CN1815764A - Baseboard structure of luminous diode module - Google Patents

Abstract

The invention relates to a substrate structure of a light emitting diode module, which has a high heat dissipation metal substrate, and a multi-layer isolation layer is formed on the upper surface of the metal substrate, which is directly arranged according to the path of the required conductive circuit, and at the same time A conductive layer is arranged on the surface of the isolation layer, so that the conductive layer can form a layout of a conductive circuit on the surface of the metal substrate, and the heat dissipation conducting material package at the bottom of the light-emitting diode is directly attached to the surface of the metal substrate, and the package The two external electrode pins provided outside the body are respectively electrically connected to the corresponding conductive layers to form the light emitting diode module.

Description

Substrate Structure of LED Module

technical field

The present invention relates to a substrate structure, in particular to a substrate structure for a light emitting diode module.

Background technique

Light Emitting Diode (Light Emitting Diode) is mainly a light-emitting component composed of III-V or II-IV compound semiconductor materials and component structure changes. Because the principle and structure of light-emitting diodes are different from those of traditional tungsten filament bulbs, compared with tungsten filament bulbs, they tend to consume electricity, emit a lot of heat, are not resistant to collisions, and have short service life. Long, low driving voltage, fast response and good shock resistance, it is widely used in portable communication devices, traffic signs, outdoor display panels, automotive light sources and lighting and other electronic products.

However, with the development of manufacturing technology, LEDs have gradually enhanced their luminous efficiency through continuous research and development, so that their luminous brightness can be further improved, so as to expand and adapt to the needs of various products. In other words, in order to increase the brightness of LEDs, in addition to solving their external packaging problems, it is also necessary to design the LEDs to have higher electrical power and stronger operating current, in order to produce LEDs with high brightness. However, when the electric power and operating current are increased, the light-emitting diode will relatively generate more heat, which will easily affect the performance of the light-emitting diode due to overheating, and even cause damage to the light-emitting diode.

Please refer to FIG. 1 and FIG. 2 respectively, which are schematic cross-sectional views of the substrate structure of the conventional LED module. In order to solve the heat generated during the operation of the light emitting diode, the existing light emitting diode module 1' is mainly arranged on a metal substrate 10', so that the light emitting diode 20' can provide heat dissipation through the metal substrate 10', wherein the metal The substrate 10' is made of a metal material with better thermal conductivity; in addition, the surface of the metal substrate 10' is mainly laminated with an insulating layer 12' and a conductive layer 14' one by one. On the surface of the metal substrate 10', and the surface of the metal substrate 10' must be subjected to polarization treatment before the lamination process; after the insulating layer 12' and the conductive layer 14' are laminated on the surface of the metal substrate 10', it needs to be passed through The way of etching processing is to remove the unnecessary conductive layer 14' on the surface of the metal substrate 10', so that the underlying insulating layer 12' is exposed, and only the required conductive layer 14' is retained as a conductive line; finally, In order to install the light-emitting diode 20', it is necessary to process and remove the above-mentioned exposed insulating layer 12', so as to expose the surface of the metal substrate 10' under the insulating layer 12', so that the packaging part 22 at the bottom of the light-emitting diode 20' 'is attached and arranged on the surface of the metal substrate 10', and the external electrode pin 24' of the LED 20' is arranged on the conductive layer 14' by soldering. As shown in FIG. 2, part of the heat generated by the light-emitting diode 20' is directly dissipated into the air through the external electrode pin 24', and the other part of the heat can be conducted to the metal substrate 10' through heat conduction. Dissipate into the air to solve the situation that the working temperature of the LED 20' is too high.

However, since the existing substrate structure is mainly to laminate the entire insulating layer and conductive layer on the surface of the metal substrate through lamination processing, this method of lamination processing is often difficult during the processing process. It needs to consume a lot of electricity, and the surface of the metal substrate needs to be polarized in advance, which also consumes a lot of electricity; moreover, the unnecessary conductive layer and insulating layer on the surface of the metal substrate must be processed by etching or other methods. However, in fact, in the actual production process, it can be found that the conductive layer that needs to be retained as a conductive line on the metal substrate, and the insulating layer that acts as an insulation between the conductive layer and the metal substrate only account for the metal substrate. The total surface area is only about 30%, and the remaining about 70% of the conductive layer and the insulating layer are all removed by processing; Energy and the waste of its required manufacturing raw materials make it difficult to reduce the manufacturing cost, and the etching processing technology used in its manufacturing process needs to be processed with a chemical solvent with strong acidity or strong alkalinity. The process is easy to produce toxic gas and toxic waste liquid with strong acidity or strong alkalinity, which will cause environmental pollution, which does not conform to the concept of environmental protection.

Contents of the invention

The main purpose of the present invention is to provide a substrate structure of a light-emitting diode module, which can simplify its manufacturing process, greatly reduce the large amount of energy consumed in the manufacturing process, and reduce environmental pollution.

Another object of the present invention is to provide a substrate structure of a light emitting diode module, the construction of the conductive circuit on the surface of the metal substrate can be simplified, and the waste of manufacturing materials can be reduced, so as to reduce the production cost.

Another object of the present invention is to provide a substrate structure of a light emitting diode module, which can facilitate the construction of a multi-layer conductive circuit structure on the surface of the metal substrate, so as to expand the range of products it can be applied to.

In order to achieve the above-mentioned purpose, the substrate structure of the light-emitting diode module of the present invention has a metal substrate with high heat dissipation, and a multi-layer isolation layer is formed on the upper surface of the metal substrate, which is directly arranged according to the path of the required conductive circuit, and at the same time A conductive layer is arranged on the surface of the isolation layer, so that the conductive layer can form a layout of a conductive circuit on the surface of the metal substrate, and the heat dissipation conducting material package at the bottom of the light-emitting diode is directly attached to the surface of the metal substrate, and the package The two external electrode pins provided on the outside of the body are respectively electrically connected to the corresponding conductive layers to form the light emitting diode module; since the metal substrate is directly coated, the isolation layer is constructed on the surface of the metal substrate, And the position and area to be coated on the metal surface of the isolation layer can be processed according to the relative position and shape of the conductive circuit that needs to be laid out on the surface of the metal substrate. At the same time, the conductive layer can also be screen printed or coated. The method is directly constructed on the surface of the isolation layer, which not only simplifies the previous processing process, but also greatly improves the disadvantages of power consumption, consumable materials, and environmental pollution caused by removing unnecessary insulating layers or conductive layers through etching processes in the past.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a substrate structure of a conventional LED module.

FIG. 2 is a schematic cross-sectional view of a conventional LED module.

FIG. 3 is a schematic diagram of the substrate structure of the LED module according to the first embodiment of the present invention.

FIG. 4 is a schematic structural diagram of a light emitting diode module according to a first embodiment of the present invention.

FIG. 5 is a schematic diagram of the substrate structure of the LED module according to the second embodiment of the present invention.

Explanation of reference signs

1’ LED Module

10’ metal substrate

12' insulation

14' conductive layer

20’ LED

22' package body

24’ external electrode pins

1 LED module

10 metal substrate

12 isolation layer

12a Upper isolation layer

122 through holes

14 Conductive layer

14a upper conductive layer

142 Conductor

20 LEDs

22 packages

24 external electrode pins

Detailed ways

In order to enable examiners to further understand the structure, features and purpose of the present invention, the accompanying drawings and preferred specific embodiments are now described in detail as follows:

Please refer to FIG. 3 , which is a schematic diagram of the substrate structure of the LED module according to the first embodiment of the present invention. As shown in the figure, the substrate structure of the light-emitting diode module 1 of the present invention has a metal substrate 10 with high heat dissipation, and a multi-layer isolation layer 12 is formed on the upper surface of the metal substrate 10. The isolation layer is directly based on the required The path of the conductive circuit is arranged, and a conductive layer 14 is provided on the surface of the isolation layer 12 , so that the conductive layer 14 can form a layout of a conductive circuit on the surface of the metal substrate 10 .

Please refer to FIG. 4 , which is a schematic structural diagram of the LED module according to the first embodiment of the present invention. The light emitting diode module 1 is provided with more than one light emitting diode 20, the light emitting diode 20 is attached to the surface of the bare metal substrate 10, the light emitting diode 20 belongs to the surface mount type light emitting diode, and the light emitting diode 20 is provided at the bottom The thermal conductor package 22 is directly attached to the surface of the metal substrate 10 , and the two external electrode pins 24 provided outside the package 22 are respectively electrically connected to the corresponding conductive layer 14 to form the LED module 1 .

The metal substrate 10 described in the present invention is made of metal plates such as copper or aluminum alloy plates with good thermal conductivity, and the isolation layer 12 is mainly coated directly on the surface of the metal substrate 10 with a high temperature resistant resin. As for the composition, the high temperature resistant resin is made of polyimide (Polyimide) or BT resin (a polymer of Bismaleimidem and Triagzine Resin monomer) / epoxy resin (EPOXY) mixed glue and other materials are better choices, or in the function The insulating layer 12 can also be composed of 50% to 90% resin and 10% to 50% graphite powder, or the composition is 50% to 90%. The mixture of resin and 10%-50% boron nitride makes the isolation layer 12 have the effect of circuit insulation between the metal substrate 10 and the conductive layer 14 .

In addition, the conductive layer 14 is made of metal powder or conductive carbon fiber mixed with materials with good conductivity and low impedance, such as gold, silver, copper, iron, tin, magnesium, aluminum, or particulate metal elements such as their oxides. and oxides, and are constructed and arranged on the surface of the isolation layer 12 by screen printing or directly by coating; of course, the conductive layer 14 can also be powdered conductive silver, copper paste or conductive silver with equivalent properties in terms of function. , copper glue instead, and is arranged on the surface of the isolation layer 12 by direct coating.

At the same time, in order to prevent the thinner isolation layer 12 between the conductive layer 14 and the metal substrate 10, so that the formed isolation distance is too close to produce a tip discharge effect, the area of the conductive layer 14 of the present invention needs to be smaller than the corresponding isolation. The area of the layer 12 is such that there is a distance d between the edge of the conductive layer 14 disposed on the surface of the isolation layer 12 and the edge of the isolation layer 12 .

As can be seen from the foregoing description, the metal substrate 10 of the present invention can directly construct the isolation layer 12 on the surface of the metal substrate 10 by coating, and the required coating path position and area of the isolation layer 12 on the surface of the metal substrate 10, It can be processed according to the relative position and shape of the conductive circuit on the surface of the metal substrate 10. At the same time, the conductive layer 14 can also be directly constructed on the surface of the isolation layer 12 by screen printing or coating, which not only simplifies the previous processing process, which greatly improves the shortcomings of power consumption, consumables and environmental pollution caused by the need to remove unnecessary isolation layers 12 or conductive layers 14 through etching processes in the past; The isolation layer 12 and the conductive layer 14 expose a relatively large area on the surface of the metal substrate 10 , so that the heat dissipation area on the surface of the metal substrate 10 can be increased and the heat dissipation efficiency can be improved.

Please refer to FIG. 5 , which is a schematic diagram of the substrate structure of the LED module according to the second embodiment of the present invention. As shown in the figure, since the isolation layer 12 and the conductive layer 4 of the metal substrate 10 of the present invention can be directly constructed by coating or screen printing technology, etc., in the second embodiment, the upper surface of the metal substrate 10 is constructed in addition to A multi-layer isolation layer 12, and a conductive layer 14 is arranged on the surface of the isolation layer 12. In addition, an upper layer isolation layer 12a can be constructed on the surface of the conductive layer 14, and an upper layer of conductive layer 12a can be constructed on the surface of the upper layer isolation layer 12a. Layer 14a, wherein the upper isolation layer 12a between the upper conductive layer 14a and the conductive layer 14 is formed with a plurality of through holes 122, and a conductor 142 is arranged in the through holes 122, so that the two conductive layers 14 and 14a Electrical paths can be formed between them, and thus multi-layer circuits can be constructed on the surface of the metal substrate 10 by alternately stacking multiple isolation layers and conductive layers, so as to enhance the functionality of the metal substrate 10 .

What is described above is only a preferred embodiment of the present invention, and is not used to limit the scope of the present invention. All equivalent changes made according to the shape, structure, characteristics and spirit described in the claims of the present invention All modifications and modifications should be included in the scope of protection required by the claims of the present invention.

Claims (13)

1. A substrate structure of a light emitting diode module, comprising: A metal substrate is made of a metal plate with high heat dissipation; A multi-layer isolation layer is arranged on the upper surface of the metal substrate, and is arranged directly according to the path of the required conductive line, and the isolation layer has the effect of insulating electricity; and The multi-layer conductive layer is arranged on the surface of the isolation layer, so as to form a layout of a conductive circuit on the metal substrate. 2. The substrate structure of an LED module according to claim 1, wherein the metal substrate is a copper or aluminum alloy plate. 3. The substrate structure of a light emitting diode module according to claim 1, wherein the isolation layer is formed by directly coating a high temperature resistant resin on the surface of the metal substrate. 4. The substrate structure of an LED module according to claim 3, wherein the high temperature resistant resin is polyimide or BT resin/epoxy resin (EPOXY) mixed colloidal material. 5. The substrate structure of a light emitting diode module according to claim 1, wherein the isolation layer is formed by directly coating a heat-conducting adhesive. 6. The substrate structure of an LED module according to claim 1, wherein the isolation layer is composed of 50%-90% resin and 10%-50% graphite powder. 7. The substrate structure of a light-emitting diode module according to claim 1, wherein the isolation layer is composed of a mixture of 50%-90% resin and 10%-50% boron nitride. 8. The substrate structure of an LED module according to claim 1, wherein the conductive layer is disposed on the surface of the isolation layer by one of screen printing and coating. 9. The substrate structure of a light emitting diode module according to claim 1, wherein the conductive layer is formed by mixing materials with good conductivity and low impedance such as metal powder or conductive carbon fiber. 10. The substrate structure of a light-emitting diode module according to claim 1, wherein the conductive layer is made of particulate metal elements such as gold, silver, copper, iron, tin, magnesium, aluminum or their oxides, and It is composed of one of metal elements such as oxides. 11. The substrate structure of a light-emitting diode module according to claim 1, wherein the conductive layer is directly coated on one of powdered conductive silver, copper paste, conductive silver, and copper glue. The surface of the isolation layer is formed. 12. The substrate structure of a light-emitting diode module according to claim 1, wherein the area of the conductive layer is smaller than the area of the corresponding isolation layer, so that the edge of the conductive layer on the surface of the isolation layer is separated from the isolation layer. There is a space between the layer edges. 13. The substrate structure of a light-emitting diode module according to claim 1, wherein an upper isolation layer is constructed on the surface of the conductive layer, and an upper conductive layer is further constructed on the surface of the upper isolation layer, through which the upper layer The conductive layer, the upper isolation layer, the conductive layer, and the isolation layer are stacked alternately and sequentially on the surface of the metal substrate, so as to construct a multilayer circuit on the upper surface of the metal substrate.

Images