CN1786868A - Notebook type computer - Google Patents

Abstract

The invention relates to a notebook PC, comprising a host machine top cover and a host machine under-frame as well as a display pin-jointed with the host machine, where the host machine top cover and the host machine under-frame are both made f nano carbon balls uniformly doped plastics. The notebook PC adopts high-heat conductivity coefficient material, namely nano carbon balls uniformly doped plastics, to make the shell, able to play the role in excellent cooling. In addition, the notebook PC has low cost and light and thin properties.

Description

laptop

【Technical field】

The invention relates to a notebook computer, in particular to a notebook computer using a heat dissipation material shell.

【Background technique】

Computers can assist people to process and store a large amount of electronic data, and have become an indispensable and important product in current life. With the advancement and development of science and technology, the functions and speed of computers have also been continuously enhanced. Therefore, computers have grown from bulky large computers in the early days to Evolved to desktop and notebook computers.

The heat dissipation problem has always been the biggest technical bottleneck of notebook computers. It is related to the stability of notebook computers. Many unexplained crashes are caused by unresolved heat dissipation problems. The method of heat dissipation is more related to the life of the notebook computer battery. Poor heat dissipation method will cause most of the battery power to be used for heat dissipation and shorten the battery life.

The heat dissipation of the existing notebook computer is generally installed on the rear end surface of the notebook computer through a cooling fan, thereby discharging the heat generated inside the notebook computer to the atmosphere. However, because the internal components of the notebook computer are arranged in a rather compact manner, the existing cooling device cannot effectively remove the heat generated inside the notebook computer.

In addition, in the limited space of a notebook computer, its external structure is usually made of engineering plastics (Acrylonitrile Butadiene Styrene, ABS) in order to make it easy and light, so that all components, such as the central processing unit (CPU), hard disk ( The heat generated by the Harddisk) and other parts are covered by the shell, which can easily cause poor heat dissipation and lead to abnormal component functions. Therefore, in order to achieve a better heat dissipation effect, the notebook computer needs to have a casing with a high conductivity coefficient.

At present, magnesium alloys and engineering plastics are mainly used for notebook computer casings. Compared with engineering plastics, magnesium alloy has the advantages of good rigidity and high thermal conductivity; but its disadvantages are also obvious: First, the specific gravity of magnesium alloy is higher than that of engineering plastics. Today's notebook computers have a tendency to become lighter and thinner, and the specific gravity of the shell material is small. Secondly, the cost of magnesium alloy raw materials is high, and its unit price is ten times more expensive than plastic raw materials; finally, due to the complicated processing technology of magnesium alloy, it further leads to an increase in the cost of magnesium alloy casings. The preparation of the magnesium alloy casing can be divided into two major processes: the front-stage die-casting and the rear-stage deburring, soil filling, painting, and baking. Die-casting can be mainly divided into cold and hot chamber die-casting methods and semi-solid injection methods. However, since magnesium alloys do not have good solid-state forming properties such as forging, punching, and extrusion, it is difficult to solve the problem of complicated processing in the later stage. This is also the reason why the price of magnesium alloy products remains high.

To sum up, the use of engineering plastics or magnesium alloys for notebook computer casings has its own advantages and disadvantages, and the materials for notebook computer casings still need to be improved.

In view of this, it is necessary to provide a notebook computer with a casing with a relatively high thermal conductivity and which is easy to form.

【Content of invention】

The object of the present invention is to provide a notebook computer with a high thermal conductivity and an easy-to-form casing.

To realize the object of the present invention, the present invention provides a kind of notebook computer, and it comprises:

A mainframe, which includes a mainframe upper cover and a mainframe chassis; and

A display is pivotally connected to the host;

Wherein, the host upper cover and the host chassis are made of plastic uniformly doped with nano-carbon spheres.

Compared with the prior art, the present invention adopts a material with high thermal conductivity, that is, a plastic material evenly doped with nano-carbon spheres to prepare a notebook computer casing, which can achieve a good heat dissipation effect. In addition, because the plastic material uniformly doped with nano-carbon spheres has light specific gravity, low cost and easy molding, the notebook computer of the present invention can be more low-cost, light and thin.

【Description of drawings】

Fig. 1 is a schematic structural diagram of a notebook computer of the present invention.

【Detailed ways】

The present invention is a notebook computer with good heat dissipation effect and meeting the requirement of thinning and thinning. The present invention will be further described in detail below with reference to the accompanying drawings.

Please refer to Fig. 1, the notebook computer of present embodiment comprises: a display 11, and it comprises a display housing 112; And protect the host 13 internal equipment, such as main board (not shown), central processing unit (not shown), hard disk (not shown), CD (not shown), cooling components (not shown) such as cooling fan (not shown in the figure), etc.; the host 13 is pivotally connected to the display 11; the host cover 132 offers a cover opening 136 for setting a keyboard (not shown).

In view of the distribution of heat sources in notebook computers, 60% of them come from the CPU, so its heat dissipation is particularly important. In the notebook computer of this embodiment, a cooling fan is installed inside the notebook computer host to discharge the heat generated inside the notebook computer out of the casing. Both the host upper cover 132 and the host chassis 134 in this embodiment are made of plastic materials uniformly doped with nano-carbon spheres. The material has the characteristics of high thermal conductivity and small specific gravity, which can play a strong heat dissipation effect. The main frame 13 of notebook computer is fixed under the parcel of main frame loam cake 132 and main frame chassis 134, still can dissipate the heat that main frame interior is not sent by cooling fan (not shown) in time by main frame loam cake 132 and main frame chassis 134, further Improve the cooling capacity of notebook computers.

In addition, as required, the display case 112 and the keyboard (not shown) in this embodiment can also be made of plastic materials evenly doped with nano-carbon spheres, which can also play a role in heat dissipation.

The plastic material of the present invention can be selected engineering plastics namely acrylonitrile butadiene styrene (Acrylonitrile Butadiene Styrene, ABS), which has the characteristics of plasticity and high rigidity. Engineering plastics are made by mixing plasticized styrene (Polymerising Styrene), propylene (Acrylonitrile) and polybutadiene (Polybutadiene) into a kind of butadiene hole glue (Latex), and then adding styrene-acrylonitrile to melt into a plastic. In the compounding process, additives such as stabilizers, lubricants and dyes can be added at the same time. It can be understood that, under the condition that the plastic material has proper rigidity, other plastic materials other than engineering plastics can be selected.

In the present invention, the weight percentage of carbon nanospheres doped in the plastic material is not particularly required under the condition that the shell has proper plasticity and rigidity. The preferred weight percentage of carbon nanospheres is 2-10%.

The preparation method of the plastic material uniformly doped with nano-carbon spheres of the present invention mainly includes the following two processes: injection molding and extrusion molding.

Injection molding process steps:

(1) Provide an injection molding equipment;

(2) The engineering plastics are made into granules or powders and evenly mixed with nano-carbon sphere particles;

(3) Add the mixture prepared in step (2) from the hopper into the heating cylinder of the injection molding equipment;

(4) melting the mixture under high pressure;

(5) and the molten mixture is injected into the closed mold cavity through the nozzle rapidly under high pressure by the reciprocating screw plug;

(6) Finally, the molten mixture is cooled in the mold to solidify and shape into a notebook case.

Extrusion molding process steps:

(1) Provide a screw type extrusion molding equipment;

(2) The engineering plastics are made into granules or powders and evenly mixed with nano-carbon sphere particles;

(3) The screw transports the mixture prepared in step (2) to the die head in the machine barrel. melted by external heat;

(4) The molten mixture is shaped by a die, cooled and shaped after being released from the mold, and cut to obtain a notebook case.

It can be understood that the structure of the notebook computer of the present invention can be arbitrarily adopted in the design of the notebook computer structure of the prior art, but the casing material of the notebook computer host is made of a plastic material uniformly doped with nano-carbon spheres. .

In the notebook computer of the present invention, in addition to installing a cooling fan inside the notebook computer host to discharge the heat generated inside the notebook computer from the casing to dissipate heat, the present invention also uses materials with high thermal conductivity, that is, uniformly doped The plastic material of nano-carbon spheres is used to prepare the notebook computer shell, which can further play a role in heat dissipation. In addition, because the plastic material evenly doped with nano-carbon spheres has light specific gravity, low cost and easy molding and preparation, the notebook computer of the present invention can be more low-cost, thin and light.

Claims (8)

1. notebook computer, it comprises:

One main frame, it comprises a main frame loam cake and a main frame; With

One display and this main frame articulate;

It is characterized in that this main frame loam cake and main frame made by the plastic material of even dopen Nano carbon ball.

2. notebook computer as claimed in claim 1 is characterized in that this main frame loam cake offers an opening and be used to be provided with a keyboard.

3. notebook computer as claimed in claim 2 is characterized in that keyboard made by the plastic material of even dopen Nano carbon ball.

4. notebook computer as claimed in claim 1 is characterized in that this display has a shell, and its plastic material by even dopen Nano carbon ball is made.

5. notebook computer as claimed in claim 1 is characterized in that this main frame includes motherboard, central processing unit, hard disk, CD and radiating subassembly.

6. as any described notebook computer of claim 1,3 and 4, the doping percentage by weight that it is characterized in that this nano carbon microsphere is 2～10%.

7. as any described notebook computer of claim 1,3 and 4, it is characterized in that these plastics are that engineering plastics are acronitrile-butadiene-styrene.

8. as any described notebook computer of claim 1,3 and 4, it is characterized in that the preparation technology of the even dopen Nano carbon of these plastics ball comprises ejection formation and extrusion molding.