CN1949034A - Display assembly and plane display using same - Google Patents
Display assembly and plane display using same Download PDFInfo
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- CN1949034A CN1949034A CN 200510113469 CN200510113469A CN1949034A CN 1949034 A CN1949034 A CN 1949034A CN 200510113469 CN200510113469 CN 200510113469 CN 200510113469 A CN200510113469 A CN 200510113469A CN 1949034 A CN1949034 A CN 1949034A
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Abstract
The invention relates to display assembly and panel display. The display assembly includes one the first base plate, one chip, one the second base plate, one polarized light plate, one die grid, and one fixed outline border. The chip is fixed on the surface of the second base plate set on the surface of the first. The polarized light plate is set on the second. The die grid is used to support the first. The fixed outline border is matched with the die grid to fix the display assembly. When the thickness of the second is less than the chip, the thickness sum of the polarized light plate and the second is bigger than the chip; or the horizon height of the die grid highest plane is bigger than the chip. Thus this can prevent chip from damaging by the fixed outline border caused by exogenous action.
Description
Technical field
The invention relates to a kind of display assembly and flat-panel screens.
Background technology
Flat-panel screens (Flat Panel Display) is the communication interface of people and information, flat-panel screens for example has at present: LCD (Liquid Crystal Display, LCD), organic electro-luminescent display (Organic Electro-Luminescent Display, OELD), LCOS liquid crystal projection display (LiquidCrystal On Silicon) etc.Along with the fast development and the progress of flat-panel screens technology, the trend development that the display of a new generation is just being oversimplified towards compactization of product, anti-external impacts, technology, improvement of for example improvement of structure packing technique, substrate technology or the like,
Improvement for the structure packing technique, the structure packing technique of the integrated circuit on the display panel (IC) chip is gradually by chip-circuit board joining technique (Chip On Board, COB) change the automatic coating technique of soft board (TapeAutomated Bonding into, TAB), be evolved into the chip bonding mode that directly integrated circuit (IC) chip is fixed in substrate afterwards again, if substrate be glass then be a chip-glass joining technique (Chip On Glass, COG).
Improvement for the substrate technology, be divided into the two big classes development of glass substrate and non-glass substrate, for example the reduced thickness of the glass substrate that will use at present, use thin sheet glass (Laminate glass) that glass and pliability material lamination form, flexible base plate (Flexible Substrate), super thin metal thin plate (Metal Foil) or the like.Ginseng table one is described as follows:
| Glass substrate | The non-glass substrate | |||||
| Present technology | Grind the thinning technology | Etching transfer technology | Thin sheet glass | Flexible base plate | The super thin metal thin plate | |
| Thickness | 1.1～ 0.5mm | 0.5～0.1mm | 0.3～0.1mm | 0.3～ 0.1mm | 0.3～0.1mm | 0.1～0.05mm |
| Research unit | Corning, Asahi, NHT, NSG or the like | Toshiba, Seiko-Epson or the like | Sony, Seiko-Epson or the like | Schott, Agfa or the like | Sharp, Samsung, Philips or the like | Princeton-University, Lehigh-University or the like |
Table one
As shown in Table 1, the substrate that often uses with present industry is divided into glass substrate and non-glass substrate two big classes, for glass substrate, present operational thickness is 1.1mm～0.5mm, has as for known below the thickness 0.5mm that three kinds of technology are under development the thinning of grinding technology, etching transfer technology, thin sheet glass respectively; Wherein grinding the thinning technology is with the reduced thickness of grinding technique with glass, wherein Xiang Guan research unit has Toshiba to deliver the glass grinding of the 0.7mm glass substrate technology to thickness 0.3mm in SID meeting in 2002, Seiko-Epson in 2003 with glass grinding to thickness 0.1mm; Etching transfer technology is to be transferred to flexible base plate after its reduced thickness being removed fully glass etching to 0.3mm～0.1mm even with glass with etching solution, and wherein Sony has relevant research with Seiko-Epson; The thin sheet glass technology is glass substrate and flexible base plate to be binded form that to make its so easier thinning glass substrate is unlikely to be the thin sheet glass technology that its break wherein Schott, Agfa all have thickness 0.3mm～0.1mm.
With non-glass substrate field, common flexible base plate and super thin metal thin plate two classes are arranged, wherein flexible base plate is generally polyethersulfone (Polyethersulfone, PES) or tygon (polyethylene, PET) its thickness of plastic material is generally 0.3mm～0.1mm, its exploitation is ripe already, but apply in the display industry, have wherein that Sharp delivered in 2000 2 " colored super twist mode LCD, SID meeting Philips in 2002 deliver pliability cholesterol type display, SID meeting Samsung in 2004 delivers 2.2 " plastic cement display; The super thin metal thin plate, this technology has been the technology of the thinnest base material that can develop at present, this technology will apply to the following thickness of thickness 0.1mm, its method is to utilize the high ductibility of metal material metal material to be prepared into the super thin metal thin plate of 0.1mm～0.05mm, the publisher is titanium, SS304 stainless steel, aluminium, iron-nickel alloy etc. at present, and wherein there are Princeton University and Lehigh University in research unit.
By the introduction of table one as can be known, the evolution of display base plate thickness will be by 1.1mm evolution to 0.3mm even 0.05mm, so, following in the utilization of flat-panel screens, as LCD, organic electro-luminescent display, LCOS liquid crystal projection display etc., be the structure of upper and lower base plate involution, if when being fixed in integrated circuit (IC) chip on the gradually thin substrate of thickness (as infrabasal plate), be easy to form the thickness of the thickness of chip greater than base material, so, because of being easy to directly act on the chip under the external force effect, and cause chip to damage.
With reference to figure 1, show the decomposing schematic representation of the display assembly of existing LCD.Should comprise by existing display assembly 1: a fixing housing (Metal Frame) 11; one first Polarizer (Polarizer) 12; one colored filter (Color Filter; CF) 13 substrates; one liquid crystal layer (Liquid crystal Layer) (not shown); one thin film transistor (TFT) (Thin Film Transistor; be called for short TFT) substrate 14; one second Polarizer 15; one fender (Protector Sheet) 16; one first optical sheet (First OpticalSheet) 17; one second optical sheet (Second Optical Sheet) 18; one diffuser plate (Diffuser Sheet) 19; one light guide plate (Light Guide Plate, LGP) 20; one reflecting plate (Reflector Sheet) 21; one framed (Mold Frame), 22 and one light tube assembly (not shown).Wherein utilize the chip bonding mode to be connected with a plurality of chips 23 (a for example IC chip) on this thin film transistor base plate 14, cover crystal glass (Chip On Glass, COG) structure and form one.
With reference to figure 2, show the combination synoptic diagram of the display assembly of existing LCD.In concrete enforcement, in this existing display assembly 1, should be fixedly the relative position of the opening of housing 11 be to form a relief area (Non-Contact Area) 24, and by this fixedly the relative position that covers of the outer rim of housing 11 be to form a contact region (Contact Area) 25.
With reference to figure 3, in the displayed map 2 along the cut-open view of line 3-3.In this existing display assembly 1, this thin film transistor base plate 14 has a upper surface 141 and a lower surface 142, this chip 23 is the upper surfaces 141 that are fixed in this thin film transistor base plate 14, this colored filter 13 is positioned at the top of this thin film transistor base plate 14, disposes with thin film transistor base plate 14 subtends and presss from both sides therebetween and establish this liquid crystal layer.This first Polarizer 12 is attached on this colored filter 13.This second Polarizer 15 is attached at the lower surface 142 of this thin film transistor base plate 14.Structural details such as this fender 16, this first optical sheet 17, this second optical sheet 18, this diffuser plate 19, this light guide plate 20, this reflecting plate 21 are arranged below this second Polarizer 15 in regular turn.
This is framed 22 in order to hold and to support this colored filter 13, this liquid crystal layer, this thin film transistor base plate 14, this second Polarizer 15, this fender 16, this first optical sheet 17, this second optical sheet 18, this diffuser plate 19, this light guide plate 20, this reflecting plate 21 and this light tube assembly.Fixedly the shape of housing 11 is to correspond to this shape of framed 22, and it comprises that rib 111, a side rib 112 reach rib 113 on one.Should be fixedly housing 11 be to be sheathed on this outside framed 22, in order to fix this display assembly 1.
Because the progress of technology, these colored filter 13 substrates are more and more thinner, yet but attenuation thereupon of this chip 23, extremely this chip is as thin as 0.3mm most so far, make these chip 23 upper surfaces be higher than this colored filter 13 upper surfaces, or near this surface, in the case, this chip 23 can be subjected to this fixedly touching of rib 111 and damaging on the housing 11, or near fixing housing and then cause the ability of resisting external force to weaken.
Therefore, be necessary to provide the display assembly and the flat-panel screens of an innovation and rich progressive, addressing the above problem, even can prevent the invention that chip damages when an applicable substrate thickness attenuate is provided.
(3) summary of the invention
Fundamental purpose of the present invention provides an a kind of display assembly and a flat-panel screens, it can prevent integrated circuit on the substrate (IC) chip because of Huai Calipering of external force effect Sun increases integrated circuit (IC) chip opposing external force ability to function on the substrate, can prevent that integrated circuit on the substrate (IC) chip from damaging because of the external force effect when an applicable substrate thickness attenuate is provided simultaneously.
A kind of display assembly according to an aspect of the present invention comprises: one first substrate has a upper surface and a lower surface; One chip is fixed in this first upper surface of base plate; One second substrate, with this first substrate subtend configuration, and the thickness of this second substrate is the thickness less than this chip; And a Polarizer, be located at this second upper surface of base plate, and the thickness sum of the thickness of this Polarizer and this second substrate is the thickness greater than this chip.
Flat-panel screens according to a further aspect of the invention, it uses a display assembly, comprising: one first substrate, a chip, one second substrate, a Polarizer, a framed and fixing housing.This chip is fixed in this first upper surface of base plate, and this second substrate is located at this first upper surface of base plate.This Polarizer is located at this second upper surface of base plate.This is framed to be used to hold and to support this first substrate.Be somebody's turn to do fixedly housing and this framed matching to fix this display assembly.
When the thickness of this second substrate was thickness less than this chip, the thickness sum that makes the thickness of this Polarizer and this second substrate was the thickness greater than this chip, and perhaps making this framed level height on high plane is the level height that is higher than this chip upper surface.Whereby, housing damages because of the external force effect can to prevent to be somebody's turn to do fixedly by this chip.
In addition, when the thickness of the thickness of not limitting this second substrate and this chip, in this fixedly on the housing relatively this chip locate design a recess or an opening, or fixedly housing is designed to a plurality of discontinuous stators.By this, housing damages because of the external force effect can to prevent to be somebody's turn to do fixedly by this chip.
During the applicable substrate thickness attenuate of display assembly of the present invention and flat-panel screens, can prevent that integrated circuit on the substrate (IC) chip from damaging because of the external force effect, promptly increase integrated circuit on the substrate (IC) chip opposing external force ability to function.
(4) description of drawings
Fig. 1 shows the decomposing schematic representation of the display assembly of existing LCD;
Fig. 2 shows the combination synoptic diagram of the display assembly of existing LCD;
In Fig. 3 displayed map 2 along the cut-open view of line 3-3;
Fig. 4 shows the decomposing schematic representation of the display assembly of first embodiment of the invention;
Fig. 5 shows the combination synoptic diagram of the display assembly of first embodiment of the invention;
In Fig. 6 displayed map 5 along the cut-open view of line 6-6;
Fig. 7 shows the synoptic diagram of first Polarizer in the display assembly of first embodiment of the invention;
Fig. 8 shows the cross-sectional schematic of the display assembly of second embodiment of the invention;
Fig. 9 shows the combination synoptic diagram of the display assembly of third embodiment of the invention;
In Figure 10 displayed map 9 along the cut-open view of line 10-10;
Figure 11 shows the combination synoptic diagram of the display assembly of fourth embodiment of the invention;
Figure 12 shows among Figure 11 the cut-open view along line 12-12;
Figure 13 shows the decomposing schematic representation of the display assembly of fifth embodiment of the invention; And
Figure 14 shows among Figure 13 the cut-open view along line 14-14.
Embodiment
With reference to figure 4, it is the decomposing schematic representation that shows the display assembly of first embodiment of the invention.This display assembly 4 is to be included within the flat-panel screens (a for example LCD), and this display assembly 4 comprises: fixedly housing 41, one first Polarizer 42, one second substrate 43 (a for example colored filter), a liquid crystal layer (not shown), one first substrate 44 (a for example thin film transistor base plate), one second Polarizer 45, a fender 46, one first optical sheet 47, one second optical sheet 48, a diffuser plate 49, a light guide plate 50, a reflecting plate 51, framed 52 and a light tube assembly (not shown).Wherein utilize the chip bonding mode to be connected with the structure of a plurality of chips 53 (a for example IC chip) on this first substrate 44.In the present embodiment, this first substrate 44 is a glass substrate (a for example thin film transistor base plate), this second substrate 43 is a glass substrate (a for example colored filter), yet, in other were used, this first substrate 44 and this second substrate 43 comprised: glass substrate, flexible base plate, super thin metal thin plate.Wherein this glass substrate comprises: grind thin substrate, etching transfer substrate, thin sheet glass.
With reference to figure 5, show the combination synoptic diagram of the display assembly of first embodiment of the invention.In this display assembly 4, this fixedly the relative position of the opening of housing 41 be to form a relief area (Non-Contact Area) 54, and be to form a contact region (Contact area) 55 by the relative position that the fixing outer rim of housing 41 covers.
With reference to figure 6, it is along the cut-open view of line 6-6 among Fig. 5.In this display assembly 4, this first substrate 44 has a upper surface 441 and a lower surface 442, and this chip 53 is the upper surfaces 441 that are fixed in this first substrate 44, and this second substrate 43 is positioned at the top of this first substrate 44, and with this first substrate, 44 subtends configuration, folder is established this liquid crystal layer therebetween.This first Polarizer 42 is attached on this second substrate 43.This second Polarizer 45 is attached at the lower surface 442 of this first substrate 44.Structural details such as this fender 46, this first optical sheet 47, this second optical sheet 48, this diffuser plate 49, this light guide plate 50, this reflecting plate 51 are arranged below this second Polarizer 45 in regular turn.
This is framed 52 in order to holding and to support this first Polarizer 42, this second substrate 43, this liquid crystal layer, this first substrate 44, this second Polarizer 45, this fender 46, this first optical sheet 47, this second optical sheet 48, this diffuser plate 49, this light guide plate 50, this reflecting plate 51 and this light tube assembly, and constitutes the housing of this display assembly 4.Fixedly the shape of housing 41 is to correspond to this shape of framed 52, and it comprises that rib 411, a side rib 412 reach rib 413 on one.Should be fixedly housing 41 be sheathed on this outside framed 52, in order to fix this display assembly 4.Wherein should go up rib 411 has a lower surface and contacts this first Polarizer 42.
In the present embodiment, the thickness of this second substrate 43 is the thickness less than this chip 53, but the thickness sum of the thickness of this first Polarizer 42 and this second substrate 43 is the thickness greater than this chip 53; Or the thickness sum of the thickness of the thickness of this liquid crystal layer, this second substrate 43 and this first Polarizer 42 is the thickness greater than this chip 53.Whereby, can make this fixedly keep a space between the last rib 411 of housing 41 and this chip 53, with prevent this fixedly the last rib 411 of housing 41 be pressed onto this chip 53 or cause chip 53 damages because of the external force effect.
With reference to figure 7, it is the synoptic diagram that shows first Polarizer 42 in the display assembly of first embodiment of the invention.This first Polarizer 42 comprises that a release film 421, an adhesive agent 422, Triafol T (TAC) layer 423,424, one polyvinyl alcohol (PVA) (PVA) layer include iodine molecule 425, a diaphragm 426 and a padded coaming 427.This padded coaming 427 is positioned at the periphery of this first Polarizer 42 and forms an external zones 429 and a mesozone 428 that is surrounded by this external zones 429.Therefore the thickness of this external zones 429 is the thickness greater than this mesozone 428, and the thickness of the external zones 429 of this first Polarizer 42 and the thickness sum of this second substrate 43 are the thickness greater than this chip 53.Preferably, the external zones 429 of this first Polarizer 42 is to should contact region 55, and the mesozone 428 of this first Polarizer 42 is to should relief area 54.In addition, in other are used, this first Polarizer 42 can be the thickness of a homogeneous, can increase arbitrary layer the thickness that constitutes in above-mentioned first Polarizer, 42 structures, as the thickness that increases diaphragm 426, increase the thickness of Triafol T (TAC) layer 423,424 or increase the thickness of a padded coaming 427; Perhaps can increase function layer (Functional layer) as anti-reflecting layer, antiglare layer, protective seam, anti-aqueous vapor layer etc. all is: in the random layer of first Polarizer, 42 said structures, reach increase Polarizer thickness simultaneously and make Polarizer that its additional function be arranged as increase one deck or plural layer anti-reflecting layer, one deck or plural antiglare layer, one deck or plural protective seam etc. on Triafol T (TAC) layer 423,424.
With reference to figure 8, it is the cross-sectional schematic that shows the display assembly of second embodiment of the invention.The present embodiment and first embodiment are roughly the same, and wherein components identical is endowed identical label.In the present embodiment, the thickness of this second substrate 43 is the thickness less than this chip 53, but the level height on the highest plane that should framed 56 is the level height that is higher than these chip 53 upper surfaces, and this fixing lower surface of rib 411 on the housing 41 of these framed 56 contacts.Whereby, can make this fixedly keep a space between the last rib 411 of housing 41 and this chip 53, with prevent this fixedly the last rib 411 of housing 41 be pressed onto this chip 53.Preferably, this fixedly on the housing 41 lower surface of rib 411 attach a padded coaming 57.
With reference to figure 9 and Figure 10, it is respectively combination and the cross-sectional schematic that shows the display assembly of third embodiment of the invention.This display assembly 6 is to be included within the flat-panel screens (a for example LCD), and this display assembly 6 comprises: fixedly housing 61, one first Polarizer 62, one second substrate 63 (a for example colored filter), a liquid crystal layer (not shown), one first substrate 64 (a for example thin film transistor base plate), one second Polarizer 65, a fender 66, one first optical sheet 67, one second optical sheet 68, a diffuser plate 69, a light guide plate 70, a reflecting plate 71, framed 72 and a light tube assembly (not shown).Wherein utilize the chip bonding mode to be connected with a plurality of chips 73 (a for example IC chip) on this first substrate 64, and form the chip bonding mode that an integrated circuit (IC) chip is fixed in substrate.In the present embodiment, this first substrate 64 is a glass substrate (a for example thin film transistor base plate), this second substrate 63 is a glass substrate (a for example colored filter), yet, in other were used, this first substrate 64 and this second substrate 63 comprised: glass substrate, flexible base plate, super thin metal thin plate.Wherein this glass substrate comprises: grind thin substrate, etching transfer substrate, thin sheet glass.
This first substrate 64 has a upper surface 641 and a lower surface 642, and this chip 73 is fixed in the upper surface 641 of this first substrate 64, and this second substrate 63 is positioned at the top of this first substrate 64, and folder is established this liquid crystal layer therebetween.This first Polarizer 62 is attached at this second substrate, 63 upper surfaces.This second Polarizer 65 is attached at the lower surface 642 of this first substrate 64.This framed 72 is in order to holding and to support this first Polarizer 62, this second substrate 63, this liquid crystal layer, this first substrate 64, this second Polarizer 65, this fender 66, this first optical sheet 67, this second optical sheet 68, this diffuser plate 69, this light guide plate 70, this reflecting plate 71 and this light tube assembly, and constitutes the housing of this display assembly 6.
Fixedly the shape of housing 61 is to correspond to this shape of framed 72, and it comprises that rib 611, a side rib 612 reach rib 613 on one.Should be fixedly housing 61 be sheathed on this outside framed 72, in order to fix this display assembly 6.Wherein should go up rib 611 and have a lower surface, it has a recess in position of this chip 73 relatively, is pressed onto this chip 73 with the lower surface that prevents rib 611 on this.In the present embodiment, rib 611 be should go up and one first part 611a, one second partly 611b and one the 3rd part 611c comprised, wherein this second part 611b is positioned at the top of this chip 73, and this first part 611a of its two ends difference extension connection downwards and the 3rd part 611c, and forms this recess.Wherein this first partly 611a and the 3rd partly 611c be positioned at same level height, and this first partly 611a can contact these first substrate, 64 upper surfaces 641 or this first Polarizer 62, the three partly the 611c contact this framed 72.This recess can form a protrusion 74 with respect to the upper surface of rib on this 611, as shown in Figure 9.
Be noted that present embodiment is not limited to the situation of the thickness of this second substrate 63 less than the thickness of this chip 73, that is present embodiment is also applicable to the thickness of this second substrate 63 situation more than or equal to the thickness of this chip 73.In addition, this recess also can be formed by following manner, and it is the position attenuation that directly makes rib 611 relative these chips on this, and the upper surface that should go up rib 611 this moment then can not form this protrusion 74.
With reference to Figure 11 and Figure 12, show the combination and the cross-sectional schematic of the display assembly of fourth embodiment of the invention respectively.Present embodiment and the 3rd embodiment are roughly the same, do not exist together only to be this fixedly pattern of housing 61, and wherein components identical is endowed identical label.In the present embodiment, position of rib 611 relative these chips 73 has an opening 75 on this, is pressed onto this chip 73 with the lower surface that prevents rib 611 on this.Preferably, lower surface of rib 611 attaches a fender and covers this and open 75 on this, or these chip 73 upper surfaces attach a fender, to protect this chip 73.Be noted that present embodiment is not limited to the situation of the thickness of this second substrate 63 less than the thickness of this chip 73, that is present embodiment is also applicable to the thickness of this second substrate 63 situation more than or equal to the thickness of this chip 73.
With reference to Figure 13 and 14, it is respectively decomposition and the combination back cross-sectional schematic that shows the display assembly of fifth embodiment of the invention.Present embodiment and the 3rd embodiment are roughly the same, do not exist together only to be this fixedly pattern of housing 81, and wherein components identical is endowed identical label.In the present embodiment, this fixedly housing 81 comprise a plurality of discontinuous stators 811 and plurality of fixed structure 812.These stators 811 are respectively to should first substrate 64 or this corner of framed 72, and in order to fix this display assembly, each stator 811 comprises a rib 811a and a side rib 811b on one at least.This fixed sturcture 812 is in order to these stators 811 are fixed on this on framed 72.In the present embodiment, this fixed sturcture 812 is a plurality of screws, in order to this stator 811 that locks.Yet, be noted that this fixed sturcture 812 also can be a snap-in structure, in order to this stator 811 is fastened on this on framed 72.
In the present embodiment, the last rib 811a of this stator 811 does not extend to the top of this chip 73, therefore, can avoid the lower surface of rib 811a on this to be pressed onto this chip 73.Preferably, these chip 73 upper surfaces attach a fender, to protect this chip 73.Be noted that present embodiment is not limited to the situation of the thickness of this second substrate 63 less than the thickness of this chip 73, that is present embodiment is also applicable to the thickness of this second substrate 63 situation more than or equal to the thickness of this chip 73.
The foregoing description only is explanation principle of the present invention and effect thereof, and unrestricted the present invention, so person skilled in the art scholar carries out the modification of equivalence or change still not taking off spirit of the present invention to the foregoing description.Protection scope of the present invention should be limited by appended the application's claim scope.
Claims (18)
1. flat-panel screens, this flat-panel screens comprises:
One display assembly, this display assembly comprises:
One first substrate has a upper surface and a lower surface;
One chip is fixed in this first upper surface of base plate;
One second substrate, with this first substrate subtend configuration, and the thickness of this second substrate is the thickness less than this chip; And
One Polarizer is located at this second upper surface of base plate, and the thickness sum of the thickness of this Polarizer and this second substrate is the thickness greater than this chip.
2. flat-panel screens as claimed in claim 1, it is characterized in that this Polarizer has an external zones and a mesozone, the thickness of this external zones is the thickness greater than this mesozone, and the thickness sum of the thickness of the external zones of this Polarizer and this second substrate is the thickness greater than this chip.
3. flat-panel screens as claimed in claim 1 is characterized in that this Polarizer has the thickness of a homogeneous.
4. flat-panel screens as claimed in claim 1 is characterized in that also comprising:
One display assembly, this display module comprises:
One is framed, is used to hold and supports this first substrate; And
One fixing housing, itself and this framed matching fixing this first substrate, this second substrate and this Polarizer, this fixedly housing comprise rib at least, rib has a lower surface on this, this lower surface contacts this Polarizer.
5. flat-panel screens, this flat-panel screens comprises:
One display assembly, this display assembly comprises:
One first substrate has a upper surface and a lower surface;
One chip has a upper surface, and this chip is fixed in this first upper surface of base plate;
One second substrate, with this first substrate subtend configuration, and the thickness of this second substrate is the thickness less than this chip; And
One is framed, be used to hold and support this first substrate, and this framed level height on high plane is the level height that is higher than this chip upper surface.
6. flat-panel screens as claimed in claim 5 is characterized in that this display assembly also comprises:
One Polarizer is located at this second upper surface of base plate; And
One fixing housing, itself and this framed matching fixing this first substrate, this second substrate and this Polarizer, this fixedly housing comprise rib at least, rib is positioned at this top framed and this chip on this.
7. flat-panel screens as claimed in claim 6 is characterized in that rib has a lower surface on this, and it contacts this Polarizer.
8. flat-panel screens as claimed in claim 6 is characterized in that rib has a lower surface on this, and it pastes pays a fender.
9. flat-panel screens, this flat-panel screens comprises:
One display assembly, this display assembly comprises:
One first substrate has a upper surface and a lower surface;
One chip is fixed in this first upper surface of base plate;
One second substrate is with this first substrate subtend configuration; And
One fixing housing, it is in order to fixing this first substrate, this second substrate and this Polarizer, this fixedly housing comprise rib at least, rib is positioned at the top of this chip on this, lower surface of rib has a recess on this, this recess is arranged at the position of this chip relatively.
10. flat-panel screens as claimed in claim 9, it is characterized in that rib comprises one first part, one second part and the 3rd partly on this, this second part is positioned at the top of this chip, and this first part and the 3rd of the downward respectively extension connection of its two end partly, and forms this recess.
11. flat-panel screens as claimed in claim 9 is characterized in that also comprising:
One is framed, is positioned at this fixedly within the housing, in order to holding and to support this first substrate, on this 3rd of rib the partly contact this is framed.
12. a flat-panel screens, this flat-panel screens comprises:
One display assembly, this display assembly comprises:
One first substrate has a upper surface and a lower surface;
One chip is fixed in this first upper surface of base plate;
One second substrate is with this first substrate subtend configuration; And
One fixing housing, it is in order to fixing this display assembly, this fixedly housing comprise rib at least, be positioned at the top of this chip, rib has an opening in the position of this chip relatively on this.
13. flat-panel screens as claimed in claim 12 is characterized in that also comprising:
One is framed, is positioned at this fixedly within the housing, and in order to holding and to support this first substrate, this is framed for contact of lower surface of rib on this.
14. flat-panel screens as claimed in claim 12 is characterized in that, rib lower surface pastes and pays a fender on this.
15. flat-panel screens as claimed in claim 12 is characterized in that, this chip upper surface pastes pays a fender.
16. a flat-panel screens, this flat-panel screens comprises:
One display assembly, this display assembly comprises:
One first substrate has a upper surface, a lower surface and four corners;
One chip is fixed in this first upper surface of base plate;
One second substrate is with this first substrate subtend configuration;
One is framed, in order to hold and to support this first substrate;
The plurality of fixed sheet, it is respectively to should the described corner of first substrate, in order to fix this first substrate, this second substrate and this Polarizer; And
The plurality of fixed structure, in order to these stators are fixed on this framed on.
17. flat-panel screens as claimed in claim 16, the thickness that it is characterized in that this second substrate are the thickness less than this chip.
18. flat-panel screens as claimed in claim 16 is characterized in that also comprising a fender, is positioned on this chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510113469 CN1949034A (en) | 2005-10-12 | 2005-10-12 | Display assembly and plane display using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510113469 CN1949034A (en) | 2005-10-12 | 2005-10-12 | Display assembly and plane display using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1949034A true CN1949034A (en) | 2007-04-18 |
Family
ID=38018602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510113469 Pending CN1949034A (en) | 2005-10-12 | 2005-10-12 | Display assembly and plane display using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1949034A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102305974A (en) * | 2011-08-26 | 2012-01-04 | 友达光电(厦门)有限公司 | Display device and manufacturing method thereof |
| WO2017193654A1 (en) * | 2016-05-12 | 2017-11-16 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2005
- 2005-10-12 CN CN 200510113469 patent/CN1949034A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102305974A (en) * | 2011-08-26 | 2012-01-04 | 友达光电(厦门)有限公司 | Display device and manufacturing method thereof |
| CN102305974B (en) * | 2011-08-26 | 2013-11-06 | 友达光电(厦门)有限公司 | Display device and manufacturing method thereof |
| WO2017193654A1 (en) * | 2016-05-12 | 2017-11-16 | 京东方科技集团股份有限公司 | Display panel and display device |
| US10288930B2 (en) | 2016-05-12 | 2019-05-14 | Boe Technology Group Co., Ltd. | Display panel and display device |
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Open date: 20070418 |