CN1862329A - Fabricating method of flexible display - Google Patents

Abstract

A method for manufacturing a flexible display includes the steps of: setting an adhesive layer, a first passivation layer and a second passivation layer, the adhesive layer includes a first adhesive material on a first surface of a support layer, an adhesive layer of a second adhesive material on the second surface of the support layer and a third adhesive material surrounding an edge of the second adhesive material, wherein the second adhesive material has a lower bond strength than the first adhesive material Strength, the bonding strength of the third bonding material is higher than the bonding strength of the second bonding material; the first passivation layer is adhered to the first surface of the support layer with the first bonding between the two material; and a second passivation layer adhered to the second surface of the support layer with a second bonding material and a third bonding material disposed therebetween; peeling off the first passivation layer from the bonding layer; The rigid substrate is adhered to the first adhesive material; the second passivation layer is peeled from the adhesive layer; and the flexible substrate is adhered to the second and third adhesive materials.

Description

Manufacturing method of flexible display

This application claims the benefit of application number P2005-40240 filed in Korea on May 13, 2005 and application number P2005-63930 filed in Korea on July 14, 2005, the entire contents of which are incorporated herein by reference .

technical field

The invention relates to a flexible display, in particular to a manufacturing method for preventing a substrate from falling off during the manufacturing process of the flexible display.

Background technique

Recently, the display market has changed rapidly, and the central position has been taken by flat panel display (FPD) devices. It is easy to manufacture the FPD device as a large-sized, thin and light display device. The FPD device includes a liquid crystal display (LCD), a plasma display panel (PDP), an organic electroluminescent display (OLED), and the like. However, existing liquid crystal displays, plasma display panels, and organic electroluminescent displays are all made of glass substrates, which limit their applications due to their inflexibility.

Accordingly, flexible displays that can be bent have been fabricated using substrates composed of flexible materials such as plastic or foil, and have rapidly risen as next-generation displays replacing existing glass substrates that do not have flexibility. Flexible displays are often referred to as "bendable displays" or "rollable displays". Methods for realizing flexible displays can be classified into two types: methods using existing displays and methods using e-paper.

The method of using the existing display device is to make the thin film transistor liquid crystal display device, organic electroluminescent display device material and the like flexible. In contrast, with regard to methods employing electronic paper, studies have been started on electrophoretic display devices using cholesteric liquid crystals, using microcapsules, electrophoresis, and hemispherical twistballs charged by electrostatic charges. The disadvantage of this electronic paper is that it is difficult to achieve full color and has limitations in realizing moving images due to the slow working speed.

Therefore, the focus of many recent investigations has been on the study of implementing flexible display devices using existing display devices. For this reason, the subject of research is to fabricate a display portion and a switch portion in the core portion of an existing display device having flexibility, including a display portion, a driving portion, and a switch portion.

Specifically, in order to impart flexibility to a display portion of a flexible display device, a flexible substrate should be used. However, the electrodes should be accurately formed in the manufacturing process of the display device, and thus the substrate should play a sufficient supporting role. For this, it should be glued to a rigid substrate. In adhering a rigid substrate, using an adhesive that is both attachable and detachable, there is a problem in the manufacturing process of a flexible display because the adhesive may separate when the rigid substrate and the flexible substrate are adhered to each other.

Contents of the invention

Accordingly, the present invention is directed to a method of fabricating a flexible display that substantially overcomes one or more of the problems due to limitations and disadvantages of the related art.

The object of the present invention is to provide a flexible display manufacturing method that prevents the substrate from falling off during the flexible display manufacturing process.

Additional advantages and features of the invention will be set forth in the description which follows, and in part will become apparent to those skilled in the art from the description, or may be learned by practice of the invention. These and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other advantages, and in accordance with the purposes of the present invention, as specifically and broadly described, a method of manufacturing a flexible display includes providing an adhesive layer, a first passivation layer, and a second passivation layer, the adhesive layer comprising an adhesive layer of a first adhesive material on the first surface of the support layer, a second adhesive material on the second surface of the support layer, and a third adhesive material surrounding the edge of the second adhesive material, wherein the second adhesive The bonding strength of the material is lower than that of the first bonding material, and the bonding strength of the third bonding material is higher than that of the second bonding material; the first passivation layer is adhered to the second layer of the support layer. On one surface, a first bonding material is arranged between the two; and the second passivation layer is adhered to the second surface of the support layer, and a second bonding material and a third bonding material are arranged between the two. peeling the first passivation layer from the bonding layer; attaching the rigid substrate to the first bonding material; peeling the second passivation layer from the bonding layer; and adhering the flexible substrate to the second and on the third bonding material.

In another aspect, a method of manufacturing a flexible display includes the steps of providing an adhesive layer, a first passivation layer, and a second passivation layer, the adhesive layer comprising a first adhesive material on a first surface of a support layer, The second adhesive material located on the second surface of the support layer and the adhesive layer located on the second adhesive material with a third adhesive material whose adhesive strength is greater than that of the second adhesive material, wherein the adhesive strength of the second adhesive material lower than the bonding strength of the first bonding material; the first passivation layer is adhered to the first surface of the support layer with the first bonding material disposed therebetween; and the second passivation layer is adhered to On the second surface of the support layer, a second adhesive material and a third adhesive material are disposed therebetween; peeling off the first passivation layer from the adhesive layer; adhering the rigid substrate to the first adhesive material peeling off the second passivation layer from the adhesive layer; and adhering the flexible substrate to the second and third adhesive materials.

In another aspect, a method of manufacturing a flexible display includes the steps of providing an adhesive layer, a first passivation layer, and a second passivation layer, the adhesive layer comprising a first adhesive material on a first surface of a support layer, An adhesive layer of a second adhesive material on the second surface of the support layer, wherein the adhesive strength of the second adhesive material is lower than the adhesive strength of the first adhesive material; the first passivation layer is adhered to the support layer On the first surface, a first bonding material is arranged between the two; and the second passivation layer is adhered to the second surface of the support layer, and a second bonding material is arranged between the two; from the adhesive Peel off the first passivation layer on the bonding layer; adhere the rigid substrate to the first adhesive material; peel off the second passivation layer from the adhesive layer; form a higher bond strength on the second adhesive material than the second a third bonding material of bonding material; and adhering the flexible substrate to the second and third bonding materials.

In another aspect, the method for manufacturing a flexible display includes forming first and second jig substrates having a first groove and a second groove formed at a lower portion of an edge of the first groove; coating an adhesive on the second groove; fixing the first and second flexible substrates to the first groove and the adhesive; manufacturing an upper array substrate on the first flexible substrate and manufacturing a lower array substrate on the second flexible substrate; bonding the upper array substrate to the lower Injecting liquid crystals on and between the array substrates; peeling off the first and second flexible substrates from the first and second fixture substrates.

It is to be understood that both the foregoing general description and the following detailed description are schematic and explanatory and are intended to provide further explanation of the claims of the present invention.

Description of drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the principle of the invention. In the attached picture:

1A to 1C are diagrams showing a method of manufacturing a flexible display;

2A to 2C are diagrams illustrating the bonding process;

3A to 3E are diagrams showing a manufacturing method of an upper array substrate;

4A to 4D are diagrams showing a manufacturing method of the lower array substrate;

5A and 5B are diagrams showing a bonding structure according to a first exemplary embodiment of the present invention;

Fig. 6 is a bonding structure diagram according to a second exemplary embodiment of the present invention;

7A and 7B are diagrams illustrating a bonding process of a flexible display according to a third exemplary embodiment of the present invention;

8A to 8C are diagrams illustrating a bonding process of a flexible display according to a fourth exemplary embodiment of the present invention;

Fig. 9 is a diagram showing a part of the manufacturing method of the flexible display;

10A and 10B are diagrams showing a peeling process of a flexible display according to a fourth exemplary embodiment of the present invention; and

Fig. 11 is a schematic cross-sectional structure diagram of an organic electroluminescent display device.

Detailed ways

Reference will now be made in detail to the preferred mode of carrying out the invention, examples of which are illustrated in the accompanying drawings. In the drawings, the thicknesses of specific regions to be shown are exaggerated in order to facilitate understanding of the present invention. An exemplary embodiment of the present invention will be described below with reference to FIGS. 1A to 11 .

As shown in FIGS. 1A to 1C, the manufacturing process of the flexible liquid crystal display according to the present invention is mainly divided into a substrate bonding process (S1), an upper array substrate manufacturing process (S2), a lower array substrate manufacturing process (S3), a liquid crystal process ( S4), peeling process (S5) and module process (S6). The substrate bonding process S1 is a process for bonding the flexible substrate 45 that provides flexibility to the display device and the rigid substrate 47 that provides support to accurately perform the electrode forming process to the rigid substrate 47 . Here, the rigid substrate 47 is formed of a glass substrate and the flexible substrate 45 is formed of a plastic substrate having high heat resistance characteristics.

The substrate bonding step ( S1 ) will be described in detail with reference to FIGS. 2A to 2C . The upper and lower array substrate manufacturing steps (S2, S3) are steps for forming R, G, B pixels, main electrodes, and the like. The manufacturing steps ( S2 , S3 ) of the upper and lower array substrates will be described in detail below in FIGS. 3A to 4D . The liquid crystal step ( S4 ) is a step of bonding the two substrates manufactured in the upper and lower array substrate manufacturing steps ( S2 , S3 ) together, and injecting liquid crystal into the liquid crystal layer space 49 thereof. The peeling process ( S5 ) is a process of peeling off the flexible substrate 45 and the rigid substrate 47 passing through the upper/lower portions of the liquid crystal process ( S4 ).

To describe the peeling process ( S5 ) in detail, as shown in FIG. 1B , the flexible substrate 45 adhered to the bonding surface with low adhesive strength is peeled off. Then, as shown in FIG. 1C, the rigid substrate 47 is peel-bonded to the bonded surface with high bond strength. In FIGS. 1B and 1C , electrodes and color filters formed on the flexible substrate 45 after the upper/lower array substrate process ( S2 , S3 ) are not shown. The module process ( S6 ) is a process of completing a module by performing a process of bonding a polarizer and mounting a driving circuit on the panel on which the processes of S1 to S5 are completed.

The substrate bonding process is discussed below by referring to FIGS. 2A to 2C.

As shown in FIGS. 2A-2C , a rigid substrate 47 that provides support to accurately perform electrode formation and a flexible substrate 45 that provides flexibility for the display are bonded to the adhesive layer 1 .

As shown in FIG. 2A, the adhesive layer 1 includes a support layer 1b and adhesive materials 1a and 1c bonded to the first surface and the second surface of the support layer 1b. The support layer 1b is located in the middle of the support layer 1 and serves to support the adhesive materials 1a, 1c. The support layer 1b is a polymer material with excellent heat resistance, and the material is mainly composed of polyimide PI.

The adhesive materials 1a, 1c are arranged opposite each other with a support layer 1b arranged between them. The adhesive materials 1a, 1c are formed of a material having excellent heat resistance and are mainly composed of acrylic resin or silicon-based materials.

The adhesive strength of the first adhesive material 1a for bonding the rigid substrate 47 and the second adhesive material 1c for bonding the flexible substrate 45 may be formed so as to be stronger or weaker depending on the component strength of the adhesive materials 1a and 1c. In FIG. 2A, the second adhesive material 1c has a lower adhesive strength than the first adhesive material 1a. The adhesive layer 1 is covered by a first and a second passivation layer 11a and 11b, which block the contact with the outside world.

Referring to FIG. 2B, in the substrate bonding process (S1), the first passivation layer 11a is peeled off and the rigid substrate 47 is bonded to the first adhesive material 1a. As shown in FIG. 2C , in the substrate bonding process ( S1 ), after peeling off the second passivation layer 11 b of the adhesive layer 1 , the flexible substrate 45 is bonded to the second adhesive material 1 c. The purpose of forming the adhesive layer 1 by the double adhesive strength of the first adhesive material 1a and the second adhesive material 1c is to gradually peel off the flexible substrate 45 and the rigid substrate when performing the peeling process (S5) as shown in FIGS. 1B and 1C. 47.

The upper/lower array substrate process (S2, S3) is a process of forming basic electrodes. The lower array substrate includes a plurality of signal lines, thin film transistors and alignment layers scattered thereon for aligning liquid crystals. The upper array substrate includes a color filter for realizing color, a black matrix for preventing light leakage, and an alignment layer scattered thereon for aligning liquid crystals.

3A to 3E are step-by-step diagrams showing the manufacturing process (S2) of the upper array substrate.

First, as shown in FIG. 3A, after the aforementioned substrate bonding process (S1), an opaque material such as opaque metal or opaque resin is deposited on the first flexible substrate 45a, and the organic material is patterned through a photolithography process and an etching process, thereby A black matrix 3 is formed. The opaque metal is usually chrome and the opaque resin is usually an organic material. As shown in FIG. 3B , after depositing a red resin on the first flexible substrate 45 a formed with the black matrix 3 , the red resin is patterned through a photolithography process and an etching process, thereby forming a red color filter R. As shown in FIG. 3C , after the green resin is deposited on the first flexible substrate 45a formed with the red color filter R, the green resin is patterned through a photolithography process and an etching process, thereby forming a green color filter G. As shown in FIG. 3D , after depositing a blue resin on the first flexible substrate 45a on which the green color filter G is formed, the blue resin is patterned through a photolithography process and an etching process, thereby forming a blue color filter B. As shown in the upper array substrate manufacturing process (S2) of Figure 3E, after depositing a transparent conductive material on the first flexible substrate 45a formed with red, green and blue color filters, the transparent conductive material is patterned through a photolithography process and an etching process. material, thereby forming the common electrode 35.

The lower array substrate manufacturing method ( S3 ) using the four-round masking process will be described below by referring to FIGS. 4A to 4D as an example.

First, as shown in FIG. 4A , the first conductive layer including the gate line 2, the gate 8 and the lower electrode 26 of the gate pad is formed on the second flexible substrate 45b after the substrate bonding process (S1) by using the first mask process. pattern set. Referring to the process of forming the first conductive pattern group in detail, a gate metal layer is formed on the second flexible substrate 45b by a deposition method such as sputtering. Subsequently, the gate metal layer is patterned through a photolithography process and an etching process using a first mask, thereby forming a first conductive pattern group including gate lines 2 , gate electrodes 8 and gate pad lower electrodes 26 . Here, the gate metal layer is made of aluminum group metal.

As shown in FIG. 4B, a gate insulating layer 46 is coated on the second flexible substrate 45b forming the first conductive pattern group. Form a semiconductor pattern comprising an active layer 48 and an ohmic contact layer 50 on the gate insulating layer 46 by using a second mask process; 22 second conductive pattern group.

The process of forming the second conductive pattern group will now be described in detail. A gate insulating layer 46, an amorphous silicon layer, an n+ amorphous silicon layer, and a source/drain metal layer are sequentially formed on the second flexible substrate 45b formed with the first conductive pattern group by a deposition method such as PECVD or sputtering. Here, the gate insulating layer 46 is formed of an inorganic insulating material such as silicon oxide SiOx or silicon nitride SiNx. Molybdenum Mo, titanium Ti, tantalum Ta, or a molybdenum alloy are used as source/drain metals.

Subsequently, a photoresist pattern is formed on the source/drain metal layer through a photolithography process using a second mask. In this way, the diffraction exposure mask having the diffraction exposure portion at the channel portion of the thin film transistor is used as the second mask. Therefore, the photoresist pattern of the channel portion is lower than the source/drain pattern portion.

Next, the source/drain metal layer is patterned through a wet etching process using a photoresist pattern, thereby forming a data line 4 , a source electrode 10 , a drain electrode integrated with the source electrode 10 , and a storage electrode 22 . Then, the n+ amorphous silicon layer and the amorphous silicon layer are patterned through a dry etching process using the same photoresist pattern, thereby forming the ohmic contact layer 50 and the active layer 48 .

After removing the photoresist pattern with a relatively low height at the channel portion through an ashing process, the source/drain metal pattern and the ohmic contact layer 50 of the channel portion are etched through a dry etching process. Therefore, the active layer 48 of the channel portion is exposed to separate the source electrode 10 and the drain electrode 12 . Subsequently, the photoresist pattern remaining on the second conductive pattern group is removed through a stripping process.

Referring to FIG. 4C, a passivation layer 52 including first to fourth contact holes 13, 21, 27, 33 is formed on the gate insulating layer 46 forming the second conductive pattern group through a third mask process. In detail, the passivation layer 52 is formed on the gate insulating layer 46 formed with the second conductive pattern group by a deposition method such as PECVD. Subsequently, the passivation layer 52 is patterned through a photolithography process and an etching process using a third mask, thereby forming first to fourth contact holes 13 , 21 , 27 , and 33 . The first contact hole 13 penetrates the passivation layer 52 to expose the drain electrode 12, the second contact hole 21 penetrates the passivation layer 52 to expose the storage electrode 22, and the third contact hole 27 penetrates the passivation layer 52 and the gate insulating layer 46 to expose the drain electrode 12. The gate pad lower electrode 26 is exposed, and the fourth contact hole 33 penetrates the passivation layer 52 to expose the data pad lower electrode 32 . Here, when a metal with a high etching rate such as molybdenum is used as the source/drain metal, the first, second, and fourth contact holes 13, 21, and 33 penetrate to the drain electrode 12, the storage electrode 22, and the data pad respectively. The electrodes 32 are exposed on their sides. The passivation layer 52 is composed of an inorganic insulating layer such as the gate insulating layer 46 or an organic insulating material such as PFCB, BCB, or an acrylic organic compound having a low dielectric constant.

Referring to FIG. 4D , a third conductive pattern group including the pixel electrode, the gate pad upper electrode 28 and the data pad upper electrode 34 is formed on the passivation layer 52 through a fourth mask process. Specifically, a transparent conductive layer is coated on the passivation layer 52 by a deposition method such as sputtering. Subsequently, the transparent conductive layer is patterned through a photolithography process and an etching process using a fourth mask, thereby forming a third conductive pattern group including the pixel electrode 14 , the upper electrode 28 on the gate pad and the upper electrode 34 on the data pad. The pixel electrode 14 is electrically connected to the drain electrode through the first contact hole 13 and is electrically connected to the storage electrode 22 through the second contact hole 21 . The gate pad upper electrode is electrically connected to the gate pad lower electrode 26 through the third contact hole 37 . The data pad upper electrode 34 is electrically connected to the data pad lower electrode 32 through the fourth contact hole 33 .

Here, the transparent conductive layer is composed of one of indium tin oxide ITO, tin oxide TO, zinc tin oxide ITZO and indium zinc oxide IZO. The deposition method for forming each electrode as described in the upper and lower array substrate manufacturing processes (S2, S3) includes a PECVD (Plasma Enhanced Chemical Vapor Deposition) method, a sputtering method, and the like. When employing these methods, conditions such as vacuum state, specified substrate temperature, reaction gas, and reaction pressure are required.

On the other hand, small air bubbles may be generated on the surface of the flexible substrate 45 bonded to the second adhesive material 1c and the surface of the rigid substrate 47 bonded to the first adhesive material 1a. These small air bubbles are combined into large air bubbles when a vacuum state is formed in the upper and lower array substrate manufacturing processes (S2, S3). Since the surface bonding strength of the flexible substrate 45 bonded to the second bonding material 1c is relatively smaller than the bonding strength of the surface of the rigid substrate 47 bonded to the first bonding material 1a, the flexible substrate 45 and the second bonding The bonding surface of the material 1c produced a phenomenon in which multiple air bubbles combined into large air bubbles. Therefore, the flexible substrate 45 may be peeled off from the adhesive material 1 during the manufacturing process due to the growing air bubbles.

In addition, the upper and lower array substrate manufacturing processes ( S2 , S3 ) are performed on the flexible substrate 45 which is relatively weaker than the existing liquid crystal display glass substrate. Therefore, the flexible substrate 45 is pressed by conditions such as temperature or pressure generated when deposition is performed, possibly causing shrinkage of the flexible substrate 45 bonded to the second adhesive material 1c. Moreover, since the bonding strength of the second adhesive material 1c is low in the wet etching or cleaning process that occurs when the upper and lower array substrate manufacturing processes (S2, S3) are performed, the flexible substrate 45 bonded to the second adhesive material 1c May peel from adhesive layer 1.

5A to 10B illustrate a method of manufacturing a flexible display according to the present invention for preventing the flexible substrate from being peeled off during the above-mentioned manufacturing process of the flexible display.

5A and 5B are structural diagrams showing an adhesive layer 5 used in the method of manufacturing a flexible substrate according to the first exemplary embodiment of the present invention. As shown in FIGS. 5A and 5B , the adhesive layer 5 according to the first exemplary embodiment of the present invention includes a first adhesive material 5 a, a support layer 5 b, a second adhesive material 5 c, and a third adhesive material 55 . A second adhesive material 5c having an adhesive strength lower than the first adhesive material 5a is formed, and a third adhesive material 55 having an adhesive strength higher than the second adhesive material 5c is formed. The third adhesive material 55 having the same adhesive strength as the first adhesive material 5a can be formed. The support layer 5b provides support for the first to third adhesive materials 5a, 5c, 55. During the manufacturing process of the flexible display, the second adhesive material 1 c in the prior art shown in FIG. 2A has a low adhesive strength, so a peeling phenomenon may occur. In order to prevent this, the third adhesive material 55 having an appropriate width is formed at the edge of the second adhesive material 5c in the first embodiment of the present invention. FIG. 5B is a plan view showing the third adhesive material 55 formed on the edge of the second adhesive material 5c. The adhesive layer 5 having this structure is protected from contact with the outside by the first and second passivation layers 11a, 11b. As described in FIGS. 2B and 2C , according to the first exemplary embodiment of the present invention, the implementation of the adhesive including the adhesive layer 5 and the first and second passivation layers 11a, 11b will provide flexibility to the flexible display. The process of bonding the flexible substrate 45 to the rigid substrate 47.

FIG. 6 shows a structure of an adhesive layer in a method of manufacturing a flexible display according to a second exemplary embodiment of the present invention.

The adhesive layer 6 according to the second exemplary embodiment of the present invention includes a first adhesive material 6 a , a support layer 6 b , a second adhesive material 6 c and a third adhesive material 66 . A second adhesive material 6c having an adhesive strength lower than the first adhesive material 6a is formed, and a third adhesive material 66 having an adhesive strength higher than the second adhesive material 6c is formed. It is also possible to form the third adhesive material 66 having the same adhesive strength as the first adhesive material 6a. The support layer 6b provides support for the first and second adhesive materials 6a, 6c. Forming the third adhesive layer 66 prevents the flexible substrate from peeling off during the manufacturing process of the flexible display. After forming the second adhesive material 6c, the third adhesive layer 66 is formed on the upper edge of the second adhesive material 6c. The adhesive layer 6 and the third adhesive layer 66 are protected from external contact by the first and second passivation layers 11a, 11b. Moreover, as described in FIGS. 2B and 2C , according to the second exemplary embodiment of the present invention, the transfer to the flexible display is performed by using an adhesive including the adhesive layer 6 and the first and second passivation layers 11a, 11b. A process of bonding the flexible flexible substrate 45 to the rigid substrate 47 is provided.

7A and 7B are diagrams illustrating a method of manufacturing a flexible display according to a third exemplary embodiment of the present invention.

The substrate bonding process (S1) according to the third exemplary embodiment of the present invention and the steps of peeling the first passivation layer 11a from the adhesive layer 1 and bonding the rigid substrate 47 thereon shown in FIGS. 2A to 2C described above and The procedure for peeling the second passivation layer 11b from the adhesive layer 1 to which the rigid substrate 47 is bonded is the same. Then, the third exemplary embodiment of the present invention includes a step of printing a third adhesive material 77 having an appropriate width on the upper edge of the second adhesive material 1c from which the second passivation layer 11b has been peeled off. Among the methods of forming the third adhesive material 77, there is a method of forming the third adhesive material 77 in the same manner as the sealant is processed except for the partial printing method. The step of bonding the flexible substrate 45 to the second bonding material 1c and the printed third bonding material 77 is performed after the third bonding material 77 is formed. Here, the third adhesive material 77 having an adhesive strength relatively higher than that of the second adhesive material 1c is formed. It is also possible to form the third adhesive material 77 having the same adhesive strength as the first adhesive material 1a.

In the first to third embodiments of the present invention, preferably, the width of the edge of the second adhesive material 5c, 6c and 7c and the third adhesive material formed on the edge of the second adhesive material 5c, 6c and 7c The width of 55, 66 and 77 is 2-8 mm. If it is formed to be less than 2mm, it is impossible to avoid the peeling phenomenon occurring during the execution of the flexible display device manufacturing process. If the forming width exceeds 8 mm, the flexible substrate 45 and the rigid substrate 47 cannot be gradually peeled off in the peeling process.

8A to 8C are diagrams illustrating a bonding process of a flexible display according to a fourth exemplary embodiment of the present invention. Referring to FIGS. 8A to 8C , a jig substrate 100 including a first groove 113 and a second groove 111 is provided through an etching process as shown in FIGS. 8A and 8B . Next, as shown in FIG. 8C, the adhesive 101 is coated on the second groove 111 of the jig substrate 100, and then the flexible base 103 is bonded to the first groove 113 on the upper part of the jig substrate 100 and coated on the second groove 111. The adhesive 101 on the groove 111 is bonded.

The jig substrate 100 includes a first groove 113 for placing the flexible substrate 101 and a second groove 111 for filling the adhesive 101 . The first groove 113 and the second groove 111 are formed by performing an etching process on a glass substrate of a rigid substrate. The reason for using a glass substrate as a rigid substrate is that when a metal substrate is used, a separate coating process is required to prevent chemical damage, which complicates the manufacturing process of the jig substrate 100 .

The thickness and width of the first groove are formed to be the same as those of the flexible substrate 103 so as to fix the flexible substrate 103 . The first groove 113 fixes the flexible substrate 103 during the manufacturing process of the flexible display, so that the flexible substrate 103 is supported during the manufacturing process of the flexible display. In addition, the second groove 111 is formed at the lower portion of the edge of the first groove 113 to provide a space for coating the adhesive 101 . The width (x) of the second groove is 5mm˜100mm. If the second groove width (x) is less than 5mm, the adhesive force cannot be provided sufficiently, so the flexible substrate is peeled off during the flexible display manufacturing process, and thus not less than 5mm is preferable. In addition, if the second groove width (x) exceeds 100 mm, it is difficult to perform the subsequent peeling process, so it is preferably not more than 100 mm. And, the thickness (y) of forming the second groove is the same as that of the adhesive 101 . Forming the thickness (y) of the second groove as same as the thickness of the adhesive 101 can improve the flexibility when bonding to the adhesive material 66, 77 having a step difference in the second and third exemplary embodiments of the present invention. The resulting step difference between the base plate 45 and the rigid base plate 47 .

9 and 10A-10B are process diagrams after performing the bonding process ( S1 ) of the flexible display according to the fourth exemplary embodiment of the present invention. Specifically, FIGS. 10A and 10B are diagrams illustrating a stripping process of a flexible display according to a fourth exemplary embodiment of the present invention, where electrodes and color filters formed after the upper/lower array substrate process are not shown. The first jig substrate 100a and the first flexible substrate 103a that are about to undergo the upper array substrate manufacturing process (S2) and the second jig substrate 100b and the second flexible substrate 103b that are about to undergo the lower array substrate manufacturing process (S3) perform flexible substrates respectively. 103 and the bonding process of the jig substrate 100 (S1).

Then, as shown in FIG. 9, the upper/lower array substrate manufacturing process (S2, S3) is performed on the upper portion of the flexible substrate adhered to the jig substrate. A detailed description of the upper/lower array substrate manufacturing process ( S2 , S3 ) will be omitted here since it has been described in FIGS. 3A to 4D .

Next, the two substrates manufactured in the upper array substrate manufacturing process (S2) and the lower array substrate manufacturing process (S3) are bonded together, and a liquid crystal process (S4) of injecting liquid crystal 149 into the liquid crystal 140 space is performed. A peeling process (5) of peeling the upper/lower array substrate from the adhesive is performed on the upper/lower array substrate that has passed through the liquid crystal process (S4).

The peeling process ( S5 ) is described in detail with reference to FIGS. 10A and 10B . The peeling process ( S5 ) differs according to the kind of adhesive spread on the second groove 111 . Ultraviolet UV-type and heat-type adhesives and polyimide adhesive tapes having high heat resistance can be used for the adhesive 101 coated in the second groove.

When the ultraviolet light type adhesive is used, if the ultraviolet light is irradiated on the adhesive 101 during the peeling process ( S5 ), the adhesive 101 loses its cohesive force. Accordingly, the first and second flexible substrates 103a, 103b are peeled off from the first and second jig substrates 100a, 100b.

Adhesives that lose adhesive force at a temperature lower than normal temperature and adhesives that lose adhesive force at a temperature between 20° C. and 200° C. can be used as the heating type adhesive. When using the adhesive that loses its cohesive force at lower than normal temperature, the peeling process (S5) is performed by applying a cooling method lower than normal temperature to the adhesive 101 to make it lose its cohesive force (S5). In the case of an adhesive that loses its adhesive force between 20° C. and 200° C., the adhesive 101 is heated at a temperature between 20° C. and 200° C. to cause it to lose its adhesive force, and the peeling process is performed ( S5 ). When the polyimide adhesive tape is used, the edges of the first and second flexible substrates 103a, 103b bonded to the polyimide adhesive tape are ablated by a laser for peeling during the peeling process (S5).

In this way, the manufacturing method of the flexible display can be easily applied to ECB (electrically controlled birefringence) liquid crystal display panels, VA (vertical alignment) mode, and IPS mode and TN mode liquid crystal display panels. In addition, it can also be used in a method of manufacturing an organic electroluminescent display device.

Referring to FIG. 11 , a cross-sectional structure of an organic electroluminescence display device manufactured by applying an exemplary embodiment of the present invention is briefly described. The brief structure of the flexible organic electroluminescent display device includes an anode electrode 84 and a cathode electrode 86 on the top of a flexible substrate 82 , and an organic light-emitting layer 80 formed at intersections of the anode electrode 84 and cathode electrode 86 . If a driving signal is applied to the anode electrode 84 and the cathode electrode 86 of the organic electroluminescence display device having this structure, electrons and holes are emitted, and the electrons and holes emitted from the anode electrode 84 and the cathode electrode 86 are emitted in the organic luminescence. Layer 80 recombines to produce visible light. At this time, the generated visible light is emitted to the outside through the anode electrode 84, thereby displaying specified pictures and images.

As described above, the manufacturing method of the present invention includes the third adhesive material positioned on the upper edge of the second adhesive material used in the substrate bonding process and the edge of the second adhesive material positioned on the adhesive layer, or in the bonding process at the edge of the second adhesive material A step of printing the third adhesive material on the upper edge of the second adhesive material. Therefore, the risk of peeling due to the low adhesive force of the second adhesive material during the process of manufacturing the flexible display device can be reduced. In addition, the first adhesive material protects the sides that are the weak points of the flexible substrate bonded to the second adhesive material, thereby preventing shrinkage of the flexible substrate caused by the stress of the deposited layer generated in each process. Therefore, the stability of the manufacturing process of the flexible display device and the improvement of productivity can be realized.

Also, by forming the jig substrate with the groove for fixing the flexible substrate and the groove for applying the adhesive, the manufacturing process of the flexible display can be performed more stably. The jig is simple to manufacture, thereby simplifying the process and improving productivity and process stability.

It will be clearly understood that various modifications and improvements of the present invention will occur to those skilled in the art. Thus, the present invention is intended to cover all modifications and improvements that come within the scope of the appended claims and their equivalents.

Claims (17)

1, a kind of manufacture method of flexible display comprises step:

Adhesive linkage is set, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and around the adhesive linkage of edge the 3rd adhesives of second adhesives, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, the bonding strength of the 3rd adhesives is higher than the bonding strength of second adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives;

Peel off first passivation layer from adhesive linkage;

Rigid substrates is adhered on first adhesives;

Peel off second passivation layer from adhesive linkage; And

Flexible base, board is adhered on the second and the 3rd adhesives.

2, manufacture method according to claim 1 is characterized in that, the described first and the 3rd adhesives is formed by same material.

3, manufacture method according to claim 1 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.

4, a kind of manufacture method of flexible display comprises step:

Adhesive linkage is set, first passivation layer and second passivation layer, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, be positioned at second adhesives of supporting layer second surface and be positioned on second adhesives bonding strength greater than the adhesive linkage of the 3rd adhesives of second adhesives, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives and the 3rd adhesives;

Peel off first passivation layer from adhesive linkage;

Rigid substrates is adhered on first adhesives;

Peel off second passivation layer from adhesive linkage; And

Flexible base, board is adhered on the second and the 3rd adhesives.

5, manufacture method according to claim 4 is characterized in that, the described first and the 3rd adhesives is formed by same material.

6, manufacture method according to claim 4 is characterized in that, described the 3rd adhesives is formed in the edge of described second adhesives with strip-like-shaped.

7, manufacture method according to claim 6 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.

8, a kind of manufacture method of flexible display comprises step:

Adhesive linkage, first passivation layer and second passivation layer are set, described adhesive linkage comprises first adhesives on the first surface that is positioned at supporting layer, is positioned at the adhesive linkage of second adhesives of supporting layer second surface, wherein the bonding strength of second adhesives is lower than the bonding strength of first adhesives, first passivation layer adheres on the first surface of supporting layer, between the two, be provided with first adhesives, and second passivation layer adhere on the second surface of supporting layer, between the two, be provided with second adhesives;

Peel off first passivation layer from adhesive linkage;

Rigid substrates is adhered on first adhesives;

Peel off second passivation layer from adhesive linkage;

On second adhesives, form the 3rd adhesives that bonding strength is higher than second adhesives; And

Flexible base, board is adhered on the second and the 3rd adhesives.

9, manufacture method according to claim 8 is characterized in that, the described first and the 3rd adhesives is formed by same material.

10, manufacture method according to claim 8 is characterized in that, described the 3rd adhesives is formed in the edge of described second adhesives with strip-like-shaped.

11, manufacture method according to claim 10 is characterized in that, the width of described the 3rd adhesives is between 2mm and 8mm.

12, a kind of manufacture method of flexible display comprises step:

Formation has first groove and is formed at first and second fixture substrates of second groove of the first recess edge bottom;

Coating adhesive on second groove;

First and second flexible base, boards are fixed on first groove and the bonding agent;

Making array base palte on first flexible base, board and array base palte under making on second flexible base, board;

To go up the array substrate bonding to descending on the array base palte and between the two, injecting liquid crystal;

Peel off first and second flexible base, boards from the one the second fixture substrates.

13, manufacture method according to claim 12 is characterized in that, the width of described first groove is between 5mm and the 100mm, and forms described first groove that has with the same thickness of described bonding agent.

14, manufacture method according to claim 12 is characterized in that, forms described second groove with the same width with described flexible base, board and thickness.

15, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove comprises Kapton Tape, and the described step of peeling off first and second flexible base, boards from first and second fixture substrates is carried out at the first and second flexible base, board edges that adopt laser ablation to be bonded in Kapton Tape.

16, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove is included in the bonding agent that loses bonding force under the UV-irradiation, and carries out the described step of peeling off first and second flexible base, boards from first and second fixture substrates by bonding agent being carried out UV-irradiation.

17, manufacture method according to claim 12, it is characterized in that, the bonding agent of coating on described first groove comprises the bonding agent that loses bonding force in response to temperature, and carries out the described step of peeling off first and second flexible base, boards from first and second fixture substrates by bonding agent being applied temperature.

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