CN1717760B - Method and apparatus for ribbon wound terminal wires - Google Patents

Abstract

A method of taping tab terminals, comprising the steps of supplying, by conveying, the tab terminals to a magnetic parts feeder, supplying the conveyed tab terminals to a pickup drum having small magnets at the bottoms of the holding grooves thereof and holding the tab terminals in the holding grooves, correcting the positions of the held tab terminals so that the directions of the rolled parts thereof are positioned parallel with the outer peripheral tangential line of the pickup drum, transferring the held tab terminals to the holding grooves of a taping drum, supplying an adhesive tape between a tape pressing roll in slidable contact with the taping drum and the taping drum and fixedly sticking the tab terminals held on the taping drum on the adhesive tape while pressing the tab terminals by the pressing roll, supplying a transparent tape to the sticking surface side of the adhesive tape on which the tab terminals are fixed and covering the adhesive tape with the transparent tape, and winding up the covered adhesive tape.

Description

Method and apparatus for ribbon wound terminal wires

technical field

The present invention relates to a method and apparatus for tape-wound rod-shaped solder tab wires for electrolytic capacitors and the like, and having directionality.

Background technique

Solder tab wires for diodes, electrolytic capacitors and the like comprising a lead portion comprising iron wire (chemically pure metal wire (CP wire)) with copper plating on which a stamped portion Also plated with tin or solder, the stamped part is prepared by flattening an aluminum wire rod. In preparing an electrolytic capacitor by winding an aluminum foil around a directional rod-shaped tab lead tape, a method is adopted in which the tab leads are arranged and bonded to the tape, which is wound into a roll, the The coil is loaded on the automatic insertion machine or the automatic manufacturing machine, and the tab lead-out wire is supplied to the automatic insertion machine or the automatic manufacturing machine while unwinding the coil.

In order to arrange the directional stem lead wires on the tape in a given direction, an alignment method using vibration is used. When the vibration is used, the direction of the lug lead-out wire body can be aligned. However, if the position of the end of the lead portion and the direction of the punched portion are not aligned when bonding the terminal wire to the tape, the lead portion sometimes protrudes from the adhesive tape, or the terminal wire sometimes ends without the punched portion. The state positioned in the given direction is wrapped around. When a coil like this is received in a packing box, problems arise, for example, that the protruding lead wire portion is hooked into the box and thus undesirably bent.

In addition, when the coil in this state is loaded into the automatic insertion machine, the terminal wire is in contact with the guide or the like of the automatic insertion machine at its lead portion or body portion, thereby disadvantageously causing the terminal wire to deformation, which in turn leads to a reduction in product yield.

Furthermore, in the above-mentioned tape winding method, at a time, several tens to several hundreds of tab wires or the like are supplied and arranged in the vibrating apparatus for tape winding. However, the supplied tens to hundreds of tab wires move in a complicated manner within the vibrating device and are supplied in a random manner. Thus, for example, batch control of tape-wound tab wires becomes difficult, disadvantageously causing quality control problems. If the tape winding can be performed in the order in which the tab wires are supplied, defects and the like can be easily eliminated.

In addition, in recent years, demands for downsizing of electrolytic capacitors and the like have led to the use of tab leads with flattened punched portions. The direction of the offset should also be considered when taking the leadout around the offset lug.

Contents of the invention

The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a method and apparatus for tape-wound electronic components which can be neatly wound even when a large number of solder tab leads are supplied. Arranged at equal intervals, and supplied to the adhesive tape in this state, in addition, even if the tab lead-out wire with the punched part is provided in an offset state, the tab lead-out wire can make the offset direction uniform state supplied onto pressure sensitive adhesive tape.

The above object can be achieved by a method for wiring each of the tabs with a punched portion such that the tabs are arranged at equal intervals and the punched portions are oriented in a predetermined direction. The method is wound around, and the method includes the steps of:

supplying the solder tab wires stored in a predetermined box to a magnetic part feeder so that the solder tab wires are arranged at predetermined intervals and conveying the solder tab wires one by one;

feeding the transferred lead-out wires one by one to a pick-up roller, the pick-up roller includes a roller with retaining grooves equidistantly arranged on its outer circumference and small magnets buried at the bottom of the retaining grooves, and retaining the solder tab leads in the corresponding retaining grooves;

correcting the position of the lug lead held in the pick-up drum so that the direction of the stamped part in the pick-up drum is parallel to the tangent line of the outer circumference of the pick-up drum, wherein by setting in the pick-up drum The guide plate on the side of the roller and the rotating brush arranged in sliding contact with the guide plate to perform the correction of the position of the lead-out line of the solder tab;

The tab wires held in the pick-up drum are conveyed one by one into holding grooves in a take-up drum comprising holding grooves arranged at equal intervals on the outer circumference of the drum. groove;

The pressure-sensitive adhesive tape is fed to a position between a tape pressure roller provided in sliding contact with the take-up drum and the take-up drum so that the tape held on the take-up drum The lead-out wire of the solder tab is bonded and fixed on the pressure-sensitive adhesive tape, and is pressed against the pressure roller at the same time;

feeding a transparent tape onto the adhesive surface side of the pressure-sensitive adhesive tape on which the tab lead-out has been fixed, for covering the pressure-sensitive adhesive tape; and

Tape around the covered pressure sensitive adhesive tape.

According to the tape winding method of the present invention, even if a large number of tab wires are fed, the tab wires can be neatly arranged at equal intervals and supplied onto the adhesive tape, and furthermore, even in the punched portion of the tab wires In the case of being in a shifted state, the tab lead wire can be supplied to the pressure-sensitive adhesive tape in a state where the shifting direction is uniform.

The present invention also provides an apparatus for winding tab wires each having a punched portion in such a manner that the tab wires are arranged at equal intervals and the punched portions are arranged along a predetermined Direction Orientation, the device includes:

The box body is used to accommodate the lead wires of the solder tabs;

a conveying device for conveying the solder tab lead-out wires stored in the box;

a magnetic parts feeder having an inlet side for receiving lug leads from said conveying device and an outlet side for sending out lug leads, and being provided with a conveying channel for conveying solder lug leads separated by a side wall, A pair of magnets are arranged outside the side wall for forming a magnetic field passing through the transfer channel, thereby arranging the solder tab leads at predetermined intervals by the action of the formed magnetic field and transferring the solder tab leads one by one;

A pick-up roller, which is arranged on the exit side of the magnetic parts feeder, and includes a roller, holding grooves are arranged at equal intervals on the outer circumference of the roller, and magnets are buried at the bottom of the holding grooves, through which the picking-up The rotation of the drum and the magnets pick up and hold the tab leads in the holding grooves;

A correcting device, comprising a guide plate arranged on the side of the pick-up roller and a rotating brush arranged in sliding contact with the guide plate, for correcting the position of the lead-out wire of the solder tab held in the pick-up roller so that all The direction of the stamping part of the lead-out line of the solder piece is parallel to the tangent line of the outer circumference of the picking drum;

The take-up drum is arranged opposite to the pickup roller, and retaining grooves are arranged at equal intervals on its outer circumference;

a changeover switch, arranged between the pick-up drum and the take-up drum, for transferring the solder lug leads held in the pick-up drum to the holding groove of the take-up drum one by one;

a tape pressing roller provided in sliding contact with the tape drum for bonding and fixing the tab lead-out wire held on the tape drum while being pressed against the tape drum on the pressure sensitive adhesive tape passing between said tape pressure roller and take-up drum;

means for feeding a transparent tape onto the adhesive surface side of the pressure-sensitive adhesive tape to which the tab lead has been fixed so as to cover the pressure-sensitive adhesive tape; and

Means for tape around said covered pressure sensitive adhesive tape.

Description of drawings

1 is a plan view showing a magnetic parts feeder and a pickup roller used in one embodiment of the present invention;

Figure 2 is an enlarged view of the circumference of the pick-up drum;

Fig. 3 is a side view of a solder tab lead-out wire used in a conventional electrolytic capacitor;

Figure 4 is a side view of a tab leadout with an offset stamped portion;

FIG. 5 is a diagram showing a step of correcting the direction of the punched portion of the tab lead-out in one embodiment of the present invention; and

Fig. 6 is a schematic view showing a series of steps from the step of supplying the tab lead to the step of winding the tape in one embodiment of the present invention.

Detailed ways

Hereinafter, the tape winding method and apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

The tape winding method according to the present invention mainly includes the steps of feeding the tab leads, correcting the orientation of the stamped portion, bonding the tape, and winding the tape. Each step will be described in detail below.

1. Steps for supplying solder tab leads

In general, at the time of tape winding, the tab wires are supplied to a component feeder in a state where a plurality (tens to hundreds) of tab wires are placed in a predetermined box. The shape of the storage box for the solder tab wires is not particularly limited, and may be a cylindrical box in which a predetermined number of solder tab wires are held in a vertical state with the front end of the lead portion of the solder tab wires facing downward; or It is a rectangular box in which a predetermined number of solder tab leads are held in a state of being arranged laterally.

The solder tab wires placed in predetermined boxes are loosened to some extent into a plurality of piles each consisting of several solder tab wires when fed to suitable vibrating conveying equipment or the like (not shown).

In this state, the tab lead wire is conveyed to the magnetic parts feeder. Fig. 1 is a plan view showing a magnetic parts feeder and a pickup roller. The magnetic parts feeder 2 is provided with a conveying channel separated by left and right parallel side walls 3 while leaving a space corresponding to the length of the tab lead-out wire 1 . A pair of magnets 4 (N pole and S pole) are disposed on both outer sides of the side wall 3 so as to face each other, thereby forming a magnetic field passing through the conveying passage. The space between the pair of magnets 4 is wide on the inlet side and decreases toward the outlet side. Therefore, the magnetic field strength increases toward the exit side of the parts feeder.

When the solder lug lead-out wire 1 is transported to the conveying channel, due to the action of the magnetic field, the solder lug lead-out wire is arranged in such a way that the front end 1a of the lead wire part is pulled onto one of the side walls, while the punched part 1b is drawn towards the other side wall. Sidewall orientation. Then, when the magnetic parts feeder 2 vibrates slightly leftward and rightward, the tab lead-out wire 1 is automatically conveyed toward the outlet side under the action of the magnetic field whose strength gradually increases toward the outlet side of the channel. In addition, the vibration of the magnetic part feeder enables the delivery of the tab leads one by one in a very orderly state.

The magnetic part feeder may be vibrated, eg by suitable vibrating equipment (not shown).

2. The step of feeding the lead-out wire to the pick-up roller and holding it in its holding groove

The solder tab leads are continuously held by the pick-up roller on the exit side of the magnetic part feeder. As shown in FIG. 2, the pick-up drum 5 has a structure in which a plurality of retaining grooves 6 are arranged at equal intervals on the outer circumference of the drum, and rod-shaped small-sized magnets 7 are embedded in the drum at equal intervals. down the outer circumference so as to face the respective retaining groove. Keep the groove 6 in an R shape (semicircle), so that the width of the groove is slightly larger than the wire diameter of the lead part of the lead-out wire of the solder tab.

As shown in FIG. 1 , the pick-up roller 5 rotates stepwise at a given angular speed so that the solder lug lead-out wires 1 are continuously fitted into the retaining groove 6 of the pick-up roller 5 from the exit of the magnetic parts feeder 2 . The lead portion 1 a of the tab lead wire is held by the action of a small magnet 7 provided at the bottom of the holding groove 6 . As shown in FIG. 1, the tab lead-out wire 1 is definitely inserted into the retaining groove by arranging the pickup roller 5 near the exit side of the magnetic part feeder 2 so as to protrude into the exit side of the magnetic part feeder 2. .

3. Procedure for correcting the direction of the punched part in the lead-out line of the solder lug

The solder tab wire supplied here can be not only a conventionally shaped solder tab wire as shown in FIG. 3, but also a solder tab wire for a small electrolytic capacitor as shown in FIG. The position is offset in one direction. The offset tab leads will be bonded to the pressure sensitive adhesive tape so that the stamped portion can be oriented in a predetermined direction as the tape is wound.

In the tape winding method according to the present invention, as shown in FIG. 5, through the guide plate provided on the side of the pick-up drum 5, each punching part of the solder tab lead wire held in the holding groove is moved along the direction of the figure in one pass. The direction 1c or direction 1d shown in 5 is arranged. The punched portions of each tab lead line arranged in a predetermined direction are corrected by the rotating brush 9 provided in sliding contact with the guide plate 8 so that the punched portions are positioned in one direction (direction 1d in FIG. 5). The rotating brush 9 rotates in the opposite direction to the rotating direction of the pick-up cylinder 5 , and the punched parts oriented in the direction 1 c are swept by the rotating brush 9 . Due to the action of the rotating brush, the lug lead-out wire is rotated in the retaining groove, so that the orientation of the stamped part along the direction 1c is corrected to be oriented along the direction 1d. In this case, it is preferable that, as shown in FIG. 5 , the rotating brush is arranged with a small distance from the guide plate to ensure that the brush reaches the stamped part of the lead-out wire of the solder tab. In this way, when the stamped portion of each tab is arranged in a given direction, even in the case of a tab having an offset stamped portion, the tab can be positioned in such a way that each tab The punched portion is wound in a state of being oriented in a predetermined direction.

4. Steps of bonding the tape

As shown in FIG. 6, the lead-out wires held in the pick-up drum are transferred one by one to the corresponding holding grooves of the take-up drum 11 through the switch 10, and the take-up drum is included on the outer circumference of the roller. Holding grooves arranged at equal intervals. In the tape drum 11, like the pick-up roller, many retaining grooves are provided at equal intervals on the outer circumference of the drum, and rod-shaped small-sized magnets are embedded at the outer circumference of the drum at equal intervals so as to face Keep the groove.

The take-up drum 11 is constructed such that it rotates in steps at a given angular velocity in the opposite direction to the pick-up drum 5 . The changeover switch 10 provided between the pick-up drum 5 and the take-up drum 11 swings vertically in synchronization with the step rotation of the pick-up drum 5, whereby the tab lead-out wire 1 is moved out of the holding groove of the pick-up drum 5 and conveyed into the retaining groove of the take-up drum 11. Each of the rotational angular velocity of the pick-up drum and the rotational angular velocity of the take-up drum is adjusted so that the transfer position is toward each holding groove. In order to surely transfer the lead-out wires of the solder tabs to the take-up drum, as shown in FIG. 6 , guide plates 12 are provided on both sides of the take-up drum 11 . With the help of the guide plate, when the lead-out wire of the solder lug is transferred to the take-up drum, the lead-out wire of the solder lug can be firmly kept on the take-up drum of the lead-out wire of the solder lug, without causing the lead-out wire of the solder Keep out of the groove. In addition, from the viewpoint of reducing delivery errors of the lead-out wires, a V-shaped groove (not shown) may be provided on the outer circumference of the guide plate 12 .

Next, the pressure-sensitive adhesive tape 14a is fed to a position between the tape pressure roller 13 provided in sliding contact with the tape drum 11 and the tape drum 11 so as to be held on the tape drum 11. The lead-out wire 1 of the solder tab on 11 is glued and fixed on the pressure-sensitive adhesive tape 14a, and the lead-out wire 1 of the solder tab is pressed by the pressing roller 13 at the same time. Specifically, by the rotation of the tape drum 11, the lead-out wire 1 delivered to the tape drum 11 is transported to the position of the tape pressure roller 13 provided in sliding contact with the tape drum 11. The lead-out wire 1 is pressed to the top of the pressure-sensitive adhesive tape 14a by the pressure roller 13, so that the lead-out wire 1 is bonded and fixed to the pressure-sensitive adhesive tape 14a.

5. Steps of winding the adhesive tape

Next, a transparent tape 14b is fed onto the adhesive surface side of the pressure-sensitive adhesive tape on which the tab lead wire has been fixed, so as to cover the pressure-sensitive adhesive tape 14a. Thus, by covering the top of the pressure-sensitive adhesive tape 14a with the transparent tape 14b, the tab lead-out 1 is wrapped in the pressure-sensitive adhesive tape and the transparent tape. The protective tape 15 is fed to the underside of the pressure-sensitive adhesive tape 14 wrapped with the tab lead wire, so that the pressure-sensitive adhesive tape 14 is wound around the winding tape drum together with the protective tape 15 .

Although one embodiment of the tape winding method according to the present invention has been described above, the present invention is not limited to this embodiment. Furthermore, without explaining the tape winding method according to the present invention, a detector or the like may be provided in the vicinity of the pick-up drum or the take-up drum to detect defective products. In addition, the detector can be interlocked with the operation of pick-up rollers etc. for automatic operation.

Claims (4)

1. A method for winding tab leads each having a punched portion in such a manner that the tabs are arranged at equal intervals and the punched portions are oriented in a predetermined direction , the method includes the steps of: supplying the solder tab wires stored in a predetermined box to a magnetic parts feeder so as to arrange the solder tab wires at predetermined intervals and convey the solder tab wires one by one; The conveyed lead-out wires are supplied one by one to a pick-up roller comprising a roller, the roller is provided with holding grooves at equal intervals on its outer circumference and small a magnet for retaining the tab leads in the corresponding retaining grooves; correcting the position of the tab wire held in the pick-up drum so that the direction of the punched portion of the solder tab wire is parallel to the tangent line of the outer circumference of the pick-up drum, wherein The guide plate on the side and the rotating brush arranged in sliding contact with the guide plate to perform the correction of the position of the lead-out line of the solder tab; conveying the tab lead-out wires held in the pick-up drum one by one into holding grooves in a take-up drum including holding grooves arranged at equal intervals on the outer circumference of a drum; The pressure-sensitive adhesive tape is fed to a position between a tape pressure roller provided in sliding contact with the take-up drum and the take-up drum, whereby the solder held on the take-up drum The lead-out line of the sheet is bonded and fixed to the pressure-sensitive adhesive tape while being pressed with the pressing roller; feeding a transparent tape onto the adhesive surface side of the pressure-sensitive adhesive tape to which the tab lead has been fixed, for covering the pressure-sensitive adhesive tape; and Tape around the covered pressure sensitive adhesive tape. 2. The method according to claim 1, characterized in that, in the magnetic part feeder, the conveying channel for the solder tab lead-out wire is separated by parallel left and right side walls, and the magnetic field passes through the The way of the transmission channel is applied on the transmission channel and further increases the magnetic field, so that the magnetic field strength on the exit side of the transmission channel is greater than the magnetic field intensity on the entrance side of the transmission channel. 3. An apparatus for winding tab leads each having a punched portion in such a manner that the tabs are arranged at equal intervals and the punched portions are oriented in a predetermined direction , the equipment includes: The box body is used to accommodate the lead wires of the solder tabs; a conveying device for conveying the solder tab lead-out wires stored in the box; a magnetic parts feeder having an inlet side for receiving lug leads from said conveying device and an outlet side for sending out lug leads, and being provided with a conveying channel for conveying solder lug leads separated by a side wall, A pair of magnets are arranged outside the side wall for forming a magnetic field passing through the transfer channel, thereby arranging the solder tab leads at predetermined intervals by the action of the formed magnetic field and transferring the solder tab leads one by one; A pick-up roller, which is arranged on the exit side of the magnetic parts feeder, and includes a roller, holding grooves are arranged at equal intervals on the outer circumference of the roller, and magnets are buried at the bottom of the holding grooves, through which the picking-up The rotation of the drum and the magnets pick up and hold the tab leads in the holding grooves; A correcting device, comprising a guide plate arranged on the side of the pick-up roller and a rotating brush arranged in sliding contact with the guide plate, for correcting the position of the lead-out wire of the solder tab held in the pick-up roller so that all The direction of the stamping part of the lead-out line of the solder piece is parallel to the tangent line of the outer circumference of the picking drum; The take-up drum is arranged opposite to the pickup roller, and retaining grooves are arranged at equal intervals on its outer circumference; a changeover switch, arranged between the pick-up drum and the take-up drum, for transferring the solder lug leads held in the pick-up drum to the holding groove of the take-up drum one by one; a tape pressing roller provided in sliding contact with the tape drum for bonding and fixing the tab lead-out wire held on the tape drum while being pressed against the tape drum on the pressure sensitive adhesive tape passing between said tape pressure roller and take-up drum; means for feeding a transparent tape onto the adhesive surface side of the pressure-sensitive adhesive tape to which the tab lead has been fixed so as to cover the pressure-sensitive adhesive tape; and Means for tape around said covered pressure sensitive adhesive tape. 4. The apparatus for tape-wound solder tab lead-out wires as claimed in claim 3, characterized in that, in the magnetic component feeder, the magnetic field is further increased so that the magnetic field intensity at the exit side of the conveying channel is greater than The magnetic field strength on the entrance side of the channel.

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