CN1949060A - Light source device - Google Patents
Light source device Download PDFInfo
- Publication number
- CN1949060A CN1949060A CN 200610146519 CN200610146519A CN1949060A CN 1949060 A CN1949060 A CN 1949060A CN 200610146519 CN200610146519 CN 200610146519 CN 200610146519 A CN200610146519 A CN 200610146519A CN 1949060 A CN1949060 A CN 1949060A
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- CN
- China
- Prior art keywords
- welding
- supply apparatus
- light
- light supply
- reflection horizon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims description 70
- 238000004020 luminiscence type Methods 0.000 claims description 31
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- 238000002310 reflectometry Methods 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000004634 thermosetting polymer Substances 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 238000001228 spectrum Methods 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract 3
- 230000002265 prevention Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000002156 mixing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004922 lacquer Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 229920004934 Dacron® Polymers 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Planar Illumination Modules (AREA)
Abstract
The invention relates to a light source device for a backlight module. The light source device mainly comprises a circuit substrate, a light-emitting component and an anti-welding reflecting layer. The circuit substrate comprises a metal circuit layer and a contact; the light emitting components are arranged on the circuit substrate at intervals in an array form and are connected with the contact points. One end of the contact is connected with the metal circuit layer, and the other end is connected with the light-emitting component. The anti-welding reflecting layer is formed on the circuit substrate and is arranged on the same side of the circuit substrate with the light-emitting component. The solder mask reflection layer covers the metal circuit layer, but exposes the contact outside the coverage area. By utilizing the structure, the light source device not only has the functions of welding prevention and light reflection, but also has simple production process and low cost.
Description
Technical field
The present invention relates to a kind of light supply apparatus for the backlight module use; Particularly, the present invention relates to a kind of light supply apparatus of backlight module use of feed flow crystal device.
Background technology
Backlight module is widely used in liquid crystal indicator, computer keyboard, mobile phone button, advertisement plate and other needs on the device of light source, to provide this type of device required planar light source.Particularly the market demand of liquid crystal indicator is significantly grown up in recent years, and for the fluid,matching crystal device reaches apparent requirement on function, the employed backlight module design of liquid crystal indicator also becomes more diversified.
Because the electronic product of various use liquid crystal indicator advances towards frivolous target in design one after another, the therefore also strictness thereupon of requirement that the liquid crystal indicator volume is reduced.At the requirement in this design, account for the light source module of ulking thickness in the backlight module, also adjust accordingly in design.Generally speaking, the main flow of light source module comprises the design of using lamp tube light source and the design of using LED source; Wherein again to use light emitting diode can satisfy requirement frivolous on the volume as the design of light source.
Figure 1 shows that the light supply apparatus of tradition use light emitting diode.As shown in Figure 1, light supply apparatus comprises substrate 31 and goes up the contact 35 that is provided with.Be connected with light-emitting diode component 33 on the contact 35.Be the copper cash on the protective substrate 31, be furnished with the anti-welding green lacquer 50 of one deck on the substrate 31.Because the light reflective of anti-welding green lacquer 50 is relatively poor, the light that light-emitting diode component 33 is produced, part can be absorbed by the anti-welding green lacquer 50 of this layer directly or indirectly, and then influence produces the utilization factor of light.
In order to increase the utilization factor that light-emitting diode component 33 emits beam, can on anti-welding green lacquer 50, additionally attach the reflector plate of one deck tool high reflectance traditionally.Complicated geometry designs is often arranged on the reflector plate.Yet the extra design that attaches reflector plate of this kind often causes the inconvenience in the assembling, increases cost and man-hour.In addition, because the required precision height of assembling, and the design complexity on the reflector plate, this kind mode also can make the yield of product descend simultaneously.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of light supply apparatus for the backlight module use, has the function of anti-welding and reflection ray simultaneously.
Another object of the present invention is to provide a kind of, have easy production procedure for backlight module and employed light supply apparatus.
Another object of the present invention is to provide a kind of, can reduce production costs for backlight module and employed light supply apparatus.
Another object of the present invention is to provide a kind of light supply apparatus production method, can simplify whole production procedure.
Another object of the present invention is to provide a kind of light supply apparatus production method, can reduce the whole production time.
Backlight module of the present invention comprises housing, light guide plate and light supply apparatus.Light supply apparatus is then corresponding to the incidence surface setting of light guide plate.Light supply apparatus mainly comprises circuit substrate, luminescence component and anti-welding reflection horizon, comprises metallic circuit layer and contact on the circuit substrate; Luminescence component then is spaced on circuit substrate with the array form, and is connected with contact.Described anti-welding reflection horizon is formed on this circuit substrate, and is provided with this luminescence component homonymy, and this anti-welding reflection horizon is distributed between this contact.Contact one end connects the metallic circuit layer, and the other end then is connected in luminescence component.Luminescence component is preferably electroluminescence component such as light emitting diode.
Anti-welding reflection horizon is covered on the metallic circuit layer, but contact is exposed to the open air outside its coverage.The reflecting spectrum wavelength coverage in anti-welding reflection horizon between 380 nanometers (nm) between 780 nanometers.By the setting in anti-welding reflection horizon, light supply apparatus can improve the utilization factor that luminescence component produces light, so that whole preferable light extraction efficiency to be provided.In order to improve the reflectivity in anti-welding reflection horizon, the preferable upper surface that comprises white or the preferable reflectivity color of other tool in anti-welding reflection horizon.
Anti-welding reflection horizon is mainly mixed by anti-welding material and reflecting material.Anti-welding material is preferable to be revolved optical activity material or other processing by thermoset resin, sense and solidifies material and formed, for example material such as epoxy resin and esters of acrylic acid.Reflecting material is for changing and the mixed reflective character of anti-welding material, and the mode of its change comprises the color that changes anti-welding reflection horizon, mixing back or makes the reflective particle that has higher proportion in its potpourri.Reflecting material is preferable to comprise following material: barium sulphate, titanium dioxide, boron nitride or aluminium oxide.
The manufacture method of light supply apparatus comprises that at first preparation has the circuit substrate of contact; Then form anti-welding reflection horizon on circuit substrate, and expose contact to the open air.This anti-welding reflection horizon forms step and comprises the following steps: to mix anti-welding material and reflecting material to form anti-welding reflecting material; Distribute anti-welding reflecting material on circuit substrate; And contain the anti-welding reflecting material of cure profile on circuit substrate to form anti-welding reflection horizon.The method then is included in the step that luminescence component is set on the contact at last.
Adopt above-mentioned light supply apparatus of the present invention,, not only have the anti-welding effect of holding circuit substrate, but also have the light reflection function that increases the luminous utilization factor of luminescence component, thereby improved the utilization factor of luminescence component generation light by the setting in anti-welding reflection horizon.And, because the present invention directly realizes anti-welding and reflection function simultaneously by anti-welding reflection horizon, to compare in the anti-welding green structure of pasting reflector plate of painting with existing, structure is more simple, has reduced assembly cost, has improved the yield of product.
Description of drawings
Fig. 1 comprises the light supply apparatus sectional view of light emitting diode for tradition;
Fig. 2 is an embodiment assembly exploded view of backlight module of the present invention;
Fig. 3 is an embodiment synoptic diagram of light supply apparatus of the present invention;
Fig. 4 is a sectional view embodiment illustrated in fig. 3;
Fig. 5 is an embodiment process flow diagram of light supply apparatus manufacture method of the present invention;
Fig. 6 is another embodiment process flow diagram of light supply apparatus manufacture method.
Main figure number explanation:
110 housings, 130 light guide plate
300 light supply apparatuses, 310 circuit substrates
311 metallic circuit layers, 313 contact
330 luminescence components, 350 anti-welding reflection horizon
Embodiment
The invention provides a kind of light supply apparatus for the backlight module use.The present invention more comprises the manufacture method of this light supply apparatus.With preferred embodiment, this backlight module feed flow crystal device uses.Yet in different embodiment, this backlight module also can need the device of planar light source to use for computer keyboard, mobile phone button, billboard and other.Furthermore, the present invention more comprises the liquid crystal indicator that uses this backlight module.In preferred embodiment, liquid crystal indicator of the present invention comprises a color liquid crystal display arrangement.Yet in different embodiment, liquid crystal indicator of the present invention also can comprise monochromatic liquid crystal indicator.Liquid crystal indicator is then made a general reference the display device of using liquid crystal panel, comprises the LCDs etc. of LCD monitor, mobile phone and digital camera of LCD TV, personal computer and the laptop computer of family expenses.
As shown in Figure 2, backlight module of the present invention comprises housing 110, light guide plate 130 and light supply apparatus 300.Housing 110 is arranged at the outside of light guide plate 130, and light supply apparatus 300 is then corresponding to the incidence surface setting of light guide plate 130.In this embodiment, light supply apparatus 300 is arranged at the side of light guide plate 130; Yet in different embodiment, light supply apparatus 300 also can be arranged at the below of light guide plate 130, to form the backlight module of straight-down negative.Light supply apparatus 300 is injected the light that produces in the light guide plate 130, and 130 of light guide plate are passed through inner structure with equalizing light rays, and is more backlight to produce.
Light supply apparatus 300 mainly comprises circuit substrate 310, luminescence component 330 and anti-welding reflection horizon 350.Circuit substrate 310 can comprise the circuit board of printed circuit board (PCB), flexible circuit board and other type.As shown in Figures 3 and 4, comprise metallic circuit layer 311 and contact 313 on the circuit substrate 310.In preferred embodiment, the metallic circuit layer is formed on the circuit substrate 310 through etch process by Copper Foil; Yet in different embodiment, metallic circuit layer 311 also can attach or technological process such as printing is formed on the circuit substrate 310.With regard to the aspect of metallic circuit layer 311 design, circuit substrate 310 comprises that single sided board, dual platen and doubling plate etc. are multi-form.In addition, circuit substrate 310 is preferable made by bakelite, half glass mat, full glass mat, the not imperial plate of iron, polyimide (polyimide), dacron (PET) or other similar material.
In this preferred embodiment, as shown in Figure 3, luminescence component 330 is spaced on circuit substrate 310 with the array form.Luminescence component 330 mainly comprises electroluminescence component such as light emitting diode.Contact 313 is for connecting luminescence component 330 usefulness.As shown in Figure 4, contact 313 1 ends connect metallic circuit layer 311, and the other end then is connected in luminescence component 330.Luminescence component 330 is preferable, and (SurfaceMounted Technology SMT) is connected on the contact 313 with the surface stuck encapsulation technology; Yet in different embodiment, luminescence component 330 also can through hole technology (Through Hole Technology THT) is connected with contact 313.
In preferred embodiment, the reflecting spectrum wavelength coverage in anti-welding reflection horizon 350 between 380 nanometers (nm) between 780 nanometers; In other words, the 350 pairs of wavelength in anti-welding reflection horizon have the effect of high reflectance between the light in this interval.In addition, when incident ray is between 380 nanometer to 780 nanometers, the preferable reflectivity that provides more than 95% in anti-welding reflection horizon.By the setting in anti-welding reflection horizon 350, light supply apparatus 300 can improve the utilization factor that luminescence component 330 produces light, so that whole preferable light extraction efficiency to be provided.In order to improve the reflectivity in anti-welding reflection horizon 350, the anti-welding reflection horizon 350 preferable upper surfaces that comprise white or the preferable reflectivity color of other tool.
In preferred embodiment, anti-welding reflection horizon 350 is mixed by anti-welding material and reflecting material.Anti-welding material is preferable to be formed by thermoset resin, for example material such as epoxy resin; Yet in different embodiment, anti-welding material also can solidify material and formed by revolve optical activity material or other processing as the sense of esters of acrylic acid.Reflecting material is for changing and the mixed reflective character of anti-welding material, and the mode of its change comprises the color that changes anti-welding reflection horizon 350, mixing back or makes the reflective particle that has higher proportion in its potpourri.Reflecting material is preferable to comprise following material: barium sulphate, titanium dioxide, boron nitride or aluminium oxide.In addition, reflecting material also can be mixed by above-mentioned material.By mixing the characteristic of anti-welding material and reflecting material, anti-welding reflection horizon 350 is had the anti-welding effect of holding circuit substrate 310 simultaneously, also can have the light reflection function that increases luminescence component 330 luminous utilization factors.
Figure 5 shows that the manufacture method embodiment process flow diagram of light supply apparatus 300 of the present invention.As shown in Figure 5, the manufacture method of light supply apparatus 300 at first comprises step 1510, and preparation circuit substrate 310 makes on the circuit substrate 310 and contact 313 is arranged.In preferred embodiment, circuit substrate 310 can be made by bakelite, half glass mat, full glass mat, the not imperial plate of iron, polyimide (polyimide), dacron (PET) or other similar material.In addition, preferable being included in of this step carried out the etched technological process of copper foil circuit on the circuit substrate 310, with formation metallic circuit layer 311, and forms contact 313.Yet in different embodiment, also can attach or technology such as printing forms metallic circuit layer 311 on circuit substrate 310.
As shown in Figure 6, this anti-welding reflection horizon 350 forms step and further comprises step 1531, mixes anti-welding material and reflecting material to form anti-welding reflecting material.In preferred embodiment, this step need be adjusted the ratio of anti-welding material and reflecting material, and the anti-welding reflecting material that makes mixing has reflectivity greater than 95% to wavelength between 380 nanometers (nm) to the visible light between 780 nanometers.Anti-welding material is preferable to be formed by thermoset resin, for example material such as epoxy resin; Yet in different embodiment, anti-welding material also can solidify material and formed by revolve optical activity material or other processing as the sense of esters of acrylic acid.Reflecting material is for changing and the mixed reflective character of anti-welding material, and the mode of its change comprises the color that changes anti-welding reflection horizon 350, mixing back or makes the reflective particle that has higher proportion in its potpourri.Reflecting material is preferable to comprise following material: barium sulphate, titanium dioxide, boron nitride or aluminium oxide.In addition, reflecting material also can be mixed by above-mentioned material.By mixing the characteristic of anti-welding material and reflecting material, anti-welding reflecting material is had the anti-welding effect of holding circuit substrate 310 simultaneously, also can have the light reflection function that increases luminescence component 330 luminous utilization factors.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that the embodiment that has disclosed does not limit the scope of the invention.On the contrary, being included in the spirit of claim and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (11)
1, a kind of light supply apparatus is characterized in that, this device comprises:
One circuit substrate comprises at least one contact;
At least one luminescence component is electrically connected this contact; And
One anti-welding reflection horizon is formed on this circuit substrate, and is provided with this luminescence component homonymy, and this anti-welding reflection horizon is distributed between this contact.
2, light supply apparatus as claimed in claim 1 is characterized in that, the reflecting spectrum wavelength coverage in described anti-welding reflection horizon is between 380 nanometer to 780 nanometers.
3, light supply apparatus as claimed in claim 2 is characterized in that, for the visible light of wavelength between 380 nanometer to 780 nanometers, this anti-welding reflection horizon has the reflectivity more than 95%.
4, light supply apparatus as claimed in claim 1 is characterized in that, described luminescence component is arranged with the array form.
5, light supply apparatus as claimed in claim 1 is characterized in that, described luminescence component comprises light emitting diode.
6, light supply apparatus as claimed in claim 1 is characterized in that, described anti-welding reflection horizon is mixed and made into by anti-welding material and reflecting material.
7, light supply apparatus as claimed in claim 6 is characterized in that, described anti-welding material comprises thermoset resin.
8, light supply apparatus as claimed in claim 7 is characterized in that, described thermoset resin comprises epoxy resin.
9, light supply apparatus as claimed in claim 6 is characterized in that, described anti-welding material comprises esters of acrylic acid.
10, light supply apparatus as claimed in claim 6 is characterized in that, described reflecting material comprises following material one of them or its combination: barium sulphate, titanium dioxide, boron nitride and aluminium oxide.
11, light supply apparatus as claimed in claim 1 is characterized in that, described anti-welding reflection horizon has a white upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610146519 CN1949060A (en) | 2006-11-15 | 2006-11-15 | Light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610146519 CN1949060A (en) | 2006-11-15 | 2006-11-15 | Light source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1949060A true CN1949060A (en) | 2007-04-18 |
Family
ID=38018619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610146519 Pending CN1949060A (en) | 2006-11-15 | 2006-11-15 | Light source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1949060A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7677769B2 (en) | 2007-11-20 | 2010-03-16 | Chi Mei Communication Systems, Inc. | Displaying assembly for portable electronic device |
| CN103035812A (en) * | 2011-09-29 | 2013-04-10 | 新世纪光电股份有限公司 | Substrate |
| CN103155189A (en) * | 2010-10-12 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Highly reflective coating on LED submount |
| CN103155721A (en) * | 2010-10-06 | 2013-06-12 | 日本发条株式会社 | Metal base circuit board |
| CN105301840A (en) * | 2015-11-18 | 2016-02-03 | 武汉华星光电技术有限公司 | Backlight module and liquid crystal display device |
-
2006
- 2006-11-15 CN CN 200610146519 patent/CN1949060A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7677769B2 (en) | 2007-11-20 | 2010-03-16 | Chi Mei Communication Systems, Inc. | Displaying assembly for portable electronic device |
| CN103155721A (en) * | 2010-10-06 | 2013-06-12 | 日本发条株式会社 | Metal base circuit board |
| CN103155721B (en) * | 2010-10-06 | 2016-01-20 | 日本发条株式会社 | metal base circuit board |
| CN103155189A (en) * | 2010-10-12 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Highly reflective coating on LED submount |
| CN103155189B (en) * | 2010-10-12 | 2017-02-22 | 皇家飞利浦电子股份有限公司 | Highly reflective coating on LED submount |
| CN103035812A (en) * | 2011-09-29 | 2013-04-10 | 新世纪光电股份有限公司 | Substrate |
| CN103035812B (en) * | 2011-09-29 | 2015-11-18 | 新世纪光电股份有限公司 | substrate |
| CN105301840A (en) * | 2015-11-18 | 2016-02-03 | 武汉华星光电技术有限公司 | Backlight module and liquid crystal display device |
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