CN1963644A - Bonding apparatus and system for liquid crystal display device - Google Patents

Abstract

A bonding apparatus for fabricating a liquid crystal display device includes a vacuum chamber for bonding first and second substrates together, an upper stage and a lower stage oppositely arranged in an upper space and a lower space of the vacuum chamber, and a pressure application system coupled to one of the upper and lower stages for applying first and second pressures to different parts of the one of the upper and lower stages.

Description

Bonding equipment and system for manufacturing liquid crystal display devices

This application is a divisional application of the application number 03105412.9 filed in China on February 20, 2003, entitled "Adhesive Equipment and System for Manufacturing Liquid Crystal Display Devices", which application is hereby incorporated as an refer to.

This application claims the benefit of Korean Application Nos. P2002-0012410, P2002-0012439, and P2002-0015081, filed Mar. 8, 2002, Mar. 8, 2002, and Mar. 20, 2002, respectively, which are incorporated herein by reference be combined.

technical field

The invention relates to a bonding device, in particular to a bonding device and system for manufacturing liquid crystal display devices.

Background technique

As demands on display devices increase, various flat display panel devices have been proposed, such as liquid crystal displays (LCDs), plasma display panels (PDPs), ELDs, electroluminescent displays (ELDs), and vacuum fluorescent displays (VFDs). LCD devices are generally used as mobile displays instead of conventional cathode ray tube (CRT) devices because of excellent image quality, light weight, thin appearance, and low power consumption of LCD devices. In addition, mobile LCDs such as those used in notebook computers are developed for televisions to receive and display broadcast signals, and as monitors for computers.

Although various technologies have been developed for LCD devices, efforts to enhance image quality of LCD devices are contradictory. Therefore, in order to use an LCD device as a general-purpose display device, the LCD device must have high image quality, ie, high definition and brightness, and must be large in size while maintaining light weight, thin appearance, and low power consumption.

An LCD device may be manufactured by an LCD injection method in which one substrate on which a sealant pattern is formed is bonded to another substrate under vacuum, and a liquid crystal material is injected thereinto through an injection hole. Alternatively, an LCD device may be manufactured by a liquid crystal dropping method, as disclosed in Japanese Patent Laid-Open Nos. H11-089612 and H11-172903, in which a substrate on which liquid crystal is dropped and another substrate are provided, along Two substrates placed vertically opposite each other are bonded together. Among the two methods, the liquid crystal dropping method has the advantage of distributing different components directly onto the substrate surface.

FIG. 1 is a cross-sectional view of a liquid crystal display bonding apparatus during a loading procedure according to the prior art. In Fig. 1, the bonding apparatus is provided with a frame 10 forming an outline, an upper platform 21, a lower platform 22, a sealant outlet part (not shown), a liquid crystal dripping part 30, an upper chamber part 31, a lower chamber part 32, a chamber Movement system 40 and platform movement system 64 . A sealant outlet part (not shown) and a liquid crystal drip part 30 are attached to the side of the frame 10, and the upper and lower chamber parts 31 and 32 are separated from each other.

The chamber moving system 40 includes a drive motor for selectively moving the lower chamber portion 32 to a position during a bonding procedure, or to a position where sealant release and liquid crystal material dropping are performed.

The platform moving system 64 is provided with a motor, a shaft 61 , a housing 62 , a linear guide 63 , a ball screw 65 and a nut housing 66 . Upper platform 21 is held by shaft 61 attached to housing 66 . Housing 66 is attached to frame 67 with linear guides and motor 64 is attached to brackets 68 on frame 67 for driving nut housing 66 in upward and downward directions. The driving power is transmitted by the ball screw 65 and the nut shell 66 , and the nut shell 66 is connected with the shell 66 through the lateral pressure element 69 .

The process steps for manufacturing LCDs with bonding equipment according to the prior art will now be explained. First, the upper substrate 51 is loaded on the upper platform 21 , and the lower substrate 52 is loaded on the lower platform 22 . Therefore, as shown in FIG. 1 , the lower chamber part N1 having the lower platform 22 is moved to a position for sealant coating and liquid crystal dripping with the chamber moving system 40 .

Next, as shown in FIG. 2, when the sealant coating and the liquid crystal dripping are completed with the sealant outlet portion (not shown) and the liquid crystal dripping portion 30, the lower chamber portion 32 is moved to the chamber moving system 40 for Glue the positions of the upper and lower platforms 51 and 52. Then, the upper and lower chamber units 31 and 32 are aligned with the chamber moving system 40, and the upper and lower chamber parts 31 and 32 are attached together to form a closed chamber. Next, the pressure of the sealed chamber is reduced by a vacuum system to generate a vacuum state in the sealed chamber. Then, the shaft 61 is moved in a downward direction by the motor 64, thereby moving the upper stage 21 to bond the upper and lower substrates 51 and 52 together. The load cell 69 functions as a pressure sensor for controlling the motor 64 with reference to the load signal generated by the load cell 69 . Therefore, the amount of bonding pressure can be controlled to a preset value.

However, the bonding apparatus according to the prior art has the following problems. First, after a cycle of repeated use, a change in position of the system for moving the upper platform 21 in upward and downward directions occurs. Therefore, an error due to the flatness of the upper platform occurs. In addition, since the drive shaft 65 of the platform moving system receives driving force from the drive motor 64 to move the upper platform 21 in a downward direction with precise force, it is difficult to achieve an accurate flat setting of the upper platform 21 before initial processing.

Second, wear at specific portions of the upper platform 21 can result in poor adhesion at specific portions of the upper and lower substrates 51 and 52 . Therefore, when a level difference along the lower surface of the upper platform 21 occurs, the adhesion of the upper and lower substrates 51 and 52 is defective. For example, as shown in FIG. 3, during the bonding of the upper and lower substrates 51 and 52, the dispersion distribution of the liquid crystal material LC is incomplete. Accordingly, a gap S is formed between adjacent sealant portions, thereby preventing uniform dispersion of the liquid crystal material LC. For example, when a portion of the lower substrate 52 on which the liquid crystal material LC is dropped is higher than a portion on which the sealant is applied, even when the portion on which the sealant is applied is not sufficiently pressurized, the load cell 69 (Fig. 1 and 2) are also read as complete adhesion of the upper and lower substrates 51 and 52. Thus, the sealant is not sufficiently compressed, and the sealing part is broken. A broken seal results in improper bonding of the upper and lower substrates 51 and 52, allowing ambient air to infiltrate the device.

Contents of the invention

SUMMARY OF THE INVENTION The present invention relates to a bonding apparatus for use in the manufacture of liquid crystal display devices which substantially obviates one or more of the problems due to limitations and disadvantages of the prior art.

An object of the present invention is to provide a bonding apparatus for manufacturing a liquid crystal display device, which can measure flatness of stages and compensate for differences between portions of stages before bonding substrates.

Another object of the present invention is to provide supplementary pressure applying means in a bonding apparatus for manufacturing a liquid crystal display device, where increased force can be applied to a given portion of bonded substrates.

Additional features and advantages of the invention will be set forth in the description which follows, and may be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other advantages and to comply with the objects of the present invention, as specifically and broadly described, a bonding apparatus for manufacturing a liquid crystal display includes: a vacuum chamber for bonding first and second substrates together; the platform and the lower platform are arranged oppositely in the upper space and the lower space of the vacuum chamber; at least one depression is formed in the working surface of at least one of the upper and lower platforms; and a supplementary pressure application system is provided in the depression protruding from the working surface Inside.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

Description of drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention together with the description and serve to explain the principles of the invention. In the picture:

1 is a cross-sectional view of a liquid crystal display bonding device during a loading procedure according to the prior art;

2 is a cross-sectional view of a liquid crystal display bonding device during a bonding procedure according to the prior art;

3 is an enlarged cross-sectional view of a liquid crystal display bonding apparatus during a bonding procedure according to the prior art;

Figure 4 is a perspective view of an example pressure application system according to the present invention;

5 is a cross-sectional view of an example pressurization system within a vacuum chamber according to the present invention;

Figure 6 is a cross-sectional view of the pressure application system prior to the bonding procedure according to the present invention;

Figure 7 is a cross-sectional view of the pressure application system during the bonding procedure according to the present invention;

Figure 8 is a cross-sectional view of an example supplemental pressurization system in accordance with the present invention;

Figure 9 is a perspective view of a supplemental pressurization system according to the present invention;

Figure 10 is a cross-sectional view of the supplemental pressure application system prior to the bonding procedure in accordance with the present invention;

Figure 11 is a cross-sectional view of the supplemental pressure application system during the bonding procedure in accordance with the present invention;

Figure 12 is a plan view of another supplemental pressurization system according to the present invention;

Fig. 13 is a plan view illustrating another exemplary supplemental pressurization system according to the present invention;

Figure 14 is a plan view of another example supplemental pressurization system according to the present invention;

Figure 15 is a perspective exploded view of another example supplemental pressurization system in accordance with the present invention;

Figure 16 is a cross-sectional view of another supplemental pressure application system prior to the bonding procedure in accordance with the present invention;

Figure 17 is a cross-sectional view of a supplemental pressure application system during a bonding procedure in accordance with the present invention; and

Figure 18 is an enlarged cross-sectional view of an example fixation system according to the present invention.

Detailed ways

Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

Figure 4 is a perspective view of an example pressure application system in accordance with the present invention. In FIG. 4 , a pressure application system may be positioned within vacuum chamber 100 for bonding upper and lower substrates 510 and 520 . The pressurizing system may include upper and lower platforms 210 and 220 positioned in upper and lower spaces of the vacuum chamber 100 . Additionally, the pressurization system may include a primary pressurization system and multiple supplemental pressurization systems. A primary pressure system may be positioned at a central portion of the upper and/or lower platforms 210 and 220 for applying pressure to the upper and lower substrates 510 and 520 during the bonding process.

The main pressing system may include: a main screw shaft 311 for moving the main pressing system in an upward and downward direction; a main drive motor 312 for moving the main screw shaft 311 in an upward and downward direction; A shell 313, coupled with the main screw shaft 311; and a main movable shaft 314, connected with the nut shell 313. A main drive motor 312 may be coupled to the main screw shaft 311 and may be attached to a frame (not shown). The main movable shaft 314 may be connected with the center portion of the top surface of the upper platform 210 , or may be connected with the center portion of the bottom surface of the lower platform 220 . Additionally, the primary pressure application system may include a primary load cell 315 for varying the applied pressure via a primary movable shaft 314 and may be attached to the primary screw shaft 311 .

A supplementary pressure applying system may be attached along the outer peripheral surfaces of the upper and lower platforms 210 and 220 for applying compensatory pressure or additional pressure during the bonding process of the upper and lower substrates 510 and 520 . The supplemental pressurization system may include at least one secondary screw shaft 321, at least one secondary drive motor 322, a nut housing 323 coupled to the secondary screw shaft 321, a secondary movable shaft 324 coupled to the nut housing 323, and at least one secondary pressure gauge Element 325. The sub-screw shaft 321 may be coupled with a sub-drive motor 322, and the sub-drive motor 322 may be attached to a frame (not shown). The auxiliary driving motor 322 may selectively move the screw shaft 321 in upward and downward directions for applying pressure to the upper and lower substrates 510 and 520 during the bonding process. The sub movable shaft 324 may be attached along a peripheral portion of the top surface of the upper platform 210 or may be attached along a peripheral portion of the bottom surface of the lower platform 220 . For example, each secondary movable shaft 324 may be attached to the upper surface of the upper platform 210 at each corner of the upper platform 210 or a middle portion of a long side of the upper platform 210 or a middle portion of a short side of the upper platform 210 . In addition, each sub-movable shaft 324 may be attached to the bottom surface of the lower platform 220 at each corner of the lower platform 220 or a middle portion of a long side of the lower platform 220 or a middle portion of a short side of the lower platform 220 . Accordingly, compensation for position variation of the upper and lower stages 210 and 220 due to uneven wear of the upper and lower stages 210 and 220 may be performed.

The secondary load cell 325 may be coupled with the secondary screw shaft 321 to vary the pressure applied to the secondary screw shaft 321 . The main load cell 315 and the secondary load cell 325 may be connected to one controller (not shown) or to individual controllers (not shown) to control the operation of the bonding apparatus by transmitting feedback/control signals.

Additionally, a flatness measurement system (not shown), such as a position sensor (optical sensor), indicator gauge, and pressure sensitive paper, may be provided for determining deflection or wear occurring at specific positions of the upper and lower platforms 210 and 220 . Various position sensors such as optical sensors may be attached to the inside or outside of the vacuum chamber 100 . Thus, the sensor provides a real-time measurement of the deviation.

In the pressure applying system of the bonding apparatus of the present invention, the driving motors 312 and 322 may be attached to a frame (not shown), or attached to the outer wall of the vacuum chamber 100, wherein the movable shafts 314 and 324 may be connected with the upper Connected with the lower platforms 210 and 220 , they can pass through the top or bottom of the vacuum chamber 100 . In this way, the upper and lower platforms 210 and 220 can receive driving force through the screw shafts 311 and 321 using the nut shells 313 and 323, respectively. Accordingly, the portion of the vacuum chamber 100 coupled with the movable shafts 314 and 324 may be sealed for maintaining the vacuum state of the vacuum chamber 100 during the bonding process.

The bonding apparatus of the present invention may include: a main screw shaft 311 for moving the upper platform 210 in an upward and downward direction; and 4 secondary screw shafts 321 for providing correction for the lack of flatness of the upper platform 210 , and is used to set the flatness reference value of the upper platform 210 before starting the initial stage of the bonding process. Thus, different pressures can be applied during the bonding process when deflection due to prolonged use or wear occurs.

An example process of bonding substrates by the bonding apparatus of the present invention is now explained.

5 is a cross-sectional view of an exemplary pressurization system within a vacuum chamber in accordance with the present invention. In FIG. 5, when the bonding apparatus is driven repeatedly, the upper and lower platforms 210 and 220 may be worn. Therefore, the surfaces of the upper and lower platforms 210 and 220 may not be completely parallel. When it is determined that a particular portion of the upper platform 210 is at least partially worn, the degree of deviation S and the location coordinates of the deviated portion may be stored in a controller (not shown).

Figure 6 is a cross-sectional view of the pressure application system prior to the bonding procedure in accordance with the present invention. In FIG. 6, when the bonding apparatus is activated, the robot arm 300 may be used to load the substrates 510 and 520 onto the upper and lower stages 210 and 220, which are positioned within the vacuum chamber 100, respectively. Then, after the substrates 510 and 520 are loaded on the upper and lower stages 210 and 220, respectively, the vacuum chamber 100 may be sealed.

Figure 7 is a cross-sectional view of the pressure application system during the bonding procedure, according to the present invention. In FIG. 7, the vacuum chamber 100 may be evacuated, and a controller (not shown) may drive the driving motors 312 and 322 to move the screw shafts 311 and 321 connected to the upper platform 210 in a downward direction. During the driving of the screw shafts 311 and 321 by the controller, the degree of deviation S of a particular portion of the upper and lower platforms 210 and 220 may be determined. Then, the compensation value R required by the degree of deviation can be calculated, and the position of the deviation can be determined for compensating the calculated value R when setting a moving distance of the secondary screw shaft 321 downward. The calculation of the compensation value and the compensation method may be performed by an automatic program and an automatic program controller (not shown), or may be performed by manual calculation and personal manual operation.

During the bonding process, load cells 315 and 325 attached to the primary and supplemental pressure application systems may continue to measure the amount of pressure supplied by the screw shaft 311 and the secondary screw shaft 321 . Accordingly, load cells 315 and 325 may provide feedback signals to a controller (not shown) to vary the control signals transmitted to drive motors 312 and 322 . In this way, the load cells 315 and 325, the screw shaft 311, the secondary screw shaft 321, and the drive motors 312 and 322 can compensate for the deviation S (in FIG. 5).

For example, when the special corner portion of the upper platform 210 deviates by about 2mm compared with other parts of the upper platform 210, the controller (not shown) can set the rotation amount of the secondary screw shaft 321 so that the special corner attached to the upper platform 210 The sub-movable shaft 324 on the part can move in the downward direction by a distance corresponding to an offset amount of 2 mm. In addition, the nut case 323 can move in the downward direction according to the amount of rotation, in order to move the sub-movable shaft 324 in the downward direction. Therefore, after the offset is compensated by the supplementary pressing system, the drive motors 312 and 322 may be driven according to the compensation setting, thereby bonding the substrates 510 and 520 together.

Additionally, if the portion of the upper platform 210 that deviates is positioned at a corner portion of the upper platform 210, but at the portion of the upper platform 210 that is positioned between adjacent secondary movable shafts 324, adjacent secondary movable shafts 324 may be compensated. The setting value of the drive motor 322.

8 is a cross-sectional view of an example supplemental pressurization system in accordance with the present invention. In FIG. 8 , the supplementary pressing system may include upper and lower platforms 210 and 220 , wherein the upper platform 210 may include a pressing part 410 , at least one lifting shaft 420 and at least one driving part 430 . Similarly, although not shown, the lower platform 220 may further include a pressing part, at least one lifting shaft, and at least one driving part. The pressing part 410 may be formed as a unit for moving in upward and downward directions by applying a moving force from the elevation shaft 420 . The lifting shaft 420 may pass through the upper platform 210 , and the upper platform 210 may include a recess 211 positioned along a working plane of the upper platform 210 , ie, a bottom surface, for receiving the pressing part 410 . The pressing part 410 may include a material that prevents the upper substrate 510 from being scratched.

Portions of the upper and lower substrates 510 and 520 pressed down by the pressing part 410 may include a sealant material coated thereon, or may include a dummy area formed thereon. The depression 211 formed in the upper platform 210 may correspond to portions of the upper and lower substrates 510 and 520 on which the sealant is coated, or the depression 211 formed in the upper platform 210 may correspond to a dummy area.

The driving part 430 may move in upward and downward directions via the elevation shaft 420 . The drive portion 430 may include a hydraulic or pneumatic cylinder or an electric motor for applying pressure. The total number of driving parts may be determined in order to uniformly transmit the pressure of the driving part 430 to the pressing part 410 .

Figure 9 is a perspective view of a supplemental pressurization system in accordance with the present invention. In FIG. 9, the pressing portion 410 may comprise an array of interconnected beams. Each drive portion 430 may be connected via a raised shaft 420 to the corner of the outermost beam as well as at the intersection of the innermost beam.

Figure 10 is a cross-sectional view of the supplemental pressure application system prior to the bonding procedure, in accordance with the present invention. In FIG. 10, during the bonding process, once the upper and lower substrates 510 and 520 are loaded on the upper and lower platforms 210 and 220, respectively, the vacuum chamber 100 may be evacuated. Then, the main pressing system can move the upper platform 210 in a downward direction, thereby bonding together the upper and lower substrates 510 and 520 held on the upper and lower platforms 210 and 220 , respectively.

Figure 11 is a cross-sectional view of a supplemental pressure application system during a bonding procedure in accordance with the present invention. In Figure 11, the supplemental pressure application system can be activated while the bonding process is in progress. For example, the drive portion 430 may move the lift shaft 420 in a downward direction as the drive portion 430 is controlled by a controller (not shown) that communicates with the controller for the primary drive motor 312 of the primary pressurization system ( not shown) separately. Next, as the lifting shaft 420 moves in a downward direction, the pressing portion 410 positioned in the depression 211 of the upper platform 210 may protrude from the depression 211 (in FIG. 8 ) to a height. Accordingly, the pressing part 410 may protrude from the bottom plane of the upper platform 210 . In this way, a specific portion of the upper substrate 510 opposite to the pressing portion 410 can be provided with a higher pressure than other portions of the upper substrate 510, so that the specific portion of the upper substrate 510 can be more tightly connected to the second substrate 520 than other portions of the upper substrate. bonding. For example, a specific portion of the upper substrate 510 provided with high pressure may include a sealant material and/or a spacer, while other portions of the upper substrate 510 provided with low pressure may include a liquid crystal material.

Once the bonding process is completed, the primary pressing system can move the upper platform 210 in an upward direction, and the driving portion 430 of the supplemental pressing system device can move the raising shaft 420 in an upward direction to accommodate the pressing portion 410 into the recess 211 . In addition, the upper substrate 520 is separated from the upper platform 210 as the release attaches the upper substrate 520 to the upper platform 210 so that the upper and lower substrates 510 and 520 may remain at the lower platform 220 after bonding. Next, the bonded upper and lower substrates 510 and 520 may be removed from the vacuum chamber 100 after returning the vacuum chamber 100 to atmospheric pressure with a robot arm (not shown).

It is not necessary to utilize the example supplementary pressure application system according to the invention only during the bonding process. For example, the supplemental pressure application system according to the invention can be utilized after completion of the bonding of the substrates.

Figure 12 is a plan view of another supplemental pressurization system in accordance with the present invention. In Fig. 12, the supplementary pressing system may include: an upper platform 210 having a plurality of pressing parts 410 for pressurizing each unit area coated with a sealant material; and a plurality of driving parts 430 via a plurality of The lifting shaft 420 is connected with the pressing part 410 . Therefore, each cell area can be individually compensated due to the wear area of the upper platform 210 . The advantage of a supplemental pressure application system is that it is possible to apply pressure only to specific cell areas when additional pressure is necessary.

Fig. 13 illustrates a plan view showing another example supplemental pressurization system according to the present invention. In Fig. 13, the supplementary pressurizing system may include: an upper platform 210 with a plurality of pressing parts 410 to pressurize each group of unit areas coated with sealant material; and a plurality of driving parts 430 through a plurality of The lifting shaft 420 is connected with the pressing part 410 . Thus, each set of individual cell areas can be individually compensated due to the wear area of the upper platform 210 . The advantage of a supplemental pressure application system is that it is possible to apply pressure only to specific groups of cell areas when additional pressure is necessary.

14 is a plan view of another example supplemental pressurization system in accordance with the present invention. In FIG. 14, the supplemental pressurization system can apply pressure to the encapsulant-coated portions of different substrate models of different forms in a manner consistent with the encapsulant portion. For example, by dividing the pressing part 410 into a plurality of blocks and selectively actuating these blocks through the respective driving parts 430 and lifting shafts 420, selection protrusions consistent with different forms of different sealant application parts of different substrate models can be realized. .

15 is a perspective exploded view of another example supplemental compression system in accordance with the present invention. In FIG. 15, the supplemental pressure application system may include a movable pressure application mask 600, which may be used for either the upper platform 210 or the lower platform 220, with raised portions 610 protruding from each portion requiring higher pressure than other portions. Therefore, when the bonding process is completed, the pressure mask 600 may be applied to the upper stage 210 without removing the bonded first and second substrates 510 and 520 . In addition, the pressure mask 600 may be applied to the lower platform 220, wherein the bonded first and second substrates 510 and 520 may be placed on top of the pressure mask 600, again applying repeated pressure to specific portions.

The pressure mask 600 may include systems that do not require coverage of the entire upper platform 210 . In this case, a plurality of coupling grooves (not shown) may be formed along the entire bottom surface of the upper platform 210, that is, the surface opposite to the lower platform 220, and a protrusion having a required height may be inserted into a part that may require heavy application of pressure. In one of the plurality of coupling slots in different.

Figure 16 is a cross-sectional view of another supplemental pressure application system prior to the bonding procedure in accordance with the present invention. In FIG. 16, the pressure mask 600 may be attached to the upper platform 210 with a fixing system 620 for preventing the pressure mask 600 from falling off the upper platform during the bonding process to the first and second substrates 510 and 520. 210. The fixing system 620 may include: a hook 621 formed on the pressing mask 600 or the upper platform 210 ; and a catch 622 formed on the other of the pressing mask 600 and the upper platform 210 . Alternatively, the pressure mask 600 may be fixed to the upper platform 210 with screws 624, as shown in FIG. 18 .

The pressing mask 600 according to the present invention may not be limited to a system that is separated from the upper platform 210 so as to cooperate with the upper platform 210 . For example, the pressure mask 600 may be permanently coupled to the upper platform 210 such that the pressure mask 600 may not be removed during the vacuum bonding process. Accordingly, the pressure mask 600 may include a structure allowing vacuum adsorption or electrostatic adsorption so that the first substrate 510 may be loaded onto the upper stage 210 .

An exemplary process of applying additional pressure to the first and second substrates in a series of steps for encapsulant application to the bonded first and second substrates in accordance with the present invention will now be explained. Additional pressure is applied to the area.

Figure 17 is a cross-sectional view of a supplemental pressure application system during a bonding procedure in accordance with the present invention. In Fig. 17, when pressure is applied to a particular portion, or may require the entire portion of the bonded first and second substrates 510 and 520, a pressure mask 600 according to the present invention may be attached using a fixing system (not shown). Attached to the upper platform 210. When the pressing mask 600 is attached to the upper stage 210, the main driving motor 312 of the main pressing system may be enabled to move the main screw shaft 311 connected to the upper stage 210 in a downward direction. Accordingly, the pressure mask 600 may be pressed down again onto the bonded first and second substrates 510 and 520 . In this way, compared with the special part of the first and second substrates 510 and 520 after bonding, that is, the sealant application part, the protruding part 610 of the pressing mask 600 can protrude downward to tightly bond the special part. part.

Next, when additional pressing is completed, the main driving motor 312 of the main pressing system may be driven again to move the upper stage 210 in an upward direction. Therefore, once the upper platform 210 has moved sufficiently in the upward direction, the bonded first and second substrates 510 and 520 can be unloaded from the vacuum chamber 100 with a robotic arm (not shown), and the bonded pair of substrates 510 and 520 can be bonded. The first and second substrates are loaded onto the vacuum chamber 100 to repeat the bonding process and additional pressure.

The pressing mask 600 according to the present invention can also provide a compensating operation for deviations occurring at specific portions of the upper and lower platforms 210 and 220 . For example, when specific portions of the upper and lower platforms 210 and 220 are worn, the pressure mask 600 may include protrusions 310 positioned at specific portions of the upper and lower platforms 210 and 220, thereby compensating for the upper and lower platforms 210 and 220. The deviation caused by the worn part of the 220.

It will be apparent to those skilled in the art that various modifications and variations can be made in the liquid crystal display bonding apparatus of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims (8)

1, a kind of binding appts that is used to make LCD comprises:

Vacuum chamber is used for first and second base plate bondings together;

Upper mounting plate and lower platform are oppositely disposed in the upper space and lower space of vacuum chamber;

At least one depression is formed in the upper and lower platform in the working surface of at least one; With

Replenish compression system, be located at from the depression of working surface projection.

2, the binding appts that is used to make liquid crystal indicator according to claim 1 is characterized in that, additional compression system is positioned to aim at sealant the area of application of first or second substrate.

3, the binding appts that is used to make liquid crystal indicator according to claim 1 is characterized in that, additional compression system comprises:

Pressing part is used to contact the zone of first or second substrate;

The rising axle is connected by depression and with pressing part; With

Drive part is with the axle coupling connection that raises.

4, the binding appts that is used to make liquid crystal indicator according to claim 3 is characterized in that, the zone of first or second substrate comprises sealant.

5, the binding appts that is used to make liquid crystal indicator according to claim 3 is characterized in that, the zone of first or second substrate comprises virtual region.

6, the binding appts that is used to make liquid crystal indicator according to claim 3 is characterized in that, pressing part comprises the material that prevents to form scuffing on the surface of first or second substrate.

7, the binding appts that is used to make liquid crystal indicator according to claim 3 is characterized in that, drive part comprises at least one in hydraulic cylinders, air pressure cylinder or the motor.

8, the binding appts that is used to make liquid crystal indicator according to claim 1 is characterized in that, additional compression system is attached on the upper mounting plate.

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