CN1982056B - Screen printing device - Google Patents

Abstract

A screen printing apparatus of the invention comprises: a supporting device supporting a circuit substrate from below; a clamp, from both sides, holding the side surface of the circuit substrate supported by the supporting device; a circuit substrate pressing device for pressing the circuit substrate from above, which is supported on the supporting device and maintaining the circuit substrate in a warp and then straightened state along an up-and-down direction. The circuit substrate pressing device holds the circuit substrate to move the same along a holding direction of the clamp. According to the invention, via the circuit substrate pressing device pressing the circuit substrate, a warp of the circuit substrate can be straightened and the circuit substrate can be maintained in this state.

Description

Screen printing device

technical field

The present invention relates to a screen printing device for coating a paste such as cream solder on a circuit board.

Background technique

In conventional screen printing devices, the squeegee moves (rotates) on the mask with the circuit board and the mask set on the printing table generally overlapped, and the creamy solder supplied to the mask, conductive Paste such as paste is printed (applied) on a predetermined position on the circuit board through openings (mask openings) formed in the mask.

The printing table of the above screen printing device includes, from below, a carrier device that supports the circuit board that is carried in substantially horizontally by a conveyor belt; A pair of clamps that overlap the matte. As a result, the above-mentioned circuit board is warped in the vertical direction as a whole, and if the circuit board in the warped state is clamped by the above-mentioned jig, an unnecessary gap will be generated between the circuit board and the mask, thereby causing Printing defects such as paste cannot be printed on the circuit board. For this reason, in the conventional screen printing apparatus, in order to correct the warping of the circuit board in the vertical direction, a circuit board pressing device is provided to press the circuit board carried by the above-mentioned carrying device from above, and the warped state of the circuit board is corrected. In the state, the circuit board is superimposed on the mask with high precision.

Specifically, the upper surface of the circuit board supported by the carrying device is pressed by the above-mentioned circuit board pressing device to correct the warping of the circuit board, and then the clamper on one side of the pair of clamps is used to move to the clamper on the other side. , by sandwiching the sides of the circuit board, the circuit board and the mask are overlapped in the sandwiched state (see Patent Document 1: Japanese Patent Laid-Open Publication No. Hei 8-1908).

However, when the upper surface of the circuit board is pressed by the circuit board pressing device, the circuit board is clamped between the circuit board pressing device and the carrier device supporting the circuit board from below, whereby the circuit board is fixed in this position. Therefore, even if one of the pair of jigs holding the side of the circuit board collides with the side of the circuit board and moves to the other jig to hold the circuit board, since the circuit board is fixed, Therefore, it is difficult to securely clamp the circuit board in a state where the warped state is corrected.

Contents of the invention

The present invention aims to solve the above problems, and an object of the present invention is to provide a screen printing device capable of correcting warping of a circuit board by pressing the circuit board with a circuit board pressing device and maintaining it in this state.

In order to solve the above-mentioned problems, the screen printing apparatus according to the present invention may include a carrier device that supports the circuit board from below; press the above-mentioned circuit board carried on the carrier device from above, and hold the circuit board up and down The substrate pressing device of the circuit in the state where the warpage in the direction is corrected; the clamp for clamping the side surface of the above-mentioned circuit substrate carried by the above-mentioned carrier device from both sides; wherein the above-mentioned circuit substrate pressing device holds the above-mentioned circuit substrate so that it can be Move along the clamping direction of the above-mentioned clamps.

With the above-mentioned screen printing device, since the circuit substrate can be clamped by the circuit substrate pressing device and the carrying device, and can be moved along the clamping direction of the jig at the same time, the warping of the circuit substrate is corrected, and the circuit substrate's This state is maintained while being movable in this state along the clamping direction of the jig. Accordingly, when the circuit board and the mask are overlapped, the influence of the warp of the circuit board can be reduced, and the occurrence of printing defects can be suppressed.

In the above-mentioned screen printing device, preferably, the above-mentioned circuit board pressing device may include a pressing part that is in contact with the upper surface of the above-mentioned circuit board, and the pressing part can be rotated by a rotating member along the clamping direction of the above-mentioned clamp. constitute.

With the above structure, the circuit board can move along the clamping direction of the jig while being clamped by the circuit board pressing device and the carrying device, and the rotating member can also rotate accordingly, so that the circuit board can be corrected when the warpage is corrected. clamped in the state.

In the above-mentioned screen printing device, preferably, the above-mentioned circuit board pressing device may include a pressing part that is in contact with the surface of the above-mentioned circuit board, and the contact surface of the pressing part that is in contact with the surface of the above-mentioned circuit board can be formed by Consists of low friction components.

With the above structure, the circuit board can move along the clamping direction of the jig while being clamped by the circuit board pressing device and the carrying device.

In the above-mentioned screen printing device, it is preferable to further include a suction holding device for suctioning the circuit board from below the circuit board; controlling various operations of the circuit board pressing device, the clamp, and the suction holding device. The control device; the control device controls a series of operations, makes the circuit board pressing device press the circuit board from above, and at the same time makes the clamp clamp the circuit board, and makes the suction holding device suck and hold the circuit board.

With the above structure, in the state where the upper surface of the circuit substrate is pressed by the circuit substrate pressing means and the circuit substrate is held by the jig, the circuit substrate can be sucked from below the circuit substrate by the suction and holding means, so that the circuit substrate can be warped. It is adsorbed while the distortion is corrected. Therefore, once the circuit board is clamped and held, it is difficult to restore the warpage.

In the above-mentioned screen printing apparatus, preferably, the suction holding device is capable of suction-holding the circuit board in a movable state under the control of the control device.

According to the above structure, the above-mentioned circuit board can be more effectively held by the circuit board pressing device in a state where the warpage is corrected.

Description of drawings

FIG. 1 is a side view of a screen printing device according to an embodiment of the present invention.

Fig. 2 is a front view showing the printing device.

Fig. 3 is a plan view schematically showing the printing device.

Fig. 4 is a perspective view showing a printing table and its surroundings of the printing apparatus.

Fig. 5 is a side view showing a clamp assembly and its surroundings of the printing apparatus.

6 is a perspective view showing the positional relationship of the positioning plate of the printing apparatus during the clamping operation, wherein (a) shows a perspective view when the positioning plate is at the retracted position, and (b) shows a perspective view when the positioning plate is at the positioning position.

FIG. 7 is a perspective view schematically showing the positional relationship of various parts of the printing apparatus according to the embodiment of FIG. 1 .

Fig. 8 is a perspective view showing a circuit board pressing device of the printing apparatus.

Fig. 9 is an enlarged perspective view showing a circuit board pressing device of the printing apparatus.

Fig. 10 is a block diagram showing a control system of the printing apparatus.

11 is a side view for explaining the operation of the above-mentioned printing device, (a) showing a side view in a state where a circuit board is placed, and (b) showing that the positioning plate is advanced to fix the board while the circuit board pressing device is moving. , (c) shows the side view of raising the substrate to fix the substrate while the circuit board pressing device is operating, (d) shows the circuit board pressing device is operating while lifting the substrate to fix the substrate. Clamped side view.

12 is a side view for explaining the operation of the above-mentioned printing device, (a) shows a side view in which the positioning plate is retracted in order to fix the circuit board while the circuit board pressing device is operating, and (b) shows the state when the solder is applied. side view.

Detailed ways

Fig. 1 is a side view of a screen printing device according to an embodiment of the present invention, Fig. 2 is a front view of the device, Fig. 3 is a top view of the device, and Fig. 4 is a printing table 10 of the device and its surroundings stereogram. As shown in the above figure, on the base 2 of the screen printing device (referred to as the printing device), a printing table 10 is provided, and on both sides of the printing table 10, along the X-axis direction (transport line) are provided with The substrate W is carried into the upstream conveyor belt 11 of the printing table 10 and carried out from the downstream conveyor belt 12 of the printing table 10 .

Moreover, the printing device also includes a clamp assembly 3 for clamping the circuit substrate W; a positioning assembly 4 for abutting against the upper surface of the circuit substrate W when clamping the circuit substrate W to position it; a mask assembly 5 And the scraper assembly 6 is arranged above the printing table 10; the camera assembly 7 is used to photograph the circuit substrate W and the mask 51; the circuit substrate pressing mechanism 8 is used to press the circuit substrate; the circuit substrate W passes through the circuit substrate pressing mechanism 8. Correct the warpage, clamp it by the clamp assembly 3 in the state where the warpage is corrected, and overlap with the mask 51 of the mask assembly 5 in this state, and then pass the scraper 61 of the scraper assembly 6. Printing.

As shown in Figures 1 and 2, on the base 2, a guide rail 211 is provided along the Y-axis direction perpendicular to the X-axis direction in the horizontal plane, and a guide rail 211 is installed on the guide rail 211 to freely slide along the Y-axis direction. Y-axis table 21. Moreover, a ball screw mechanism (not shown) is provided between the Y-axis table 21 and the base 2, and by driving the ball screw mechanism, the Y-axis table 21 can be moved relative to the base 2 along the Y-axis direction. move.

On the Y-axis table 21 , a guide rail 221 is provided along the X-axis direction, and on the guide rail 221 , an X-axis table 22 freely slidable along the X-axis direction is installed. Moreover, a ball screw mechanism (not shown) is provided between the X-axis table 22 and the Y-axis table 21, and by driving the ball screw mechanism, the X-axis table 22 can be moved along the Y-axis table 21 relative to the Y-axis table 21. Move in the X-axis direction.

On the X-axis table 22 , the R-axis table 23 that can freely rotate around an axis in the vertical direction (Z-axis direction) is provided via a rotating assembly 231 . The R-axis table 23 is rotationally driven around the Z-axis by a rotational drive device not shown.

The four corners of the R-axis workbench 23 are equipped with sliding pillars 241 that can slide freely along the up-down direction (Z-axis direction). Sliding can make the lifting table 24 freely move up and down along the Z-axis direction relative to the R-axis table 23 . And, between the lifting table 24 and the R-axis table 23, a ball screw mechanism 243 is arranged, and by driving the ball screw mechanism, the lifting table 24 can be moved along the Z-axis direction relative to the R-axis table 23 ( up and down) to move. In this embodiment, the printing table 10 is constituted by the elevating table 24 and the clamp assembly 3 arranged on the elevating table 24 .

On the elevating table 24, a pair of main conveyor belts 20 are mounted on the structural member 25 along the X-axis direction. This main conveyor belt 20, when the elevating table 24 is in a state of descending, its upstream side end and downstream side end are respectively opposed to the end of the above-mentioned upstream side conveyor 11 and the end of the downstream side conveyor 12. . In addition, in the above state, the gap between the main conveyor 20 and both side conveyors 11, 12 is set to allow the circuit board W to be conveyed between the conveyors, specifically a small gap of about 5 mm. Therefore, in this embodiment, in order to avoid the interference between the main conveyor belt 20 and the conveyor belts 11 and 12 on both sides, when the main conveyor belt 20 is in the lowered state, the movement of the X-axis table 22 and the R-axis table 23 is restricted. The resulting movement of the main conveying plate 20 in the directions of the X-axis and the R-axis, and in order to prevent the main conveying belt 20 from shifting relative to the conveying belts 11 and 12 on both sides, the Y-axis table 21 and R The main conveyor belt 20 moves in the Y-axis and R-axis directions due to the movement of the axis table 23 . That is, the main conveyor belt 20, when in a descended state, limits the movement of the main conveyor belt 20 in the horizontal direction (X axis, Y axis and R-axis direction) movement.

As shown in FIGS. 1-5 , the gripper assembly 3 arranged on the lifting table 24 includes a pair of slat-shaped clamping plates 31 a, 31 b arranged above the pair of main conveyor belts 20 along the X-axis direction. The clamping plate 31a on one side is fixed on the structural component 25 (referring to FIG. 5 ) on the elevating workbench 24, and the clamping plate 31b on the other side can move along the Y-axis direction with respect to the structural component 25 of the elevating workbench 24. It is mounted to be slid freely, and can be freely approached or separated with respect to the clamping plate 31a.

In addition, a bracket 26b is arranged on the splint 31b on the other side, and an air cylinder (air cylinder) 33 is arranged between the bracket 26b and the structural component 25 . Through the propulsion drive (extension drive) of the air cylinder 33, the clamping plate 31b on the other side, together with the bracket 26b, moves along the Y-axis direction in a direction away from the clamping plate 31a on the fixed side, so that the clamping plates 31a, 31b are Separated, on the other hand, through the backward drive (shortening drive) of the cylinder 33, the clamping plate 31b on the other side moves along the Y-axis direction towards the direction close to the clamping plate 31a on the fixed side, thereby making the clamping plates 31a, 31b near. Thus, by opening and closing the pair of clamp plates 31a and 31b, the substrate W can be clamped and released as described below.

As shown in FIGS. 3 and 4 , a plurality of adsorption holes 35 are provided on the upper surfaces of the two splints 31 a and 31 b. Negative pressure is formed in each suction hole 35 by a suction device not shown. In the state where the mask 51 is overlapped with the clamping plates 31a, 31b, since each suction hole 35 has a negative pressure, the masking sheet 51 is sucked and held on the upper surfaces of the clamping plates 31a, 31b.

As shown in FIG. 5 , the positioning assembly 4 provided on the lifting table 24 as a pressing device includes a pair of slatted positioning plates 41a, 41b corresponding to the above-mentioned two clamping plates 31a, 31b respectively. The positioning plate 41a on one side is arranged on the structural member 25 through a parallel link mechanism 42, and the positioning plate 41b on the other side is arranged on the above-mentioned support 26b through a parallel link mechanism 42. And, along with the rotation of two parallel link mechanisms 42, the two positioning plates 41a, 41b, under the state of keeping the level, can be positioned at the evacuated positions on both sides of a pair of clamping plates 31a, 31b shown in Fig. 6(a). , and shown in FIG. 6( b ) are located above a pair of clamping plates 31a, 31b to press the positioning position of the substrate for free displacement. And two positioning plates 41a, 41b, when being in retreat position, its upper surface and the upper surface of a pair of clamping plates 31a, 31b are in the same horizontal plane; In contrast, protrudes toward the inside of the device along the Y-axis direction.

In addition, on the lifting workbench 24 and the bracket 26b, a cylinder 43 for driving two parallel linkage mechanisms 42 is provided. Through the propulsion drive (extension drive) of the cylinder 43, a pair of positioning plates 41a, 41b move along the Y circumferential direction. The inside of the device is pushed to move to the positioning position, or the pair of positioning plates 41a, 41b are separated to move to the retracted position by the backward driving (shortening driving) of the air cylinder 43 .

As shown in FIG. 4 , the four corners of the elevating worktable 24 are vertically provided with pillars 44 for supporting the positioning board as supporting members. When the positioning plates 41a, 41b are at the retracted position (retracted state), the positioning plates 41a, 41b are supported by the pillars 44 so as to be able to withstand the pressure generated by the scraper 61 described later when applying the paste.

As shown in FIG. 4 , a plurality of adsorption holes 45 are provided on the positioning plates 41a, 41b. In each suction hole 45, a negative pressure is formed by a suction device (not shown) via a suction pipe 46 . As described below, in the state where the mask 51 overlaps the positioning plates 41a, 41b, the mask 51 is sucked and held on the upper surfaces of the positioning plates 41a, 41b due to the negative pressure in the suction hole 45 .

As shown in FIGS. 1 to 5 , on the lifting table 24 , corresponding to the position between the pair of main conveying belts 20 , there is provided a loading table 29 that can be freely lifted up and down by sliding pillars 291 . In addition, a ball screw mechanism (not shown) is provided between the loading table 29 and the lifting table 24. By driving the ball screw mechanism, the loading table 29 can be moved up and down relative to the lifting table 24. move. The carrying table 29 is used as a carrying device to carry the circuit substrate W. By rising, the circuit substrate W on the main conveyor belt 20 can be transferred to the carrying table 29 and moved upward. The circuit substrate W is transferred to the main conveyor belt 20 .

FIG. 7 is a perspective view schematically showing the positional relationship of various parts of the printing apparatus according to this embodiment.

As shown in Figures 5 and 7, the mask assembly 5 includes a mask support platform 52 fixedly arranged on the left and right sides of the printing table 10, and on the mask support platform 52, a mask in a laying state is horizontally arranged. 51, which is provided with an opening portion (pattern hole) corresponding to the solder application portion. On the left and right mask supporting tables 52, two mask holders 53 are provided at the front and rear respectively, and the mask holders 53 are driven by a driving device (not shown) such as an air cylinder to press the frame portion 54 of the mask 51 against the mask. The mask 51 is fixed on the mask supporting table 52 by this.

The squeegee assembly 6 arranged above the mask assembly 5 is supported by the squeegee support frame 63 vertically arranged on the left and right sides of the printing table 10 . On the upper surfaces of the left and right scraper support frames 63, 63, there are respectively provided scraper guide rails 64, 64 extending along the Y-axis direction. The movable arm 65 is thus in a state where the movable arm 65 straddles the printing table 10 . On the movable arm 65, a scraper holder 62 is installed, and the scraper holder 62 is provided with a pair of scrapers 61 which can be lifted and lowered freely respectively.

And, by moving one of the squeegee 61 in the lowered state to one of the Y-axis directions, the cream solder S can be rolled on the mask 51 to one of the Y-axis directions. While expanding it, the other scraper 61 moves in the other direction of the Y-axis direction in a lowered state, thereby rolling the paste on the mask 51 in the other direction of the Y-axis direction. shape solder S to make it expand.

FIG. 8 is a perspective view showing the imaging unit 7 and the circuit board pressing device 8 of the printing apparatus, and FIG. 9 is an enlarged perspective view of the circuit board pressing device 8 .

As shown in Figures 7-9, on the lower surface of the scraper support frame 63 on both sides, there are lower guide rails 74, 74 extending along the Y-axis direction, which are supported on the lower guide rails via sliders (not shown). The moving arm (moving assembly) 75 on 74,74 is erected between the left and right scraper support frames 63,63. The movable arm 75 is movable in the Y-axis direction along the lower guide rail 74, and its height position is located between the lowered printing table 10 and the mask 51. As shown in FIG.

On the outside of the scraper supporting frames 63, 63, ball screws 76, 76 extending along the Y-axis direction are provided. The above-mentioned left and right ball screws 76, 76 are driven to rotate by ball screw drive motors 761, 761 respectively, so that The moving arm 75 provided with nuts (not shown) screwed with the ball screws 76 and 76 respectively moves in the Y-axis direction. In this embodiment, the above-mentioned left and right ball screws 76, 76 and ball screw drive motors 761, 761 constitute two driving devices for moving and driving the moving arm (moving unit) 75 .

The moving arm 75 is equipped with an imaging unit 7 for photographing the circuit board W and the mask 51 and a circuit board pressing device 8 for pressing the circuit board W from above. In this embodiment, the moving arm 75 is a moving unit that moves relative to the circuit board W and the mask 51 , and the Y-axis direction is the moving direction (first direction). Therefore, by arranging the circuit board pressing device 8 and the imaging unit 7 on the moving arm (moving unit) 75, the moving arm (moving unit) 75 can be used as the circuit board pressing unit 8 and the imaging unit 7 when they move in the Y-axis direction. Shared Y-axis direction movement mechanism.

In addition, the lower guide rails 74, 74 supporting the movable arm 75 are directed backward from the circuit board pressing area including the circuit board pressing area for pressing the circuit board W, and the printing work area located below the mask 51 (in FIGS. 7 and 8 ). In order to extend from the surface of the paper to the deep direction), during the printing operation of applying paste to the circuit board W, the imaging unit 7 and the circuit board pressing device 8 can be made to stand by at the standby position located behind the above-mentioned work area. , to prevent the above two from interfering with the printing table 10 . Thus, the movable arm (moving unit) 75 can stand by at the standby position E at a certain distance from the operation area A including the above-mentioned circuit board pressing area and the printing operation area under the mask 51, thereby enabling the circuit The substrate pressing device 8 and the camera assembly 7 are simultaneously on standby at the standby position E, and the circuit substrate pressing device 8 and the camera assembly 7 can be sent from the standby position E to the working area A.

The camera assembly 7 is installed in front of the moving arm (moving assembly) 75, that is, it is arranged at a position close to the work area A side, and it includes a camera 711 (upper side) for photographing a mask and a camera 712 (on the upper side) for photographing a circuit board ( The camera head (camera head) 71 on the lower side). The camera 71 is movable in the X-axis direction by an X-axis direction movement mechanism 77 provided in front of the moving arm 75 . Thus, the camera 71 is driven in the X-axis direction by the X-axis moving mechanism 77, and in the Y-axis direction is jointly driven by the camera assembly 7 and the Y-axis direction moving mechanism (moving arm 75) of the circuit board pressing device 8. , so that it can move on the XY plane for shooting.

The X-axis direction moving mechanism 77 includes a guide rail 771 extending along the length direction (X-axis direction) of the movable arm 75; a slide block 772 that can move along the X-axis direction on the guide rail 771; The provided nut (not shown) is screwed with the ball screw; the drive motor (not shown) that rotates and drives the ball screw. The camera 71 is installed on the slider 772, and the camera 71 can move along the X-axis direction through the rotation of the ball screw. In this embodiment, the X-axis direction moving mechanism 77 is a moving device for moving the camera along the second direction perpendicular to the above-mentioned first direction, and the X-axis direction is the second direction.

The camera 711 for photographing the matte can be composed of a CCD camera including an illumination component, and is installed facing upwards to photograph the matte 51 located above the imaging unit 7 . In addition, the camera 711 for photographing the mask can photograph the alignment mark provided on the mask 51 after installing the new mask 51 to detect its position, thereby adjusting the position of the mask 51 and the circuit board W. In addition, photographs are taken to check whether solder remains on the opening of the mask or its lower surface.

The camera 712 for photographing the circuit board is constituted by a CCD camera including an illumination component, and is installed facing downward to photograph the circuit board W located below the imaging unit 7 . In addition, the circuit board photographing camera 712 can photograph the positioning marks and the like provided on the circuit board W fixed on the printing table 10 to detect their positions, thereby adjusting the positions of the circuit board W and the mask 51 .

The circuit board pressing device 8 is installed in front of the moving arm (moving assembly) 75, specifically, on the slider 772 of the above-mentioned X-axis direction moving mechanism 77, adjacent to the above-mentioned camera assembly 7, and passes through the above-mentioned The X-axis direction moving mechanism 77 moves in the X-axis direction. Therefore, the circuit board pressing device 8 can be driven in the X-axis direction by the X-axis direction moving mechanism 77 together with the imaging unit 7, and can be driven in the Y-axis direction by the Y-axis direction moving mechanism. to move on.

As shown in FIGS. 8 and 9 , the circuit board pressing device 8 includes a flat frame 81 extending along the X-axis direction, and a pressing portion 82 located below the frame 81 .

The frame 81 is formed of a flat member extending in the X-axis direction, and is installed in a state protruding toward the work area A side than the imaging unit 7 in order to prevent interference with the circuit board imaging camera 712 of the imaging unit 7. On slider 772.

In addition, the frame 81 includes an upper frame 81a and a lower frame 81b. The upper frame 81a and the lower frame 81b are connected by support rods 83 respectively provided in the longitudinal direction of the frames. Specifically, two ends of the lower frame 81b in the longitudinal direction are fixedly connected to one end of the support rod 83, and the other end of the support rod 83 penetrates the two ends of the upper frame 81a in the longitudinal direction. Further, the support rods 83 protruding from the upper surface of the upper frame 81a are held in a vertically slidable state by guides 84 provided at both ends in the longitudinal direction of the upper frame 81a.

In addition, a linear actuator 85 is provided on the upper surface of the upper frame 81a. A drive rod (rod) 85a of the actuator 85 penetrates the upper frame 81a and is connected to the lower frame 81b. Therefore, the lower frame 81b can approach or separate from the upper frame 81a by the operation of the actuator 85 . That is, the lower frame 81b can be displaced between a circuit board pressing position at a certain distance from the upper frame 81a, and a releasing position in contact with the upper frame 81a.

In addition, a pressing portion 82 for pressing the circuit board W is attached to the lower surface of the lower frame 81b. The pressing portion 82 includes a support portion 82a extending in the longitudinal direction of the lower frame 81b, and rollers 82b attached to both ends of the support portion 82a in the longitudinal direction. As shown in FIG. 9, the lower frame 81b is provided with two support portions 82a along the longitudinal direction (X-axis direction) of the lower frame 81b.

The said roller 82b is provided along the direction orthogonal to the side surface of the said support part 82a with the outer peripheral surface. That is, the above-mentioned roller 82b rotates around the X-axis. In addition, the minimum height position of the outer peripheral surface of the said roller 82b is lower than the height position of the lower surface of the support part 82a. That is, a part of the outer peripheral surface of the roller 82b protrudes downward compared with the lower surface of the support part 82a. Therefore, the outer peripheral surface of the roller 82b collides with the upper surface of the circuit board W when the pressing portion 82 is lowered. Moreover, when the rollers 82b collide with the circuit board W, the rollers 82b can restrict the circuit board W from moving in directions other than the Y axis, but the circuit board W can be moved along the Y axis by the rotation of the rollers 82b.

Fig. 10 is a block diagram showing a control system of the printing apparatus. As shown in the figure, the above-mentioned device includes a CPU 91 as a control device for controlling the driving of each drive unit, a keyboard 92 as an input device, a CRT monitor 93 as a display device, and a storage device 94. The keyboard 92 is used to input various data related to the printing process to the printing device, and the CRT display 93 is used to display various information (data). On the other hand, the storage device 94 is used to store various data and the like required for printing.

In addition, in the present embodiment, as the driving part (control object) controlled by CPU91, include, the driving part of each conveyor belt 11, 12, 20; The driving part of each workbench 21, 22, 23, 24, 29; 31a, 31b and positioning plates 41a, 41b driving part (pneumatic device); mask holder 53 driving part; mask shooting camera 711 and circuit board shooting camera 712 driving part; as a moving arm (moving unit) 75 The ball screw driving motor 761 of the driving part; the driving motor as the driving part of the X-axis direction moving mechanism 77;

In the printing device of this embodiment, the CPU 91 operates in response to commands from the keyboard 92, based on various data such as program data, the results of images taken by the cameras 711 and 712, and output information from various sensors that detect the position of the circuit board and the like. , to control the driving of the above-mentioned driving parts to automatically perform the following operations.

Hereinafter, the operation of the printing apparatus described above will be described with reference to the side views shown in FIGS. 11 and 12 .

As shown in FIG. 11( a ), the circuit board W to be printed is carried into the main conveyor 20 via the upstream conveyor 11 . Then, the circuit board W carried into the main conveyor 20 is held at a predetermined position on the printing table 10 .

Specifically, as shown in FIG. 11( b ), the positioning plates 41a, 41b of the positioning unit 4 move toward the inside of the device, and at the same time enter the positioning position where they can be pressed against the clamping plates 31a, 31b from above. At this time, the circuit board pressing device 8 at the standby position E moves to an appropriate position above the circuit board pressing area, that is, suitable for pressing the circuit board W, by utilizing the operation time of the positioning unit 4 and the like.

Then, as shown in FIG. 11( c ), the loading table 29 is raised so as to come into contact with the lower surface of the circuit board W. As shown in FIG. And further raise the workbench 29, make the upper surface of the circuit substrate W and the lower surface (reference plane) of the positioning plate 41a, 41b conflict, so that the circuit substrate W is located in the same plane with respect to the upper surfaces of the clamping plates 31a, 31b , and be temporarily fixed. At this time, the warpage of the circuit board W is corrected to a certain extent by the positioning plates 41 a, 41 b and the loading table 29 . Furthermore, the circuit board W is movably placed on the loading table 29 in a finely adjustable state.

On the other hand, the lower frame 81b is lowered from the release position to the circuit board pressing position by the operation of the actuator 85 of the circuit board pressing device 8 . The circuit substrate W is clamped by the rollers 82b and the loading table 29 by the contact between the rollers 82b and the upper surface of the circuit substrate W. As shown in FIG. Accordingly, the circuit board W is held by the positioning plates 41a, 41b, the mounting table 29, and the rollers 82b in a state where the warpage is corrected.

Then, as shown in FIG. 11( d ), the substrate W is clamped by the clamp plates 31 a , 31 b as the clamp plates 31 a , 31 b approach. That is, in the state shown in FIG. 11(c), the clamping plate 31b (positioning plate 41b) is moved to the clamping plate 31a side (clamping direction). At this time, the circuit board W is held by the positioning plates 41a, 41b, carrying the table 29, and the rollers 82b in a state where the warpage is corrected. Furthermore, when the circuit board W is pressed in the clamping direction by the clamping plate 31b, since the roller 82b rotates with the movement of the circuit board W, the circuit board W moves toward the clamping plate 31a side. Therefore, the circuit board W moves toward the clamping plate 31a side in a state where the warpage is corrected, and is clamped by the clamping plates 31a and 31b in this state.

Then, the lower frame 81b of the circuit board pressing device 8 is displaced from the circuit board pressing position to the release position, the rollers 82b leave the surface of the circuit board W, and the circuit board pressing device 8 moves to the standby position E. In addition, the positioning plates 41a, 41b move to the outside of the apparatus and stop at the withdrawn position, thus completing the fixing operation of the circuit board W on the printing table 10 (see FIG. 12( a )). At this time, the circuit board W remains in a state where the warpage is corrected, the upper surfaces of the positioning plates 41a, 41b and the upper surfaces of the clamping plates 31a, 31b are in the same plane, and the upper surfaces of the clamping plates 31a, 31b and the upper surfaces of the circuit board W are in the same plane. surfaces are in the same plane.

Thus, after the circuit board W is clamped by the clamping plates 31a, 31b, the lifting table 24 is raised, thereby aligning the positioning plates 41a, 41b, the clamping plates 31a, 31b, and the upper surface of the circuit board W with the mask of the mask assembly 5. The lower surfaces of 51 overlap (see FIG. 12(b)). Moreover, due to the negative pressure in the suction holes 35 of the clips 31a, 31b and the suction holes 45 of the positioning plates 41a, 41b, the mask 51 is adsorbed and fixed on the clamping plates 31a, 31b and the positioning plates 41a, 41b.

Subsequently, the squeegee 61 on one side of the squeegee assembly 6 descends and moves in the Y-axis direction along the mask 51, thereby expanding the cream solder S supplied to the mask 51, so that the cream solder S passes through The pattern holes on the mask 51 are printed (coated) on predetermined positions of the circuit board W. As shown in FIG.

As described above, according to the screen printing apparatus of the present invention according to the above-mentioned embodiment, the circuit board W can be pressed by the circuit board pressing device 8 movable in the clamping direction of the jaws 31a, 31b, so that the warpage of the circuit board can be corrected. In addition, the circuit board W remains in the state where the warpage is corrected, and at the same time, can move along the clamping direction of the clamping plates in this state. Therefore, during printing, the influence of warpage of the circuit board can be minimized, and the occurrence of printing defects can be suppressed.

In addition, in the above-mentioned embodiment, an example has been described in which only the circuit board W whose warpage is corrected by the circuit board pressing device 8 is sandwiched and printed using the clamping plates 31a and 31b, but a suction holding device may also be provided to After the circuit board W is clamped by the clamping plates 31a and 31b, the circuit board W is sucked to hold it in the state where the above-mentioned warpage is corrected.

Specifically, suction holes capable of forming a negative pressure by a suction device may be provided on the surface of the mounting table 29, and the suction device may be controlled by a control device (CPU 91). In the state where the warpage of the circuit substrate is corrected by the pressing device 8, it is clamped by the splints 31a, 31b, and then the suction device is controlled to make the above-mentioned suction hole a negative pressure, so that the circuit substrate W is corrected in warpage. State is fixed on the bearing workbench 29. According to the above structure, it is possible to prevent the circuit board W whose warpage has been corrected and clamped from returning to the uncorrected warpage state due to warpage recovery before being overlapped with the mask.

In addition, the above suction holding device sucks and holds the circuit board W on the loading table 29 after it is sandwiched by the clamp plates 31 a and 31 b as described above. However, the circuit board W may be sucked and held by holding the negative pressure of the circuit board W in a state where the circuit board W can move during the clamping operation of the grippers 31 a and 31 b by the suction holding device. That is, in the operation of pressing by the circuit board pressing device 8 and clamping by the clamp plates 31a, 31b, the negative pressure in the suction hole is made to the extent that the sucked circuit board W can move, and the circuit board W is held in this state. The substrate W is adsorbed and held on the carrying table 29. After the clamping plates 31a and 31b complete the clamping operation, and the warpage of the circuit substrate W is corrected, the negative pressure in the suction hole is increased to further compress the circuit substrate W. Adsorption is maintained on the carrying table 29 . According to the above configuration, the circuit board W can be more effectively clamped by the circuit board pressing device 8 in a state where the warp is corrected.

In addition, in the circuit board pressing device 8 of the above-mentioned embodiment, the example in which the rollers 82b are provided on the support portion 82a has been described, but the support portion 82a made of a low-friction member that contacts the upper surface of the circuit board W may also be used. The structure of the abutment surface replaces the roller 82b. For example, in the above-mentioned embodiment, the lower surface of the supporting portion 82a is the abutting surface that abuts against the upper surface of the circuit board W. surface abutment. Thus, the circuit board W can be pressed and moved in a state where the circuit board W is clamped by the circuit board pressing device 8 and the mounting table 29, so that the circuit board W can be in a state where the warpage is corrected. Be clamped.

Claims (3)

1. screen printing apparatus is characterized in that comprising:

Bogey is from below supporting circuit substrate;

Circuit substrate pressing device is pushed the foregoing circuit substrate that is carried on the above-mentioned bogey from the top, and this circuit substrate is remained on the state that the warpage of above-below direction is corrected;

Anchor clamps have two clamping plates at least, by making side clamping plate in the described two clamping plates to the side that the opposite side clamping plate move the foregoing circuit substrate that is carried on the above-mentioned bogey from sandwich, wherein,

The foregoing circuit substrate pressing device, comprise with the upper surface of foregoing circuit substrate and conflicting, and the revolving member that the clamping direction of the above-mentioned anchor clamps that the foregoing circuit substrate moves to above-mentioned opposite side clamping plate is rotated along above-mentioned side clamping plate, keep the foregoing circuit substrate, it can be moved along the clamping direction of above-mentioned anchor clamps.

2. screen printing apparatus according to claim 1 is characterized in that:

Also comprise,

Sticking and holding apparatus adsorbs this circuit substrate from the below of foregoing circuit substrate, and is kept;

Control device, the various operations of control foregoing circuit substrate pressing device, above-mentioned anchor clamps and above-mentioned sticking and holding apparatus;

Above-mentioned control device is controlled sequence of operations, makes the foregoing circuit substrate pressing device push the foregoing circuit substrate from the top, makes above-mentioned this circuit substrate of anchor clamps clamping simultaneously, and makes above-mentioned sticking and holding apparatus absorption keep this circuit substrate.

3. screen printing apparatus according to claim 2 is characterized in that:

Above-mentioned sticking and holding apparatus, by the control of above-mentioned control device, absorption keeps the foregoing circuit substrate, makes it be in the possible state that moves.

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