CN1847894A - Optical Transceiver Module - Google Patents

Abstract

An optical transceiver module comprises a circuit structure, a fixing device, an optical transmission element and a cover, wherein the fixing device covers a part or all of a transmission optical fiber, and an optical signal is transmitted in the transmission optical fiber. The light-transmitting element is directly connected to the circuit structure and receives or transmits the light signal.

Description

Optical Transceiver Module

technical field

The present invention relates to an optical transceiver module, in particular to an optical transceiver module with few manufacturing processes, easy assembly and alignment, and low cost.

Background technique

Please refer to FIG. 1 , which shows a schematic diagram 10 of an example of a known optical transceiver module. First, a planar light wave circuit (PLC) 1 is fixed on a ceramic substrate 2 with an opening 3 , and the light-incident side of the planar light wave circuit 1 is aligned with the opening 3 . Then, the optical fiber 4 is inserted into the opening 3 and fixed to the light entrance of the planar optical waveguide 1 in an adhesive manner. Finally, the ceramic substrate 2 is fixed on a printed circuit board (PCB) through pins, so as to complete the preparation of the optical transceiver module. However, with the above method, there is a problem of increased manufacturing cost due to the necessity of a ceramic substrate.

Furthermore, please refer to FIG. 2 , which shows a schematic diagram of another example of a known optical transceiver module 100 . In this example, firstly, the optical fiber 102 is passed through a zirconia ferrule (ferrule) 104 , and then the zirconia ferrule 104 is sleeved in a free-cutting copper flange (Flange) 106 . In addition, the planar optical waveguide 108 is fixed on the ceramic substrate 110 . Next, the core portion 120 of the optical fiber 102 is placed in the V-shaped groove of the planar optical waveguide 108, and then aligned with the waveguide (waveguide) incident surface of the planar optical waveguide 108; 102 core portion 120, and the fiber cover 112 is affixed to the planar optical waveguide 108 by heating and melting. And the planar optical waveguide 108 is electrically connected to the ceramic substrate 110 by wire bonding. Then, the ceramic substrate 110 and the flange 106 are sleeved and adhered to the base 116 to position and further fix the optical fiber 102 and the planar optical waveguide 108 . Next, the pins 114 protruding from the ceramic substrate 110 are electrically connected to the printed circuit board 118 to complete the preparation of the optical transceiver module 100 .

Although the above method can reduce the amount of ceramic materials used, it needs to increase components such as free-cutting copper ferrules, ceramic flanges and zirconia ferrules, so not only can not use ceramic materials at all, but also increase other high-priced components , so the above method cannot effectively save costs. Furthermore, the above method needs to add at least 3 processes compared with another known technology, so the overall process time will be greatly increased, and the process difficulty will be increased accordingly.

Contents of the invention

Therefore, in order to solve the above problems, the present invention proposes an optical transceiver module to greatly reduce manufacturing cost and time.

In addition, the optical transceiver module of the present invention can greatly reduce the process difficulty and manufacturing cost without using high-temperature-resistant materials.

Furthermore, the optical transceiver module proposed by the present invention can reduce the possibility of optical fiber displacement/deformation/breakage, etc., and can increase the stability of the light source.

In the present invention, an optical transceiver module is provided, which is composed of a circuit structure, a fixing device, a light-conducting element and a cover, wherein the circuit structure is engaged with the fixing device in a fitting manner, and the aforementioned fitting method is formed by fixing the A groove is designed on the device, and the groove is embedded with the circuit structure. Between the groove and the circuit structure, one of the group consisting of adhesive, filling material, elastic material or other soft materials can be used to Increase the adhesion between the circuit structure and the fixture. And this fixing device covers all or a part of the delivery fiber, and one of the group consisting of adhesive, filling material, elastic material or other soft materials can be used between the fixing device and the delivery fiber to reduce the displacement of the delivery fiber. Possibility of deformation/breakage. The optical signal is transmitted in the transmitting optical fiber. The light conducting element is directly connected to the circuit structure, and receives and/or sends the aforementioned light signal. The cover is to connect the transmission optical fiber to the light-conducting element by means of glue, spot welding, or laser welding.

In the above-mentioned optical transceiver module, the light-conducting element and the cover are located on the same side of the circuit structure, and the light-conducting element is located at the place where the cover and the circuit structure enclose. The optical fiber is passed and connected to the light conducting element, creating an electrical connection. The circuit structure also has at least one pin for connecting with an external system to generate electrical connection.

In the above-mentioned optical transceiver module, the light-conducting element is selected from the group consisting of planar optical waveguide, laser diode, vertical resonant cavity surface-emitting laser, light-emitting diode, and photodiode. The circuit structure is a printed circuit board. The covering material is selected from the group consisting of plastics, metals, alloys, resins, stainless steel, and ceramics. The material of the fixing device is plastic, metal, alloy, ceramics or one of the groups formed therein.

Furthermore, in the above-mentioned optical transceiver module, the fixing device can be directly embedded with the circuit structure through a groove, or a casing can be used to cover the fixing device, so that the fixing device can be indirectly embedded with the circuit structure. Therefore, the present invention further provides an optical transceiver module, which is composed of a circuit structure, a light-conducting element, a circuit structure, a fixing device, a housing, and a cover, wherein the circuit structure is engaged with the fixing device in a fitting manner. The method is to design a groove on the fixing device, and use the groove to fit the circuit structure, and use the shell to cover the fixing device, so that the fixing device indirectly fits the circuit structure. Adhesive, filling material, elastic material or one of other soft materials can be used between the groove and the circuit structure to increase the fixation force between the circuit structure and the fixing device. And this fixing device covers all or a part of the delivery fiber, and one of the group consisting of adhesive, filling material, elastic material or other soft materials can be used between the fixing device and the delivery fiber to reduce the displacement of the delivery fiber. Possibility of deformation/breakage. The optical signal is transmitted in the transmitting optical fiber. The light conducting element is directly connected to the circuit structure, and receives and/or sends the aforementioned light signal.

In the present invention, the covering system connects the transmission optical fiber to the light-conducting element by means of glue, spot welding, or laser welding, and the housing has a through opening, so that part of the transmission optical fiber can be inserted, so that the transmission optical fiber can pass through the housing. light signal. In addition, adhesive, filling material, elastic material or other soft materials can be used between the transmission fiber and the housing to reduce the possibility of displacement/deformation/breakage of the transmission fiber. The outer shell fixes the circuit structure by means of affixation. The aforesaid method of affixation is adhesion, clamping, fitting, tight fitting, clamping, filling or using at least one pin. a circuit structure and having at least one pin for connecting with an external system to create an electrical connection,

In the above-mentioned optical transceiver module, the light-conducting element and the cover are located on the same side of the circuit structure, and the light-conducting element is located at the place where the cover and the circuit structure enclose. The optical fiber is passed and connected to the light conducting element, creating an electrical connection. The circuit structure also has at least one pin for connecting with an external system to generate electrical connection.

In the above-mentioned optical transceiver module, the light-conducting element is selected from the group consisting of planar optical waveguide, laser diode, vertical resonant cavity surface-emitting laser, light-emitting diode, and photodiode. The circuit structure is a printed circuit board. The covering material is selected from the group consisting of plastics, metals, alloys, resins, stainless steel, and ceramics. The material of the fixing device is plastic, metal, alloy, ceramics or one of the groups formed therein. The material of the casing is selected from plastics, metals, alloys, stainless steel, ceramics or one of the groups formed therefrom.

To sum up, in the optical transceiver module of the present invention, since the light-conducting element is directly located on the circuit structure, and the circuit structure is directly used as a carrier, it is not necessary to connect with the circuit structure via a ceramic substrate, and the ceramic substrate can be omitted. Base plate, so it is not only convenient to assemble, but also can greatly reduce the manufacturing cost and time.

Moreover, in the optical transceiver module of the present invention, since there is no need to use a ceramic substrate as a carrier, different gluing methods can be changed to bond the cover and the light-conducting element. The gluing material may include ultraviolet glue or low-temperature epoxy Resin or other low-temperature resins reduce the possibility of material deformation due to heat, so low-temperature metal materials can also be used for fixtures.

Furthermore, in the optical transceiver module of the present invention, since the bonding method between the optical fiber and the light-conducting element is not thermal fusion bonding, the structure for bonding the optical fiber and the light-conducting element does not need to use high-temperature-resistant materials, and does not require It is necessary to use a high-temperature-resistant ferrule to fix the position of the optical fiber, so the process difficulty and manufacturing cost can be greatly reduced.

In addition, in the optical transceiver module of the present invention, since the outside of the optical fiber is covered by soft/elasticity, when the optical fiber is subjected to external force, the fixing device will absorb the external force, thereby reducing the possibility of optical fiber displacement/deformation/breakage, etc. sex.

In order to make the above and other purposes, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, as follows:

Description of drawings

Fig. 1 shows a schematic diagram of a known optical transceiver module.

FIG. 2 shows a schematic cross-sectional view of another known optical transceiver module.

FIG. 3A shows a top view of a preferred embodiment of the optical transceiver module of the present invention.

FIG. 3B shows a schematic cross-sectional view of a preferred embodiment of the optical transceiver module of the present invention.

Fig. 4 shows a schematic cross-sectional view of another preferred embodiment of the optical transceiver module of the present invention.

FIG. 5A shows a top view of yet another preferred embodiment of the optical transceiver module of the present invention.

FIG. 5B shows a schematic cross-sectional view of a preferred embodiment of the optical transceiver module of the present invention.

Detailed ways

3A and 3B show schematic diagrams of a preferred embodiment of the optical transceiver module 300 of the present invention. Please refer to FIG. 3A, which shows a top view of the present invention, the optical transceiver module 300 is composed of a light-conducting element 302, a fixing device 303 and a circuit structure 301, wherein the light-conducting element 302 and the fixing device 303 The connection between them is achieved by covering with a cover 304 and making the edge of the cover 304 and the light-conducting element 302 fixed. The method of connecting the cover 304 and the light-conducting element 302 is, for example, glue, spot welding, or laser welding, wherein the material of the glue may include ultraviolet glue, low-temperature epoxy resin or other low-temperature resin. The material of the cover 304 is, for example, plastic, metal, alloy, stainless steel, ceramic or other materials with sufficient rigidity. The material of the fixing device 303 is, for example, plastic, metal, alloy, ceramic or other materials with sufficient rigidity.

The light conducting element 302 can be a planar light waveguide, a laser diode (laser diode, LD), a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Lasers, VCSEL), a light emitting diode (light emitting diode, LED) or a photodiode ( photodiode, PD). In addition, the light conducting element 302 further has an opening 308 for providing positioning between the fixing device 303 and the light conducting element 302 .

The fixing device 303 covers a part of the transmission optical fiber 306, and the center of the transmission optical fiber 306 is composed of a core part 307 for transmitting optical signals, wherein the core part 307 is for the optical signal to be inside. The internal reflective structure that reflects the progress is, in particular, for example a solid internal total reflective structure or a hollow internal total reflective structure. And make the delivery optical fiber 306 pass through the fixing device 303 and extend out of the fixing device 303, between the fixing device 303 and the delivery fiber 306, a soft or elastic substance can be injected to absorb the shock, Reduce the stress on the transmission fiber and effectively prevent the transmission fiber from shifting.

In this preferred embodiment, the light-conducting element 302 has an opening 308 for arranging the core portion 307 at one end of the transmission fiber 306, and making the core portion 307 opposite to the incident portion or the exiting portion of the light-conducting element 302 .

Wherein, the fixing device 303 has a groove 309, and the circuit structure 301 is engaged with the fixing device 303 in a fitting manner; The joint between 309 and the circuit structure 301 can use a material softer than the fixing device 303 such as adhesive, filling material, elastic material or other soft substances to increase the stability of the fitting between the circuit structure 301 and the fixing device 303 .

The circuit structure 301 is used to drive/control the light-conducting element 302 or be driven/controlled by the light-conducting element 302 . The circuit structure 301 also has a plurality of pins 310 for connecting with an external system to generate an electrical connection. The circuit structure 301 can be a printed circuit board. The light-conducting element 302 is directly connected to the circuit structure 301 to receive the optical signal from the core part 307, and convert the optical signal into other signals such as electrical signals, or convert other signals such as electrical signals into Convert it into an optical signal, and then send the optical signal to the core part 307. The light-conducting element 302 and the circuit structure 301 can be connected by wire bonding, integrated molding or embedded. Wherein, integrally formed means that the light conducting element 302 and the circuit structure 301 are manufactured in the same structure at the same time or separately. Furthermore, the light conducting element 302 and the cover 304 are located on the same side of the circuit structure 301, as shown in FIG. Where structure 301 double-teams.

Next, please refer to FIG. 4 , which is a top view of another preferred embodiment of the optical transceiver module 400 of the present invention. Firstly, the light conducting element 302 is directly connected to the circuit structure 301 by wire bonding, so that the light conducting element 302 is electrically connected to the circuit structure 301 . Next, the relative position between the fixing device 303 and the housing 305 is determined by clamping, fitting, welding, clamping or adhesion. In addition, make the fixing device 303 wrap the entire delivery fiber 306 , and then fill the elastic material/filler between the delivery fiber 306 and the fixing device 303 , so that the delivery fiber 306 is fixed in the fixing device 303 .

Then, the circuit structure 301 is fitted on the groove 309 of the fixing device 303, and the core part 307 of the transfer optical fiber 306 is placed in the opening 308 of the light-conducting element 302, and the core part 307 is It is in contact with the incident part or the outgoing part of the light conducting element 302 . Then, cover the opening 308 with the cover 304, and fix the cover 304 on the light-conducting element 302 by gluing, spot welding or laser welding. At this time, the transmission optical fiber 306 is received by the cover 304 and The clamping of the light conducting element 302 is fixed.

In addition, the fixing device 303 can directly use the groove 309 to fit the circuit structure 301, or use a casing 305 to cover the fixing device 303, so that the fixing device 303 can indirectly fit the circuit structure 301. Please refer to FIG. 4 , where the housing 305 and the fixing device 303 can be integrally formed, or can be separate structures that can be combined with each other. The material of the casing 305 is, for example, plastic, metal, stainless steel, alloy, ceramic or other materials with sufficient rigidity. The joining methods of the casing 305 and the fixing device 303 are, for example, adhesion, clamping, fitting, tight fit, clamping, and integral molding.

By means of this preferred embodiment, actions such as alignment and fixing between the fixing device and the light-conducting element can be easily completed, and since the bonding process does not require high-temperature melting steps, this preferred embodiment Part of the components can be directly made of easy-to-process and cheap materials such as plastics.

Furthermore, since the periphery of the transmission fiber is covered by a slightly elastic or soft structure, when the transmission fiber is subjected to external force, the aforementioned elastic and soft structure can absorb the external force to reduce the stress on the transmission fiber. Effect and effectively prevent the transmission fiber from shifting.

In addition, the assembling method of the optical transceiver module of the present invention is not limited to the above-mentioned assembling method, and may also be the structure shown in FIG. 5A or 5B, or other methods and structures obtained under the same spirit.

Please refer to FIG. 5A , which shows a top view of yet another preferred embodiment of the optical transceiver module 500 of the present invention. In this preferred embodiment, the difference between the optical transceiver module 500 and the optical transceiver module 300 shown in FIGS. 3A and 3B is that a housing 501 is used as a protection/positioning optical transceiver module in this preferred embodiment. The axis of the housing 501 forms a through opening 502 for allowing the core portion 307 in the transmitting optical fiber 306 to transmit optical signals through the housing 501 , and please refer to the schematic cross-sectional view shown in FIG. 5B .

The housing 501 fixes the circuit structure 301 in a fixed way, such as adhering, clamping, clamping, tight fitting, fitting, filling or using at least one pin. The shape of the housing 501 can be cylindrical, columnar, polygonal or other structures that can be used to protect/position the optical transceiver module.

The above example is used as an example for illustration, but it is not limited to the above, and may be used interchangeably depending on the actual situation.

To sum up, in the optical transceiver module of the present invention, since the light-transmitting element is directly connected to the circuit structure, it does not need to be connected to the circuit structure through a ceramic substrate, so the manufacturing cost and time can be greatly reduced.

Furthermore, in the optical transceiver module of the present invention, since the joining method between the transfer optical fiber and the light-conducting element is not thermal fusion bonding, the structure for joining the transfer optical fiber and the light-conducting element does not need to use a high-temperature-resistant material, and there is no need to use a high-temperature-resistant ferrule to fix the position of the transmission fiber, so the difficulty of the process and the manufacturing cost can be greatly reduced.

In addition, since the bonding method between the light-conducting element and the cover can be carried out at low temperature, ultraviolet glue or low-temperature epoxy resin can be used for bonding, which can further reduce costs.

In addition, in the optical transceiver module of the present invention, since the outside of the transmission fiber is covered by a soft/elastic material, when the transmission fiber is subjected to an external force, it will absorb the external force, thereby reducing the displacement/deformation/breakage of the transmission fiber, etc. possibility.

Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims (13)

1. An optical transceiver module, comprising: a circuit structure; A fixing device, the fixing device completely or partially covers a transmission fiber, and an optical signal is transmitted in the transmission fiber; a light conducting element, coupled to the fixture and directly connected to the circuit structure, and receives and/or transmits the light signal; and A cover is used to connect one end of the transmission fiber to the light-conducting element. 2. The optical transceiver module as claimed in claim 1, further comprising a housing covering the fixing device so that the fixing device is indirectly fitted with the circuit structure, and the material of the housing is plastic, metal, alloy, stainless steel or ceramic. 3. The optical transceiver module as claimed in claim 1, wherein the circuit structure is engaged with the fixing structure in a fitting manner. 4. The optical transceiver module as claimed in claim 1, wherein the fixing device has a groove, and is engaged with the circuit structure through the groove. 5. The optical transceiver module as claimed in claim 5, wherein the circuit structure is bonded in the groove by adhesive, filling material, elastic material or soft material. 6. The optical transceiver module as claimed in claim 1, wherein the fixing device and the transmission optical fiber are fixedly assembled by using adhesive, filling material, elastic material or soft material. 7. The optical transceiver module as claimed in claim 1, wherein the light-conducting element and the cover are located on the same side of the circuit structure, and the light-conducting element is located between the cover and the circuit structure. 8. The optical transceiver module as claimed in claim 1, wherein the circuit structure has at least one pin for connecting with an external system to generate an electrical connection. 9. The optical transceiver module as claimed in claim 1, wherein the fixing device is made of plastic, metal, alloy or ceramic. 10. The optical transceiver module as claimed in claim 1, wherein the covering material is selected from the group consisting of plastic, metal, alloy, stainless steel and ceramic. 11. The optical transceiver module as claimed in claim 1, wherein the cover and the light-conducting element are bonded to each other by ultraviolet glue, low-temperature epoxy resin or other low-temperature resin. 12 . The optical transceiver module according to claim 1 , wherein the covering is to connect one end of the transmitting optical fiber to the light-conducting element in a manner selected from the group consisting of gluing, spot welding and laser welding. 13 . 13. An optical transceiver module, comprising: a circuit structure; A fixing device, the fixing device completely or partially covers a transmission fiber, and an optical signal is transmitted in the transmission fiber; a light-conducting element, coupled to the fixture and directly connected to the circuit structure, and receives and/or transmits the light signal; a housing with a through opening through which the optical signal can pass through; and A cover is used to connect one end of the transmission fiber to the light-conducting element.

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