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CN1809935B - Fabrication of polymer devices - Google Patents

Fabrication of polymer devices Download PDF

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CN1809935B
CN1809935B CN200480017086.3A CN200480017086A CN1809935B CN 1809935 B CN1809935 B CN 1809935B CN 200480017086 A CN200480017086 A CN 200480017086A CN 1809935 B CN1809935 B CN 1809935B
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polymer
crosslinking
layer
solution
oligomer
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CN1809935A (en
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L-L·蔡
P·K-H·何
R·H·弗兰德
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Cambridge Enterprise Ltd
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Abstract

A method of forming a polymer device includes the steps of: (i) depositing on a substrate a solution comprising a polymer or oligomer and a crosslinking moiety, to form a layer; (ii) curing the layer formed in step (i) under conditions to form an insoluble crosslinked polymer; characterised in that the crosslinking moiety is present in step (i) in an amount in the range of from 0.05 to 5 mol % based on the total number of moles of repeat units of the polymer or oligomer and the crosslinking moiety in the solution.

Description

聚合物器件的制备 Fabrication of polymer devices

本发明涉及制造聚合物器件的方法。尤其,本发明涉及在制造聚合物器件的方法中沉积聚合物层的方法。本发明还涉及由本发明的方法制备的器件,如电子和光电子器件。The present invention relates to methods of fabricating polymeric devices. In particular, the present invention relates to methods of depositing polymer layers in methods of fabricating polymer devices. The invention also relates to devices, such as electronic and optoelectronic devices, prepared by the method of the invention.

聚合物器件包括聚合物发光二极管(LED),光检测器,光致电压器(PV)和场效应晶体管(FET)。此类器件典型地包括位于电极之间的一种或多种半导体聚合物层。半导体聚合物特征在于在骨架或侧链中部分或相当大的π-共轭。Polymer devices include polymer light-emitting diodes (LEDs), photodetectors, photovoltaics (PVs) and field-effect transistors (FETs). Such devices typically include one or more semiconducting polymer layers positioned between electrodes. Semiconducting polymers are characterized by partial or substantial π-conjugation in the backbone or side chains.

半导体聚合物现在常常用于许多光学器件中,如用于在WO90/13148中公开的聚合物发光二极管(“PLED”);场效应晶体管(“FET”);公开在WO 96/16449中的光致电压器件;和公开在US 5523555中的光检测器。Semiconducting polymers are now commonly used in many optical devices, such as for polymer light emitting diodes ("PLEDs") disclosed in WO 90/13148; field effect transistors ("FETs"); light emitting diodes disclosed in WO 96/16449. a potentiotropic device; and a photodetector disclosed in US 5,523,555.

典型的PLED包括基材,在该基材上承载的阳极,阴极,以及位于阳极和阴极中并包括至少一种聚合物电场致发光材料的有机电场致发光层。在操作中,空穴通过阳极被注入该器件中,和电子通过阴极注入到该器件中。该空穴和电子在有机电场致发光层中结合形成激子,它然后经历辐射衰减而得到光。其它层可以存在于PLED中。例如有机空穴注入材料如聚(亚乙基二氧基噻吩)/聚苯乙烯磺酸盐(PEDT/PSS)的层可以提供在阳极和有机电场致发光层之间以协助空穴从阳极注入到有机电场致发光层中。A typical PLED includes a substrate, an anode carried on the substrate, a cathode, and an organic electroluminescent layer disposed within the anode and cathode and comprising at least one polymeric electroluminescent material. In operation, holes are injected into the device through the anode, and electrons are injected into the device through the cathode. The holes and electrons combine in the organic electroluminescent layer to form excitons, which then undergo radiative decay to give light. Other layers may be present in PLEDs. For example a layer of organic hole injection material such as poly(ethylenedioxythiophene)/polystyrene sulfonate (PEDT/PSS) can be provided between the anode and the organic electroluminescent layer to assist hole injection from the anode into the organic electroluminescent layer.

晶体管,具体地说场效应晶体管(FET),是三端子器件,它包括源接点,漏极接点,和栅接点。半导体层(通道)桥连该源接点和漏极接点,并且本身通过称作栅介质的绝缘层与栅接点间隔开。在聚合物晶体管中,该半导体层由半导体聚合物,典型地π-共轭有机聚合物制造的。这一层可以通过前体途径或直接通过溶液-加工法沉积在器件中。Transistors, specifically field effect transistors (FETs), are three-terminal devices that include a source contact, a drain contact, and a gate contact. A semiconductor layer (channel) bridges the source and drain contacts and is itself spaced from the gate contact by an insulating layer called a gate dielectric. In polymer transistors, the semiconducting layer is fabricated from a semiconducting polymer, typically a π-conjugated organic polymer. This layer can be deposited in the device via the precursor route or directly via solution-processing.

在源接点和漏极接点之间施加电压。此外,在场效应晶体管中,在栅接点上施加电压。这一电压产生了电场,引起电荷载流子在直接位于栅介质之下的半导体层中的积聚或耗散。这进而将从源极流向漏极接点的电流控制在给定的源漏间电压。A voltage is applied between the source and drain contacts. Furthermore, in field effect transistors, a voltage is applied to the gate contact. This voltage creates an electric field that causes the accumulation or dissipation of charge carriers in the semiconductor layer directly beneath the gate dielectric. This in turn controls the current flow from the source to the drain contact at a given source-drain voltage.

对于光电晶体管,合适波长的光照射在该通道上。该光子能够产生空穴-电子对,它分裂和有助于产生在源极和漏极之间流动的电流,由此调节源极-漏极电导率。For a phototransistor, light of the appropriate wavelength is shone on this channel. The photons can generate hole-electron pairs that split and contribute to the generation of current flowing between the source and drain, thereby modulating the source-drain conductivity.

如在WO 96/16499中所述,典型的光致电压器件包括光响应区段,后者具有第一和第二主表面和在光响应区段的第一和第二主表面各自之上提供的第一和第二电极。该光响应区段包括任选地与第二种半导体聚合物(它与第一种半导体聚合物发生相分离)共混的第一种半导体聚合物。在短路状态下,内电场存在于光响应区段中。内电场的取向使得电子迁移到具有最低功函数的接点(一般为铝、镁或钙电极)并被收集在它之上,同时空穴朝着具有较高功函数的电极如氧化铟锡电极移动。因此,光电流能够被检测和例如可用于提供电能(就象例如太阳能电池的情况),或允许检测出光图案如用于图像传感器中的图像的一部分。As described in WO 96/16499, a typical photovoltaic device includes a photoresponsive section having first and second major surfaces and providing the first and second electrodes. The photoresponsive segment includes a first semiconducting polymer optionally blended with a second semiconducting polymer that is phase separated from the first semiconducting polymer. In the short circuit state, an internal electric field exists in the photoresponsive section. The orientation of the internal electric field causes electrons to migrate to and be collected on the junction with the lowest work function (typically an aluminum, magnesium, or calcium electrode), while holes move toward an electrode with a higher work function, such as an ITO electrode . Thus, the photocurrent can be detected and used, for example, to provide electrical energy (as is the case for example with solar cells), or to allow the detection of a light pattern such as part of an image for use in an image sensor.

如在US5,523,555中所讨论,典型的光检测器器件包括排列在具有不同功函数的第一和第二电极层之间的光响应层。该光响应层包括半导体聚合物或此类聚合物的共混物。可以有多个的光响应层。连接偏压电路以便在第一和第二电极层之间施加偏电压。连接一种感测电路,检测在施加偏电压的同时由于入射在聚合物层上的辐射所引起的跨越聚合物层在第一和第二电极层之间流动的光电流。该偏电压与在电极之间的距离相关地进行选择。As discussed in US 5,523,555, a typical photodetector device includes a photoresponsive layer arranged between first and second electrode layers having different work functions. The photoresponsive layer comprises a semiconducting polymer or a blend of such polymers. There can be multiple photoresponsive layers. A bias circuit is connected to apply a bias voltage between the first and second electrode layers. A sensing circuit is connected to detect a photocurrent flowing across the polymer layer between the first and second electrode layers due to radiation incident on the polymer layer while a bias voltage is applied. The bias voltage is selected in dependence on the distance between the electrodes.

半导体聚合物能够显示出各种各样的光物理性能(如π-π*带隙和光致发光产率);光学性质(如折光指数和它的分散);电子性能(如空穴-和电子-传输能量水平,和空穴-和电子-流动性);和加工性能(如溶剂溶解度,相变温度,结晶度和相转变温度)。这些性能主要通过聚合物的化学结构来控制。在这一方面,这些性能基本上可以通过聚合物的骨架单元和侧链的合适选择被控制在一定范围内。Semiconducting polymers can exhibit a wide variety of photophysical properties (such as π-π* bandgap and photoluminescence yield); optical properties (such as refractive index and its dispersion); electronic properties (such as hole- and electron- - transport energy levels, and hole- and electron-mobility); and processing properties (such as solvent solubility, phase transition temperature, crystallinity and phase transition temperature). These properties are mainly controlled by the chemical structure of the polymer. In this regard, these properties can basically be controlled within a certain range by suitable selection of the backbone units and side chains of the polymer.

在前述聚合物器件中的一种或多种聚合物优选可溶于普通的有机溶剂中以便促进它们在器件制造期间的沉积。这一溶解性的关键优点之一是聚合物层能够通过溶液加工法,例如通过旋转-浇铸,喷墨印刷,丝网印刷,浸涂等等来制造。此类聚合物的例子已公开在,例如,Adv.Mater.2000 12(23)1737-1750中并包括具有从芳族或杂芳族单元如芴,茚并芴,亚苯基类,亚芳基亚乙烯基类,噻吩,吡咯类,喹喔啉,苯并噻二唑,噁二唑,噻吩,和含有增溶基团的芳基胺形成的至少部分地共轭的骨架的聚合物,和具有非共轭骨架的聚合物如聚(乙烯基咔唑)。聚亚芳基类如聚芴类具有良好的成膜性能和可以容易地通过Suzuki或Yamamoto聚合法来形成,从而对所得聚合物的区域规整性有高度控制能力。One or more polymers in the aforementioned polymeric devices are preferably soluble in common organic solvents in order to facilitate their deposition during device fabrication. One of the key advantages of this solubility is that polymer layers can be fabricated by solution processing methods such as by spin-casting, inkjet printing, screen printing, dip coating and the like. Examples of such polymers are disclosed, for example, in Adv. Mater. 2000 12 (23) 1737-1750 and include those having aromatic or heteroaromatic units such as fluorene, indenofluorene, phenylenes, arylene Polymers of vinylidene, thiophene, pyrrole, quinoxaline, benzothiadiazole, oxadiazole, thiophene, and arylamine containing solubilizing groups at least partially conjugated backbone, and polymers with non-conjugated backbones such as poly(vinylcarbazole). Polyarylenes such as polyfluorenes have good film-forming properties and can be easily formed by Suzuki or Yamamoto polymerization methods, allowing a high degree of control over the regioregularity of the resulting polymer.

在某些器件中希望在单个基材表面上铸塑不同聚合物的多个层(即层压材料)。例如这能够实现不同功能的优化,例如电子或空穴电荷迁移,发光控制,光子-限制,激子-限制,光诱导的电荷产生,和电荷封闭或储存。In some devices it is desirable to cast multiple layers of different polymers (ie, laminates) on a single substrate surface. This enables, for example, the optimization of different functions, such as electron or hole charge transport, luminescence control, photon-confinement, exciton-confinement, light-induced charge generation, and charge confinement or storage.

在这方面,它能够用于制造此类聚合物的多层,以控制例如跨越聚合物堆叠体的电学和光学性质。这对于最佳器件性能是有用的。最佳器件性能能够,例如,通过电子和空穴传输水平偏移,光学折光指数不匹配,跨越该界面的能隙不匹配的小心设计来实现。此类杂化结构能够,例如,促进一种载流子的注入但阻断相反载流子的提取和/或防止激子扩散到该猝熄(quenching)界面。因此,此类杂化结构能够提供有用的载流子和光子限制效果。In this regard, it can be used to fabricate multilayers of such polymers to control, for example, electrical and optical properties across the polymer stack. This is useful for optimal device performance. Optimal device performance can be achieved, for example, by careful design of electron and hole transport level shifts, optical refractive index mismatches, and energy gap mismatches across the interface. Such hybrid structures can, for example, facilitate the injection of one carrier but block the extraction of the opposite carrier and/or prevent the diffusion of excitons to the quenching interface. Therefore, such hybrid structures can provide useful carrier and photon confinement effects.

也能够用于制造多层,以便在器件结构上提供保护层。在这方面,举一个例子,据信PEDT/PSS会对PLED的电场致发光层具有有害影响。不希望受理论的束缚,据认为这可能归因于在PEDT∶PSS层和电场致发光层(即其中空穴和电子相结合形成激子的层)之间的电化学反应。一般认为这会导致发光的猝熄和所需驱动电压的递增。因此,希望在PEDT∶PSS和电场致发光层之间提供保护层。It can also be used to fabricate multiple layers to provide a protective layer over the device structure. In this regard, as an example, PEDT/PSS is believed to have deleterious effects on the electroluminescent layer of a PLED. Without wishing to be bound by theory, it is thought that this may be due to an electrochemical reaction between the PEDT:PSS layer and the electroluminescent layer (ie, the layer in which holes and electrons combine to form excitons). This is generally believed to result in a quenching of the luminescence and an incremental increase in the required drive voltage. Therefore, it is desirable to provide a protective layer between the PEDT:PSS and the electroluminescent layer.

然而,聚合物层压材料的制备一般不是不重要的。尤其,最初铸塑或沉积的层在用于后续的层中的溶剂中的溶解性将会带来问题。这是因为后续的聚合物层的溶液沉积能够溶解和破坏在先层的完整性。However, the preparation of the polymer laminate is generally not trivial. In particular, the solubility of the initially cast or deposited layer in the solvent used in the subsequent layer can pose problems. This is because solution deposition of subsequent polymer layers can dissolve and destroy the integrity of previous layers.

克服这一问题的一个选项是使用前体聚合物体系。PPV(聚亚苯基亚乙烯基)和PTV(聚亚噻吩基亚乙烯基)的前体体系在本技术领域中是已知的。One option to overcome this problem is to use precursor polymer systems. Precursor systems for PPV (polyphenylene vinylene) and PTV (polythienyl vinylene) are known in the art.

半导体性聚合物的层可以通过沉积可溶性聚合物前体,然后化学转化成不溶性电场致发光形式来形成。例如,WO94/03030公开了其中不溶性、电场致发光聚(亚苯基亚乙烯基)由可溶性前体形成并且其它层然后由溶液沉积到这一不溶性层之上的方法。Layers of semiconducting polymers can be formed by depositing a soluble polymer precursor followed by chemical conversion to an insoluble electroluminescent form. For example, WO94/03030 discloses a process in which an insoluble, electroluminescent poly(phenylene vinylene) is formed from a soluble precursor and further layers are then deposited from solution onto this insoluble layer.

然而,显然不希望将在聚合物器件中的聚合物限于从不可溶的前体聚合物形成的那一类型的聚合物。此外,前体聚合物所需要的化学转化过程涉及到极端加工条件和可能损害在完工器件中在先层的性能的反应活性副产物。However, it is clearly not desirable to limit the polymers in a polymer device to those types of polymers formed from insoluble precursor polymers. Furthermore, the required chemical conversion process of the precursor polymers involves extreme processing conditions and reactive by-products that can impair the performance of the preceding layers in the finished device.

克服这一问题的附加选项是使用在它们的溶解行为上有很大程度不同的聚合物。例如,可溶于烃熔剂中的聚合物与可溶于水或溶于乙酸酯溶剂中的聚合物的结合使用使得能够制备出有限的双层或三层堆叠体。在这方面的重要例子是共轭聚合物从芳族烃溶剂中沉积在不可溶于芳族烃溶剂中的首先形成的导电性PEDT∶PSS涂膜上。再次,这严重地限制了能够用于多层堆叠体中的聚合物的类型。这是因为大多数的共轭聚合物体系特征在于在相同组的芳族烃溶剂(如二甲苯和其它取代苯)和微极性烃熔剂(如四氢呋喃和卤化溶剂)中的溶解度。An additional option to overcome this problem is to use polymers that differ to a large extent in their dissolution behavior. For example, the use of polymers soluble in hydrocarbon solvents in combination with polymers soluble in water or acetate solvents allows the preparation of limited bilayer or trilayer stacks. An important example in this regard is the deposition of conjugated polymers from aromatic hydrocarbon solvents onto first formed conductive PEDT:PSS coatings that are insoluble in aromatic hydrocarbon solvents. Again, this severely limits the types of polymers that can be used in multilayer stacks. This is because most conjugated polymer systems are characterized by solubility in the same set of aromatic hydrocarbon solvents (such as xylenes and other substituted benzenes) and slightly polar hydrocarbon solvents (such as tetrahydrofuran and halogenated solvents).

应当认识到,对于可用于层压材料中的聚合物的限制意味着器件结构的许多概念不能研究或实施。照这样,器件层次结构的进一步发展会严重地受妨碍。It should be appreciated that limitations on the polymers that can be used in laminates mean that many concepts of device structures cannot be studied or implemented. As such, further development of the device hierarchy can be severely hampered.

WO96/20253一般性地描述了含有交联的发光性的成膜溶剂可加工聚合物。据称因为该薄膜对于在普通溶剂中的溶解作用有抵抗作用,这允许附加层的沉积,由此促进了器件制造。连接于聚合物主链上的叠氮基的使用被提及为热交联的一个例子。在7页上显示的通式中,聚噻吩共聚物含有含量在5mol%至66mol%之间的具有交联用结构部分的重复单元。WO 96/20253 generally describes luminescent, film-forming, solvent-processable polymers containing crosslinks. It is claimed that because the film is resistant to dissolution in common solvents, this allows for the deposition of additional layers, thereby facilitating device fabrication. The use of azido groups attached to the polymer backbone is mentioned as an example of thermal crosslinking. In the general formula shown on page 7, the polythiophene copolymer contains a repeating unit having a moiety for crosslinking in a content between 5 mol % and 66 mol %.

US 6107452公开了形成多层器件的方法,其中包括末端乙烯基基团的含芴的低聚物从溶液沉积并交联形成不可溶的聚合物(需要在它之上沉积附加的层)。该乙烯基单元必须以高于至少25%的摩尔比存在。这可以由在US6107452中的机理(经由它发生交联)来决定。US 6107452 discloses a method of forming multilayer devices in which fluorene-containing oligomers comprising terminal vinyl groups are deposited from solution and cross-linked to form an insoluble polymer requiring deposition of additional layers on top of it. The vinyl units must be present in a molar ratio higher than at least 25%. This can be determined by the mechanism in US6107452 via which crosslinking occurs.

类似地,Kim等人,Synthetic Metals 122(2001),363-368公开了包括三芳基胺基团和乙炔基基团的聚合物,它可在聚合物的沉积之后交联。这一文件公开了以100mol%存在的作为聚合物的重复单元的一部分而存在的乙炔基团。Similarly, Kim et al., Synthetic Metals 122 (2001), 363-368 disclose polymers comprising triarylamine groups and ethynyl groups, which can be crosslinked after deposition of the polymer. This document discloses the presence of acetylene groups present as part of the repeating unit of the polymer at 100 mol%.

除了用于形成聚合物层压材料之外,在沉积之后让聚合物变得不可溶也会允许实现负-色调平版印刷。根据标准负-色调光刻胶平版印刷,将含有临界荷载量的交联体系的聚合物膜,常常聚苯乙烯或聚(甲基丙烯酸甲酯)铸塑到基材之上。所选择的区域经由掩模图案曝光。曝光的区域通过交联反应变成不可溶的。未曝光的区域保持可溶性和能够随后通过用显影剂溶剂体系洗涤被除去,导致掩模的负像转移到光刻胶涂膜之上。In addition to being used to form polymer laminates, making the polymer insoluble after deposition also allows for negative-tone lithography. According to standard negative-tone photoresist lithography, a polymer film, usually polystyrene or poly(methyl methacrylate), containing a critical loading of a crosslinked system is cast onto a substrate. Selected areas are exposed via a mask pattern. The exposed areas become insoluble through a cross-linking reaction. The unexposed areas remain soluble and can be subsequently removed by washing with the developer solvent system, resulting in the transfer of the negative image of the mask onto the photoresist coating.

在这方面,希望通过红色,绿色和蓝色场致发光材料的图案化来形成全色显示器。还希望将在基材上形成的各FET或光检测器元件图案化和分离。已知的方法包括溶液可加工物质,尤其聚合物,利用在例如EP 0880303中公开的喷墨印刷法或利用可蒸发的物质经由遮蔽掩模的蒸发所实现的有图案沉积。In this regard, it is desirable to form full-color displays by patterning red, green and blue electroluminescent materials. It is also desirable to pattern and separate the individual FET or photodetector elements formed on the substrate. Known methods include patterned deposition of solution processable substances, especially polymers, by means of inkjet printing as disclosed in eg EP 0880303 or by evaporation of vaporizable substances through shadow masks.

一种方法是在聚合物的侧链中引入可聚合的结构部分,并经由辐射-敏感的引发剂来引发聚合(交联)反应。这一方法的一个例子描述在Nature 421,829-833,2003中,它公开了由含有氧杂环丁烷侧基的红色、绿色和蓝色电场致发光聚合物的层的沉积形成全色显示器的方法,该聚合物在沉积之后通过暴露于合适辐射经由光致酸产生剂来交联。含有氧杂环丁烷的单体以25mol%的水平被引入到举例说明的聚合物中。仅仅各层的所选择区域通过掩模暴露于UV辐照,让所选择的区域交联。在未曝光区域中的聚合物保持可溶性,因此可被洗去而留下图案层。然而所公开的这一方法得到具有减低的电子和空穴流动性的聚合物。此外氧杂环丁烷容易在贮存过程中在痕量酸催化剂存在下发生自聚。One approach is to introduce polymerizable moieties in the side chains of the polymer and initiate the polymerization (crosslinking) reaction via a radiation-sensitive initiator. An example of this approach is described in Nature 421, 829-833, 2003, which discloses the formation of full-color displays by deposition of layers of red, green and blue electroluminescent polymers containing pendant oxetane groups In this method, the polymer is crosslinked after deposition by exposure to suitable radiation via a photoacid generator. Oxetane-containing monomers were incorporated into the exemplified polymers at a level of 25 mol%. Exposing only selected areas of each layer to UV radiation through a mask causes the selected areas to crosslink. The polymer in the unexposed areas remains soluble and can therefore be washed away leaving a patterned layer. However, this disclosed method results in polymers with reduced electron and hole mobility. In addition oxetanes are prone to self-polymerize during storage in the presence of traces of acid catalysts.

另外的途径是在聚合物-溶剂配制剂中使用低分子量辐射-敏感的交联剂。Another approach is the use of low molecular weight radiation-sensitive crosslinkers in polymer-solvent formulations.

在这方面,双芳基叠氮化物的使用公开于T Iwayanagi,TKohashi,S Nonogaki,T Matsusawa,K Douta,H.Yanazawa,IEEETransactions on Electronic Devices ED25(1981),1306页。这一文件公开了由芳族叠氮化物化合物和酚醛树脂的光敏组合物作为平版印刷用的负性深UV光刻胶。该叠氮化合物以在5-30wt%之间的量与酚醛树脂混合。In this regard, the use of bisaryl azides is disclosed in T Iwayanagi, T Kohashi, S Nonogaki, T Matsusawa, K Douta, H. Yanazawa, IEEE Transactions on Electronic Devices ED25 (1981), p. 1306. This document discloses a photosensitive composition of an aromatic azide compound and a phenolic resin as a negative working deep UV photoresist for lithography. The azide compound is mixed with the phenolic resin in an amount between 5-30 wt%.

此外,在S.X.Cai,D.J.Glenn,M.Kanskar,,M.N.Wybourne和J.F.W.Keana,“Development of highly efficient deep-uv andelectron beam mediated cross-linkers:synthesis and photolysisof bis(perfluorophenyl)azides”,Chemistry of Materials,6(1994),1822-1829页中,已经公开了为了负性抗蚀剂配制剂的目的的双(全氟亚苯基叠氮化物)的使用。在这一公开物中,双(全氟亚苯基叠氮化物)与属于普通的平版印刷聚合物的聚(苯乙烯)共混。这一文件没有公开聚合物器件。Also, in S.X.Cai, D.J.Glenn, M.Kanskar, M.N.Wybourne and J.F.W.Keana, "Development of highly efficient deep-uv and electron beam mediated cross-linkers: synthesis and photolysis of bis(perfluorophenyl)azides", Chemistry of 6 Materials (1994), pp. 1822-1829, the use of bis(perfluorophenylene azide) for the purpose of negative resist formulations has been disclosed. In this publication, bis(perfluorophenylene azide) is blended with poly(styrene), which is a common lithographic polymer. This document does not disclose polymer devices.

虽然交联剂在负性-光刻胶电子束和光学平版印刷的领域中的使用是已知的,但是负性平版印刷光刻胶(NLR)配制剂和可交联的配制剂对于半导体聚合物(SP)的要求是大大地不同的:While the use of cross-linking agents is known in the field of negative-tone-resist e-beam and optical lithography, negative-tone lithographic resist (NLR) formulations and cross-linkable formulations are critical for semiconductor polymerization Specific (SP) requirements are vastly different:

(1)NLR配制剂典型地包括不吸收的不聚合物基质和对所需辐射敏感的交联剂体系。因为聚合物基质对于所述的辐射波长是基本上透明的,它本身不会对于交联剂体系被敏化所需要的频谱波长有要求。因此交联剂体系的光谱敏感度主要地由所选择的辐射波长支配。相反,SP特征在于在可见光和紫外线波长范围中的强吸光谱带。这一吸收特征对于在器件中SP的性质和用途是很重要的。因为它们的主要吸收光谱带的吸收强度是相当大的,相应地吸收深度是浅的并且SP膜在这些波长下实际上是不透明的。例如,该1/e吸收深度(或等价地,辐射穿透深度)对于大部分SP来说在谱带最大值下典型地低于50nm。该交联体系因此理想地具有与在各SP的强吸收谱带之间的有限的透明窗相匹配的它的光谱敏感度。不满足这一要求的交联体系只能让膜的最上层交联,因此限制了它们在SP中的用途。此外,还理想的是能够使用一些波长,在该波长下SP是基本上不吸收的,以避免伴随的光诱导的氧化和其它反应。(1) NLR formulations typically include a non-absorbing, non-polymeric matrix and a cross-linker system that is sensitive to the desired radiation. Since the polymer matrix is substantially transparent to the stated wavelengths of radiation, it does not itself impose requirements on the spectral wavelengths required for the crosslinker system to be sensitized. The spectral sensitivity of the crosslinker system is therefore mainly governed by the chosen radiation wavelength. In contrast, SPs are characterized by strong absorption bands in the visible and ultraviolet wavelength ranges. This absorption feature is important for the nature and use of SPs in devices. Because the absorption intensity of their main absorption spectral bands is considerable, the corresponding absorption depth is shallow and SP films are practically opaque at these wavelengths. For example, the 1/e absorption depth (or equivalently, the radiation penetration depth) is typically below 50 nm at the band maximum for most SPs. The cross-linked system thus ideally has its spectral sensitivity matched to a limited transparency window between the strong absorption bands of the individual SPs. Crosslinking systems that do not meet this requirement can only crosslink the uppermost layer of the membrane, thus limiting their use in SP. Furthermore, it would also be desirable to be able to use wavelengths at which the SP is substantially non-absorbing to avoid concomitant light-induced oxidation and other reactions.

(2)NLR配制剂不用作半导体器件中的活性层。它们用作牺牲性的掩蔽用层和因此不用接受需要用于该器件中的可交联的SP配制剂的严厉要求。尤其,在SP配制剂中,该交联剂体系不应该引入较大浓度的电子阱,空穴阱或激子阱,它们可能降低器件的性能。例如,一些众所周知的光致产生的酸(PGA)以化学方式放大的光刻胶体系留下PGA残留物,它们能够严重地干扰共轭聚合物的电荷传输和发光性能。(2) NLR formulations are not used as active layers in semiconductor devices. They serve as a sacrificial masking layer and are therefore not subject to the stringent requirements of cross-linkable SP formulations required for use in the device. In particular, in SP formulations, the crosslinker system should not introduce large concentrations of electron traps, hole traps or excitonic traps, which may degrade device performance. For example, some well-known photogenerated acid (PGA) chemically amplified photoresist systems leave PGA residues that can seriously interfere with the charge transport and light emitting properties of conjugated polymers.

非氟化双(苯基叠氮化物)作为辐射敏感交联剂来配制以导电聚合物PEDT∶PSS为基础的负型光刻胶的用途最近已经公开于F.J.Touwslager,N.P.Willard和D.M.de Leeuw,“I-line lithographyof poly(3,4-ethylenedioxythiophene)electrodes andapplication in all-polymer integrated circuits”,AppliedPhysics Letters,81(2002),4556-4558页中。这描述了导电性(与半导体性不同)聚合物线的照相平版印刷的图案化,以形成电极和互联体。该PEDT∶PSS在暴露于365-nm I-线辐射之后与双(苯基叠氮化物)交联。这一方法(就象WO96/20253的叠氮化物方法)的主要特征是,作为一类的物质的苯基叠氮化物类作为交联剂是相当低效的,这需要它们以高浓度引入。此外,有交联反应的许多副产物,许多这些副产物对于器件性能是有毒的。The use of non-fluorinated bis(phenylazides) as radiation sensitive crosslinkers to formulate negative photoresists based on the conductive polymer PEDT:PSS has recently been disclosed in F.J.Touwslager, N.P.Willard and D.M.de Leeuw, "I-line lithography of poly(3,4-ethylenedioxythiophene) electrodes and application in all-polymer integrated circuits", Applied Physics Letters, 81(2002), pp. 4556-4558. This describes the photolithographic patterning of conductive (as opposed to semiconducting) polymer lines to form electrodes and interconnects. The PEDT:PSS was crosslinked with bis(phenylazide) after exposure to 365-nm I-ray radiation. The main feature of this method (like the azide method of WO 96/20253) is that phenyl azides as a class of species are rather inefficient as crosslinkers, requiring their introduction in high concentrations. Furthermore, there are many by-products of the cross-linking reaction, many of which are toxic to device performance.

类似的方法描述在US 2002/106529中,其中电场致发光材料与聚合物粘结剂(binder)共混或结合于后者。该粘结剂聚合物可以是交联的。具有光可交联基团的一些粘结剂聚合物具有由公开在5页上的通式(9)表示的重复单元。显然,这些材料具有高mol%含量的光交联的基团。另外地,光交联反应结构部分可以与粘结剂聚合物混合,并且在这一实施方案中,已经教导该试剂应该以5-50重量份的量混合,以100重量份的粘结剂聚合物为基础。A similar approach is described in US 2002/106529, where the electroluminescent material is blended with or bound to a polymeric binder. The binder polymer may be crosslinked. Some binder polymers having photocrosslinkable groups have repeating units represented by the general formula (9) disclosed on page 5. Clearly, these materials have a high mol% content of photocrosslinkable groups. Alternatively, the photocrosslinking reactive moiety may be mixed with the binder polymer, and in this embodiment, it has been taught that the agent should be mixed in an amount of 5-50 parts by weight to polymerize with 100 parts by weight of the binder thing-based.

公开在现有技术中的体系,特别是公开在以上Applied LettersPhysics disclosure,US 2002/106529,WO96/20253,和US 6107452中的那些体系,不是特别地适合用于器件内。公开的交联工艺以聚合或以在两个交联用结构部分之间的特定偶联为基础。为了让交联有效地发生,该交联剂结构部分必须以非常高的载量(基本上高于5mol%)的存在。高载量的交联剂结构部分本身或交联剂结构部分的反应的副产物倾向于干扰在器件层中的有效电荷-载流子输送。此外,该交联剂结构部分能够通过它们的稀释和无序化效应来间接地干扰有效电荷-载流子输送。“稀释效应”是指,随着在最终产物中交联的结构部分的载量提高,在聚合物中共轭链段的相对浓度下降所引起的效应。“无序化效应”是指,由于交联的结构部分的高载量,最终的交联聚合物的骨架从平面上扭转出来。结果器件的驱动电压相应地提高,且它们的使用寿命缩短。The systems disclosed in the prior art, especially those disclosed in the above Applied Letters Physics disclosure, US 2002/106529, WO96/20253, and US 6107452, are not particularly suitable for use in devices. The disclosed crosslinking processes are based on polymerization or on specific couplings between two crosslinking moieties. In order for crosslinking to occur effectively, the crosslinker moiety must be present in very high loadings (substantially higher than 5 mol%). High loadings of the crosslinker moiety itself or by-products of the reaction of the crosslinker moiety tend to interfere with efficient charge-carrier transport in the device layers. Furthermore, the crosslinker moieties can indirectly interfere with efficient charge-carrier transport through their dilution and disordering effects. "Dilution effect" refers to the effect caused by the decrease in the relative concentration of conjugated segments in the polymer as the loading of crosslinking moieties in the final product increases. By "disordering effect" is meant that the backbone of the final crosslinked polymer is twisted out of plane due to the high loading of crosslinked moieties. As a result, the driving voltage of the devices is correspondingly increased, and their service life is shortened.

考虑到以上情况,应当理解仍然需要提供聚合物器件制造的其它方法,其中最初铸塑或沉积的聚合物层在用于后续加工步骤中的溶剂中变得不可溶的。In view of the above, it should be appreciated that there remains a need to provide other methods of polymer device fabrication in which initially cast or deposited polymer layers become insoluble in solvents used in subsequent processing steps.

因此,本发明的目的是提供聚合物器件制造的新方法,优选与高性能相结合。此外,本发明的目的是提供由该新方法可获得的聚合物器件。It is therefore an object of the present invention to provide new methods of polymer device fabrication, preferably combined with high performance. Furthermore, it is an object of the present invention to provide polymeric devices obtainable by this new method.

在这方面,本发明人令人吃惊地已经发现,迄今无人知道的低浓度的交联用结构部分(<5mol%)能够成功地用于在器件制造中的半导体性层中。交联用结构部分能够与半导体性聚合物混合或作为聚合物主链或侧链的一部分,以形成具有低浓度的交联用结构部分的交联聚合物产物。此外,本发明人已经发现这一低浓度的交联的结构部分基本上没有降低聚合物器件中聚合物的性能。In this context, the inventors have surprisingly found that hitherto unknown low concentrations of crosslinking moieties (<5 mol %) can be successfully used in semiconducting layers in the manufacture of devices. The crosslinking moiety can be mixed with the semiconducting polymer or be part of the polymer backbone or side chains to form a crosslinked polymer product with a low concentration of the crosslinking moiety. Furthermore, the inventors have found that this low concentration of cross-linking moieties does not substantially degrade the performance of the polymer in polymeric devices.

因此,在本发明的第一方面提供了形成聚合物器件的方法,包括以下步骤:Accordingly, in a first aspect the present invention provides a method of forming a polymer device comprising the steps of:

(i)在基材上沉积包括聚合物或低聚物和交联用结构部分的溶液,形成层;(i) depositing a solution comprising a polymer or oligomer and a moiety for crosslinking on a substrate to form a layer;

(ii)在一定条件固化在步骤(i)中形成的该层,从而形成不可溶的交联聚合物;(ii) curing the layer formed in step (i) under conditions to form an insoluble cross-linked polymer;

其特征在于该交联用结构部分以0.05-5mol%范围内的量存在于步骤(i)中,基于在溶液中聚合物或低聚物和交联用结构部分的总摩尔数。It is characterized in that the crosslinking moiety is present in step (i) in an amount ranging from 0.05 to 5 mol%, based on the total number of moles of polymer or oligomer and crosslinking moiety in the solution.

该交联用结构部分可以与在步骤(i)中沉积的溶液中的聚合物或低聚物混合。另外地,该交联用结构部分可以属于在溶液中聚合物/低聚物的聚合物/低聚物主链或侧链的一部分。The crosslinking moiety may be mixed with the polymer or oligomer in the solution deposited in step (i). Alternatively, the crosslinking moiety may be part of the polymer/oligomer backbone or side chains of the polymer/oligomer in solution.

该交联用结构部分以在0.05mol%-5mol%范围内的水平,优选在0.05mol%至低于5mol%范围内的水平,更优选在0.05至3mol%范围内的水平,再更优选在0.1mol%至2mol%范围内的水平和再更优选在0.1mol%到1mol%范围内的水平存在于在步骤(i)中的溶液中,基于在溶液中聚合物或低聚物和交联用结构部分的总摩尔数。The crosslinking moiety is at a level in the range of 0.05 mol% to 5 mol%, preferably at a level in the range of 0.05 mol% to less than 5 mol%, more preferably at a level in the range of 0.05 to 3 mol%, still more preferably at A level in the range of 0.1 mol% to 2 mol% and still more preferably a level in the range of 0.1 mol% to 1 mol% is present in the solution in step (i), based on the polymer or oligomer and crosslinking in solution The total number of moles of moieties is used.

当交联用结构部分与在该溶液中的聚合物或低聚物混合时,交联用结构部分存在的水平能够容易地根据以下公式测量:When a crosslinking moiety is mixed with a polymer or oligomer in the solution, the level of crosslinking moiety present can be readily measured according to the following formula:

n交联剂/(n交联剂+n聚合物)×100n cross-linking agent /(n cross-linking agent +n polymer )×100

其中n交联剂是交联用结构部分的摩尔数,和n聚合物是聚合物或低聚物的重复单元的摩尔数。对于根据通式AxByC(1-x-y)描述的无规或交替共聚物;和对于根据通式AxByCz描述的嵌段共聚物,聚合物的重复单元对于本发明的目的被定义为A,B,和C。where ncrosslinker is the number of moles of crosslinking moiety, and npolymer is the number of moles of repeating units of the polymer or oligomer. For random or alternating copolymers described according to the general formula AxByC(1-xy); and for block copolymers described according to the general formula AxByCz , the repeating units of the polymers are important for the present invention Purposes are defined as A, B, and C.

在下面所示的三个例子(a),(b)和(c)中,n聚合物是(A的摩尔数)+(B的摩尔数)+(C的摩尔数)。在下面所示的例子(a)、(b)和(c)的每一个中,n聚合物是(6+6+6)=18。仅仅举例来说,如果一摩尔的交联用结构部分与聚合物(a)、(b)或(c)的任何一种一起存在于溶液中,则交联用结构部分将以1/(1+18)×100=5.26mol%的浓度存在。In the three examples (a), (b) and (c) shown below, npolymer is (moles of A) + (moles of B) + (moles of C). In each of the examples (a), (b) and (c) shown below, npolymer is (6+6+6)=18. By way of example only, if one mole of a crosslinking moiety is present in solution with any of polymers (a), (b) or (c), the crosslinking moiety will be present in a ratio of 1/(1 +18) x 100 = 5.26 mol% concentration present.

(a)ABCBBACACCBAACBCBA(a) ABCBBACACCBAACBCBA

(b)ABCABCABCABCABCABC(b) ABCABCABCABCABCABCABC

(c)AAACCCBBBCCCAAABBB(c)AAACCCBBBCCCAAABBB

交联剂结构部分和重复单元的相对数量能够通过微量分析或通过NMR来测量。The relative amounts of crosslinker moieties and repeat units can be measured by microanalysis or by NMR.

其中该交联用结构部分是聚合物或低聚物主链或侧链的一部分,对于本发明的目的,该交联用结构部分被规定存在的水平应该根据下面所示来测量。Where the crosslinking moiety is part of a polymer or oligomer backbone or side chain, for the purposes of the present invention, the level at which the crosslinking moiety is stated to be present should be measured as shown below.

考虑到聚合物或低聚物包括具有下列结构中的一种的重复单元:Consider a polymer or oligomer comprising repeating units having one of the following structures:

作为侧链连接                                主链的交联基团部分Part of the cross-linking group attached to the main chain as a side chain

的交联基团cross-linking group

其中R是在包括烃的聚合物或低聚物的主链中的重复单元和X是交联用结构部分,则交联用结构部分所存在的水平应该如下测量:Where R is a repeating unit in the backbone of a polymer or oligomer comprising a hydrocarbon and X is a crosslinking moiety, then the level of crosslinking moiety present should be measured as follows:

n交联剂/(n交联剂+n聚合物)×100n cross-linking agent /(n cross-linking agent +n polymer )×100

其中n交联剂是交联用结构部分X的摩尔数,和n聚合物是聚合物或低聚物的重复单元的摩尔数。where ncrosslinker is the number of moles of crosslinking moiety X, and npolymer is the number of moles of repeating units of the polymer or oligomer.

在步骤(ii)中形成的不可溶的交联聚合物含有0.05-5mol%交联用结构部分。优选,交联的结构部分以在0.05mol%至低于5mol%范围内的量,更优选以在0.05mol%到3mol%范围内的量,更优选以在0.1mol%至2mol%范围内的量,再更优选以在0.1mol%至1mol%范围内的量存在,基于在步骤(i)中形成的层中不可溶的交联聚合物的总摩尔数。The insoluble crosslinked polymer formed in step (ii) contains 0.05-5 mol % of crosslinking moieties. Preferably, the crosslinking moiety is present in an amount ranging from 0.05 mol % to less than 5 mol %, more preferably in an amount ranging from 0.05 mol % to 3 mol %, more preferably in an amount ranging from 0.1 mol % to 2 mol % amount, still more preferably present in an amount ranging from 0.1 mol% to 1 mol%, based on the total moles of insoluble crosslinked polymer in the layer formed in step (i).

考虑到不可溶的交联聚合物包括具有下列结构中的一种的重复单元:Consider insoluble cross-linked polymers comprising repeat units with one of the following structures:

Figure G2004800170863D00111
Figure G2004800170863D00111

其中R和R是在交联聚合物的主链中的重复单元和X是交联的结构部分,则交联的结构部分的存在水平应该如下测量:Where R and R are repeating units in the backbone of the crosslinked polymer and X is a crosslinking moiety, then the level of presence of the crosslinking moiety should be measured as follows:

n交联/(n交联+n聚合物)×100n cross-linking /(n cross-linking +n polymer )×100

其中n交联是交联的结构部分X’的摩尔数,和n聚合物是聚合物的重复单元的摩尔数。where ncrosslinks is the number of moles of crosslinked moieties X', and npolymer is the number of moles of repeating units of the polymer.

本方法提供了让沉积后的聚合物膜交联获得任何所需膜厚度的简单途径,例如在一个工艺周期中约1nm到约500nm的膜厚度。这是高度多用途的和通用的工艺。在本方法中,这能够在许多情况下实现,无需引入较大浓度的电荷-载流子阱或激子阱。结果,有可能制造出各种各样的实用的聚合物-聚合物杂化结构并将它们有利地引入到聚合物器件中,特别地在发光二极管,光电二极管和场效应晶体管中。本方法也开发了聚合物膜的图案化的新途径。The present method provides a simple route to crosslinking as-deposited polymer films to achieve any desired film thickness, for example from about 1 nm to about 500 nm in one process cycle. This is highly versatile and versatile craft. In the present method, this can be achieved in many cases without introducing a greater concentration of charge-carrier or exciton traps. As a result, it is possible to fabricate a wide variety of practical polymer-polymer hybrid structures and to incorporate them advantageously into polymer devices, especially in light-emitting diodes, photodiodes and field-effect transistors. The present method also opens up new avenues for the patterning of polymer films.

总而言之,实用的和基本上无限制的多层堆叠体和图案化聚合物膜能够通过使用由本方法所定义的一般策略来制造。Altogether, practical and essentially unlimited multilayer stacks and patterned polymer films can be fabricated using the general strategy defined by this method.

出乎意料地,本发明人已经发现在这一低水平下的交联基本上没有产生那些严重地损害半导体聚合物层的电学和光电功能的“杀伤”缺陷或副产物。Unexpectedly, the present inventors have discovered that crosslinking at this low level produces substantially no "killer" defects or by-products that seriously impair the electrical and optoelectronic functions of the semiconducting polymer layer.

在步骤(ii)中的固化可以通过电子束辐射来实现。然而,优选地,固化条件包括在惰性气氛中暴露于短波长辐射,更优选在惰性气氛中暴露于深紫外线辐射。更优选,深紫外辐射的波长是在200nm至400nm,更优选245nm至370nm,再更优选250nm到260nm范围内。特别优选的波长是大约254-nm,可从低压汞灯获得,和248nm,可从例如KrF准分子激光器获得。因此,优选的是交联用结构部分对上述波长的短波长辐射是敏感的。Curing in step (ii) can be achieved by electron beam radiation. Preferably, however, the curing conditions include exposure to short wavelength radiation in an inert atmosphere, more preferably exposure to deep ultraviolet radiation in an inert atmosphere. More preferably, the wavelength of the deep ultraviolet radiation is in the range of 200nm to 400nm, more preferably 245nm to 370nm, even more preferably 250nm to 260nm. Particularly preferred wavelengths are about 254-nm, available from low-pressure mercury lamps, and 248 nm, available from eg KrF excimer lasers. Therefore, it is preferred that the moiety for crosslinking is sensitive to short-wavelength radiation of the above-mentioned wavelength.

当在步骤(i)中沉积的溶液含有低聚物时,在步骤(ii)中的固化将会聚合以及让低聚物交联以形成不可溶的交联聚合物。When the solution deposited in step (i) contains oligomers, curing in step (ii) will polymerize and crosslink the oligomers to form an insoluble crosslinked polymer.

有利地,已经发现半导体聚合物对于曝光所需要的实际深UV剂量一般是稳定的,只要曝光是在惰性气氛中进行就行。Advantageously, it has been found that semiconducting polymers are generally stable to the actual deep UV dose required for exposure, as long as the exposure is performed in an inert atmosphere.

本发明人已经发现,许多主要的半导体聚合物(聚噻吩,聚芳基亚乙烯基类,聚芴类和它们的共聚物)意外地在大约200-300nm的深紫外线中具有共同的透明窗。这一谱特性很好地与下面讨论的优选的交联用结构部分的敏感谱相匹配,以及理想地与商购的光源匹配。The present inventors have discovered that many of the main semiconducting polymers (polythiophenes, polyarylvinylidenes, polyfluorenes and their copolymers) unexpectedly have a common transparent window in the deep ultraviolet at about 200-300 nm. This spectral characteristic matches well with the sensitivity spectrum of the preferred crosslinking moieties discussed below, and ideally with commercially available light sources.

优选的交联用结构部分包括氟化芳基叠氮化物。进一步优选的是,没有位于在氟化芳基叠氮化物中的叠氮化物邻位的氢原子。为此目的,在一些实施方案中,优选的是氟原子位于叠氮化物的邻位的任何位置。Preferred crosslinking moieties include fluorinated aryl azides. It is further preferred that there are no hydrogen atoms located ortho to the azide in the fluorinated arylazides. For this purpose, in some embodiments it is preferred that the fluorine atom be located anywhere ortho to the azide.

更优选地,交联用结构部分包括全氟芳基叠氮化物,再更优选全氟苯基叠氮化物或全氟萘基叠氮化物。More preferably, the crosslinking moiety comprises perfluoroaryl azide, still more preferably perfluorophenyl azide or perfluoronaphthyl azide.

在第一实施方案中,特别优选的交联用结构部分在步骤(i)中与溶液中的聚合物或低聚物混合,和有利地,交联经由下述机理来进行,据此机理该交联反应包括在交联用结构部分和聚合物或低聚物单元之间的成键反应,与在交联用结构部分本身之间的成键反应不同。换句话说,在步骤(ii)中该交联用结构部分基本上没有自偶联或自聚合。本发明人已经发现具有上述能力的交联用结构部分有利地以相当低的浓度使用。In a first embodiment, particularly preferred moieties for crosslinking are mixed in step (i) with polymers or oligomers in solution, and advantageously crosslinking takes place via the following mechanism, according to which The crosslinking reaction involves a bonding reaction between the crosslinking moiety and the polymer or oligomer unit, as opposed to a bonding reaction between the crosslinking moiety itself. In other words, there is substantially no self-coupling or self-polymerization of the crosslinking moiety in step (ii). The inventors have found that crosslinking moieties having the above-mentioned capabilities are advantageously used in rather low concentrations.

应当指出,如上所述的优选的交联用结构部分在步骤(ii)中基本上不会自偶联或自聚合。然而,此类交联用结构部分有能力自偶联或自聚合。在本发明的一个实施方案中简单需要的是,它们在本发明的方法的步骤(ii)中基本上不会这样。It should be noted that the preferred cross-linking moieties as described above do not substantially self-couple or self-polymerize in step (ii). However, such crosslinking moieties are capable of self-coupling or self-polymerization. It is simply required in one embodiment of the invention that they substantially do not do so in step (ii) of the method of the invention.

在该第一实施方案中的进一步优选的交联用结构部分具有以下通式I:Further preferred crosslinking moieties in this first embodiment have the following general formula I:

N3-ArF-N3  IN 3 -Ar F -N 3 I

其中ArF包括取代的或未被取代的氟化芳基。wherein ArF includes substituted or unsubstituted fluorinated aryl groups.

更优选的交联剂具有通式II:More preferred crosslinkers have the general formula II:

N3-ArF-L-ArF’-N3    IIN 3 -Ar F -L-Ar F '-N 3 II

其中ArF和ArF’独立地各自包括取代的或未被取代的氟化芳基和L包括任选的二价或多价连接基基团。优选的取代基包括比F更庞大的取代基,例如CF3。在一个实施方案中优选的是ArF和ArF’中的一个或两个具有至少一个(优选一个)比F有更大体积的取代基。wherein ArF and ArF ' independently each comprise a substituted or unsubstituted fluorinated aryl group and L comprises an optional divalent or multivalent linker group. Preferred substituents include substituents that are bulkier than F, such as CF3 . In one embodiment it is preferred that one or both of ArF and ArF ' have at least one (preferably one) substituent which is more bulky than F.

优选的连接基基团包括键接于Ar和/或ArF’上的吸电子结构部分。此类吸电子结构部分包括-CO-,-C(O)O-,S(O)2O-,C(O)NR-,或S(O)2NR-,其中R是H或取代基,连同柔性间隔基团如(CH2)x(x=1-5),(CH2)x-O-(CH2)x(x=1-3),或环己烷二基链段一起。连接剂基团可以包括两个吸电子结构部分(一个键接到ArF上和另一键接到ArF’),它们被柔性间隔基团所连接。更优选的连接剂基团包括-C-O-,-C(O)O-(CH2)n-O(O)C-(n=1-5)和,-C(O)O-环己烷二基-O(O)C-,和-S(O)2-NR-(CH2)x-NR-S(O)2-。Preferred linker groups include electron withdrawing moieties bonded to Ar and/or Ar F '. Such electron withdrawing moieties include -CO-, -C(O)O-, S(O) 2O- , C(O)NR-, or S(O) 2NR- , where R is H or a substituent , together with flexible spacers such as (CH 2 ) x (x=1-5), (CH 2 ) x -O-(CH 2 ) x (x=1-3), or cyclohexanediyl segments . The linker group may comprise two electron-withdrawing moieties (one bonded to ArF and the other bonded to ArF ') connected by a flexible spacer group. More preferred linker groups include -CO-, -C(O)O-( CH2 ) n -O(O)C-(n=1-5) and, -C(O)O-cyclohexane Diradicals -O(O)C-, and -S(O) 2 -NR-( CH2 ) x -NR-S(O) 2- .

在通式II中,更优选地ArF和ArF’各包括取代的或未被取代的氟化苯基或萘基,再更优选地取代的全氟苯基或全氟萘基。最优选地,ArF和ArF’各包括全氟苯基团。由于下面针对化合物XVI至XVIII所讨论的理由,在一个实施方案中,在全氟苯基或全氟萘基上的氟基团中的一个或多个(优选一个)有利地能够被更庞大基团如氟化烷基(例如三氟甲基)替代。这一替代有利地在2位上发生。In the general formula II, it is more preferred that Ar F and Ar F ' each comprise a substituted or unsubstituted fluorinated phenyl or naphthyl, still more preferably a substituted perfluorophenyl or perfluoronaphthyl. Most preferably, Ar F and Ar F ' each comprise a perfluorophenyl group. For the reasons discussed below for compounds XVI to XVIII, in one embodiment one or more (preferably one) of the fluorine groups on the perfluorophenyl or perfluoronaphthyl can advantageously be replaced by a larger bulky group Groups such as fluorinated alkyl groups (eg trifluoromethyl) are substituted. This substitution advantageously takes place on 2 bits.

因此,在一个实施方案中ArF和/或ArF’优选包括:Thus, in one embodiment Ar F and/or Ar F ' preferably comprises:

其中B是庞大取代基团如氟化烷基(例如三氟甲基)。wherein B is a bulky substituent such as a fluorinated alkyl group (eg trifluoromethyl).

在全氟苯基或全氟萘基之间的连接剂基团优选是如上所述类型的短连接剂基团。The linker groups between the perfluorophenyl or perfluoronaphthyl groups are preferably short linker groups of the type described above.

各叠氮基(-N3)光化学方式分解成缺电子的氮宾,后者容易进入到C-H键中,特别地烷基C-H键:-N+-C-H=-C-N(H)-。照这样,双叠氮化物的各端连接到C-H片段上。两个C-H片段公称上属于相邻的聚合物链或低聚物和因此在它们之间形成交联。是这一原因,聚合物或低聚物优选包括许多的饱和烃链段。然而,为了改进溶解度,常常使饱和烃类,具体地说烷基C-H存在于聚合物或低聚物中。Each azido group (-N 3 ) is photochemically decomposed to electron-deficient nitrene, which readily enters into CH bonds, especially alkyl CH bonds: -N+-CH=-CN(H)-. In this manner, each end of the bis-azide is attached to the CH segment. Two CH segments nominally belong to adjacent polymer chains or oligomers and thus form a crosslink between them. For this reason, the polymer or oligomer preferably includes many saturated hydrocarbon segments. However, to improve solubility, saturated hydrocarbons, in particular alkyl CH's, are often present in polymers or oligomers.

本发明人已经发现,交联通过高效率插入到C-H键中,特别地到烷基C-H键中来进行,而一般不破坏在主链上存在的π-共轭。此外,交联用结构部分与聚合物或低聚物形成键的能力已经由本发明人发现可以使用较低浓度的交联用结构部分。The present inventors have found that crosslinking proceeds through high-efficiency insertion into C-H bonds, in particular into alkyl C-H bonds, without generally disrupting the π-conjugation present on the main chain. Furthermore, the ability of the crosslinking moiety to form bonds with the polymer or oligomer has been discovered by the present inventors to allow the use of lower concentrations of the crosslinking moiety.

本发明人通过实验发现,这一交联用结构部分一般没有了留下可能妨碍聚合物性能(如电荷传输和发光性能)的残留物的缺陷。The present inventors have found through experiments that this moiety for crosslinking is generally free from the defect of leaving residues that may hinder polymer properties such as charge transport and light emitting properties.

此外,这一交联用结构部分的交联机理已经发现通常与在半导体聚合物中π-共轭的存在相适合。Furthermore, the crosslinking mechanism of this crosslinking moiety has been found to be generally compatible with the presence of π-conjugation in semiconducting polymers.

此外,已经发现共轭聚合物的固态交联效率对于该交联用结构部分出乎意料地高(>80%)。不希望受理论束缚,这一类型的交联剂的高效率被认为归因于在环中氟原子的存在(特别地邻位氟),它抑制竞争性寄生扩环副反应。Furthermore, it has been found that the solid state crosslinking efficiency of conjugated polymers is unexpectedly high (>80%) for this crosslinking moiety. Without wishing to be bound by theory, the high efficiency of this type of crosslinker is believed to be due to the presence of fluorine atoms (especially ortho fluorine) in the ring, which suppress competing parasitic ring expansion side reactions.

下面的新型交联剂已经由本发明人合成。这些交联剂组适合于与聚合物或低聚物在溶液中混合:The following novel crosslinkers have been synthesized by the present inventors. These groups of crosslinkers are suitable for mixing in solution with polymers or oligomers:

-亚烷基二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯),- alkylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate),

-亚烷基二胺双(4-叠氮基-2,3,5,6-四氟苯甲酰胺),-Alkylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzamide),

-亚烷基二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺),-Alkylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide),

-亚环烷基二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯),- cycloalkylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate),

-亚环烷基二胺双(4-叠氮基-2,3,5,6-四氟苯甲酰胺),-cycloalkylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzamide),

-亚环烷基二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺),-cycloalkylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide),

这些新型交联剂的特定例子包括:Specific examples of these novel crosslinkers include:

-乙二胺双(4-叠氮基-2,3,5,6-四氟苯甲酰胺);- Ethylenediaminebis(4-azido-2,3,5,6-tetrafluorobenzamide);

-乙二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺)-Ethylenediaminebis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide)

-1,3-环己烷二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯),-1,3-cyclohexanediol bis(4-azido-2,3,5,6-tetrafluorobenzoate),

-1,4-环己烷二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)。- 1,4-Cyclohexanediol bis(4-azido-2,3,5,6-tetrafluorobenzoate).

其中在四氟苯甲酰胺、四氟苯磺酰胺或四氟苯甲酸酯中氟原子的至少一个(优选一个)被更庞大基团(如氟化烷基,例如CF3)替代的上述新型交联剂的等同物是理想的。替代优选是在2位上。The above-mentioned novel compounds wherein at least one (preferably one) of the fluorine atoms in tetrafluorobenzamide, tetrafluorobenzenesulfonamide or tetrafluorobenzoic acid ester is replaced by a bulkier group (such as a fluorinated alkyl group, for example CF 3 ) The equivalent of the crosslinker is ideal. Substitution is preferably at position 2.

具有通式II的交联剂:Crosslinking agents having the general formula II:

N3-ArF-L-ArF’-N3    IIN 3 -Ar F -L-Ar F '-N 3 II

其中ArF和ArF’各自如上所定义,可以通过包括F-ArF-L-ArF’-F与叠氮化物反应的步骤的一种方法来合成。wherein ArF and ArF ' are each as defined above, can be synthesized by a method comprising the step of reacting F- ArF -L- ArF' -F with an azide.

优选,叠氮化物是金属叠氮化物,更优选碱金属叠氮化物,再更优选叠氮化钠。Preferably, the azide is a metal azide, more preferably an alkali metal azide, still more preferably sodium azide.

F-ArF-L-ArF’-F可以通过合适的氟化芳基(例如五氟苯基)酰卤的反应来制备。共反应物取决于L的性质。然而,氟化芳基(例如五氟苯基)酰氯与二醇或二胺的反应通常是有用的。F-Ar F -L-Ar F' -F can be prepared by reaction of a suitable fluorinated aryl (eg pentafluorophenyl) acid halide. The co-reactants depend on the nature of L. However, the reaction of fluorinated aryl (eg, pentafluorophenyl) acid chlorides with diols or diamines is often useful.

例如,F-ArF-L-ArF’-F可以通过F-ArF-COX或F-ArF-SO2X(X=Cl,Br)与HO-R-OH或NHY-R-NHY(Y=H,烷基,或芳基,优选烷基或芳基,以便在最终产物中有改进的溶解度)(R=亚烷基,亚环烷基)进行反应形成F-ArF-L-ArF’-F来制得。For example, F-Ar F -L-Ar F '-F can be combined with HO-R-OH or NHY-R-NHY by F-Ar F -COX or F-Ar F -SO 2 X (X=Cl, Br) (Y = H, alkyl, or aryl, preferably alkyl or aryl for improved solubility in the final product) (R = alkylene, cycloalkylene) react to form F-Ar F -L -Ar F '-F to make.

对于乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯),这可以通过1摩尔当量的乙二胺与稍微过量的2摩尔当量的的五氟苄基氯反应产生乙二胺双(五氟苯甲酸盐)来制得。乙二醇双(五氟苯甲酸酯)然后可以与稍微过量的1摩尔当量的金属叠氮化物反应,生产乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)。For ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate), this can be achieved by 1 molar equivalent of ethylenediamine with a slight excess of 2 molar equivalents of pentafluorobenzyl It is prepared by the reaction of base chloride to produce ethylenediamine bis(pentafluorobenzoate). Ethylene glycol bis(pentafluorobenzoate) can then be reacted with a slight excess of 1 molar equivalent of metal azide to produce ethylene glycol bis(4-azido-2,3,5,6-tetrafluoro parabens).

对于乙二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺),这可以通过1摩尔当量的乙二胺与稍微过量的2摩尔当量的五氟苯磺酰氯反应生产乙二胺双(五氟苯磺酰胺)来制备。乙二胺双(五氟苯磺酰胺)然后可以与稍微过量的1摩尔当量的金属叠氮化物反应,生产乙二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺)。For ethylenediaminebis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide), this can be achieved by 1 molar equivalent of ethylenediamine with a slight excess of 2 molar equivalents of pentafluorobenzenesulfonyl chloride Reaction to produce ethylenediamine bis (pentafluorobenzenesulfonamide) to prepare. Ethylenediaminebis(pentafluorobenzenesulfonamide) can then be reacted with a slight excess of 1 molar equivalent of metal azide to produce ethylenediaminebis(4-azido-2,3,5,6-tetrafluorobenzene sulfonamide).

对于步骤(i),理想地,该溶液包括聚合物和交联用结构部分的共混物/混合物。然而,在另一个实施方案中,溶液另外可以含有其中交联用结构部分键接于聚合物或低聚物上(典型地作为侧基)的聚合物或低聚物。For step (i), ideally, the solution comprises a blend/mixture of polymers and crosslinking moieties. However, in another embodiment, the solution may additionally contain a polymer or oligomer in which a crosslinking moiety is bonded to the polymer or oligomer, typically as a pendant group.

在这一实施方案,特别优选的交联用结构部分是聚合物或低聚物的主链的一部分或作为侧链连接于聚合物或低聚物上,和有利地,交联利用下述机理来进行,据此机理该交联反应包括在交联用结构部分和聚合物或低聚物单元之间的键形成反应,与在交联用结构部分本身之间的键形成反应不同。换句话说,在步骤(ii)中,交联用结构部分基本上没有自偶联或自聚合。In this embodiment, particularly preferred moieties for crosslinking are part of the backbone of the polymer or oligomer or attached as a side chain to the polymer or oligomer, and advantageously the crosslinking utilizes the following mechanism According to which mechanism the crosslinking reaction involves a bond forming reaction between the crosslinking moiety and the polymer or oligomer unit, as opposed to a bond forming reaction between the crosslinking moiety itself. In other words, there is substantially no self-coupling or self-polymerization of the crosslinking moiety in step (ii).

在这一实施方案,在包括交联用结构部分的聚合物或低聚物中的优选的结构单元具有通式III或IV:In this embodiment, preferred structural units in polymers or oligomers comprising a crosslinking moiety have the general formula III or IV:

其中ArF包括取代的或未被取代的氟化芳基和R是在聚合物或低聚物的主链中的结构单元(典型地重复单元)。where Ar F comprises a substituted or unsubstituted fluorinated aryl group and R is a structural unit (typically a repeating unit) in the backbone of the polymer or oligomer.

这些优选的交联用结构部分包括叠氮基,和因此,这些交联用结构部分具有以上关于根据本发明的优选交联剂的第一实施方案所述的相同优点。These preferred crosslinking moieties comprise azido groups, and thus these crosslinking moieties have the same advantages as described above with respect to the first embodiment of the preferred crosslinking agent according to the invention.

在通式III和IV中,ArF能够与以上关于通式II任何地方的定义相同。In formulas III and IV, Ar F can be as defined anywhere above for formula II.

在通式III和IV中,优选地ArF包括取代的或未被取代的氟化苯基或萘基基团,更优选全氟苯基或全氟萘基团。最优选地,ArF包括全氟苯基团。In formulas III and IV, preferably Ar F comprises a substituted or unsubstituted fluorinated phenyl or naphthyl group, more preferably a perfluorophenyl or perfluoronaphthyl group. Most preferably, Ar F includes perfluorophenyl groups.

一般对于本发明的方法,在步骤(i)中的沉积例如通过任何合适溶液-处理方法来实现。在这方面,可以提到喷墨式印刷,离心浇铸,丝网印刷,浸渍涂敷,和胶版印刷。In general for the process of the invention, the deposition in step (i) is achieved, for example, by any suitable solution-processing method. In this connection, mention may be made of ink-jet printing, centrifugal casting, screen printing, dip coating, and offset printing.

基材的合适材料将取决于所形成的聚合物器件。对于LED和光电二极管/光检测器,优选的基材包括在玻璃上的ITO层,在PET上的ITO层,在Si上的ITO层等等。对于FET,优选的基材包括玻璃,PET,聚碳酸酯等等的层。基材可以本身包括层压体结构。换句话说,基材可以本身包括多种不同的层。Suitable materials for the substrate will depend on the polymer device being formed. For LEDs and photodiodes/photodetectors, preferred substrates include ITO layers on glass, ITO layers on PET, ITO layers on Si, and the like. For FETs, preferred substrates include layers of glass, PET, polycarbonate, and the like. The substrate may itself comprise a laminate structure. In other words, the substrate may itself comprise a variety of different layers.

如上所提及,在本发明方法的步骤(ii)中,在步骤(i)中形成的层变成不可溶的。为了实现这一不溶解性,当在步骤(i)中形成的层经历交联条件时在步骤(ii)中必须发生足够程度的交联。为了在步骤(ii)达到所需程度的交联,在步骤(i)中沉积的溶液中所需的交联用结构部分的精确量(在规定范围内)将取决于聚合物的分子量分布特征。一般,聚合物的分子量越高,所需交联剂的量越低。所需的最低量适宜由凝胶-分数实验来测定。这一实验可以如下进行:As mentioned above, in step (ii) of the method of the invention, the layer formed in step (i) becomes insoluble. In order to achieve this insolubility, a sufficient degree of crosslinking must occur in step (ii) when the layer formed in step (i) is subjected to crosslinking conditions. The precise amount (within specified ranges) of the crosslinking moieties required in the solution deposited in step (i) in order to achieve the desired degree of crosslinking in step (ii) will depend on the molecular weight distribution characteristics of the polymer . In general, the higher the molecular weight of the polymer, the lower the amount of crosslinker required. The minimum amount required is suitably determined by gel-fraction experiments. This experiment can be performed as follows:

·将聚合物或低聚物以在合适溶剂中的试验浓度(例如在芳族烃溶剂中的0.5-2.5wt%)与在0.05-5mol%范围内的浓度(基于在溶液中交联基团和聚合物/低聚物的总摩尔数)的交联基团进行共混;或用该分数的交联用结构部分来合成该聚合物。The polymer or oligomer is tested at a concentration in a suitable solvent (for example 0.5-2.5 wt% in an aromatic hydrocarbon solvent) and at a concentration in the range of 0.05-5mol% (based on crosslinking groups in solution and total moles of polymer/oligomer) of crosslinking groups; or use this fraction of crosslinking moieties to synthesize the polymer.

·通过旋涂或喷墨印刷浇铸膜和然后固化;Cast films by spin coating or inkjet printing and then curing;

·由轮廓测定法、椭圆光度法或干涉测量法测量厚度;Measurement of thickness by profilometry, ellipsometry or interferometry;

·让膜暴露于100mJ/cm2剂量的交联辐射。• Expose the membrane to a dose of 100 mJ/ cm2 of crosslinking radiation.

·将膜在正常地溶解聚合物的溶剂中浸泡(或显影),然后吹干或旋转除去溶剂;Soak (or develop) the film in a solvent that normally dissolves the polymer, then blow dry or spin to remove the solvent;

·再次测量膜厚度;Re-measure the film thickness;

·在不同的交联用结构部分的摩尔比率下重复以上序列,直至实现不溶解性和所需厚度为止。• Repeat the above sequence at different molar ratios of crosslinking moieties until insolubility and desired thickness are achieved.

聚合物或低聚物在溶液中的优选浓度范围是在交联用结构部分的添加之前的0.5-2.5wt%。The preferred concentration range of the polymer or oligomer in the solution is 0.5-2.5% by weight before the addition of the crosslinking moiety.

在步骤(ii)中形成的交联的聚合物有利地是导体性,半导体性或绝缘聚合物。优选地,交联聚合物是半导体聚合物。The crosslinked polymer formed in step (ii) is advantageously a conducting, semiconducting or insulating polymer. Preferably, the crosslinked polymer is a semiconducting polymer.

当聚合物存在于在步骤(i)中使用的溶液中并且交联用结构部分与聚合物混合时,理想地,在溶液中的聚合物可以是导体性,半导体性或绝缘聚合物。优选地,在步骤(i)中的溶液中的聚合物是半导体聚合物。当在溶液中的聚合物是半导体聚合物时,在步骤(ii)中固化该层有利地基本上不影响聚合物的半导体性能。When the polymer is present in the solution used in step (i) and the crosslinking moiety is mixed with the polymer, ideally the polymer in solution may be a conducting, semiconducting or insulating polymer. Preferably, the polymer in the solution in step (i) is a semiconducting polymer. When the polymer in solution is a semiconducting polymer, curing the layer in step (ii) advantageously does not substantially affect the semiconducting properties of the polymer.

与半导体性聚合物相反,导电聚合物典型地被重度掺杂(>5mol%,按重复单元)成导电状态。结果,导电聚合物典型地具有>1018cm-3的电荷载流子浓度。“导电聚合物”典型地指具有>1×10-5S/cm的导电性的聚合物。照这样,它们的电性质对附加杂质基本上不敏感。此类导电聚合物主要用作传输线或电极接头。重要的是它们常常具有透射窗口,后者大大地扩展到可见光、紫外和深紫外光谱区的各个部分,对于光致图案化工艺有提高的宽松性(laxity)。In contrast to semiconducting polymers, conducting polymers are typically heavily doped (>5 mol%, by repeating unit) into a conducting state. As a result, conducting polymers typically have a charge carrier concentration >10 18 cm −3 . "Conductive polymer" typically refers to a polymer having a conductivity > 1 x 10 -5 S/cm. As such, their electrical properties are substantially insensitive to additional impurities. Such conductive polymers are mainly used as transmission lines or electrode connectors. Importantly, they often have transmission windows that extend greatly into various parts of the visible, ultraviolet and deep ultraviolet spectral regions, with increased laxity for photopatterning processes.

半导体聚合物典型地是未掺杂的或以低浓度(典型地0.001mol%或更少)固有地掺杂。与导电聚合物相反,半导体聚合物典型地具有<1015cm-3的电荷载流子浓度。“半导体聚合物”典型地指具有<1×10-8S/cm的导电率的聚合物。这些聚合物主要形成了包括LED、FET和PV在内的各种聚合物器件技术的核芯。它们典型地在以上所解释的可见光-紫外线区中具有相当窄的透射窗口。它们还具有对杂质量更加敏感的重要和独特的传输和光物理性能。Semiconducting polymers are typically undoped or inherently doped at low concentrations (typically 0.001 mol % or less). In contrast to conducting polymers, semiconducting polymers typically have a charge carrier concentration of <10 15 cm −3 . A "semiconducting polymer" typically refers to a polymer having a conductivity &lt; 1 x 10&lt;&quot;8&gt; S/cm. These polymers primarily form the core of various polymer device technologies including LEDs, FETs and PVs. They typically have a rather narrow transmission window in the visible-ultraviolet region explained above. They also possess important and unique transport and photophysical properties that are more sensitive to the amount of impurities.

本发明人已经发现,半导体聚合物能够根据本发明来交联,而在功能上基本上没有损失。The inventors have found that semiconducting polymers can be crosslinked according to the present invention with substantially no loss of functionality.

尤其,本发明人已发现交联用结构部分实际上对各种的共轭聚合物膜的光致发光和电场致发光性能没有影响,特别当以0.1-0.5mol%的量使用时且当聚合物的分子量足够地高(>300,000)时。In particular, the inventors have found that the crosslinking moiety has practically no effect on the photoluminescent and electroluminescent properties of various conjugated polymer films, especially when used in an amount of 0.1-0.5 mol% and when polymerized When the molecular weight of the compound is sufficiently high (>300,000).

本发明人已经发现,在本发明中描述的交联用结构部分和交联方法事实上甚至与宽带隙材料,尤其蓝色EL聚合物,例如在WO03/095586中所述相媲美。本工艺没有引入激子或电荷阱,后者损害这些特别敏感材料的器件性能。The inventors have found that the crosslinking moieties and crosslinking methods described in the present invention are in fact even comparable to wide bandgap materials, especially blue EL polymers, as described for example in WO03/095586. The process does not introduce excitons or charge traps, which impair device performance in these particularly sensitive materials.

对于低分子量材料,需要使用较高浓度的交联用结构部分(>0.5%),和在一些情况下,这将开始对于聚合物的光致发光效率具有有害影响,如在图11中对于交联用结构部分乙二醇双(对-叠氮基-2,3,5,6-四氟苯甲酸酯)所示。在许多情况下,光致发光效率能够通过退火部分地恢复。For low molecular weight materials, higher concentrations of crosslinking moieties (>0.5%) need to be used, and in some cases this will start to have a detrimental effect on the photoluminescent efficiency of the polymer, as in Figure 11 for crosslinking. The combined structure is represented by ethylene glycol bis(p-azido-2,3,5,6-tetrafluorobenzoate). In many cases, photoluminescent efficiency can be partially restored by annealing.

聚合物XI:Polymer XI:

聚合物XII:Polymer XII:

交联用结构部分: Moieties for cross-linking:

曝光条件:254-nm Hg线;1mW/cm2,2minExposure conditions: 254-nm Hg line; 1mW/cm 2 , 2min

交联用结构部分在高浓度下的不希望有的影响能够进一步通过增加在交联用结构部分上的空间体积来最大程度减少。对于通式II的交联用结构部分,这能够例如通过L,或在ArF,ArF’和/或L上的取代基的合适选择来实现。例如,下面系列相对于光致发光熄灭来进行观察:The undesired effect of the crosslinking moiety at high concentrations can further be minimized by increasing the steric volume on the crosslinking moiety. For the crosslinking moieties of the general formula II this can be achieved, for example, by a suitable choice of L, or of substituents on Ar F , Ar F ' and/or L. For example, the following series are observed relative to photoluminescence extinction:

XVI>XVII>XVIIIXVI>XVII>XVIII

所以,如果由于需要交联的聚合物的低分子量而使得交联用结构部分需要以高浓度存在,和因此光致发光猝熄变成一个问题,则在全氟化环附近具有较高空间体积的交联用结构部分,例如2-三氟甲基取代化合物XVIII,能够被选择以减轻或完全地抑制该问题。So, if the crosslinking moiety needs to be present in high concentration due to the low molecular weight of the polymer that needs to be crosslinked, and therefore photoluminescence quenching becomes an issue, then there is a higher steric volume near the perfluorinated ring The crosslinking moiety of , for example 2-trifluoromethyl substituted compound XVIII, can be chosen to alleviate or completely suppress this problem.

这说明了氟化苯基叠氮化物在为各种共轭聚合物提供有效交联,但不损害聚合物的所需光物理和电子性能上的多用途。This illustrates the versatility of fluorinated phenylazides in providing efficient crosslinking to various conjugated polymers without compromising the desired photophysical and electronic properties of the polymers.

优选聚合物或低聚物骨架是至少部分地共轭的。此外,在一个实施方案中,聚合物或低聚物骨架优选是基本上或甚至完全地共轭的。Preferably the polymer or oligomer backbone is at least partially conjugated. Furthermore, in one embodiment, the polymer or oligomer backbone is preferably substantially or even completely conjugated.

对于聚合物或低聚物的结构,优选它包括在侧链或主链中的多个饱和烃链段(-CH2-和-CH-)。优选的是聚合物或低聚物包括许多的脂族氢。As for the structure of the polymer or oligomer, it is preferable that it includes a plurality of saturated hydrocarbon segments (-CH 2 - and -CH-) in the side chain or the main chain. It is preferred that the polymer or oligomer include a plurality of aliphatic hydrogens.

这些链段在聚合物或低聚物中的优选重量分数是10-100%,对于半导体聚合物优选的重量分数是10-70%。The preferred weight fraction of these segments in the polymer or oligomer is 10-100%, for semiconducting polymers the preferred weight fraction is 10-70%.

优选的交联的半导体聚合物包括重复单元Ar1,后者包括:Preferred crosslinked semiconducting polymers comprise repeating units Ar 1 comprising:

(1)取代的或未被取代的亚苯基或芳基亚乙烯基,如对-亚苯基亚乙烯基;(1) Substituted or unsubstituted phenylene or aryl vinylene, such as p-phenylene vinylene;

(2)9,9-二取代的芴,如9,9-二烷基芴(它可以进一步被取代);(2) 9,9-disubstituted fluorenes, such as 9,9-dialkylfluorenes (which may be further substituted);

(3)取代的或未被取代的三芳基胺;(3) substituted or unsubstituted triarylamines;

(4)未被取代的或取代的杂芳族单元如噻吩,苯并噻二唑,喹啉,吡啶,优选取代的类似物;或(4) Unsubstituted or substituted heteroaromatic units such as thiophene, benzothiadiazole, quinoline, pyridine, preferably substituted analogues; or

(5)未被取代的或取代的噁二唑。(5) Unsubstituted or substituted oxadiazoles.

优选的取代基包括烷基,环烷基,烷氧基,芳基,和芳氧基。Preferred substituents include alkyl, cycloalkyl, alkoxy, aryl, and aryloxy.

聚合物可以进一步含有与Ar1相结合的一个或多个共重复单元。优选的共重复单元包括对位-连接的未被取代的或取代的亚苯基;未被取代的或取代的亚苯基亚乙烯基;2,5-连接的取代的或未被取代的苯并噻二唑;2,5-连接的取代或未被取代的噻吩;并噻吩或三联噻吩,取代的或未被取代的三芳基胺或双(三芳基胺)。特别优选的是,当Ar1包括9,9-二取代的芴时,交联聚合物含有一个或多个共重复单元。The polymer may further contain one or more co-repeat units in combination with Ar 1 . Preferred co-repeat units include para-linked unsubstituted or substituted phenylene; unsubstituted or substituted phenylene vinylene; 2,5-linked substituted or unsubstituted phenylene thiadiazoles; 2,5-linked substituted or unsubstituted thiophenes; and thiophenes or terthiophenes, substituted or unsubstituted triarylamines or bis(triarylamines). It is especially preferred that the crosslinked polymer contains one or more co-repeat units when Ar 1 comprises a 9,9-disubstituted fluorene.

所有这些聚合物能够根据本发明来交联。All these polymers can be crosslinked according to the invention.

当然,聚合物或低聚物必须是可溶的,为的是它在步骤(i)中处于溶液中。为此目的,聚合物或低聚物可以包括增溶基团。优选的增溶基团包括烷基,烷氧基芳基,环烷基,芳氧基,和环烷基氧基。Of course, the polymer or oligomer must be soluble in order for it to be in solution in step (i). For this purpose, the polymer or oligomer may comprise solubilizing groups. Preferred solubilizing groups include alkyl, alkoxyaryl, cycloalkyl, aryloxy, and cycloalkyloxy.

优选的是该交联用结构部分具有在深紫外的窄透射窗口中有吸收。典型地,这是在200nm到300nm,更优选245到270nm,再更优选250nm到260nm范围内。交联用结构部分的吸收能够通过UV可见的吸收光谱法测量。It is preferred that the crosslinking moiety has absorption in a narrow transmission window in the deep UV. Typically this is in the range of 200nm to 300nm, more preferably 245 to 270nm, even more preferably 250nm to 260nm. The absorption of the crosslinking moiety can be measured by UV visible absorption spectroscopy.

交联用结构部分有利地在这一范围内具有合适的吸收,因为这对应于为许多半导体聚合物常见的透射(transition)窗口。因此,聚合物的交联和图像化能够在低曝光剂量下完成。The crosslinking moiety advantageously has a suitable absorption in this range, since this corresponds to a transition window common to many semiconducting polymers. Therefore, cross-linking and imaging of polymers can be accomplished at low exposure doses.

在步骤(ii)中形成的固化层的优选厚度是在500nm或更低的范围内。当在步骤(ii)中的固化通过暴露于紫外线辐射来进行时,所形成的不溶性层能够在一次合适的UV曝光之后是500nm厚度至几个nm厚度。如果需要,最终厚度大于500nm的各层可以通过重复的涂敷和固化来制造。所需的最终膜厚度取决于最终用途。原则对于由该方法制造的层的数量没有限制。A preferred thickness of the cured layer formed in step (ii) is in the range of 500 nm or less. When the curing in step (ii) is performed by exposure to UV radiation, the insoluble layer formed can be 500 nm thick to a few nm thick after a suitable UV exposure. Layers with a final thickness greater than 500 nm can be produced by repeated coating and curing, if desired. The desired final film thickness depends on the end use. In principle there is no limit to the number of layers produced by this method.

在步骤(ii)中形成的不溶性层的所需厚度在某种程度上取决于层的功能。当该层是在聚合物LED中的注入中间层时,优选的厚度是在5到20nm范围内。当该层是电荷传输层时,在例如光电二极管中,优选的厚度是在10到50nm范围内。当该层是在波导器件中的包覆层时,优选的厚度是在100到400nm范围内。当该层是在FET的通道层时,优选的厚度是在20到300nm范围内。The desired thickness of the insoluble layer formed in step (ii) depends to some extent on the function of the layer. When the layer is an implanted interlayer in a polymer LED, the preferred thickness is in the range of 5 to 20 nm. When the layer is a charge transport layer, eg in a photodiode, the preferred thickness is in the range of 10 to 50 nm. When the layer is a cladding layer in a waveguide device, the preferred thickness is in the range of 100 to 400 nm. When the layer is in the channel layer of a FET, the preferred thickness is in the range of 20 to 300 nm.

在一个实施方案中在步骤(i)沉积的层可以是聚合物共混物或复合材料。可以有利地进行交联以便提高固化聚合物共混物或复合材料的热稳定性或优化最终的固化层对于溶剂溶解的耐受性。In one embodiment the layer deposited in step (i) may be a polymer blend or composite. Crosslinking may be advantageously performed in order to increase the thermal stability of the cured polymer blend or composite or to optimize the resistance of the final cured layer to solvent dissolution.

对于在步骤(ii)中的固化条件,当固化包括让该层曝露于紫外线辐射时,这优选在1-100mW/cm2的功率下,和优选的曝光时间是在约0.1-100s范围之内。在被固化的层上的能量剂量优选是1-100mJ/cm2,更优选5-20mJ/cm2For the curing conditions in step (ii), when curing involves exposing the layer to ultraviolet radiation, this is preferably at a power of 1-100 mW/cm 2 , and the preferred exposure time is in the range of about 0.1-100 s . The energy dose on the cured layer is preferably 1-100 mJ/cm 2 , more preferably 5-20 mJ/cm 2 .

该层在步骤(ii)中固化,以使它变成不可溶的。这意味着该层和因此聚合物没有完全地溶解在任何溶剂(在交联之前该层可溶于其中)中。如上所述,实现这一结果取决于对于所述具体层而言的所需交联水平。一般,固化的层在常用有机溶剂中变成不可溶的。此外,一般该层将在芳族烃溶剂中变成不可溶的,该芳族烃溶剂包括,甲苯,二甲苯,均三甲苯,均四甲苯,氢化萘,等等,和卤化溶剂如氯仿,氯苯等等。这些溶剂因此可用于在器件制造中的后续处理中。This layer is cured in step (ii) so that it becomes insoluble. This means that the layer and thus the polymer is not completely soluble in any solvent in which the layer is soluble prior to crosslinking. Achieving this result depends on the desired level of crosslinking for the particular layer, as described above. Typically, the cured layer becomes insoluble in common organic solvents. Furthermore, generally the layer will become insoluble in aromatic hydrocarbon solvents including, toluene, xylene, mesitylene, durene, hydrogenated naphthalene, etc., and halogenated solvents such as chloroform, Chlorobenzene and so on. These solvents are thus available for subsequent processing in device fabrication.

测定不溶解性的一个特定试验可以描述如下:A specific test for determining insolubility can be described as follows:

·通过旋涂或喷墨印刷来浇铸膜,然后固化;Films are cast by spin coating or inkjet printing and then cured;

·由轮廓测定法,椭圆光度法或干涉测量法精确地测量厚度,将它称作d1Accurately measure the thickness by profilometry, ellipsometry or interferometry, call it d1 ;

·将膜在可以正常地溶解聚合物的溶剂中浸泡(或显影),然后吹干或旋转干燥;Soak (or develop) the film in a solvent that normally dissolves the polymer, then blow dry or spin dry;

·再次测量膜厚度,将它称作d2• Measure the film thickness again, call it d2 .

当该层是完全地“不可溶的”时,在浸泡该膜/层之后膜厚度没有减少(即d2/d1=1.0)。然而,在许多情况下,该层只须是部分地不可溶的。假若保留的分数(d2/d1)是已知的,则任何减少能够在器件的设计中允许。然而,通常d2/d1需要大于0.4,优选大于0.5是有用的。When the layer is completely "insoluble", there is no decrease in film thickness after soaking the film/layer (ie d 2 /d 1 =1.0). In many cases, however, this layer only has to be partially insoluble. Provided the retained fraction (d 2 /d 1 ) is known, any reduction can be allowed in the design of the device. Generally, however, d 2 /d 1 needs to be greater than 0.4, preferably greater than 0.5 to be useful.

一般,在步骤(ii)中固化之后,该层可以与溶剂接触。已交联聚合物不溶于溶剂(等价的未交联聚合物可溶于其中)中的事实意味着该层所接触的溶剂可以选自包括常用有机溶剂在内的广阔类型的溶剂。这一接触不会溶解在步骤(ii)中形成的交联聚合物。Typically, after curing in step (ii), the layer can be contacted with a solvent. The fact that the crosslinked polymer is insoluble in solvents (in which equivalent uncrosslinked polymers are soluble) means that the solvent with which the layer comes into contact can be selected from a broad class of solvents including common organic solvents. This contact does not dissolve the crosslinked polymer formed in step (ii).

任选地,在步骤(ii)中固化之后,该层可以用合适溶剂洗涤。当其中该层在步骤(ii)中进行图案化交联时可以包括该洗涤步骤。这包括将步骤(i)的层的仅仅所选择区域暴露于在步骤(ii)中的固化条件。这例如可通过掩模曝光于紫外射线来实现。在曝光区域中的材料变得不可溶,而在未曝光区域中的材料将保持可溶性。这使得在未曝光区域中的材料可以在洗涤步骤中被除去。Optionally, after curing in step (ii), the layer may be washed with a suitable solvent. This washing step may be included when the layer is patterned crosslinked in step (ii). This involves exposing only selected areas of the layer of step (i) to the curing conditions in step (ii). This can be achieved, for example, by exposing a mask to UV radiation. Material in the exposed areas becomes insoluble, while material in the unexposed areas will remain soluble. This allows material in the unexposed areas to be removed during the washing step.

任选地,在步骤(ii)中固化之后,该层可以由湿化学方法,由合适化学反应进行化学改性。此类化学反应可以包括芳族磺化,氨甲基化,或其它衍生化反应。Optionally, after curing in step (ii), the layer may be chemically modified by wet chemical methods, by suitable chemical reactions. Such chemical reactions may include aromatic sulfonation, aminomethylation, or other derivatization reactions.

磺化将SO3H基团引入到一部分的聚合物重复单元中。这能够用于制造例如自掺杂的导体聚合物层。这一特殊反应能够在宽范围的条件下进行,例如让该层在-60℃下与氯磺酸的稀氯仿溶液进行反应。Sulfonation introduces SO3H groups into a portion of the polymer repeat units. This can be used to produce, for example, self-doped conducting polymer layers. This particular reaction can be performed under a wide range of conditions, such as allowing the layer to react with chlorosulfonic acid in dilute chloroform at -60°C.

可能有用的另一个反应是由交联反应引入的NH基团的甲基化反应。这一反应将用潜在地更稳定的甲基置换该氢原子。这一特殊反应能够通过让该层在室温下与甲基碘反应,然后用在氯仿-乙醇混合物中的三乙胺洗涤来进行。所以在聚合物层变成不可溶的之后,能够进行各种化学反应以改变或调节该层的本体性质和表面性质。Another reaction that may be useful is the methylation of NH groups introduced by crosslinking reactions. This reaction will replace the hydrogen atom with a potentially more stable methyl group. This particular reaction can be performed by allowing the layer to react with methyl iodide at room temperature, followed by washing with triethylamine in a chloroform-ethanol mixture. So after the polymer layer becomes insoluble, various chemical reactions can be performed to change or adjust the bulk and surface properties of the layer.

附加(第二)层可以沉积在由本发明方法形成的层上。在这方面,考虑到在步骤(ii)中的固化,在本发明方法中形成的层不溶于用于沉积附加(第二)层的任何溶液中。Additional (second) layers may be deposited on the layer formed by the method of the invention. In this regard, the layer formed in the process of the invention is insoluble in any solution used to deposit the additional (second) layer, taking into account the curing in step (ii).

任选地,本发明方法可以另外包括在根据本发明第一方面的方法的步骤(ii)中形成的不可溶的聚合物进行退火的步骤。退火可以按照下面根据本发明第六方面所述的方法来进行。Optionally, the method of the invention may additionally comprise the step of annealing the insoluble polymer formed in step (ii) of the method according to the first aspect of the invention. Annealing can be performed according to the method described below according to the sixth aspect of the present invention.

典型地,在根据本发明第一方面的方法中的聚合物器件是光学器件。优选,器件是聚合物发光器件,聚合物晶体管如场效应晶体管,光检测器,光致电压器件,波导器件,或分布布拉格反射器。Typically the polymeric device in the method according to the first aspect of the invention is an optical device. Preferably, the device is a polymer light emitting device, a polymer transistor such as a field effect transistor, a photodetector, a photovoltaic device, a waveguide device, or a distributed Bragg reflector.

聚合物LED器件可以用由本发明的方法沉积的交联的空穴-传输聚合物层来制造。器件进一步可以包括发光的聚合物层和/或电子-传输聚合物层和/或激子-封阻聚合物层。任选地,这些附加层能够根据本发明方法来沉积。对于聚合物LED,例如可以设计一种结构,它包括在阳极上形成的空穴-注入和电子-封阻聚合物层,接着有发光的聚合物层,然后是电子-注入,空穴-封阻和激子-封阻聚合物层,然后有阴极。有利地,合适的聚合物也可以作为发光层来图案化,得到如以上讨论的全色显示器。另外,该发光层能够是聚合物的交联共混物的膜。Polymer LED devices can be fabricated with crosslinked hole-transporting polymer layers deposited by the method of the present invention. The device may further comprise a light emitting polymer layer and/or an electron-transporting polymer layer and/or an exciton-blocking polymer layer. Optionally, these additional layers can be deposited according to the method of the invention. For polymer LEDs, for example, a structure can be designed that includes a hole-injecting and electron-blocking polymer layer formed on the anode, followed by a light-emitting polymer layer, followed by an electron-injecting, hole-blocking polymer layer. blocking and exciton-blocking polymer layer, and then there is the cathode. Advantageously, suitable polymers can also be patterned as emissive layers, resulting in full color displays as discussed above. Alternatively, the light emitting layer can be a film of a crosslinked blend of polymers.

聚合物波导LED器件可以用由本发明方法沉积的一种或多种交联聚合物包覆层来制造。器件进一步包括发光芯层,它任选地可以根据本发明方法来沉积。波导器件特征在于比邻接包覆层(或外围层)有更高折光指数的芯层(或条带(strip))。芯层和包覆层可以各自包括一个或多个单层。因为它的较高折光指数,满足相位匹配条件的合适波长的光被全部内反射所截获并引导在芯层(或条带)中。该光能够在器件的边缘上发射或引导至另一个区域中,它在该区域中可以摆脱藕联(out-coupled)。以这一方式发射的光能够是高度方向性的以及充分地藕联于光学纤维。Polymer waveguide LED devices can be fabricated with one or more crosslinked polymer cladding layers deposited by the method of the present invention. The device further comprises a light emitting core layer, which optionally may be deposited according to the method of the invention. Waveguide devices are characterized by a core layer (or strip) having a higher refractive index than the adjacent cladding layer (or peripheral layer). The core and cladding layers may each comprise one or more monolayers. Because of its higher refractive index, light of the appropriate wavelength that satisfies the phase-matching condition is intercepted by total internal reflection and guided in the core (or strip). This light can be emitted on the edge of the device or directed into another region where it can be out-coupled. Light emitted in this manner can be highly directional and well coupled to optical fibers.

聚合物分布布拉格反射器可以使用由本发明方法沉积的交联的交替高折光指数和低折光指数聚合物多个层来制造。布拉格反射器包括高(nH)和低(nL)折光指数材料的多个四分之一波长厚度(dH,dL)层。满足布拉格条件(λ/2=nHdH+nLdL)的波长的光在堆叠体内强烈地反射。该布拉格反射器能够与另一个布拉格反射器或反光镜藕联以形成光谐振器。此类谐振器作为波长选择器有着重要用途。Polymer distributed Bragg reflectors can be fabricated using multiple layers of crosslinked alternating high and low refractive index polymers deposited by the method of the present invention. The Bragg reflector comprises multiple quarter-wavelength thickness ( dH , dL ) layers of high ( nH ) and low ( nL ) refractive index materials. Light having a wavelength satisfying the Bragg condition (λ/2=n H d H +n L d L ) is strongly reflected in the stack. The Bragg reflector can be coupled with another Bragg reflector or mirror to form an optical resonator. Such resonators have important uses as wavelength selectors.

聚合物微孔隙LED器件可以用由本发明方法沉积的一种或多种交联聚合物分布布拉格反射器来制造。器件进一步可以包括发光芯层。任选地,发光芯层可以根据本发明方法来沉积。Polymer microporous LED devices can be fabricated with one or more crosslinked polymer distributed Bragg reflectors deposited by the method of the present invention. The device may further include a light emitting core layer. Optionally, a luminescent core layer may be deposited according to the method of the invention.

聚合物FET器件可以用由本发明方法沉积的交联的半导体聚合物层来制造。器件进一步可以包括交联的绝缘性聚合物层。任选地,绝缘性聚合物层可以根据本发明方法来沉积。如果这一层在半导体层之前沉积则尤其是这样。器件可以是顶-栅,侧-栅或底-栅构型。对于聚合物FET,例如设计一种结构,它包括在源极和漏极之间的基材上形成的电荷传输半导体聚合物,接着是用作栅绝缘体的绝缘性聚合物。这一绝缘性聚合物层能够从用于沉积半导体聚合物(在它交联之后)的相同溶剂中沉积。Polymer FET devices can be fabricated with crosslinked semiconducting polymer layers deposited by the method of the present invention. The device may further comprise a cross-linked insulating polymer layer. Optionally, an insulating polymer layer may be deposited according to the method of the invention. This is especially the case if this layer is deposited before the semiconductor layer. Devices can be top-gate, side-gate or bottom-gate configurations. For polymer FETs, for example, a structure is designed that includes a charge-transporting semiconducting polymer formed on a substrate between the source and drain, followed by an insulating polymer that acts as a gate insulator. This insulating polymer layer can be deposited from the same solvent used to deposit the semiconducting polymer (after it has been crosslinked).

聚合物光致电压器件可以用包括交联聚合物共混物或聚合物复合材料的光响应层来制造。Polymer photovoltaic devices can be fabricated with photoresponsive layers comprising crosslinked polymer blends or polymer composites.

本发明的第二方面提供了聚合物器件,它由任何地方对于本发明第一方面定义的方法获得或可获得。该器件可以与在任何地方对于本发明第一方面的定义相同。在以上对于本发明第一方面描述的器件的任何一种中和在根据本发明的第二方面的器件中,阴极的优选材料包括碱土金属,如钡和钙。A second aspect of the invention provides a polymer device obtained or obtainable by a method as defined anywhere for the first aspect of the invention. The device may be as defined anywhere for the first aspect of the invention. In any of the devices described above for the first aspect of the invention and in devices according to the second aspect of the invention, preferred materials for the cathode include alkaline earth metals such as barium and calcium.

本发明的第三方面提供了根据本发明的第二方面的聚合物器件的用途。A third aspect of the invention provides the use of a polymer device according to the second aspect of the invention.

本发明的第四个方面提供了含有聚合物或低聚物和交联用结构部分的溶液,其特征在于该交联用结构部分以0.05-5mol%范围内的量存在,基于在溶液中聚合物或低聚物和交联用结构部分的总重量。A fourth aspect of the present invention provides a solution containing a polymer or oligomer and a crosslinking moiety, characterized in that the crosslinking moiety is present in an amount ranging from 0.05 to 5 mol %, based on polymerization in solution The total weight of polymers or oligomers and crosslinking moieties.

在本发明的第四个方面,聚合物或低聚物,交联用结构部分和溶剂可以与以上在任何地方对于本发明第一方面描述的相同。此外,它们在溶液中的浓度可以与以上在任何地方对于本发明第一方面描述的相同。In the fourth aspect of the invention, the polymer or oligomer, the moiety for crosslinking and the solvent may be the same as described anywhere above for the first aspect of the invention. Furthermore, their concentration in solution may be the same as described anywhere above for the first aspect of the invention.

优选该交联用结构部分与聚合物或低聚物混合。根据本发明第四个方面的优选溶液含有半导体聚合物。在一个特别优选的实施方案中,交联用结构部分具有通式II,其中ArF和ArF’各自是全氟苯基团。Preferably the crosslinking moiety is mixed with a polymer or oligomer. A preferred solution according to the fourth aspect of the invention contains a semiconducting polymer. In a particularly preferred embodiment, the crosslinking moiety has the general formula II, wherein ArF and ArF ' are each a perfluorophenyl group.

本发明的第五个方面提供了根据本发明第四个方面的溶液在制造如本发明的第一和第二方面所定义的聚合物器件中的用途。A fifth aspect of the invention provides the use of a solution according to the fourth aspect of the invention for the manufacture of a polymer device as defined in the first and second aspects of the invention.

本发明的第六方面提供了形成聚合物器件的方法,包括以下步骤:A sixth aspect of the present invention provides a method of forming a polymer device comprising the steps of:

(i)在基材上沉积包括聚合物或低聚物和交联用结构部分的溶液以形成涂层;(i) depositing a solution comprising a polymer or oligomer and a crosslinking moiety on a substrate to form a coating;

(ii)将在步骤(i)中形成的层在一定条件下固化而形成不可溶的交联聚合物;(ii) curing the layer formed in step (i) under certain conditions to form an insoluble cross-linked polymer;

(iii)将在步骤(ii)中形成的不可溶的聚合物退火;和(iii) annealing the insoluble polymer formed in step (ii); and

(iv)任选地将在步骤(ii)中形成的不可溶聚合物的表面或本体进行化学改性。(iv) optionally chemically modifying the surface or bulk of the insoluble polymer formed in step (ii).

在本发明第六方面的方法中,聚合物,低聚物,交联用结构部分和它们的浓度和交联条件优选可以与在任何地方对于本发明第一方面所定义的相同。在本发明的第六方面,交联用结构部分不是必要地以0.1-5mol%范围内的量存在于步骤(i)中。In the method of the sixth aspect of the present invention, polymers, oligomers, crosslinking moieties and their concentrations and crosslinking conditions may preferably be the same as defined everywhere for the first aspect of the present invention. In the sixth aspect of the present invention, the moiety for crosslinking is not necessarily present in step (i) in an amount ranging from 0.1 to 5 mol%.

优选地,在步骤(iii)中的退火是在120到200℃范围内的温度下进行的。Preferably, the annealing in step (iii) is performed at a temperature in the range of 120 to 200°C.

就本发明的第六方面而言,本发明人意外地发现在膜沉积和交联之后的退火步骤能够有利地至少部分地恢复在步骤(ii)中发生的任何所观察到的性能下降。With regard to the sixth aspect of the invention, the inventors have surprisingly found that an annealing step after film deposition and crosslinking advantageously at least partially restores any observed performance degradation that occurred in step (ii).

在根据本发明第六方面的方法的步骤(iv)中的化学改性可以按照对于本发明第一方面所定义的方法来进行。The chemical modification in step (iv) of the method according to the sixth aspect of the invention may be performed as defined for the first aspect of the invention.

本发明现在参考附图来更详细地描述,其中:The invention will now be described in more detail with reference to the accompanying drawings, in which:

图1显示了在不同的交联剂比率下典型的膜保留率(或胶凝点)特征。Figure 1 shows typical membrane retention (or gel point) profiles at different crosslinker ratios.

图2显示了在膜厚度和膜保留率之间的关系。Figure 2 shows the relationship between film thickness and film retention.

图3显示了具有TFB中间层的器件的器件特性。Figure 3 shows the device characteristics of the device with the TFB interlayer.

图4显示了与在图3中报道的器件类似但没有TFB中间层的类似器件的器件特性。Figure 4 shows the device characteristics of a similar device to that reported in Figure 3 but without the TFB interlayer.

图5显示了在实施例3中测量的电流密度与二极管电压的关系。FIG. 5 shows the current density versus diode voltage measured in Example 3. FIG.

图6显示了在实施例3中测量的亮度与二极管电压的关系。FIG. 6 shows the luminance measured in Example 3 versus the diode voltage.

图7显示了在实施例3中测量的外部量子效率与二极管电压的关系。FIG. 7 shows the external quantum efficiency measured in Example 3 as a function of diode voltage.

图8显示了根据实施例5的器件和没有交联剂的类似器件的器件特性的对比。Figure 8 shows a comparison of the device properties of a device according to Example 5 and a similar device without crosslinker.

图9显示了根据实施例6的FET的传输特性。FIG. 9 shows the transfer characteristics of the FET according to Example 6. FIG.

图10显示根据实施例7的器件的传输特性。FIG. 10 shows the transfer characteristics of the device according to Example 7. FIG.

图11显示了该交联用结构部分乙二醇双(对-叠氮基-2,3,5,6-四氟苯甲酸酯)在两种不同聚合物中的光致发光效率。Figure 11 shows the photoluminescence efficiency of the crosslinking moiety ethylene glycol bis(p-azido-2,3,5,6-tetrafluorobenzoate) in two different polymers.

曝光条件是:254-nmHg线;1mW/cm2,2min。Exposure conditions were: 254-nmHg line; 1 mW/cm 2 , 2 min.

图12显示在实施例8中描述的多层制造过程中收集的UV-可见光吸收光谱。FIG. 12 shows UV-visible absorption spectra collected during the multilayer fabrication process described in Example 8. FIG.

图13显示了描述在实施例8中的器件的光电流曲线。FIG. 13 shows the photocurrent curves of the device described in Example 8. FIG.

实施例Example

交联剂的合成:Synthesis of cross-linking agent:

使用下面的合成反应历程:二醇或二胺与合适的五氟苯基酰卤在酸清除剂存在下进行定量反应,和该产物然后与叠氮化钠定量地反应,在重结晶之后得到双(全氟苯基叠氮化物)交联剂。The following synthetic reaction scheme is used: a diol or diamine is reacted quantitatively with the appropriate pentafluorophenyl halide in the presence of an acid scavenger, and the product is then reacted quantitatively with sodium azide to give the bis (perfluorophenyl azide) crosslinker.

实施例1:乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)Example 1: Ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate)

将一起溶于10mL无水醚中的乙二醇(135mg,2.1mmol)和三乙胺(510mg,5.0mmol)添加到在10mL无水醚中的五氟苯甲酰氯(1.2g,5.0mmol)中。获得三乙基氯化铵的白色沉淀物,然后过滤。滤液用3×20mL水洗涤,用MgSO4干燥,和蒸发,回收乙二醇双(五氟苯甲酸酯)(I),为无色液体(产率,75%)。让在2.2ml水和3.7mL丙酮中的叠氮化钠(150mg,2.3mmol)然与在2mL丙酮中的I(500mg,1.1mmol)进行反应,并且在60℃加热板上搅拌一夜。获得白色沉淀物。溶液由蒸发减少至一半体积,滤出沉淀物(产率,80%)和在1∶3氯仿-己烷中重结晶两次,得到乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(II),为白色晶体。FTIR:2134(N3不对称伸缩),1731(C=O拉伸),1645,1483,1252(N3对称伸缩),在3000-3500没有酸OH谱带。Ethylene glycol (135 mg, 2.1 mmol) and triethylamine (510 mg, 5.0 mmol) dissolved together in 10 mL of dry ether were added to pentafluorobenzoyl chloride (1.2 g, 5.0 mmol) in 10 mL of dry ether middle. A white precipitate of triethylammonium chloride was obtained, which was then filtered. The filtrate was washed with 3 x 20 mL of water, dried over MgSO 4 , and evaporated to recover ethylene glycol bis(pentafluorobenzoate) (I) as a colorless liquid (yield, 75%). Sodium azide (150 mg, 2.3 mmol) in 2.2 ml water and 3.7 mL acetone was then reacted with I (500 mg, 1.1 mmol) in 2 mL acetone and stirred overnight on a 60°C hot plate. A white precipitate was obtained. The solution was reduced to half volume by evaporation, and the precipitate was filtered off (yield, 80%) and recrystallized twice from 1:3 chloroform-hexane to give ethylene glycol bis(4-azido-2,3, 5,6-Tetrafluorobenzoate) (II), as white crystals. FTIR: 2134 (N 3 asymmetric stretching), 1731 (C=O stretching), 1645, 1483, 1252 (N 3 symmetric stretching), no acid OH band at 3000-3500.

实施例2:乙二胺双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)Example 2: Ethylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzoate)

将一起溶于10mL无水醚中的乙二胺(130mg,2.1mmol)和三乙胺(510mg,5.0mmol)添加到在10mL无水醚中的五氟苯甲酰氯(1.2g,5.0mmol)中。获得白色沉淀物,过滤。残留物用氯仿,然后用水洗涤,然后过滤回收乙二胺双(五氟苯甲酸酯)(III),为白色针形结晶(产率,100%)。让在1.7mL水和4.0mL DMF中的叠氮化钠(270mg,4.2mmol)与在20mL DMF中的III(870mg,2.0mmol)进行反应,并且在60℃加热板上搅拌一夜。获得白色沉淀物。溶液由蒸发减少至一半体积,滤出沉淀物(产率,35%),干燥和从DMF中重结晶,得到白色晶体形式的乙二胺双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(IV)。FTIR:2129(N3不对称伸缩),1666(C=O拉伸),1554,1483,1242(N3对称伸缩),在3000-3500没有酸OH谱带。Ethylenediamine (130 mg, 2.1 mmol) and triethylamine (510 mg, 5.0 mmol) dissolved together in 10 mL of dry ether were added to pentafluorobenzoyl chloride (1.2 g, 5.0 mmol) in 10 mL of dry ether middle. A white precipitate was obtained which was filtered. The residue was washed with chloroform, then water, and then filtered to recover ethylenediamine bis(pentafluorobenzoate) (III) as white needle crystals (yield, 100%). Sodium azide (270 mg, 4.2 mmol) in 1.7 mL water and 4.0 mL DMF was reacted with III (870 mg, 2.0 mmol) in 20 mL DMF and stirred overnight on a 60° C. hot plate. A white precipitate was obtained. The solution was reduced to half volume by evaporation and the precipitate was filtered off (yield, 35%), dried and recrystallized from DMF to give ethylenediamine bis(4-azido-2,3,5, 6-tetrafluorobenzoate) (IV). FTIR: 2129 (N 3 asymmetric stretching), 1666 (C=O stretching), 1554, 1483, 1242 (N 3 symmetric stretching), no acid OH band at 3000-3500.

实施例3:乙二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺)Embodiment 3: Ethylenediamine bis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide)

将一起溶于8mL无水氯仿中的乙二胺(70mg,1.0mmol)和三乙胺(240mg,2.0mmol)添加到在2mL无水氯仿中的五氟苯磺酰氯(710mg,2.2mmol)中。获得白色沉淀物,过滤。滤液用3×4ml半饱和KCl水溶液洗涤,然后用MgSO4干燥,蒸发回收白色晶体形式的乙二胺双(五氟苯磺酰胺)(V)(产率,80%)。在1.0mL水和4.0mL丙酮中的叠氮化钠(105mg,1.6mmol)然后与V(390mg,0.76mmol)进行反应,并且在60℃加热板上搅拌一夜。获得白色沉淀物。溶液通过蒸发减少至一半体积,添加2mL水。沉淀物然后被滤出,干燥和从氯仿中重结晶,得到白色晶体形式的乙二胺双(4-叠氮基-2,3,5,6-四氟苯磺酰胺)(VI)。可溶于丙酮,异丙醇和二甲苯中,但不溶于水或己烷中。FTIR:3315(N-H拉伸),2130(N3不对称伸缩),1642,1493,1358(SO2不对称伸缩),1230(N3不对称伸缩),1169(SO2对称伸缩),989,在1650-2800没有水合的酸谱带。Ethylenediamine (70 mg, 1.0 mmol) and triethylamine (240 mg, 2.0 mmol) dissolved together in 8 mL of anhydrous chloroform were added to pentafluorobenzenesulfonyl chloride (710 mg, 2.2 mmol) in 2 mL of anhydrous chloroform . A white precipitate was obtained which was filtered. The filtrate was washed with 3 x 4 ml semi-saturated KCl aqueous solution, then dried over MgSO 4 and evaporated to recover ethylenediamine bis(pentafluorobenzenesulfonamide) (V) in the form of white crystals (yield, 80%). Sodium azide (105 mg, 1.6 mmol) in 1.0 mL water and 4.0 mL acetone was then reacted with V (390 mg, 0.76 mmol) and stirred overnight on a 60°C hot plate. A white precipitate was obtained. The solution was reduced to half volume by evaporation and 2 mL of water were added. The precipitate was then filtered off, dried and recrystallized from chloroform to give ethylenediaminebis(4-azido-2,3,5,6-tetrafluorobenzenesulfonamide) (VI) in the form of white crystals. Soluble in acetone, isopropanol and xylene, but insoluble in water or hexane. FTIR: 3315 (NH stretching), 2130 (N 3 asymmetric stretching), 1642, 1493, 1358 (SO 2 asymmetric stretching), 1230 (N 3 asymmetric stretching), 1169 (SO 2 symmetric stretching), 989, There is no hydrated acid band at 1650-2800.

实施例4:1,3-环己烷二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)与在实施例1中一样,但使用1,3-环己烷二醇。Example 4: 1,3-Cyclohexanediol bis(4-azido-2,3,5,6-tetrafluorobenzoate) As in Example 1, but using 1,3- Cyclohexanediol.

实施例5:1,4-环己烷二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)与在实施例1中一样,但使用1,4-环己烷二醇。Example 5: 1,4-Cyclohexanediol bis(4-azido-2,3,5,6-tetrafluorobenzoate) As in Example 1, but using 1,4- Cyclohexanediol.

实施例6:乙二醇双(4-叠氮基-2-三氟甲基-3,5,6-三氟苯甲酸酯)Example 6: Ethylene glycol bis(4-azido-2-trifluoromethyl-3,5,6-trifluorobenzoate)

以类似的方式,将一起溶于10mL无水醚中的乙二醇(2.1mmol)和三乙胺(5.0mmol)添加到在10mL无水醚中的2-三氟甲基-3,4,5,6-四氟苯甲酰氯(5.0mmol)中。获得三乙基氯化铵的白色沉淀物,并过滤出来。滤液用3×20mL水洗涤,用MgSO4干燥,和蒸发回收粗乙二醇双(2-三氟甲基-3,4,5,6-四氟苯甲酸酯)。让在2.2水和3.7mL丙酮中的叠氮化钠(150mg,2.3mmol)然后与在2mL丙酮中的I(1.1mmol)进行反应,并且在60℃加热板上搅拌一夜。溶液由蒸发减少至半体积,滤出沉淀物,然后在1∶5氯仿-己烷中重结晶两次。In a similar manner, ethylene glycol (2.1 mmol) and triethylamine (5.0 mmol) dissolved together in 10 mL of dry ether were added to 2-trifluoromethyl-3,4 in 10 mL of dry ether, 5,6-Tetrafluorobenzoyl chloride (5.0 mmol). A white precipitate of triethylammonium chloride was obtained, which was filtered off. The filtrate was washed with 3 x 20 mL of water, dried over MgSO4 , and evaporated to recover crude ethylene glycol bis(2-trifluoromethyl-3,4,5,6-tetrafluorobenzoate). Sodium azide (150 mg, 2.3 mmol) in 2.2 water and 3.7 mL acetone was then reacted with I (1.1 mmol) in 2 mL acetone and stirred overnight on a 60°C hot plate. The solution was reduced to half volume by evaporation, and the precipitate was filtered off and recrystallized twice from 1:5 chloroform-hexane.

(A)空穴-传输-和-电子-封阻中间层或中间层堆叠体的交联获得对中间层厚度和注入特征的精确控制:(A) Crosslinking of hole-transporting-and-electron-blocking interlayers or interlayer stacks to obtain precise control over interlayer thickness and injection characteristics:

实施例1(F8BT-发光器LED):Embodiment 1 (F8BT-illuminator LED):

a.通过使用丙酮,异丙醇和氮吹扫从预先图案化的ITO玻璃基板上除去光刻胶。ITO表面然后在筒形刻蚀器中暴露于氧等离子体10min(Tegal Barrel Etcher 421;典型条件:压力,450mbar;功率150W)。用1∶15的PEDT∶PSS比率配制的聚(3,4-亚乙基二氧基噻吩)∶聚苯乙烯磺酸盐(PEDT∶PSS)然后由水溶液旋涂,得到60-70nm厚度膜。膜在氮气中在设定于150℃的加热板上烘烤15min。a. Removal of photoresist from pre-patterned ITO glass substrates by purging with acetone, isopropanol and nitrogen. The ITO surface was then exposed to oxygen plasma for 10 min in a barrel etcher (Tegal Barrel Etcher 421; typical conditions: pressure, 450 mbar; power 150 W). Poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDT:PSS) formulated with a PEDT:PSS ratio of 1:15 was then spin-coated from aqueous solution to give 60-70 nm thick films. The films were baked under nitrogen for 15 min on a hot plate set at 150°C.

b.用相当于TFB重量的1.8%乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(I)配制的聚(9,9-二辛基芴-交替-[亚苯基-(N-对-2-丁基苯基)亚胺-亚苯基])(TFB)然后在氮气中由0.9w/v%混合-二甲苯溶液旋涂,得到15-nm厚度膜。膜然后在氮气中通过光掩模曝光于254-nm深紫外辐射达2min,在膜表面上有1mW/cm2的照度。b. Poly(9,9-dioctyl) formulated with 1.8% ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate) (I) corresponding to the weight of TFB Fluorene-alternating-[phenylene-(N-p-2-butylphenyl)imine-phenylene]) (TFB) was then spin-coated from a 0.9 w/v% mixed-xylene solution in nitrogen, A 15-nm thick film was obtained. The film was then exposed through a photomask to 254-nm deep ultraviolet radiation for 2 min in nitrogen with an illumination of 1 mW/ cm2 on the film surface.

(1.在阳极界面上的优选的中间层聚合物具有空穴-传输和电子-封阻性能。该聚合物还需要是稳定的,不参加不希望有的与发光聚合物之间的电化学反应,该反应会降低界面在操作中的电性质。举例性的中间层聚合物包括TFB和聚(三芳基胺)。(1. The preferred interlayer polymer on the anode interface has hole-transport and electron-blocking properties. The polymer also needs to be stable and not participate in unwanted electrochemical reactions with the light-emitting polymer , this reaction degrades the electrical properties of the interface in operation. Exemplary interlayer polymers include TFB and poly(triarylamine).

(2.优选的聚合物浓度由中间层膜的所需厚度决定,能够容易地通过旋转涂敷试验发现。典型地,对于10-20nm的靶中间层厚度,所需聚合物浓度是0.2-1w/v%,取决于聚合物粘度,和所需的旋转速度是2000-8000rpm。另外地,可以使用计量的喷墨印刷。(2. The preferred polymer concentration is determined by the desired thickness of the interlayer film, which can be easily found by spin coating experiments. Typically, for a target interlayer thickness of 10-20 nm, the required polymer concentration is 0.2-1w /v %, depending on polymer viscosity, and required spin speed is 2000-8000 rpm Alternatively, metered inkjet printing can be used.

(3.优选的交联剂-与-聚合物摩尔比由所使用聚合物的数均分子量和它的分布决定。该交联剂通过将膜中的聚合物的有效分子量提高到当它不再溶于溶剂时的程度来起作用。然而,如果存在,低分子量物质无法达到凝胶极限,因此在良溶剂中仍然沥出。因此,随着交联剂比率或聚合物分子量降低,保留的膜厚度的分数是较小的。典型的膜保留率(或胶凝点)特征示于图1中。对于105的数均分子量,对于合理的膜保留率>50%所需的交联剂比率是1.5-2w/w%。对于106的数均分子量,所需的比率是0.3-0.6w/w%。选择的比率应该是为了确保所需交联水平的最低值。(3. The preferred crosslinker-to-polymer molar ratio is determined by the number-average molecular weight of the polymer used and its distribution. The crosslinker works by increasing the effective molecular weight of the polymer in the film to when it is no longer However, if present, low molecular weight species cannot reach the gel limit and therefore still leach out in good solvents. Therefore, as the crosslinker ratio or polymer molecular weight is reduced, the retained film The fraction of thickness is small. A typical membrane retention (or gel point) profile is shown in Figure 1. For a number average molecular weight of 105 , the crosslinker ratio required for reasonable membrane retention >50% is 1.5-2 w/w %. For a number average molecular weight of 106 the required ratio is 0.3-0.6 w/w %. The ratio chosen should be the lowest value to ensure the desired level of crosslinking.

(4.优选的照射剂量是10-100mJ/cm2。所需的最小剂量取决于聚合物在254-nm下通过滤片效应(filter effect)的本征吸收。它能够容易地由剂量系列试验来确定。(4. The preferred irradiation dose is 10-100 mJ/cm 2 . The minimum dose required depends on the intrinsic absorption of the polymer at 254-nm by the filter effect. It can easily be tested by dose series to make sure.

(5.优选的辐射波长是254-nm或248-nm。这方便地从低压水银灯源(254-nm)或KrF准分子激光器源(248-nm)获得。(5. The preferred radiation wavelength is 254-nm or 248-nm. This is conveniently obtained from a low pressure mercury lamp source (254-nm) or a KrF excimer laser source (248-nm).

(6.优选的空穴注入中间层厚度是通过在器件的所需区域中优化电子-空穴捕获来控制,并能够由实验测定。典型地,对于聚芴衍生的发光体,最佳厚度是在5-20nm范围内,它容易地用这里公开的方法来实现。膜厚度能够精确地控制在5-300nm之间。典型的结果示于图2。参见下面的实施例3。(6. The preferred hole-injecting interlayer thickness is controlled by optimizing electron-hole capture in the desired region of the device and can be determined experimentally. Typically, for polyfluorene-derived emitters, the optimal thickness is In the range of 5-20 nm, it is easily achieved with the method disclosed here. The film thickness can be precisely controlled between 5-300 nm. Typical results are shown in Figure 2. See Example 3 below.

c.基材然后任选地在氮气中在设定于180℃的加热板上烘烤60min。c. The substrate is then optionally baked under nitrogen for 60 min on a hot plate set at 180°C.

d.膜然后用混合二甲苯在旋转器夹盘上洗涤(10秒浸泡,随后在8000rpm下旋转除去)。d. The membrane was then washed with mixed xylenes on the spinner chuck (10 sec soak followed by spin removal at 8000 rpm).

e.聚(9,9-二辛基芴-交替-[苯并-2-噻-1,3-二唑-4,7-二基])(F8BT)然后在氮气中从1.0w/v%甲苯溶液旋涂,得到65-70nm厚膜。e. Poly(9,9-dioctylfluorene-alternating-[benzo-2-thia-1,3-oxadiazole-4,7-diyl]) (F8BT) was then heated from 1.0w/v in nitrogen % toluene solution was spin-coated to obtain a 65-70nm thick film.

f.基材然后在氮气中在设定于120℃的加热板上烘烤3min。f. The substrate was then baked for 3 minutes in nitrogen on a hot plate set at 120°C.

g.在2-4×10-6的基础压力下经由遮蔽掩模将3nm-厚Ca,随后120nm-厚度Al蒸发到该膜上。g. Evaporate 3 nm-thick Ca followed by 120 nm-thick Al onto the film via a shadow mask at a base pressure of 2-4 x 10 -6 .

当器件在正向偏压下驱动时(Ca/Al作为阴极和ITO作为阳极),获得了具有光发射的大的正向偏压的二极管电流。器件特性在图3和4中与没有TFB中间层的类似器件进行对比。量子效率改进了15倍,对于例如1000cd/m2的驱动电压由4.25V减少到具有TFB中间层的3.70V。因为大大地延长了器件使用寿命,在驱动电压上的改进是显著的。在这一实施例中,空穴-传输中间层不仅用作空穴-传输/电子-封阻层,而且用作界面电化学反应的缓冲层。因此,使用寿命增加了10倍以上。When the device was driven under forward bias (Ca/Al as cathode and ITO as anode), a large forward biased diode current with light emission was obtained. The device characteristics are compared in Figures 3 and 4 with similar devices without the TFB interlayer. The quantum efficiency is improved by a factor of 15, reducing from 4.25V to 3.70V with a TFB interlayer for a driving voltage of eg 1000cd/ m2 . The improvement in drive voltage is significant because the lifetime of the device is greatly extended. In this embodiment, the hole-transporting interlayer serves not only as a hole-transporting/electron-blocking layer but also as a buffer layer for interfacial electrochemical reactions. Therefore, the service life is increased by more than 10 times.

实施例2(F8BT-TFB-共混物-发光器LED):Example 2 (F8BT-TFB-blend-emitter LED):

与实施例1中一样,不同的在步骤(e)中的发光聚合物层是F8BT和TFB的1∶1共混物,得到1.4w/v%混合-二甲苯溶液。As in Example 1, the different light-emitting polymer layer in step (e) was a 1:1 blend of F8BT and TFB, resulting in a 1.4 w/v% mixed-xylene solution.

使用寿命,量子效率和该所需亮度的电压因为定义明确的空穴-传输-和电子-封阻中间层在10-15nm厚度的阳极界面上的存在而得到增强。取决于共混物配方,量子效率改进了20-100%但没有发现相关的电压损失(penalty)。这表明甚至对于被配制成共混物的空穴-传输聚合物,在阳极接点上厚度5-20nm的定义明确的和连续的空穴传输层的制造也能够进一步改进性能和稳定性。The lifetime, quantum efficiency and voltage for this desired brightness are enhanced by the presence of well-defined hole-transporting- and electron-blocking interlayers at the anode interface of 10-15 nm thickness. Quantum efficiency was improved by 20-100% depending on the blend formulation but no associated voltage penalty was found. This shows that even for hole-transporting polymers formulated as blends, the fabrication of a well-defined and continuous hole-transporting layer with a thickness of 5-20 nm on the anode junction can further improve performance and stability.

实施例3(F8BT-发光体LED):Embodiment 3 (F8BT-illuminant LED):

与实施例1中一样,不同的在步骤(b)中TFB中间层的厚度用5-nm分辩率控制在10nm和30nm之间。中间层的厚度由原子力轮廓测定法证实。器件的电流密度,亮度(luminance)和外部量子效率分别示于图5,6和7。本实施例用于显示中间层厚度的精确控制的益处。结果,器件性能的系统优化是可能的。As in Example 1, the thickness of the different TFB interlayers in step (b) was controlled between 10 nm and 30 nm with 5-nm resolution. The thickness of the interlayer was confirmed by atomic force profilometry. The current density, luminance and external quantum efficiency of the devices are shown in Figures 5, 6 and 7, respectively. This example serves to demonstrate the benefits of precise control of interlayer thickness. As a result, systematic optimization of device performance is possible.

实施例4(堆叠的空穴注入中间层):Embodiment 4 (stacked hole injection interlayer):

与在实施例1中一样,不同的是第二种空穴传输聚合物的附加层用作在中间层堆叠体中的第二层。这里选择这一聚合物使得基于聚(乙烯基咔唑)(PVK)重量的1.6%的I与PVK配混。混合物在氮气中由0.25w/v%氯仿溶液旋涂,得到10-nm厚膜。膜然后在氮气中通过光掩模曝光于254-nm深紫外辐射达2min,在膜表面上有1mW/cm2的照度。As in Example 1, except that an additional layer of a second hole-transport polymer is used as the second layer in the interlayer stack. This polymer was chosen here so that 1.6% of I, based on the weight of poly(vinylcarbazole) (PVK), was compounded with PVK. The mixture was spin-coated from a 0.25 w/v% chloroform solution in nitrogen to obtain a 10-nm thick film. The film was then exposed through a photomask to 254-nm deep ultraviolet radiation for 2 min in nitrogen with an illumination of 1 mW/cm2 on the film surface.

(7.在阳极界面(如果使用)上该第二种中间层聚合物的优选性质是在第一中间层聚合物的膜和发光聚合物的膜之间提供空穴-传输级(level)中间体,同时对于电子的渗漏不提供任何可达到的电子传输级(level)。用这种方式,设置梯形的空穴-传输能级以促进空穴注入到发光聚合物本身中。(7. A preferred property of the second interlayer polymer at the anode interface (if used) is to provide a hole-transport level intermediate between the film of the first interlayer polymer and the film of the light-emitting polymer. bulk, while not providing any accessible electron transport levels for leakage of electrons. In this way, a trapezoidal hole-transport energy level is set to facilitate hole injection into the light emitting polymer itself.

(8.另外,这一聚合物用作覆盖层以便抑制与发光聚合物之间的不希望有的电化学反应,它会改变界面在操作时的电性质。(8. Additionally, this polymer is used as a capping layer to suppress undesired electrochemical reactions with the light-emitting polymer, which would alter the electrical properties of the interface during operation.

PVK部分地符合这些考虑因素和因此不是理想的。由于PVK是比TFB更好的电子封闭剂,仍然获得了在低压效率上的改进。因此本实施例证实了堆叠的中间层能够有利地用合适的聚合物来构造。PVK partially meets these considerations and is therefore not ideal. Since PVK is a better electron sealer than TFB, an improvement in low pressure efficiency is still obtained. This example thus demonstrates that stacked intermediate layers can advantageously be constructed from suitable polymers.

(B)在LED中LEP层的交联和光致图案化:(B) Crosslinking and photopatterning of LEP layers in LEDs:

实施例5(光致图案化OC1C10-PPV LED):Embodiment 5 (photopatterned OC1C10-PPV LED):

a.通过使用丙酮,异丙醇和氮吹扫从预先图案化的ITO玻璃基材上除去光刻胶。ITO表面然后在筒形蚀刻器中暴露于氧气等离子体10min(Tegal Barrel Etcher 421;典型条件:压力,450mbar;功率150W)。用1∶15的PEDT∶PSS比率配制的聚(3,4-亚乙基二氧基噻吩)∶聚苯乙烯磺酸盐(PEDT∶PSS)然后由水溶液旋涂,得到60-70nm厚度膜。膜在氮气中在设定于150℃的加热板上烘烤15min。a. Removal of photoresist from pre-patterned ITO glass substrates by purging with acetone, isopropanol and nitrogen. The ITO surface was then exposed to oxygen plasma for 10 min in a barrel etcher (Tegal Barrel Etcher 421; typical conditions: pressure, 450 mbar; power 150 W). Poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDT:PSS) formulated with a PEDT:PSS ratio of 1:15 was then spin-coated from aqueous solution to give 60-70 nm thick films. The films were baked under nitrogen for 15 min on a hot plate set at 150°C.

b.用基于OC1C10重量的2%乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(I)与聚(2-甲氧基-5-(3,5-二甲基)辛基-1,4-亚苯基亚乙烯基)(OC10-PPV)配混,然后在氮气中由0.5w/v%混合二甲苯溶液旋涂,得到47-nm厚膜。膜然后在氮气中通过光掩模曝光于254-nm深紫外辐射达2min,在膜表面上有1mW/cm2的照度,然后用甲苯显影。b. with 2% ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate) (I) and poly(2-methoxy-5-( 3,5-Dimethyl)octyl-1,4-phenylenevinylene) (OC10-PPV) compounded and then spin-coated from a 0.5 w/v% mixed xylene solution under nitrogen to give 47- nm thick film. The film was then exposed to 254-nm deep ultraviolet radiation through a photomask for 2 min in nitrogen with an illumination of 1 mW/ cm2 on the film surface and then developed with toluene.

c.基材然后任选地在氮气中在设定于200℃的加热板上烘烤5min。c. The substrate is then optionally baked under nitrogen for 5 min on a hot plate set at 200°C.

d.在2-4×10-6mbar的基础压力下经由遮蔽掩模将3nm-厚Ca,随后120nm-厚度Al蒸发到该膜上。d. Evaporate 3 nm-thick Ca followed by 120 nm-thick Al onto the film via a shadow mask at a base pressure of 2-4 x 10 -6 mbar.

当器件在正向偏压下驱动时(Ca/Al作为阴极和ITO作为阳极),获得了具有光发射的大的正向偏压的二极管电流。器件特性在图8中与没有交联剂和光致图案化的类似器件对比。在两种情况下获得类似的电流密度。因此驱动电流流过器件的能力没有降低。量子效率对于光致图案化器件是更差的,但是这通过将交联剂分数降低至<0.5wt%而回升到最初的水平。这一实施例用于显示这里所述的交联工艺能够用于LEP层。从LEP中的必不可少的双极性注入和电致发光甚至在较高的交联剂比率和小的膜厚度(它使得电流-电压特性对注入接点特别敏感)下仍然没有强烈地下降。这些器件因此没有优化:47nm的OC1C10-PPV厚度显著地小于60-65nm的最佳值,并且所使用的交联剂分数比需要使用的量(大约0.5%)显著过量。When the device was driven under forward bias (Ca/Al as cathode and ITO as anode), a large forward biased diode current with light emission was obtained. The device properties are compared in Figure 8 to similar devices without crosslinker and photopatterning. Similar current densities were obtained in both cases. The ability to drive current through the device is therefore not degraded. Quantum efficiency was worse for photopatterned devices, but this was brought back to the original level by reducing the crosslinker fraction to <0.5 wt%. This example serves to show that the crosslinking process described herein can be used for LEP layers. The requisite bipolar injection and electroluminescence from LEPs do not drop strongly even at higher crosslinker ratios and small film thicknesses (which make the current-voltage characteristics particularly sensitive to injection junctions). These devices were therefore not optimized: the OC1C10-PPV thickness of 47nm was significantly less than the optimum of 60-65nm, and the crosslinker fraction was used in significant excess of what needed to be used (approximately 0.5%).

(B)在FET中通道层的交联和光致图案化:(B) Crosslinking and photopatterning of the channel layer in FETs:

实施例6(交联的/光致图案化的P3HT-通道底部-栅极FET):Example 6 (Crosslinked/Photopatterned P3HT-Channel Bottom-Gate FET):

a.具有200nm二氧化硅顶部电介质层和金(Au)源极-漏极接头垫片的预图案化的p+-掺杂的Si基材通过在筒形蚀刻器(TegalBarrel Etcher 421,典型条件:压力,450mbar;功率200W)中暴露于氧气等离子体10min来清洗,然后用CMOS级水、异丙醇漂洗,然后在氮射流中干燥。预图案化的通道长度是10μm和通道宽度是2mm。六甲基二硅氮烷以900rpm,30s,旋涂到基材上,然后该基材在空气中在120℃的加热板上烘烤2min。a. A pre-patterned p + -doped Si substrate with a 200 nm top dielectric layer of silicon dioxide and gold (Au) source-drain contact pads was passed through a barrel etcher (TegalBarrel Etcher 421, typical conditions : pressure, 450mbar; power 200W) exposed to oxygen plasma for 10min to clean, then rinsed with CMOS grade water, isopropanol, and then dried in a nitrogen jet. The pre-patterned channel length is 10 μm and channel width is 2 mm. Hexamethyldisilazane was spin-coated onto the substrate at 900 rpm for 30 s, and then the substrate was baked in air on a heating plate at 120° C. for 2 minutes.

b.用基于P3HT重量的5%乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(I)与区域构规整的聚(3-己基噻吩)(P3HT)配混,由1.8w/v%氯仿溶液旋涂,得到50-nm厚膜。膜然后在氮气中通过光掩模曝光于254-nm深紫外辐射达2min,在膜表面上有1mW/cm2的照度,然后用氯仿显影,接着用氮气吹干。b. With 5% ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate) (I) based on the weight of P3HT with regioregular poly(3-hexylthiophene) (P3HT) was compounded and spin-coated from a 1.8 w/v% chloroform solution to give a 50-nm thick film. The film was then exposed to 254-nm deep-UV radiation through a photomask in nitrogen for 2 min with an illumination of 1 mW/ cm2 on the film surface, then developed with chloroform, and then dried with nitrogen.

c.器件然后在加热板上在氮气氛围中在100℃下退火2min。c. The device was then annealed on a hot plate at 100° C. for 2 min in a nitrogen atmosphere.

这一FET的传输特性示于图9中。阈值栅电压(Vth)是大约-0V。当栅电压(Vg)提高到这一阈值以上时,发现通道导电性的强劲开启。对于-30V的漏极电压(Vds)和-50V的栅电压(Vgs)获得了100μA的“开启”源极-漏极通道电流。对于栅电压-50V到+50V,开-关比率好于100。由传统的方程式从线性范围中的Isd-Vgs斜率求出的FET流动性接近3×10-2cm2/Vs。没有交联剂和曝光的情况下旋涂的最初P3HT膜的典型流动性是10-1-10-2cm2/Vs。正反向扫描特征是可重叠的。这一实施例用于证明该理想的场效应流动性能够在这里所述的光致交联过程之后,甚至在较高的交联剂分数下基本上保留。场效应流动性对于缺陷和杂质(倾向于分离界面)的存在是特别敏感的。这一发现证实了本方法是将具有高场效应流动性的聚合物晶体管图案化的有前途的手段。在实际的器件中,FET晶体管将在其它基材,如玻璃,聚乙烯,聚(对苯二甲酸乙二醇酯),或其它聚合物材料上构造,并且将其它材料作为源极,漏极和栅接点,如导体聚合物型材料。所使用的场效应聚合物的分子量比这里所使用的分子量(大约30,000)大了一个数量级左右。所以,所使用的交联剂分数能够进一步减少至低于1%,进一步增强本方法的有吸引力的特征。The transfer characteristics of this FET are shown in Figure 9. The threshold gate voltage (V th ) is about -0V. When the gate voltage (V g ) was increased above this threshold, a robust turn-on of channel conductivity was found. An "on" source-drain channel current of 100 μA was obtained for a drain voltage (V ds ) of -30V and a gate voltage (V gs ) of -50V. The on-off ratio is better than 100 for a gate voltage of -50V to +50V. The FET fluidity obtained from the I sd -V gs slope in the linear range by the conventional equation is close to 3×10 −2 cm 2 /Vs. Typical flowability of spin-coated initial P3HT films without crosslinker and light exposure is 10 −1 to 10 −2 cm 2 /Vs. Forward and reverse scan features are overlappable. This example serves to demonstrate that the ideal field effect mobility can be substantially preserved even at higher crosslinker fractions after the photocrosslinking process described here. Field-effect mobility is particularly sensitive to the presence of defects and impurities that tend to separate interfaces. This finding confirms the present method as a promising means to pattern polymer transistors with high field-effect mobility. In practical devices, FET transistors will be constructed on other substrates, such as glass, polyethylene, poly(ethylene terephthalate), or other polymer materials, and have other materials as source, drain and gate contacts, such as conductive polymer type materials. The molecular weight of the field effect polymer used is about an order of magnitude larger than that used here (approximately 30,000). Therefore, the fraction of crosslinker used can be further reduced to below 1%, further enhancing the attractive features of the present process.

实施例7(交联的/光致图案化的TFB-通道顶部-栅极FET):Example 7 (Crosslinked/Photopatterned TFB-Channel Top-Gate FET):

与在实施例6中一样,不同的是场效应聚合物是用与基于TFB重量的1.3%乙二醇双(4-叠氮基-2,3,5,6-四氟苯甲酸酯)(I)掺混的以1.8w/v%(在均三甲苯中)的浓度使用的TFB来替代。在1600rpm,60s,将它旋涂到基材上,得到30nm膜。基材具有具有5μm通道长度和10mm通道宽度的预图案化20-nm金(Au)源极和漏极接头(交错阵列)。基材然后在氮气中通过光掩模曝光于254nm辐射达2min以使TFB膜交联,由10-s均三甲苯浸泡来显影,随后在6000rpm,30s,旋转去除。As in Example 6, except that the field effect polymer was used with 1.3% ethylene glycol bis(4-azido-2,3,5,6-tetrafluorobenzoate) based on the weight of TFB (I) Blended TFB used at a concentration of 1.8 w/v% (in mesitylene) instead. It was spin-coated onto the substrate at 1600 rpm for 60 s, resulting in a 30 nm film. The substrate had pre-patterned 20-nm gold (Au) source and drain contacts (staggered array) with 5 μm channel length and 10 mm channel width. The substrate was then exposed to 254 nm radiation through a photomask for 2 min in nitrogen to crosslink the TFB film, developed by a 10-s mesitylene soak, followed by spin removal at 6000 rpm for 30 s.

被稀释到12.7w/v%的浓度的在均三甲苯中的双(二甲基乙烯基苯并环丁烯)二硅氧烷单体(Cyclotene,Dow Chemical Company,MI,U.S.A.)在6000rpm,60s,被旋涂到TFB膜上,得到200nm膜。应当指出,如果TFB膜不是交联的,则这一BCB型单体/均三甲苯溶液的施涂将立即再溶解所形成的TFB层。基材然后在氮气中在设定于290℃的加热板上烘烤10s。Bis(dimethylvinylbenzocyclobutene)disiloxane monomer (Cyclotene) in mesitylene diluted to a concentration of 12.7w/v% , Dow Chemical Company, MI, USA) at 6000rpm, 60s, was spin-coated onto the TFB film to obtain a 200nm film. It should be noted that application of this BCB type monomer/mesitylene solution will immediately redissolve the formed TFB layer if the TFB film is not crosslinked. The substrate was then baked under nitrogen for 10 s on a hot plate set at 290°C.

按照在实施例1中所述方法,施涂PEDT∶PSS(可以从HC Starckof Leverkusen,Germany以“Baytron P”(RTM)商购),得到顶部-栅电极。A top-gate electrode was obtained by applying PEDT:PSS (commercially available as "Baytron P" (RTM) from HC Starck of Leverkusen, Germany) as described in Example 1.

这一器件的传输特性示于图10中。阈值栅电压(Vth)是大约-30V。这很大程度上受到在TFB场效应聚合物中痕量的离子杂质的限制。当栅门电压(Vgs)提高到这一阈值以上时,发现通道导电性的强劲开启。对于-20V的漏极电压(Vds),和-30V的(Vg-Vth)获得了几个微安的“开启”源极-漏极通道电流(Isd)。开-关比率好于1000。由传统的方程式从线性范围中的Isd-Vgs斜率求出的FET流动性接近4×10-4cm2/Vs。这一实施例用于显示,光致交联的场效应聚合物能够有利地与宽范围的否则会破坏首先形成的聚合物膜的完整性的后续溶剂处理步骤(例如,为了沉积栅介质,级间(interlevel)平面化层,互联体等)相结合。最初的旋涂TFB膜的场效应流动性是10-3-10-4cm2/Vs。流动性因此没有降低,与在实施例6中一样,证明这里所述的方法和工艺过程与具有非常不同性能的许多半导体性聚合物都是相适合的。The transfer characteristics of this device are shown in Figure 10. The threshold gate voltage (V th ) is about -30V. This is largely limited by trace amounts of ionic impurities in TFB field-effect polymers. When the gate voltage (V gs ) was increased above this threshold, a robust turn-on of channel conductivity was found. An "on" source-drain channel current (I sd ) of a few microamps was obtained for a drain voltage (V ds ) of -20V, and (V g -V th ) of -30V. The on-off ratio is better than 1000. The FET fluidity obtained from the I sd -V gs slope in the linear range by the conventional equation is close to 4×10 −4 cm 2 /Vs. This example serves to show that photocrosslinked field-effect polymers can be advantageously combined with a wide range of subsequent solvent processing steps that would otherwise destroy the integrity of the first formed polymer film (e.g., for deposition of gate dielectric, level (interlevel) planarization layer, interconnect, etc.). The field effect fluidity of the initial spin-coated TFB film is 10 -3 -10 -4 cm 2 /Vs. Flowability is thus not reduced, as in Example 6, demonstrating that the methods and processes described here are compatible with many semiconducting polymers with very different properties.

实施例8(给体-受体多层光电导装置):Example 8 (donor-acceptor multilayer photoconductive device):

在以侧向交错阵列形成图案的玻璃基材上制备空穴-传输给体聚合物(“PFB”)和电子-传输受体聚合物(“F8BT”)的多个交替层。这里引入给体-受体术语来表明,光致激发在这两种聚合物之间的界面上离解,从而在界面的PFB侧上留下空穴和在界面的F8BT侧上留下电子。这些层中的每一种是大约40nm厚。在多层制造的每一阶段中收集的UV-可见光吸收光谱示于图12中。膜的质量根据在透明窗中不存在光散射和当总体膜厚度接近光学长度标度时干涉条纹花样的规则形成来判断是优异的。事实上该谱以有条理的方式以PFB或F8BT膜的各自添加到多层堆叠体上来构造。这意味着大量的后续聚合物层能够以受控的厚度来沉积,但不损害底层的完整性。否则在没有本发明中所述的交联用结构部分技术的情况下,这是不可能的。Multiple alternating layers of hole-transport donor polymer ("PFB") and electron-transport acceptor polymer ("F8BT") were prepared on a glass substrate patterned in a laterally staggered array. The donor-acceptor terminology is introduced here to indicate that photoexcitation dissociates at the interface between these two polymers, leaving holes on the PFB side of the interface and electrons on the F8BT side of the interface. Each of these layers is approximately 40nm thick. The UV-visible absorption spectra collected at each stage of multilayer fabrication are shown in FIG. 12 . The quality of the film was judged to be excellent by the absence of light scattering in the clear window and the regular formation of the interference fringe pattern as the overall film thickness approaches the optical length scale. In fact the spectrum is structured in an orderly manner with the respective addition of PFB or F8BT films to the multilayer stack. This means that numerous subsequent polymer layers can be deposited at controlled thicknesses without compromising the integrity of the underlying layer. This would not otherwise be possible without the moiety technology for crosslinking described in this invention.

因为激子漫射长度在有机材料中受限制,有利的是具有比激子漫射长度(典型地20nm)更小的各自给体和受体膜厚度,这样能够获得最大电荷载流子浓度,以提供大的光电导响应。为了试验这一可能性,制造两个多层堆叠体,其中F8BT厚度在一个堆叠体中是40nm而在第二堆叠体(在图13中显示的器件结构)中是80nm。在两堆叠体中PFB层厚度保持相等(大约40nm)。该堆叠体用457-nm(Ar-离子激光器)照射,在该波长下只有F8BT组分吸收光。在堆叠体中的累积F8BT厚度应使得实际上全部的横穿堆叠体的光被吸收。所得到的光电流曲线示于图13中,说明了在具有较薄的F8BT层的给体-受体堆叠体的光电导性上有两倍的提高,与期望一致。Since the exciton diffusion length is limited in organic materials, it is advantageous to have respective donor and acceptor film thicknesses smaller than the exciton diffusion length (typically 20 nm) so that the maximum charge carrier concentration can be obtained, to provide a large photoconductive response. To test this possibility, two multilayer stacks were fabricated, where the F8BT thickness was 40 nm in one stack and 80 nm in the second stack (device structure shown in Figure 13). The PFB layer thickness was kept equal (about 40 nm) in both stacks. The stack was irradiated with 457-nm (Ar-ion laser), at which wavelength only the F8BT component absorbs light. The cumulative F8BT thickness in the stack should be such that virtually all of the light traversing the stack is absorbed. The resulting photocurrent curves are shown in Figure 13, illustrating a two-fold increase in the photoconductivity of the donor-acceptor stack with the thinner F8BT layer, as expected.

本实施例用于进一步显示该途径(方法)在利用互补性给体-受体,和电子-空穴传输性能,寻求可以制造出多层有机电子器件的可能性上的用途。This example is used to further demonstrate the application of this approach (method) in seeking the possibility of manufacturing multilayer organic electronic devices by utilizing complementary donor-acceptor and electron-hole transport properties.

Claims (22)

1.形成聚合物器件的方法,包括以下步骤:1. A method for forming a polymer device, comprising the steps of: (i)在基材上沉积包括(1)半导体聚合物或低聚物、和(2)交联用结构部分的溶液,形成层;(i) depositing a solution comprising (1) a semiconducting polymer or oligomer, and (2) a moiety for crosslinking on a substrate to form a layer; (ii)在一定条件固化在步骤(i)中形成的该层,形成不可溶的交联聚合物;(ii) curing the layer formed in step (i) under conditions to form an insoluble cross-linked polymer; 其特征在于该交联用结构部分以0.05-3mol%范围内的量存在于步骤(i)中,基于在溶液中聚合物或低聚物和交联用结构部分的重复单元的总摩尔数。It is characterized in that the crosslinking moiety is present in step (i) in an amount ranging from 0.05 to 3 mol%, based on the total number of moles of repeating units of the polymer or oligomer and the crosslinking moiety in the solution. 2.根据权利要求1的方法,其中该方法包括将含有第二种聚合物的溶液沉积在步骤(ii)中所形成的交联聚合物上的附加步骤。2. A method according to claim 1, wherein the method comprises the additional step of depositing a solution comprising a second polymer on the crosslinked polymer formed in step (ii). 3.根据权利要求1或权利要求2的方法,其中该方法包括化学改性不可溶的交联聚合物的附加步骤。3. A method according to claim 1 or claim 2, wherein the method comprises the additional step of chemically modifying the insoluble crosslinked polymer. 4.根据权利要求1的方法,其中在步骤(ii)中形成的聚合物通过仅固化在步骤(i)中形成的层的一部分和除去未固化部分来形成图案。4. The method of claim 1, wherein the polymer formed in step (ii) is patterned by curing only a portion of the layer formed in step (i) and removing uncured portions. 5.根据权利要求4的方法,其中除去未固化部分通过用溶剂洗涤来进行。5. The method according to claim 4, wherein removing the uncured part is performed by washing with a solvent. 6.根据权利要求1的方法,其中交联用结构部分对于具有在200nm到400nm范围内的波长的紫外线辐射是敏感的,在步骤(ii)中的条件包括让该层在惰性气氛中曝光于具有在200nm到400nm范围内的波长的紫外线辐射。6. The method according to claim 1, wherein the crosslinking moiety is sensitive to ultraviolet radiation having a wavelength in the range of 200nm to 400nm, the conditions in step (ii) comprising exposing the layer to Ultraviolet radiation having a wavelength in the range of 200nm to 400nm. 7.根据权利要求1的方法,其中在步骤(ii)中形成的交联聚合物是部分地共轭的,基本上地共轭的或完全地共轭的。7. The method according to claim 1, wherein the crosslinked polymer formed in step (ii) is partially conjugated, substantially conjugated or fully conjugated. 8.根据权利要求1的方法,其中在步骤(ii)中形成的交联聚合物是半导体聚合物,并且其中半导体聚合物包括芴和/或茚并芴和/或三芳基胺和/或噻吩和/或亚苯基和/或亚苯基亚乙烯基和/或取代的吡咯类重复单元。8. The method according to claim 1, wherein the crosslinked polymer formed in step (ii) is a semiconducting polymer, and wherein the semiconducting polymer comprises fluorene and/or indenofluorene and/or triarylamine and/or thiophene and/or phenylene and/or phenylene vinylene and/or substituted pyrrole repeat units. 9.根据权利要求1的方法,其中在步骤(i)中沉积的层的厚度是1-500nm。9. The method according to claim 1, wherein the thickness of the layer deposited in step (i) is 1-500 nm. 10.根据权利要求1的方法,其中所述聚合物器件是选自下列这些中的器件:聚合物LED器件,聚合物波导LED器件,聚合物分布布拉格反射器,聚合物微孔隙LED器件,聚合物FET器件,聚合物光检测器和聚合物光致电压器件。10. The method according to claim 1, wherein said polymer device is a device selected from the group consisting of polymer LED devices, polymer waveguide LED devices, polymer distributed Bragg reflectors, polymer microporous LED devices, polymer FET devices, polymer photodetectors and polymer photovoltaic devices. 11.根据权利要求1的方法,其中交联用结构部分是所述聚合物或低聚物的主链的一部分或作为侧链连接到聚合物或低聚物上。11. The method according to claim 1, wherein the crosslinking moiety is part of the main chain of said polymer or oligomer or is attached to the polymer or oligomer as a side chain. 12.根据权利要求11的方法,其中所述聚合物或低聚物包括包含该交联用结构部分的并具有通式III或IV的结构单元:12. The method according to claim 11, wherein said polymer or oligomer comprises a structural unit comprising the crosslinking moiety and having the general formula III or IV: 其中ArF包括取代的或未被取代的氟化芳基和R是在聚合物或低聚物的主链中的结构单元。where Ar F includes substituted or unsubstituted fluorinated aryl groups and R is a structural unit in the main chain of the polymer or oligomer. 13.根据权利要求1的方法,其中(2)交联用结构部分与(1)聚合物或低聚物在溶液中混合。13. The method according to claim 1, wherein (2) the moiety for crosslinking is mixed with (1) the polymer or oligomer in solution. 14.根据权利要求13的方法,其中该交联用结构部分具有通式I:14. The method according to claim 13, wherein the crosslinking moiety has the general formula I: N3-ArF-N3(I)N 3 -Ar F -N 3 (I) 其中ArF包括取代的或未被取代的氟化芳基。wherein ArF includes substituted or unsubstituted fluorinated aryl groups. 15.根据权利要求13的方法,其中该交联用结构部分具有通式II:15. The method according to claim 13, wherein the crosslinking moiety has the general formula II: N3-ArF-L-ArF’-N3(II)N 3 -Ar F -L-Ar F '-N 3 (II) 其中ArF和ArF’独立地各自包括氟化芳基和L包括任选的二价或多价连接基团。wherein Ar F and Ar F ' independently each include a fluorinated aryl group and L includes an optional divalent or multivalent linking group. 16.根据权利要求13到15中任何一项的方法,其中在交联用结构部分的添加之前,聚合物或低聚物以0.5-2.5wt%的量存在于该溶液中。16. A method according to any one of claims 13 to 15, wherein the polymer or oligomer is present in the solution in an amount of 0.5-2.5 wt% prior to the addition of the crosslinking moiety. 17.根据权利要求1的方法,进一步包括将在步骤(ii)中形成的不可溶的聚合物退火。17. The method of claim 1, further comprising annealing the insoluble polymer formed in step (ii). 18.可通过权利要求1到16中任何一项所定义的方法获得的聚合物器件。18. A polymer device obtainable by a method as defined in any one of claims 1 to 16. 19.根据权利要求18的聚合物器件,其是包括芯层和至少一包覆层的波导LED器件,其中芯层和至少一包覆层各包括交联聚合物。19. The polymer device of claim 18, which is a waveguide LED device comprising a core layer and at least one cladding layer, wherein the core layer and the at least one cladding layer each comprise a cross-linked polymer. 20.含有半导体聚合物和交联用结构部分的溶液,其特征在于该交联用结构部分以0.05-3mol%的量存在,基于在溶液中聚合物和交联用结构部分的重复单元的总摩尔数。20. A solution containing a semiconducting polymer and a crosslinking moiety, characterized in that the crosslinking moiety is present in an amount of 0.05-3 mol %, based on the total of repeating units of the polymer and the crosslinking moiety in the solution number of moles. 21.根据权利要求20的溶液,其中该交联用结构部分与聚合物在溶液中混合。21. The solution according to claim 20, wherein the crosslinking moiety is mixed with the polymer in solution. 22.根据权利要求21的溶液,其中该交联用结构部分具有通式II:22. The solution according to claim 21, wherein the crosslinking moiety has the general formula II: N3-ArF-L-ArF’-N3 N 3 -Ar F -L-Ar F '-N 3 其中ArF和ArF’各自是氟化芳基和L包括任选的二价或多价连接基团。where ArF and ArF ' are each a fluorinated aryl group and L includes an optional divalent or multivalent linking group.
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