CN1885164B - Photoresist coating method and photoresist coating equipment - Google Patents
Photoresist coating method and photoresist coating equipment Download PDFInfo
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- CN1885164B CN1885164B CN200510079116XA CN200510079116A CN1885164B CN 1885164 B CN1885164 B CN 1885164B CN 200510079116X A CN200510079116X A CN 200510079116XA CN 200510079116 A CN200510079116 A CN 200510079116A CN 1885164 B CN1885164 B CN 1885164B
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Abstract
Description
发明领域field of invention
本发明涉及一种光阻涂布设备和方法,具体地,涉及一种可控制微粒数量的光阻涂布设备和方法。The invention relates to a photoresist coating device and method, in particular to a photoresist coating device and method capable of controlling the number of particles.
技术背景technical background
目前一般应用于大尺寸液晶面板制作过程的光阻涂布设备,如图1a所显示的,是利用一光阻涂布装置10,以扫描的方式朝一第一方向x移动,将光阻2均匀喷洒涂布于基板1的表面。参照图1b,光阻涂布装置10包括喷头11,喷头11中央具有一狭缝12,而光阻(剂)2即从该狭缝12之间喷洒而出。这种类型的设计已见于东京应化工业(TOK)等公司所提供的光阻涂布设备之中。At present, the photoresist coating equipment generally used in the production process of large-size liquid crystal panels, as shown in FIG. Spray coating on the surface of the
在光阻涂布制作过程中,基板与传输设备所携带的微粒,以及光阻涂布设备本身所产生的微粒,都会随着时间逐渐于光阻涂布设备内累积,并可能会污染基板,降低产品的质量。During the photoresist coating process, the particles carried by the substrate and the transmission equipment, as well as the particles produced by the photoresist coating equipment itself, will gradually accumulate in the photoresist coating equipment over time, and may contaminate the substrate. Reduce the quality of the product.
发明内容Contents of the invention
本发明即为了欲解决上述现有技术的问题,而提供一种光阻涂布设备,包括一光阻涂布装置、一清洁装置以及一平台。其中,该清洁装置包括一吹气单元以及一吸气单元,该吹气单元朝该基板吹出一气体,以使所述多个微粒脱离该基板,该吸气单元以真空吸力清除该基板表面的所述多个微粒。其中,该吹气单元包括一吹气口,该吹气口为一狭缝,并且该吹气口的宽度约为1~2毫米。基板置放于平台之上。当涂布光阻时,清洁装置先清除基板表面的微粒,接着,光阻涂布装置将光阻均匀喷洒于基板的表面。In order to solve the above-mentioned problems in the prior art, the present invention provides a photoresist coating device, which includes a photoresist coating device, a cleaning device and a platform. Wherein, the cleaning device includes an air blowing unit and an air suction unit, the air blowing unit blows a gas toward the substrate, so that the plurality of particles are separated from the substrate, and the air suction unit removes the particles on the surface of the substrate by vacuum suction. the plurality of microparticles. Wherein, the air blowing unit includes an air blowing port, the air blowing port is a slit, and the width of the air blowing port is about 1-2 millimeters. The substrate is placed on the platform. When coating the photoresist, the cleaning device first removes particles on the surface of the substrate, and then, the photoresist coating device uniformly sprays the photoresist on the surface of the substrate.
本发明可在光阻涂布之前,预先对基板进行清洁,因此可减少基板表面的微粒,提升产品的质量。此外,本发明同时对用于置放基板的平台进行清洁,以进一步清除光阻涂布设备内的微粒,因此,可有效控制光阻涂布设备之内的微粒数量。The invention can pre-clean the substrate before coating the photoresist, thereby reducing particles on the surface of the substrate and improving product quality. In addition, the present invention simultaneously cleans the platform for placing the substrate to further remove particles in the photoresist coating equipment, so the number of particles in the photoresist coating equipment can be effectively controlled.
附图简述Brief description of the drawings
图1a是显示现有技术的光阻涂布设备的示意图;Figure 1a is a schematic diagram showing a prior art photoresist coating equipment;
图1b是显示光阻涂布装置的细部结构的示意图;Figure 1b is a schematic diagram showing the detailed structure of a photoresist coating device;
图2是显示本发明的光阻涂布设备的示意图;2 is a schematic diagram showing a photoresist coating device of the present invention;
图3a是显示图2中清洁装置的A-A方向截面图;Fig. 3 a is the A-A direction sectional view showing the cleaning device in Fig. 2;
图3b是显示清洁装置的仰视图;Figure 3b is a bottom view showing the cleaning device;
图3c是显示清洁装置的清洁情形的示意图;Figure 3c is a schematic diagram showing the cleaning situation of the cleaning device;
图3d是显示本发明的清洁装置的变形例的示意图;Figure 3d is a schematic diagram showing a modified example of the cleaning device of the present invention;
图3e是显示图3d中的清洁装置的清洁情形的示意图;以及Figure 3e is a schematic diagram showing the cleaning situation of the cleaning device in Figure 3d; and
图4a、4b、4c和4d是显示本发明的清洁步骤的示意图。4a, 4b, 4c and 4d are schematic diagrams showing the cleaning steps of the present invention.
符号说明Symbol Description
1~基板 2~光阻1~substrate 2~photoresist
3~微粒 10~光阻涂布装置3~
11~喷头 12~狭缝11~nozzle head 12~slit
20~清洁装置 21、21’~吸气单元20~
22、22’~吹气单元 23~吸气口22, 22’~blowing
24~吹气口 30~平台24~
40~制作过程腔体 100~光阻涂布设备40~
发明详述Detailed description of the invention
参照图2,其显示了本发明的光阻涂布设备100,包括一光阻涂布装置10、一清洁装置20、一平台30以及一制作过程腔体40。光阻涂布装置10、清洁装置20以及平台30均设于制作过程腔体40之中。基板1置放于平台30之上。当涂布光阻2时,清洁装置20先清除基板1表面的微粒,接着,光阻涂布装置10将光阻2均匀喷洒于基板1的表面。Referring to FIG. 2 , it shows a
参照图3a,其显示了图2中清洁装置20的A-A方向截面图。清洁装置20包括一吸气单元(吸气腔体)21以及两个吹气单元(吹气腔体)22,吹气单元22位于吸气单元21的两侧。吸气单元21具有吸气口23,吹气单元22具有吹气口24。参照图3b,其显示了清洁装置20的仰视图,吸气口23及吹气口24均为长条形的狭缝,其宽度约为1~2毫米。参照图3c,吹气单元22连接一吹气管路(未示出),当进行清洁时,吹气单元22从吸气单元21两侧,朝基板1吹出一气体(空气),以使基板1表面的微粒3脱离该基板1,同时,吸气单元21以真空吸力将微粒3吸入吸气单元21之中。吸气单元21连接一真空管路(未图标),微粒3进入吸气单元21之后,可通过该真空管路而排出该光阻涂布设备100。该吹气单元22的吹气压力约为12~14千帕。该吸气单元21的吸气压力约为-12~-14千帕。当清洁装置20作用时,吸气单元21的吸气压力可略大于吹气单元22的吹气压力。Referring to FIG. 3a, it shows a cross-sectional view of the
参照图3d,其显示了本发明的清洁装置的变形例,其特点在于,吸气单元21’位于吹气单元22’的两侧。参照图3e,吹气单元22’连接一吹气管路(未示出),当进行清洁时,吹气单元22’朝基板1吹出一气体(空气),以使基板1表面的微粒3脱离该基板1,同时,吸气单元21’于该吹气单元22’的两侧,以真空吸力将微粒3吸入吸气单元21’之中。吸气单元21’连接一真空管路(未示出),微粒3进入吸气单元21’之后,可通过该真空管路而排出该光阻涂布设备100。Referring to Fig. 3d, it shows a modified example of the cleaning device of the present invention, which is characterized in that the air suction unit 21' is located on both sides of the air blowing unit 22'. Referring to Fig. 3 e, the blowing unit 22' is connected with a blowing pipeline (not shown), and when cleaning, the blowing unit 22' blows a gas (air) towards the
虽然在本发明之实施例中,吸气单元以及吹气单元均为腔体结构,吸气口及吹气口均为长条形的狭缝。然而,其并未限制本发明的实施方式,吸气单元以及吹气单元也可以为管路结构,而吸气口及吹气口也可以为孔状结构。或者单纯利用吸气单元移除微粒,而省略该吹气单元。Although in the embodiment of the present invention, both the air suction unit and the air blowing unit are cavity structures, the air suction port and the air blow port are both elongated slits. However, it does not limit the embodiment of the present invention, the air suction unit and the air blowing unit may also be in a pipeline structure, and the air suction port and the air blowing port may also be in a hole structure. Or simply use the air suction unit to remove the particles, and omit the air blowing unit.
以下说明本发明的光阻涂布设备100的操作情形。参照图4a,首先,在该制作过程腔体40之中,该光阻涂布装置10位于一第一位置,该清洁装置20位于一第二位置。接着,如图4b所显示的,该清洁装置20沿一第二方向-x,从该第二位置移至该第一位置,并同时清除该平台30上的微粒。参照图4c,在清洁装置20清洁完该平台30并位于该第一位置之后,基板1被输送置放于该平台30之上。然后,如图4d所显示的,该光阻涂布装置10以及该清洁装置20同时朝该第一方向x,从该第一位置移动至该第二位置,此时,该清洁装置20位于该光阻涂布装置10的前方,该清洁装置20预先清除该基板1上的微粒,该光阻涂布装置10随后对该基板1喷洒光阻2。在光阻涂布完成之后,移除该基板,该清洁装置20停留在该第二位置,该光阻涂布装置10沿该第二方向-x,从该第二位置回到该第一位置,而恢复图4a的状态。The operation of the
本发明可在光阻涂布之前,预先对基板进行清洁,因此可减少基板表面的微粒,提升产品的质量。此外,本发明同时对用于置放基板的平台进行清洁,以进一步清除光阻涂布设备内的微粒,因此,可有效控制光阻涂布设备之内的微粒数量。The invention can pre-clean the substrate before coating the photoresist, thereby reducing particles on the surface of the substrate and improving product quality. In addition, the present invention simultaneously cleans the platform for placing the substrate to further remove particles in the photoresist coating equipment, so the number of particles in the photoresist coating equipment can be effectively controlled.
虽然本发明已以具体的较佳实施例揭露如上,然其并非用以限定本发明,任何本领域普通技术人员在不脱离本发明的精神和范围内,仍可做出许多更改和润饰,因此本发明的保护范围以所附的权利要求所界定的范围为准。Although the present invention has been disclosed above with specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make many changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention shall be determined by the appended claims.
Claims (14)
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| CN200510079116XA CN1885164B (en) | 2005-06-24 | 2005-06-24 | Photoresist coating method and photoresist coating equipment |
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| CN200510079116XA CN1885164B (en) | 2005-06-24 | 2005-06-24 | Photoresist coating method and photoresist coating equipment |
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| CN1885164B true CN1885164B (en) | 2010-04-07 |
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| CN200510079116XA Expired - Fee Related CN1885164B (en) | 2005-06-24 | 2005-06-24 | Photoresist coating method and photoresist coating equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102419511A (en) * | 2011-06-07 | 2012-04-18 | 上海华力微电子有限公司 | Method for removing dust particles on surface of optical lithography mask slice |
| CN104162496A (en) * | 2013-05-15 | 2014-11-26 | 上海和辉光电有限公司 | Slit coater |
| CN105093578B (en) * | 2015-07-25 | 2019-05-28 | 武汉华星光电技术有限公司 | Light blockage coating device |
| CN106842646B (en) * | 2017-03-03 | 2019-11-29 | 惠科股份有限公司 | Display panel cleaning machine |
| CN109643657B (en) * | 2017-06-22 | 2022-08-16 | 深圳市柔宇科技股份有限公司 | Manufacturing equipment and manufacturing method of array substrate |
| CN112007826A (en) * | 2019-05-29 | 2020-12-01 | 夏普株式会社 | Coating device |
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|---|---|---|---|---|
| DE4025663A1 (en) * | 1990-08-14 | 1991-10-24 | Bayerische Motoren Werke Ag | DEVICE FOR APPLYING A CONSISTENT SUBSTANCE TO A WORKPIECE |
| CN1570767A (en) * | 2003-03-06 | 2005-01-26 | 三星电子株式会社 | Discharging unit for discharging a photosensitive material, coater and apparatus for coating a photosensitive material |
| CN1574221A (en) * | 2003-06-04 | 2005-02-02 | 大日本网目版制造株式会社 | Liquid supplying device and substrate processing device |
| CN1618527A (en) * | 2003-11-18 | 2005-05-25 | 大日本网目版制造株式会社 | Base plate treater, slit jet nozzle and mechanism for determining liquid filling degree and gas mixing degree in filled body |
| CN1695822A (en) * | 2004-05-10 | 2005-11-16 | 鸿富锦精密工业(深圳)有限公司 | Coating equipment |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4025663A1 (en) * | 1990-08-14 | 1991-10-24 | Bayerische Motoren Werke Ag | DEVICE FOR APPLYING A CONSISTENT SUBSTANCE TO A WORKPIECE |
| CN1570767A (en) * | 2003-03-06 | 2005-01-26 | 三星电子株式会社 | Discharging unit for discharging a photosensitive material, coater and apparatus for coating a photosensitive material |
| CN1574221A (en) * | 2003-06-04 | 2005-02-02 | 大日本网目版制造株式会社 | Liquid supplying device and substrate processing device |
| CN1618527A (en) * | 2003-11-18 | 2005-05-25 | 大日本网目版制造株式会社 | Base plate treater, slit jet nozzle and mechanism for determining liquid filling degree and gas mixing degree in filled body |
| CN1695822A (en) * | 2004-05-10 | 2005-11-16 | 鸿富锦精密工业(深圳)有限公司 | Coating equipment |
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