CN1794095A - Coaxial position aligning system and aligning method in projection exposure device - Google Patents
Coaxial position aligning system and aligning method in projection exposure device Download PDFInfo
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- CN1794095A CN1794095A CN 200610023153 CN200610023153A CN1794095A CN 1794095 A CN1794095 A CN 1794095A CN 200610023153 CN200610023153 CN 200610023153 CN 200610023153 A CN200610023153 A CN 200610023153A CN 1794095 A CN1794095 A CN 1794095A
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- 238000000034 method Methods 0.000 title claims description 24
- 230000033001 locomotion Effects 0.000 claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims abstract description 33
- 238000003384 imaging method Methods 0.000 claims description 31
- 238000005286 illumination Methods 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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Abstract
A coaxial position alignment system in projected exposure device is prepared as installing at least two position alignment units on optical projection system by applying said system axis as axis center; setting mask label on mask and exposure object label on exposure object as well as reference label on plate - carry table; detecting position information of all said labels by position alignment unit and transmitting them to component motion control system to control and to regulate position of mask, plate - carry table and exposure object for making them be aligned.
Description
Affiliated technical field
The present invention relates to the optical devices technologies field, particularly about coaxial position alignment system and alignment methods in a kind of projection aligner.
Background technology
With the circuit pattern that is depicted on the mask, be imaged on by projection aligner on the silicon chip surface of the manufacturing integrated circuit that scribbles photosensitive materials such as photoresist, on the silicon chip of making integrated circuit, form the shadow etching method of pattern afterwards by etching technics, be widely used in various fields, printed circuit board (PCB) is also used recent exposure device manufacturing.
Projection aligner is with the circuit pattern on the mask, do projection exposure through optical systems such as projection exposure lens, with circuit pattern with certain amplification or the multiplying power projection dwindled on the silicon chip of making integrated circuit, become known for the manufacturing of integrated circuit, this projection aligner also is applicable to the manufacturing of printed circuit board (PCB) in recent years.
When doing exposure with projection aligner, mask must be aimed at the position of exposure object (for example silicon chip, printed circuit board (PCB) etc.), usually the mask top all disposes the mark that position alignment is used with the exposure object top, by certain position alignment device and position alignment method, set up accurate relative position relation between mask and the exposure object.
The position alignment device and the position alignment method that are used for projection aligner at present are a lot, but because the complicacy of its position alignment apparatus structure and position alignment signal Processing, Design of device cost and dress school difficulty have not only been increased, and make the position alignment process become complicated, increase position alignment error link, finally influence alignment precision.
Summary of the invention
Purpose of the present invention realizes that for solving above-mentioned prior art problem the high precision position between mask and the exposure object is aimed at.
For realizing goal of the invention of the present invention, the invention provides the coaxial position alignment system in a kind of projection aligner, be arranged at one at least by optical projection system, mask, wafer-supporting platform, exposure object, and on the projection aligner of component movement control system composition, it comprises, with the optical projection system axis is the equally distributed position alignment device that is no less than two in axle center, be arranged at the mask mark on the mask, be arranged at the wafer-supporting platform reference mark on the wafer-supporting platform, be arranged at the exposure object mark on the exposure object, described position alignment device is by detecting described mask mark, reference mark, the positional information of exposure object mark also sends the component movement control system to, with the control mask, wafer-supporting platform, the adjustment of exposure object position makes its aligning.
Wherein, described position alignment device comprises: the lighting source that is used for mask mark, wafer-supporting platform reference mark and exposure object illumination; Be used for the emergent light of lighting source is imported to the lighting fiber of mark illuminator; Be used for mark illuminator with the even illumination of alignment mark; Be used for mark is imaged onto mark imaging system on the mark camera target surface; Be used to receive the mark camera of the picture of alignment mark.The sensor of mark camera is CCD or CMOS.
Described mask markers align, wafer-supporting platform reference mark are aimed at and the exposure object markers align all adopts same set of lighting source, same set of lighting fiber, same set of mark illuminator, same set of mark imaging system and same set of mark camera.The shared same set of optical system of mark illuminator and mark imaging system forms coaxial-illuminating.
Mask mark and wafer-supporting platform reference mark all are reflection-type amplitude mark.The mask mark size is in the submillimeter rank.The mask mark is provided with logical light window, is used for the illumination and the imaging of reference mark and exposure object mark.The exposure object mark is arranged on the minimum circuit structural unit of exposure object, and it has uniqueness in this minimum circuit structural unit.This optical projection system can be the refraction projection optical system, also can be refraction and reflection projection optical system.
The present invention also provides the alignment methods of the coaxial position in a kind of projection aligner, comprise the following steps: by the logical light window illumination wafer-supporting platform reference mark on the mask, take the wafer-supporting platform reference mark by the mark camera, and store this picture position information; Take the mask mark by the mark camera, and store this picture position information; Take the exposure object mark by the mark camera, and store this picture position information; The position relation of each image by storage, the position of adjusting mask, wafer-supporting platform and exposure object makes its aligning.
Wherein, the sensor of described mark camera is CCD or CMOS.Described mask markers align, wafer-supporting platform reference mark are aimed at and the exposure object markers align all adopts the same set of position alignment device of being made up of lighting source, lighting fiber, mark illuminator, mark imaging system and mark camera.The shared same set of optical system of mark illuminator and mark imaging system forms coaxial-illuminating.The position alignment device can be for a plurality of, and are that the axle center evenly distributes with the optical projection system axis in the projection aligner.
Mask mark and wafer-supporting platform reference mark all are reflection-type amplitude mark.The mask mark size is in the submillimeter rank.The exposure object mark is arranged on the minimum circuit structural unit of exposure object, and it has uniqueness in this minimum circuit structural unit.
Mask markers align of the present invention, wafer-supporting platform reference mark are aimed at and the exposure object markers align all adopts same set of lighting source, same set of lighting fiber, same set of mark illuminator, same set of mark imaging system and same set of mark camera, can simplify the position alignment apparatus structure so greatly and reduce its cost.
And above-mentioned position alignment device all is in and holds the bed top, is convenient to and the integrated of other equipment and test.In addition, hold bed and in small scope, move, can reduce the design and the processing cost of holding bed like this, and can improve the bearing accuracy of holding bed.
In addition, the device that is used for position alignment among the present invention has many covers, and the true field center about optical projection system on the space layout evenly distributes.Adopt many cover position alignment devices, can accurately determine the translational movement and the mask rotation amount at mask center.
The present invention also adopts lighting fiber that lighting source is incorporated into the mark illuminator, make lighting source away from optical projection system, avoided the lighting source heating and cause and the thermal drift of projection optical system improved the position alignment precision between mask and the exposure object.
Description of drawings
Fig. 1 is a system architecture synoptic diagram of the present invention.
Fig. 2 is mask mark used in the present invention and the position view of logical light window on mask.
Fig. 3 is the position view of wafer-supporting platform reference mark used in the present invention on wafer-supporting platform.
Fig. 4 is an exposure object mark partial enlarged drawing used in the present invention.
Embodiment
Exposure system of the present invention comprises that mask has been described circuit pattern; Hold bed, be used to support circuit pattern on the mask to treat by the optical projection system projection imaging to exposure object; Optical projection system, the wavelength that utilizes exposure light source with the circuit pattern described on the mask with certain amplification or the multiplying power projection imaging dwindled on exposure object; Exposure object, its surface scribbles photoresist, and the circuit pattern that is used to receive on the mask passes through the optical projection system imaging; Wafer-supporting platform is used to support exposure object; Hold bed and wafer-supporting platform motion control device, in the process of setting up mask mark and exposure object mark relative position, the motion of holding bed and wafer-supporting platform by control makes mask aim at exposure object; The overhead control device is finished the series of algorithms in the alignment procedures, and total system is controlled.The position alignment device is used to set up the relative position relation between mask and the exposure object; Lighting source is used for the illumination of mask mark, wafer-supporting platform reference mark and exposure object; Lighting fiber is used for the emergent light of lighting source is imported to the mark illuminator; The mark illuminator is used for alignment mark is evenly thrown light on; The mark imaging system is used for mark is imaged onto mark camera target surface; The mark camera is used to receive the picture of alignment mark; The mask mark, be arranged on the mask, the position alignment that is used for mask, its sensor are CCD (Charge Coupled Device charge-coupled image sensor) or CMOS (ComplementaryMetal-Oxide-Semiconductor Transistor complementary metal oxide semiconductor (CMOS)); The wafer-supporting platform reference mark is used to establish the relative position relation between mask and wafer-supporting platform and exposure object and the wafer-supporting platform; The exposure object mark is arranged on the described exposure object, is used for the position alignment of exposure object.
The present invention gives the position alignment method that this position alignment device is established relative position relation between mask and the exposure object, for realizing that high precision alignment provides a kind of scheme between mask and the exposure object.
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Fig. 1 is the projection aligner for manufacturing integrated circuit or printed circuit board (PCB), the exposure object that applies photoresist places movably on the wafer-supporting platform 80, can move in X, Y, Z and θ direction by wafer-supporting platform motion control device 92, wherein θ is the anglec of rotation (not shown) of Z axle.The mask 40 of describing the exposure circuit pattern places and holds on the bed 50, can make and hold bed 50 by holding bed motion control device 91 at X, Y, the θ direction is done small scope and is moved, and by exposure light source 30 and optical projection system 60 circuit pattern described on the mask 40 is transferred on the exposure object 70 with certain amplification or the multiplying power projection dwindled.
Mark position alignment device 1 comprises mark illuminator and mark imaging system, and the mark illuminator is used for the even illumination of mark, comprises lighting unit 10, lens 11, Amici prism 12, lens 13, catoptron 14; The mark imaging system is imaged onto mark on the mark camera 15, comprises catoptron 14, lens 13, Amici prism 12 and mark camera 15.Mark position alignment device 2 is identical with the structure of position alignment device 1, is made up of lighting unit 20, lens 21, Amici prism 22, lens 23, catoptron 24 and mark camera 25.The relative optical projection system true field of each mark position alignment device center symmetry on space layout.In fact, the position alignment device can be for a plurality of, and are that the axle center evenly distributes with the optical projection system axis in the projection aligner.
Fig. 2 is the mask mark 18,28 on the mask 40 and is used for logical light window 17,27 synoptic diagram that exposure object mark 71,72,81 illuminations of wafer-supporting platform reference mark and imaging are used that wherein mask mark 18,28 is a reflection-type amplitude mark.In the actual conditions: with respect to circuit pattern 31, this mark is very little, and size is in the submillimeter rank.Mask mark 18,28 is " ten " font among the figure, but actual be as long as this mark shape can satisfy graphics processing unit carries out high precision position and determine, there is no particular determination.
Fig. 3 is wafer-supporting platform reference mark 81 and the position description of exposure object 70 on wafer-supporting platform 80, and wherein wafer-supporting platform reference mark 81 is a reflection-type amplitude mark, and mark shape is carried out high precision position and determined to get final product to satisfy graphics processing unit, there is no particular determination.
Fig. 4 is the position description of exposure object mark 71,72 on exposure object 70 that amplifies, wherein 73 is minimum circuit structural unit on the exposure object, 71,72 be arranged on the minimum circuit structural unit 73, its marker characteristic requires to have uniqueness in this structural unit.
Below its action of explanation:
The alignment actions of mark camera 15 and wafer-supporting platform reference mark 81
Hold bed 50 to the precalculated position by holding 91 fine motions of bed motion control device, the logical light window 17 of mask is in the imaging viewing field scope of mark camera 15, this moment, logical light window 27 was in the imaging viewing field scope of mark camera 25.
Move wafer-supporting platform 80 to the precalculated position by wafer-supporting platform motion control device 92, wafer-supporting platform reference mark 81 is in the imaging viewing field scope of mark camera 15.
Light the lighting unit 10 in the position alignment device 1, light is shone on the wafer-supporting platform reference mark 81 by the logical light window 17 on the mask 40, wafer-supporting platform reference mark 81 is imaged onto on the mark camera 15 by optical projection system 60 and position alignment device 1 then, the picture of 16 pairs of wafer-supporting platform reference marks 81 of graphics processing unit is handled, and write down the positional information of its center on mark camera 15, allow wafer-supporting platform motion control device 92 write down the positional information of wafer-supporting platforms 80 this moment simultaneously.
The alignment actions of mark camera 25 and wafer-supporting platform reference mark 81
Move wafer-supporting platform 80 to the precalculated position by motion wafer-supporting platform motion control device 92, wafer-supporting platform reference mark 81 is in the imaging viewing field scope of mark camera 25.
Light the lighting source 20 in the position alignment device 2, light is shone on the wafer-supporting platform reference mark 81 by the logical light window 27 on the mask 40, wafer-supporting platform reference mark 81 is imaged onto on the mark camera 25 by optical projection system 60 and position alignment device 2 then, the picture of 26 pairs of wafer-supporting platform reference marks 81 of graphics processing unit is handled, and write down the positional information of its center on mark camera 25, allow wafer-supporting platform motion control device 92 write down the positional information of wafer-supporting platforms 80 this moment simultaneously.
The alignment actions of mark camera 15 and mask mark 18
Move and hold bed 50 to the precalculated position by holding bed motion control device 91, mask mark 18 is in the imaging viewing field scope of mark camera 15, mask mark 28 also is in the imaging viewing field scope of mark camera 25 simultaneously.
The alignment actions of mark camera 25 and mask mark 28
After above-mentioned action, after the picture of 26 pairs of mask marks 28 of graphics processing unit is handled, the positional information of center on mark camera 25 of the picture of record mask mark 28.
According to the center of the above-mentioned mask marker image that writes down and the center information of wafer-supporting platform reference mark picture, and the corresponding positional information of holding bed and wafer-supporting platform, by a series of coordinate transforms and related algorithm, hold the required amount of movement of bed (Δ X ' when in overhead control device 90, finishing mask registration, Δ Y ', Δ θ '), send to and with this result and to hold bed motion control device 91 and finish aiming at of mask 40 and wafer-supporting platform reference mark 81.
The alignment actions of mark camera 15 and exposure object mark 72,71
At first, to hold bed 40 and move to the precalculated position by holding bed motion control device 91, the logical light window 17 of mask is in the imaging viewing field scope of mark camera 15, the logical light window 27 of mask is in the imaging viewing field scope of mark camera 25, and by holding the positional information that bed motion control device 91 records hold bed at this moment.
Secondly, move wafer-supporting platform 80 to the precalculated position by wafer-supporting platform motion control device 92, exposure object mark 72 is in the imaging viewing field scope of mark camera 15, be imaged onto on the mark camera 15 through optical projection system 60 and position alignment device 1, and, write down the positional information of its inconocenter on mark camera 15 by after graphics processing unit 16 processing.Simultaneously, write down the positional information of wafer-supporting platforms this moment by wafer-supporting platform motion control device 92.
Then, move wafer-supporting platform 80 to the precalculated position by wafer-supporting platform motion control device 92, exposure object mark 71 is in the imaging viewing field scope of mark camera 15, be imaged onto on the mark camera 15 through optical projection system 60 and position alignment device 1, and, write down the positional information of its inconocenter on mark camera 15 by after graphics processing unit 16 processing.Simultaneously, write down the positional information of wafer-supporting platforms this moment by wafer-supporting platform motion control device 92.
Pass through said process, the positional information of center on mark camera 15 according to exposure object mark 72,71 pictures of being preserved, and the positional information of corresponding wafer-supporting platform, by a series of coordinate transforms and related algorithm, in overhead control device 90, finish exposure object amount of movement (the Δ X required to punctual wafer-supporting platform, and this result is sent to wafer-supporting platform motion control device 92 finish aiming at of exposure object mark 72,71 and wafer-supporting platform reference mark 81 Δ Y, Δ θ).
Because position alignment device 1 and position alignment device 2 are symmetrical about the true field center of optical projection system 60, therefore in order to improve the alignment actions that position alignment precision can realize mark camera 25 and exposure object mark 72,71 by above-mentioned steps.In addition, according to the requirement of position alignment precision, the quantity of exposure object mark is optional a plurality of.
After above-mentioned a series of alignment actions, set up the accurate relative position relation between mask and the exposure object.
That more than introduces only is based on several preferred embodiment of the present invention, can not limit scope of the present invention with this.Any device of the present invention is done replacement, the combination, discrete of parts well know in the art, and the invention process step is done well know in the art being equal to change or replace and all do not exceed exposure of the present invention and protection domain.
Claims (20)
1, coaxial position alignment system in a kind of projection aligner, be arranged at one at least by optical projection system, mask, wafer-supporting platform, exposure object, and on the projection aligner of component movement control system composition, it is characterized in that it comprises, with the optical projection system axis is the equally distributed position alignment device that is no less than two in axle center, be arranged at the mask mark on the mask, be arranged at the wafer-supporting platform reference mark on the wafer-supporting platform, be arranged at the exposure object mark on the exposure object, described position alignment device is by detecting described mask mark, reference mark, the positional information of exposure object mark also sends the component movement control system to, with the control mask, wafer-supporting platform, the adjustment of exposure object position makes its aligning.
2, coaxial position alignment system as claimed in claim 1 is characterized in that described position alignment device comprises:
The lighting source that is used for mask mark, wafer-supporting platform reference mark and exposure object illumination;
Be used for the emergent light of lighting source is imported to the lighting fiber of mark illuminator;
Be used for mark illuminator with the even illumination of alignment mark;
Be used for mark is imaged onto mark imaging system on the mark camera target surface;
Be used to receive the mark camera of the picture of alignment mark.
3, coaxial position alignment system as claimed in claim 2, the sensor that it is characterized in that described mark camera is CCD.
4, coaxial position alignment system as claimed in claim 2, the sensor that it is characterized in that described mark camera is CMOS.
5, coaxial position alignment system as claimed in claim 2 is characterized in that described mask markers align, wafer-supporting platform reference mark are aimed at and the exposure object markers align all adopts same set of lighting source, same set of lighting fiber, same set of mark illuminator, same set of mark imaging system and same set of mark camera.
6, coaxial position alignment system as claimed in claim 2 is characterized in that the shared same set of optical system of mark illuminator and mark imaging system forms coaxial-illuminating.
7, coaxial position alignment system as claimed in claim 2 is characterized in that mask mark and wafer-supporting platform reference mark all are reflection-type amplitude mark.
8, coaxial position alignment system as claimed in claim 2 is characterized in that described mask mark size is in the submillimeter rank.
9, coaxial position alignment system as claimed in claim 2 is characterized in that being provided with logical light window at mask mark side, is used for the illumination and the imaging of reference mark and exposure object mark.
10, coaxial position alignment system as claimed in claim 2 is characterized in that described exposure object mark is arranged on the minimum circuit structural unit of exposure object, and it has uniqueness in this minimum circuit structural unit.
11, coaxial position alignment system as claimed in claim 1 is characterized in that optical projection system can be the refraction projection optical system, also can be refraction and reflection projection optical system.
12, the coaxial position alignment methods in a kind of projection aligner is characterized in that comprising the following steps:
By the logical light window illumination wafer-supporting platform reference mark on the mask, take the wafer-supporting platform reference mark by the mark camera, and store this picture position information;
Take the mask mark by the mark camera, and store this picture position information;
Take the exposure object mark by the mark camera, and store this picture position information;
The position relation of each image by storage, the position of adjusting mask, wafer-supporting platform and exposure object makes its aligning.
13, coaxial position alignment methods as claimed in claim 12, the sensor that it is characterized in that described mark camera is CCD.
14, coaxial position alignment methods as claimed in claim 12, the sensor that it is characterized in that described mark camera is CMOS.
15, coaxial position alignment methods as claimed in claim 12 is characterized in that described mask markers align, wafer-supporting platform reference mark are aimed at and the exposure object markers align all adopts the same set of position alignment device of being made up of lighting source, lighting fiber, mark illuminator, mark imaging system and mark camera.
16, coaxial position alignment methods as claimed in claim 15 is characterized in that the shared same set of optical system of described mark illuminator and mark imaging system forms coaxial-illuminating.
17, coaxial position alignment methods as claimed in claim 16 is characterized in that described position alignment device can be for a plurality of and be that the axle center evenly distributes with the optical projection system axis in the projection aligner.
18, coaxial position alignment methods as claimed in claim 12 is characterized in that described mask mark and wafer-supporting platform reference mark all are reflection-type amplitude mark.
19, coaxial position alignment methods as claimed in claim 12 is characterized in that described mask mark size is in the submillimeter rank.
20, coaxial position alignment methods as claimed in claim 12 is characterized in that described exposure object mark is arranged on the minimum circuit structural unit of exposure object, and it has uniqueness in this minimum circuit structural unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610023153 CN1794095A (en) | 2006-01-06 | 2006-01-06 | Coaxial position aligning system and aligning method in projection exposure device |
| PCT/CN2006/002977 WO2007079639A1 (en) | 2006-01-06 | 2006-11-07 | Ttl alignment system for projection exposure apparatus and alignment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610023153 CN1794095A (en) | 2006-01-06 | 2006-01-06 | Coaxial position aligning system and aligning method in projection exposure device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1794095A true CN1794095A (en) | 2006-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610023153 Pending CN1794095A (en) | 2006-01-06 | 2006-01-06 | Coaxial position aligning system and aligning method in projection exposure device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1794095A (en) |
| WO (1) | WO2007079639A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101329515B (en) * | 2008-07-29 | 2010-06-09 | 上海微电子装备有限公司 | Calibration device and calibration method for alignment system of stepper lithography machine |
| CN104460246A (en) * | 2013-09-12 | 2015-03-25 | 上海微电子装备有限公司 | Novel lithography alignment method |
| CN107134446A (en) * | 2016-02-29 | 2017-09-05 | 上海微电子装备有限公司 | A kind of chip bonding device and bonding method |
| WO2017167260A1 (en) * | 2016-03-31 | 2017-10-05 | 上海微电子装备（集团）股份有限公司 | Coaxial mask alignment device, photolithography apparatus and alignment method |
| CN107850761A (en) * | 2015-08-06 | 2018-03-27 | 高通股份有限公司 | Sub-micron wafer aligned |
| CN110854031A (en) * | 2019-11-20 | 2020-02-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Bonding method for flip chip |
| CN112068405A (en) * | 2020-08-19 | 2020-12-11 | 郑州大学 | An automatic alignment method of lithography machine based on image processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9348111B2 (en) * | 2010-08-24 | 2016-05-24 | Apple Inc. | Automatic detection of lens deviations |
| US11867501B2 (en) * | 2021-12-28 | 2024-01-09 | Mloptic Corp. | Integrated calibration tool for optical instrument entrance pupil 6-axis spatial allocation |
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| US4780615A (en) * | 1985-02-01 | 1988-10-25 | Canon Kabushiki Kaisha | Alignment system for use in pattern transfer apparatus |
| US5117254A (en) * | 1988-05-13 | 1992-05-26 | Canon Kabushiki Kaisha | Projection exposure apparatus |
| JP2897330B2 (en) * | 1990-04-06 | 1999-05-31 | キヤノン株式会社 | Mark detection device and exposure device |
| JP4015087B2 (en) * | 2003-08-27 | 2007-11-28 | 株式会社東芝 | Reticle and exposure method |
| JP2005175383A (en) * | 2003-12-15 | 2005-06-30 | Canon Inc | Exposure apparatus, alignment method, and device manufacturing method |
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2006
- 2006-01-06 CN CN 200610023153 patent/CN1794095A/en active Pending
- 2006-11-07 WO PCT/CN2006/002977 patent/WO2007079639A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101329515B (en) * | 2008-07-29 | 2010-06-09 | 上海微电子装备有限公司 | Calibration device and calibration method for alignment system of stepper lithography machine |
| CN104460246A (en) * | 2013-09-12 | 2015-03-25 | 上海微电子装备有限公司 | Novel lithography alignment method |
| CN107850761B (en) * | 2015-08-06 | 2019-04-23 | 高通股份有限公司 | Submicron wafer alignment |
| CN107850761A (en) * | 2015-08-06 | 2018-03-27 | 高通股份有限公司 | Sub-micron wafer aligned |
| CN107134446A (en) * | 2016-02-29 | 2017-09-05 | 上海微电子装备有限公司 | A kind of chip bonding device and bonding method |
| CN107134446B (en) * | 2016-02-29 | 2019-05-31 | 上海微电子装备（集团）股份有限公司 | A chip bonding device and bonding method |
| WO2017167260A1 (en) * | 2016-03-31 | 2017-10-05 | 上海微电子装备（集团）股份有限公司 | Coaxial mask alignment device, photolithography apparatus and alignment method |
| JP2019511747A (en) * | 2016-03-31 | 2019-04-25 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Coaxial mask alignment device, photolithography apparatus and alignment method |
| KR20180126544A (en) * | 2016-03-31 | 2018-11-27 | 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 | Coaxial mask alignment device, photolithographic device and alignment method |
| KR102190328B1 (en) | 2016-03-31 | 2020-12-11 | 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 | Coaxial mask alignment device, photolithographic apparatus and alignment method |
| US10901331B2 (en) | 2016-03-31 | 2021-01-26 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Coaxial mask alignment device, photolithography apparatus and alignment method |
| CN110854031A (en) * | 2019-11-20 | 2020-02-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Bonding method for flip chip |
| CN112068405A (en) * | 2020-08-19 | 2020-12-11 | 郑州大学 | An automatic alignment method of lithography machine based on image processing |
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| WO2007079639A1 (en) | 2007-07-19 |
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