CN1958180A - Wafer cleaning device and cleaning method thereof - Google Patents
Wafer cleaning device and cleaning method thereof Download PDFInfo
- Publication number
- CN1958180A CN1958180A CN 200510118759 CN200510118759A CN1958180A CN 1958180 A CN1958180 A CN 1958180A CN 200510118759 CN200510118759 CN 200510118759 CN 200510118759 A CN200510118759 A CN 200510118759A CN 1958180 A CN1958180 A CN 1958180A
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- Prior art keywords
- wafer
- rotating disk
- rotation direction
- motor
- cleaner
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- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 105
- 238000005516 engineering process Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000003749 cleanliness Effects 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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Abstract
The invention discloses a wafer cleaning device and a cleaning method thereof. The wafer cleaning apparatus includes: a turntable for carrying and fixing a chip; a motor coupled to the turntable for rotating the turntable and the wafer; the control unit is electrically connected with the motor and used for controlling the motor to rotate the turntable and the wafer in a non-fixed rotation direction; and a fluid injector arranged above the turntable and used for injecting a fluid to clean the surface of the wafer.
Description
Technical field
The present invention relates to a kind of wafer cleaner and cleaning method thereof, and be particularly related to a kind of wafer cleaner and cleaning method thereof that rotates wafer and clean wafers with the on-fixed rotation direction.
Background technology
Semiconductor process technique is maked rapid progress, and process yield, circuit precision and process efficiency significantly promote.All need to carry out such as technologies such as exposure, development, etching, thin film deposition and ion injections in the semiconductor technology, and wafer (Wafer) surface need keep clean, reduce the influence of particulate technology in the toilet (Clean Room) of certain cleanliness factor.And along with the breakthrough of science and technology, the precision of chip live width constantly promotes, and the little live width that heals can make little chip hold more microelectronic element and circuit.When live width was constantly dwindled, the cleanliness factor in the technology required higher.Therefore in semiconductor technology, not only need provide the toilet of high-cleanness, high, more frequent clean wafers surface is with the cleaning of maintenance wafer surface.
Traditional wafer cleaner (Wafer scrubber) and wafer cleaning method thereof are to carry a wafer with a rotating disk.Rotating disk and wafer are fixed, and rotating disk and wafer can rotate synchronously.Because wafer surface is rough circuit, so particulate is often concealed in the groove of wafer surface.When wafer cleaner starts, rotating disk with one fixedly rotation direction drive rotating disk and wafer rotates synchronously.And wafer cleaner is also used the surface of deionized water clean wafers.After deionized water washes away wafer surface, flow out wafer surface fast, be with particulate to flow out wafer surface simultaneously by action of centrifugal force.
Yet traditional wafer cleaner and wafer cleaning method thereof adopt and fixedly turn to the rotation wafer, make particulate along fixedly rotation direction is mobile, may rest on a side of fixing in the groove of wafer surface.Even increase scavenging period or change rotating speed, also can't remove the particulate that rests in the groove effectively.And then the cleanliness factor of reduction wafer, and the wafer manufacture quality can't effectively be controlled.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of wafer cleaner and cleaning method thereof.It can avoid particulate to stay in the groove so that particulate vibrates back and forth in groove and leaves wafer surface with the design of on-fixed rotation direction rotation wafer and clean wafers.Therefore, improve the wafer cleanliness factor widely, and the wafer manufacture quality can be controlled effectively.
According to purpose of the present invention, a kind of wafer cleaner is proposed.Wafer cleaner comprises a rotating disk, a motor, a control module and a fluid ejector filler.Rotating disk is in order to carrying and fix a wafer.Motor and rotating disk couple, in order to rotate rotating disk and wafer.Control module is electrically connected at motor, rotates rotating disk and wafer in order to the control motor with the on-fixed rotation direction.The fluid ejector filler is arranged at the top of rotating disk, in order to a fluid on the surface of spray clean wafers.
According to another object of the present invention, a kind of wafer cleaning method is proposed.At first, rotate a wafer with the on-fixed rotation direction.Then, the surface of clean wafers.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. elaborate.
Description of drawings
Fig. 1 illustrates the schematic diagram of wafer cleaner according to a preferred embodiment of the invention.
Fig. 2 illustrates wafer cleaner among Fig. 1 and carries out side view in the wafer cleaning process.
Varied curve when Fig. 3 illustrates a polarity of voltage.
Fig. 4 illustrates the flow chart according to wafer cleaning method of the present invention.
Varied curve when Fig. 5 illustrates a polarity of voltage, size.
Description of reference numerals
10: wafer 11: projection
12: groove 13: center
20: rotating disk 22: suction mouth
30: motor 40,401: control module
50: fluid ejector filler 51: fluid
60: storage element 70: bristle
80: particulate 100,101: wafer cleaner
C1: the first rotation direction C2: second rotation direction
L1: rotary middle spindle
The specific embodiment
First embodiment
Please be simultaneously with reference to Fig. 1 and Fig. 2, Fig. 1 illustrates the schematic diagram of wafer cleaner according to a preferred embodiment of the invention.Fig. 2 illustrates wafer cleaner among Fig. 1 and carries out side view in the wafer cleaning process.Wafer cleaner (Wafer Scrubber) 100 comprises a rotating disk 20, a motor 30, a control module 40 and a fluid ejector filler 50.Rotating disk 20 is in order to carrying and fix a wafer (Wafer) 10.Motor 30 couples with rotating disk 20, in order to rotate rotating disk 20 and wafer 10.Control module 40 is electrically connected at motor 30, rotates rotating disk 20 and wafer 10 in order to control motor 30 with the on-fixed rotation direction.Fluid ejector filler 20 is arranged at the top of rotating disk 20, comes the surface of clean wafers 10 in order to ejecting fluid 51.
Please be simultaneously referring to figs. 1 through Fig. 3, varied curve when Fig. 3 illustrates a polarity of voltage.Rotating disk 20 carrying and fixed wafers 10, and wafer 10 can rotate synchronously with rotating disk.Wafer 10 firmly is carried on the rotating disk 20 in every way, and slide plate, mobile situation can not take place in rotary course.And preferably, the center of wafer 10 is overlapped in the rotary middle spindle L1 of rotating disk 20, makes wafer 10 to rotate stably.
In addition, fluid ejector filler 50 is towards the surface of wafer 10 surperficial spray one fluids 51 with clean wafers 10.Wherein, fluid 51 can be deionized water (DeionizedWater, DI Water) or have subacidity or have subalkaline cleaning liquid, is that example explains with a pure deionized water in the present embodiment.Fluid ejector filler 50 can be back and forth on wafer 10 surfaces between center and edge spray fluid 51 with clean wafers 10.And wafer cleaner 100 also comprises a bristle 70, in order to scrub wafer 10 surfaces back and forth between center and edge, makes bristle 70 can scrub the everywhere on wafer 10 surfaces.
Please refer to shown in Figure 4ly, it illustrates the flow chart according to wafer cleaning method of the present invention.At first, begin a wafer cleaning step, in step 401, rotate this wafer with the on-fixed rotation direction.Then, enter step 402, clean the surface of this wafer.At last, finish the wafer cleaning step.Wherein, in the step 401 of present embodiment, rotate this wafer with on-fixed rotation direction and movement at the uniform velocity.
Wherein, rotating disk 20 can come holding chip 10 with a plurality of suction mouths, a mechanical type chuck or a magnetic force chuck.Illustrate as Fig. 2, with a plurality of suction mouth 22 contact wafers 10 bottom surfaces, explain for example in the present embodiment in order to fixed wafer 10.
Please refer to Fig. 2, wafer 10 surfaces have a plurality of projections 11 and groove 12, and particulate 80 is often concealed in groove 12.Driving wafer 10 by rotating disk 20 rotates, and with fluid 51 and bristle 70 clean wafers 10 surfaces, make the particulate of concealing in groove 12 80 to vibrate back and forth, and leave wafer 10 surfaces, can not rest on the side in the groove 12 along the first rotation direction C1 or the second rotation direction C2.
Second embodiment
Disclosed wafer cleaner of the above embodiment of the present invention and cleaning method thereof, it adopts the on-fixed rotation direction to rotate the design of wafer and clean wafers, can avoid particulate to stay in the groove so that particulate vibrates back and forth in groove and leaves wafer surface.Therefore, improve the wafer cleanliness factor widely, and the wafer manufacture quality can be controlled effectively.
In sum, though the present invention with preferred embodiment openly as above, so it is not in order to limit the present invention.Any in the technical field of the invention those of ordinary skill, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when looking being as the criterion that claims define.
Claims (10)
1. wafer cleaner comprises:
One rotating disk is in order to carry and to fix a wafer;
One motor couples with described rotating disk, in order to rotate described rotating disk and described wafer;
One control module is electrically connected at described motor, rotates described rotating disk and described wafer in order to control described motor with the on-fixed rotation direction; And
One fluid ejector filler is arranged at the top of described rotating disk, cleans the surface of described wafer in order to spray one fluid.
2. wafer cleaner as claimed in claim 1, wherein, described control module during according to a polarity of voltage varied curve control described motor with the on-fixed rotation direction and etc. rotational speed.
3. wafer cleaner as claimed in claim 2 also comprises:
One storage element, varied curve when storing described polarity of voltage.
4. wafer cleaner as claimed in claim 1, wherein, described control module is also controlled described motor and is rotated described rotating disk and described wafer with the on-fixed velocity of rotation.
5. wafer cleaner as claimed in claim 4, wherein, described control module during according to a polarity of voltage and voltage swing varied curve control described motor with on-fixed rotation direction and rotational speed such as non-.
6. wafer cleaner as claimed in claim 5 also comprises:
One storage element, varied curve when storing described polarity of voltage and voltage swing.
7. wafer cleaning method comprises:
Rotate a wafer with the on-fixed rotation direction; And
Clean the surface of described wafer.
8. wafer cleaning method as claimed in claim 7, wherein, the step of the described wafer of described rotation also comprises:
With the on-fixed rotation direction and etc. the described wafer of rotational speed.
9. wafer cleaning method as claimed in claim 7, wherein, the step of the described wafer of described rotation also comprises:
With on-fixed rotation direction and the described wafer of rotational speed such as non-.
10. wafer cleaning method as claimed in claim 7, wherein, the step on the surface of the described wafer of described cleaning also comprises:
Clean the surface of described wafer with a fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510118759 CN1958180A (en) | 2005-10-31 | 2005-10-31 | Wafer cleaning device and cleaning method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510118759 CN1958180A (en) | 2005-10-31 | 2005-10-31 | Wafer cleaning device and cleaning method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1958180A true CN1958180A (en) | 2007-05-09 |
Family
ID=38070121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510118759 Pending CN1958180A (en) | 2005-10-31 | 2005-10-31 | Wafer cleaning device and cleaning method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1958180A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102847688A (en) * | 2011-06-30 | 2013-01-02 | 株式会社荏原制作所 | Substrate cleaning method |
-
2005
- 2005-10-31 CN CN 200510118759 patent/CN1958180A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102847688A (en) * | 2011-06-30 | 2013-01-02 | 株式会社荏原制作所 | Substrate cleaning method |
| US20130000671A1 (en) * | 2011-06-30 | 2013-01-03 | Xinming Wang | Substrate cleaning method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070509 |