CN1982404A - Thermal-interface material and its production - Google Patents
Thermal-interface material and its production Download PDFInfo
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- CN1982404A CN1982404A CN 200510120676 CN200510120676A CN1982404A CN 1982404 A CN1982404 A CN 1982404A CN 200510120676 CN200510120676 CN 200510120676 CN 200510120676 A CN200510120676 A CN 200510120676A CN 1982404 A CN1982404 A CN 1982404A
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Abstract
本发明提供一种热界面材料，其包括高分子基体及导热填充物；所述导热填充物至少包括第一导热粒子、与所述第一导热粒子不同材料且不同粒径的第二导热粒子，所述第一导热粒子的粒径范围为50纳米～1微米，所述第二导热粒子的粒径范围为1微米～10微米；所述高分子基体及导热填充物的质量比为1∶9～3∶7。本发明还提供所述热界面材料的制备方法。
The present invention provides a thermal interface material, which includes a polymer matrix and a thermally conductive filler; the thermally conductive filler includes at least first thermally conductive particles, second thermally conductive particles of different materials and different particle sizes from the first thermally conductive particles, The particle diameter of the first heat-conducting particles ranges from 50 nanometers to 1 micron, the particle diameter of the second heat-conducting particles ranges from 1 micron to 10 microns; the mass ratio of the polymer matrix to the heat-conducting filler is 1:9 ~3:7. The invention also provides a preparation method of the thermal interface material.
Description
[technical field]
The present invention relates to hot teach skill art field, relate in particular to a kind of heat interfacial material and preparation method thereof.
[background technology]
In recent years, along with the fast development of semiconducter device integrated technique, the integrated degree of semiconducter device is more and more higher, and it is more and more littler that device volume but becomes, and its heat radiation becomes a more and more important problem, and its requirement to heat radiation is also more and more higher.For satisfying these needs, various radiating modes are used in a large number, as utilize modes such as fan heat radiation, water-cooled auxiliary heat dissipation and heat pipe heat radiation, and obtain certain radiating effect, but because the contact interface and the unfairness of scatterer and semiconductor integrated device, generally be in contact with one another only less than 2% area, contact problems at heat abstractor and thermal source surface, tackling way in the industry generally is to add a thermally conductive material between electronic component and heat abstractor, be heat interfacial material, to improve the heat conduction efficiency between electronic component and the heat abstractor.
Traditional a kind of heat interfacial material, it adopts polymkeric substance such as silicone oil, siloxanes as substrate oil, and adds a kind of heat conduction particle in metallic aluminium, aluminum oxide, zinc oxide, aluminium nitride, graphite or the CNT (carbon nano-tube) etc. therein.Yet silicone oil, this type organic of siloxanes are generally oligopolymer, and its surface tension is lower, may separate diffusion from the heat interfacial material that makes, and make the matrix attenuate of the heat interfacial material that makes, and therefore whole heat interfacial material may be destroyed; And silicone oil, siloxanes are relatively poor to the wetting ability that is added into heat conduction particle wherein, also obtain heat-conductive characteristic preferably than difficulty; And, a kind of heat conduction particle makes an addition in a kind of substrate oil, the particle-filled density of the heat conduction that obtains can only be maintained at low limit usually, otherwise the snappiness of substrate oil and wettability can be lost because of the excessive filling of heat conduction particle, particularly nano level heat conduction particle can cause more that because of its high-specific surface area the substrate oil viscosity acutely increases, cause substrate oil to be difficult to mix with the heat conduction particle, so the heat interfacial material heat-conductive characteristic that forms just may not satisfy the demand of present electronic element radiating.
In view of this, heat interfacial material that a kind of heat-conductive characteristic excellence is provided and preparation method thereof is real in necessary.
[summary of the invention]
Below, will a kind of heat interfacial material be described with embodiment.
And a kind of hot interface preparation method is described with embodiment.
A kind of heat interfacial material, it comprises macromolecule matrix and heat-conducting filler; Described heat-conducting filler comprise at least the first heat conduction particle, with the second heat conduction particle of the described first heat conduction particle differing materials and different-grain diameter, the particle size range of the described first heat conduction particle is 50 nanometers～1 micron, and the particle size range of the described second heat conduction particle is 1 micron～10 microns; The mass ratio of described macromolecule matrix and heat-conducting filler is 1: 9～3: 7.
And a kind of method of preparing heat interfacial material, it may further comprise the steps:
Macromolecule matrix, heat-conducting filler are provided, described heat-conducting filler comprise at least the first heat conduction particle, with the second heat conduction particle of the described first heat conduction particle differing materials and different-grain diameter, and the particle size range of the described first heat conduction particle, the second heat conduction particle is respectively 50 nanometers～1 micron, 1 micron～10 microns.
Above-mentioned macromolecule matrix and the heat-conducting filler mass ratio according to 1: 9～3: 7 is mixed;
Material after above-mentioned the mixing is carried out ground and mixed, form a heat interfacial material.
Compared with prior art, described heat interfacial material adopts the polymer with better snappiness and wettability as body material, and uses the first heat conduction particle of differing materials, different-grain diameter and the second heat conduction particle as heat-conducting filler.So design can make the loading level of heat-conducting filler in macromolecule matrix increase; The particle diameter of the described first heat conduction particle is selected between 50 nanometers～1 micron, the particle diameter of the described second heat conduction particle is selected between 1 micron～10 microns, tool can be filled in the interparticle space of heat conduction of tool greater particle size than the heat conduction particle of small particle size, increase the contact area of heat conduction particle, thereby can increase thermal conduction; The mass ratio of described macromolecule matrix and heat-conducting filler remains between 1: 9～3: 7 simultaneously, can avoid the snappiness of macromolecule matrix and wettability to be destroyed because of the loading level of heat-conducting filler increases, and bring into play the heat-conductive characteristic of the heat conduction particle excellence of this particle size range fully, the heat-conductive characteristic of whole heat interfacial material also obtains best performance.Described method of preparing heat interfacial material, described macromolecule matrix and heat-conducting filler are mixed and ground and mixed in the ratio between the mass ratio 1: 9～3: 7, can protect positive heat-conducting filler and in macromolecule matrix, disperse equably, improve the heat-conductive characteristic of the heat interfacial material of preparation.
[description of drawings]
Fig. 1 is the heat interfacial material synoptic diagram that embodiments of the invention provide.
Fig. 2 is the user mode synoptic diagram of the heat interfacial material that provides among Fig. 1.
Fig. 3 is the method for preparing heat interfacial material schematic flow sheet that embodiments of the invention provide.
[embodiment]
Below in conjunction with accompanying drawing heat interfacial material provided by the invention and preparation method thereof is described in further detail.
See also Fig. 1, heat interfacial material 1 synoptic diagram that provides for embodiments of the invention.Described heat interfacial material 1 comprises macromolecule matrix 10 and heat-conducting filler 20; Described heat-conducting filler 20 comprise at least the first heat conduction particle 21, with the second heat conduction particle 22 of the described first heat conduction particle, 21 differing materials and different-grain diameter, the particle size range of the described first heat conduction particle 21 is 50 nanometers～1 micron, and the particle size range of the described second heat conduction particle 22 is 1 micron～10 microns; The mass ratio of described macromolecule matrix and heat-conducting filler is 1: 9～3: 7.
Wherein, described macromolecule matrix 10 can be selected from the one or more combination in alkene, dibasic acid esters, multi-hydroxy ester, polyhydroxy ethers, polyhydroxyketone and the polyhydroxy-acid.Certainly, described macromolecule matrix 10 can also be selected from other and has better close-burning polyvalent alcohol and other ethers grease etc.Preferably, the kinematic viscosity of described macromolecule matrix 10 in the time of 40 degrees centigrade is 10～500 square millimeters/second.
The material of the described first heat conduction particle 21 and the second heat conduction particle 22 can be selected from one or more combination in metallics, metal oxide, boron nitride, aln precipitation, CNT (carbon nano-tube), carbon fiber, carbon black and the diamond respectively.Described metallics is selected from the one or more combination in gold and silver, copper, aluminium, nickel, tin and the lead.Described metal oxide is selected from the one or more combination of zinc oxide, aluminum oxide and titanium oxide.Certainly, the material of the described first heat conduction particle 21 and the second heat conduction particle 22 is not limited to above-mentioned form, the row that other heat conduction particle with better heat-conductive characteristic also all can use in the present invention; Described metallics, metal oxide also are not limited to above-mentioned form, and other has the metallics of better heat-conductive characteristic, the row that metal oxide materials also all can use in the present invention.
See also Fig. 2, during heat interfacial material 1 practical application, place between Heating element 2 and the heat abstractor 3, macromolecule matrix 10 is filled up at Heating element 2 and heat abstractor 3 in the minim gap because of contact interface unfairness formation fully by its snappiness, and can be well in conjunction with heat-conducting filler 20 by its good wettability.Heat-conducting filler 20 adopts the first heat conduction particle 21 and the second heat conduction particle 22 of differing materials, different-grain diameter, and the loading level of heat-conducting filler 20 in macromolecule matrix 10 increased; The particle diameter of the described first heat conduction particle 21 is selected between 50 nanometers～1 micron, the particle diameter of the described second heat conduction particle 22 is selected between 1 micron～10 microns, tool can be filled in than the heat conduction particle 21 of small particle size in the space of 22 on heat conduction particle of tool greater particle size, increase the contact area of heat conduction particle 21,22, thereby can increase thermal conduction; The mass ratio of described macromolecule matrix 10 and heat-conducting filler 20 remains between 1: 9～3: 7 simultaneously, can avoid the snappiness of macromolecule matrix 10 and wettability to be destroyed because of the loading level of heat-conducting filler 20 increases, and bring into play the heat-conductive characteristic of the heat conduction particle excellence of this particle size range fully, the heat-conductive characteristic of whole heat interfacial material 1 also obtains best performance.The heat that Heating element 2 produces just can conduct to heat abstractor 3 quickly and evenly by above-mentioned heat interfacial material 1, and heat abstractor 3 is dispersed into heat in the external world by its radiating fin 31 and fan 32 and goes.
Certainly, described heat-conducting filler is not limited to the above-mentioned one first heat conduction particle that only comprises, the form of one second heat conduction particle, and can comprise the heat conduction particle of multiple differing materials, and the particle diameter of the heat conduction particle of this multiple differing materials also can be selected from respectively between 50 nanometers～1 micron and 1 micron～10 microns, only must make at least wherein inequality the getting final product of particle diameter of two kinds of heat conduction particles.
The heat interfacial material that present embodiment provides, employing has the polymer of better snappiness and wettability as body material, and the heat conduction particle that uses heterogeneity material, different-grain diameter is as heat-conducting filler, and so design can make the loading level of heat-conducting filler in macromolecule matrix increase; The particle diameter of the described first heat conduction particle 21 is selected between 50 nanometers～1 micron, the particle diameter of the described second heat conduction particle 22 is selected between 1 micron～10 microns, tool can be filled in than the heat conduction particle 21 of small particle size in the space of 22 on heat conduction particle of tool greater particle size, increase the contact area of heat conduction particle 21,22, thereby can increase thermal conduction; The mass ratio of described macromolecule matrix and heat-conducting filler remains between 1: 9～3: 7 simultaneously, can avoid the snappiness of macromolecule matrix and wettability to be destroyed because of the loading level of heat-conducting filler increases, and bring into play the heat-conductive characteristic of the heat conduction particle excellence of this particle size range fully, the heat-conductive characteristic of whole heat interfacial material also obtains best performance.
The present invention also provides a kind of method of preparing heat interfacial material, below with reference to accompanying drawing described method of preparing heat interfacial material is described further.
See also Fig. 3, the method for preparing heat interfacial material that embodiments of the invention provide comprises the steps:
Step 100: macromolecule matrix 10, heat-conducting filler 20 are provided, this heat-conducting filler 20 comprise at least the first heat conduction particle 21, with the second heat conduction particle 22 of the described first heat conduction particle, 21 differing materials and different-grain diameter, and the particle size range of the described first heat conduction particle 21, the second heat conduction particle 22 is respectively 50 nanometers～1 micron, 1 micron～10 microns.
Described macromolecule matrix 10 can be selected from the one or more combination in alkene, dibasic acid esters, multi-hydroxy ester, polyhydroxy ethers, polyhydroxyketone and the polyhydroxy-acid.In the present embodiment, macromolecule matrix 10 is selected multi-hydroxy ester for use.Certainly, described macromolecule matrix 10 can also be selected from other polyvalent alcohol with better wettability and other ethers grease etc.Preferably, the kinematic viscosity of described macromolecule matrix 10 in the time of 40 degrees centigrade is 10～500 square millimeters/second.
The material of the described first heat conduction particle 21 and the second heat conduction particle 22 can be selected from one or more combination in metallics, metal oxide, boron nitride, aln precipitation, CNT (carbon nano-tube), carbon fiber, carbon black and the diamond respectively.Described metallics is selected from the one or more combination in gold and silver, copper, aluminium, nickel, tin and the lead.Described metal oxide is selected from the one or more combination of zinc oxide, aluminum oxide and titanium oxide.Certainly, described heat conduction particle and wherein metallics, metal oxide are not limited to above-mentioned form, the row that other particle with better heat-conductive characteristic also all can use in the present invention.
In the present embodiment, described heat-conducting filler 20 comprises one first heat conduction particle 21, one second heat conduction particle 22, the material selection zinc oxide of the described first heat conduction particle 21, particle diameter is selected between 100～500 nanometers, the material selection metallic aluminium of the second heat conduction particle 22, particle diameter is selected between 4～4.9 microns.
Step 200: above-mentioned macromolecule matrix 10 and heat-conducting filler 20 mass ratio according to 1: 9～3: 7 is mixed.First mixing can at room temperature select for use the planetary-type mixer (Planetary Mixer) of tool agitating vane to mix.
In the present embodiment, described macromolecule matrix 10 and heat-conducting filler 20 mix according to 1: 4～1: 5 mass ratio, the first heat conduction particle 21 in the described heat-conducting filler 20 and the second heat conduction particle 22 account for 45% and 55% of heat-conducting filler 20 total masses respectively.
Step 300: the material after above-mentioned the mixing is carried out ground and mixed, form a heat interfacial material.Mix the three-roll grinder (Three-roll Mill) that at room temperature to select shearing force for use once more, make macromolecule matrix 10 and heat-conducting filler 20 thorough mixing more, form a heat interfacial material.
Place a heat interfacial material device for measuring thermal conductive property (figure does not show) to measure calculating the heat interfacial material of above-mentioned preparation, its thermal impedance be 0.06～0.12 degree centigrade of square centimeter/watt between (℃ cm
2/ W).
The method of preparing heat interfacial material that present embodiment provides, employing has the material of the polymer of better snappiness and wettability as matrix, and use differing materials, the first heat conduction particle of different-grain diameter and the second heat conduction particle are as heat-conducting filler, the described first heat conduction particle, the particle size range of the second heat conduction particle is respectively 50 nanometers～1 micron, 1 micron～10 microns, so design can make the loading level of heat-conducting filler in macromolecule matrix increase, tool can be filled in the interparticle space of heat conduction of tool greater particle size than the heat conduction particle of small particle size, increase the contact area of heat conduction particle, give full play to the heat-conductive characteristic of the heat conduction particle excellence of this particle size range; Described macromolecule matrix and heat-conducting filler are mixed and ground and mixed in the ratio between the mass ratio 1: 9～3: 7, can make heat-conducting filler homodisperse in macromolecule matrix, also can avoid the snappiness of macromolecule matrix and wettability to be destroyed simultaneously because of the loading level of heat-conducting filler increases.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these changes and distortion all should belong to the protection domain of claim of the present invention according to technical scheme of the present invention and technical conceive.
Claims (11)
1. heat interfacial material, it comprises:
Macromolecule matrix; And
Heat-conducting filler;
Described heat-conducting filler comprise at least the first heat conduction particle, with the second heat conduction particle of the described first heat conduction particle differing materials and different-grain diameter, the particle size range of the described first heat conduction particle is 50 nanometers～1 micron, and the particle size range of the described second heat conduction particle is 1 micron～10 microns; The mass ratio of described macromolecule matrix and heat-conducting filler is 1: 9～3: 7.
2. heat interfacial material as claimed in claim 1 is characterized in that described macromolecule matrix is selected from the one or more combination in alkene, dibasic acid esters, multi-hydroxy ester, polyhydroxy ethers, polyhydroxyketone and the polyhydroxy-acid.
3. heat interfacial material as claimed in claim 1 is characterized in that, the kinematic viscosity of described macromolecule matrix in the time of 40 degrees centigrade is 10～500 square millimeters/second.
4. heat interfacial material as claimed in claim 1, it is characterized in that the material of the described first heat conduction particle and the second heat conduction particle can be selected from one or more combination in metallics, metal oxide, boron nitride, aln precipitation, CNT (carbon nano-tube), carbon fiber, carbon black and the diamond respectively.
5. heat interfacial material as claimed in claim 4 is characterized in that described metallics is selected from the one or more combination in gold and silver, copper, aluminium, nickel, tin and the lead.
6. heat interfacial material as claimed in claim 4 is characterized in that described metal oxide is selected from the one or more combination of zinc oxide, aluminum oxide and titanium oxide.
7. heat interfacial material as claimed in claim 1 is characterized in that, the particle size range of the described first heat conduction particle is 50～500 nanometers.
8. heat interfacial material as claimed in claim 1 is characterized in that, the particle size range of the described second heat conduction particle is 1～5 micron.
9. method of preparing heat interfacial material, it may further comprise the steps:
Macromolecule matrix, heat-conducting filler are provided, described heat-conducting filler comprise at least the first heat conduction particle, with the second heat conduction particle of the described first heat conduction particle differing materials and different-grain diameter, and the particle size range of the described first heat conduction particle, the second heat conduction particle is respectively 50 nanometers～1 micron, 1 micron～10 microns; Above-mentioned macromolecule matrix and the heat-conducting filler mass ratio according to 1: 9～3: 7 is mixed; Material after above-mentioned the mixing is carried out ground and mixed, form a heat interfacial material.
10. method of preparing heat interfacial material as claimed in claim 9 is characterized in that, the described device that mixes adopts planetary-type mixer.
11. method of preparing heat interfacial material as claimed in claim 9 is characterized in that, the device of described ground and mixed adopts three-roll grinder.
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| CN 200510120676 CN1982404A (en) | 2005-12-13 | 2005-12-13 | Thermal-interface material and its production |
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| CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
| CN111995991A (en) * | 2020-07-27 | 2020-11-27 | 深圳陶陶科技有限公司 | A kind of thermal interface material and preparation method thereof |
| WO2021057630A1 (en) * | 2019-09-24 | 2021-04-01 | 华为技术有限公司 | Thermal conductor, thermally conductive material, and packaging structure of semiconductor device |
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| CN101633833B (en) * | 2008-07-23 | 2011-07-20 | 昆山纳诺新材料科技有限公司 | Nano-diamond thermal grease |
| US8080499B2 (en) | 2008-07-23 | 2011-12-20 | Kunshan Nano New Material Technology Co., Ltd. | Nanodiamond thermal grease |
| CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
| JP2022549311A (en) * | 2019-09-24 | 2022-11-24 | 華為技術有限公司 | Thermal conductors, thermally conductive materials, and package structures for semiconductor devices |
| WO2021057630A1 (en) * | 2019-09-24 | 2021-04-01 | 华为技术有限公司 | Thermal conductor, thermally conductive material, and packaging structure of semiconductor device |
| CN112625657A (en) * | 2019-09-24 | 2021-04-09 | 华为技术有限公司 | Packaging structure of heat conductor, heat conduction material and semiconductor device |
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| JP7373061B2 (en) | 2019-09-24 | 2023-11-01 | 華為技術有限公司 | Package structures for thermal conductors, thermally conductive materials, and semiconductor devices |
| EP4023733A4 (en) * | 2019-09-24 | 2022-10-19 | Huawei Technologies Co., Ltd. | THERMAL CONDUCTOR, THERMALLY CONDUCTIVE MATERIAL, AND SEMICONDUCTOR DEVICE ENCAPSULATING STRUCTURE |
| KR20220066383A (en) * | 2019-09-24 | 2022-05-24 | 후아웨이 테크놀러지 컴퍼니 리미티드 | Thermal Conductor, Thermally Conductive Material, and Packaging Structure of a Semiconductor Device |
| CN115024027A (en) * | 2020-01-22 | 2022-09-06 | 3M创新有限公司 | Thermal interface layer |
| CN111995991B (en) * | 2020-07-27 | 2022-01-18 | 深圳陶陶科技有限公司 | Thermal interface material and preparation method thereof |
| CN111995991A (en) * | 2020-07-27 | 2020-11-27 | 深圳陶陶科技有限公司 | A kind of thermal interface material and preparation method thereof |
| CN113185953A (en) * | 2020-07-27 | 2021-07-30 | 谷歌有限责任公司 | Thermal interface material and method of making the same |
| CN113150551A (en) * | 2020-07-27 | 2021-07-23 | 谷歌有限责任公司 | Thermal interface material and method of making the same |
| US12187951B2 (en) | 2020-07-27 | 2025-01-07 | Google Llc | Thermal interface material and method for making the same |
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| CN117802349A (en) * | 2024-03-01 | 2024-04-02 | 成都先进金属材料产业技术研究院股份有限公司 | Liquid metal thermal interface material and preparation method and application thereof |
| CN117802349B (en) * | 2024-03-01 | 2024-06-04 | 成都先进金属材料产业技术研究院股份有限公司 | Liquid metal thermal interface material and preparation method and application thereof |
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Open date: 20070620 |