CN1975985A - Apparatus and methods for a substrate carrier having an inflatable seal - Google Patents
Apparatus and methods for a substrate carrier having an inflatable seal Download PDFInfo
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- CN1975985A CN1975985A CNA200610150474XA CN200610150474A CN1975985A CN 1975985 A CN1975985 A CN 1975985A CN A200610150474X A CNA200610150474X A CN A200610150474XA CN 200610150474 A CN200610150474 A CN 200610150474A CN 1975985 A CN1975985 A CN 1975985A
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- H10P72/00—
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- H10P72/0441—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- H10P72/10—
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- H10P72/1916—
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Abstract
本发明提供了一种用于衬底载体的系统、方法和设备。本发明提供了适于使用真空源来收缩衬底载体的门的充气式密封件的门开启器。通过使充气式密封件收缩,门从衬底载体的主体释放,使得衬底可以被移除和/或插入到载体中。第二真空源可以施加至门以将其牢固地保持至门开启器。还公开了本发明的许多其它方面。
The present invention provides a system, method and apparatus for a substrate carrier. The present invention provides a door opener adapted to use a vacuum source to retract the inflatable seal of the door of a substrate carrier. By retracting the inflatable seal, the door is released from the body of the substrate carrier so that the substrate can be removed and/or inserted into the carrier. A second vacuum source can be applied to the door to hold it securely to the door opener. Many other aspects of the invention are also disclosed.
Description
本申请要求2005年11月21日提交的名为“Apparaus and Methods fora Substrae Carrier Having an Inflatable Seal”的美国临时专利申请序列号60/738,542的优先权,其整个内容通过引用包含在这里。This application claims priority to U.S. Provisional Patent Application Serial No. 60/738,542, filed November 21, 2005, entitled "Apparaus and Methods for a Substrae Carrier Having an Inflatable Seal," the entire contents of which are hereby incorporated by reference.
技术领域technical field
本发明涉及电子器件制造,更具体而言,涉及密封衬底载体门的设备和方法。The present invention relates to electronic device fabrication, and more particularly, to apparatus and methods for sealing substrate carrier doors.
背景技术Background technique
一般来说,优选的是保护衬底(例如图案化的或未图案化的半导体晶片、玻璃面板、聚合物衬底、标线片、掩膜、玻璃板等)以防其暴露至任何潜在的污染颗粒物。因此,这些衬底必须储存在气密的容器中。但是,通常衬底必须被输送至电子器件制造设备中的不同处理工具。因此,需要用于将衬底输送到密封的容器中的方法和设备以及用于在不使衬底暴露至潜在的污染颗粒物的情况下接近衬底的系统和方法。In general, it is preferred to protect substrates (e.g., patterned or unpatterned semiconductor wafers, glass panels, polymer substrates, reticles, masks, glass plates, etc.) from exposure to any potential pollution particles. Therefore, these substrates must be stored in airtight containers. Often, however, the substrate must be transported to different processing tools in the electronics manufacturing facility. Accordingly, there is a need for methods and apparatus for transporting substrates into sealed containers and systems and methods for accessing substrates without exposing the substrates to potentially contaminating particles.
发明内容Contents of the invention
在一些方面中,本发明提供了用于衬底载体的设备,该设备包括门开启器,门开启器使用第一真空源来收缩衬底载体的门的充气式密封件,以从衬底载体的主体释放门。In some aspects, the present invention provides an apparatus for a substrate carrier that includes a door opener that uses a first vacuum source to retract the inflatable seal of the door of the substrate carrier to release the vacuum from the substrate carrier. The main release door.
在本发明的其它方面中,提供了用于密封衬底载体的系统,该系统包括适于保持一个或多个衬底的衬底载体以及用于接收来自衬底载体传输系统的衬底载体的装载端口。装载端口包括门开启器,门开启器适于使用第一真空源来收缩衬底载体的门的充气式密封件,以从衬底载体的主体释放门。In other aspects of the invention, a system for sealing a substrate carrier is provided that includes a substrate carrier adapted to hold one or more substrates and a substrate carrier for receiving a substrate carrier from a substrate carrier transport system. Mount port. The loadport includes a door opener adapted to retract the inflatable seal of the door of the substrate carrier using the first vacuum source to release the door from the body of the substrate carrier.
在本发明的其它方面中,提供了一种方法,该方法包括:在装载端口处接收衬底载体;将门开启器配合至衬底载体的门;经由门开启器施加第一真空压力至门以保持门;并施加第二真空压力至充气式密封件以收缩充气式密封件并从衬底载体释放衬底的门。In other aspects of the invention there is provided a method comprising: receiving a substrate carrier at a load port; fitting a door opener to the door of the substrate carrier; applying a first vacuum pressure to the door via the door opener to holding the door; and applying a second vacuum pressure to the inflatable seal to contract the inflatable seal and release the door of the substrate from the substrate carrier.
从以下的详细描述、权利要求和附图中,本发明的其它特征和方面将变得更加完整、清楚。Other features and aspects of the present invention will become more complete and apparent from the following detailed description, claims and accompanying drawings.
附图说明Description of drawings
图1图示本发明设备的示例性实施例的立体图。Figure 1 illustrates a perspective view of an exemplary embodiment of the device of the present invention.
图2图示图1的设备,其中门开启器的密封板被移除。Figure 2 illustrates the apparatus of Figure 1 with the sealing plate of the door opener removed.
图3以反向的立体图图示图1的设备,其示出衬底载体门和门开启器的反向侧。FIG. 3 illustrates the apparatus of FIG. 1 in a reverse perspective view showing the reverse side of the substrate carrier door and door opener.
图4图示沿着图3的线4-4所取的图3的设备的部件的侧视图。4 illustrates a side view of components of the apparatus of FIG. 3 taken along line 4-4 of FIG. 3 .
图5图示图4的设备的侧视图,示出附装至衬底载体门或与衬底载体门配合的门开启器。Figure 5 illustrates a side view of the apparatus of Figure 4 showing the door opener attached to or engaged with the substrate carrier door.
图6图示沿着图3的线6-6所取的图3的设备部件的剖面侧视图。6 illustrates a cross-sectional side view of the device component of FIG. 3 taken along line 6 - 6 of FIG. 3 .
图7图示图6的设备的侧视图,示出附装至FOUP门或与FOUP门配合的门开启器。Figure 7 illustrates a side view of the apparatus of Figure 6 showing the door opener attached to or mated with a FOUP door.
图8图示使用图1至7的发明的FOUP门和门开启器的系统。Figure 8 illustrates a system using the inventive FOUP door and door opener of Figures 1-7.
图9图示描述根据本发明实施例的示例处理的流程图。Figure 9 illustrates a flowchart describing example processing according to an embodiment of the present invention.
具体实施方式Detailed ways
本发明涉及具有充气式密封件的衬底载体门。为了方便起见,结合前面开口一体盒(FOUP)的门进行描述。但是,应当理解本发明可以用于适于容纳盒输送衬底的任何衬底载体,这些衬底例如半导体晶片、玻璃衬底、聚合物衬底、掩膜、标线片等。The invention relates to a substrate carrier door with an inflatable seal. For convenience, the description will be made in conjunction with the door of a front opening unitary box (FOUP). However, it should be understood that the present invention may be used with any substrate carrier suitable for housing cassettes for transporting substrates, such as semiconductor wafers, glass substrates, polymer substrates, masks, reticles, and the like.
图1图示本发明设备的示例性实施例的立体图,本发明的设备一般用参考标号100来表示。参考图1,设备100包括FOUP门200。在示例性实施例中,FOUP门200可以用于任何合适的前面开口一体盒(FOUP)(其示例描述在图8中)或与其结合使用。FOUP门200适于放置在FOUP的门框架(未示出)中以建立密封件的闭合。设备100还包括门开启器300,门开启器300用于FOUP门开启器(图8)和/或装载端口(图8)或与它们结合使用。FIG. 1 illustrates a perspective view of an exemplary embodiment of the apparatus of the present invention, generally designated by the
参考图1,FOUP门200包括外板210和附装至外板210的内部结构220。外板210和内部结构220可以以任何合适的方式(例如经由螺钉、螺栓等)彼此附装,或者可以一体地形成和/或成为整体的构造。Referring to FIG. 1 , the
FOUP门200还包括充气式门密封件230,充气式门密封件230沿着结合的外板210/内部结构220的外周并邻近其延伸,如图所示。在示例性实施例中,充气式门密封件230可以由橡胶或类似的材料(例如弹性、柔性和/或顺应性材料)制成。当FOUP门200位于FOUP的门框架中时,充气式门密封件230可以膨胀以压靠门框架并密封关闭的FOUP。The
FOUP门200还可以在外板210中包含插口240,如图所示,插口240可以接收门开启器300的销或其它特征,如下所述。在示例性实施例中,插口240可以是对准销插口或类似的运动特征。根据门开启器300和/或FOUP门200的设计,可以使用任意数量的插口240。FOUP门200还可以包括位于外板210中的门密封件真空配件(fitting)250,如图所示。也可以使用其它的配件位置。The
外板210和内部结构220适于使得外板210/内部结构220组合允许空气或任何其它气体经由门密封件真空配件250穿出充气式门密封件230,并允许空气或任何其它气体从门密封件真空配件250进入充气式门密封件230。以此方式,施加真空至门密封件真空配件250可以使门密封件250放气或收缩。从门密封件真空配件250移除真空(和/或施加加压的空气/气体)可以允许空气或任何其它气体(在一些实施例中其可以被施加至门密封件真空配件250)进入穿过门密封件真空配件250,以再次充气或膨胀门密封件230。The
再次参考图1,门开启器300包括外壁310和内壁320。内壁320适于面对FOUP门200的外板210。门开启器300还包括密封板330,密封板330可移除地附装至门开启器的外壁310,并用作门开启器300的内部区域的封盖。Referring again to FIG. 1 , the
门开启器300还包括门保持端口340,门保持端口340可以连接至真空源(未示出),用于允许FOUP门200经由门开启器300保持真空,如下详细所述。门开启器300还包括门密封件启动端口350,门密封件启动端口350可以连接至真空源(未示出),用于FOUP门200的门密封件230的真空启动(放气)(以下将详细描述)。The
在示例性实施例中,本发明的设备和方法可以使用适于提供这里所述的真空源功能的两个真空源、任意数量的真空源或单个真空源。可替换地或附加地,本发明可以使用一个或多个空气或气体源,以为FOUP门200的门密封件230充气。In exemplary embodiments, the apparatus and methods of the present invention may use two vacuum sources, any number of vacuum sources, or a single vacuum source adapted to provide the vacuum source functions described herein. Alternatively or additionally, the present invention may use one or more air or gas sources to inflate the
图2图示图1的设备100,其中门开启器300的密封板330被移除。在密封板330被移除的情况下,门开启器300的内部区域360被暴露。在内部区域360内,门开启器300可以包括门保持真空通道370。当从各个真空源施加真空压力时,门保持真空通道370经由通道341连接至门保持端口340以提供真空,用于使FOUP门200抵靠门开启器300保持在合适的位置,如下详细所述。FIG. 2 illustrates the
在内部区域360内,门开启器300可以包括门密封件启动真空通道380。门密封件启动真空通道380经由通道351连接至门密封件启动端口350,以允许从各个真空源施加的真空使门密封件230收缩,如下详细所述。Within interior region 360 ,
图3以相反方向图示图1的设备100,示出FOUP门200和门开启器300的相反侧。参考图3,门开启器300在其内壁320上包括门密封件真空配件355,在示例性实施例中,门密封件真空配件355适于延伸到FOUP门200中的门密封件真空配件250中。门密封件真空配件355连接至门密封件启动真空通道380(图2)。门开启器300还可以在其内壁320上包括销345或其它对准/运动特征,在示例性实施例中,销345或其它对准/运动特征适于与FOUP门200的插口240(图2)运动地配合。根据门开启器300和/或FOUP门200的设计,可以使用任意数量和可使用形状的销345。FIG. 3 illustrates the
再次参考图3,门开启器300可以在其内壁320上包括门保持真空杯形构件或元件375。在所示的实施例中,使用两个门保持真空杯形构件375以保持FOUP门200抵靠门开启器300。一般来说,可以使用任意数量的门保持真空杯形构件375(例如一个、两个、三个、四个等)。Referring again to FIG. 3 , the
门保持真空杯形构件375可以由能够形成抵靠FOUP门200的密封的任何合适的材料制成,例如聚四氟乙烯(PTFE)等。在一个实施例中,每个门保持真空杯形构件375可以通过在门开启器300的内壁320中加工通道(未示出)并在该通道中放置O形环377或类似的密封元件来形成。门保持真空杯形构件375可以与门保持真空通道370(图2)相连,并可以在从各个真空源施加真空并且真空经由门保持端口340(图2)和门保持真空通道370(图2)提供至门保持真空杯形构件375时,保持FOUP门200抵靠门开启器300。The door retaining
图4图示沿图3的线4-4所取的图3的设备100的部件的侧视图。在图4中,FOUP门200和门开启器300被示作彼此间隔开。图4图示FOUP门200的外板210、内部结构220和充气式密封件230。图4还图示了门开启器300的外壁310、内壁320、销345和门保持真空杯形构件375。FIG. 4 illustrates a side view of components of the
图5图示了图4所示设备100的侧视图,示出安装至FOUP门200或与FOUP门200配合的门开启器300。换言之,门开启器300的内壁320与FOUP门200的外板210接触,门开启器300的销345(图3)配合在外板210中的插口240(图2)中。在图示的构造中,如果真空压力经由门保持端口340(图2)并经由门保持真空通道370(图2)施加至门保持真空杯形构件375,则FOUP门200可以保持抵靠门开启器300。FIG. 5 illustrates a side view of the
图6图示沿着图3的线6-6所取的图3的设备100的部件的剖面侧视图。在图6中,FOUP门200和门开启器300被示作彼此间隔开。FIG. 6 illustrates a cross-sectional side view of components of the
图6图示门开启器300以及外壁310、内壁320、密封板330、门保持真空通道370、门密封件启动真空通道380、连接通道351、门密封件真空配件355、销345和门保持真空杯形构件375。图6还图示了FOUP门200以及外板210、内部结构220、充气式密封件230和门密封件真空配件250。门密封件真空配件250可以包括密封元件610(例如O形环),用于在门密封件真空配件250和门密封件真空配件355之间形成密封(如图7所示)。6 illustrates
现在转至图7,图7图示图6的设备100的剖面侧视图,图7描述了附装至FOUP门200或与FOUP门200配合的门开启器300。换言之,门开启器300的内壁320与FOUP门200的外板210接触,门开启器300的销345(图3)配合到外板210中的插240(图2)中。在图示的构造中,如果真空压力经由门保持端口340(图2)并经由门保持真空通道370(图2)施加至门保持真空杯形构件375,则FOUP门200可以保持抵靠门开启器300。Turning now to FIG. 7 , which illustrates a cutaway side view of the
图8图示使用图1-7的发明的FOUP门200和门开启器300的系统800。参考图8,系统800包括衬底载体810(例如FOUP),衬底载体810具有连接至其上的FOUP门200。就是说,门200位于衬底载体810的开口815中,充气式密封件230(图8中未示出)膨胀以将门200保持在那里。Figure 8 illustrates a system 800 using the
系统800还包括装载端820,装载端口820具有连接至其上的门开启器825。门开启器825包括门开启器300(图8中未示出)。第一真空源830可以经由第一真空线路832连接至门开启器300,用于施加第一真空至门开启器300的门保持真空杯形构件375。类似地,第二真空源835可以经由第二真空线路834连接至门开启器300,用于施加第二真空至门200的门密封件230。第一和第二真空源830、835可以供应自单个真空源或多个真空源(例如一个或多个真空泵)。System 800 also includes a load end 820 having a door opener 825 connected thereto. Door opener 825 includes door opener 300 (not shown in FIG. 8 ). A first vacuum source 830 may be connected to the
系统800还可以包括适于控制系统800的控制器840。例如,控制器840可以经由信号电缆耦合至装载端口820,并可以控制机械手和门开启器825的操作。控制器840还可以直接耦合至真空源830、835,并且还适于直接控制真空源830、835,以执行本发明的方法,如参考图9以下所述。System 800 may also include a controller 840 adapted to control system 800 . For example, controller 840 may be coupled to load port 820 via a signal cable and may control operation of manipulator and door opener 825 . The controller 840 may also be directly coupled to the vacuum sources 830, 835 and is also adapted to directly control the vacuum sources 830, 835 to perform the method of the present invention, as described below with reference to FIG. 9 .
现在转至图9,其中针对图8所描述的系统描述了本发明的示例性方法900。在步骤902中,当在FOUP门200上进行打开操作时,FOUP810可以通过机械手(未示出)定位在装载端口820处。在步骤904中,FOUP可以在之后朝向装载端口820的门开启器825移动,使得FOUP门200接触门开启器300(如图所示,例如图5和7)。Turning now to FIG. 9 , an exemplary method 900 of the present invention is depicted for the system depicted in FIG. 8 . In step 902, when an opening operation is performed on the
当FOUP门200移动至与门开启器300接触和/或抵靠时,门开启器300的销345与FOUP门200的外板210上的插口240啮合和/或配合(见图4-5)。FOUP门200继续朝向门开启器300移动,直到外板210与门保持真空杯形构件375接触(图5),并且门密封件真空配件355也移动至门密封件真空配件250中(图6-7)When the
在步骤906中,从第一真空源830经由门保持真空通道370施加真空至门保持端口340并施加至门保持真空杯形构件375。基于第一真空的施加,FOUP门200的外板210被紧密地拉靠门开启器300。In step 906 , vacuum is applied from the first vacuum source 830 via the door holding vacuum channel 370 to the door holding port 340 and to the door holding
然后可以校验第一真空,以确保FOUP门200保持抵靠门开启器300。以此方式,第一真空可以用于允许门开启器300抓在FOUP门200上或将其自身附装至FOUP门200,并且之后,在接下来的门开启和/或关闭操作(以下描述)中将FOUP门200保持和/或紧固在合适的位置,或者以其它方式操纵FOUP门200。The first vacuum can then be verified to ensure that the
一旦FOUP门200被附装至门开启器300并被门开启器300保持,在步骤908中,从第二真空源835经由门密封件启动真空通道380施加第二真空至门密封件启动端口350和门密封件真空配件355。第二真空经由门密封件真空配件250施加至门密封件230。施加第二真空至门密封件真空配件250使得门密封件230放气和/或收缩。之后,在步骤910中,FOUP门200可以从FOUP810的开口815移除,由此打开FOUP200。一旦打开,在步骤912和914中,可以从FOUP810添加和/或移除衬底。Once the
为了关闭FOUP门200,反向进行以上的过程。例如,在示例性实施例中,FOUP门200可以被移动至关闭位置,以在步骤916中关闭FOUP810的前部开口815。在步骤918中,第二真空源835可以断开,以允许门密封件230再次充气或膨胀,由此密封关闭的FOUP门200。(如果需要,未单独示出的空气、氮气或其它气体源可以用于使门密封件230充气)。之后,在步骤920中,第一真空源830可以断开,以从FOUP门200的外板210释放门保持真空杯形构件375。然后,在步骤922中,FOUP810被移动或传输远离门开启器300并远离门开启器825。To close the
在上述的示例性实施例中,设备100被描述为使用两个真空源。第一真空源830可以用于允许门开启器300抓在FOUP门200上或将其自身附装至FOUP门200。在已经通过第一真空源830建立FOUP门200的控制之后,第二真空源835可以使门密封件230放气或收缩以允许打开FOUP门200。在另一个示例性实施例中,可以使用任何数量的真空源。在另一个示例性实施例中,可以使用适于进行以上两个操作的单个真空源。In the exemplary embodiment described above,
尽管以各种示例性实施例描述并图示了本发明,但是这些描述仅是本发明的示例,而不应被理解为本发明的限制。考虑到此,在不脱离仅由以下的权利要求所限定的本发明的范围的情况下,本发明包含任意和所有的修改、变化和/或替代实施例。While the invention has been described and illustrated in various exemplary embodiments, these descriptions are only exemplary of the invention and are not to be construed as limitations of the invention. With this in mind, the present invention encompasses any and all modifications, changes and/or alternative embodiments without departing from the scope of the present invention, which is limited only by the following claims.
Claims (24)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73854205P | 2005-11-21 | 2005-11-21 | |
| US60/738,542 | 2005-11-21 |
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| CN1975985A true CN1975985A (en) | 2007-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA200610150474XA Pending CN1975985A (en) | 2005-11-21 | 2006-10-31 | Apparatus and methods for a substrate carrier having an inflatable seal |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20070116545A1 (en) |
| KR (1) | KR20070053609A (en) |
| CN (1) | CN1975985A (en) |
| TW (1) | TW200725784A (en) |
| WO (1) | WO2007061604A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003231451A1 (en) * | 2002-05-10 | 2003-11-11 | Tokyo Electron Limited | Substrate processing device |
| US7611319B2 (en) | 2004-06-16 | 2009-11-03 | Applied Materials, Inc. | Methods and apparatus for identifying small lot size substrate carriers |
| US10115616B2 (en) | 2013-07-18 | 2018-10-30 | Applied Materials, Inc. | Carrier adapter insert apparatus and carrier adapter insert detection methods |
| KR20220120714A (en) | 2013-08-12 | 2022-08-30 | 어플라이드 머티어리얼스, 인코포레이티드 | Substrate processing systems, apparatus, and methods with factory interface environmental controls |
| US10359743B2 (en) | 2014-11-25 | 2019-07-23 | Applied Materials, Inc. | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls |
Family Cites Families (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4536678A (en) * | 1983-04-01 | 1985-08-20 | Gte Products Corporation | Glass coated metal arc director for compact fluorescent lamp |
| AU578621B2 (en) * | 1983-08-31 | 1988-11-03 | Sony Corporation | Device for exchanging disks |
| US4532970A (en) * | 1983-09-28 | 1985-08-06 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
| US4534389A (en) * | 1984-03-29 | 1985-08-13 | Hewlett-Packard Company | Interlocking door latch for dockable interface for integrated circuit processing |
| US4687542A (en) * | 1985-10-24 | 1987-08-18 | Texas Instruments Incorporated | Vacuum processing system |
| US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
| US4738618A (en) * | 1987-05-14 | 1988-04-19 | Semitherm | Vertical thermal processor |
| US4903168A (en) * | 1988-04-22 | 1990-02-20 | Ag Communication Systems Corporation | Substrate carrier device |
| US5153039A (en) * | 1990-03-20 | 1992-10-06 | Paxon Polymer Company, L.P. | High density polyethylene article with oxygen barrier properties |
| US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
| US5192087A (en) * | 1990-10-02 | 1993-03-09 | Nippon Steel Corporation | Device for supporting a wafer |
| US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
| US5239437A (en) * | 1991-08-12 | 1993-08-24 | Minnesota Mining And Manufacturing Company | Self identifying universal data storage element |
| ES2101070T3 (en) * | 1992-08-04 | 1997-07-01 | Ibm | PORTABLE SEALED PRESSURE CONTAINERS TO STORE A SLICE OF SEMICONDUCTOR IN A PROTECTIVE GASEOUS ENVIRONMENT. |
| DE69205570T2 (en) * | 1992-08-04 | 1996-06-13 | Ibm | Distributor with gas delivery device for handling and storing sealable portable pressurized containers. |
| EP0582019B1 (en) * | 1992-08-04 | 1995-10-18 | International Business Machines Corporation | Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers |
| US5291923A (en) * | 1992-09-24 | 1994-03-08 | Internatinal Business Machines Corporation | Door opening system and method |
| DE69419443T2 (en) * | 1993-03-23 | 2000-04-13 | Matsushita Electric Industrial Co., Ltd. | Combination of cassette adapter and cassette for accommodation in the adapter |
| US5531835A (en) * | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
| EP0735573B1 (en) * | 1995-03-28 | 2004-09-08 | BROOKS Automation GmbH | Loading and unloading station for semiconductor treatment installations |
| KR970018317A (en) * | 1995-09-25 | 1997-04-30 | 김광호 | Wafer carrier |
| JP3796782B2 (en) * | 1995-11-13 | 2006-07-12 | アシスト シンコー株式会社 | Mechanical interface device |
| US5692623A (en) * | 1995-12-20 | 1997-12-02 | Storage Technology Corporation | Storage array for presenting tape media of differing dimensions to a robotic arm at a common datum |
| FR2747112B1 (en) * | 1996-04-03 | 1998-05-07 | Commissariat Energie Atomique | DEVICE FOR TRANSPORTING FLAT OBJECTS AND METHOD FOR TRANSFERRING THESE OBJECTS BETWEEN SAID DEVICE AND A PROCESSING MACHINE |
| US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
| US5926615A (en) * | 1997-07-08 | 1999-07-20 | National Science Council | Temperature compensation method for semiconductor wafers in rapid thermal processor using separated heat conducting rings as susceptors |
| US6576064B2 (en) * | 1997-07-10 | 2003-06-10 | Sandia Corporation | Support apparatus for semiconductor wafer processing |
| US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
| US5837059A (en) * | 1997-07-11 | 1998-11-17 | Brooks Automation, Inc. | Automatic positive pressure seal access door |
| EP1022615A4 (en) * | 1997-08-29 | 2001-01-03 | Nikon Corp | PHOTOMASK BOX, ROUTING DEVICE AND METHOD |
| US6008964A (en) * | 1997-11-14 | 1999-12-28 | Exabyte Corporation | Cartridge library and method of operation thereof |
| EP1049640A4 (en) * | 1997-11-28 | 2008-03-12 | Mattson Tech Inc | SYSTEMS AND METHODS FOR HANDLING WORKPIECES FOR VACUUM PROCESSING AT HIGH FLOW RATE AND LOW CONTAMINATION |
| TW412728B (en) * | 1998-01-21 | 2000-11-21 | Hitachi Ltd | Disk cartridge |
| US6120660A (en) * | 1998-02-11 | 2000-09-19 | Silicon Genesis Corporation | Removable liner design for plasma immersion ion implantation |
| JP3656701B2 (en) * | 1998-03-23 | 2005-06-08 | 東京エレクトロン株式会社 | Processing equipment |
| US6398032B2 (en) * | 1998-05-05 | 2002-06-04 | Asyst Technologies, Inc. | SMIF pod including independently supported wafer cassette |
| US6215241B1 (en) * | 1998-05-29 | 2001-04-10 | Candescent Technologies Corporation | Flat panel display with encapsulated matrix structure |
| FR2779421B1 (en) * | 1998-06-08 | 2000-08-18 | Incam Solutions | ADAPTER DEVICE FOR CONTAINMENT BOXES OF AT LEAST ONE FLAT OBJECT UNDER ULTRA-CLEAN ATMOSPHERE |
| JP3973782B2 (en) * | 1998-11-12 | 2007-09-12 | 富士フイルム株式会社 | Cassette storage case |
| US6347918B1 (en) * | 1999-01-27 | 2002-02-19 | Applied Materials, Inc. | Inflatable slit/gate valve |
| US6520726B1 (en) * | 1999-03-03 | 2003-02-18 | Pri Automation, Inc. | Apparatus and method for using a robot to remove a substrate carrier door |
| US6264467B1 (en) * | 1999-04-14 | 2001-07-24 | Applied Materials, Inc. | Micro grooved support surface for reducing substrate wear and slip formation |
| US6808820B2 (en) * | 2000-09-05 | 2004-10-26 | Advanced Plastics Technology Ltd. | Multilayer containers and preforms having barrier properties utilizing recycled material |
| US6234219B1 (en) * | 1999-05-25 | 2001-05-22 | Micron Technology, Inc. | Liner for use in processing chamber |
| JP3769417B2 (en) * | 1999-06-30 | 2006-04-26 | 株式会社東芝 | Substrate storage container |
| KR100427916B1 (en) * | 1999-09-03 | 2004-04-28 | 미쯔이 죠센 가부시키가이샤 | Wafer holder |
| DE10003639C2 (en) * | 2000-01-28 | 2003-06-18 | Steag Rtp Systems Gmbh | Device for the thermal treatment of substrates |
| US6388383B1 (en) * | 2000-03-31 | 2002-05-14 | Lam Research Corporation | Method of an apparatus for obtaining neutral dissociated gas atoms |
| US6581264B2 (en) * | 2000-05-02 | 2003-06-24 | Shin-Etsu Polymer Co., Ltd. | Transportation container and method for opening and closing lid thereof |
| TW477882B (en) * | 2000-07-03 | 2002-03-01 | Tokyo Electron Ltd | Processing apparatus with sealing mechanism |
| US7147424B2 (en) * | 2000-07-07 | 2006-12-12 | Applied Materials, Inc. | Automatic door opener |
| US6491435B1 (en) * | 2000-07-24 | 2002-12-10 | Moore Epitaxial, Inc. | Linear robot |
| US6389707B1 (en) * | 2000-08-17 | 2002-05-21 | Motorola, Inc. | Wafer container having electrically conductive kinematic coupling groove to detect the presence of the wafer container on a support surface, the support surface, and method |
| KR100410991B1 (en) * | 2001-02-22 | 2003-12-18 | 삼성전자주식회사 | Loadport for semiconductor processing apparatus |
| US7059475B2 (en) * | 2001-10-04 | 2006-06-13 | Entegris, Inc. | System for cushioning wafer in wafer carrier |
| US20030170583A1 (en) * | 2002-03-01 | 2003-09-11 | Hitachi Kokusai Electric Inc. | Heat treatment apparatus and a method for fabricating substrates |
| US7789241B2 (en) * | 2002-03-12 | 2010-09-07 | Seagate Technology Llc | Ergonomic substrate container |
| JP3683552B2 (en) * | 2002-05-28 | 2005-08-17 | 富士通株式会社 | Medium input device |
| SG111069A1 (en) * | 2002-06-18 | 2005-05-30 | Micron Technology Inc | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
| US6955197B2 (en) * | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
| US7258520B2 (en) * | 2002-08-31 | 2007-08-21 | Applied Materials, Inc. | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing |
| JP2004192710A (en) * | 2002-12-10 | 2004-07-08 | Fuji Photo Film Co Ltd | Gripping part structure for recording tape cartridge |
| US20050169730A1 (en) * | 2003-04-30 | 2005-08-04 | Ravinder Aggarwal | Semiconductor processing tool front end interface with sealing capability |
| US7051870B2 (en) * | 2003-11-26 | 2006-05-30 | Applied Materials, Inc. | Suspension track belt |
| US7163393B2 (en) * | 2004-02-02 | 2007-01-16 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor silicon substrate |
| US7611319B2 (en) * | 2004-06-16 | 2009-11-03 | Applied Materials, Inc. | Methods and apparatus for identifying small lot size substrate carriers |
| US20070140822A1 (en) * | 2005-12-16 | 2007-06-21 | Applied Materials, Inc. | Methods and apparatus for opening and closing substrate carriers |
-
2006
- 2006-10-30 US US11/554,505 patent/US20070116545A1/en not_active Abandoned
- 2006-10-30 TW TW095140087A patent/TW200725784A/en unknown
- 2006-10-30 WO PCT/US2006/042953 patent/WO2007061604A2/en not_active Ceased
- 2006-10-31 KR KR1020060106197A patent/KR20070053609A/en not_active Withdrawn
- 2006-10-31 CN CNA200610150474XA patent/CN1975985A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007061604A2 (en) | 2007-05-31 |
| US20070116545A1 (en) | 2007-05-24 |
| TW200725784A (en) | 2007-07-01 |
| KR20070053609A (en) | 2007-05-25 |
| WO2007061604A3 (en) | 2009-05-07 |
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