nm, 1280nm, 1310nm, 1340nm.

6. parallel light transceiver component as claimed in claim 2, is characterized in that, in described optical fiber receive module:

6th collimation lens (406), becomes collimated light for beam shaping of Optical Fiber Transmission being come;

7th collimation lens (407), the 8th collimation lens (408), the 9th collimation lens (409) and the tenth collimation lens (410), for changing the collimated light beam after described 6th collimation lens (406) shaping into converging light;

Described detector receiving chip and described PCB (105) carry out passive attachment by high precision patch device, be connected adopt gold wire bonding mode to realize with the circuit of described PCB (105);

Contraposition between described conglomerate and described detector receiving chip, adopts high precision patch device to realize with passive or active alignment so:

Being observed by infrared CCD makes the summit hot spot of described 7th collimation lens (407) aim at the first detector receiving chip (201) photosurface center, the summit hot spot of described 8th collimation lens (408) is aimed at the second detector receiving chip (202) photosurface center, the summit hot spot of described 9th collimation lens (409) is aimed at the 3rd detector receiving chip (203) photosurface center, and the summit hot spot of described tenth collimation lens (410) is aimed at the 4th detector receiving chip (204) photosurface center; After collimation lens contraposition described in described detector receiving chip and described conglomerate, described conglomerate is fixed in described PCB (105), after pre-fixing by ultraviolet glue, then is reinforced by epoxide-resin glue fixing; Finally, described seal cover board (106) is fixed on described conglomerate by fluid sealant, realizes device sealing.

7. parallel light transceiver component as claimed in claim 6, it is characterized in that, described parallel light transceiver component also comprises the first adjustable support (301), the second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304);

Described four adjustable supports are provided with 45 degree of inclined-planes of relatively described PCB surface level, for installing described four wavelength-division multiplex demultiplexing optical filters respectively, described adjustable support are designed with handle, are convenient to clamping or suction nozzle adsorption operations; Ultraviolet glue is adopted to fix between described adjustable support and described conglomerate;

When optical assembly requires higher coupling efficiency, the upper and lower displacement of described wavelength-division multiplex demultiplexing optical filter is regulated to regulate fixing described first adjustable support (301), the second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304) successively by single channel:

Optical Fiber Transmission is come light beam, regulate described adjustable support, the light beam of one of them wavelength is reflected at the described wavelength-division multiplex demultiplexing optical filter place of its correspondence, make described light beam all can incide on the described detector receiving chip photosurface of its correspondence by monitoring responsiveness, fixing described adjustable support.

8. parallel light transceiver component as claimed in claim 6, it is characterized in that, described parallel light transceiver component also comprises the second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304);

Described adjustable support is provided with 45 degree of inclined-planes of relatively described PCB surface level, for installing described second wavelength-division multiplexing and demultiplexing optical filter (108), the 3rd wavelength-division multiplex demultiplexing optical filter (109) and the 4th wavelength-division multiplex demultiplexing optical filter (110) respectively, described adjustable support is designed with handle, is convenient to clamping or suction nozzle adsorption operations; Described first wavelength-division multiplexing and demultiplexing optical filter (107) is fixed on described conglomerate; Ultraviolet glue is adopted to fix between described adjustable support and described conglomerate;

When optical assembly requires higher coupling efficiency, regulate described second adjustable support (302), the 3rd adjustable support (303) and the 4th adjustable support (304) by single channel, regulate described corresponding optical filter to control the position of folded light beam:

Optical Fiber Transmission is come light beam, regulate described adjustable support, the light beam of one of them wavelength is reflected at the described wavelength-division multiplex demultiplexing optical filter place of its correspondence, make described light beam all can incide on the described detector receiving chip photosurface of its correspondence by monitoring responsiveness, fixing described adjustable support.

9. parallel light transceiver component as claimed in claim 6, it is characterized in that, the corresponding service band of described first detector receiving chip (201), the second detector receiving chip (202), the 3rd detector receiving chip (203) and the 4th detector receiving chip (204) is respectively 820nm, 850nm, 880nm, 910nm or is respectively 1250nm, 1280nm, 1310nm, 1340nm.