CN1849060B - Electronic component mounting device - Google Patents

Abstract

It is an object of the present invention to provide an electronic component mounting apparatus capable of reliably detecting a suction error of an electronic component with an inexpensive device. The electronic component mounting device includes: an optical sensor (19), which is arranged on the mounting head, and is composed of a light projecting part and a light receiving part; a flow sensor (16), which is arranged in the air suction channel connecting the suction nozzle and the vacuum generating device Among them: a control unit, which performs the control of installing the electronic components adsorbed by the above-mentioned suction nozzle on the substrate, the control unit includes: the process of obtaining the height data of the electronic components adsorbed by the optical sensor (19); through the above-mentioned flow sensor (16 ) a process of measuring the air flow rate; a comparison process of comparing the measured value with a preset value; and a determination process, which determines whether the electronic component is adsorbed or not and whether the adsorption posture is good or not according to the comparison process.

Description

Electronic component mounting device

technical field

The invention relates to an electronic component mounting device, which absorbs electronic components and mounts them on a substrate through a suction nozzle provided on a mounting head, and particularly relates to an electronic component mounting device capable of detecting adsorption errors of electronic components.

Background technique

In the past, Japanese Patent No. 3038905 (Patent Document 1), Japanese Patent No. 3269041 (Patent Document 2), and Japanese Patent Laid-Open No. 2003-133791 ( Patent Document 3).

The electronic component mounting apparatus in Patent Document 1 has a one-dimensional optical sensor including a plurality of scanning lines, the one-dimensional sensor is arranged in a vertical direction, and a light projecting unit and a light receiving unit are opposed to each other. In addition, the electronic component mounting apparatus moves the attracted electronic component across the scanning line of the one-dimensional optical sensor, thereby obtaining two-dimensional image information of the electronic component.

The electronic component mounting device in Patent Document 2 measures the flow rate of suction air by a flow sensor, and compares the actual flow rate with a pre-stored design flow rate to detect clogging of the suction nozzle and the like.

The electronic component mounting device in Patent Document 3 uses a flow sensor to measure the flow rate of suction air, and compares the actual flow rate with the pre-stored design flow rate to detect whether the electronic component is adsorbed or whether the adsorption state is good or bad.

Patent Document 1: Japanese Patent No. 3038905

Patent Document 2: Japanese Patent No. 3269041

Patent Document 3: Japanese Patent Laid-Open No. 2003-133791

However, the device in Patent Document 1 requires processing time to obtain two-dimensional image information, and the device is relatively expensive.

The devices in Patent Documents 2 and 3 only use the flow sensor to detect whether the electronic component is adsorbed or whether the adsorption state is good or bad, so there is a problem of poor reliability when the detected flow rate increases or decreases slightly. In addition, there is also a problem that it is not possible to reliably detect suction errors in which parts stand sideways or obliquely.

Contents of the invention

The present invention was made in order to solve the above-mentioned problems, and an object of the present invention is to provide an inexpensive electronic component mounting device capable of reliably detecting a suction error of an electronic component.

In addition, the object is to detect a pickup error of an electronic component in a short time.

Furthermore, an object of the present invention is to reliably detect a suction error regardless of whether the component is in a state such as standing sideways or obliquely.

In order to solve the above problems, the first aspect of the present invention is an electronic component mounting device, including: a suction nozzle 10, which is used to adsorb electronic components; a vertical movement unit 13, which is used to move the above-mentioned suction nozzle up and down; a mounting head 7 , which holds the above-mentioned suction nozzle and can move in the horizontal direction; optical sensors 19, 25, 27, 28 are arranged on the above-mentioned installation head and are composed of a light projecting part and a light receiving part; In the air suction channel of the nozzle and the vacuum generating device; a control unit that performs control of mounting the electronic components adsorbed by the above-mentioned adsorption nozzle on the substrate.

The above-mentioned control unit includes the following processes: the process of obtaining the height data of the electronic components adsorbed by the above-mentioned optical sensor; the process of measuring the air flow through the above-mentioned flow sensor and obtaining the air flow data; the actual measurement of the above-mentioned height data and the above-mentioned air flow data A comparison process of comparing the value with a preset set value; and a determination process, which determines whether the electronic component is attracted or not and whether the adsorption posture is good or bad according to the comparison process.

According to a second aspect of the present invention, in the electronic component mounting apparatus according to the first aspect of the present invention, the control unit judges that the electronic component is in the non-adsorbed, horizontal and erect states by comparing the height data of the electronic component, and By comparing the above air flow data, it can be determined that the electronic component is in a normal adsorption state or in an upright state.

In a third aspect of the present invention, in the electronic component mounting apparatus according to the first aspect and the second aspect of the present invention, the control unit executes acquisition of height data and measurement of air flow before and after adsorption of the electronic component, Thereby, it is judged that the retrieval of the electronic component or the clogging of the suction nozzle of the suction nozzle.

An electronic component mounting device according to a fourth aspect of the present invention includes: a suction nozzle 10 for suctioning electronic components; a vertical movement unit 13 for moving the suction nozzle up and down; a mounting head 7 for holding the suction nozzle and It can move in the horizontal direction; the optical sensor 25 is arranged on the above-mentioned mounting head and is composed of a light projecting part and a light receiving part; a control unit is used to control the installation of the electronic components adsorbed by the above-mentioned suction nozzles on the substrate. The installation device has the following structure: the above-mentioned light sensor has a detection range larger than the light-shielding area of the electronic component that is normally adsorbed, and the output value of the light sensor is variable according to the amount of light received by its light-receiving part, and the above-mentioned control unit includes: a measuring process , the process irradiates light to the adsorbed electronic component through the above-mentioned optical sensor, and obtains an output value according to the amount of light received; the determination process compares the output value obtained in the above-mentioned measurement process with a preset set value , to determine whether the above-mentioned electronic components are adsorbed, and compare the above-mentioned output value with any of the set values of the normal adsorption range, the vertical adsorption range, the oblique adsorption range, and the horizontal adsorption range, so as to determine the above-mentioned electronic components. The quality of the adsorption posture.

A fifth aspect of the present invention is the electronic component mounting apparatus according to the fourth aspect of the present invention, including variable means 22, 29, 30 for changing the detection range of the optical sensor according to the shape of the electronic component.

According to the first aspect of the present invention, an adsorption error of an electronic component can be detected reliably and in a short time with an inexpensive device.

According to the second aspect of the present invention, it is possible to reliably detect suction errors such as horizontal or oblique positioning of the electronic component.

According to the third aspect of the present invention, it is possible to reliably detect the retrieval of the electronic component or clogging of the suction nozzle.

According to the fourth and fifth aspects of the present invention, it is possible to detect an adsorption error of an electronic component in a shorter time.

Description of drawings

FIG. 1 is a perspective view showing an outline of an electronic component mounting apparatus according to a first embodiment.

Fig. 2 is an enlarged perspective view of the mounting head of the first embodiment.

Fig. 3 is a perspective view showing the arrangement of suction nozzles and flow sensors according to the first embodiment.

Fig. 4 is a flowchart of the first embodiment.

Fig. 5 is a flowchart of the first embodiment.

Fig. 6 is a front view showing a suction state of the electronic component according to the first embodiment.

Fig. 7 is a perspective view of a photosensor (photosensor) of a second embodiment.

FIG. 8 is an explanatory diagram of a case where electronic component identification is performed according to the second embodiment.

9 is an explanatory diagram showing the relationship between sensor output and light-shielding area in the second embodiment.

Fig. 10 is an enlarged perspective view of a mounting head according to another embodiment.

Fig. 11 is a detailed view of the tip of a suction nozzle according to another embodiment.

Fig. 12 is an enlarged perspective view of a mounting head in another embodiment.

Label description

10: suction nozzle; 13: Z-axis motor (up and down moving unit); 7: installation head; 19: photoelectric sensor (light sensor); 16: flow sensor; 25: light sensor; 27: light sensor; 28: light sensor; 22: slit piece (variable unit); 29: variable unit; 30: variable unit.

Detailed ways

A first embodiment of the present invention will be described with reference to FIGS. 1 to 6 .

The electronic component mounting apparatus is provided with a pair of conveyance lanes 2 in the X direction of the central part of the base 1 . The conveyance lane 2 conveys the substrate 3 for mounting electronic components in the X direction. In addition, a substrate holding portion (not shown) is provided at the upper end portion of the transport path 2 . This substrate holding unit is a device that holds and positions the conveyed substrate 3 at a predetermined position.

Supply units 4 for electronic components are arranged on both sides of the transport path 2 . A plurality of tape feeders 5 are arranged in parallel on each supply unit 4 . The tape feeder 5 supports the tape containing the electronic components, and feeds the tape step by step to supply the electronic components.

A pair of Y-axis frames 8 are provided in the Y direction at both ends of the upper surface of the base 1 . Both ends of the X-axis frame 6 are supported by the pair of Y-axis frames 8 . On the Y-axis frame 8, there is provided a Y-axis moving means by means of an unshown motor, a belt, and the like. When the Y-axis moving unit is driven, the X-axis frame 6 moves horizontally in the Y direction.

A mounting head 7 is provided on the X-axis frame 6 . An X-axis moving unit is provided on the X-axis frame 6 by means of an unillustrated motor, a belt, and the like. When the X-axis moving unit is driven, the mounting head 7 moves in the X direction.

A camera 9 is arranged between the transport path 2 and the supply unit 4 on the upper surface of the base 1 . The camera 9 is arranged to face the movement path of the mounting head 7 . In addition, the camera 9 photographs the mounting head 7 or the suction nozzle 10 from below to identify the electronic component and detect its positional deviation.

Next, the structure of the mounting head 7 will be described with reference to FIG. 2 .

The mounting head 7 is a multiple mounting head and is composed of four sets of unit mounting heads 7a. On each unit mounting head 7a, a suction nozzle shaft 11 is provided along the up-down direction. An independently driven θ-axis motor 12 is connected to an upper end portion of the suction nozzle shaft 11 . When the θ-axis motor 12 rotates, the nozzle shaft 11 rotates around its axis.

In addition, the suction nozzle shaft 11 is connected to a Z-axis motor 13 as a vertical movement unit through a gear not shown, and when the Z-axis motor 13 is driven, the suction nozzle shaft 11 moves up and down. The suction nozzle 10 is attached to the end of each suction nozzle shaft 11 .

On the lower end side of the suction nozzle 10, a photoelectric sensor 19 as an optical sensor composed of a light projector 17 and a light receiver 18 is provided for each unit mounting head 7a.

The light projector 17 and the light receiver 18 of the photoelectric sensor 19 are respectively attached to the mounting head 7 and arranged on a straight line so that the light emitted from the light projector 17 can enter the light receiver 18 . In addition, the photoelectric sensor 19 is a point-type photoelectric sensor that emits light at a point, and its optical axis may cross the lower end side of the suction nozzle 10 . A substrate recognition camera (not shown) is disposed on the mounting head 7 , and the position of the positioned and held substrate is recognized by moving the mounting head 7 and imaging the substrate mark with the substrate recognition camera.

Next, referring to FIG. 3 , the suction mechanism attached to the suction nozzle 10 will be described.

The suction nozzle shaft 11 is a hollow member, and the suction nozzle 10 is attached to the lower end. The suction nozzle 10 is formed with a suction hole penetrating toward the end. An air suction passage is formed by the suction hole and the hollow hole 11a penetrating the shaft of the suction nozzle. A vacuum generator 15 and a flow sensor 16 are attached to the nozzle shaft 11 of the air suction passage in this order from the upstream side. The vacuum generating device 15 is an ejector vacuum device that generates vacuum by ejecting compressed air. In addition, the flow sensor 16 is a sensor that measures the flow rate of the air suction passage based on the temperature difference between the downstream side and the upstream side. And, according to the operation of the vacuum generating device 15 , the flow rate of air generated in the air suction passage is measured by the flow sensor 16 .

Next, a controller (control unit) not shown that controls the electronic component mounting apparatus will be described.

The controller includes a microcomputer (CPU), RAM, ROM, or flash memory for controlling the entire device. These memories store altitude data or airflow data which are preset design values for each electronic component.

Furthermore, the controller is connected with: the motor of the X-axis moving unit, the motor of the Y-axis moving unit, the θ-axis motor 12, the Z-axis motor 13, the photoelectric sensor 19, the vacuum generator 15, the flow sensor 16, and the like.

Next, the procedure for detecting the adsorption state of the electronic component will be described with reference to FIGS. 4 , 5 , and 6 .

The following actions are performed by the controller as the control unit.

When the mounting operation of the electronic component starts, first, the substrate 3 is loaded onto the conveyance lane 2, and the substrate 3 is conveyed in the X direction. Then, the substrate 3 is positioned and held at a predetermined position by a substrate holding unit (not shown) ( S1 ).

After that, the mounting head 7 is moved, and the board mark is imaged by a board recognition camera (not shown) to recognize the position of the board being positioned and held (S2).

Next, the mounting head 7 is moved toward the supply part 4 (S3).

Next, while the mounting head 7 is moving to the supply unit 4 , the Z-axis motor 13 is driven with respect to the suction nozzle 10 that does not pick up the electronic component. Then, the suction nozzle shaft 11 is gradually lowered, and when the output value of the photoelectric sensor 19 changes rapidly, the Z-axis height at that time is output from the encoder of the Z-axis motor 13 . This Z-axis height is stored in the flash memory as Z0 (a value for identifying the lower end of the suction nozzle) (S4).

Then, compare the Z0a value in the state of not picking up electronic components measured by the same type of suction nozzle last time with the Z0 value in S4, and if the difference |Z0a-Z0| is greater than the set value , it is judged as an abnormality (retrieval of an electronic component, etc.), and it progresses to S13, and when |Z0a-Z0| is in the setting value range, it progresses to S6 (S5).

Next, while the mounting head 7 is moving toward the supply unit 4 , the vacuum generator 15 is driven. And, the flow rate of the air suction passage is measured using the flow sensor 16 with respect to the suction nozzle 10 that does not suction electronic components. This air flow rate is referred to as F0, and stored in the flash memory (S6).

Next, compare the F0a value of the previous measurement using the same type of suction nozzle in the state where no electronic components are adsorbed, with the F0 value in S7, and if the difference |F0a-F0| is greater than the set value Next, it is determined to be abnormal (clogging of the suction nozzle), and the process proceeds to S13, and when |F0a-F0| is within the range of the set value, the process proceeds to S8 (S7).

Next, after the mounting head 7 moves to the supply part 4, the adsorption nozzle 10 is lowered, and after the adsorption nozzle 10 adsorbs an electronic component, the adsorption nozzle 10 is raised (S8).

Next, in S9 , when the output value of the photoelectric sensor 19 changes rapidly when the suction nozzle 10 is raised, the Z-axis height at that time is output from the encoder of the Z-axis motor 13 . This Z-axis height is taken as Z1 (a value for identifying the lower end surface of the suction nozzle on which the electronic component is sucked), and is stored in the flash memory (S9).

Next, in S10, when the suction nozzle 10 is raised, the vacuum generator 15 is driven. And, the flow rate of the air suction passage is measured using the flow sensor 16 with respect to the suction nozzle 10 on which the electronic component is suctioned. This air flow is stored as F1 in the flash memory (S10).

Then, according to the flowchart of FIG. 5 , the adsorption state of the electronic component is determined using the Z0, Z1, F0, and F1 values measured previously (S11).

First, the difference |Z0-Z1| (thickness data of electronic parts) of the Z-axis height data is compared with the preset value (setting value: Zx to Zy) for each part type, and when |Z0-Z1| is less than In the case of the set value, it is determined that there is no suction, and when |Z0-Z1| is greater than the set value, it is determined that it is horizontal as shown in Fig. When |Z0-Z1| is within the range of the set value, it proceeds to the next step S11B (S11A).

In addition, the horizontal state shown in FIG. 6( b ) refers to a state in which the suction nozzle picks up one side surface of the electronic component, and the suction nozzle rises by ΔZ1 compared to normal with respect to the bottom surface. In addition, the upright state shown in FIG. 6( c ) refers to a state in which the suction nozzle picks up the other side of the electronic component, and the suction nozzle is raised by ΔZ2 compared to the normal level based on the bottom surface.

Next, the output difference |F0-F1| In the case of being less than or equal to the set value, it is determined to be the oblique stand shown in Figure 6(d), and in the case of |F0-F1| greater than the set value, it is determined to be the normal adsorption (S11B) shown in Figure 6(a). ).

As shown in FIG. 6( d ), the so-called upright state means that the suction nozzle is suctioning the corner of the electronic component, and the height data is approximately the same as that of the normal suction.

Then, returning to FIG. 4 , it is determined whether the component suction state is normal. In the above-mentioned steps, if there is no adsorption, horizontal standing, vertical standing, or oblique standing, it is judged to be abnormal, and the process proceeds to S13, and in the case of normal suction, the process proceeds to S14 (S12).

When Z0 is not normal in S5, or when F0 is not normal in S7, or if it is not normally adsorbed in S12, it is determined that the adsorption posture is not good, such as horizontal standing, standing upright, oblique standing, There are no suction errors such as suction, poor installation of suction nozzles, or poor selection of suction nozzles. Then, the installation operation is stopped, the operator is notified of the abnormality by the alarm device, and after the error processing is completed, the process proceeds to S3 (S13).

Next, in the case of normal suction, after moving the mounting head 7 to a position facing the camera 9, recognition of the electronic component to be suctioned is performed (S14).

Then, according to the recognition result, after the mounting head 7 moves to a predetermined position of the substrate 3 and drives the θ-axis motor 12 to adjust the position, the Z-axis motor 13 is driven to mount the electronic component on the substrate 3 (S15).

Thereafter, it is determined whether the mounting of all components is completed, and if not completed, returns to S3, and if completed, the mounting operation is terminated.

According to the above-mentioned first embodiment, there are the following steps: the step of obtaining the height data of the electronic components adsorbed by the optical sensor 19; the step of measuring the air flow rate by the above-mentioned flow sensor 16; A comparison process for comparing fixed values; a determination process, which determines whether there is adsorption of electronic components and whether the adsorption posture is good or bad according to the above comparison process. Therefore, it is possible to reliably detect an adsorption error of an electronic component in a short time.

In addition, by comparing the height data of the electronic components, it is determined that the electronic components are in the non-absorbed and horizontal states, and by comparing the air flow data, it is determined that the electronic components are in the normal adsorption and inclined states. Therefore, suction errors such as sideways erection of electronic components can be reliably detected.

Next, a second embodiment of the present invention will be described based on FIG. 7 , FIG. 8 , and FIG. 9 .

In the second embodiment, a photosensor of a different type from that in the first embodiment is used, and only its structure and determination of the adsorption state will be described, and other descriptions will be omitted.

Fig. 7 is a perspective view of an analog output type photoelectric sensor (optical sensor). FIG. 8 is a diagram illustrating a case of identifying an electronic component using this type of photosensor. FIG. 9 is an explanatory diagram showing the relationship between the sensor output and the light-shielding area when this type of photosensor is used.

The analog output photoelectric sensor (optical sensor) 25 is composed of a light projecting unit 21 and a light receiving unit not shown. The light projecting part 21 is made up of a light source and a slit (slit) (variable unit) 22. The above-mentioned light source is made of a light emitting diode or the like, and the above-mentioned slit has a rectangular window for limiting the light emitted from the light source. formed on the optical axis 23. In addition, the light receiving range of the not-shown light receiving unit substantially coincides with the light projecting range 22a of the light projecting unit. In addition, the light projecting part 21 and the light receiving part 22 of the photoelectric sensor 25 are respectively fixed on the mounting head 7 and arranged on a straight line so that the light emitted from the light projector of the photoelectric sensor 25 can enter the light receiver.

Light is emitted from the light projecting part of the photoelectric sensor 25, and the range formed by connecting the window on the light projecting side and the window on the light receiving side on a straight line is the detection range 22a. As shown in FIG. 8( a ), the detection range 22 a is set to a rectangle having the same shape as the side surface of the electronic component 20 that is normally picked up, and its size is set to be slightly larger than the electronic component. And, in the case of standing upright in FIG. 8( c ) and obliquely standing in FIG. 8( d ), since the electronic component protrudes from the detection range 22 a and the amount of light received increases, the sensor output increases. In addition, in the horizontal position of FIG. 8( b ), although the electronic component protrudes from the detection range 22 a, the amount of received light decreases, so the sensor output decreases. On the other hand, when the electronic component is not adsorbed, the area where the electronic component blocks the optical axis, that is, the light-shielding area is 0, and the sensor output is at the maximum Gmax.

Next, the operation of the second embodiment will be described.

The second embodiment differs from the first embodiment in the determination process of the adsorption measurement position and the adsorption state. The different parts are explained, and other explanations are omitted.

The following actions are performed by the controller as the control unit.

When the Z-axis motor 13 is driven, the suction nozzle 10 that suctions the electronic component 20 rises. Then, when the suction nozzle 10 moves to a position where the lower end of the suction nozzle 10 coincides with the upper end portion of the light projection range 22 a of the photoelectric sensor 25 , light is irradiated from the photoelectric sensor 25 . In addition, since the amount of light received by the light receiving part of the photosensor 25 changes according to the adsorption state (shading area) of the electronic component, the output value of the photosensor 25 changes. For example, the sensor output value is Ga during normal adsorption, Gb during horizontal adsorption, Gc during vertical adsorption, Gd during inclined vertical adsorption, and Gmax when there is no adsorption.

Then, the measured value is compared with the set value Gx-Gy (Ga±0.5V) of normal adsorption preset in the controller, and it is determined that the Ga value within the range of Gx-Gy is normal adsorption. And it can be judged: Gb in the range of Gx1-Gy1 is horizontal adsorption; Gd in the range of Gx2-Gy2 is oblique adsorption, Gc in the range of Gx3-Gy3 is vertical adsorption, and Gmax is no adsorption.

Compared with the first embodiment, in the second embodiment, by setting the suction nozzle 10 at a predetermined height, it is possible to determine the presence or absence of the suction member and the quality of the suction posture, thereby shortening the recognition time. Furthermore, in the second embodiment, the detection range 22a can be changed by changing the slit member 22 as a variable unit according to the shape of the electronic component to be sucked.

In addition, in the second embodiment, since there are a plurality of light-receiving amount setting values, normal adsorption setting ranges, vertical adsorption ranges, horizontal adsorption ranges, oblique vertical adsorption ranges, and non-adsorption setting ranges, more Detect adsorption errors such as normal adsorption, horizontal adsorption, vertical adsorption, inclined vertical adsorption, and no adsorption of electronic components in a short period of time.

The present invention is not limited to the above-described embodiments, and various changes can be made.

For example, in the first embodiment, the retrieval of the electronic component is determined by comparing the Z-axis height data Z0 and Z0a in the state where the electronic component is not adsorbed. Instead of this method, the following method can be easily conceived: comparing the Z-axis height data Z1 in the state where the electronic component is adsorbed with the previous Z-axis height data Z1a, and if the data difference is large, it is determined that the electronic component is damaged. retrieve.

In addition, in the first embodiment, the clogging of the suction nozzle is determined by comparing the air flow rate F0 and F0a in the state where the electronic component is not suctioned. Instead of this method, a method is easily conceivable in which the air flow rate F1 in the state of picking up the electronic component is compared with the previous air flow rate F1a, and if the data difference is large, it is determined that the suction nozzle is clogged.

Furthermore, it is also conceivable to easily perform the next installation operation after overwriting and saving the values stored in the flash memory when the comparison results of Z1 and Z1a and F1 and F1a are not significantly different.

In addition, in the above-mentioned embodiment, the photosensors 19 and 25 are provided on the suction nozzles. Instead of this method, the following method can be easily conceived: as shown in FIG. The Z-axis motor 13 moves up and down to identify electronic components that are individually attracted.

In addition, the shape of the light projection area 22a in the second embodiment is not limited to a rectangle, and various changes can be made. For example, as shown in FIG. 11 , when the detection range is too large or too small for the electronic component to be adsorbed, as shown in FIG. 12 , a variable means capable of changing the detection range can be used.

This variable unit is constituted by a pair of shading plates 29 and 30 provided with a plurality of slits. It is also easy to conceive of a method of rotating the light-shielding plates 29, 30 so that an optimum detection range 22a can be obtained according to the size of the electronic component. In addition, the following methods can also be easily conceived: in the case of narrowing the detection range, increase the amplification gain of the optical sensor; in the case of increasing the detection range, reduce the amplification gain of the optical sensor to optimize the detection sensitivity .

Furthermore, in the second embodiment, there are a plurality of light-receiving amount setting values, normal suction setting ranges, vertical suction ranges, horizontal suction ranges, oblique vertical suction ranges, and no suction setting ranges, but instead of these, you may It is easy to conceive of the normal adsorption setting range and other adsorption error ranges.

Furthermore, it is also easily conceivable to use the optical sensor of the second embodiment in the first embodiment.

In addition, regarding the error handling of the above-mentioned embodiment, parts can be discarded in the case of a suction error, or cleaning of the suction nozzle or replacement of the filter in the suction nozzle shaft can be performed when the suction nozzle is clogged.

Claims (5)

1. An electronic component mounting device, comprising: a suction nozzle, which is used to adsorb electronic components; a vertical movement unit, which is used to move the above-mentioned suction nozzle up and down; a mounting head, which holds the above-mentioned suction nozzle and can move in a horizontal direction; An optical sensor, which is arranged on the above-mentioned installation head, is composed of a light-emitting part and a light-receiving part; a flow sensor, which is arranged in the air suction channel connecting the above-mentioned suction nozzle and the vacuum generating device; Adsorption of electronic components mounted on a control substrate, characterized in that, The above-mentioned control unit includes: the process of obtaining the height data of the electronic component adsorbed by the above-mentioned optical sensor; the process of measuring the air flow through the above-mentioned flow sensor and obtaining the air flow data; A comparison process for comparing preset set values; and a determination process, which determines whether the electronic component is attracted or not and whether the adsorption posture is good or bad according to the comparison process. 2. The electronic component mounting apparatus according to claim 1, wherein: The above-mentioned control unit judges that the electronic component is in the state of no adsorption, horizontal and vertical by comparing the height data of the above-mentioned electronic component, and judges that the electronic component is in the state of normal adsorption and oblique standing by comparing the above-mentioned air flow data. state. 3. The electronic component mounting apparatus according to claim 1 or 2, wherein: The control unit executes a step of obtaining height data and a step of measuring air flow before and after picking up the electronic component, thereby determining retrieval of the electronic component or clogging of the suction nozzle. 4. An electronic component mounting device, comprising: a suction nozzle, which is used to adsorb electronic components; a vertical movement unit, which is used to move the above-mentioned suction nozzle up and down; a mounting head, which holds the above-mentioned suction nozzle and can move in a horizontal direction; The optical sensor is provided on the above-mentioned mounting head and is composed of a light projecting part and a light receiving part; a control unit that controls the mounting of the electronic component sucked by the above-mentioned suction nozzle on the substrate, is characterized in that, The above-mentioned photosensor has a detection range larger than the light-shielding area of the normally adsorbed electronic component, and the output value of the photosensor is variable according to the amount of light received by its light-receiving part; In addition, the above-mentioned control unit includes: a measurement process, which irradiates light to the adsorbed electronic component through the above-mentioned optical sensor, and obtains an output value according to the amount of light received; a determination process, which compares the output value obtained in the above-mentioned measurement process with a predetermined The set value is compared to determine whether the above-mentioned electronic components are adsorbed, and the above-mentioned output value is compared with any of the set values of the normal adsorption range, the vertical adsorption range, the oblique adsorption range, and the horizontal adsorption range. Comparison, thereby judging whether the adsorption posture of the above-mentioned electronic components is good or bad. 5. The electronic component mounting apparatus according to claim 4, wherein: There is a variable unit that can change the detection range of the photosensor according to the shape of the electronic component.

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