CN1887500A - No-lead soldering paste - Google Patents
No-lead soldering paste Download PDFInfo
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- CN1887500A CN1887500A CN 200610061209 CN200610061209A CN1887500A CN 1887500 A CN1887500 A CN 1887500A CN 200610061209 CN200610061209 CN 200610061209 CN 200610061209 A CN200610061209 A CN 200610061209A CN 1887500 A CN1887500 A CN 1887500A
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- welding powder
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- tin
- bismuth
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- 238000005476 soldering Methods 0.000 title claims abstract description 70
- 239000000843 powder Substances 0.000 claims abstract description 106
- 238000003466 welding Methods 0.000 claims abstract description 87
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 46
- 239000000956 alloy Substances 0.000 claims abstract description 46
- 230000005496 eutectics Effects 0.000 claims abstract description 24
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 229910052718 tin Inorganic materials 0.000 claims description 62
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 61
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 22
- 239000006071 cream Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- ZJHIEQGQFJJLBM-UHFFFAOYSA-N [Co].[Sn].[Cu] Chemical compound [Co].[Sn].[Cu] ZJHIEQGQFJJLBM-UHFFFAOYSA-N 0.000 claims description 7
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 claims description 7
- 229910002056 binary alloy Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 2
- 238000010992 reflux Methods 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract 1
- 229910001152 Bi alloy Inorganic materials 0.000 abstract 1
- 229910017816 Cu—Co Inorganic materials 0.000 abstract 1
- 238000003723 Smelting Methods 0.000 abstract 1
- 229910020836 Sn-Ag Inorganic materials 0.000 abstract 1
- 229910020888 Sn-Cu Inorganic materials 0.000 abstract 1
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 abstract 1
- 229910020988 Sn—Ag Inorganic materials 0.000 abstract 1
- 229910019204 Sn—Cu Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 5
- 239000010941 cobalt Substances 0.000 description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
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Abstract
The present invention is one kind of no-lead soldering paste, and aims at improving the performance of soldering paste with binary eutectic Bi48Sn42 alloy powder. The no-lead soldering paste contains binary eutectic Bi48Sn42 alloy powder in 1-99 wt%; one of binary Sn-Cu alloy powder, ternary Sn-Ag-Cu alloy powder, ternary Sn-Ag-Bi alloy powder, binary Sn-Ag alloy powder, ternary Sn-Cu-Ni alloy powder ternary Sn-Cu-Co alloy powder, which possess melting point or melting range within 200-230 deg.c, in 1-99 wt%; and soldering flux. The present invention has the advantage of smelting point and reflux welding peak temperature capable of being regulated through regulating the compound ratio of the alloy powder.
Description
Affiliated technical field
The present invention relates in electronic product surface mount (SMT) process leadless soldering tin paste of use.Particularly a kind of peak temperature in the Reflow Soldering use has the leadless soldering tin paste that significantly reduces than stannum-copper binary alloy welding powder, stannum-silver-copper three-part alloy welding powder, Xi-Yin-bismuth ternary alloy three-partalloy welding powder, Xi-Yin bianry alloy welding powder, tin-copper-nickel ternary alloy three-partalloy welding powder or solder(ing) paste that tin-copper-cobalt ternary-alloy welding powder lead-free alloy is made.
Background technology
In the prior art, the leaded solder(ing) paste that alloyed powders such as tin-lead are made, in electronic product surface mount (SMT) process, because the peak temperature in the Reflow Soldering use is moderate, wiring board and components and parts is not damaged guarantees that simultaneously the intensity that solder joint high temperature uses is widely used.
For satisfying environmental protection requirement, adopting unleaded welding material in the microelectronic processing technology process has been imperative, as European Union for environmental protection requirement, about two instructions (WEEE and ROHS) of poisonous and harmful substance in the electronic product July 1 in 2006 purpose implement in full.The most common leadless soldering tin paste adopts tin-silver-copper alloy systems such as Sn96.5Ag3Cu0.5, Sn96.3Ag3Cu0.7 more at present.Xi-Yin, Xi-Yin-bismuth, tin-copper and tin-copper adds the alloy system that transition metals such as minor amount of nickel, cobalt are formed simultaneously, and the solder(ing) paste of making also can be used in the electronic product surface mount SMT technical process.But all between 217 ℃-227 ℃, its reflow soldering temperature then needs to reach more than 245 ℃ the fusing point of these alloys.So high serviceability temperature usually can cause the damage of wiring board and components and parts.And by eutectic welding tin cream that bismuth-Xi binary eutectic Bi48Sn42 welding powder is made, though can avoid the too high and problem that causes of reflux temperature, but because the inclined to one side end of fusing point, have only 138 ℃, formed solder joint serviceability temperature during near 100 ℃ reliability reduce greatly, thereby be not used in the production process of most of electronic products.
Summary of the invention
For overcoming the eutectic welding tin cream that bismuth-Xi binary eutectic Bi48Sn42 welding powder is made, fusing point is on the low side, formed solder joint is the low shortcoming of reliability in use, and the high temperature solder(ing) paste made of multicomponent alloy welding powder such as tin-silver-copper, Xi-Yin-bismuth, tin-copper, easily cause pcb board and components and parts to damage the deficiency that makes in the tin cream welding process, the present invention discloses a kind of the welding and uses fusing point and traditional leadless soldering tin paste that tin-plumbous system is suitable.
The technical measures that the present invention taked are: in the leadless soldering tin paste, alloy welding powder is by in bismuth-Xi binary eutectic welding powder Bi48.Sn42 and fusing point or stannum-copper binary alloy welding powder, stannum-silver-copper three-part alloy welding powder, Xi-Yin-bismuth ternary alloy three-partalloy welding powder, Xi-Yin bianry alloy welding powder, tin-copper-nickel ternary alloy three-partalloy welding powder or the tin-copper-cobalt ternary-alloy welding powder of melting range between 200-230 ℃, wherein a kind of alloy welding powder, press 1-99: the 99-1 weight proportion adds the tin cream that scaling powder is made after mixing.Wherein the stannum-copper binary alloy welding powder is Sn99.3Cu0.7, the stannum-silver-copper three-part alloy welding powder is Sn96.5.Ag3.Cu0.5 or Sn96.5Ag3.Cu0.7, Xi-Yin-bismuth ternary alloy three-partalloy welding powder is Sn91.7.Ag3.5.Bi4.8, Xi-Yin bianry alloy welding powder is Sn96.5.Ag3.5 or Sn98.Ag2, tin-copper-nickel ternary alloy three-partalloy welding powder is that the content of tin Sn is 98.3-99.2, the content of nickel is tin-copper-nickel ternary alloy three-partalloy welding powder Sn.Cu0.7.Ni of 0.1-1, tin-copper-cobalt ternary-alloy welding powder is that the content of tin Sn is 98.3-99.2, and the content of cobalt Co is tin-copper-cobalt ternary-alloy welding powder Sn.Cu0.7.Co of 0.1-1.
Good effect of the present invention is: leadless soldering tin paste remains between 220-245 ℃ the peak temperature of leadless soldering tin paste in solder reflow process under the condition that does not change its welding performance.Lower reflow soldering temperature has been avoided the damage of wiring board and components and parts, has also improved the reliability of solder joint in the high temperature use simultaneously.
The specific embodiment
In the use of leadless soldering tin paste of the present invention, bismuth-Xi binary eutectic Bi48.Sn42 alloy welding powder at first begins to melt at 138 ℃, Bi48.Sn42 alloy under the molten condition produces facilitation to the thawing to the Sn99.3Cu0.7, the Sn96.5.Ag3.Cu0.5 that do not melt as yet, Sn96.5.Ag3Cu.0.7, Sn91.7.Ag3.5.Bi4.8, Sn96.5.Ag3.5, Sn98.Ag2, the lead-free alloy welding powders of fusing point between 200-230 ℃ such as Sn.Cu0.7.Ni, SnCu0.7.Co, and the reflux temperature of leadless soldering tin paste of the present invention is reduced.Also shortened simultaneously the thawing time of leadless soldering tin paste.After the leadless soldering tin paste cooling, sneaked into metal such as silver, copper nickel, cobalt in the alloy solder joint of formation and formed new ternary, quaternary and quinary alloy.The fusing point of the alloy that these are newly-generated all is higher than the fusion temperature of bismuth-Xi eutectic Bi48.Sn42.Thereby improved the dependability of solder joint under hot conditions.
According to above principle, in the leadless soldering tin paste under the present invention, along with the content increase of bismuth-Xi eutectic Bi48.Sn42 welding powder, the cocurrent flow peak temperature of leadless soldering tin paste can reduce gradually, and the dependability of solder joint also can correspondingly decrease simultaneously.Otherwise along with the content of bismuth-ashbury metal Bi48Sn42 welding powder reduces, the backflow peak temperature of leadless soldering tin paste also can increase gradually, and the dependability of solder joint also can correspondingly increase.In use, according to the designing requirement of product, the ratio weight ratio of selecting bismuth-ashbury metal Bi48Sn42 welding powder and Sn99.3Cu0.7, Sn96.5Ag3Cu0.5, Sn96.5Ag3Cu0.7, Sn91.7.Ag3.5.Bi4.8, Sn96.5.Ag3.5, Sn98.Ag2, the lead-free alloy welding powders of fusing point between 200-230 ℃ such as Sn.Cu0.7.Ni, Sn.Cu0.7.Co is at 1-99: between the 99-1.
The embodiment of the invention 1: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic Bi48.Sn42 alloy welding powder and tin-steel bianry alloy welding powder Sn99.3Cu0.7 by 1-99: after the 99-1 weight proportion mixes, add scaling powder and make.
Specifically technical parameter is,
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃
The Sn99.3Cu0.7 fusing point: 227 ℃, Reflow Soldering peak temperature: more than 250 ℃
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn99.3Cu0.7(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 250 | 245 | 242 | 238 | 235 | 230 | 228 | 225 | 190 |
The embodiment of the invention 2: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic (Bi48Sn42) welding powder and stannum-silver-copper three-part alloy welding powder Sn96.5Ag.3Cu0.5 by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃
Sn96.5.Ag3.Cu0.5 fusing point: 216-220 ℃, Reflow Soldering peak temperature: more than 245 ℃
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn96.5.Ag3Cu0.5(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 245 | 240 | 236 | 232 | 230 | 227 | 223 | 220 | 190 |
The embodiment of the invention 3: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic Bi48.Sn42 welding powder and stannum-silver-copper three-part alloy welding powder Sn96.3.Ag3.Cu0.7 by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃
Sn96.3.Ag.3Cu0.7 fusing point: 217-220 ℃, Reflow Soldering peak temperature: more than 245 ℃
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn96.3Ag3.Cu0.7(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 245 | 240 | 236 | 232 | 230 | 227 | 223 | 220 | 190 |
The embodiment of the invention 4: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic Bi48.Sn42 and Xi-Yin-bismuth ternary alloy three-partalloy welding powder Sn91.7.Ag3.5.Bi4.8 by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃
Sn91.7.Ag3.5.Bi4.8 fusing point: 205-210 ℃ of Reflow Soldering peak temperature: 245 ℃
| Bi48Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sng1.7.Ag3.5.Bi4.8(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 245 | 240 | 236 | 232 | 230 | 227 | 223 | 220 | 190 |
The embodiment of the invention 5: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic (Bi48Sn42) and Xi-Yin bianry alloy welding powder Sn96.5.Ag3.5 by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃.
The Sn96.5.Ag3.5 fusing point: 221 ℃, Reflow Soldering peak temperature: 250 ℃.
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn96.5.Ag3.5(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 250 | 245 | 242 | 238 | 235 | 230 | 228 | 225 | 190 |
The embodiment of the invention 6: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic Bi48.Sn42 and Xi-Yin bianry alloy welding powder Sn98.Ag2 by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃.
Sn98.Ag2 fusing point: 221-226 ℃, Reflow Soldering peak temperature: more than 250 ℃.
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn98.Ag2(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 250 | 245 | 242 | 238 | 235 | 230 | 228 | 225 | 190 |
The embodiment of the invention 7: in the leadless soldering tin paste welding powder be by bismuth-Xi binary eutectic Bi48Sn42 and tin-copper-nickel ternary alloy three-partalloy welding powder Sn.Cu0.7.Ni by 1-99: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.Among tin-copper-cobalt ternary-alloy welding powder Sn.Cu0.7.Ni, the content of tin Sn is 98.3-99.2, and the content of nickel (Ni) is 0.1-1.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃.
Sn.Cu0.7.Ni fusing point: 225-227 ℃, Reflow Soldering peak temperature: more than 250 ℃.
| Bi48Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn.Cu0.7.Ni(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 250 | 245 | 242 | 238 | 235 | 230 | 228 | 225 | 190 |
The embodiment of the invention 8: welding powder is to close Bi48.Sn42 and-copper-cobalt ternary-alloy welding powder Sn.Cu0.7.Co by 1-99 by bismuth-Xi binary congruent melting in the leadless soldering tin paste: after the 99-1 proportioning is mixed, add the tin cream that scaling powder is made.Among tin-copper-cobalt ternary-alloy welding powder Sn.Cu0.7.Co, the content of tin Sn is 98.3-99.2, and the content of cobalt Co is 0.1-1.
Concrete technical parameter is:
The Bi48.Sn42 fusing point: 138 ℃, Reflow Soldering peak temperature: 190 ℃
Sn.Cu0.7.Co fusing point: 225-227 ℃, Reflow Soldering peak temperature: more than 250 ℃
| Bi48.Sn42(％) | 0 | 1 | 25 | 40 | 55 | 70 | 85 | 99 | 100 |
| Sn.Cu0.7.Co(％) | 100 | 99 | 75 | 60 | 45 | 30 | 15 | 1 | 0 |
| The Reflow Soldering peak temperature (℃) | 250 | 245 | 242 | 238 | 235 | 230 | 228 | 225 | 190 |
Claims (7)
1, a kind of leadless soldering tin paste, it is characterized in that: in the leadless soldering tin paste, alloy welding powder is by in bismuth-Xi binary eutectic welding powder Bi48.Sn42 and fusing point or stannum-copper binary alloy welding powder, stannum-silver-copper three-part alloy welding powder, Xi-Yin-bismuth ternary alloy three-partalloy welding powder, Xi-Yin bianry alloy welding powder, tin-copper-nickel ternary alloy three-partalloy welding powder or the tin-copper-cobalt ternary-alloy welding powder of melting range between 200-230 ℃, wherein a kind of alloy welding powder, press 1-99: the 99-1 weight proportion adds the tin cream that scaling powder is made after mixing.
2, leadless soldering tin paste according to claim 1, it is characterized in that: alloy welding powder is by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and stannum-copper binary alloy welding powder Sn99.3Cu0.7 in the leadless soldering tin paste, weight is pressed 1-99: after the 99-1 proportioning, add the tin cream that scaling powder is made.
3, leadless soldering tin paste according to claim 1 is characterized in that: in the leadless soldering tin paste alloy welding powder be by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and stannum-silver-copper three-part alloy welding powder Sn96.5.Ag3.Cu0.5 or Sn96.5Ag3.Cu0.7 weight by 1-99: the 99-1 proportioning adds the tin cream that scaling powder is made.
4, leadless soldering tin paste according to claim 1, it is characterized in that: in the leadless soldering tin paste alloy welding powder be by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and Xi-Yin-bismuth ternary alloy three-partalloy welding powder Sn91.7.Ag3.5.Bi4.8 weight by 1-99: after the 99-1 proportioning, add the tin cream that scaling powder is made.
5, leadless soldering tin paste according to claim 1, it is characterized in that: in the leadless soldering tin paste alloy welding powder be by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and Xi-Yin bianry alloy welding powder Sn96.5.Ag3.5 or Sn98.Ag2 weight by 1-99: after the 99-1 proportioning, add the tin cream that scaling powder is made.
6, leadless soldering tin paste according to claim 1, it is characterized in that: alloy welding powder is that the content by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and tin Sn is 98.3-99.2 in the leadless soldering tin paste, the content of nickel is tin-copper-nickel ternary alloy three-partalloy welding powder Sn.Cu0.7.Ni of 0.1-1, weight is pressed 1-99: after the 99-1 proportioning, add the tin cream that scaling powder is made.
7, leadless soldering tin paste according to claim 1, it is characterized in that: alloy welding powder is that the content by bismuth-Xi binary eutectic welding powder Bi48.Sn42 and tin Sn is 98.3-99.2 in the leadless soldering tin paste, the content that bores Co is tin-copper-brill ternary alloy three-partalloy welding powder Sn.Cu0.7.Co of 0.1-1, weight is pressed 1-99: after the 99-1 proportioning, add the tin cream that scaling powder is made.
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| CN 200610061209 CN1887500A (en) | 2006-06-20 | 2006-06-20 | No-lead soldering paste |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI392557B (en) * | 2009-09-03 | 2013-04-11 | 村田製作所股份有限公司 | A solder paste, a joining method using it, and a bonding structure |
| CN103551756A (en) * | 2013-11-12 | 2014-02-05 | 宁波市鄞州恒迅电子材料有限公司 | Sn-Ag-Cu system lead-free soldering paste |
| CN103906596A (en) * | 2011-10-04 | 2014-07-02 | 铟泰公司 | Mn-doped Sn-based solder alloys and their welds with superior drop impact reliability |
| TWI480382B (en) * | 2010-11-19 | 2015-04-11 | 村田製作所股份有限公司 | A conductive material, a connecting method using the same, and a connecting structure |
| US9175368B2 (en) | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| CN111906469A (en) * | 2019-05-09 | 2020-11-10 | 铟泰公司 | Low-temperature melting point and medium-temperature melting point lead-free soldering paste with mixed soldering tin alloy powder |
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2006
- 2006-06-20 CN CN 200610061209 patent/CN1887500A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9175368B2 (en) | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| US10010980B2 (en) | 2009-09-03 | 2018-07-03 | Murata Manufacturing Co., Ltd. | Solder paste, joining method using the same and joined structure |
| TWI392557B (en) * | 2009-09-03 | 2013-04-11 | 村田製作所股份有限公司 | A solder paste, a joining method using it, and a bonding structure |
| US9044816B2 (en) | 2009-09-03 | 2015-06-02 | Murata Manufacturing Co., Ltd. | Solder paste, joining method using the same and joined structure |
| TWI480382B (en) * | 2010-11-19 | 2015-04-11 | 村田製作所股份有限公司 | A conductive material, a connecting method using the same, and a connecting structure |
| US10050355B2 (en) | 2010-11-19 | 2018-08-14 | Murata Manufacturing Co., Ltd. | Conductive material, bonding method using the same, and bonded structure |
| CN103906596A (en) * | 2011-10-04 | 2014-07-02 | 铟泰公司 | Mn-doped Sn-based solder alloys and their welds with superior drop impact reliability |
| CN103906596B (en) * | 2011-10-04 | 2017-03-01 | 铟泰公司 | Mn-doped Sn-based solder alloys and their welds with superior drop impact reliability |
| CN103551756A (en) * | 2013-11-12 | 2014-02-05 | 宁波市鄞州恒迅电子材料有限公司 | Sn-Ag-Cu system lead-free soldering paste |
| CN111906469A (en) * | 2019-05-09 | 2020-11-10 | 铟泰公司 | Low-temperature melting point and medium-temperature melting point lead-free soldering paste with mixed soldering tin alloy powder |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| US11712762B2 (en) | 2019-05-09 | 2023-08-01 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| EP4646041A3 (en) * | 2019-05-09 | 2026-01-21 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
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