CN1737478A - Heat treatment device - Google Patents
Heat treatment device Download PDFInfo
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- CN1737478A CN1737478A CNA2005100807280A CN200510080728A CN1737478A CN 1737478 A CN1737478 A CN 1737478A CN A2005100807280 A CNA2005100807280 A CN A2005100807280A CN 200510080728 A CN200510080728 A CN 200510080728A CN 1737478 A CN1737478 A CN 1737478A
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Abstract
本发明的目的是提一种结构简单、可抑制使伴随着基板的热处理而产生的生成气体冷却而产生的所谓升华物的发生的热处理装置。热处理装置(1)包括具有用于向基板处理部(5)供给热风的热风供给部件(14)的空气调整部(11)、以及用于对基板进行热处理的热处理室(12)。热处理装置(1)配置有催化壁(40)，载持有促进在热处理室(12)的最下游一侧、当处理基板时所产生的生成气体的氧化分解的催化剂。因此，热处理装置(1)因冷却生成气体而产生的所谓的升华物的产生量极低。此外，由于在生成气体氧化分解时会产生反应热，所以热处理装置(1)在热处理时加热混合气体只需很少的耗电量。
An object of the present invention is to provide a heat treatment apparatus having a simple structure and capable of suppressing generation of a so-called sublimation product generated by cooling a generated gas accompanying heat treatment of a substrate. A heat treatment apparatus (1) includes an air conditioning unit (11) having a hot air supply member (14) for supplying hot air to a substrate processing unit (5), and a heat treatment chamber (12) for heat treating a substrate. The heat treatment device (1) is provided with a catalytic wall (40) carrying a catalyst for promoting oxidative decomposition of a gas generated when a substrate is processed on the most downstream side of the heat treatment chamber (12). Therefore, the amount of so-called sublimates generated by cooling the generated gas in the heat treatment device (1) is extremely low. In addition, since the heat of reaction is generated during the oxidative decomposition of the generated gas, the heat treatment device (1) only needs little power consumption to heat the mixed gas during heat treatment.
Description
Technical Field
The present invention relates to a heat treatment apparatus for heat-treating an object to be heated such as a substrate with hot air.
Background
The heat treatmentapparatus disclosed in patent document 1 is used for producing a Flat Panel Display (FPD) such as a Liquid Crystal Display (LCD), a Plasma Display (PDP), or an organic EL Display. The heat treatment apparatus is an apparatus that applies a specific solution to a substrate (object to be heated) such as a glass plate in advance, stores the heated and dried substrate in a heating chamber, and performs heat treatment (firing) by exposing the substrate to hot air of a predetermined temperature introduced into the heating chamber.
Patent document 1: japanese patent No. 2971771
Disclosure of Invention
The heat treatment apparatus of the related art has an opening, a gap, or the like for allowing an object to be heated to come in and out, and is not completely sealed, and therefore, a low temperature is easily formed in the vicinity of the opening or the gap. Therefore, the generated gas generated by vaporizing the specific solution or the like applied to the substrate as the heat treatment progresses is cooled and solidified in the vicinity of the opening or the gap, and a so-called sublimate is formed. The sublimates are in the form of particles or tar, and not only contaminate the inside of the heat treatment apparatus and reduce the mass of the object to be heated, but also have a problem of leaking to the outside of the heat treatment apparatus when the object to be heated comes in and goes out.
In general, a heat treatment apparatus is installed in a clean room or the like having a high degree of cleanliness. Therefore, if the sublimate leaks from the heat treatment apparatus as in the heat treatment apparatus of the related art, there is a problem that the cleanliness of the cleaning chamber is even lowered.
In view of the above problem, the heat treatment apparatus disclosed in patent document 1 is configured as follows: that is, the inside of the heat treatment apparatus is maintained at a low pressure slightly lower than the atmospheric pressure in which the heat treatment apparatus is installed, thereby preventing air or generated gas in the heat treatment apparatus from leaking to the outside. In the case of such a configuration, although a problem that so-called sublimates are discharged from the heat treatment apparatus to the outside is exhibited with a certain effect, there is a possibility that the sublimates are generated to some extent due to the influence of air flowing in from the opening or the gap for allowing the heated object to come in and go out.
In the heat treatment apparatus disclosed in patent document 1, there is a possibility that temperature unevenness may occur in the heating chamber due to the influence of the air flowing into the apparatus. Therefore, the heat treatment apparatus disclosed in patent document 1 has a problem that a mechanism for sucking and trapping the generated gas leaking from the heating chamber side to the outside and the air flowing from the outside to the heating chamber side has to be separately provided in the vicinity of the opening for the entrance and exit of the object to be heated, and the structure of the apparatus becomes complicated.
Accordingly, an object of the present invention is to provide a heat treatment apparatus having a relatively simple structure and capable of suppressing generation of so-called sublimates due to cooling of a generated gas generated during heat treatment of a substrate.
Accordingly, the present invention provided to solve the above problems is characterized in that: the heating apparatus includes a hot air supply means for supplying hot air, and a heating chamber for introducing the hot air generated by the hot air supply means and heating an object to be heated with the hot air, and a generated gas decomposition means for oxidatively decomposing the generated gas is disposed in a generated gas flow region generated as the object to be heated is heated.
In the heat treatment apparatus of the present invention, most of the generated gas generated by heating the object with the hot air supplied from the hot air supply means to the heating chamber is oxidatively decomposed in the generated gas decomposition means. Therefore, in the heat treatment apparatus of the present invention, most of the gas flowing downstream of the generated gas decomposition means is decomposed gas generated by decomposition of the generated gas, and the concentration of the generated gas is very low. Therefore, in the heat treatment apparatus of the present invention, the generation of so-called sublimates in which the generated gas is in a solid state or in a tar state can be suppressed.
In the heat treatment apparatus of the present invention, the generated gas is oxidatively decomposed by the generated gas decomposition member, and therefore reaction heat is generated. Therefore, in the above configuration, the gas passing through the gas decomposition member is heated by the reaction heat to have a high temperature, and is discharged from the heating chamber. Therefore, in the heat treatment apparatus of the present invention, even if a part of the generated gas is left without being decomposed in the generated gas decomposition member, the generated gas is hardly converted into a solid or tar-like sublimate.
In the heat treatment apparatus of the present invention, the product gas is oxidatively decomposed in the product gas decomposition member, and the temperature of the gas discharged to the downstream side of the product gas decomposition member is raised by the reaction heat generated at the decomposition reaction. Therefore, in the heat treatment apparatus of the present invention, the distribution of the ambient gas temperature may change between the upstream side and the downstream side of the generated gas decomposition member, and the heating of the object to be heated may become uneven in some cases.
Accordingly, the present invention provided based on such an understanding is characterized in that: the heating apparatus includes a hot air supply means for supplying hot air, and a heating chamber for introducing the hot air generated by the hot air supply means and heating an object to be heated with the hot air, wherein the heating chamber has an object-to-be-heated disposition area in which the object to be heated is disposed, and a generated gas decomposition means for oxidatively decomposing the generated gas is disposed in a generated gas flow area generated as the object to be heated is heated on a downstream side in a flow direction of the hot air in the object-to-be-heated disposition area.
In such a configuration, the temperature distribution of the heated region in which the object to be heated is arranged is stabilized, and uneven heating of the object to be heated can be reliably prevented.
Here, the heat treatment apparatus of the present invention is characterized in that: the product gas decomposition member carries a catalyst for promoting oxidative decomposition of the product gas on a catalyst substrate.
In such a configuration, the generated gas generated by heating the object to be heated can be reliably decomposed, and generation of solid or tarry substances accompanying cooling of the generated gas can be suppressed.
In the heat treatment apparatus of the present invention described above, the heating chamber may be surrounded by an upstream wall communicating with the hot air supply means, a downstream wall facing the upstream wall, and a partition wall extending in a direction intersecting the upstreamwall and the downstream wall, and a part or all of the downstream wall may be constituted by the generated gas decomposition means.
In the heat treatment apparatus of the present invention, since the upstream wall communicates with the hot air supply means, hot air is introduced into the heating chamber from the upstream wall side and flows out from the downstream wall side. In the heat treatment apparatus of the present invention, since the generated gas decomposition member constitutes a part or the whole of the downstream wall, the generated gas generated in association with the heat treatment of the object to be heated can be efficiently decomposed.
Here, the noble metal or noble metal alloy has high oxidation activity for various gases. Therefore, in the heat treatment apparatus of the present invention described above, the generated gas decomposition member preferably supports a catalyst containing a noble metal or a noble metal alloy on the catalyst substrate.
In such a configuration, the generated gas generated by heating the object to be heated can be reliably decomposed, and the generation of so-called sublimate accompanying the cooling of the generated gas can be reliably prevented.
In the heat treatment apparatus of the present invention, the product gas decomposition member preferably supports a catalyst for promoting oxidative decomposition of the product gas on the catalyst substrate, and the catalyst substrate preferably has a honeycomb shape in which a plurality of product gas flow paths are formed.
In such a configuration, the generated gas can be brought into sufficient contact with the catalyst, and the generated gas can be efficiently decomposed.
In the present invention, the "honeycomb shape" refers to a porous structure having a plurality of flow paths formed therein, and the opening shape of the flow paths may be a polygonal shape such as a triangle or a hexagon, or a curved shape such as a circle, an ellipse, or a corrugation.
In the heat treatment apparatus of the present invention, it is preferable that the generated gas decomposition member supports a catalyst for promoting oxidative decomposition of the generated gas on a catalyst substrate, and the catalyst substrate is provided with a plurality of generated gas flow paths having a thickness in a range of 30mm to 80 mm.
In such a configuration, the generated gas generated as the object is heated can be sufficiently oxidized and decomposed, and the generated gas decomposition member can be prevented from generating a large resistance to the flow of the generated gas.
The heat treatment apparatus of the present invention described above is preferably configured to be provided with a circulation flow path for returning the decomposition gas generated in the generated gas decomposition means to the hot air supply means.
In the heat treatment apparatus of the present invention, the decomposition gas or the air in the vicinity of the product gas decomposition member is heated by the influence of the decomposition heat generated when the product gas is decomposed in the product gas decomposition member. Therefore, in the heat treatment apparatus of the present invention, the decomposition gas or the air heated by the decomposition heat of the generated gas is supplied to the hot air supply means through the circulation flow path. The decomposition gas or the air mixture is heated in the hot air supply means to be introduced into the heating chamber as hot air.
In the heat treatment apparatus of the present invention, since the decomposition gas or air heated by the decomposition heat in advance is supplied to the hot air supply means, a large heating capacity is not required to heat the mixed gas to a predetermined temperature. Therefore, according to the present invention, it is possible to provide a heat treatment apparatus with low consumption of necessary heating of an object to be heated.
The heat treatment apparatus of the present invention is configured to introduce the decomposed gas, which has passed through the heating chamber and been decomposed by the product gas decomposition means, into the heating chamber by reheating, and therefore, the amount of the outdoor gas taken in can be minimized. Therefore, according to the heat treatment apparatus of the present invention, the temperature distribution of hot air introduced into the heating chamber is made uniform, and the unevenness of the temperature distribution at the position of the object exposed to the hot air can be suppressed to the minimum.
In the heat treatment apparatus according to the present invention, the generated gas decomposition member is preferably provided on an upstream side in a flow direction of the generated gas in a portion where the outdoor gas may flow in.
In such a configuration, the sublimation of the generated gas by cooling the generated gas by the outdoor air can be minimized.
In the heat treatment apparatus according to the present invention, the hot air supply means is preferably configured to be capable of supplying the heated gas to the heating chamber by heating a mixed gas containing the decomposed gas generated by the generated gas decomposing means and air introduced from the outside.
In the heat treatment apparatus of the present invention, the pyrolysis gas generated by the generated gas decomposition means and the outdoor air, which is assumed to have a lower temperature than the pyrolysis gas, are introduced into the hot air supply means in a state of being mixed in advance. Therefore, in the heat treatment apparatus of the present invention, there is almost no temperature deviation in the mixed gas of the decomposition gas and the outdoor gas at the time of introduction into the hot air supply means. Therefore, according to the present invention, the uneven heating of the mixed gas in the hot air supply member is less likely to occur, and the temperature distribution of the hot air supplied to the heating chamber can be made substantially uniform.
The heat treatment apparatus of the present invention described above can be suitably applied to heating of an object to be heated in which a predetermined liquid is applied to the surface of a flat substrate.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide a heat treatment apparatus having a relatively simple structure and capable of minimizing the amount of organic gas sublimates generated during heat treatment of an object to be heated and the amount of power consumption required for the heat treatment.
Drawings
Fig. 1 is a front view showing a heat treatment apparatus as an embodiment of the present invention.
Fig. 2 is a sectional perspective view showing a part of the internal configuration of the heat treatment apparatus shown in fig. 1.
Fig. 3 is a schematic plan view showing the internal configuration of the heat treatment apparatus shown in fig. 1.
Fig. 4(a) is a perspective view conceptually showing a positional relationship between a hot air supply member and a hot air chamber of the heat treatment apparatus shown in fig. 1, (b) is an enlarged view of a portion a of the catalyst wall shown in (a), and (c) is an enlarged perspective view of a main portion of the catalyst wall shown in (b).
Fig. 5 is a conceptual view schematically showing flows of air and mixed gas in the heat treatment apparatus shown in fig. 1.
Fig. 6 is a conceptual diagram illustrating a modification of the heat processing apparatus shown in fig. 1.
Description of the symbols:
5: substrate processing unit, 11: air adjustment portion, 12: heat treatment chamber (heating chamber), 14: hot air supply means, 16: air merging portion, 17: air duct, 40: catalytic wall (product gas decomposition component), 47: through-hole (channel), 48: catalytic substrate, 49: catalyst, 70: a gas decomposition component is generated.
Detailed Description
Next, a heat treatment apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a front view showing a heat treatment apparatus as an embodiment of the present invention. Fig. 2 is a sectional perspective view showing a part of the internal configuration of the heat treatment apparatus shown in fig. 1. Fig. 3 is a schematic plan view showing the internal configuration of the heat treatment apparatus shown in fig. 1. Fig. 4(a) is a perspective view conceptually showing a positional relationship between a hot air supply member and a heat treatment chamber of the heat treatment apparatus shown in fig. 1, (b) is an enlarged view of a portion a of the catalyst wall shown in (a), and (c) is an enlarged perspective view of a main portion of the catalyst wall shown in (b). Fig. 5 is a conceptual view schematically showing flows of air and mixed gas in the heat treatment apparatus shown in fig. 1. Fig. 6 is a conceptual diagram illustrating a modification of the heat processing apparatus shown in fig. 1.
In fig. 1, reference numeral 1 denotes a heat treatment apparatus according to the present embodiment. The heat treatment apparatus 1 is configured to: a device housing section 3 is provided below the metal box-shaped main body case 2, and a substrate processing section 5 is provided above the device housing section. The apparatus housing portion 3 incorporates a power supply device (not shown) for supplying power to the substrate processing portion 5, a control device (not shown) for controlling the operation of the substrate processing portion 5, and the like.
As shown in fig. 1 and 2, the substrate processing unit 5 has a loading port 6 for loading and unloading the substrate W by a loading device such as a robot arm, not shown, on the front side, and a door 7 for use in maintenance on the rear side. A shutter 10 that opens and closes in conjunction with the operation of the cylinder 8 is attached to the refill port 6.
As shown in fig. 2 and 3, the substrate processing unit 5 has a heat treatment chamber 12 (heating chamber) at the center thereof, and is configured to surround the periphery thereof by an air adjusting unit 11. The air adjustment portion 11 is surrounded on the four sides by peripheral walls 13a to 13d made of a heat insulating material. The air adjusting unit 11 is configured to heat air to a predetermined temperature, blow the heated air into the heat treatment chamber 12, and circulate the air discharged from the heat treatment chamber 12 on the upstream side.
More specifically, as shown in fig. 2 and 3, the air adjustment unit 11 is roughly divided into a hot air supply member 14, an air duct 17, and an equipment room 18. The hot air supply member 14 includes: a heating function of heating air or the like, and an air blowing function of sending the heated air or the like into the heat treatment chamber 12. A filter 21 for purifying air and the like is provided at a boundary portion between the hot air supply means 14 and the heat treatment chamber 12.
Near the hot air supply unit 14, air merging portions 16 and 16 are provided on the front side and the rear side of the heat treatment chamber 12. The air merging portions 16, 16 communicate with an air duct 17, respectively. The air merging portion 16 has a function of merging air introduced from an outdoor air inlet (not shown) and gas flowing in from the air duct 17, and serving as a premixing space for mixing these gases.
The air duct 17 is a space formed along the catalytic wall 40 (the generated gas decomposition member) and the partition walls 41 and 43 forming most of the downstream wall 20b of the heat treatment chamber 12. The air duct 17 is an air flow path disposed so as to surround the periphery of the heat treatment chamber 12, and forms an air flow path for returning the air discharged from the heat treatment chamber 12 to the air merging portion 16.
The heat treatment chamber 12 is a space surrounded by the upstream wall 20a, the downstream wall 20b, and partition walls 41 and 43 extending in a direction intersecting the upstream wall and the downstream wall. The upstream wall 20a, the downstream wall 20b, and the partition walls 41 and 43 are all at a height from the ceiling 45 to the bottom surface 46 of the substrate processing section 5. The heat treatment chamber 12 communicates with the hot air supply member 14 through an opening of the filter 21 constituting the upstream wall 20 a. The downstream wall 20b is partially or entirely formed of the catalyst wall 40, and communicates with the air duct 17 through the through holes 47 provided in the catalyst wall 40.
As shown in fig. 4 b, the catalyst wall 40 is a so-called honeycomb plate body in which a plurality of through holes 47 (flow paths) having a substantially triangular opening shape are continuously formed as a catalyst substrate 48. The through-holes 47 function as flow paths for the generated gas, and as shown in fig. 4(c), a plurality of particulate catalysts 49 are dispersed and embedded on the surface of the inner wall surface 47a forming the through-holes 47. The material of the catalyst substrate 48 is preferably a metal material such as a stainless alloy or a ceramic material such as silica or alumina that is stable even at the ambient temperature in the heat treatment chamber 12. In order to smoothly start the oxidative decomposition reaction by the catalyst 49 carried on the inner wall surface 47a forming the through-hole 47, the catalyst base 48 is preferably made of a material having high thermal conductivity and small heat capacity.
The opening shape of the catalyst substrate 48 may be a polygonal shape instead of the triangular shape as shown in the present embodiment in consideration of the flow path resistance and the contact area of the gas with the catalyst 49 to be supported, or may be a curved shape such as a circle, an ellipse, or a wave. The thickness of the catalyst substrate 48 (corresponding to W in FIG. 4) is preferably about 30 to 80mm from the viewpoint of catalytic action against oxidative decomposition reaction and resistance to aeration. In the present embodiment, the thickness of the catalyst substrate 48 is about 50 mm. Therefore, the catalytic wall 40 exhibits a sufficient catalytic action with respect to the generated gas generated in the heat treatment chamber 12, and does not form a large flow path resistance against the hot air flowing through the inside of the heat treatment chamber 12.
The catalyst 49 supported on the catalytic substrate 48 is used to promote the oxidative decomposition reaction of the generated gas discharged from the heat treatment chamber 12. In the present embodiment, a noble metal such as platinum (Pt) or palladium (Pd), or a noble metal alloy thereof, which has a high catalytic action with respect to the generated gas, is used as the catalyst 49. The catalyst 49 exhibits catalytic activity in a temperature environment of approximately 150 to 200 ℃ with respect to the generated gas generated in the heat treatment chamber 12, and exhibits sufficient catalytic activity in a state where the heat treatment chamber 12 reaches 230 to 250 ℃ which is a heat treatment (firing) temperature.
The partition wall 41 has an opening 50 at a position corresponding to the replacement port 6 provided in the substrate processing section 5. The opening 50 is formed in a size and shape that are minimally necessary to allow the substrate W and the robot arm to enter and exit. The opening 50 is isolated from the air duct 17 by a protective wall 51 provided so as to surround the opening 50, and communicates with the refill port 6. Therefore, the gas flowing through the air duct 17 does not enter the heat treatment chamber 12 through the opening 50 and does not leak to the outside through the refill port 6. On the other hand, the partition wall 43 is fixed at a position corresponding to the door 7, and is configured to be removable when necessary for maintenance or the like.
As shown in fig. 3, a carrier 55 for placing a substrate is disposed substantially at the center of the heat treatment chamber 12. The carrier 55 has a structure in which a plurality of support layers 64 for horizontally mounting the substrate W are provided in the vertical direction, as in the case of the heat treatment apparatus of the known related art.
Inside the heat treatment chamber 12, as shown in fig. 2 and 3, a temperature sensor 68 for measuring the ambient temperature is provided. The temperature sensor 68 is disposed such that the front end thereof reaches below the upstream side of the heat treatment chamber 12. The heattreatment apparatus 1 is configured to adjust the temperature in the heat treatment chamber 12 to a predetermined temperature (230 to 250 ℃ in the present embodiment) by feedback-controlling the operation of the heater wire 35 by a control device (not shown) based on the temperature detected by the temperature sensor 68.
The heat treatment apparatus 1 of the present embodiment is characterized by a gas flow during heat treatment. Hereinafter, the operation of the heat treatment apparatus 1 will be described with reference to the conceptual diagram shown in fig. 5, focusing on the gas flow during the heat treatment.
Before the heat treatment starts, the controller (not shown) of the heat treatment apparatus 1 starts a blower, a heater, or the like (not shown) constituting the hot air supply means 14 to introduce heated air into the heat treatment chamber 12. Therefore, in the heat treatment apparatus 1, a circulating flow is formed in which air flows through the heat treatment chamber 12 and the air duct 17 and returns to the hot air supply unit 14.
As described above, while the air is circulated in the heat treatment apparatus 1, the air is gradually heated in the hot air supply unit 14 so that the ambient temperature in the heat treatment chamber 12 reaches a predetermined heat treatment temperature (230 to 250 ℃ in the present embodiment). The catalyst wall 40 provided at the downstream end of the heat treatment chamber 12 is gradually heated to a high temperature by the influence of the air flow circulating in the heat treatment apparatus 1, and when the temperature in the heat treatment chamber 12 reaches a predetermined heat treatment temperature, the catalyst 49 supported on the inner wall surface 47a in which the through holes 47 are formed also reaches a temperature at which the catalyst function can be sufficiently exhibited.
When the ambient temperature of the heat treatment chamber 12 reaches the heat treatment temperature, a transfer device such as a robot arm disposed outside the heat treatment apparatus 1 is loaded with the substrate W to be heat-treated. On the other hand, the heat treatment apparatus 1 operates the cylinder 8 to open the shutter 10 that closes the loading port 6. When the shutter 10 is opened, the substrate W is horizontally inserted from the loading port 6 by the robot arm and placed on each support layer 64. When the substrate W is placed on each support layer 64 of the placement frame 55, the shutter 10 is closed.
As described above, the substrate W mounted on the support layer 64 of the carrier 55 is subjected to heat treatment (baking) by being exposed to hot air flowing in the heat treatment chamber 12. When the substrate W is subjected to the heat treatment, the solution previously applied to the surface is vaporized, and an organic generated gas is generated at a high temperature. Therefore, when the heat treatment is started, the mixed gas including the generated gas and the air flows to the downstream side of the heat treatment chamber 12.
When the mixed gas containing the generated gas reaches the catalyst wall 40, the mixed gas flows into the plurality of through holes 47 provided in the catalyst base 48. As described above, since the predetermined heat treatment temperature is reached in the heat treatment chamber 12, the catalyst 49 supported on the inner wall surface 47a of the catalyst base 48 is in a state in which it can sufficiently exert a catalytic action on the generated gas. Therefore, the temperature of the molten metal is controlled,when the generated gas passes through the catalyst wall 40, the oxidative decomposition reaction of the generated gas is promoted by the catalyst 49 supported on the inner wall surface 47a where the through holes 47 are formed: ( ) Thereby decomposing the generated gas into carbon dioxide and water.
The oxidative decomposition reaction is generated along with the generation of reaction heat. Therefore, when the heat treatment is started in the heat treatment apparatus 1, the mixed gas passing through the catalytic wall 40 is discharged into the air duct 17 in a heated state due to the reaction heat accompanying the oxidative decomposition reaction of the product gas. The mixed gas discharged to the air duct 17 flows through the air ducts 17, 17 formed between the peripheral walls 13b, 13d of the substrate processing section 5 and the partition walls 41, 43 of the heat treatment chamber 12 while maintaining a high temperature state.
The mixed gas flowing through the air ducts 17, 17 flows into the air merging portion 16 formed on both sides of the hot air supply member 14 while maintaining a high temperature state, and is premixed with outdoor air introduced from the outside of the heat treatment apparatus 1. Therefore, the outdoor air is heated to some extent by heat exchange with the mixed gas. The outdoor air and the mixed gas are heated to a predetermined temperature by the hot air supply unit 14 and introduced into the heat treatment chamber 12. The heat treatment apparatus 1 circulates the heated mixed gas in the heat treatment chamber 12 in this order, and continues the heat treatment of the substrate W.
As described above, in the heat processing apparatus 1 of the present embodiment, most of the generated gas generated when the substrate W is heated by the hot air supplied from the hot air supply unit 14 into the heat processing chamber 12 is oxidized and decomposed by the catalyst 49 supported on the catalyst wall 40. Here, in the heat treatment apparatus 1 of the present embodiment, the catalyst wall 40 forms a part or the whole of the downstream wall 20b constituting the heat treatment chamber 12, and a noble metal such as platinum or palladium having a higher catalytic activity than an organic gas and a noble metal alloy are supported as the catalyst wall 40. Moreover, the catalytic wall 40 is formed such that: a honeycomb member having a plurality of through holes 47 is used as the catalyst substrate 48, and a catalyst 49 is supported on an inner wall surface 47a in which the through holes 47 are formed. Therefore, most of the generated gas flowing into the catalyst wall 40 is decomposed into a mixed gas containing generated carbon dioxide as a main component, and therefore the concentration of the generated gas is extremely low.
In the heat treatment apparatus 1, the mixed gas containing carbon dioxide as a main component decomposed by the catalyst wall 40 is heated to a high temperature by reaction heat generated when the reaction gas is oxidatively decomposed in the catalyst wall 40. Therefore, in the heat treatment apparatus 1, the temperature of the mixed gas flowing through the air duct 17 during the heat treatment is high, and for example, even if a part of the generated gas remains without being decomposed in the generated gas decomposition unit, the sublimate is hardly generated.
In the heat treatment apparatus 1, the mixed gas that is oxidized and decomposed in the catalyst wall 40 to have a high temperature flows through the air duct 17, and is mixed with outdoor air that is newly introduced from the outside in the hot air supply unit 14. The heat treatment apparatus 1 is used by heating again the decomposition gas that has passed through the heat treatment chamber 12 and is oxidatively decomposed in the catalyst wall 40, and most of the mixed gas circulates in the apparatus. Therefore, the heat treatment apparatus 1 requires only a small amount of electric power to heat the mixed gas supplied to the heat treatment chamber 12 to a predetermined temperature, and contributes to energy saving. In the heat treatmentapparatus 1, since the outside air is premixed with the mixed gas and introduced into the hot air supply unit 14 at the air merging portion 16, the hot air introduced from the hot air supply unit 14 into the heat treatment chamber 12 hardly has temperature unevenness, and the substrate W can be heated without variation.
As described above, the mixed gas is oxidatively decomposed by passing through the catalytic wall 40 and heated. Therefore, the mixed gas having passed through the catalyst wall 40 may have a predetermined temperature distribution due to factors such as the concentration distribution of the mixed gas or the passage of the mixed gas through a certain portion of the catalyst wall 40. As can be understood from the above, in the heat treatment apparatus 1 of the present embodiment, the catalyst wall 40 is disposed on the downstream side of the carrier 55 on which the substrate W is placed. That is, in the heat treatment apparatus 1, the catalytic wall 40 is disposed in a region on the downstream side in the flow direction of the mixed gas at the point of heat treatment, and the oxidative decomposition reaction is performed in this region. Therefore, in the heat treatment apparatus 1 of the present embodiment, the temperature distribution of the hot air exposed to the substrate W is substantially uniform, and the substrate W can be heated without variation.
As described above, in the heat treatment apparatus 1, most of the generated gas generated in the heat treatment chamber 12 is decomposed in the catalytic wall 40, and therefore, a sublimate is hardly generated. Therefore, the heat processing apparatus 1 can maintain the cleanliness of the interior of the heat processing apparatus 1 even if the heat processing operation is continued, and can prevent the sublimates from leaking to the outside of the heat processing apparatus 1 when the shutter 10 or the door 7 is opened and contaminating the clean room or the like. In the heat processing apparatus 1, the catalyst wall 40 forms a part or all of the downstream wall 20b located on the downstream side in the flow direction of the generated gas generated on the substrate W, and the structure is very simple.
In the heat treatment apparatus 1 of the above embodiment, the catalytic wall 40 is disposed on the downstream wall 20b constituting the wall surface on the downstream side of the heat treatment chamber 12, but the present invention is not limited to this, and for example, as shown in fig. 6, a product gas decomposition member 70 having the same catalytic action as the catalytic wall 40 may be provided in the middle of the air duct 17. In this case, the generated gas decomposition member 70 may be provided at any point in the air duct 17, but is preferably provided upstream of a portion into which the outdoor gas such as the door 7 may flow.
In the catalyst wall 40 used in the above embodiment, the catalyst 49 is supported in the through holes 47 of the honeycomb catalyst base 48, but the present invention is not limited to this, and for example, a catalyst in the form of pellets or pills may be filled in the inside of a case made of a material having air permeability such as a metal mesh. Even in the case of such a configuration, the generated gas generated in association with the heat treatment of the substrate W can be reliably oxidized and decomposed. In the above embodiment, since a noble metal such as platinum (Pt) or palladium (Pd) or a high-priced material of an alloy of these noble metals, which exhibits sufficient catalytic activity for a generated gas at an ambient temperature of 230 to 250 ℃ in a heat treatment (firing) temperature, is used as the catalyst 49, the catalyst wall 40 tends to be expensive. Therefore, if the amount of the catalyst 49 supported on the catalyst wall 40 is optimized according to the concentration of the generated gas generated during the heat treatment, the amountof the catalyst 49 supported can be reduced, and the manufacturing cost of the heat treatment apparatus 1 can be further reduced.
Claims (11)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194242 | 2004-06-30 | ||
| JP2004194242A JP2006017357A (en) | 2004-06-30 | 2004-06-30 | Heat treatment equipment |
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| CN1737478A true CN1737478A (en) | 2006-02-22 |
| CN100573011C CN100573011C (en) | 2009-12-23 |
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| CNB2005100807280A Expired - Fee Related CN100573011C (en) | 2004-06-30 | 2005-06-30 | Heat treatment device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006017357A (en) |
| KR (1) | KR101184570B1 (en) |
| CN (1) | CN100573011C (en) |
| TW (1) | TWI275762B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101324404B (en) * | 2007-06-12 | 2011-12-07 | 爱斯佩克株式会社 | Heat processing device |
| CN101173840B (en) * | 2006-09-13 | 2012-06-27 | 爱斯佩克株式会社 | Heat treatment apparatus |
| CN115143779A (en) * | 2021-03-31 | 2022-10-04 | 株式会社村田制作所 | Heat treatment system |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5107528B2 (en) * | 2006-04-24 | 2012-12-26 | 光洋サーモシステム株式会社 | Exhaust gas treatment unit |
| JP4291832B2 (en) * | 2006-06-23 | 2009-07-08 | 株式会社フューチャービジョン | Air supply and exhaust system for substrate firing furnace |
| JP4372806B2 (en) * | 2006-07-13 | 2009-11-25 | エスペック株式会社 | Heat treatment equipment |
| WO2008038880A1 (en) * | 2006-09-28 | 2008-04-03 | Korea Pionics Co., Ltd. | Annealing apparatus |
| JP5015541B2 (en) * | 2006-10-07 | 2012-08-29 | 昭和鉄工株式会社 | Heat treatment equipment |
| JP4630307B2 (en) * | 2007-05-22 | 2011-02-09 | エスペック株式会社 | Heat treatment equipment |
| JP2009047351A (en) * | 2007-08-20 | 2009-03-05 | Tohoku Univ | Circulating substrate firing furnace |
| TW200934574A (en) * | 2008-01-11 | 2009-08-16 | Nikki Universal Co Ltd | Catalyst for purifying discharge gas from heat-treatment furnace, method of purifying discharge gas from heat-treatment furnace with the catalyst, and method of preventing contamination of heat-treatment furnace |
| JP4331784B2 (en) * | 2008-07-22 | 2009-09-16 | 株式会社フューチャービジョン | Supply and exhaust method for substrate firing furnace |
| JP6855687B2 (en) * | 2015-07-29 | 2021-04-07 | 東京エレクトロン株式会社 | Substrate processing equipment, substrate processing method, maintenance method of substrate processing equipment, and storage medium |
| US20170032983A1 (en) * | 2015-07-29 | 2017-02-02 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, maintenance method of substrate processing apparatus, and storage medium |
| KR102831412B1 (en) | 2021-03-29 | 2025-07-09 | 삼성디스플레이 주식회사 | Display device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174464A (en) * | 1985-01-23 | 1986-08-06 | 京都機械株式会社 | Apparatus for heat treatment of fabric |
| JPS6399492A (en) * | 1986-10-14 | 1988-04-30 | 株式会社村田製作所 | Exhaust gas treatment equipment |
| JPH087656Y2 (en) * | 1989-08-15 | 1996-03-04 | 千住金属工業株式会社 | Reflow furnace |
| US5282880A (en) * | 1992-09-15 | 1994-02-01 | Olson Larry K | Low pressure plasma metal extraction |
| JPH11159965A (en) | 1997-11-27 | 1999-06-15 | Murata Mfg Co Ltd | Heat treatment furnace |
| JPH11197517A (en) * | 1998-01-08 | 1999-07-27 | Honda Motor Co Ltd | Metal carrier for catalyst |
| JP3696505B2 (en) * | 2000-12-15 | 2005-09-21 | 光洋サーモシステム株式会社 | Heat treatment apparatus and heat treatment method |
| JP2003214772A (en) * | 2002-01-21 | 2003-07-30 | Ngk Insulators Ltd | Heating furnace |
| JP2003247706A (en) * | 2002-02-26 | 2003-09-05 | Japan Steel Works Ltd:The | Method and apparatus for burning organic waste |
-
2004
- 2004-06-30 JP JP2004194242A patent/JP2006017357A/en active Pending
-
2005
- 2005-06-20 TW TW094120473A patent/TWI275762B/en not_active IP Right Cessation
- 2005-06-28 KR KR1020050056236A patent/KR101184570B1/en not_active Expired - Fee Related
- 2005-06-30 CN CNB2005100807280A patent/CN100573011C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173840B (en) * | 2006-09-13 | 2012-06-27 | 爱斯佩克株式会社 | Heat treatment apparatus |
| CN101324404B (en) * | 2007-06-12 | 2011-12-07 | 爱斯佩克株式会社 | Heat processing device |
| CN115143779A (en) * | 2021-03-31 | 2022-10-04 | 株式会社村田制作所 | Heat treatment system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006017357A (en) | 2006-01-19 |
| TWI275762B (en) | 2007-03-11 |
| TW200604479A (en) | 2006-02-01 |
| KR101184570B1 (en) | 2012-09-21 |
| KR20060048613A (en) | 2006-05-18 |
| CN100573011C (en) | 2009-12-23 |
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Granted publication date: 20091223 Termination date: 20170630 |