CN1858143A - Electronic packaging material - Google Patents
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- CN1858143A CN1858143A CN 200510046366 CN200510046366A CN1858143A CN 1858143 A CN1858143 A CN 1858143A CN 200510046366 CN200510046366 CN 200510046366 CN 200510046366 A CN200510046366 A CN 200510046366A CN 1858143 A CN1858143 A CN 1858143A
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- 239000005022 packaging material Substances 0.000 title claims abstract description 56
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 18
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 17
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 5
- 239000002109 single walled nanotube Substances 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 8
- 239000010703 silicon Substances 0.000 abstract description 8
- 229910021392 nanocarbon Inorganic materials 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011156 metal matrix composite Substances 0.000 description 3
- 238000001132 ultrasonic dispersion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002114 nanocomposite Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
一种电子封装材料，其特征在于：以纳米金属为基体，以纳米碳管作为添加剂制成；所述电子封装材料组成为：纳米碳管：体积比0～35％；纳米金属：余量。所述电子封装材料可以选用纳米铝为基体，以纳米碳管作为添加剂制成。本发明的优点是：此复合材料可与半导体硅同步热膨胀，避免了半导体硅与铝基封装材料之间形成热应力及热裂纹，作为电子封装材料性能优良；材料成本低，具有极其广阔的应用前景。An electronic packaging material, characterized in that: nano-metal is used as a matrix, and nano-carbon tube is used as an additive; the electronic packaging material is composed of: nano-carbon tube: volume ratio 0-35%; nano-metal: balance. The electronic packaging material can be made of nano-aluminum as a matrix and carbon nanotubes as an additive. The advantages of the invention are: the composite material can thermally expand synchronously with the semiconductor silicon, avoiding thermal stress and thermal cracks between the semiconductor silicon and the aluminum-based packaging material, and has excellent performance as an electronic packaging material; the material cost is low, and it has extremely wide applications prospect.
Description
技术领域：Technical field:
本发明涉及材料科学，特别提供了一种电子封装材料。The invention relates to material science, and in particular provides an electronic packaging material.
背景技术：Background technique:
电子封装材料主要作用是机械支持、密封保护、散失电子元器件的热量等。它是属于低膨胀高导热材料，其性能要求为：(1)有较高的热导率，散热迅速，以防器件升温过高而失效；(2)一定的热膨胀系数，通常要求与器件的热膨胀系数(CTE)相匹配(主要是与Si和GaAs)；(3)一定的机械性能。随着航空航天、大规模集成电路、军事通讯等方面的不断发展，传统的单质电子封装材料已经满足不了这些领域的要求。而复合材料，特别是金属基复合材料作为电子封装材料有着其他封装材料所不具备的优点：(1)设计自由度大；(2)该类材料的热膨胀系数低，可以作到同电子器件材料的相匹配，同时又有高的导热率和低的密度；(3)具有相对好的机械性能；(4)材料制造灵活，生产费用不高，价格正在不断地降低。正因如此，现在研究热膨胀系数与陶瓷材料、半导体材料相匹配的高导热率的金属基复合材料以用于电子器件，已成为金属基复合材料发展最重要的方向之一。人们期待性能更好的电子封装材料出现。The main functions of electronic packaging materials are mechanical support, sealing protection, heat dissipation of electronic components, etc. It is a material with low expansion and high thermal conductivity, and its performance requirements are: (1) It has high thermal conductivity and rapid heat dissipation to prevent the device from heating up and failing; (2) A certain thermal expansion coefficient, which is usually required to match the device Coefficient of thermal expansion (CTE) matches (mainly with Si and GaAs); (3) Certain mechanical properties. With the continuous development of aerospace, large-scale integrated circuits, military communications, etc., traditional single-substance electronic packaging materials can no longer meet the requirements of these fields. Composite materials, especially metal matrix composite materials, as electronic packaging materials have advantages that other packaging materials do not have: (1) large degree of design freedom; (3) It has relatively good mechanical properties; (4) The material is flexible in manufacturing, the production cost is not high, and the price is constantly decreasing. For this reason, it has become one of the most important directions for the development of metal matrix composites to study metal matrix composites with high thermal conductivity matching the thermal expansion coefficient of ceramic materials and semiconductor materials for use in electronic devices. People look forward to the emergence of electronic packaging materials with better performance.
发明内容：Invention content:
本发明的目的是提供一种新型的电子封装材料。The purpose of the present invention is to provide a novel electronic packaging material.
本发明一种电子封装材料，其特征在于：以纳米金属为基体制成。相对于粗晶金属而言，使用纳米金属作为基体与纳米添加剂配合能在一定程度上降低电子封装材料的热膨胀系数。The electronic packaging material of the invention is characterized in that it is made of nano metal as a matrix. Compared with coarse-grained metals, the use of nano-metals as a matrix and the combination of nano-additives can reduce the thermal expansion coefficient of electronic packaging materials to a certain extent.
本发明电子封装材料，其特征在于：所述电子封装材料以纳米金属为基体，以纳米碳管作为添加剂制成。向金属基中加入低热膨胀系数的添加剂可以降低其热膨胀系数；由于纳米碳管具有高热导率、比强度、比刚度和接近于零的热膨胀系数，所以其可以被用作一种有效的添加剂。本发明在纳米金属基体中添加纳米碳管作为添加剂，形成双纳米复合结构，这样可以使得纳米金属基体与纳米碳管二者之间具有较大的界面体积分数，大幅度降低材料的热膨胀系数，使其成为与半导体硅同步热膨胀材料，从而有效避免半导体硅与电子封装材料之间的热应力及热裂纹，因此其可以用作性能优异的电子封装材料。The electronic packaging material of the present invention is characterized in that: the electronic packaging material is made of nano metal as a matrix and carbon nanotubes as additives. Adding an additive with a low thermal expansion coefficient to a metal matrix can lower its thermal expansion coefficient; carbon nanotubes can be used as an effective additive due to their high thermal conductivity, specific strength, specific stiffness, and close to zero thermal expansion coefficient. In the present invention, carbon nanotubes are added to the nanometal matrix as an additive to form a double nanocomposite structure, so that the interface volume fraction between the nanometal matrix and the carbon nanotubes can be greatly reduced, and the thermal expansion coefficient of the material is greatly reduced. It becomes a material that thermally expands synchronously with semiconductor silicon, thereby effectively avoiding thermal stress and thermal cracks between semiconductor silicon and electronic packaging materials, so it can be used as an electronic packaging material with excellent performance.
本发明电子封装材料，其特征在于：所述电子封装材料组成成分及含量为：纳米碳管：体积比0～35％；纳米金属：余量。以上所述是效果较好时，材料成分的配比方案。The electronic packaging material of the present invention is characterized in that: the composition and content of the electronic packaging material are: carbon nanotube: volume ratio 0-35%; nanometer metal: balance. The above is the proportioning scheme of the material components when the effect is better.
本发明电子封装材料，其特征在于：所述电子封装材料组成成分及含量为：纳米碳管：体积比5～20％；纳米金属：余量。这一含量范围是优选，效果更佳。The electronic packaging material of the present invention is characterized in that: the composition and content of the electronic packaging material are: nanometer carbon tube: volume ratio 5-20%; nanometer metal: balance. This content range is preferred and the effect is better.
本发明电子封装材料，其特征在于：所述电子封装材料以纳米铝为基体。金属铝的热导率较高(230W/(m.K))，热膨胀系数也高(23×10-6/K)；将其加入的增强体是热膨胀系数低、导热性能好的材料。铝基材料不仅具有比强度、比刚度高等特点，而且导热性能好、同时，铝是除铁之外最常用、最廉价的金属材料，作为电子封装元器件的选材，具有很好的开发应用潜力。相对于普通粗晶铝而言，纳米铝基体的电子封装材料性能也有所改善。The electronic packaging material of the present invention is characterized in that: the electronic packaging material uses nano-aluminum as a matrix. Metal aluminum has a high thermal conductivity (230W/(mK)) and a high thermal expansion coefficient (23×10 -6 /K); the reinforcement added to it is a material with a low thermal expansion coefficient and good thermal conductivity. Aluminum-based materials not only have the characteristics of high specific strength and specific stiffness, but also have good thermal conductivity. At the same time, aluminum is the most commonly used and cheapest metal material except iron. As a material for electronic packaging components, it has good potential for development and application . Compared with ordinary coarse-grained aluminum, the performance of electronic packaging materials of nano-aluminum matrix has also been improved.
本发明电子封装材料，其特征在于：所述电子封装材料以纳米铝为基体，以纳米碳管作为添加剂制成。目前，降低铝的热膨胀系数的主要方法是向铝基中加入低热膨胀系数的添加剂。研究证明，由于纳米碳管具有高热导率、比强度、比刚度和接近于零的热膨胀系数，其可以作为一种有效添加剂用于添加到纳米铝基体中用于制作电子封装材料。铝基复合材料线膨胀系数可调、密度较低；在这里，纳米铝基体和纳米碳管形成双纳米复合结构，二者相互适应，使得界面体积分数明显增大，使该电子封装材料成为与半导体硅同步热膨胀材料，从而有效避免半导体硅与铝基封装材料之间的热应力及热裂纹，因此其可以用作性能优异的电子封装材料。The electronic packaging material of the present invention is characterized in that: the electronic packaging material is made of nano-aluminum as a matrix and nano-carbon tubes as additives. At present, the main method to reduce the thermal expansion coefficient of aluminum is to add additives with low thermal expansion coefficient to the aluminum base. Studies have proved that carbon nanotubes can be used as an effective additive to add nano-aluminum matrix to make electronic packaging materials due to their high thermal conductivity, specific strength, specific stiffness and close to zero thermal expansion coefficient. The linear expansion coefficient of the aluminum-based composite material is adjustable and the density is low; here, the nano-aluminum matrix and the carbon nanotubes form a double nano-composite structure, and the two adapt to each other, so that the interface volume fraction increases significantly, making the electronic packaging material become a The semiconductor silicon synchronously thermally expands the material, thereby effectively avoiding thermal stress and thermal cracks between the semiconductor silicon and the aluminum-based packaging material, so it can be used as an electronic packaging material with excellent performance.
本发明电子封装材料，其特征在于：所述电子封装材料组成成分及含量为：纳米碳管：体积比0～35％；纳米铝：余量。以上所述是效果较好时的一种材料配比方案。The electronic packaging material of the present invention is characterized in that: the composition and content of the electronic packaging material are: nano-carbon tube: volume ratio 0-35%; nano-aluminum: balance. The above is a material ratio scheme when the effect is better.
本发明电子封装材料，其特征在于：所述电子封装材料组成成分及含量为：纳米碳管：体积比10～20％；纳米金属：余量。以上所述是效果更优的优选含量范围。The electronic packaging material of the present invention is characterized in that: the composition and content of the electronic packaging material are: carbon nanotube: volume ratio 10-20%; nano metal: balance. The above is the preferred content range with better effect.
本发明的优点是：The advantages of the present invention are:
1、作为电子封装材料，性能优良：由于所制成的材料与半导体硅能实现完全同步的热膨胀，避免了半导体硅与铝基封装材料之间形成热应力及热裂纹，因此其可以用作性能优异的电子封装材料；1. As an electronic packaging material, it has excellent performance: because the material and semiconductor silicon can achieve completely synchronized thermal expansion, it avoids the formation of thermal stress and thermal cracks between semiconductor silicon and aluminum-based packaging materials, so it can be used as a performance Excellent electronic packaging materials;
2、材料成本低，以铝基作为基体材料。2. The material cost is low, and the aluminum base is used as the base material.
附图说明：Description of drawings:
图1纳米铝粉与纳米碳管添加剂混合的透射电镜照片；The transmission electron micrograph of Fig. 1 nano-aluminum powder and carbon nanotube additive mixing;
图2纳米铝基体添加不同含量纳米碳管复合材料的热膨胀系数图；Figure 2 shows the coefficient of thermal expansion of nano-aluminum matrix with different content of carbon nanotube composites;
具体实施方式：Detailed ways:
实施例1Example 1
用半连续氢电弧法和活性氢等离子蒸发法分别制备出单壁纳米碳管和纳米Al粉体，然后将提纯后的碳管与纳米Al粉体按比例经湿法超声波分散混合，在室温下冷压成型，再经380℃真空热压处理，制备出碳管含量为2.5wt.％的、致密度大于95％的块体复合材料样品。在20℃～250℃测试了复合材料的热膨胀系数为11×10-6/K～18×10-6/K。Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. Cold press forming, followed by vacuum hot pressing at 380°C, to prepare a block composite material sample with a carbon tube content of 2.5wt.% and a density greater than 95%. The thermal expansion coefficient of the composite material was tested at 20℃～250℃ to be 11×10 -6 /K～18×10 -6 /K.
实施例2Example 2
用半连续氢电弧法和活性氢等离子蒸发法分别制备出单壁纳米碳管和纳米Al粉体，然后将提纯后的碳管与纳米Al粉体按比例经湿法超声波分散混合，在室温下冷压成型，再经380℃真空热压处理，制备出碳管含量为5wt.％的、致密度大于95％的块体复合材料样品。在20℃～250℃测试了复合材料的热膨胀系数为8×10-6/K～12×10-6/K。Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. Cold press forming, followed by vacuum heat treatment at 380°C, to prepare a block composite material sample with a carbon tube content of 5wt.% and a density greater than 95%. The thermal expansion coefficient of the composite material was tested at 20℃～250℃ to be 8×10 -6 /K～12×10 -6 /K.
实施例3Example 3
用半连续氢电弧法和活性氢等离子蒸发法分别制备出单壁纳米碳管和纳米Al粉体，然后将提纯后的碳管与纳米Al粉体按比例经湿法超声波分散混合，在室温下冷压成型，再经380℃真空热压处理，制备出碳管含量为17.5wt.％的、致密度大于95％的块体复合材料样品。在20℃～250℃测试了复合材料的热膨胀系数为5×10-6/K～7×10-6/K。Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. After cold pressing and hot pressing at 380°C, a bulk composite material sample with a carbon tube content of 17.5 wt.% and a density greater than 95% was prepared. The thermal expansion coefficient of the composite material was tested at 20℃～250℃ to be 5×10 -6 /K～7×10 -6 /K.
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| CN200510046366A CN100577768C (en) | 2005-04-30 | 2005-04-30 | An electronic packaging material |
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| CN200510046366A CN100577768C (en) | 2005-04-30 | 2005-04-30 | An electronic packaging material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127721A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Aluminum alloy material and preparation method of aluminum alloy back plate |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN108140635A (en) * | 2015-09-30 | 2018-06-08 | 三星Sdi株式会社 | Semiconductor package and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3072367B2 (en) | 1997-11-04 | 2000-07-31 | 工業技術院長 | Manufacturing method of structure control type composite ceramics |
| CN1186469C (en) * | 2002-06-06 | 2005-01-26 | 中国科学院金属研究所 | Nano carbon tube reinforced nano metal base composite material and preparation method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102127721A (en) * | 2010-11-03 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | Aluminum alloy material and preparation method of aluminum alloy back plate |
| WO2012058847A1 (en) * | 2010-11-03 | 2012-05-10 | 映瑞光电科技(上海)有限公司 | Aluminium alloy material and method for preparing aluminium alloy back board |
| US8833431B2 (en) | 2010-11-03 | 2014-09-16 | Enraytek Optoelectronics Co., Ltd. | Aluminum alloy material and method of manufacturing aluminum alloy backboard |
| CN103103403A (en) * | 2013-01-24 | 2013-05-15 | 西安交通大学 | Electronic packaging material |
| CN108140635A (en) * | 2015-09-30 | 2018-06-08 | 三星Sdi株式会社 | Semiconductor package and manufacturing method thereof |
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| CN100577768C (en) | 2010-01-06 |
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