CN1974109A - RE no-lead welding alloy for wave soldering - Google Patents
RE no-lead welding alloy for wave soldering Download PDFInfo
- Publication number
- CN1974109A CN1974109A CN 200610136882 CN200610136882A CN1974109A CN 1974109 A CN1974109 A CN 1974109A CN 200610136882 CN200610136882 CN 200610136882 CN 200610136882 A CN200610136882 A CN 200610136882A CN 1974109 A CN1974109 A CN 1974109A
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- CN
- China
- Prior art keywords
- lead
- solder
- solder alloy
- soldering
- wave soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 62
- 239000000956 alloy Substances 0.000 title claims abstract description 62
- 238000005476 soldering Methods 0.000 title claims abstract description 34
- 238000003466 welding Methods 0.000 title description 5
- 229910000679 solder Inorganic materials 0.000 claims description 113
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 10
- 229910052727 yttrium Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 238000009736 wetting Methods 0.000 abstract description 12
- 229910020888 Sn-Cu Inorganic materials 0.000 abstract description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 abstract description 4
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 description 12
- 230000003647 oxidation Effects 0.000 description 10
- 238000003892 spreading Methods 0.000 description 10
- 230000007480 spreading Effects 0.000 description 10
- 230000006872 improvement Effects 0.000 description 7
- 150000002910 rare earth metals Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000010301 surface-oxidation reaction Methods 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The RE no-lead soldering alloy for wave soldering is one kind of environment friendly no-lead soldering material for soft soldering. It consists of Cu 0.1-2.5 wt%, P 0.001-1.0 wt%, Ni 0.01-1.5 wt%, RE elements Ce, Er and/or Y 0.001-1 wt%, and Sn for the rest. It is superior to available Sn-Cu no-lead soldering alloy, which has excessive metal oxide in the surface of soldering material pot, poor soldering point bridging, poor wetting and other demerits. It may be processed into soldering rod, soldering wire, soldering ball, etc. for PCB assembling, SMT, etc.
Description
Technical Field
The invention relates to a lead-free solder alloy, in particular to a lead-free solder alloy for wave soldering.
Background
The Sn-Pb alloy has the characteristics of excellent wettability, weldability, conductivity, mechanical property, lower cost and the like, and becomes a typical solder alloy for electronic packaging and assembly in the electronic industry at present. However, Pb and Pb-containing compounds are toxic and harmful substances which are harmful to human health and pollute the environment. At present, the solder lead-free process is established in succession in japan, the european union, and the united states, and weee (water electric Electronic equipment) and rohs (restriction of hazrdous sussurfaces) mandate that Electronic products sold in european markets are considerably lead-free from 2006, month 7 and day 1. Lead-free solder alloy for wave solderingIn gold, the Sn0.7Cu eutectic alloy is one of the first alloys of the lead-free solder for wave soldering because of the advantages of low price, sufficient raw material supply, easy recovery of solder alloy elements, good mechanical property and machinability, higher reliability than the traditional SnPb solder welding spot, and the like. However, in the case of Sn-Cu based solder alloys, the solder alloy is liable to cause a structure segregation phenomenon during melting, and its spreadability is still insufficient. The Sn — Cu based lead-free solder alloy with a high Sn content also has an increased tendency to oxidize during use. In addition, the sn0.7cu lead-free solder alloy has some outstanding problems during wave soldering, such as bridging of solder joints and the tendency of Cu in the printed circuit substrate to dissolve into the molten solder. The former is liable to cause short-circuit of solder joints, and the latter is liable to form Cu as well as change in composition of molten solder6Sn5The intermetallic phase (the phase density is lower than that of the Sn0.7Cu alloy) causes the delamination phenomenon of the molten solder alloy to easily occur, and shortens the service life of the solder. In summary, there is a need for further improvement in at least one area of any of the lead-free solders of the prior art.
Disclosure of Invention
The invention aimsto provide a rare earth lead-free solder alloy for wave soldering, which can solve the problems of easy oxidation of the surface of a solder pot, bridging of welding spots, insufficient wettability and the like of Sn-Cu lead-free solder alloy in the using process.
The technical scheme of the invention is as follows: a rare earth lead-free solder alloy for wave soldering comprises the following components in percentage by weight: 0.1 to 2.5 percent of Cu0.001 to 1.0 percent of P, and the balance of Sn.
As a further improvement of the invention, the lead-free solder alloy is further added with 0.001-1.0 wt% of Ni and 0.001-1.0 wt% of rare earth Ce, Er, Y or a combination thereof.
As a further improvement of the invention, the preferable range of the copper content is 0.5 to 1.0%.
As a further improvement of the invention, the content of P is preferably in the range of 0.005 to 0.5%.
In a further improvement of the present invention, the preferable amount of Ni is 0.01 to 0.5%.
As a further improvement of the invention, the preferable content of the rare earth element is 0.05-0.25%.
As a further improvement of the invention, the lead-free solder alloy can be processed into forms of solder bars, solder rods, solder wires, solder balls, solder paste and the like.
The invention has the beneficial effects that: the rare earth lead-free solder alloy has better brazing performance than Sn0.7Cu lead-free solder alloy. Since the Sn content of the Sn-Cu lead-free solder alloy is as high as 99%, the generation amount of metal oxides on the surface of molten solder of a solder pot can be increased in the using process, and the further oxidation of the solder alloy can be effectively prevented by adding 0.001-1.0% of element P. Inuse, the molten solder alloy in the solder pot undergoes an oxidation reaction ( ， ) A very thin oxide film may form on the surface of the molten solder, which may further hinder the oxidation reaction of the solder alloy in direct contact with the surrounding air. If the amount of the element P added is less than 0.001%, the effect of suppressing oxidation is not significant, but if the content of the element P exceeds 1%, the oxidation phenomenon seriously deteriorates the solderability of the solder alloy. In the invention, the element Ni is further added on the basis of the element P, so that the dissolution of Cu in a printed circuit Cu substrate and a component pin to molten solder alloy can be inhibited, and the Cu in the molten solder is reduced6Sn5The production amount of the solder is reduced, and the service life of the solder is prolonged; on the other hand, Ni can be dissolved in Cu in a solid solution6Sn5In the compound phase, the morphology of the intermetallic compound is changed from needle-like to spherical. The spherical compounds have much less effect on the fluidity of the molten solder, thereby reducing the likelihood of bridge formation. When the Ni content is less than 0.001%, the effect is not remarkable, and when the Ni content exceeds 1.0%, the solder properties are deteriorated and the melting point is increased. In the invention, trace rare earth element Ce or Er or Y or the rare earth element Ce or Er or Y is also addedTo improve the texture of the solder alloy. The rare earth elements can promote nucleation of the solder alloy in the solidification process, and have the functions of modification and homogenization, so that the mechanical property of the solder alloy is improved, and the creep fatigue resistance of the solder alloy is obviously improved. If the content of the rare earth element is less than 0.01%, the effect is not remarkable, and if more than 1% of the rare earth element is added, the performance of the solder alloy is deteriorated and the melting point is increased. The addition of rare earth elements in the invention can also improve the wetting and spreading performance of the solder alloy. Because the rare earth element is a surface active element, the addition is suitableThe rare earth element content can reduce the surface tension of the molten solder alloy and improve the wetting property of the solder alloy. The lead-free solder alloy can be processed into forms of solder bars, solder rods, solder wires, solder balls, solder paste and the like, and can meet the requirements of PCB assembly, SMT surface mounting and the like.
Detailed Description
Example 1:
the lead-free solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P0.001, Ni0.1, Ce0.05 and the balance Sn, and the solder is processed into a solder strip for wave soldering, is used for PCB assembly, has no surface oxidation, good soft solderability, long service life of solder, no bridging of solder points and good wetting and spreading performance.
Example 2:
the lead-free solder alloy of the embodiment comprises the following components in percentage by weight: cu0.5, P0.005, Ni1.0, Er0.1 and the balance Sn, and is processed into a solder rod for wave soldering, which is used for PCB assembly, has no surface oxidation, good soft solderability, long service life of solder, no bridging of solder points and good wetting and spreading performance.
Example 3:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P0.01, Ni0.5, Ce0.001, and Sn in balance, and can be processed into solder wire for PCB assembly, with no oxidation on surface, good solderability, long service life, no bridging of solder joint, and good wetting and spreading properties.
Example 4:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu1.0, P0.1, Ni0.001, Ce, Y0.25 and the balance Sn, and the solder balls are processed for PCB assembly, the surface is free of oxidation, the solder has good soft solderability, the service life of the solder is long, the solder joint is free of bridging, and the wetting spreading performance is good.
Example 5:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.1, P0.5, Ni0.1, Ce, Y0.1 and the balance Sn, and is processed into forms of soldering paste and the like for SMT surface mounting, the surface is free of oxidation, the soldering paste has good soft solderability, long service life, no bridging of welding spots and good wetting and spreading performance.
Example 6:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P1.0, Ni0.01, Ce, Y0.1 and the balance Sn, and the solder paste is processed into a form of solder paste and the like for PCB assembly, has no surface oxidation, good soft solderability, long service life of the solder, no bridging of welding spots and good wetting and spreading performance.
Example 7:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P0.1, Ni0.1, Ce, Y0.1 and the balance Sn, and is processed into a solder strip for wave soldering, which is used for PCBassembly, has no oxidation on the surface, good soft solderability, long service life of solder, no bridging of solder joints and good wetting and spreading performance.
Example 8:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P0.1, Ni0.1, Ce, Y0.1 and the balance Sn, and is processed into a solder strip for wave soldering, which is used for PCB assembly, has no oxidation on the surface, good soft solderability, long service life of solder, no bridging of solder joints and good wetting and spreading performance.
Example 9:
the lead-free soft solder alloy of the embodiment comprises the following components in percentage by weight: cu0.7, P0.1, Ni0.1, Ce, Y1.0 and the balance Sn, and is processed into a solder strip for wave soldering, which is used for PCB assembly, has no oxidation on the surface, good soft solderability, long service life of solder, no bridging of solder joints and good wetting and spreading performance.
The present invention includes, but is not limited to, the above examples, and the scope of the present invention is within the scope of the present invention, as long as the lead-free solder alloy has a Cu content of 0.1 to 2.5 and a P content of 0.001 to 1.0 wt%.
Claims (10)
1. The lead-free solder alloy for wave soldering is characterized by comprising the following components in percentage by weight: 0.1-2.5% of Cu0.001-1% of P, and the balance of Sn.
2. The lead-free solder alloy for wave soldering according to claim 1, wherein the copper content is 0.5 to 1.0%.
3. The lead-free solder alloy for wave soldering according to claim 1 or 2, wherein the content of P is 0.005 to 0.5%.
4. The lead-free solder alloy for wave soldering according to claim 3, wherein Ni is further added in an amount of 0.001 to 1.5% by weight.
5. The lead-free solder alloy for wave soldering according to claim 4, wherein the amount of Ni added is 0.01 to 0.5%.
6. The lead-free solder alloy for wave soldering according to claim 5, wherein the lead-free solder alloy further contains 0.001 to 1.0% by weight of a rare earth element Ce, Er, Y or a combination thereof.
7. The lead-free solder alloy for wave soldering according to claim 4, wherein the lead-free solder alloy further contains 0.001 to 1.0% by weight of a rare earth element Ce, Er, Y or a combination thereof.
8. The lead-free solder alloy for wave soldering according to claim 6, wherein the content of the rare earth element is 0.05 to 0.25%.
9. The lead-free solder alloy for wave soldering according to claim 7, wherein the content of the rare earth element is 0.05 to 0.25%.
10. The lead-free solder alloy for wave soldering according to claim 8 or 9, wherein the lead-free solder alloy is processed into any one of a solder bar, a solder wire, a solder ball and a solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610136882 CN1974109A (en) | 2006-12-18 | 2006-12-18 | RE no-lead welding alloy for wave soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610136882 CN1974109A (en) | 2006-12-18 | 2006-12-18 | RE no-lead welding alloy for wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1974109A true CN1974109A (en) | 2007-06-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610136882 Pending CN1974109A (en) | 2006-12-18 | 2006-12-18 | RE no-lead welding alloy for wave soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1974109A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102642099A (en) * | 2012-05-05 | 2012-08-22 | 大连理工大学 | A kind of Sn-Zn based lead-free solder alloy for aluminum-copper soldering and preparation method thereof |
| CN103008904A (en) * | 2012-11-28 | 2013-04-03 | 一远电子科技有限公司 | SnCuNiGaGeIn serial silver-free and lead-free solder alloy |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
-
2006
- 2006-12-18 CN CN 200610136882 patent/CN1974109A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102642099A (en) * | 2012-05-05 | 2012-08-22 | 大连理工大学 | A kind of Sn-Zn based lead-free solder alloy for aluminum-copper soldering and preparation method thereof |
| CN103008904A (en) * | 2012-11-28 | 2013-04-03 | 一远电子科技有限公司 | SnCuNiGaGeIn serial silver-free and lead-free solder alloy |
| CN103008904B (en) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | SnCuNiGaGeIn serial silver-free and lead-free solder alloy |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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