CN1808692A - Hot-melt underfill composition and methos of coating - Google Patents
Hot-melt underfill composition and methos of coating Download PDFInfo
- Publication number
- CN1808692A CN1808692A CN 200510132320 CN200510132320A CN1808692A CN 1808692 A CN1808692 A CN 1808692A CN 200510132320 CN200510132320 CN 200510132320 CN 200510132320 A CN200510132320 A CN 200510132320A CN 1808692 A CN1808692 A CN 1808692A
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- Prior art keywords
- underfill
- resin
- wafer
- composition
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- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 1
- 239000011378 shotcrete Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical class C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
This invention provides a process for applying a wafer level underfill comprising: providing a solvent-free hot-melt underfill composition; melting the underfill; applying the underfill in a uniform layer to the active side of a semiconductor wafer; returning the underfill to a solid state; optionally B-staging the underfill; optionally removing any excess underfill from the bumps on the wafer; and dicing the wafer into individual dies.
Description
Technical field
The present invention relates to the method for solvent-free underfill composition of hot melt (hot-melt solvent-freeunderfill composition) and deposition underfill (underfill), particularly be cut into tube core (dies) independently and before it be deposited on method on the semiconductor silicon wafer at semiconductor silicon wafer.
Background technology
In the structure of semiconductor subassembly, semiconductor element or chip are all adhered on the substrate (substrates) electronically or mechanically.In a kind of adhesion method, the die front side that comprises electrical connection dish and circuit is significant surface (active face), owing to deposit scolder, thereby be protruding.Corresponding terminal (terminals) is aimed at and contact on these solder bumps (solder bumps) and the substrate, and scolder is heated to its fusing point or " backflow " temperature with the formation solder joint, thereby sets up the mechanical support electric interconnection between semiconductor element and the substrate.
The common requirement of difference of thermal coefficient of expansion between tube core and the substrate (CTE) should be filled certain reinforcement material in the space between tube core and the substrate, it is commonly called " underfill ", to absorb the stress that CTE difference is caused.Usually utilize at least three kinds of diverse ways to apply such underfill material.
In the method for a kind of being called " capillary flow ", semiconductor element is adhered on the substrate by welding flux interconnected, and a kind of then underfill material is assigned to around the edge that is present in the gap between semiconductor element and the substrate.Underfill attracted in this gap because of capillarity, solidifies then.
In the method for a kind of being called " non-current ", the underfill material is assigned on the substrate, and semiconductor chip or tube core then are placed on this substrate.Should guarantee before solder reflow produces connection, to make the solder bump on the chip to contact during placement with corresponding terminal pad on the substrate.Typically, underfill solidifies in solder reflow, although need an extra curing schedule sometimes.Non-current assembling can utilize also that sinter is incompatible to be finished.In this method, non-current underfill is dispensed on the substrate, and tube core is placed on the substrate, and tube core and/or substrate are heated, pressurize, thereby realizes refluxing and interconnection.Because the cause of heating and pressurizing, underfill will flow out with formation filler band, and make solder bump and terminal pad interconnection.This underfill may need an extra curing schedule.
Capillary process and non-current underfill method all are to go up in die-level (die level) to carry out, and be therefore all very consuming time.Another major defect of non-current system is that if non-current underfill is a system of filling up, filler may hinder welding so.In addition, noncurrent method needs new industrial infrastructure to support desired hot binding, rather than utilizes the technology of the surface mounting technology infrastructure of current standard.
The third method is called as " precoating (pre-applied) ", it comprise with underfill be coated to the total silicon wafer, because of on the significant surface that scolder projection is arranged, and wafer is cut into independently tube core in this stage.The surface mounting technology that such wafer coating underfill and bottom fill method can utilize standard has improved process velocity, thereby has reduced processing charges.
Generally speaking, existing precoating underfill depends on the adhesive composition based on solvent, and wherein solvent must be removed, and/or underfill is partly solidified to form a solid layer.This removal solvent and/or partly solidified process quilt are called B-stageization (B-staging).After underfill had carried out B-stageization, wafer was cut into independently chip.Perhaps, before cutting technology, can carry out back side technique for grinding, silicon is thinned to a controlled thickness.Solder ball on the significant surface is aimed at the end points on the substrate, and chip is placed on the substrate.Scolder is refluxed, to form electrical interconnection.If underfill full solidification not during solder reflow so can be succeeded by an independent underfill curing schedule.
Fig. 1 shows and is used for the current technology that assembling has the tube core of wafer scale (wafer level) underfill.Although this wafer level process has advantage with respect to capillary and non-current technology, it also has some shortcomings.If the condition of B-stageization is not optimised, residual solvent in the wafer scale underfill may outgas during refluxing, stop good being welded to connect (causing cold solder connection), perhaps cause the space, it may cause component failure, perhaps causes the zone (not wetting) that is not contacted by underfill.Further, if the thickness of underfill layer is increased to more than 200 microns, from underfill, removes solvent and will become very difficult.Residual solvent degassing during refluxing can cause space and not wetting.In this technology, removal of solvents is an extra step, and must handle these removed solvents in a kind of mode that meets environmental consciousness.
Summary of the invention
The present invention is by providing a kind of solvent-free curable hot-melt composition, make the method that this class is suitable for use as the hot-melt composition of wafer scale underfill, and this hot melt underfill deposited to or be coated to painting method on the semiconductor wafer, thereby obtained the solution of the problems referred to above.
Owing to do not require the use solvent, avoided during refluxing owing to the solvent degassing produces space or not wetting (non-wets) phenomenon.The thickness of underfill layer can be the desired any effective thickness of the ad hoc approach that the professional determines.In the case of necessary, can adopt thick-layer underfill (＞200 μ m), to adapt to higher solder structure.Because the technical process of any B-stageization can be very short, so decline to a great extent circulation timei.Need not to handle or remove solvent.Coating is carried out on wafer scale, therefore compares with applying with the underfill of die-level, makes efficient and increases.Do not require and adopt new and important device infrastructure.
The accompanying drawing summary
Fig. 1 shows the existing method that is used to assemble the tube core that has the wafer scale underfill.Fig. 2 a and 2b show underfill method of the present invention.Fig. 3 is the photo that adopts the band protruding block tube core of wafer scale underfill coating.Fig. 4 is the cross-sectional picture that adopts the band protruding block tube core of wafer scale underfill coating.
Detailed Description Of The Invention
Hot melt underfill composition of the present invention comprises that one or more are curable or can Polymerization and/or the material of polymerization, such as monomer, prepolymer (pre-polymer) and thermoplasticity Resin, they at room temperature are solids, and become liquid in 40 ℃-300 ℃ temperature range. In another embodiment, this hot-melt composition can be prepared by liquid resin, this liquid tree Fat can with the hot melt those skilled in the art known extrude or spray drying technology is consolidated Change.
Before being welded to connect, these materials should be able to be in (being welded to connect) process of backflow Fusing. But after being welded to connect, these materials can be maybe can not re-using of can re-using , this depends on specific encapsulation and/or final the application. If the final application requirements material of expection Material has a property of re-using, then this material will the melting temperature of scolder or be higher than the scolder fusing point it On temperature under deliquescing and have minimum adhesiveness, thereby be easy to remove this material and scolder. If final the application do not require that material can re-use, even then under very high temperature, should Material also will keep its shape and intensity, can not re-use and can not become.
Except the filler of any existence, polymer will be the key component in the said composition.Usually other component that adopts in the underfill composition can be added according to professional's selection, and other component of this class includes but not limited to curing agent, scaling powder, wetting agent, flow control agent, adhesive accelerant, and degasser.This based composition also can comprise filler, and in the case, filler will account at the most 95% of total composition.
The principal character of these materials is that they have the robustness that is enough to be cut.Therefore, be coated to underfill on the semiconductor wafer after, can adopt the semiconductor sawing device of any standard that wafer is cut into independently tube core, and can not adhere on the blade.
A kind of method that obtains enough robustnesses is that selecting under the room temperature is solid, and the heat of various manufacturing operation steps such as the generation of cutting operation step is had stable on heating resin.This has prevented that also resin/underfill from adhering on the blade.The another kind of method that obtains enough robustnesses is to make underfill experience B-stage processing, and this is improved the performance of resin, make it to cutting during heat of generation have thermal endurance and can not deform.Control the degree of B-stageization by selecting suitable potential catalyst.According to final application, underfill can be configured to re-use; That is, underfill will have minimum adhesiveness at the liquidus temperature of scolder.Suitable material is to be solid under those room temperatures, and its fusing point drops on the material in the operating temperature range.
The suitable polymers that is used for underfill comprises thermosetting resin and thermoplastic resin, as epoxy resin, and polyamide, phenoxy resin, Polybenzoxazine, acrylate, cyanate, bismaleimides, polyether sulfone, polyimides, benzoxazine, vinyl ethers, the silication olefine, polyolefin, polybenzoxyzole, polyester, polystyrene, Merlon, polypropylene, polyvinyl chloride, polyisobutene, polyacrylonitrile, polymethyl methacrylate, polyvinyl acetate base ester, poly-(2-vinylpyridine), suitable-1, the 4-polyisoprene, 3,4-polychlorobutadiene, ethylenic copolymer, poly(ethylene oxide), polyethylene glycol, polyformaldehyde, metacetaldehyde, poly-(b-propiolactone), poly-(10-decylate), poly-(terephthalic acid (TPA) ethylidene ester), polycaprolactam, poly-(11-11 phosphoamides), poly-(-phenylene-terephthalamide), poly-(tetramethylene--benzsulfamide), polyester polyacrylate, polyphenylene oxide, polyphenylene sulfide, polysulfones, polyimides, polyether-ether-ketone (polyetheretherketone), Polyetherimide, fluorinated polyimide, Polyimidesiloxane, poly--the iosindolo-quinazoline diones, Polythioetherimide polyphenylene quinoxaline, polyquuinixalone, acid imide-aryl ether phenyl quinoxaline copolymer, polyquinoxaline, polybenzimidazoles, polybenzoxazole, polynorbornene, poly (arylene ether), polysilane, Parylene, benzocyclobutene, hydroxyl (benzoxazole) copolymer, poly (silarylene siloxanes), and polybenzimidazoles.
Except the filler of any existence, polymer will be a component main in the composition.Usually, exist under the situation of filler, the content of filler will account for about at the most 95% of total composition.
Other the suitable material that is used to make hot-melt composition comprises rubber polymer, the block copolymer of monovinyl aromatic hydrocarbon and conjugated diene for example, concrete example has styrene-butadiene, s-B-S (SBS), styrene-isoprene-phenylethene (SIS), styrene-ethylene-butylene-styrene (SEBS), and styrene-ethylene-propylene-styrene (SEPS).
Other the suitable material that is used to make hot-melt composition comprises the ethane-acetic acid ethyenyl ester polymer, other vinyl acetate and copolymer, metering system vinyl acetate for example, normal-butyl vinyl acrylate and ethylene acrylic; Polyolefin is as polyethylene and polypropylene; Polyvinyl acetate base ester and its random copolymer; Polyacrylate; Polyamide; Polyester; And pure and mild its copolymer of polyvinyl.
In some embodiments, these compositions are prepared with tackifying resin, and purpose is to improve adhesiveness and introduce viscosity; The example of tackifying resin comprises the natural resin of natural resin and modification; Polyterpene resin; Phenol-modified terpene resin; Coumarone-indene resin; Aliphat and aromatic base crude oil hydrocarbon resin; Phthalic acid ester; Hydrogenate hydrocarbon, Foral and hydrogenated wood rosin glycerol ester.
In some embodiments, the example of other component that can comprise has diluent, as liquid polybutene or polypropylene; Pertroleum wax, for example paraffin and microwax, polyethylene grease, the animal of hydrogenation, fish and plant fat, mineral oil and synthetic wax, cyclic hydrocarbon or paraffinic mineral oil.
Other optional additive can comprise stabilizer, antioxidant, colouring agent and filler.
In one embodiment, solid aromatic family bismaleimides (BMI) toner has constituted the major part of underfill resin.Suitable solid BMI resin is the resin with following array structure:
Wherein X is an aromatic group; Exemplary aromatic group comprises:
Bimaleimide resin with these X bridge formation groups can be commercially available, and for example can buy from Sartomer (USA) or HOS-Technic GmbH (Austria).
The preferred hard resin that adopts, reason are that liquid resin can not provide noncohesive surface usually under the situation of not exclusively solidifying.Yet hard resin and liquid resin can be united employing, and wherein the content of liquid resin accounts for 40% weight of resin total amount or lower.
Perhaps, curable resin can be the liquid form that solidifies after a while before in being applied to composition of the present invention.Can comprise epoxy resin with the appropriate resin that liquid form obtains, acrylate or methacrylate, maleimide, vinyl ethers, polyester, poly-(butadiene), silication olefine, silicone resin, styrene resin and cyanate ester resin.
In another embodiment, maleimide resin can be used in the hot-melt composition of the present invention, and can comprise having formula
Resin, wherein n is 1-3, and X
1For containing the organic moiety of aliphat or aromatic group.Exemplary X
1Part comprises polybutadiene, Merlon, polyurethane, polyethers, polyester, lower hydrocarbon, and the lower hydrocarbon (simple hydrocarbons) that contains functional group such as carbonyl, carboxyl, acid amides, carbamate, urea or ether.The resin of these types can be commercially available, for example can be from National Starch and ChemicalCompany and Dainippon Ink and Chemical, and Inc buys.
In further execution mode, maleimide resin is selected from:
C wherein
36The straight or branched (have or be not with into loop section) of 36 carbon atoms of expression;
And
Suitable acrylate comprises the resin with following formula
Suitable vinyl ether resin comprises having formula
Resin, wherein n is 1-6, X
3For containing the organic moiety of aromatic series or aliphatic group.Exemplary X
3Part comprises polybutadiene, Merlon, polyurethane, polyethers, polyester, lower hydrocarbon, and the lower hydrocarbon that contains functional group such as carbonyl, carboxyl, acid amides, carbamate, urea or ether.Commercially available resin comprises the cyclohenane dimethanol divinyl ether available from International Speciality Products (ISP), dodecyl vinyl, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ethers, the DPG divinyl ether, the hexylene glycol divinyl ether, octadecyl vinyl ether, and butanediol divinyl ether; Available from Sigma-Aldrich, the Vectomer4010 of Inc, 4020,4030,4040,4051,4210,4220,4230,4060,5015.
Suitable polybutadiene comprises polybutadiene, epoxidised polybutadiene, the polybutadiene of maleinization, the polybutadiene of propylene acidifying, BS, and hycar.Commercially available material comprises the Company available from Sartomer, and the homopolymers butadiene of Inc (Ricon130,131,134,142,150,152,153,154,156,157, P30D); Butadiene and cinnamic random copolymer (Ricon 100,181,184) available from Sartomer Company Inc.; Available from Sartomer Company, and the polybutadiene of the maleinization of Inc. (Ricon 130MA8,130MA13,130MA20,131MA5,131MA10,131MA17,131MA20,156MA17); Available from the polybutadiene of the propylene acidifying of Sartomer Inc. (CN301, NTX6039, PRO6270, Ricacryl 3100, Ricacryl 3500 for CN302, NTX6513); Epoxidized polybutadiene (Polybd 600,605) available from Sartomer Company.Inc; And available from Daicel Chemical Industries, the Epolead PB3600 of Ltd; And available from the copolymer (Hycar CTBN series, ATBN series, VTBN series and ETBN series) of the acrylonitrile and butadiene of Hanse Chemical.
Suitable epoxy resin comprises the epoxy resin of bisphenol type, naphthalene type and aliphat type.Commercially available material comprises the ﹠amp available from Dainippon Ink; Chemicals, and the bisphenol-type epoxy resin of Inc. (Epiclon 830LVP, 830CRP, 835LV, 850CRP); Available from Dainippon Ink﹠amp; Chemicals, the naphthalene type epoxy resin (Epiclon HP4032) of Inc.; Aliphatic epoxy resin (Araldite CY179,184,192,175 available from CibaSpecialty Chemicals, 179), available from the Epoxy 1234,249 of Union Carbide Corporation, 206, and available from Daicel Chemical Industries, the EHPE-3150 of Ltd.Other suitable epoxy resin comprises cycloaliphatic epoxy resin, bisphenol-A type epoxy resin, bisphenol-f type epoxy resin, epoxy phenolics, biphenyl type epoxy resin, naphthalene type epoxy resin, bicyclopentadiene phenol-type epoxy resin.
Suitable silication olefin resin can obtain by the selective silicon hydrogenation of silicone and divinyl material, and it has following formula,
Suitable silicone resin comprises the reactive silicone resin with following formula
Wherein n is 0 or arbitrary integer, X
4And X
5Be hydrogen, methyl, amine, epoxy radicals, carbonyl, hydroxyl, acrylate, methacrylate, sulfydryl, phenol, or vinyl-functional, R
2And R
3Can be-H-CH
3, vinyl, phenyl, or have any hydrocarbon structure of plural carbon.Commercially available material comprises the Co. available from Shin-EtsuSilicone International Trading (Shanghai), the KF8012 of Ltd, KF8002, KF8003, KF-1001, X-22-3710, KF6001, X-22-164C, KF2001, X-22-170DX, X-22-173DX, X-22-174DX, X-22-176DX, KF-857, KF862, KF8001, X-22-3367 and X-22-3939A.
Suitable styrene resin comprises the resin with following formula
Suitable cyanate ester resin comprises having formula
Resin, wherein n is 1 or bigger number, X
7For containing the organic moiety of alkyl and/or aromatic group.Exemplary X
7Part comprises bis-phenol, phenol or cresols type phenolic resins, bicyclopentadiene, polybutadiene, Merlon, polyurethane, polyethers, or polyester.Commercially available material comprises the AroCy L-10 available from HuntsmanLLC, AroCy XU366, AroCy XU371, AroCy XU378, XU71787.02L, XU 71787.07L; Available from the PrimasetPT30 of Lonza Group Limited, Primaset PT30 S75, Primaset PT60, Primaset PT60S, PrimasetBADCY, Primaset DA230S, Primaset MethylCy, and Primaset LECY; Available from Oakwood Products, the 2-chavicol cyanate of Inc, 4-metoxyphenol cyanate, 2,2-two (4-cyanogen oxy phenol)-1,1,1,3,3,3-HFC-236fa, bisphenol-A cyanate, diallyl bisphenol cyanate, 4-phenylphenol cyanate, 1,1,1-three (4-cyanato-phenyl) ethane, 4-cumenyl phenol cyanate, 1,1-two (4-cyanato-phenyl) ethane, 2,2,3,3,4,4,5,5,6,6,7,7-12 fluoro-ethohexadiols two cyanates, and 4,4 '-bis-phenol cyanate.
Curing agent if desired, then the chemical property of the polymer that is adopted and the process conditions that adopted are depended in the selection of curing agent.Under processing and condition of storage (preparation of underfill and mixing are coated on wafer, and adhere to the storage before the tube core), the inertia of curing agent must be enough big, to prevent excessively leadingization (excessive advancement) of resin material.This class curing agent usually is considered to potential catalyst.Excessively leadingization causes the viscosity of underfill system to become Tai Gao and is difficult for being coated on the wafer and/or with semiconductor element and is adhered on the substrate effectively.
Adoptable curing agent has aromatic amines compound in the composition, cycloaliphatic amines compound, aliphatic amine compound, triazine, slaine, aromatic hydroxy compound.The example of this class catalyst comprises imidazoles, glyoxal ethyline for example, 2-undecyl imidazole, 2-heptadecyl imidazoles, the 2-phenylimidazole, 2-ethyl 4-methylimidazole, 1-benzyl-glyoxal ethyline, 1-propyl group-glyoxal ethyline, the 1-1-cyanoethyl-2-methylimidazole, 1-cyano group-ethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl imidazole, 1-cyanoethyl-2-phenylimidazole, the addition compound product of 1-guanidine amino-ethyl-glyoxal ethyline and imidazoles and trimellitic acid; Tertiary amine, N for example, N-dimethyl benzene methylamine, N, accelerine, N, N-dimethyl methyl aniline, N, N-dimethyl-P-anisidine, right-halo-N, accelerine, 2-N-ethyl-ethoxylaniline, three-n-butylamine, pyridine, quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N, N, N ', N '-tetramethyl butane diamine, N-methyl piperidine; Phenolic compounds, phenol for example, cresols, xylenols, resorcinol, and phloroglucin; Organic metal salt, lead naphthenate for example, lead stearate, zinc naphthenate, zinc octoate, oleic acid tin, maleic acid dibutyl tin, magnesium naphthenate, cobalt naphthenate, and pentanedione iron; And inorganic metal salt, stannic chloride for example, zinc chloride and aluminium chloride; Peroxide, benzoyl peroxide for example, lauroyl peroxide, the peroxidating decoyl, acetyl peroxide, chloro benzoyl peroxide and adjacent carboxyl are crossed phthalic acid di-t-butyl ester; Acid anhydrides, maleic anhydride for example, phthalate anhydride, lauric anhydride, PMA, trihemellitic acid acid anhydride, hexahydrophthalic acid anhydride, equal tetracid acid anhydride of hexahydrobenzene and inclined to one side three acid anhydrides of hexahydrobenzene; Azo-compound, azoisobutyl cyanide for example, 2,2 '-azo two propane, m, m '-azoxy styrene, hydrazone, and the mixture of above-mentioned substance.
Curing agent can be radical initiator or cationic initiator, and this depends on selects free radical type still to select the ionic cured resin.Under the situation that adopts radical initiator, radical initiator exists with effective dose.Effective dose is occupied the 0.1-10% of organic compounds (getting rid of any filler) weight usually.Preferred radical initiator comprises peroxide, for example crosses butyl caprylate and dicumyl peroxide; And azo-compound, for example 2,2 '-azo two (2-methyl-propionitrile) and 2,2 '-azo two (2-methyl-butyronitrile).
Under the situation that adopts cationic initiator, cationic initiator exists with effective dose.Effective dose is occupied the 0.1-10% of organic compounds (getting rid of any filler) weight usually.The preferred cation curing agent comprises dicyandiamide, phenol type phenolic resins, adipic dihydrazide, diallyl melamine, diaminourea malconitrile, BF3-amine compound, the imidazolium compounds of amine salt and modification.
In one embodiment, can adopt curing accelerator that curing agent is replenished, in this case, preferred promoter is selected from: triphenylphosphine, the imidazoles that alkyl replaces, imidazole salts, borate, metallo-chelate, or the mixture of above-mentioned substance.
Metallic compound also can be used as the curing accelerator of cyanate system, and it includes but not limited to metal naphthenate, acetylacetone,2,4-pentanedione acid metal salt (chelate), sad slaine, acetate slaine, metal halide, metal imidazoles compound, and metal amine compound.
In some cases, can expect to adopt more than one curing mode.For example, can both need cation to cause, and also need free radical to cause, in this case, can adopt radically curing and ion cured resin in the composition.This based composition for example can allow to cause the initial solidification process of mode by the cation that adopts the UV irradiation, and in treatment step subsequently, and the free radical that causes by heating causes finishes curing reaction.
Preferably, curing is carried out during refluxing.Yet, if solidify insufficient, and if the intensity of underfill and structure deficiency, need after backflow, carry out curing schedule and further advance reaction.Even after backflow, be not cured, also still can adopt curing agent.For example, in some cases, time and temperature may not allow institute to respond and all take place.In this case, may need an independent curing schedule.
If the employing curing schedule, then curing temperature is generally 80 °-250 ℃, realizes solidifying in several seconds to 120 minutes time, and this depends on the chemical property and the selected curing agent of specific resin.The time of every kind of adhesive composition is different with temperature-curable feature (profile), can design different components and obtain the curing characteristic that matches with the particular industry manufacturing process.
According to final application, can comprise one or more fillers in the composition, the adding of these fillers is normally in order to improve rheological property and to reduce stress.Use for underfill, filler is non-conductive.The example of suitable non-conductive filler has aluminium oxide, aluminium hydroxide, silica, vermiculite, mica, wollastonite, calcium carbonate, titanium dioxide, sand, glass, barium sulfate, zirconium, carbon black, organic filler, and halogenated vinyl polymer such as tetrafluoroethene, trifluoro-ethylene, vinylidene fluoride, PVF, vinylidene chloride and vinyl chloride.Filler particles can be any suitable size from nano-grade size to several millimeters.Carrying out size Selection at specific final application, is in those skilled in the art's professional knowledge scope.The content of filler can account for the 0-95% weight of total composition.
According to final application, can comprise flux in the composition.The selection of flux is depended on the chemical property of the resin that is adopted.Yet, be the curing that flux should not influence epoxy resin to some key requests of flux, corrosivity should be not excessive, should too not outgas during refluxing, and should have compatibility with resin, and/or flux residue should have compatibility with resin.
The example of suitable flux comprises and contains one or more hydroxyls (compound OH), organic carboxyl acid for example, acid anhydrides, and alcohol, concrete example has hexahydrophthalic acid anhydride, the methyl hexahydrophthalic acid anhydride, ethylene glycol, glycerine, 3-[two (glycidol yloxymethyl) methoxyl group]-1, the 2-propylene glycol, D-ribose, the D-cellobiose, cellulose and 3-cyclohexene-1,1-dimethanol; The amines flux for example has the aliphatic amine of 1-10 carbon atom, and concrete example has trimethylamine, triethylamine, n-propylamine, n-butylamine, isobutyl amine, sec-butylamine, tert-butylamine, n-amylamine, secondary amylamine, the 2-ethyl butyl amine, positive heptyl amice, 2-DEHA, n-octyl amine, and t-octanylamine; Adopted the epoxy resin of crosslinking agent with fluxing action.Flux exists with effective dose, and the scope of effective dose is a 1-30% weight.
In another embodiment, can in composition, add coupling agent.Typically, coupling agent is a silane, as the epoxy type silane coupler, and amine type silane coupler, or sulfydryl type silane coupler.Adopting under the situation of coupling agent, it exists with effective dose, and the scope of effective dose is 5% weight at the most.
In another embodiment, can in composition, add surfactant.Suitable surfactant has silicone, the polyethylene/polypropylene oxides block copolymer is based on the polyethylene/polypropylene oxides block copolymer of ethylenediamine, based on the polyoxyalkylene of polyalcohol, based on the polyoxyalkylene of fatty alcohol, and fatty alcohol polyoxyalkylene alkyl ethers.Adopting under the situation of surfactant, it exists with effective dose, and typical effective dose is 5% weight at the most.
According to the process conditions that adopted, can comprise wetting agent in the composition.To depend on the chemical property that applies the resin that requires and adopted to the selection of wetting agent.Adopting under the situation of wetting agent, it exists with effective dose, and typical effective dose is 5% weight at the most.The example of suitable wetting agent comprises the Fluorad FC-4430 Fluorosurfactant available from 3M, Clariant Fluowet OTN available from Rhomand Haas, BYK W-990, Surfynol 104 Surfactant, Crompton Silwet L-7280, Triton X100, preferred L w is greater than 240 propylene glycol, gamma-butyrolacton, castor oil, glycerine or other aliphatic acid, and silane.
According to the process conditions that adopted, can comprise flow control agent in the composition.To depend on the chemical property that applies the resin that requires and adopted to the selection of flow control agent.Adopting under the situation of flow control agent, it exists with effective dose, and typical effective dose is 5% weight at the most.The example of suitable flow control agent has the Cab-O-Sil TS720 available from Cabot, available from Aerosil R202 or the R972 of Degussa, fumed silica, alumina, or fumed metal oxides.
According to the chemical property of final application, can comprise adhesive accelerant in the composition with the resin that is adopted.The chemical property that will depend on application requirements and the resin that is adopted to the selection of adhesive accelerant.Adopting under the situation of adhesive accelerant, it exists with effective dose, and typical effective dose is 5% weight at the most.The example of suitable adhesive accelerant has available from the Z6040 epoxy type silane of Dow Corning or Z6020 amine type silane; Available from the A186 Silane of OSI Silquest, A187 Silane, A174 Silane, or A1289; OrganosilaneSI264 available from Degussa; Johoku Chemical CBT-1Carbobenzotriazole available from Johoku Chemical; Functionalized BTA; Thiazole.
According to the manufacture method and methods for using them of the underfill that is adopted, can adopt degasser (defoamer).The chemical property that will depend on application requirements and the resin that is adopted to the selection of degasser.Adopting under the situation of degasser, it exists with effective dose, and typical effective dose is 5% weight at the most.The example of suitable degasser comprises the Antifoam 1400 available from Dow Corning, DuPont Modoflow, and BYK A-510.
The additive that also can add other, diluent for example, stabilizer, and impact modifier, its type and consumption are known in this area.
In further execution mode, the present invention is a kind of method of making semiconductor chip, wherein is coated with the underfill composition on this semiconductor chip.This method comprises: hot melt underfill composition is provided, this underfill is heated to its temperature more than fusing point until fusing, be coated to the underfill of fusing on the significant surface (active side) of semiconductor wafer with the form of conforming layer, cooling off this underfill, that it is returned to is solid-state, underfill is carried out optional B-stage processing (heating is desolvated or underfill is solidified to remove), can randomly remove any excessive underfill, and wafer is cut into independently tube core from the wafer bump piece.
Adhesive process is filled shown in Fig. 2 a and Fig. 2 b in the end of the present invention.
The step that underfill is heated to the temperature more than the composition fusing point and underfill can be melted be coated on the wafer can be independent step, also can be the integration section of manufacturing process, and this depends on the painting method that is adopted.The manufacture method that is adopted must be able to make the underfill of fusing be scattered in thickness on wafer and form all basic layer uniformly.Can adopt one or more technology that the underfill composition of fusing is applied into uniform layer.Common technology comprises stencilization (stencil printing), screen painting (screen printing), " hot melt " printing, gunite, spin-coating method, powder coated method, injection moulding, transfer molding method, and the thin layer platen press.According to the painting method that is adopted, wafer can be under the room temperature, or is heated to a certain temperature between room temperature and the adhesive application temperature.
Place the environment of environmental condition or cooling by the wafer after will applying, make it below melting temperature that is cooled to underfill, underfill will solidify.
According to the resin formula that is adopted, minimum for the viscosity (tackiness) of solidifying the back underfill is reduced to, can randomly carry out B-stage operational processes independent, that polymer moieties is solidified.The condition of B-stageization depends on the state of cure of the resin formula that adopted and needs.In general, the condition of B-stageization is to carry out 5 seconds to 120 minutes in 50 °-175 ℃ a certain temperature or a certain temperature range.
If underfill is applied to the height that thickness on the wafer is higher than protruding block, then must removes excessive underfill, thereby make the terminal of protruding block on can wetting substrate to form mutual electrical connection from protruding block.Can adopt comprise mechanical grinding multiple this area public affairs method realize the removal of excessive underfill.The another kind of possible method of removing excessive underfill is a chemical method for etching, wherein by adopting suitable solvent that the underfill material at protruding block top is preferentially removed/etching.To depend on the type of the resin that is adopted to choice of Solvent.Unite the method that adopts mechanical grinding and chemical etching and also can be used to remove underfill on the protruding block top.Another kind of feasible method is a plasma clean.
The wafer cutting adopts standard cutting technique well known by persons skilled in the art and equipment to carry out.
For the metallurgical body (stud metallurgy) of any protruding block or post, comprise tin-plumbous eutectic, unleaded (Sn/Cu), copper, gold, Au/Sn, Au/Ge or indium, this technology can be used for Sn/Ag/Cu, Sn/Ag.
In another embodiment, the present invention makes hot melt underfill method for compositions.This underfill composition is to adopt to prepare in any method of the above hybrid resin of the melt temperature of resin and any other component.Preferably, the adding mode of each component of composition should make the joining day of curing agent in technology that composition is changed in advance.Usually, any curing agent that needs control to exist is exposed to the duration under the high temperature.This makes the state of cure of resin or extent of polymerization (advancements) be controlled in the OK range that is suitable for using.
Manufacture method also must comprise " degassing " or remove the ability that maybe may be absorbed in any gas in the adhesive composition that generates between mixing period.Processing can outgas by the method that during mixing vacuumizes.
The example of suitable manufacture method comprises each component carried out high shear mixing, and abrasive solid composition then carries out liquid single screw rod or twin-screw again and extrudes and become solid globules.
Embodiment
The method according to this invention prepares tube core.Two kinds of different underfill preparations are produced, shown in embodiment 1 and 2.
Embodiment 1
Adopt standard binders hybrid technology well known by persons skilled in the art to prepare the preparation of embodiment 1, it consists of:
Epon 1001F bisphenol-A/epichlorohydrin epoxy 47.6wt%
Unformed silica filler 47.6wt%
The poly-acid anhydrides 4.76wt% of poly-decanedioic acid
Embodiment 2
Adopt standard binders hybrid technology well known by persons skilled in the art to prepare the preparation of embodiment 2, it consists of:
Epiclon HP-7200H epoxy resin 41.7wt%
Unformed silica filler 41.7wt%
Dodecanedioic acid flux 10.0wt%
Epiclon 830S bisphenol F epoxy resin 4.17wt%
The epoxy resin 1.9wt% of Hypox RM20 modified rubber
HRJ 1166 novolac type phenol resin 0.48wt%
Amino aromatic amides 0.11wt%
Each composition is printed onto respectively on the silicon wafer, and it highly is 450 microns that this silicon wafer has, and spacing is 800 microns a protruding block.The thick slightly aluminum dipping form version of wafer than the band projection is used to printing, thereby makes material can cover protruding block fully.This has guaranteed that protruding block can not damaged by squeegee during printing.Wafer is positioned in the masterplate on the hot plate.Excessive solid underfill is positioned over an end of masterplate and wafer on the hot plate.Masterplate, wafer and solid underfill are heated to 130 ℃, and this moment, underfill was melted.Adopt the metal squeegee underfill to be printed onto on the wafer then by masterplate.After the printing, make coated wafer cool to room temperature.Under the room temperature, the underfill of wafer scale becomes solid, adopts the DAD320Disco sawing device to be cut into independent tube core then, and the cutting parameter of this DAD320 Disco sawing device is as follows:
Saw type-NBC-ZH 2050-SE 27HEEE
Sharp keen hub flange type
Saw overall diameter-55.56mm
Saw interior diameter-19.05mm
Exposure-0.890-1.020mm
Kerf width-0.035-0.040mm
Depth of cut-0.8382mm
Axle rotary speed-30krpm
Feed speed-25.4mm/sec
Z-axially descends speed-5mm/sec
Cooling fluid type-running water
Cutting mode-A (cutting downwards)
Band-0.0889mm is thick-Unitron Systems, and Inc
Knife height-0.3048mm
The result that each embodiment obtains is the protruding block tube core that is coated with solid underfill adhesive.Adopt the light microscopy protruding block, find, all covered fully and do not wreck for embodiment 1 and embodiment 2.In addition, tube core is by transversal, and cross section is checked by light microscope.Protruding block among two embodiment all is capped fully and does not wreck.Fig. 3 has shown the photo of the tube core that the inventive method according to the preparation that adopts embodiment 2 prepares.Fig. 4 has shown the cross-sectional picture of the tube core that the inventive method according to the preparation that adopts embodiment 2 prepares.
Claims (8)
1. method that is used for coated wafers level underfill, this method comprises:
(i.) provide a kind of solvent-free hot melt underfill composition,
(ii.) melt this underfill,
(iii.) form of underfill with conforming layer is coated on the significant surface of semiconductor wafer,
(iv.) it is solid-state underfill to be returned to,
(v.) wafer is cut into singulated dies.
2. method according to claim 1, wherein said underfill comprise one or more curable, polymerisable or materials of polymerization, and described material at room temperature is a solid, becomes liquid in 40 ℃ to 300 ℃ temperature range.
3. method according to claim 2, wherein said underfill comprises epoxy resin.
4. method according to claim 2, wherein said underfill comprise that weight accounts at least 20% filler.
5. method according to claim 1, wherein said underfill are to adopt stencilization coated.
6. method according to claim 1, this method further are included in coated with heated chip before the underfill.
7. method according to claim 1, wherein excessive underfill adopt the mechanical grinding method to be removed.
8. method according to claim 2, wherein said underfill is applied to the thickness greater than 200 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63833704P | 2004-12-22 | 2004-12-22 | |
| US60/638,337 | 2004-12-22 | ||
| US11/275,080 | 2005-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1808692A true CN1808692A (en) | 2006-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510132320 Pending CN1808692A (en) | 2004-12-22 | 2005-12-21 | Hot-melt underfill composition and methos of coating |
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| CN103643590A (en) * | 2013-12-25 | 2014-03-19 | 山东鲁南纸业股份有限公司 | Sizing material, preparation method of sizing material and application of sizing material to producing pre-impregnated gummed paper |
| CN104064531A (en) * | 2014-06-25 | 2014-09-24 | 中国科学院微电子研究所 | Device package structure and manufacturing method with solder balls controlling package height |
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| US9609762B2 (en) | 2012-03-12 | 2017-03-28 | Koki Company Limited | Flux, solder composition, and method for manufacturing electronic circuit mounted substrate |
| CN104159701A (en) * | 2012-03-12 | 2014-11-19 | 株式会社弘辉 | Flux, solder composition and method for producing electronic circuit mounting substrate |
| CN104159701B (en) * | 2012-03-12 | 2017-03-01 | 株式会社弘辉 | Flux, solder composition and manufacturing method of electronic circuit mounting substrate |
| CN103643590B (en) * | 2013-12-25 | 2016-01-20 | 山东鲁南新材料股份有限公司 | A kind of sizing material and preparation method thereof and the application in pre-gum dipped paper is produced |
| CN103643590A (en) * | 2013-12-25 | 2014-03-19 | 山东鲁南纸业股份有限公司 | Sizing material, preparation method of sizing material and application of sizing material to producing pre-impregnated gummed paper |
| CN104064531A (en) * | 2014-06-25 | 2014-09-24 | 中国科学院微电子研究所 | Device package structure and manufacturing method with solder balls controlling package height |
| CN104658933A (en) * | 2014-12-30 | 2015-05-27 | 华天科技（西安）有限公司 | POP structure applying lamination process and preparation method thereof |
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| US10256148B2 (en) | 2015-08-31 | 2019-04-09 | Disco Corporation | Method of processing wafer |
| CN106486408B (en) * | 2015-08-31 | 2019-06-11 | 株式会社迪思科 | method of processing wafers |
| CN108347872A (en) * | 2017-12-29 | 2018-07-31 | 江西合力泰科技有限公司 | It is a kind of to reduce the technique for producing process fingerprint recognition twice |
| CN108712828A (en) * | 2018-05-22 | 2018-10-26 | 江西合力泰科技有限公司 | A kind of full automatic line preparation process for producing the big plate of fingerprint recognition |
| CN108738295A (en) * | 2018-05-22 | 2018-11-02 | 江西合力泰科技有限公司 | A kind of preparation process for the metal ring on the big plate of fingerprint recognition |
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