CN1940818A - Heat dissipation module and electronic device for removing dust on heat dissipation fins by means of vibration - Google Patents
Heat dissipation module and electronic device for removing dust on heat dissipation fins by means of vibration Download PDFInfo
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- CN1940818A CN1940818A CN 200510108705 CN200510108705A CN1940818A CN 1940818 A CN1940818 A CN 1940818A CN 200510108705 CN200510108705 CN 200510108705 CN 200510108705 A CN200510108705 A CN 200510108705A CN 1940818 A CN1940818 A CN 1940818A
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Abstract
Description
技术领域technical field
本发明涉及一种散热模块,特别是涉及一种利用振动方式清除散热鳍片上灰尘的散热模块。The invention relates to a heat dissipation module, in particular to a heat dissipation module which uses vibration to remove dust on heat dissipation fins.
背景技术Background technique
在现代化的今日信息社会,计算机系统已经成为多数人不可或缺的信息工具之一,而不论是桌上型个人计算机、笔记型个人计算机或是服务器等,其运作时脉越来越高,应用层面也日益广泛。现今笔记型计算机是朝着轻薄的趋势来发展,然而随着科技的进步,笔记型计算机的功能愈来愈强大,因此在执行各种功能时所伴随产生的热量也相对地增加,这种由笔记型计算机的内部组件产生的热量若无法有效率的排除,则会影响到笔记型计算机的功能运作和运算速度。In today's modern information society, the computer system has become one of the indispensable information tools for most people. Regardless of whether it is a desktop personal computer, a notebook personal computer or a server, etc., its operating clock is getting higher and higher, and the application The levels are also getting wider. Today's notebook computers are developing towards thinner and lighter. However, with the advancement of technology, the functions of notebook computers are becoming more and more powerful, so the heat generated when performing various functions is also relatively increased. This is caused by If the heat generated by the internal components of the notebook computer cannot be efficiently removed, it will affect the functional operation and computing speed of the notebook computer.
请参阅图1,图1为现有一笔记型计算机10的一散热模块12的示意图。笔记型计算机10包括一壳体14,用来包覆内部组件,,壳体14的旁侧则设有一出风口18,用来排出流经散热模块12的热空气至壳体14之外。笔记型计算机10的散热模块12包括一风扇20,安装于一入风口(未显示于图中)的上方,以及一散热槽(heat sink)22,安装于风扇20与壳体14的出风口18之间,散热槽22上设有多个散热鳍片24,用以增加散热的表面积。散热模块12的风扇20可经由入风口吸入外界的空气,并将所吸入的空气排至散热槽22的多个散热鳍片24,最后再由出风口18排出,以将笔记型计算机10内部组件所产生的热量通过热对流的方式排出于壳体14之外。Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a
请参阅图2,图2为现有笔记型计算机10使用一滤网26阻隔风扇20经由入风口所吸入的灰尘吹入散热鳍片24的示意图。由于灰尘常会经由入风口被风扇20所吸入,再被吹送至散热鳍片24,故散热鳍片24上常会堆积许多灰尘,尤其以风扇20与散热鳍片24交界处附近灰尘堆积的情况较为严重。如图1与图2所示,因此,其中一种解决方式是于风扇20与散热鳍片24交界处设置滤网26,以阻隔风扇20经由入风口所吸入的灰尘吹入散热鳍片24。但笔记型计算机10在长时间使用下来,滤网26上也会堆积大量灰尘,若使用者仍未清除卡在滤网26的灰尘,则会造成热风不易由出风口18排出,如此一来笔记型计算机10内部组件所产生的热量便不易散出,会造成笔记型计算机10系统温度迅速升高,而影响到笔记型计算机10运作的稳定性,因而可能产生所谓热当机的状况,甚至降低笔记型计算机10内部组件的使用寿命。然而一般使用者并不知如何拆卸笔记型计算机10的壳体14以将滤网26拆除以清洁灰尘,或者是根本就忘记有滤网26的设置,因此现有利用滤网26过滤灰尘的方式实不为一人性化的设计。Please refer to FIG. 2 . FIG. 2 is a schematic diagram of a
发明内容Contents of the invention
本发明的目的在于提供一种利用振动方式清除散热鳍片上灰尘的散热模块,以解决笔记型计算机的内部组件产生的热量若无法有效率的排除,则会影响到笔记型计算机的功能运作和运算速度或可能产生所谓热死机的状况。The purpose of the present invention is to provide a heat dissipation module that uses vibration to remove dust on the heat dissipation fins, so as to solve the problem that if the heat generated by the internal components of the notebook computer cannot be efficiently removed, it will affect the functional operation and calculation of the notebook computer speed or may produce a condition known as a thermal freeze.
本发明的的目的是这样实现的,即提供一种利用振动方式清除散热鳍片上灰尘的散热模块,其包括有一底座,多个散热鳍片,安装在该底座上,以及一振动装置,安装在该底座上,用来使该多个散热鳍片振动,用以清除该多个散热鳍片上的灰尘。The purpose of the present invention is achieved by providing a heat dissipation module that utilizes vibration to remove dust on heat dissipation fins, which includes a base, a plurality of heat dissipation fins mounted on the base, and a vibrating device mounted on The base is used to vibrate the plurality of cooling fins to remove dust on the plurality of cooling fins.
本发明还提供一种利用振动方式清除散热鳍片上灰尘的电子装置,其包括有一壳体,以及一散热模块,安装于该壳体内,该散热模块包括有一底座,多个散热鳍片,安装于该底座上;以及一振动器,安装于该底座上,用来使该多个散热鳍片振动,用以清除该复数个散热鳍片上的灰尘。The present invention also provides an electronic device that uses vibration to remove dust on heat dissipation fins. It includes a housing and a heat dissipation module installed in the housing. The heat dissipation module includes a base and a plurality of heat dissipation fins installed in the housing. on the base; and a vibrator installed on the base for vibrating the plurality of cooling fins to remove dust on the plurality of cooling fins.
本发明的精神在于利用振动散热鳍片,而使得灰尘不易着尘于散热鳍片,如此一来便不会影响到散热鳍片的散热功效,且不会影响空气对流的顺畅,或可抖落已经堆积于散热鳍片上的灰尘,而可更容易地由出风口排出阻塞于散热鳍片上的灰尘,如此一来电子装置内部组件所产生的热量便能顺利散出,而保持电子装置运作的稳定性,且可延长电子装置内部组件的使用寿命。The spirit of the present invention is to utilize vibrating heat dissipation fins to prevent dust from accumulating on the heat dissipation fins, so that the heat dissipation effect of the heat dissipation fins will not be affected, and the smooth air convection will not be affected, or it may be shaken off Dust that has accumulated on the heat dissipation fins can be more easily discharged from the air outlet to block the dust on the heat dissipation fins, so that the heat generated by the internal components of the electronic device can be dissipated smoothly, and the stability of the operation of the electronic device can be maintained reliability and prolong the life of the internal components of the electronic device.
附图说明Description of drawings
图1为现有笔记型计算机的散热模块的示意图;FIG. 1 is a schematic diagram of a heat dissipation module of an existing notebook computer;
图2为现有笔记型计算机使用滤网阻隔风扇经由入风口所吸入的灰尘吹入散热鳍片的示意图;FIG. 2 is a schematic diagram of an existing notebook computer using a filter to block the dust inhaled by the fan through the air inlet from blowing into the cooling fins;
图3为本发明电子装置的内部组件示意图;3 is a schematic diagram of the internal components of the electronic device of the present invention;
图4为本发明电子装置的功能方块示意图。FIG. 4 is a schematic functional block diagram of the electronic device of the present invention.
具体实施方式Detailed ways
请参阅图3,图3为本发明一电子装置50的内部组件示意图,电子装置50包括一壳体52,用来包覆内部组件,,壳体52的旁侧则设有一出风口56,电子装置50另包括一散热模块58,其包括一风扇60,安装于一入风口(未显示于图中)的上方,以及一底座62,其安装于风扇60与壳体52的出风口56之间。底座62可为一散热槽(heat sink),底座62上设有多个散热鳍片64,用以增加散热的表面积。散热模块58的风扇60可经由入风口吸入外界的空气,并将所吸入的空气输出至底座62上的多个散热鳍片64,最后再由出风口56排出,以将电子装置50内部组件所产生的热量通过热对流的方式排出于壳体52之外。电子装置50另包括一振动模块66,其安装于底座62上,用来使多个散热鳍片64振动,用以清除多个散热鳍片64上的灰尘,振动模块66可通过导线与电子装置50的主机板相连接(未显示于图中),以接受信号与电源。请参阅图6,图6为本发明电子装置50的功能方块示意图,电子装置50另包括一逻辑单元70,以及一振动模块66,其中,该振动模块66更包括一马达控制接口74及一振动器72。逻辑单元70安装于壳体52内,用来控制振动模块66的动作。振动器72,其可为一振动马达或为其它可产生振动的组件,而马达控制接口74电连接于逻辑单元70以及振动器72,用来依据逻辑单元70传来的控制信号控制振动器72的动作。Please refer to FIG. 3 . FIG. 3 is a schematic view of the internal components of an
逻辑单元70可通过输入控制信号至振动模块66的马达控制接口74,以启动或关闭振动器72,以及通过控制输入振动模块66的电流来调整振动模块66的振动器72的振动幅度。举例来说,可在电子装置50开机后,逻辑单元70控制散热模块58的风扇60启动的同时,逻辑单元70输出一控制信号至振动模块66的马达控制接口74,以启动振动器72进行旋转的振动,而由于振动器72与散热鳍片64都安装在底座62上,故振动器72产生旋转的振动可通过底座62传至散热鳍片64,使得散热鳍片64也产生相对应的振动,如此一来不仅可有效地避免灰尘着尘于散热鳍片64,并可将先前堆积于散热鳍片64上的灰尘以振动的方式抖落,再通过风扇60将所吸入的空气排至底座62上的多个散热鳍片64,以将散热鳍片64上的灰尘由出风口56排出。因此,振动器72的作用在于带动散热鳍片64产生相对应的振动,而使得灰尘不易着尘于散热鳍片64,如此一来便不会影响到散热鳍片64的散热功效,且不会影响空气对流的顺畅,以及可以振动的方式抖落已经堆积于散热鳍片64上的灰尘,而可更容易地由出风口54排出阻塞于散热鳍片64上的灰尘。此外,本发明可利用一程控振动器72的振动,例如使用者可在电子装置50上执行该程序,之后逻辑单元70便可通过马达控制接口74控制振动器72产生振动;或可在电子装置50上增设一开关,使用者可利用切换该开关以执行该程序,进行控制振动器72产生振动。The
相比较于现有的电子装置,本发明的电子装置由于并未使用滤网作为过滤灰尘的机制,故可省去拆卸机壳以清理滤网的不便,且可改善使用者忘记清理滤网的缺点,而由于本发明的电子装置利用振动散热鳍片,而使得灰尘不易着尘于散热鳍片,如此一来便不会影响到散热鳍片的散热功效,且不会影响空气对流的顺畅,或可抖落已经堆积于散热鳍片上的灰尘,而可更容易地由出风口排出阻塞于散热鳍片上的灰尘,如此一来电子装置内部组件所产生的热量便能顺利散出,而保持电子装置运作的稳定性,且可延长电子装置内部组件的使用寿命。Compared with the existing electronic device, the electronic device of the present invention does not use a filter as a mechanism for filtering dust, so the inconvenience of disassembling the casing to clean the filter can be omitted, and the problem of users forgetting to clean the filter can be improved. The disadvantage is that the electronic device of the present invention utilizes vibrating fins to prevent dust from accumulating on the fins, so that the cooling effect of the fins will not be affected, and the smoothness of air convection will not be affected. Or it can shake off the dust that has accumulated on the heat dissipation fins, and the dust blocked on the heat dissipation fins can be more easily discharged from the air outlet, so that the heat generated by the internal components of the electronic device can be dissipated smoothly, while keeping the electronics The stability of the operation of the device can extend the service life of the internal components of the electronic device.
以上所述仅为本发明的较佳实施例,凡依本发明权利要求所做的均等变化与修饰,都应属本发明专利的涵盖范围。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the patent of the present invention.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005101087056A CN100495293C (en) | 2005-09-28 | 2005-09-28 | Radiating module and electronic device for removing dust on radiating fins in vibration mode |
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| CNB2005101087056A CN100495293C (en) | 2005-09-28 | 2005-09-28 | Radiating module and electronic device for removing dust on radiating fins in vibration mode |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494966B (en) * | 2008-01-22 | 2011-06-15 | 纬创资通股份有限公司 | Heat dissipation module with dust removal mechanism and combination of electronic device and heat dissipation module |
| CN103157626A (en) * | 2011-12-13 | 2013-06-19 | 技嘉科技股份有限公司 | Dust removal device |
| CN102045983B (en) * | 2009-10-09 | 2013-07-24 | 马小康 | Radiating module and manufacturing method thereof |
| CN103433247A (en) * | 2013-08-07 | 2013-12-11 | 华为数字技术(苏州)有限公司 | Dust removing method and dust removing device of electronic equipment and electronic equipment |
| CN108446002A (en) * | 2018-05-17 | 2018-08-24 | 郑州天点科技有限公司 | A kind of notebook vibrating dust removing radiator |
| CN106020077B (en) * | 2016-05-07 | 2018-11-16 | 徐帆 | A kind of intelligent monitoring device using remote monitoring modules |
| CN109843027A (en) * | 2019-04-01 | 2019-06-04 | 楼伟强 | Radiating device for electronic equipment |
| CN111831089A (en) * | 2020-07-20 | 2020-10-27 | 蒙秀花 | Heat dissipation and dust removal structure for notebook computer |
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| CN87204145U (en) * | 1987-04-20 | 1988-05-04 | 湖南有色金属研究所 | Heat tube exchanger with vibrating dust removing function |
| CN1093860A (en) * | 1993-04-16 | 1994-10-19 | 北京市西城区新开通用试验厂 | A kind of cooling device for spray chamber |
| JP2000244161A (en) * | 1999-02-24 | 2000-09-08 | Sony Corp | Cooling device and electronic equipment |
| JP2004253873A (en) * | 2003-02-18 | 2004-09-09 | Olympus Corp | Electronic imaging unit |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494966B (en) * | 2008-01-22 | 2011-06-15 | 纬创资通股份有限公司 | Heat dissipation module with dust removal mechanism and combination of electronic device and heat dissipation module |
| CN102045983B (en) * | 2009-10-09 | 2013-07-24 | 马小康 | Radiating module and manufacturing method thereof |
| CN103157626A (en) * | 2011-12-13 | 2013-06-19 | 技嘉科技股份有限公司 | Dust removal device |
| CN103157626B (en) * | 2011-12-13 | 2016-10-05 | 技嘉科技股份有限公司 | Dust removal device |
| CN103433247A (en) * | 2013-08-07 | 2013-12-11 | 华为数字技术(苏州)有限公司 | Dust removing method and dust removing device of electronic equipment and electronic equipment |
| CN103433247B (en) * | 2013-08-07 | 2016-03-30 | 华为数字技术(苏州)有限公司 | Electronic equipment dust collection method, device and electronic equipment |
| CN106020077B (en) * | 2016-05-07 | 2018-11-16 | 徐帆 | A kind of intelligent monitoring device using remote monitoring modules |
| CN108446002A (en) * | 2018-05-17 | 2018-08-24 | 郑州天点科技有限公司 | A kind of notebook vibrating dust removing radiator |
| CN109843027A (en) * | 2019-04-01 | 2019-06-04 | 楼伟强 | Radiating device for electronic equipment |
| CN111831089A (en) * | 2020-07-20 | 2020-10-27 | 蒙秀花 | Heat dissipation and dust removal structure for notebook computer |
| CN111831089B (en) * | 2020-07-20 | 2022-04-12 | 深圳市森创达科技有限公司 | Heat dissipation and dust removal structure for notebook computer |
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