CN1874154A - Switch module and single pole double throw module for wireless communication - Google Patents
Switch module and single pole double throw module for wireless communication Download PDFInfo
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- CN1874154A CN1874154A CNA2005100754387A CN200510075438A CN1874154A CN 1874154 A CN1874154 A CN 1874154A CN A2005100754387 A CNA2005100754387 A CN A2005100754387A CN 200510075438 A CN200510075438 A CN 200510075438A CN 1874154 A CN1874154 A CN 1874154A
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Abstract
The invention relates to a switch module and a single-pole double-throw module for wireless communication, which consists of a layer-adding multilayer plate structure and a plurality of passive elements. The build-up multi-layer board structure has a plurality of conductive layers and a plurality of dielectric layers stacked on each other, wherein at least one dielectric layer is present between any two conductive layers. The passive component is a part of at least one conductive layer and is electrically connected with a plurality of conductive pads on at least one surface of the build-up multi-layer board structure. The invention integrates the passive elements such as capacitance, inductance, resistance and the like required by the radio frequency switch circuit into a multilayer board, can be applied to a radio frequency front end module of a wireless communication electronic product, and simultaneously achieves the purposes of reducing cost and miniaturizing.
Description
Technical field
The present invention is a kind of structure of wireless telecommunications switch, particularly provides a kind of utilization to increase switch module and single-pole double throw module that the layer multi-layer plate is made the wireless telecommunications of radio-frequency (RF) switch.
Background technology
Low-cost and miniaturization becomes one of important goal of wireless telecommunications, digital computer, portable electronic product.For instance, therefore switching between the radio-frequency (RF) switch of RF front-end module (RF Front End Module) control selection antenna, antenna end and the receiving terminal and the switching between antenna end and the transmitting terminal are one of key element of wireless telecommunications.
Radio-frequency (RF) switch is made up of some IC and passive device, and the limited passive device of present radio-frequency (RF) switch is a surface adhering element, even therefore change circuit layout, also can't dwindle the usable floor area of circuit board effectively, benefits limited for the microminiaturization of product.
Summary of the invention
Because in the above-mentioned background, the trend of relevant high speed radio communication product miniaturization, the purpose of this invention is to provide a kind of construction of switch of wireless telecommunications of radio-frequency (RF) switch in this, compared to general surface adhering element, can reduce element effectively when being integrated into various passive devices in the multilager base plate.
Moreover, in order to design radio-frequency (RF) switch cheaply, in this provide a kind of have a passive device increase the layer multi-layer structure, utilize ectonexine conductive layer and the conduction connecting structure that contacts, can make surface and built-in passive device.
Moreover, in order to provide wireless telecommunications required radio frequency diverter switch, provide a kind of single-pole double throw (Single-Pole Double-Throw of wireless telecommunications in this, SPDT) module, except the element of diode function, other necessary passive device can utilize circuit board to increase a layer mode and make, and need can not reduce the volume or the area of radio communication product by the surface adhering technology in conjunction with passive device.
For reaching above-mentioned purpose, one of the present invention embodiment provides a kind of switch module of wireless telecommunications, increases the layer multi-layer plate structure and some passive devices are formed by one.Increase that the layer multi-layer plate structure has the plural conductive layer and a plurality of dielectric layer is superimposed with each other, have arbitrary at least dielectric layer between wherein wantonly two conductive layers.Passive device is positioned at least one lip-deep plural conductive pad that increases the layer multi-layer plate structure for a part and the electric connection of arbitrary at least conductive layer.
For reaching above-mentioned purpose, the present invention also comprises following embodiment:
A kind of single-pole double throw module of wireless telecommunications is characterized in that, comprises:
One increases the layer multi-layer plate structure, and this increases the layer multi-layer plate structure and comprises:
The plural conductive layer is parallel to each other, and wherein two these conductive layers are positioned at this two surfaces that increase the layer multi-layer plate structure;
A plurality of dielectric layers, wherein arbitrary this dielectric layer is between wantonly two these conductive layers; And
The plural conductive structure, wherein this plural conductive structure of part is passed this dielectric layer of part with contact and connection wantonly at least two these conductive layers;
One resistive element is formed by a part that is positioned at arbitrary this conductive layer that should the surface;
One capacity cell is made up of a top crown, a bottom crown, different two these conductive structures and two first conductive pads at least, this top crown and this bottom crown are formed by different and adjacent two these conductive layers part separately, two different these conductive structures contact this top crown and this bottom crown separately, two different these conductive structures contact arbitrary this first conductive pad separately, and arbitrary this first conductive pad is the part of arbitrary this conductive layer that should the surface; And
One inductance element is made up of with two second conductive pads the circulation of at least one conduction, and this conduction circulation and this two second conductive pad are the part of arbitrary this conductive layer that should the surface and this conduction this two second conductive pad of electric connection that circulates.
According to above-mentioned technical characterictic, beneficial effect of the present invention is to utilize the various passive devices of multi-layer sheet structure fabrication.For example utilize high density to connect (High Density Interconnection, HDI) increase the layer multi-layer plate, passive devices such as the electric capacity that radio-frequency switch circuit is required, inductance, resistance are integrated in the multi-layer sheet, can be applicable to reach the purpose that reduces cost with miniaturization simultaneously in the RF front-end module (RF Front End Module) of wireless telecommunications, the sub-product of mobile radio etc.
Description of drawings
Figure 1A is depicted as a schematic front perspective view, illustrates that the first embodiment of the present invention makes built-in electric capacity.
Figure 1B is depicted as a generalized section, illustrates that the first embodiment of the present invention makes built-in electric capacity.
Fig. 1 C is depicted as a generalized section, illustrates that the second embodiment of the present invention makes built-in electric capacity.
Fig. 2 A is depicted as a schematic front perspective view, illustrates that the first embodiment of the present invention makes built-in resistance.
Fig. 2 B is depicted as a generalized section, illustrates that the first embodiment of the present invention makes built-in resistance.
Fig. 3 A is depicted as a front schematic view, illustrates that the first embodiment of the present invention makes surperficial inductance.
Fig. 3 B is depicted as a front schematic view, and second embodiment of the present invention making inductance element is described.
Fig. 3 C is depicted as the generalized section of Fig. 3 B.
Figure 4 shows that a schematic layout pattern, illustrate one of the present invention embodiment with each element application in an electronic module.
Symbol description among the figure:
10 increase the layer multi-layer plate structure
The 10a surface
12a, 12b, 12c, 12d, 12e dielectric layer
14,24 outer conductive layers
14a, 14b, 24a, 24b conductive pad
14c conducts electricity circulation
15b, 15a, 17a, 17b conduction connecting structure
16,18,20,22 internal layer conductive layers
The 16c conductive trace
16b, 20a top crown
18a, 22b bottom crown
16a, 20c resistance body
100 single-pole double throw modules
102,104,109,110,111,112,115,116 electric capacity
107,108 diode IC
117,118 resistance
121 inputs
122,123 outputs
Embodiment
Embodiments of the invention are described in detail as follows with schematic diagram, and when embodiments of the invention were described in detail in detail, expression increases the part of layer multi-layer plate can amplify demonstration and explanation, so should be with this as the cognition that qualification is arranged.In addition, increasing in the layer multi-layer plate of reality, can comprise other necessary part in this structure.
Secondly, when each element in the embodiments of the invention accompanying drawing or structure during with single element or structrual description explanation, should be with this as the cognition that qualification is arranged, be following explanation not during the restriction on the lay special stress on number, spirit of the present invention and range of application can be spreaded on most elements or structure and structure of depositing and the method.
Figure 1A is depicted as a schematic front perspective view, illustrates that the first embodiment of the present invention makes built-in electric capacity (built-in capacitor, embedded capacitor).Increase in the wantonly two adjacent internal layer conductive layers parallel to each other in the layer multi-layer plate structure 10 (at interval a dielectric layer) in one and to form overlapping last bottom crown 16b and 18a respectively, top crown 16b contacts and is connected to conductive pad 14b on the outer conductive layer by passing the conduction connecting structure (not showing on the figure) that increases layer multi-layer plate structure 10.Bottom crown 18a contact also is connected to conductive pad 14a on the outer conductive layer by passing the conduction connecting structure 15a, the 15b that increase layer multi-layer plate structure 10.Can be connected with the external world to control this built-in electric capacity with 14a by the conductive pad 14b that is positioned at outer conductive layer.
Figure 1B is depicted as a generalized section, illustrates that the first embodiment of the present invention makes built-in electric capacity.Increasing layer multi-layer plate structure 10 is made up of between wantonly two adjacent conductive layers a plural conductive layer and a dielectric layer.In an embodiment, increase layer multi-layer plate structure 10 and have internal layer conductive layer parallel to each other 16,18,20 and 22 and outer conductive layer 14 and 24, be separated by with dielectric layer 12a, 12b, 12c, 12d and 12e respectively therebetween.In a preferred embodiment, consider the factor of signal transmission, in increasing in the layer method of symmetry, dielectric layer 12a can be the identical dielectric layer of material with 12e, the RCC/pre-preg of low-k for example, loss and propagation delay in the time of can decreasing in high frequency/high-speed transfer; Dielectric layer 12b can also be the identical dielectric layer of material with 12d, and for example the RCC of high-k can be used to design built-in electric capacity; Dielectric layer 12c then can be a core baseplate material, so that integrally-built mechanical strength to be provided, but the invention is not restricted to above-mentioned.
Moreover internal layer conductive layer 16,18,20 and 22 is a material with the thin copper foil plate, through after general configuration and the palm fibre/melanism again with outer conductive layer 14 and 24, dielectric layer 12a, 12b, 12c, 12d and 12e mode lamination pressing to increase layer.In present embodiment, internal layer conductive layer 16,18,20 and 22 layout comprise last bottom crown 16b, 18a and 20a, the 22b of capacity cell, wherein last bottom crown 16b and the 18a of a dielectric layer 12b have certain geometry specific and close size at interval in pairs and only, a rectangle for example, to meet the requirement of capacity cell, secondly, be overlapping fully haply on the position, electrically on then not with other line conduction of place internal layer conductive layer.In like manner paired last bottom crown 20a and 22b also are.Moreover, paired last bottom crown 16b must contact conduction connecting structure 15b and 15a (or conduction connecting structure 17a and 17b) respectively with 18a (or going up bottom crown 20a and 22b), and passes through conduction connecting structure 15b and be connected with 15a (or conduction connecting structure 17a and 17b) and contact conductive pad 14b and 14a (or conductive pad 24a and 24b) on the outer conductive layer 14 (or 24) extremely.In this embodiment, conduction connecting structure 15b, 15a, 17a and 17b comprise the conductive blind hole that passes at least one dielectric layer, conduction buried via hole, and can couple together by conductive blind hole or the conduction buried via hole that partially conductive trace on the internal layer conductive layer or connection gasket will run through the different dielectric layer.
According to above-mentioned, spirit utilization of the present invention increases the symmetry up and down of layer multi-layer plate structure 10 and carries out the design of double-sided wiring, can reduce module size and cost.Secondly, increase layer multi-layer plate structure 10 in the present embodiment and make, also can reduce cost with the Layer increasing method of the 2+2+2 of higher process rate.Be noted that spirit of the present invention must be not limited to six layers and increase the layer multi-layer plate, also can spread to four, eight or ten layers and increase layer multi-layer plate structure 10.
Fig. 1 C is depicted as a generalized section, illustrates that the second embodiment of the present invention makes built-in electric capacity.With first embodiment in the same manner, increase layer multi-layer plate structure 10 and have internal layer conductive layer 16,18,20 and 22 and outer conductive layer 14 and 24, be separated by with dielectric layer 12a, 12b, 12c, 12d and 12e respectively therebetween.Different with first embodiment is in present embodiment only in one or more built-in electric capacity of single face layout, bottom crown can lay respectively on the internal layer conductive layer of wantonly two adjacent (only interval one dielectric layers) on this moment, as shown in scheming to go up, last bottom crown 20b and 22a lay respectively on internal layer conductive layer 20 and 22.Understandable, this moment conduction connecting structure 15a with 15b respectively by the conductive blind hole that passes multilayer dielectric layer, conduction buried via hole, be connected the conductive blind hole that runs through the different dielectric layer or partially conductive trace or the connection gasket that conducts electricity buried via hole formed.
Fig. 2 A is depicted as a schematic front perspective view, illustrates that the first embodiment of the present invention makes built-in resistance (built-in capacitor, embedded resistor).Resistance body 16a is arranged in arbitrary internal layer conductive layer, and its contact and be connected to conductive pad 14a on the outer conductive layer by passing the some conduction connecting structure 15a that increase layer multi-layer plate structure 10.Can be connected with the external world to control this built-in resistance by the conductive pad 14a that is positioned at outer conductive layer.
Fig. 2 B is depicted as a generalized section, illustrates that the first embodiment of the present invention makes built-in resistance.Identical when making built-in electric capacity, increase layer multi-layer plate structure 10 and have internal layer conductive layer 16,18,20 and 22 and outer conductive layer 14 and 24, be separated by with dielectric layer 12a, 12b, 12c, 12d and 12e respectively therebetween.Some resistance body 16a and 20c lay respectively on arbitrary internal layer conductive layer 16 and 20, and resistance body 16a or 20c have a certain size geometry, electrically on then not with other line conduction of place internal layer conductive layer.Secondly, resistance body 16a or 20c are in edge or end points place and the conduction connecting structure 15a or the 17a of geometry, for example conductive blind hole contact, and connect and the conductive pad 14a (or conductive pad 24a) of contact to the outer conductive layer 14 (or 24) by conduction connecting structure 15a or 17a.
Fig. 3 A is depicted as a front schematic view, illustrates that the first embodiment of the present invention makes surperficial inductance.On a surperficial 10a who increases layer multi-layer plate structure 10, have one or some (only showing) surperficial inductance and other conducting wiring (not showing on the figure) with one in this.Each surperficial inductance is contacted with two conductive pad 14a by the conduction circulation 14c that is arranged in parallel with each other and the end points that is positioned at conduction circulation 14c is formed.The number of turns, the width of conduction circulation 14c are different because of design with length, and geometry and the size of conductive pad 14a also become with design, are not limited to represented person on the figure.
Fig. 3 B is depicted as a front schematic view, and second embodiment of the present invention making inductance element is described.Be at least one conduction circulation 14c of surperficial inductance different with first embodiment distributes with concentrically ringed mode socket.Moreover though an end and the arbitrary conductive pad 14a of conduction circulation 14c are positioned on the same surperficial 10a, both contact by conduction connecting structure 15a, conductive trace 16c and are connected.In present embodiment, conduction connecting structure 15a by respectively with the conductive blind hole of conduction circulation 14c one end and arbitrary conductive pad 14a contact be connected the conductive trace 16c that contacts two conductive blind holes and formed, wherein conductive trace 16c is arranged in arbitrary internal layer conductive layer.
Fig. 3 C is depicted as the generalized section of Fig. 3 B.Increase layer multi-layer plate structure 10 and have internal layer conductive layer 16,18,20 and 22 and outer conductive layer 14 and 24, be separated by with dielectric layer 12a, 12b, 12c, 12d and 12e respectively therebetween.Two conductive pad 14a of inductance element are positioned at outer conductive layer 14 with conduction circulation 14c, and conduction connecting structure 15a then comprises conductive trace 16c that is positioned at internal layer conductive layer 16 and the conductive blind hole that is connected with conductive trace 16c two end in contact.Understandable, conductive trace of the present invention and the conductive blind hole that is connected with conductive trace two end in contact are not limited to the graphic middle revealer of institute, the neither scope of the invention of taking off of the conductive trace of multilayer between the conductive blind hole of multilayer and the conductive blind hole.
Figure 4 shows that a schematic layout pattern, illustrate one of the present invention embodiment with each element application in an electronic module.With reference to Fig. 4, (Single-Pole Double-Throw, SPDT) module 100 has an input 121, two outputs 122 and 123, two resistance 117 and 102,104,109,110,111,112,115 and 116, two inductance 105 of 118, eight electric capacity and 106 and two diode IC (or transistor I C) 107 and 108 to one single-pole double throw.Its operating principle utilizes the conducting of control signal control diode IC 107 and 108 or closes, and corresponds to output 122 or 123, makes the input signal of input 121 can select one of two outputs 122 and 123 as signal output, reaches the effect of switch.
Compared to the single-pole double throw module of general use surface adhering element (SMD), the single-pole double throw module 100 of present embodiment adopts surface or the built-in element in the above-mentioned institute drawings attached, can effectively reduce the area of employed circuit board.For instance, it is 1000 Mils (mil) *, 400 Mils that tradition is used the required board area of single-pole double throw module of surface adhering element, the required board area of single-pole double throw module with identical function of present embodiment is 440 Mils (mil) *, 300 Mils, has dwindled 70% area than tradition.
According to above-mentioned, one of the present invention embodiment provides a kind of single-pole double throw module, comprises one and increases layer multi-layer plate structure, some resistive elements, inductance element and capacity cell.Increasing the layer multi-layer plate structure, to comprise the plural conductive layer parallel to each other, and wherein two conductive layers are positioned at two surfaces that increase the layer multi-layer plate structure.A plurality of dielectric layers, wherein arbitrary dielectric layer is between wantonly two conductive layers.The plural conductive structure, wherein the partially conductive structure is passed the part dielectric layer with contact and wantonly at least two conductive layers of connection.Resistive element is formed by the part of the conductive layer that is positioned at arbitrary surface.Capacity cell is made up of a top crown, a bottom crown, different two conductive structures and two first conductive pads at least, top crown and bottom crown are formed by different and adjacent two a conductive layers part separately, two wherein different conductive structures contact top crown and bottom crown separately, two different conductive structures contact arbitrary first conductive pad separately, and arbitrary first conductive pad part that is the conductive layer on arbitrary surface.One inductance element is made up of with two second conductive pads at least one conduction circulation, and conduction circulation and two second conductive pads are that a part and the conduction circulation of the conductive layer on arbitrary surface electrically connects two second conductive pads.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (10)
1. the switch module of wireless telecommunications is characterized in that, comprises:
One increases the layer multi-layer plate structure, and this increases, and the layer multi-layer plate structure has the plural conductive layer and a plurality of dielectric layer is superimposed with each other, and wherein has arbitrary at least this dielectric layer between wantonly two these conductive layers; And
At least one passive device is the part of arbitrary at least this conductive layer and electrically connects the plural conductive pad that wherein this plural conductive pad is positioned on this at least one surface that increases the layer multi-layer plate structure.
2. the switch module of wireless telecommunications as claimed in claim 1 is characterized in that, this passive device comprises a capacity cell.
3. the switch module of wireless telecommunications as claimed in claim 2, it is characterized in that, this capacity cell comprises a top crown and a bottom crown is positioned at two different adjacent these conductive layers, and connect arbitrary this conductive pad with conductive blind hole contact respectively, and this top crown becomes position overlapped relation up and down with this bottom crown.
4. the switch module of wireless telecommunications as claimed in claim 1 is characterized in that, this passive device comprises a resistive element, and this resistive element has a resistance body and contacts this plural conductive pad and be positioned on this surface.
5. the switch module of wireless telecommunications as claimed in claim 1, it is characterized in that, this passive device comprises an inductance element, this inductance element have at least one conduction circulation this plural conductive pad of contact and be positioned on this surface, two conductive blind holes contact this conduction circulation and this conductive pad respectively, and at least one conductive trace is positioned at and increases the layer multi-layer plate structure to contact this two conductive blind hole.
6. the single-pole double throw module of wireless telecommunications is characterized in that, comprises:
One increases the layer multi-layer plate structure, and this increases the layer multi-layer plate structure and comprises:
The plural conductive layer is parallel to each other, and wherein two these conductive layers are positioned at this two surfaces that increase the layer multi-layer plate structure;
A plurality of dielectric layers, wherein arbitrary this dielectric layer is between wantonly two these conductive layers; And
The plural conductive structure, wherein this plural conductive structure of part is passed this dielectric layer of part with contact and connection wantonly at least two these conductive layers;
One resistive element is formed by a part that is positioned at arbitrary this conductive layer that should the surface;
One capacity cell is made up of a top crown, a bottom crown, different two these conductive structures and two first conductive pads at least, this top crown and this bottom crown are formed by different and adjacent two these conductive layers part separately, two different these conductive structures contact this top crown and this bottom crown separately, two different these conductive structures contact arbitrary this first conductive pad separately, and arbitrary this first conductive pad is the part of arbitrary this conductive layer that should the surface; And
One inductance element is made up of with two second conductive pads the circulation of at least one conduction, and this conduction circulation and this two second conductive pad are the part of arbitrary this conductive layer that should the surface and this conduction this two second conductive pad of electric connection that circulates.
7. the single-pole double throw module of wireless telecommunications as claimed in claim 6 is characterized in that, arbitrary this conductive structure comprises at least one conductive blind hole and passes at least one this dielectric layer.
8. the single-pole double throw module of wireless telecommunications as claimed in claim 7 is characterized in that, arbitrary this conductive structure more comprises at least one conductive trace contact and connects this conductive blind hole.
9. the single-pole double throw module of wireless telecommunications as claimed in claim 6 is characterized in that, this top crown becomes lap position relation with this bottom crown.
10. the single-pole double throw module of wireless telecommunications as claimed in claim 6 is characterized in that, more comprise a diode element be fixed in arbitrary should this conductive layer on surface on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100754387A CN100550632C (en) | 2005-06-01 | 2005-06-01 | Switch module and single-pole double-throw module of wireless communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100754387A CN100550632C (en) | 2005-06-01 | 2005-06-01 | Switch module and single-pole double-throw module of wireless communication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1874154A true CN1874154A (en) | 2006-12-06 |
| CN100550632C CN100550632C (en) | 2009-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100754387A Expired - Fee Related CN100550632C (en) | 2005-06-01 | 2005-06-01 | Switch module and single-pole double-throw module of wireless communication |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104412348A (en) * | 2012-06-18 | 2015-03-11 | 罗森伯格高频技术有限及两合公司 | switch |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000077911A (en) * | 1998-09-02 | 2000-03-14 | Murata Mfg Co Ltd | Multilayer-transmission-line and electronic part using the same |
| JP2003087149A (en) * | 2001-09-14 | 2003-03-20 | Matsushita Electric Ind Co Ltd | High frequency composite switch module |
| JP4025654B2 (en) * | 2003-01-29 | 2007-12-26 | 京セラ株式会社 | High frequency module |
| JP2004357037A (en) * | 2003-05-29 | 2004-12-16 | Ngk Spark Plug Co Ltd | High frequency switch module and radio telephone terminal using the same |
| JP4310461B2 (en) * | 2003-10-01 | 2009-08-12 | 株式会社村田製作所 | Switching power supply module |
-
2005
- 2005-06-01 CN CNB2005100754387A patent/CN100550632C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104412348A (en) * | 2012-06-18 | 2015-03-11 | 罗森伯格高频技术有限及两合公司 | switch |
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| Publication number | Publication date |
|---|---|
| CN100550632C (en) | 2009-10-14 |
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