CN1711817B - Electronic component mounting apparatus and method - Google Patents

Abstract

An electronic parts mounting apparatus which holds an electronic part with a mounting head, photographs the electronic part by a line camera 11, processes an image of the electronic part photographed by the line camera to recognize a position of the electronic part by using a recognition unit 16, positions the electronic part to a substrate in accordance with the position recognition result, and mounts the electronic part on the substrate. Offset values which are pre-stored for each recognition system associated with its own light source, a light source for transmission illumination 15a or a light source for reflection illumination 15b, are used for offset values used when a position correction is made, at the time of positioning, based on the position recognition result. Even in the electronic parts mounting apparatus of the type in which the plural recognition systems are selectively operated, the position recognition result difference caused by the use of another type of the illumination method is corrected to secure a necessary part mounting accuracy.

Description

Electronic component mounting apparatus and method

technical field

The present invention relates to an electronic component mounting apparatus and method for holding an electronic component with a nozzle, transferring the electronic component thus held onto a substrate, and mounting the electronic component on the substrate.

Background technique

In such an apparatus for mounting electronic components on a substrate, a technique of correcting the mounting position of the electronic component by using image recognition processing is widely used to improve the accuracy of the mounting position of the electronic component on the substrate. In this technique, a transfer head picks up an electronic component from a component supply section, holds the electronic component with a nozzle, and then moves along a path to a substrate. The camera photographs the electronic components held by the head. The captured image of the electronic component is processed for detecting deflection of the electronic component. When the electronic component is positioned on the substrate, the offset of the electronic component is corrected, so that the electronic component is precisely mounted in its correct position.

Techniques for using cameras to identify the location of electronic components are well known. Among the first techniques is that the underside of the electronic component is illuminated with light from below, and the camera receives the light reflected from the electronic component to take an image of the electronic component. The images thus obtained are used for position recognition. Another technique is transmitted illumination technique. In this technique, a reflector is used, which is located behind the electronic components. The illuminating light is projected onto the reflective plate. The camera receives the light reflected from the reflector. The captured images are used for location recognition. Another known technique uses two different recognition systems, each of which is applied to its own object that needs to be recognized, and is selectively used depending on the currently recognized object. These systems are installed in an electronic component mounting apparatus (see, for example, JP-A-08-153997 <Japanese Patent Application Laid-Open No. Hei 08-153997.>). Electronic component mounting equipment currently in use includes different light sources. A light source is selected from among those light sources based on the shape, size and surface properties of the identified electronic component. Thus, multiple identification systems can be selectively used.

In such an electronic component mounting apparatus that selectively uses a plurality of identification systems, the accuracy of mounting positions sometimes varies due to the characteristics of the identification systems. More specifically, when electronic components in the same state are photographed by the same camera, the position recognition results of electronic component images captured by transmitted illumination are sometimes different from those of electronic component images captured by reflected illumination.

The difference in the recognition result is caused by different factors: for example, between a transillumination system (in which the outline of the electronic component is displayed as an image) and a reflective illumination system (in which the shape of the underside of the electronic component is displayed as an image) The difference between them, as well as the diffraction of illuminating light in transmitted illumination, etc. Therefore, when a component mounting operation is performed by selecting a recognition system according to a recognized object in such an electronic component mounting apparatus that selectively uses a plurality of recognition systems, the difference in position recognition results as described causes component mounting Variation in precision.

Contents of the invention

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electronic component mounting apparatus and method which ensure satisfactory accuracy of component mounting even in such electronic component mounting apparatus which selectively uses a plurality of identification systems.

The present invention provides an electronic component mounting apparatus for holding an electronic component using a nozzle, transferring the electronic component onto a substrate, and mounting the electronic component on the substrate, the electronic component mounting apparatus comprising:

a mounting head comprising said nozzle;

a head moving device for moving the mounting head relative to the substrate;

an illumination device for illuminating the electronic component with a light source selected from a plurality of different light sources when the electronic component held by the nozzle is photographed;

an identification device disposed on the moving path of the mounting head for taking a picture and identifying the electronic component illuminated by a light source selected from the plurality of different light sources;

a control unit for controlling said head moving device to perform a component mounting operation in which positioning and mounting of electronic components on said substrate is performed, and

An offset memory for storing an offset used for each of the plurality of different light sources when performing position correction in positioning according to the identification result of the identification device.

Preferably, the lighting device includes:

a light source for trans-illumination in which the outline of the electronic component is displayed as an image, and

A light source for reflected illumination in which the underside profile of an electronic component is displayed as an image.

Preferably, an installation data memory for storing distinction data indicating a light source for illuminating the individual electronic components selected from one of a light source for transillumination and a light source for reflective illumination is further included.

Preferably, it further includes an illumination selector, which selects a light source for transmission illumination or a light source for reflection illumination according to the difference data in the installation data memory.

Preferably, the offset storage includes:

an offset memory for diascopic identification, which is used to store offsets used by light sources for diascopic illumination, and

An offset memory for identification of reflected lighting, which is used to store the offset used for the light source of reflected lighting.

The present invention provides an electronic component mounting apparatus for holding an electronic component using a nozzle, transferring the electronic component onto a substrate, and mounting the electronic component on the substrate, the electronic component mounting apparatus comprising:

a mounting head including a nozzle;

a head moving device for moving the mounting head relative to the substrate;

an illumination device for illuminating the electronic component with a light source selected from a plurality of different light sources when taking a picture of the electronic component held by the nozzle;

an identification device disposed on the moving path of the mounting head for taking a picture and identifying the electronic component illuminated by a light source selected from the plurality of different light sources;

a control device for controlling said head moving device to perform a component mounting operation in which positioning and mounting of electronic components on said substrate is performed, and

An offset storage device for storing an offset used for each of the plurality of different light sources when performing position correction in positioning according to the recognition result of the recognition device.

Preferably, the lighting device includes:

a light source for trans-illumination in which the outline of the electronic component is displayed as an image, and

A light source for reflected illumination in which the underside profile of an electronic component is displayed as an image.

Preferably, an installation data memory for storing discrimination data indicating a light source for illuminating the individual electronic components selected from a light source for transillumination and a light source for reflective illumination is further included therein.

Preferably, it further includes an illumination selector, which selects the light source for the transmission illumination or the light source for the reflection illumination according to the difference data in the installation data memory.

Preferably, the offset storage device includes:

an offset memory for diascopic identification, which is used to store offsets used by light sources for diascopic illumination, and

An offset memory for specular lighting identification, which is used to store the offset used by the light source of the specular lighting.

The present invention provides an electronic component mounting method for holding an electronic component using a nozzle, transferring the electronic component to a substrate, and mounting the electronic component on the substrate, comprising the following steps:

moving a mounting head holding electronic components relative to said substrate;

photographing and identifying the electronic components held by the nozzle by an identification device on the moving path of the mounting head;

When photographing the electronic component in the photographing and identifying step, illuminating the electronic component with a light source selected from a plurality of light sources of the lighting device; and

positioning an electronic component held by the mounting head on the substrate, and mounting the electronic component on the substrate;

Wherein, for the light source selected from the plurality of light sources, the corresponding offset is used when performing position correction according to the recognition result of the recognition device during positioning.

According to an aspect of the present invention, there is provided an electronic component mounting apparatus that holds an electronic component using a nozzle, transfers the held electronic component to a substrate and mounts the electronic component on the substrate, the electronic component mounting apparatus It includes: a mounting head including the nozzle; a head moving device for moving the mounting head relative to the substrate; an image recognition device, which is arranged on the moving path of the mounting head for taking pictures and identifying the nozzle An electronic component held by the mouth; an illumination system for illuminating the electronic component by a light source selected from a plurality of different light sources when photographing the electronic component; a control unit for controlling the head moving device for component mounting Operation, wherein the positioning and installation of the electronic components on the substrate are operated; and an offset memory is used to store the position correction for each identification system corresponding to its own light source when the position is corrected according to the identification result of the identification device in the positioning. The offset to use.

According to another aspect of the present invention, there is provided an electronic component mounting method, which uses a nozzle to hold an electronic component, transfers the held electronic component to a substrate and mounts the electronic component on the substrate, the electronic component is mounted The method includes the steps of: moving the mounting head holding the electronic component by the nozzle relative to the substrate; taking pictures and identifying the electronic component held by the nozzle through a recognition device on the moving path of the mounting head; in the step of photographing and identifying, when When photographing an electronic component, illuminating the electronic component through an illumination device with multiple light sources; and positioning the electronic component held by the mounting head on the substrate, and mounting the electronic component on the substrate; wherein, for Corresponding to each identification system with its own light source, the offset used when performing positioning correction based on the identification result of the identification system during positioning is used.

According to the present invention, the offset amount stored in advance for each identification system combined with its own light source is used as the offset amount used when performing position correction based on the identification result of the identification unit during positioning. Even in such an electronic component mounting apparatus that selectively uses a plurality of recognition systems, differences in position recognition results caused by use of other types of lighting methods are corrected to ensure necessary component mounting accuracy.

Description of drawings

Fig. 1 is a plan view showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a transfer head unit of the electronic component mounting apparatus in FIG. 1. FIG.

FIG. 3 is an explanatory view showing an image recognition device used in the electronic component mounting apparatus of FIG. 1 .

4A and 4B are explanatory views explaining component recognition processing in the electronic component mounting apparatus of FIG. 1 .

FIG. 5 is a block diagram showing a control system of the electronic component mounting apparatus of FIG. 1 .

FIG. 6 is a flowchart showing the flow of an electronic component mounting process performed by the electronic component mounting apparatus of FIG. 1 .

It should be noted that in the drawings, reference numeral 3 denotes a substrate, 8 is a transfer head unit, 8a is a transfer head unit, 11 is a line camera, 14 is a suction nozzle, 15 is an illumination unit, 15a is a transmission illumination light source, and 15b is a reflection illumination Light source, 16 is identification unit, 17 is illumination selector, 23 is mounting position offset memory, 24 is offset memory for transmitted illumination identification and 25 is offset memory for reflected illumination identification.

Detailed ways

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Fig. 1 is a plan view showing an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a schematic view showing a transfer head unit of the electronic component mounting apparatus in FIG. 1. FIG. FIG. 3 is an explanatory view showing an image recognition device used in the electronic component mounting apparatus of FIG. 1 . 4A and 4B are explanatory views explaining component recognition processing in the electronic component mounting apparatus of FIG. 1 . FIG. 5 is a block diagram showing a control system of the electronic component mounting apparatus of FIG. 1 . FIG. 6 is a flowchart showing the flow of an electronic component mounting process performed by the electronic component mounting apparatus of FIG. 1 .

The structure of the electronic component mounting apparatus will be described with reference to FIG. 1 . In FIG. 1 , a transport path 2 is located at the central portion of the base 1 along the X direction. This transport path 2 guides the movement of the substrate 3 and positions the substrate 3 at a position where electronic components are mounted on the substrate 3 . Component supply sections 4 are located on both sides of the transport path 2 . Each component supply section 4 includes a plurality of tape feeding devices 5 arranged side by side. Each tape feeder 5 includes electronic components held by the tape. The tape is progressively fed to supply the electronic components.

Y-axis stages 6A and 6B are located on both sides of the surface of the base 1 , and X-axis stages 7A and 7B are provided on and bridge the Y-axis stages 6A and 6B. When the Y-axis stage 6A is driven, the X-axis stage 7A moves horizontally. When the Y-axis stage 6B is driven, the X-axis stage 7B moves horizontally in the Y direction. The X-axis stages 7A and 7B are each mounted with a combination of a transfer head unit 8 and a camera 9 that moves together with the transfer head unit 8 .

When the Y-axis platforms 6A and 6B, and the X-axis platforms 7A and 7B are properly combined and driven, the transfer head unit 8 moves in the horizontal direction and picks up electrons from the suction nozzles on the respective component supply sections 4. Components, the electronic components are mounted on the substrate located on the transport path 2. The camera 9 moves onto the substrate 3 and takes pictures of the substrate 3 . The Y-axis stages 6A and 6B, and the X-axis stages 7A and 7B constitute a transfer device which is a head moving device for moving the transfer head unit 8 relative to the substrate 3 .

A line camera 11 and a nozzle stocker 12 are located along the moving path of the transfer head unit 8 from the component supply section 4 to the substrate 3 on the transport path 2 . The line camera constitutes an identification device for identifying electronic components, as will be described below. The linear camera 22 photographs the electronic components held by the transfer head unit 8 from the lower side. The nozzle stocker 12 includes different types of nozzles suitable for different types of electronic components to be sucked. In order to replace the suction nozzle with a new one, the transfer head unit 8 accesses this nozzle magazine 12 .

The transfer head unit 8 will be described with reference to FIG. 2 . As shown in the figure, the transfer head unit 8 has various types, and includes a plurality of suction heads 8a (mounding heads) for holding electronic components. The suction head 8 a moves together with the camera 9 . The suction heads 8a are respectively provided on the suction nozzles 14 for suction-holding the electronic components.

The suction nozzles 14 are respectively detachably coupled to the nozzle holders 10 of the suction head 8a, and can be selectively used according to the type of electronic components mounted. When the suction nozzles 14 are respectively driven by the Z-axis motor 8b connected to the suction head 8a, they are independently movable in the vertical direction. In addition, the suction nozzle 14 is rotatable around the θ axis when it is driven by a general θ axis motor 13 .

The arrangement of the image recognition device incorporated into this electronic component mounting apparatus will be described with reference to FIG. 3 . The image recognition device is a recognition device that photographs the electronic component P held by the suction nozzle 14 from the lower side and recognizes the position of the electronic component P. The image recognition device is composed of a linear camera 11 used as a photographing device and a recognition unit 16 for recognizing and processing the photographed results of the linear camera. The lighting unit 15 is disposed around the optical system of the line camera 11 . The lighting unit 15 illuminates the electronic component P from the lower side so that the electronic component P is photographed by the line camera 11 . The lighting unit 15 includes two types of light sources, a light source 15a for transmission illumination and a light source 15b for reflection illumination.

The light source 15a for transillumination and the light source 15b for reflective illumination each consist of an annular array with a plurality of light emitting diodes. An illumination selector 17 selects the light source 15a for transillumination or the light source 15b for reflective illumination. By controlling the operation of the lighting selector 17, the illuminated object located on the lighting unit 15 is selectively illuminated from the lower side in one of different lighting directions. A disc-shaped reflective plate 14a mounted on the suction nozzle 14 reflects downward the light emitted from the light source 15a for trans-illumination through the reflective surface 14b.

Two types of component recognition processing realized by using the light source 15 a for transmission illumination and the light source 15 b for reflection illumination will be described with reference to FIGS. 4A and 4B . FIG. 4A illustratively shows a trans-illumination identification technique using a trans-illumination light source 15a. The light source 15a for transmission illumination is arranged such that light emitted from the light source 15a for transmission illumination is obliquely incident on the reflection plate 14a positioned above the electronic component P at a predetermined irradiation angle. The light reflected from the reflection plate 14a is vertically incident on the line camera 11 from behind the electronic component P. As shown in FIG.

The line camera 11 receives incident light to take an image 18 of the electronic component P. As shown in FIG. In the image 18, the background area other than the electronic component P area is a bright image 18a, and the area corresponding to the electronic component P is a dark image 19a. The profile Pa of the electronic component P corresponding to the outline of the dark image 19a is extracted from the image 18 to obtain a representative position of the profile Pa (eg, the position of the center of gravity), thereby detecting the position of the electronic component P.

The position of the profile Pa includes a positional error specific to transmitted illumination recognition. Therefore, the outline Pt at a position shifted by the previously obtained characteristic shift amounts Δxa and Δya from the identified position is the true position of the electronic component P. In other words, the true position of the electronic component P is obtained by adding the offsets Δxa and Δya (=offset at the time of transmitted illumination identification) to the position of the electronic component P obtained by the transmitted illumination identification.

FIG. 4B illustratively shows the reflection illumination recognition technique using the reflection illumination light source 15b. The reflective illumination light source 15b is arranged such that light emitted from the reflective illumination light source 15b is obliquely incident on the lower side surface of the electronic component P at a predetermined irradiation angle. The light reflected from the underside of the electronic component is vertically incident on the line camera 11 .

The line camera 11 receives incident light to capture an image of the electronic component P. As shown in FIG. In the image 18, the background area other than the electronic component P area is a dark image 18b, and the area corresponding to the electronic component P is a bright image 19b. The outline Pb of the electronic component P corresponding to the contour line of the bright image 19b is extracted from the image 18, thereby obtaining a representative position of the outline Pb, thereby detecting the position of the electronic component P.

The position of the profile Pb includes the positional error specific to reflected illumination identification. Therefore, the profile Pt located at a position shifted from the identified position by the previously obtained feature offsets Δxb and Δyb, is the true position of the electronic component P. In other words, by Add offsets Δxb and Δyb (=offset during reflected illumination recognition) to the position of electronic component P obtained by reflected lighting recognition to obtain the real position of electronic component P.

The two sets of offsets (Δxa and Δya, and Δxb and Δyb) often take different values due to the characteristics of lighting technology. This discrepancy in recognition results is caused by different factors: for example, the difference between a transillumination system (where the outline of an electronic component is shown as an image) and a reflective lighting system (where the outline of an electronic component's underside is shown as an image). , the diffraction of illuminating light in transmitted illumination, and so on.

Thus, the electronic component mounting apparatus of the present embodiment stores two sets of offsets (Δxa and Δya, and Δxb and Δyb), and appropriately selects one of these sets of offsets according to the currently used identification system. For positional corrections of electronic components as they are positioned on the substrate during component mounting operations, this set of offsets is added to the mounting position offset, which is used to correct for errors caused by errors inherent in the mounting mechanism. position offset. The sum of these offsets is used as the position correction value.

Instead of adding the installation position offset to the offset (=recognition offset) each time in the position identification process, the following alternative method can be used. The mounting position offset is regarded as a parameter unique to each electronic component mounting apparatus, and it is included in the identification offset in advance. In order to achieve position correction, this alternative method requires a simple computational process, adding the recognition offset directly to the result of the recognition process.

The structure of the control system for the electronic component mounting apparatus will be described with reference to FIG. 5 . In FIG. 5, by using the installation data stored in the installation data storage 22, the control unit 20 including the CPU executes the component installation program stored in the installation program storage 21, thereby controlling the component installation operation. The mounting program memory 21 stores various programs necessary for performing component mounting operations, such as mounting sequence programs.

The mounting data memory 22 stores data necessary for mounting operations, such as data representing mounting positions of electronic components on the substrate 3, data specific to electronic components, and data necessary for mounting operations. The mounting position data includes distinction data indicating an identification system used to identify the position of the individual electronic components, such as a transillumination system or a reflective illumination system.

The mounting position offset memory 23 stores an offset value (mounting position offset) for correcting the mounting position offset caused by the mechanical error of the mounting mechanism. The offset amount memory 24 for transmitted illumination recognition stores offset amounts Δxa and Δya used for position identification using the transmitted illumination system. The offset amount memory 25 for reflected lighting recognition stores offset amounts Δxb and Δyb used in position recognition using the reflected lighting system.

The mechanism drive unit drives the X-axis stages 7A and 7B, and the Y-axis stages 6A and 6B, and the Z-axis motor 8b and theta-axis motor 13 of the suction head 8a. The recognition unit 16 recognizes the position of the substrate 3 by processing the image data collected from the photographing operation of the camera 9, and recognizes the electronic component held by the suction nozzle 14 by processing the image data collected from the photographing operation of the line camera 11. s position. An illumination selector 17 selects the light source 15a for transillumination or the light source 15b for reflective illumination. The selection of the light source is carried out according to the data in the installation data indicating the position identification system.

The control unit 20 forming the control device controls the installation mechanism including the X-axis stages 7A and 7B, the Y-axis stages 6A and 6B, and the Z-axis motor 8b and the θ-axis motor 13 of the suction head 8a through the mechanism drive unit 26, so that the suction head 8a The held electronic components are positioned on the substrate and mounted on the substrate. The offset memory 24 for the identification of the transmitted illumination and the offset memory 25 for the identification of the reflected illumination constitute offsets for storing the offsets. The offset storage device, the offset is the offset used for each identification system combined with its own light source when the position is corrected according to the identification result of the identification device during positioning.

An electronic component mounting method performed by using the electronic component mounting apparatus thus configured will be described with reference to the flowchart in FIG. 6 . Mounting data on the substrate 3 on which electronic components are mounted is read out from the mounting data memory 22 before the component mounting operation is started. When the mounting operation starts, the control unit moves the transfer head unit 8 to the component supply section 4, and causes the suction head 8a on the transfer head unit 8 to suctionly pick up the electronic components (ST1). Then, the control unit moves the transfer head unit 8 holding the picked up electronic component onto the line camera 11 ( ST2 ).

Based on the read out mounting data, the control unit distinguishes an identification system for identifying electronic components held by the transfer head unit 8 (ST3). Specifically, the control unit distinguishes whether the identification system for identifying the position of the electronic component is a transmitted illumination identification system or a reflected illumination identification system, and then selects an illumination method corresponding to the selected identification system. When the selected identification system is a transmission illumination identification system, the control unit selects a transmission illumination method (ST4). When the selected identification system is a reflected lighting identification system, the control unit selects a reflected lighting method (ST5). And, the control unit instructs the lighting selector 17 to select a lighting method corresponding to the selected recognition system. Then, the control unit reads out the offset corresponding to the selected identification system (identification offset) (ST6). Specifically, the control unit reads the offsets Δxa and Δya from the offset memory for transmitted illumination identification 24 , or reads the offsets Δxb and Δyb from the offset memory for reflected illumination identification 25 .

Thereafter, the electronic components are photographed. Specifically, the line camera 11 takes a picture of the electronic components by the selected lighting method (ST7). Then, the recognition unit 16 recognizes and processes the captured image ( ST8 ). The control unit adds the offset to the result of the recognition process, and outputs the result of the addition as the component position ( ST9 ). In this way, the control unit outputs corrected or true component positions, which do not include positional errors of the recognition process results produced by using different recognition means (see FIGS. 4A and 4B ).

Subsequently, the transfer head unit 8 is moved over the substrate 3 and its suction head 8 a is lowered to the substrate 3 to mount the electronic components on the substrate 3 . In this case, the position of the electronic component is corrected based on the output real position, and then, the electronic component is mounted at the corrected position (ST10). In cases where errors inherent in the mounting mechanism have to be corrected, the sum of the offset and the sum of the mounting offset is used as the actual position correction value.

Thus, the electronic component mounting method includes the steps of: moving the suction head 8a holding the electronic component P with the suction nozzle 14 relative to the substrate 3; photographing the electronic component P held by the suction nozzle 14 on the moving path of the suction head 8a, And the captured image is recognized by the recognition unit 16; and the electronic component P held by the suction head 8a is positioned on the substrate 3 and the electronic component is mounted on the substrate.

For each identification system combined with its own light source (light source 15a for transmission illumination or light source 15b for reflection illumination), the pre-stored offset is used when performing position correction based on the identification result of the identification unit 16 during positioning offset.

Therefore, in such an electronic component mounting apparatus selectively using a plurality of recognition systems, when the component mounting operation is carried out by selecting an appropriate recognition system according to the recognized object, there is no positional recognition result difference causing component mounting accuracy The problem of change.

Industrial applicability

The pre-stored offset for each identification system combined with its own light source is used as the offset used when performing position correction based on the identification result of the identification unit during positioning. Even in such an electronic component mounting apparatus that selectively uses a plurality of recognition systems, differences in position recognition results caused by use of other types of lighting methods are corrected to ensure necessary component mounting accuracy.

Claims (15)

1. An electronic component mounting apparatus for holding an electronic component using a nozzle, transferring the electronic component onto a substrate, and mounting the electronic component on the substrate, the electronic component mounting apparatus comprising: a mounting head comprising said nozzle; a head moving device for moving the mounting head relative to the substrate; an illumination device for illuminating the electronic component with a light source selected from a plurality of different light sources when the electronic component held by the nozzle is photographed; an identification device disposed on the moving path of the mounting head for taking a picture and identifying the electronic component illuminated by a light source selected from the plurality of different light sources; a control unit for controlling said head moving device to perform a component mounting operation in which positioning and mounting of electronic components on said substrate is performed, and An offset memory for storing an offset used for each of the plurality of different light sources when performing position correction in positioning according to the identification result of the identification device. 2. The electronic component mounting apparatus according to claim 1, wherein the lighting device comprises: a light source for trans-illumination in which the outline of the electronic component is displayed as an image, and A light source for reflected illumination in which the underside profile of an electronic component is displayed as an image. 3. The electronic component mounting apparatus according to claim 2 , further comprising a mounting data memory for storing a light source for illuminating a single electronic component selected from one of a light source for transmission illumination and a light source for reflective illumination. Distinguishing data for the component's light source. 4. The electronic component mounting apparatus according to claim 3, further comprising an illumination selector which selects a light source for transmission illumination or a light source for reflection illumination based on discrimination data in said mounting data memory. 5. The electronic component mounting apparatus according to claim 4, wherein the offset memory includes: an offset memory for diascopic identification, which is used to store offsets used by light sources for diascopic illumination, and An offset memory for identification of reflected lighting, which is used to store the offset used for the light source of reflected lighting. 6. An electronic component mounting apparatus for holding electronic components using a nozzle, transferring the electronic components onto a substrate, and mounting the electronic components on the substrate, the electronic component mounting apparatus comprising: a mounting head including a nozzle; a head moving device for moving the mounting head relative to the substrate; an illumination device for illuminating the electronic component with a light source selected from a plurality of different light sources when taking a picture of the electronic component held by the nozzle; an identification device disposed on the moving path of the mounting head for taking a picture and identifying the electronic component illuminated by a light source selected from the plurality of different light sources; a control device for controlling said head moving device to perform a component mounting operation in which positioning and mounting of electronic components on said substrate is performed, and An offset storage device for storing an offset used for each of the plurality of different light sources when performing position correction in positioning according to the recognition result of the recognition device. 7. The electronic component mounting apparatus according to claim 6, wherein the lighting device comprises: a light source for trans-illumination in which the outline of the electronic component is displayed as an image, and A light source for reflected illumination in which the underside profile of an electronic component is displayed as an image. 8. The electronic component mounting apparatus according to claim 7, further comprising a mounting data memory for storing a light source for illuminating a single electronic component selected from a light source for transmission illumination and a light source for reflective illumination. Differential data for light sources. 9. The electronic component mounting apparatus according to claim 3, further comprising an illumination selector which selects a light source for transmission illumination or a light source for reflection illumination based on discrimination data in said mounting data memory. 10. The electronic component mounting apparatus according to claim 4, wherein said offset storage means comprises: an offset memory for diascopic identification, which is used to store offsets used by light sources for diascopic illumination, and An offset memory for specular lighting identification, which is used to store the offset used by the light source of the specular lighting. 11. An electronic component mounting method for holding an electronic component using a nozzle, transferring the electronic component onto a substrate, and mounting the electronic component on the substrate, comprising the steps of: moving a mounting head holding electronic components relative to said substrate; photographing and identifying the electronic components held by the nozzle by an identification device on the moving path of the mounting head; When photographing the electronic component in the photographing and identifying step, illuminating the electronic component with a light source selected from a plurality of light sources of the lighting device; and positioning an electronic component held by the mounting head on the substrate, and mounting the electronic component on the substrate; Wherein, for the light source selected from the plurality of light sources, the corresponding offset is used when performing position correction according to the recognition result of the recognition device during positioning. 12. The electronic component mounting method according to claim 11 , wherein said plurality of light sources are a light source of transillumination in which an outline of an electronic component is displayed as an image, and an outline of an electronic component is displayed as an image. A light source for reflected lighting. 13. The electronic component mounting method according to claim 12, further comprising a step of determining a light source of the lighting device to be selected. 14. The electronic component mounting method according to claim 13, further comprising the step of instructing the lighting selector to select the light source to be used according to the selected light source. 15. The electronic component mounting method according to claim 14 , wherein when a light source of transillumination is used for illumination, the offset for transillumination identification is used, and The offset used for specular lighting identification is used when a light source for specular lighting is used for lighting.

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