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CN1893790B - 表面带有用于与电气元件电触点接通的金属层的塑料构件 - Google Patents

表面带有用于与电气元件电触点接通的金属层的塑料构件 Download PDF

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Publication number
CN1893790B
CN1893790B CN2006101011757A CN200610101175A CN1893790B CN 1893790 B CN1893790 B CN 1893790B CN 2006101011757 A CN2006101011757 A CN 2006101011757A CN 200610101175 A CN200610101175 A CN 200610101175A CN 1893790 B CN1893790 B CN 1893790B
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plastic
layer
component
metal layer
temperature
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CN1893790A (zh
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斯蒂芬·格洛德
于尔根·哈根
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Siemens Medical Ag
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Siemens Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like
    • B29C65/5021—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/38—Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
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    • B29C66/43441—Joining substantially flat articles for forming fork connections, e.g. for making Y-shaped pieces with two right angles, e.g. for making T-shaped pieces, H-shaped pieces
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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Abstract

一种塑料构件，其包括一个设在其表面上的金属层，通过热固定法尤其是钎焊方法实现与电气元件的电触点接通，其中，在用热塑性塑料制的构件基体(2)上的至少一个或多个触点区内安设由热固性塑料或由耐高温的热塑性塑料组成的一塑料层(4、10)，所述金属层(6、11)覆盖在该塑料层(4、10)上面，其中，所述热固性塑料是一种硬化的树脂，其中，该树脂层通过丝网印刷、辊涂或喷涂液态树脂来构成；或敷设形式上为薄膜的耐高温热塑性塑料。

Description

表面带有用于与电气元件电触点接通的金属层的塑料构件
技术领域
本发明涉及一种塑料构件，其包括一个设在其表面上的金属层，该金属层用于通过一种加热固定法尤其是一种钎焊方法实现与电气元件的电触点接通。
背景技术
在不同的应用情况下有时需要在表面涂覆有金属层的塑料构件上安置其他一个或多个电气元件，以及通过金属层同与金属层连接的另一些元器件触点接通。这种电触点接通通常用钎焊方法实现，也就是说，要与金属层连接的元器件或手工或自动热钎焊。在这方面的一个应用例子是用于磁共振仪的表面波阻隔器(Mantelwellensperre：表面波阻隔器)的外壳构件，其中，外壳构件用塑料制造以及在其内部装各种元器件，它们与处于外壳构件外侧上的金属化表面触点接通，以及通过此金属化表面与钎焊在表面的元器件触点接通。
在钎焊时，在金属化表面以及也在塑料构件本身上短时作用的温度约为300℃。然而，这种尽管短暂但高的热负荷，通常导致损伤聚合材料。往往采用热塑性聚合物构成这种塑料构件，它们在施加处于极限温度范围内的温度时软化。这种局部软化大多导致恶化金属化表面的粘附，直至使其脱离。其结果是必然使钎焊在上面元器件的电接触或完全不存在或仅是低质量的。
为了防止脱离或为了达到金属化表面与塑料良好的粘附性，在这些情况下采用耐高温的塑料，但它们在成形技术方面需要比较高的费用，此外，这种特殊塑料的材料成本高。
US4774126公开了一种结构构件，它有一种廉价的热塑性材料作为基体。在基体上全部或部分成形有一种耐高温的热塑性材料，在该材料上可以钎焊金属层。在这里尤其介绍了一些印刷电路板。
在DE69510786T2中公开了一种弹性复合材料。它由一个连续的支承层和至少一个施加在支承层上的保护层组成，其中至少一个保护层由一种耐热的树脂构成，它薄片状敷设在支承层的表面。这种复合材料应隔热和电绝缘以及防水的，以及它可以用作印刷电路板。
发明内容
因此，本发明的目的是提供一种塑料构件，它能方便和廉价地制造，并与此同时可以通过热触点接通方法，如钎焊方法，实现附加的元器件没有疑问的电触点接通。
上述目的通过这样一种塑料构件来实现，其包括一个设在其表面上的金属层，该金属层用于通过一种热固定法尤其是一种钎焊方法实现与电气元件的电触点接通，其中，在用一种热塑性塑料制的所述构件的基体上的至少一个或多个触点区内安设由一种热固性塑料或由一种耐高温的热塑性塑料组成的一塑料层，所述金属层覆盖在该塑料层上面，按照本发明，所述热固性塑料是一种硬化的树脂，其中，该树脂层通过丝网印刷、辊涂或喷涂液态树脂来形成；或，施加形式上为薄膜的所述耐高温热塑性塑料。
按本发明的塑料构件有一个构件基体，它用一种易于加工的从材料成本上看能在市场上便宜地买到的热塑性塑料组成，在构件基体的表面施加一个形式上为由热固性塑料或由耐高温的热塑性塑料构成的层的“热闸”，用于防止在要触点接通的元器件钎焊期间产生不可允许的高热负荷，然后在其上面安置用于触点接通的金属层。热固性塑料或耐高温的热塑性塑料不会因钎焊时的高温受损。温度缓慢地穿透基体材料，亦即市场上买到的热塑性塑料，在这种情况下仅发生基体材料小量的加热以及绝不会导致其损坏。电的触点接通因而可以在不破坏基体材料的情况下实施和完成。
因此，按本发明的塑料构件可以使用易于加工的廉价的热塑性塑料以及与此同时可以实现附加的电气元件可靠的触点接通，因为通过所施加的优选地具有厚度为5-75μm，尤其≤50μm很薄的附加塑料层，有利地避免了对基本材料的热损害。在这里起隔热作用的层可以大面积或全面地施加在构件基体的表面上，但也可以将它们选择性地施加在那些需要金属层的地方，亦即应定位元器件的地方。
作为热固性塑料，它作为上述第一种实施形式可用于构成阻热层，采用一种硬化的树脂或一种相应的树脂系统，为此适用的是环氧树脂、丙烯酸树脂或酚醛树脂。所有这些树脂有低的热导率，从而避免损害在它下方构成基体的热塑性塑料，或只是在时间非常长以及强度非常大的温度作用下才可望发生损害，然而对于电气元件仅持续几秒钟的触点接通而言并非这种情况。所提及的树脂均可无困难地按下列工序金属化，在这里为了金属化可以采用不同的技术。例如“经典的”塑料金属化方法以及在湿化学法(nasschemischer systeme)领域中指称的底涂层(Primer)技术，亦即众所周知的化学或电镀金属层方法。但还可以设想通过PVD(物理蒸发沉积)技术金属化，亦即金属化的物理方法。
有关的树脂层在构件基体上同样可用涂层技术施加，亦即通过丝网印刷、辊涂或喷涂。最后，涂层的方式取决于所使用的材料和构件几何结构。
与使用热固性塑料或热固性塑料系统不同，如已说明的那样按本发明也可以施加薄的耐高温热塑性塑料层。作为耐高温的塑料可例如采用PPS(Polyphenylensulfid：聚苯硫醚)、PPA(Polyphthalamid：聚邻苯二酰胺)、PES(Polyethersulfon：聚醚砜)、PEEK(Polyetheretherketon：聚醚醚酮)、PEI(Polyetherimid：聚醚酰亚胺)、PSU(Polysulfon：聚砜)或LCP(Liquid-Crystal-Polymer：液晶聚合物)。所有这些塑料即使在高温范围也是稳定的，也就是说，在钎焊时产生的约300℃的温度无疑问是能经受住的。在使用新型的无铅钎焊系统如Sn-Ag或Sn-Cu-Ni时，由于低共熔点移动到温度约220℃，所以同样需要高的钎焊温度，在这种情况下仍然能无疑问地使用。所述耐高温热塑性塑料的金属化同样可以用上述化学、电镀或物理涂层方法之一进行。
在采用所介绍的树脂系统的情况下所述热固性塑料在液态下涂覆，而当采用耐高温的热塑性塑料时它们以薄膜的形式施加。安设薄膜层同样可以按任意的方式例如通过压片或粘合进行。这种薄膜已制成标准薄膜可以大量提供。
相宜地，还可以向热固性或耐高温热塑性塑料层内添加一种或多种添加剂尤其用于提高耐久性，和/或添加一种或多种填料。使用可能的添加剂或填料尤其在树脂系统的情况下无疑问是可以实现的，因为树脂系统要直接在施加前才在使用现场完成加工。
作为添加剂可例如添加TBBA(Tetrabrombiphenol A：四溴双酚A)用于提高耐火等级。添加金属颗粒如钯、铜或铁也是有利的，在这种情况下为了下一步的金属化不再需要专门的底涂层。作为填料可例如使用玻璃粉用于调整规定的物理、化学或机械性质。
如已说明的那样，施加厚度为5-75μm，优选地≤50μm薄的塑料层就足够了。鉴于加热的持续时间很短，这种层厚足以防止热量过强地输送给在它下方的热塑性塑料。
如已说明的那样，塑料构件可例如是一个外壳构件，尤其是一个用于磁共振仪的表面波阻隔器(Mantelwellensperre)的外壳构件。当然本发明不受此限制。确切地说，塑料构件可以涉及任意形状或规定用于各种使用目的的塑料构件。
附图说明
本发明的其他优点、特征和详情由下面介绍的实施例并借助附图说明。
图1表示按本发明的塑料构件1的部分视图。
具体实施方式
图1所示塑料构件1例如是用于磁共振仪的表面波阻隔器的外壳构件。此塑料构件1包括一个构件基体2，例如一个其上侧3平坦的外壳顶盖。构件基体2由任意类型的市场上买到的热塑性材料组成。
为了将图中没有详细表示的附加的电气元件能与处于外壳或类似物内部同样没有进一步表示的电气元件触点接通，有时需要将它们在外侧设在表面3的区域内以及与金属化表面电触点接通。这通过钎焊的过程实现。为了能在钎焊时使构件基体不受热的影响，按本发明首先在构件基体2的上侧施加一个形式上为塑料层的阻热层，它耐高的热负荷。
在图的左边作为阻热层施加一个采用耐高温的热塑性塑料1的塑料层4，这种耐高温的塑料可以例如涉及PPS(分晶)、PPA(分晶)、PEI(非晶形)、PES(非晶形)、PSU(非晶形)、PEEK(分晶)或LCP(液晶聚合物)。有关的聚合物以塑料薄膜的形式施加。在图示的实施例中固定通过使用一种胶粘剂5进行。如图所示，耐高温的塑料层4仅部分地在元器件应触点接通的地方安设在表面3上，也就是说，有选择地根据触点接通线路图在下一步要安装元器件的地方进行定位。
为了能实施这种触点接通，在耐高温的热塑性塑料层4(必要时在事先涂覆一个底涂层后)上施加金属化层6，例如一个用任意的沉积法施加的铜层。它在构件上侧3与另一个例如装在内部的元器件等类似元件的一个相应的连接点连通，通过金属化层6触点接通的元器件可与该另一个例如装在内部的元器件电接触。在图示的例子中，在金属化层6上通过钎焊连接9钎焊一个元器件7，图中只表示了此元器件的触脚8。
在通常只持续数秒钟的钎焊过程中产生高达300℃的温度或更高。这种高的温度基于耐高温塑料层的中间连接不或仅小部分传给构件基体2的热塑性聚合材料，也就是说，构件基体在触点接通位置下方的区域内仅小量地加热或仅加热到无论如何不可能损坏聚合材料的程度。另一方面，耐高温的塑料层4无疑问地有能力经受短时产生的高温。它本身吸收绝大部分热能以及只将热能的少部分进一步传给构件基体。
在图的右边表示在使用树脂构成阻热塑料层10的情况下按本发明的另一种实施形式。树脂例如涉及环氧树脂或酚醛树脂。在各自的硬化过程中的交联反应是充分已知的，所获得的层有高的热稳定性和低的热导率。所述树脂的施加通过印刷或喷涂进行，这鉴于树脂起先是液态的因而无疑问是可以实现的。在硬化后，在这里同样在必要时预先涂敷一个底涂层或底漆后安设一个金属化层11，对于加层方法在这里也完全不加限制。一个在图中只表示了触脚13的元器件12在这里也通过钎焊连接14与金属化层11触点接通。在这里同样不会造成构件基体材料明显地受热。
为了改善或调整物理、化学或机械性能，可以在具体使用的树脂内添加例如用于改善耐火等级的添加剂，尤其是TBBA(四溴双酚A)。在树脂内搀和金属颗粒也是适宜的，因为为此无需使用特殊的、用于预处理硬化树脂表面的底涂层便可以直接形成金属化层11。作为填料可例如添加玻璃粉。在图中用符号15(添加剂)或16(填料)表示相应的添加剂/填料。在这里也仅仅在局部有限的面积上施加环氧树脂。当然，也可以与之不同将整个上侧3施加阻热层。
各塑料层4或10的厚度应优选地<50μm。这样做的优点还在于，构件始终保持热塑性的总特征，这有利于采取再循环措施。当然与制造阻热层相关的附带造成的费用是可以忽略不计的。

Claims (8)

1.一种塑料构件，其包括一个设在其表面上的金属层，该金属层用于通过一种热固定法实现与电气元件的电触点接通，其中，在用一种热塑性塑料制的所述构件的基体(2)上的至少一个或多个触点区内安设由一种耐高温的热塑性塑料组成的一塑料层(4、10)，所述金属层(6、11)覆盖在该塑料层(4、10)上面，其特征为：敷设形式上为薄膜的所述耐高温热塑性塑料。
2.按照权利要求1所述的塑料构件，其特征为，所述耐高温的热塑性塑料是PPS、PPA、PES、PEEK、PEI、PSU或LCP。
3.按照权利要求1或2所述的塑料构件，其特征为，所述耐高温的热塑性塑料层包含一种或多种用于提高耐火性的添加剂(15)和/或一种或多种填料(16)。
4.按照权利要求1或2所述的塑料构件，其特征为，所述塑料层(4、10)的厚度为5-75μm。
5.按照权利要求4所述的塑料构件，其特征为，所述塑料层(4、10)的厚度为5-50μm。
6.按照权利要求1或2所述的塑料构件，其特征为，它是一个外壳构件。
7.按照权利要求6所述的塑料构件，其特征为，所述外壳构件是一个用于磁共振仪的表面波阻隔器的外壳构件。
8.按照权利要求1所述的塑料构件，其特征为，所述金属层用于通过一种钎焊方法实现与电气元件的电触点接通。
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