CN1786052A - Preparation method of polyimide - Google Patents
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Abstract
本发明有关一种聚酰亚胺的新颖制法,包括使二酸酐与二胺反应形成聚酰胺酸(polyamic acid)后,藉由将聚酰胺酸涂布或藉铸模(casting)等方法涂布于支持体上,再移除溶剂藉由控制聚酰胺酸的挥发份含量在10重量%以下,并以张力控制在20kgf/cm2以下进行卷绕后,以批式方式进入高温烘箱,利用梯度温度加热而使聚酰胺酸脱水环化成聚酰亚胺,可获得产率高、外观佳的软性积层板。依据本发明的方法,可以低成本地获得品质良好的聚酰亚胺软膜。The present invention relates to a novel preparation method of polyimide, which comprises reacting dianhydride and diamine to form polyamic acid (polyamic acid), and then coating the polyamic acid or coating it by methods such as casting On the support, remove the solvent by controlling the volatile content of the polyamic acid below 10% by weight, and control the tension below 20kgf/ cm2 for winding, then enter the high-temperature oven in batch mode, using gradient The polyamic acid is dehydrated and cyclized into polyimide by heating at a temperature, and a flexible laminate with high yield and good appearance can be obtained. According to the method of the invention, the polyimide soft film with good quality can be obtained at low cost.
Description
技术领域technical field
本发明有关藉由涂布或铸模(casting)等方法涂布于支持体上制造聚酰亚胺的新颖方法,尤其有关藉由控制聚酰胺酸的挥发成分含量并以特定张力卷绕后利用梯度温度加热而以高产率获得外观加软性积层板的聚酰亚胺的新颖制法。The present invention relates to a novel method of manufacturing polyimide by coating or casting on a support, especially by controlling the volatile content of polyamic acid and using gradient after winding with a specific tension Novel manufacturing method of polyimide with high yield and appearance and flexible laminate obtained by heating at high temperature.
背景技术Background technique
聚酰亚胺为用途极广的耐高温材料,其不溶于溶剂本身亦不熔化,可自溶液形态的聚酰胺酸制成膜。或可用作黏着剂或电线的绝缘材料,或可先形成最终产品型态后经酰亚胺化。聚酰亚胺具有高的热安定性,可承受所有的封装条件,可耐受金属化的温度考验,且其具有电气特性、表面及总体的漏电率低,亦适用于高频线路。Polyimide is a high-temperature-resistant material with a wide range of uses. It is insoluble in solvents and does not melt. It can be formed into a film from polyamic acid in solution. Or it can be used as an adhesive or an insulating material for wires, or it can be imidized after being formed into the final product shape. Polyimide has high thermal stability, can withstand all packaging conditions, and can withstand the temperature test of metallization. It has electrical characteristics, low surface and overall leakage rates, and is also suitable for high-frequency circuits.
由于聚酰亚胺的该等特性而广泛应用于通讯、消费性电子产品、个人通讯助理、气体分离膜等领域。聚酰亚胺通常由涂布于例如铜箔等的金属箔上,制作软性电路板,而应用于笔记型计算机、消费性电子产品、行动电话等的电子通讯设备上。Due to these characteristics of polyimide, it is widely used in communications, consumer electronics, personal communication assistants, gas separation membranes and other fields. Polyimide is usually coated on a metal foil such as copper foil to make a flexible circuit board, and is used in electronic communication equipment such as notebook computers, consumer electronics products, and mobile phones.
在制作软性电路板时,目前采用下列方法:(1)将聚酰胺酸树脂涂布在金属箔上或聚酰亚胺薄膜上,连续通过一般高于350℃的高温红外线或加热风炉使聚酰胺酸环化形成聚酰亚胺,但在此高温下由于金属箔与聚酰亚胺的热膨胀系数差异,常会造成所得的聚酰亚胺膜翘曲,导致卷绕该聚酰亚胺膜时收卷不佳使良率降低,且所用设备昂贵;(2)将聚酰胺酸树脂涂布在金属箔上或聚酰亚胺薄膜上,以编织铁网垫在该金属箔两侧,以批式进入一般高于350℃的高温红外线或加热风炉使聚酰胺酸环化形成聚酰亚胺,但在此高温下该编织铁网常会变形,导致聚酰亚胺成品产生皱折,降低良率;及(3)将聚酰胺酸树脂涂布在金属箔上或聚酰亚胺薄膜上,以耐高温的离型膜或聚酰亚胺薄膜隔开,进入高温红外线或加热风炉使聚酰胺酸环化形成聚酰亚胺,但此方法的操作温度不能太高否则将使离型膜熔解或使聚酰亚胺树脂沾黏,使成品外观不佳,但操作温度低则会降低环化率,若欲达到环化率95%以上,则须较长操作时间,而会降低生产效率。In the production of flexible circuit boards, the following methods are currently used: (1) Coating polyamic acid resin on metal foil or polyimide film, continuously passing through high-temperature infrared rays or heating furnaces generally higher than 350°C Polyamic acid is cyclized to form polyimide, but at this high temperature, due to the difference in thermal expansion coefficient between metal foil and polyimide, the resulting polyimide film often warps, resulting in the winding of the polyimide film. When the winding is not good, the yield rate is reduced, and the equipment used is expensive; (2) the polyamic acid resin is coated on the metal foil or the polyimide film, and the braided iron mesh is used as a pad on both sides of the metal foil to The batch type enters the high-temperature infrared ray or heating furnace that is generally higher than 350°C to cyclize the polyamic acid to form polyimide, but the woven iron mesh is often deformed at this high temperature, resulting in wrinkles in the finished polyimide product, reducing the yield rate; and (3) coating polyamic acid resin on metal foil or polyimide film, separated by high temperature resistant release film or polyimide film, and entering into high temperature infrared ray or heating furnace Polyamic acid is cyclized to form polyimide, but the operating temperature of this method should not be too high, otherwise the release film will melt or the polyimide resin will stick, making the appearance of the finished product poor, but the operating temperature will decrease If the cyclization rate is more than 95% if the cyclization rate is to be achieved, the operation time will be longer and the production efficiency will be reduced.
鉴于上述,本发明人等为了改善上述习知方法的缺点,对聚酰胺酸环化成聚酰亚胺的制程条件进行广泛研究,因而完成本发明。In view of the above, in order to improve the shortcomings of the above-mentioned conventional methods, the present inventors conducted extensive research on the process conditions for the cyclization of polyamic acid to polyimide, thus completing the present invention.
发明内容Contents of the invention
本发明有关一种聚酰亚胺的新颖制法,包括使二酸酐与二胺反应形成聚酰胺酸(polyamic acid)后,藉由将聚酰胺酸涂布或铸模(casting)等方法涂布于支持体上,再移除溶剂藉由控制聚酰胺酸的挥发份含量在10重量%以下,并以张力控制在20kgf/cm2以下进行卷绕后,以批式方式进入高温烘箱,利用梯度温度加热而使聚酰胺酸脱水环化成聚酰亚胺,可获得产率高、外观佳的软性积层板。The present invention relates to a novel preparation method of polyimide, comprising reacting dianhydride and diamine to form polyamic acid, and then coating the polyamic acid on the polyamic acid by coating or casting. On the support, remove the solvent by controlling the volatile content of the polyamic acid below 10% by weight, and control the tension below 20kgf/ cm2 for winding, then enter the high-temperature oven in batch mode, using gradient temperature The polyamic acid is dehydrated and cyclized into polyimide by heating, and a flexible laminate with high yield and good appearance can be obtained.
本发明中聚酰胺酸的制法是使二酸酐与二胺反应形成含有-NH-CO-官能基以及羧酸基的聚合物。且本发明中所称的环化反应,是进一步使该-NH-CO-官能基与该羧酸基进行脱水缩合而形成环状基的过程,也称为亚酰胺化反应。The method for preparing polyamic acid in the present invention is to react dianhydride and diamine to form a polymer containing -NH-CO-functional groups and carboxylic acid groups. And the cyclization reaction referred to in the present invention is a process of further dehydrating and condensing the -NH-CO-functional group and the carboxylic acid group to form a cyclic group, also called imidization reaction.
依据本发明的方法,可以高产率及高环化率获得无皱纹的外观良好且机械性质优异的聚酰亚胺树脂金属箔软膜。According to the method of the present invention, the polyimide resin metal foil soft film with no wrinkle, good appearance and excellent mechanical properties can be obtained with high yield and high cyclization rate.
具体实施方式Detailed ways
本发明中制备聚酰胺酸的二酸酐实例可举例如(但不限于)芳族双酐例如苯均四酸二酐(PMDA)、4,4-二酞酸二酐(BPDA)、4,4-六氟亚异丙基二酞酸二酐(6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、1,4-双(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6GDA)、1-(3’,4’-二羧基苯基)-1,3,3-三甲基茚满-5,6-二羧酸二酐、1-(3’,4’-二羧基苯基)-1,3,3-三甲基茚满-6,7-二羧酸二酐、1-(3’,4’-二羧基苯基)-3-甲基茚满-5,6-二羧酸二酐、1-(3’,4’-二羧基苯基)-3-甲基茚满-6,7-二羧酸二酐、2,3,9,10-二萘嵌苯四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,6-二氯萘-1,4,5,8-四羧酸二酐、2,7-二氯萘-1,4,5,8-四羧酸二酐、2,3,6,7-四氯萘-2,4,5,8-四羧酸二酐、菲-1,8,9,10-四羧酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、1,2’,3,3’-二苯甲酮四羧酸二酐、3,3’,4,4’-联苯四羧酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、2,2’,3,3’-联苯四羧酸二酐、4,4’-亚异丙基二酞酸二酐、3,3’-亚异丙基二酞酸二酐、4,4’-氧基二酞酸二酐、4,4’-磺酰基二酞酸二酐、3,3’-氧基二酞酸二酐、4,4’-亚甲基二酞酸二酐、4,4’-硫基二酞酸二酐、4,4’-亚乙基二酞酸二酐、2,3,6,7-萘四羧酸二酐、1,2,4,5-萘四羧酸二酐、1,2,5,6-萘四羧酸二酐、苯-1,2,3,4-四羧酸二酐、吡嗪-2,3,5,6-四羧酸二酐等,其中较好为苯均四酸二酐(PMDA)、4,4-二酞酸二酐(BPDA)、4,4-六氟亚异丙基二酞酸二酐(6FDA)、1-(三氟甲基)-2,3,5,6-苯四羧酸二酐(P3FDA)、1,4-双(三氟甲基)-2,3,5,6-苯四羧酸二酐(P6GDA)。Examples of dianhydrides for the preparation of polyamic acid in the present invention include (but not limited to) aromatic dianhydrides such as pyromellitic dianhydride (PMDA), 4,4-diphthalic dianhydride (BPDA), 4,4 - Hexafluoroisopropylidene diphthalic dianhydride (6FDA), 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P3FDA), 1,4-bis(tri Fluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P6GDA), 1-(3',4'-dicarboxyphenyl)-1,3,3-trimethylindan- 5,6-dicarboxylic dianhydride, 1-(3',4'-dicarboxyphenyl)-1,3,3-trimethylindane-6,7-dicarboxylic dianhydride, 1-( 3',4'-dicarboxyphenyl)-3-methylindane-5,6-dicarboxylic dianhydride, 1-(3',4'-dicarboxyphenyl)-3-methylindane -6,7-dicarboxylic dianhydride, 2,3,9,10-perylenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,6-dichloro Naphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene- 2,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 1,2',3,3'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 3,3',4,4'-diphenyl Methanone tetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 4,4'-isopropylidene diphthalic anhydride, 3,3'-isopropylidene Diphthalic dianhydride, 4,4'-oxydiphthalic dianhydride, 4,4'-sulfonyl diphthalic dianhydride, 3,3'-oxydiphthalic dianhydride, 4,4'- Methylene diphthalic dianhydride, 4,4'-thiodiphthalic dianhydride, 4,4'-ethylene diphthalic dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride , 1,2,4,5-naphthalene tetracarboxylic dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, pyrazine- 2,3,5,6-tetracarboxylic dianhydride, etc., among which pyromellitic dianhydride (PMDA), 4,4-diphthalic dianhydride (BPDA), 4,4-hexafluoroisoiso Propyl diphthalic dianhydride (6FDA), 1-(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride (P3FDA), 1,4-bis(trifluoromethyl)- 2,3,5,6-Phenylenetetracarboxylic dianhydride (P6GDA).
本发明中制备聚酰胺酸的二胺实例可举例如(但不限于)芳族双胺例如4,4’-氧基二苯胺(ODA)、5-胺基-1-(4’-胺基苯基)-1,3,3-三甲基茚满、6-胺基-1-(4’-胺基苯基)-1,3,3-三甲基茚满、4,4’-亚甲基双(邻-氯苯胺)、3,3’-二氯二苯胺、3,3’-磺酰基二苯胺、4,4’-二胺基二苯甲酮、1,5-二胺基萘、双(4-胺基苯基)二乙基硅烷、双(4-胺基苯基)二苯基硅烷、双(4-胺基苯基)乙基膦氧化物、N-(双(4-胺基苯基))-N-甲基胺、N-(双(4-胺基苯基))-N-苯基胺、4,4’-亚甲基双(2-甲基苯胺)、4,4’-亚甲基双(2-甲氧基苯胺)、5,5’-亚甲基双(2-胺基苯酚)、4,4’-亚甲基双(2-甲基苯胺)、4,4’-氧基双(2-甲氧基苯胺)、4,4’-氧基双(2-氯苯胺)、2,2’-双(4-胺基苯酚)、5,5’-氧基双(2-胺基苯酚)、4,4’-硫基双(2-甲基苯胺)、4,4’-硫基双(2-甲氧基苯胺)、4,4’-硫基双(2-氯苯胺)、4,4’-磺酰基双(2-甲基苯胺)、4,4’-磺酰基双(2-乙氧基苯胺)、4,4’-磺酰基双(2-氯苯胺)、5,5’-磺酰基双(2-胺基苯酚)、3,3’-二甲基-4,4’-二胺基二苯甲酮、3,3’-二甲氧基-4,4’-二胺基二苯甲酮、3,3’-二氯-4,4’-二胺基二苯甲酮、4,4’-二胺基联苯、间-苯二胺、对-苯二胺、4,4’-亚甲基二苯胺、4,4’-硫基二苯胺、4,4’-磺酰基二苯胺、4,4’-亚异丙基二苯胺、3,3’-二甲基联苯胺、3,3’-二甲氧基联苯胺、3,3’-二羧基联苯胺、2,4-甲苯基二胺、2,5-甲苯基二胺、2,6-甲苯基二胺、间-二甲苯基二胺、2,4-二胺基-5-氯甲苯、2,4-二胺基-6-氯甲苯等。较好为4,4’-氧基二苯胺(ODA)。Examples of diamines for preparing polyamic acid in the present invention include (but not limited to) aromatic diamines such as 4,4'-oxydiphenylamine (ODA), 5-amino-1-(4'-amino Phenyl)-1,3,3-trimethylindane, 6-amino-1-(4'-aminophenyl)-1,3,3-trimethylindane, 4,4'- Methylenebis(o-chloroaniline), 3,3'-dichlorodiphenylamine, 3,3'-sulfonyldiphenylamine, 4,4'-diaminobenzophenone, 1,5-diamine Naphthalene, bis(4-aminophenyl)diethylsilane, bis(4-aminophenyl)diphenylsilane, bis(4-aminophenyl)ethylphosphine oxide, N-(bis (4-aminophenyl))-N-methylamine, N-(bis(4-aminophenyl))-N-phenylamine, 4,4'-methylenebis(2-methyl Aniline), 4,4'-methylenebis(2-methoxyaniline), 5,5'-methylenebis(2-aminophenol), 4,4'-methylenebis(2- methylaniline), 4,4'-oxybis(2-methoxyaniline), 4,4'-oxybis(2-chloroaniline), 2,2'-bis(4-aminophenol) , 5,5'-oxybis(2-aminophenol), 4,4'-thiobis(2-methylaniline), 4,4'-thiobis(2-methoxyaniline), 4,4'-thiobis(2-chloroaniline), 4,4'-sulfonylbis(2-methylaniline), 4,4'-sulfonylbis(2-ethoxyaniline), 4, 4'-sulfonylbis(2-chloroaniline), 5,5'-sulfonylbis(2-aminophenol), 3,3'-dimethyl-4,4'-diaminobenzophenone , 3,3'-dimethoxy-4,4'-diaminobenzophenone, 3,3'-dichloro-4,4'-diaminobenzophenone, 4,4'- Diaminobiphenyl, m-phenylenediamine, p-phenylenediamine, 4,4'-methylenediphenylamine, 4,4'-thiodiphenylamine, 4,4'-sulfonyldiphenylamine, 4 , 4'-isopropylidene diphenylamine, 3,3'-dimethylbenzidine, 3,3'-dimethoxybenzidine, 3,3'-dicarboxybenzidine, 2,4-tolyl Diamine, 2,5-tolyldiamine, 2,6-tolyldiamine, m-xylylenediamine, 2,4-diamino-5-chlorotoluene, 2,4-diamino- 6-chlorotoluene, etc. Preferably it is 4,4'-oxydiphenylamine (ODA).
该二酸酐与二胺的反应可在非质子极性溶剂中进行,非质子极性溶剂的种类并无特别限制,只要不与反应物及产物反应即可。具体实例可举例如N,N-二甲基乙酰胺(DMAc)、N-甲基吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)、四氢呋喃(THF)、二恶烷、氯仿(CHCl3)、二氯甲烷等。其中较好使用1-甲基吡咯烷酮(NMP)及N,N-二甲基乙酰胺(DMAc)。The reaction of the dianhydride and diamine can be carried out in an aprotic polar solvent, and the type of the aprotic polar solvent is not particularly limited as long as it does not react with reactants and products. Specific examples can include, for example, N, N-dimethylacetamide (DMAc), N-methylpyrrolidone (NMP), N, N-dimethylformamide (DMF), tetrahydrofuran (THF), dioxane, chloroform (CHCl 3 ), dichloromethane, etc. Among them, 1-methylpyrrolidone (NMP) and N,N-dimethylacetamide (DMAc) are preferably used.
该二酸酐与二胺的反应一般在室温至70℃的温度范围内进行,且该芳族双胺及芳族双酐的比值介于0.5至2.0的范围,较好在0.75~1.25的范围。The reaction of the dianhydride and diamine is generally carried out at a temperature ranging from room temperature to 70° C., and the ratio of the aromatic diamine to aromatic dianhydride is in the range of 0.5 to 2.0, preferably in the range of 0.75 to 1.25.
依据本发明的方法,在二酸酐与二胺反应形成聚酰胺酸后,将聚酰胺酸树脂涂布或铸模等方法涂布在支撑体上,再移除其内所含的溶剂藉由控制聚酰胺酸内的挥发份含量在10重量%以下。随后利用覆卷机将涂布有聚酰胺酸的支撑物以涂覆树脂面朝内或朝外的方式,覆卷于覆卷机的钢管上,将张力控制于20kgf/cm2以下,随后松卷使各层间留有间隔,使热对流进入各层间而达到环化的目的。覆卷长度可高达150米,较好为20至120米的长度。According to the method of the present invention, after the dianhydride and diamine react to form polyamic acid, the polyamic acid resin is coated on the support by methods such as coating or casting, and then the solvent contained therein is removed by controlling the polyamic acid. The volatile matter content in the amic acid is 10% by weight or less. Then use a rewinding machine to wrap the support coated with polyamic acid on the steel pipe of the rewinding machine with the coated resin facing inward or outward, and control the tension below 20kgf/cm 2 , and then loosen it. The roll leaves a gap between the layers, allowing heat convection to enter the layers to achieve the purpose of cyclization. The wrap length can be up to 150 meters, preferably a length of 20 to 120 meters.
本发明方法中所用支撑物可使用例如Kapton、Upliex等聚酰亚胺薄膜、铜箔、铝箔、不锈钢箔、镍箔等金属箔,较通常使用铜箔。The support used in the method of the present invention can be metal foils such as polyimide films such as Kapton and Upliex, copper foil, aluminum foil, stainless steel foil, nickel foil, etc., and copper foil is more commonly used.
随后将松卷的卷绕物移至烘箱中,使烘箱温度梯度控制在100至380℃的范围,亦即自100℃起始,以1-2℃/分钟的升温速度逐渐升温至高达380℃后,予以冷却降温。自160至380℃的升温期间,可分别在数个特定温度停留数十分钟,例如先以160至180℃起始并停留例如约30分钟后,以2℃/分钟的升温速度逐渐升温至约210至230℃又停留例如约30分钟后,再以2℃/分钟的升温速度逐渐升温至约270至290℃又停留例如约30分钟,随后又以2℃/分钟的升温速度逐渐升温至约340至350℃又停留例如约30分钟,最后升温至高达370℃并停留约10分钟后,予以冷却。Then move the unrolled windings to the oven, so that the temperature gradient of the oven is controlled in the range of 100 to 380°C, that is, starting from 100°C, the temperature is gradually increased to as high as 380°C at a rate of 1-2°C/min Afterwards, cool it down. During the temperature rise from 160 to 380°C, you can stay at several specific temperatures for tens of minutes, for example, start at 160 to 180°C and stay for about 30 minutes, then gradually increase the temperature at a rate of 2°C/min to about After staying at 210 to 230°C for about 30 minutes, then gradually raising the temperature to about 270 to 290°C at a heating rate of 2°C/min and staying for about 30 minutes, and then gradually raising the temperature at a heating rate of 2°C/minute to about 340 to 350° C. for a further dwell of eg about 30 minutes, finally raised to 370° C. and held for about 10 minutes before being cooled.
本发明的环化过程中,亦可添加触媒例如三乙胺及乙酸酐等,以加速环化反应。当于环化过程中使用触媒时,所用的梯度温度可相对较低。In the cyclization process of the present invention, catalysts such as triethylamine and acetic anhydride may also be added to accelerate the cyclization reaction. When a catalyst is used in the cyclization process, the temperature gradient used can be relatively low.
当支撑物使用铜箔时,为避免铜箔氧化,较好在烘箱中加热环化的过程中,吹入惰性气体例如氮气,使烘箱内的氧气浓度保持在1.0体积%以下,较好0.5体积%以下,更好低于0.1体积%,可防止铜箔氧化变色。When copper foil is used as the support, in order to avoid copper foil oxidation, it is better to blow inert gas such as nitrogen in the process of heating and cyclization in the oven to keep the oxygen concentration in the oven below 1.0% by volume, preferably 0.5% by volume. % or less, preferably less than 0.1% by volume, it can prevent the copper foil from oxidative discoloration.
本发明方法中,为使卷绕物的各层间留有间隔以利热对流通过,亦可在卷绕期间每隔数米插入一平滑杆,在卷绕完成后再予以移除。In the method of the present invention, in order to leave a space between the layers of the winding to facilitate the passage of heat convection, a smooth rod can also be inserted every few meters during the winding, and removed after the winding is completed.
以下将以实施例及比较例进一步说明本发明,该等实施例及比较例中,挥发份的测量方法及环化率(酰亚胺化率)的测量方法如下:Below will further illustrate the present invention with embodiment and comparative example, in these embodiments and comparative example, the measuring method of volatile matter and the measuring method of cyclization rate (imidization rate) are as follows:
挥发份的测量方法Volatile content measurement method
取10公分×10公分的树脂金属箔样品精确称重为W1,将该样品置入220℃烘箱中历时20分钟后,取出精确称重为W2,并另对同样10公分×10公分的未涂布树脂的金属箔样品称重为W3。以下式计算挥发份%。Take a 10 cm × 10 cm resin metal foil sample and weigh it accurately as W1, place the sample in an oven at 220°C for 20 minutes, take it out and weigh it accurately as W2, and make another uncoated sample of the same 10 cm × 10 cm A metal foil sample of cloth resin is weighed as W3. Volatile % was calculated by the following formula.
挥发份(%)=(W1-W2)/(W1-W3)×100%Volatile matter (%)=(W1-W2)/(W1-W3)×100%
环化率(酰亚胺化率)的测量方法:Cyclization rate (imidization rate) measurement method:
以FTIR(傅里叶红外线光谱仪)测量树脂在温度T的1720cm-1与1500cm-1的吸收面积比值([面积(1720cm-1)/面积(1500cm-1)]T),随后以FTIR测量树脂在温度350℃历时1小时后的1720cm-1与1500cm-1的吸收面积比值([面积(1720cm-1)/面积(1500cm-1)]T1),以下式计算环化率(%):Use FTIR (Fourier Transform Infrared Spectrometer) to measure the absorption area ratio ([area (1720cm-1) /area (1500cm-1) ]T) of the resin at temperature T between 1720cm -1 and 1500cm - 1, and then use FTIR to measure the resin The absorption area ratio ([area (1720cm-1) /area (1500cm-1) ] T 1 ) of 1720cm - 1 to 1500cm-1 after 1 hour at a temperature of 350°C, the cyclization rate (%) is calculated by the following formula:
环化率(%)=[面积(1720cm-1)/面积(1500cm-1)]T/[面积(1720cm-1)/面积(1500cm-1)]T1×100%Cyclization rate (%)=[area (1720cm-1) /area (1500cm-1) ]T/[area (1720cm-1) /area (1500cm-1) ]T 1 ×100%
实施例1Example 1
使苯均四酸二酐(PMDA)与4,4’-氧基二苯胺(ODA)使用N-甲基吡咯烷酮(NMP)作为溶剂反应后获得固成分为15%的聚酰胺酸树脂,利用涂布机涂布于18微米厚、宽520毫米的铜箔上,利用热风或IR烘箱将NMP溶剂蒸除,测支撑物树脂的溶剂含量为3.2重量%,利用覆卷机将涂布有聚酰胺酸树脂的铜箔卷绕于钢管上,张力控制在20kgf/cm2以下,在卷绕同时每卷绕15米插入一平滑杆,共卷绕100米后,在最外圈以聚酰亚胺胶带固定后,移除该平滑杆使该铜箔松卷。随后移入通入氮气且控制氧气含量在0.1%以下的烘箱中,以下列的温度梯度进行加热环化反应。After pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) were reacted using N-methylpyrrolidone (NMP) as a solvent, a polyamic acid resin with a solid content of 15% was obtained. The fabric machine is coated on a copper foil with a thickness of 18 microns and a width of 520 mm. The NMP solvent is evaporated by hot air or an IR oven. The solvent content of the support resin is measured to be 3.2% by weight. The acid resin copper foil is wound on the steel pipe, the tension is controlled below 20kgf/ cm2 , and a smooth rod is inserted every 15 meters of winding while winding, and after a total of 100 meters of winding, the outermost ring is covered with polyimide After the tape is set, remove the smooth bar to unwind the copper foil. Then move it into an oven where nitrogen gas is fed and the oxygen content is controlled below 0.1%, and the heating and cyclization reaction is carried out with the following temperature gradient.
环化条件:Cyclization conditions:
1.180℃停留30分钟(以30分钟升温至220℃)1.Stay at 180°C for 30 minutes (heat up to 220°C in 30 minutes)
2.220℃停留30分钟(以30分钟升温至280℃)2.Stay at 220°C for 30 minutes (heat up to 280°C in 30 minutes)
3.280℃停留30分钟(以30分钟升温至350℃)3.Stay at 280°C for 30 minutes (heat up to 350°C in 30 minutes)
4.350℃停留30分钟(以10分钟升温至370℃)4. Stay at 350°C for 30 minutes (heat up to 370°C in 10 minutes)
5.370℃停留10分钟(冷却降温)5. Stay at 370°C for 10 minutes (cool down)
随后利用上述测量环化率的方法进行环化率测量并检查外观。结果如表1所示。Subsequently, the cyclization rate was measured using the method for measuring the cyclization rate described above and the appearance was checked. The results are shown in Table 1.
实施例2Example 2
使苯均四酸二酐(PMDA)与4,4’-氧基二苯胺(ODA)使用N-甲基吡咯烷酮(NMP)作为溶剂反应后获得固成分为15%的聚酰胺酸树脂,于该树脂中添加三乙胺及乙酸酐作为触媒,利用涂布机涂布于18微米厚、宽520毫米的铜箔上,利用热风或IR烘箱将NMP溶剂蒸除,测支撑物树脂的溶剂含量为5.3重量%,利用覆卷机将涂布有聚酰胺酸树脂的铜箔卷绕于钢管上,张力控制在20kgf/cm2以下,在卷绕同时每卷绕15米插入一平滑杆,共卷绕100米后,在最外圈以聚酰亚胺胶带固定后,移除该平滑杆使该铜箔松卷。随后移入通入氮气且控制氧气含量在0.1%以下的烘箱中,以下列的温度梯度进行加热环化反应。After pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) were reacted using N-methylpyrrolidone (NMP) as a solvent, a polyamic acid resin with a solid content of 15% was obtained. Add triethylamine and acetic anhydride to the resin as catalysts, use a coating machine to coat on a copper foil with a thickness of 18 microns and a width of 520 mm, and use hot air or an IR oven to evaporate the NMP solvent. The solvent content of the support resin is measured as 5.3% by weight, using a rewinding machine to wind the copper foil coated with polyamic acid resin on the steel pipe, the tension is controlled below 20kgf/ cm2 , and a smooth rod is inserted every 15 meters of winding while winding, and the coiling is done together. After winding for 100 meters, after the outermost circle is fixed with polyimide tape, remove the smooth bar to unwind the copper foil. Then move it into an oven where nitrogen gas is fed and the oxygen content is controlled below 0.1%, and the heating and cyclization reaction is carried out with the following temperature gradient.
环化条件:Cyclization conditions:
1.120℃停留30分钟(以30分钟升温至180℃)1.Stay at 120°C for 30 minutes (heat up to 180°C in 30 minutes)
2.180℃停留30分钟(以30分钟升温至250℃)2.Stay at 180°C for 30 minutes (heat up to 250°C in 30 minutes)
3.250℃停留30分钟(以30分钟升温至300℃)3.Stay at 250°C for 30 minutes (heat up to 300°C in 30 minutes)
4.300℃停留10分钟(冷却降温)4. Stay at 300°C for 10 minutes (cooling down)
随后利用上述测量环化率的方法进行环化率测量并检查外观。结果如表1所示。Subsequently, the cyclization rate was measured using the method for measuring the cyclization rate described above and the appearance was checked. The results are shown in Table 1.
实施例3及4Example 3 and 4
如同实施例1所述的条件进行,但树脂的挥发份含量于实施例3及实施例4中分别控制为3.3重量%及3.5重量%。所得结果示于表1。The same conditions as in Example 1 were carried out, but the volatile content of the resin was controlled to 3.3% by weight and 3.5% by weight in Example 3 and Example 4, respectively. The obtained results are shown in Table 1.
比较例1Comparative example 1
如同实施例1所述的条件进行,但树脂的挥发份含量控制在3.4重量%并利用40网目的铁网作为隔离物,所得结果示于下表1。The conditions were the same as those described in Example 1, but the volatile content of the resin was controlled at 3.4% by weight and a 40-mesh iron mesh was used as a separator. The results obtained are shown in Table 1 below.
比较例2Comparative example 2
如同实施例1所述的条件进行,但树脂的挥发份含量控制在3.7重量%并利用Upilex聚酰亚胺膜作为隔离物,所得结果示于下表1。The same conditions as in Example 1 were carried out, but the volatile content of the resin was controlled at 3.7% by weight and an Upilex polyimide film was used as a separator. The results obtained are shown in Table 1 below.
比较例3Comparative example 3
如同实施例1所述的条件进行,但树脂的挥发份含量控制在3.5重量%并利用Kapton聚酰亚胺膜作为隔离物,所得结果示于下表1。The same conditions as in Example 1 were carried out, but the volatile content of the resin was controlled at 3.5% by weight and Kapton polyimide film was used as a separator. The results obtained are shown in Table 1 below.
比较例4Comparative example 4
如同实施例1所述的条件进行,但树脂的挥发份含量控制在11重量%,所得结果示于下表1。The conditions were the same as those described in Example 1, but the volatile content of the resin was controlled at 11% by weight. The results obtained are shown in Table 1 below.
表1
由表1的数据显示,实施例1至4的本发明方法藉由控制树脂的挥发份含量在10重量%以下,同时未介由间隔物进行环化反应,可获得外观良好且无皱纹的聚酰亚胺薄膜。相反地,比较例1至3,虽树脂的溶剂含量亦控制在10重量%以下,但由于其在加热环化过程中利用如铁网或聚酰亚胺的间隔物,由于该等间隔物在加热过程中与铜箔间的热膨胀系数差异,导致环化所形成的聚酰亚胺树脂薄膜产生外观皱纹而不佳。又比较例4中,虽未介由间隔物,但由于树脂的溶剂含量高于10重量%,因此导致环化过程中,铜箔有树脂沾黏的现象因此外观亦不佳。As shown by the data in Table 1, the method of the present invention in Examples 1 to 4 controls the volatile content of the resin below 10% by weight, and does not carry out cyclization reaction through spacers at the same time, and can obtain a polymer with good appearance and no wrinkles. imide film. On the contrary, in Comparative Examples 1 to 3, although the solvent content of the resin is also controlled below 10% by weight, because it utilizes spacers such as iron mesh or polyimide in the heating and cyclization process, due to the spacers in the The difference in thermal expansion coefficient between the copper foil and the heating process causes the appearance of wrinkles of the polyimide resin film formed by cyclization, which is not good. In Comparative Example 4, although there is no spacer, since the solvent content of the resin is higher than 10% by weight, during the cyclization process, the copper foil has resin sticking phenomenon and the appearance is not good.
由上述数据可知,本发明的聚酰亚胺的新颖环化方法,可以高产率及高环化率获得无皱纹的外观良好且机械性质优异的聚酰亚胺树脂金属箔软膜。From the above data, it can be seen that the novel cyclization method of polyimide of the present invention can obtain a polyimide resin metal foil soft film with no wrinkles, good appearance and excellent mechanical properties with high yield and high cyclization rate.
Claims (9)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103145985A (en) * | 2012-12-09 | 2013-06-12 | 上海飞凯光电材料股份有限公司 | Preparation of polyimide resin and application in high-temperature-resistant optical fiber coatings thereof |
| CN103219067A (en) * | 2012-12-22 | 2013-07-24 | 西安交通大学 | An anisotropic conductive film based on carbon nanotube array and its preparation method |
| CN105665250A (en) * | 2016-01-28 | 2016-06-15 | 深圳市弘海电子材料技术有限公司 | Production line for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method |
| CN112689454A (en) * | 2020-12-23 | 2021-04-20 | 宁波今山新材料有限公司 | Method for manufacturing shielding material |
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| EP0474054B1 (en) * | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
| JPH06192419A (en) * | 1992-12-25 | 1994-07-12 | Shin Etsu Chem Co Ltd | Production of polyimide film |
| JP3523952B2 (en) * | 1995-12-26 | 2004-04-26 | 日東電工株式会社 | Polyimide-metal foil composite film |
| TW526223B (en) * | 1999-10-18 | 2003-04-01 | Nippon Mektron Kk | Novel polyimide copolymer and metal laminate using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103145985A (en) * | 2012-12-09 | 2013-06-12 | 上海飞凯光电材料股份有限公司 | Preparation of polyimide resin and application in high-temperature-resistant optical fiber coatings thereof |
| CN103219067A (en) * | 2012-12-22 | 2013-07-24 | 西安交通大学 | An anisotropic conductive film based on carbon nanotube array and its preparation method |
| CN105665250A (en) * | 2016-01-28 | 2016-06-15 | 深圳市弘海电子材料技术有限公司 | Production line for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method |
| CN105665250B (en) * | 2016-01-28 | 2018-11-23 | 深圳市弘海电子材料技术有限公司 | Two layers of method prepares the flexible production line without glue polyimide copper clad lamination |
| CN112689454A (en) * | 2020-12-23 | 2021-04-20 | 宁波今山新材料有限公司 | Method for manufacturing shielding material |
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