CN1778025A - Surge absorber and production method therefor - Google Patents

Abstract

The present invention provides a surge absorber comprising an insulating member on the peripheral surface of which a conductive film is dividedly formed via a discharge gap, a pair of terminal electrodes disposed opposite to this insulating member and in contact with the conductive film, and an insulating tube having the pair of electrodes disposed at the opposite ends thereof to seal the insulating member along with a sealing gas thereinside, wherein a conductive unit is provided at least between the end face of the conductive film and a terminal electrode. Consequently, a surge absorber having stable performance and quality and an excellent durability can be provided at low costs.

Description

Surge absorber and manufacturing method thereof

technical field

The present invention relates to a surge absorber used to protect various equipment impacted by surges and prevent accidents before they happen.

Background technique

In order to prevent damage caused by thermal damage or ignition of electronic equipment or printed circuit boards mounted on the equipment due to abnormal voltage, electronic equipment and communication equipment used in communication equipment such as telephones, fax machines, modems, etc. Connect a surge absorber to the connection part of the line, or the part where the power line, antenna or CRT drive circuit, etc., abnormal current (surge current) or abnormal voltage (surge voltage) caused by lightning surge or static electricity, etc. will cause electric shock.

Hitherto, there has been proposed, for example, a discharge type surge absorber as described in JP-A-9-171881, in which: an element arranged in a glass tube with terminal electrodes provided at both ends; A pair of Dumet wires of the terminal electrode, one end of which is connected to the lead wire used to connect to the external circuit; a cylindrical one that is connected externally to each Dumet wire and internally connected to both ends of the glass tube to seal the two ends of the glass tube liner. At this time, since the contact between the Dumet wire and the terminal electrode is not stable, the discharge start voltage tends to fluctuate. In addition, since the area of the terminal electrode is large, material cost increases, which is also disadvantageous in terms of cost.

In addition, with the miniaturization of electronic equipment, discharge type surge absorbers are also being surface-mounted. The surface mount type (MELF type) surge absorber has terminal electrodes without leads, and when mounting on a board, the terminal electrodes are soldered to the board. In such a surge absorber, for example, a surge absorbing element having a micro gap as shown in JP-A-2002-110311 and JP-A-2002-134247 is used, and the structure of such a surge absorber is shown in Figure 10.

The structure of the surge absorbing element 1 is that a so-called micro-gap M is formed at the center of the surface of a cylindrical ceramic member (insulating member) 3 surrounded by a conductive film 2, and a so-called micro gap M is formed at both ends of the ceramic member 3. 4 on the cap electrode. The surge absorbing element 1 is housed in the glass tube 5 together with the sealing gas, and the two ends of the glass tube 5 are heated and sealed with a pair of opposing terminal electrodes 6 to form a discharge type surge absorber.

However, in recent years, surge absorbers have been required to provide products with high durability and high surge capacity in addition to low-cost, stable performance and quality. Therefore, the dimensional accuracy of the surge absorbing element, the glass tube, and the terminal electrodes becomes a problem. In particular, it is an important technical issue to ensure reliable contact between the surge absorbing element and the sealing electrode without creating a gap.

In addition, in recent years, even for applications requiring high surge capacity, such as communication lines and power lines, surge absorbers have been required to have performance that can sufficiently cope. Also, in the MELF type surge absorber, the glass tube may be damaged during installation. Therefore, it was considered to replace the glass tube with a ceramic tube. In a surge absorber using a glass tube, ceramic components are placed in the glass tube, and terminal electrodes are installed at both ends of the glass tube, and the glass tube is sealed by melting the glass tube in a high-temperature furnace and tightly fixing it to the terminal electrodes. Tube. When the sealed glass tube is cooled, residual stress in the direction of compression occurs due to the difference in thermal expansion coefficient between the glass tube and the ceramic member, and sufficient ohmic contact can be obtained between the terminal electrode and the conductive film of the ceramic member.

However, in the case of using a ceramic tube instead of a glass tube, since the difference in thermal expansion coefficient between the ceramic tube and the ceramic member is smaller than the above case, the residual stress generated during cooling is small, and there is an ohmic gap between the terminal electrode and the conductive coating of the ceramic member. Insufficient contact, in this case, electrical characteristics such as discharge start voltage become unstable.

The present invention was conceived in view of the above circumstances, and an object of the present invention is to provide a surge absorber having stable performance and quality, excellent durability, and high surge capacity at low cost.

Contents of the invention

In the present invention, in order to solve the above-mentioned problems, the following configurations are adopted.

The surge absorber of the present invention is characterized in that it is provided with: an insulating member formed by dividing a conductive coating film with a discharge gap in between; a pair of conductive coating films in contact with the insulating member. terminal electrodes; and an insulating tube in which the insulating member is sealed together with a sealing gas by arranging the pair of terminal electrodes at both ends; and a conductive portion is provided at least between the conductive film and the terminal electrodes.

For example, the surge absorber of the present invention is characterized in that it is a surge absorber provided with the following members: a columnar insulating member formed by dividing a conductive film with a discharge gap in between on the peripheral surface; A pair of terminal electrodes at both ends of the conductive member facing the above-mentioned conductive film; and an insulating tube that seals the above-mentioned insulating member and sealing gas inside; contains a conductive filling material as the above-mentioned conductive part to be buried A gap between the above-mentioned conductive film and the above-mentioned terminal electrode.

In this surge absorber, a gap generated on the contact surface between the terminal electrode and the conductive coating due to dimensional accuracy, flaws, and deformation during processing is filled with a conductive filling material. Thereby, sufficient ohmic contact between the terminal electrode and the conductive film can be obtained, and electrical characteristics such as the discharge start voltage of the surge absorber can be stabilized.

In addition, the surge absorber of the present invention is characterized in that the following members are provided: a columnar insulating member formed by dividing the conductive film with the above-mentioned discharge gap interposed on the peripheral surface; A pair of terminal electrodes facing the above-mentioned conductive film; and an insulating tube sealing the inside of the above-mentioned insulating member together with the sealing gas; a metal member is provided between the above-mentioned conductive film and the above-mentioned terminal electrodes, and the The conductive filling material of the conductive portion fills the gap between the metal member and the terminal electrode.

In this surge absorber, a gap generated on the contact surface between the terminal electrode and the metal member due to dimensional accuracy, flaws, deformation during processing, and the like is filled with a conductive filling material. Therefore, sufficient ohmic contact between the terminal electrode and the metal member can be obtained, and electrical characteristics such as the discharge start voltage of the surge absorber can be stabilized.

In addition, in this surge absorber, it is preferable to form an oxide film by oxidation treatment on the main discharge surface which is the mutually opposing surfaces of the pair of metal members.

In this surge absorber, the abnormal current and abnormal voltage such as an electrical surge intruding from the outside are triggered by the discharge of the micro gap, and the main discharge is performed between the main discharge surfaces of the pair of metal members facing each other. to absorb the surge. Here, by forming an oxide film on the main discharge surface, a main discharge surface having excellent chemical stability in a high temperature region can be obtained. In addition, it prevents the electrode components on the main discharge surface from scattering and adhering to the micro-gap and the inner wall of the insulating tube during the main discharge, so that the life of the surge absorber can be extended. In addition, since the oxide film has excellent adhesion to the main discharge surface, the above-mentioned characteristics can be reliably exhibited. Furthermore, since it is not necessary to use an expensive metal having excellent chemical stability in a high-temperature region as the metal member, an inexpensive metal can be used as the material of the metal member.

In addition, in this surge absorber, it is preferable that the average film thickness of the above-mentioned oxide film is 0.01 μm or more.

In this surge absorber, since the average film thickness of the oxide film is 0.01 μm or more, it is possible to sufficiently suppress the scattering of the electrode components of the metal member due to the main discharge.

In addition, in this surge absorber, it is preferable that a holding portion for holding the insulating member is provided, which is formed to protrude from the terminal electrode toward the inside of the insulating tube in the axial direction.

In this surge absorber, since the holding member is used for holding, the insulating member is reliably arranged near the center and the peripheral portion of the terminal electrode. As a result, the discharge start voltage is stabilized, the insulating member is prevented from shifting to the end portion side of the terminal electrode, and the life of the surge absorber can be extended.

In addition, in this surge absorber, the pressure of the sealing gas is preferably a negative pressure.

In this surge absorber, since the pressure of the sealing gas is a negative pressure, when the sealed insulating tube is cooled, a force in the direction of compression is generated on the terminal electrodes due to the action of atmospheric pressure higher than the pressure of the sealing gas. By bringing the conductive film into contact with the terminal electrode by the force in the compressive direction, more reliable ohmic contact can be obtained.

In addition, the surge absorber of the present invention is characterized in that the following members are provided: a columnar insulating member formed by dividing a conductive film with a discharge gap in between on the peripheral surface; A pair of terminal electrodes facing each other with conductive coatings; and an insulating tube in which the pair of terminal electrodes are arranged at both ends by soldering, and the above-mentioned insulating member is sealed inside together with a sealing gas; conductive bonding as a conductive part The above-mentioned conductive film and the above-mentioned terminal electrodes are bonded together with an agent.

In this surge absorber, by bonding the terminal electrode and the conductive coating with a conductive adhesive, sufficient ohmic contact between the terminal electrode and the conductive coating can be obtained, so that the electrical characteristics such as the discharge start voltage of the surge absorber Stablize. In addition, by fixing the insulating member to the vicinity of the center and the periphery of the terminal electrode, the discharge start voltage can be stabilized and the life of the surge absorber can be extended.

In addition, the surge absorber of the present invention is characterized in that the following members are provided: a columnar insulating member formed by dividing a conductive film with a discharge gap in between on the peripheral surface; A pair of terminal electrodes facing the conductive film; and an insulating tube in which the pair of terminal electrodes are arranged at both ends by soldering, and the insulating member and the sealing gas are sealed inside; the conductive film and the above-mentioned A metal member is provided between the terminal electrodes, and the metal member and the terminal electrodes are bonded together with a conductive adhesive as the conductive portion.

In this surge absorber, by adhering the terminal electrode and the metal member with a conductive adhesive, sufficient ohmic contact between the terminal electrode and the metal member can be obtained, and electrical characteristics such as the discharge start voltage of the surge absorber can be stabilized. In addition, by fixing the insulating member to the vicinity of the center and the periphery of the terminal electrode, the discharge start voltage can be stabilized and the life of the surge absorber can be extended.

In addition, in this surge absorber, it is preferable to form an oxide film produced by oxidation treatment on the main discharge surface which is the mutually opposing surfaces of the pair of metal members.

In this surge absorber, abnormal currents and abnormal voltages such as electrical surges intruding from the outside are triggered by the discharge at the micro gap, and the main discharge surface is between the opposing surfaces of a pair of metal members, that is, the main discharge surface. discharge while absorbing the surge. Here, since an oxide film is formed on the main discharge surface, a main discharge surface having good chemical stability in a high temperature region can be obtained. Therefore, during the main discharge, the electrode components on the main discharge surface are prevented from scattering and adhering to the micro-gap and the inner wall of the insulating tube, thereby achieving a longer life of the surge absorber. In addition, since the oxide film has good adhesion to the main discharge surface, the above-mentioned characteristics can be reliably exhibited. Furthermore, since it is not necessary to use an expensive metal having good chemical stability in a high-temperature region as the metal member, an inexpensive metal can be used as the material of the metal member.

In addition, in this surge absorber, it is preferable that the average film thickness of the above-mentioned oxide film is 0.01 μm or more.

In this surge absorber, since the average film thickness of the oxide film is set to be 0.01 μm or more, scattering of electrode components of metal members due to main discharge can be sufficiently suppressed.

In addition, in this surge absorber, it is preferable that the above-mentioned solder and the above-mentioned adhesive are formed of different materials.

In this surge absorber, since the solder and the adhesive are made of different materials, the bonding between the terminal electrode and the conductive film, the bonding between the terminal electrode and a metal member, or the bonding between the terminal electrode and an insulating tube , the material with the most suitable bonding strength can be selected.

In addition, it is preferable that the surge absorber is provided with a holding member protruding from the terminal electrode toward the inside of the insulating tube in the axial direction and holding the insulating member.

In this surge absorber, the insulating member is held by the holding member so that it is securely arranged near the center and the peripheral portion of the terminal electrode. As a result, the discharge start voltage is stabilized, the insulating member is prevented from shifting to the end portion side of the terminal electrode, and the life of the surge absorber is prolonged.

In addition, it is preferable that the holding member is formed of the same material as the solder but different from the adhesive.

Alternatively, it is preferable that the holding member is formed of the same material as the adhesive but different from the solder.

In this surge absorber, by forming the holding member and the solder or adhesive from the same material, the number of parts can be reduced and the surge absorber can be easily manufactured.

Alternatively, the above-mentioned holding member is preferably formed of a material different from the above-mentioned adhesive and the above-mentioned solder.

In this surge absorber, since the holding member is made of a material that is difficult to wet the conductive coating, metal member, terminal electrode, adhesive, and solder, when cooling the sealed insulating tube, the bulging height of the holding member increased. Therefore, the insulating member can be fixed more stably.

In addition, in this surge absorber, the pressure of the sealing gas is preferably a negative pressure.

In this surge absorber, since the pressure of the sealing gas is a negative pressure, when the sealed insulating tube is cooled, a force in the direction of compression is generated on the terminal electrodes by the atmosphere higher than the pressure of the sealing gas. By bringing the conductive film into contact with the terminal electrode with the force in the direction of compression, more reliable ohmic contact can be obtained.

In addition, the surge absorber of the present invention is characterized in that it is provided with: a columnar or plate-shaped insulating member formed by dividing a conductive film with a discharge gap in between on the peripheral surface; A pair of terminal electrodes whose ends face the conductive coating; and an insulating tube in which the insulating member and the sealing gas are sealed inside by arranging the pair of terminal electrodes at both ends; A conductive buffer member is provided between the electrodes as the above-mentioned conductive portion.

According to this surge absorber, a conductive cushioning member is provided between the end surface of the conductive film and the terminal electrode, and the dimensional tolerance can be absorbed by compressing the cushioning member, so that the end surface of the conductive film and the terminal electrode can be reliably connected through the cushioning material. . Therefore, a high-quality surge absorber having stable discharge performance and capable of reliably passing a surge current between the conductive film and the terminal electrodes can be manufactured at low cost without strict dimensional tolerance management.

The arrangement of the buffer member described above is particularly suitable for a surge absorber in which terminal electrodes are bonded to both end surfaces of an insulating tube.

In addition, any of metal plate or metal foil, foamed metal, fiber metal, or solder can be used as the above-mentioned cushioning member.

In addition, it is preferable that protrusions for holding the outer peripheral surfaces at both ends of the insulating member are provided on the cushioning member.

Since the insulating member is securely fixed by providing bumps on the buffer member to hold the outer peripheral surfaces at both ends of the insulating member, surge absorption with a stable discharge start voltage can be obtained even in a use environment affected by vibrations, for example. device.

In addition, the manufacturing method of the surge absorber is characterized in that the following members are provided: a columnar or plate-shaped insulating member formed by dividing a conductive film with a discharge gap in between on the peripheral surface; A pair of terminal electrodes facing the above-mentioned conductive film on both end surfaces; and an insulating tube in which the above-mentioned insulating member is sealed inside together with the sealing gas by arranging the above-mentioned pair of terminal electrodes at both ends; after inserting the above-mentioned insulating tube The buffer member is provided between the end surface of the inner conductive film and the terminal electrode, and the terminal electrode is bonded to both ends of the insulating tube.

According to the manufacturing method of the surge absorber, the buffer member is compressed by being pressed by the terminal electrodes, absorbs dimensional tolerances, and securely connects the end surface of the conductive film and the terminal electrodes through the buffer material. Therefore, a high-quality surge absorber with stable discharge performance that reliably flows a surge current between the end surface of the conductive film and the terminal electrode can be manufactured at low cost without strict dimensional tolerance management.

A brief description of the drawings

Fig. 1(A) is a sectional view showing a surge absorber according to a first embodiment of the present invention.

Fig. 1(B) is a cross-sectional view showing a first modified example of the surge absorber of the first embodiment of the present invention.

Fig. 1(C) is a cross-sectional view showing a second modified example of the surge absorber of the first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the surge absorber shown in FIG. 1A.

Fig. 3A is a perspective view showing a surge absorbing element in a surge absorber according to a second embodiment of the present invention.

FIG. 3B is a partial cross-sectional view of FIG. 3A.

Fig. 4 is a sectional view showing a surge absorber according to a third embodiment of the present invention.

Fig. 5A is a sectional view showing a surge absorber according to a fourth embodiment of the present invention.

FIG. 5B is an enlarged view of a contact portion between the terminal electrode and the cylindrical ceramic in FIG. 5A .

Fig. 6 is a cross-sectional view of an example of the surge absorber of the present invention mounted on a substrate.

Fig. 7A is a cross-sectional view showing a surge absorber according to a fifth embodiment of the present invention.

Fig. 7B is an enlarged view of a contact portion between the terminal electrode and the cylindrical ceramic in Fig. 7A.

Fig. 8A is a sectional view showing a surge absorber according to a sixth embodiment of the present invention.

Fig. 8B is an enlarged view of a contact portion between the terminal electrode and the cylindrical ceramic in Fig. 8A.

Fig. 9A is a sectional view showing a surge absorber according to a seventh embodiment of the present invention.

Fig. 9B is an enlarged view of a contact portion between the terminal electrode and the cylindrical ceramic in Fig. 9A.

Fig. 10 is a sectional view of an example of a conventional surge absorber.

Best Embodiment of the Invention

A first embodiment of the surge absorber and its manufacturing method of the present invention will be described below with reference to FIGS. 1A and 2 . Furthermore, FIG. 1A is a sectional view of the surge absorber, and FIG. 2 is an exploded perspective view of FIG. 1A.

The surge absorber 10 of this embodiment is a discharge-type surge absorber using a so-called micro-gap. The surge absorber 11 is accommodated together with the sealing gas in a cylindrical ceramic (insulating tube) 15, and the insulating tube Terminal electrodes 16 are respectively bonded to the end faces 15a at both ends of 15 to seal the cylindrical ceramic 15.

The cylindrical ceramic 15 is formed by molding an insulating member such as ceramics or lead glass into a hollow quadrangular prism shape. In the hollow portion 15 b of the cylindrical ceramic 15 , a surge absorbing element 11 to be described later is accommodated together with a sealing gas G, and both ends 15 a of the cylindrical ceramic 15 are sealed by a pair of terminal electrodes 16 . That is, the hollow portion 15b is configured as an airtight chamber in which the surge absorbing element 11 and the sealing gas G are enclosed.

In addition, Ni (nickel) is electroplated on both end surfaces 15a of the cylindrical ceramic 15, for example, after metallization of Mo (molybdenum)-Mn (manganese). Furthermore, the metallization of both ends 15a is not limited to Mo (molybdenum)-Mn (manganese), for example, Mo-W (tungsten), Ag (silver), Cu (copper), Au (gold) etc. can also be used, And it can be nickel-plated. Alternatively, active silver solder or glass can be used instead to form the metallization layer on the end faces 15a.

Here, examples of insulating members that can be used for the cylindrical ceramic 15 include: Al ₂ O ₃ (aluminum oxide), ZrO ₂ (zirconia), glass ceramics, Si ₃ N ₄ (silicon nitride), AlN (aluminum nitride), SiC (silicon carbide) and other insulating ceramics.

In addition, the sealing gas used may contain air as long as it is a gas ionized at high temperature, but in consideration of stability at high temperature, it is preferable to use, for example, He (helium), Ar (argon), Ne ( Neon), Xe (xenon), SF ₆ , CO ₂ (carbon dioxide), C ₃ F ₈ , C ₂ F ₆ , CF ₄ , H ₂ (hydrogen), etc., or a mixed gas of two or more.

The surge absorbing element 11 has a structure in which a cylindrical ceramic (insulating member) 13 is fully covered with a conductive film 12 of a thin film such as Ti (titanium), and a micro gap M as a discharge gap is formed on the peripheral surface.

The micro-gap M is a portion where the cylindrical ceramic 13 is exposed on the peripheral surface by removing the conductive film 12 in the vicinity of the axial center of the cylindrical ceramic 13 in the circumferential direction. As a result, the conductive film 12 is divided into two by the micro-gap, and becomes an electrically insulating state. Such discharge gaps M can be formed by methods such as laser cutting, mechanical cutting, or etching. In addition, about 1 to 100 discharge gaps M are formed with a width of about 0.01 to 1.5 mm.

The cylindrical ceramics 13 are, for example, insulating ceramics made of mullite sintered body, etc. In addition, Al ₂ O ₃ (aluminum oxide), ZrO ₂ (zirconia), glass ceramics, Si ₃ Insulating ceramics such as N ₄ (silicon nitride), AlN (aluminum nitride), and SiC (silicon carbide).

In addition, in forming the conductive film 12, a physical vapor deposition (PVD) method or a chemical vapor deposition (CVD) method can be used. In addition, in addition to the above-mentioned Ti film, for example: SnO ₂ (tin oxide), TiCN (titanium carbonitride), Ag (silver), Ag (silver)/Pd (palladium), Al (aluminum), Ni (nickel), Cu (copper), TiN (titanium nitride), Ta (tantalum), W (tungsten), SiC (silicon carbide), BaAl, C (carbon), Ag (silver)/Pt (platinum), Conductive film 12 such as TiO ₂ (titanium oxide), TiC (titanium carbide), or the like.

After the surge absorbing element 11 having the above-mentioned structure is inserted into the hollow portion 15b of the cylindrical ceramic 15, the terminal electrodes 16 are bonded to both end faces 15a to seal together with the sealing gas. A conductive buffer member (conductive portion) 17 is provided between the end surface 11 a of 11 and the terminal electrode 16 . Since the cushioning member 17 is a member including a fixing material, a support material, and an easily deformable material, they will be collectively referred to as a "buffering member" in the following description.

As the electrode material constituting the terminal electrode 16 , Cu (copper), Cu (copper)-based, and Ni (nickel)-based alloy materials, etc. can be used other than Kovar (registered trademark), for example. This terminal electrode 16 is connected to a surge protection circuit or the like. Furthermore, the sealing of the terminal electrode 16 can be made of solder, glass, or the like.

The buffer member 17 is a conductive member having moderate elasticity, and for example, any of metal plate or metal foil, foamed metal, fiber metal, or solder may be used.

Here, specific examples of the metal plate or metal foil include Ag (silver), Cu (copper), Al (aluminum), Au (gold), Ni (nickel), Pd (palladium), and Sb (antimony). , Zn (zinc), In (indium), Sn (tin), Pb (lead), Bi (bismuth), Ti (titanium), stainless steel materials, and alloys containing two or more of the above metals.

In addition, the foamed metal is a metal in a porous state, and may be a metal having a property of being compressed and deformed by the cylindrical ceramic 13 forming the micro gap M when the cylindrical ceramic 15 and the terminal electrode 16 are bonded. As specific foam metals, Ni (nickel), Cu (copper), Al (aluminum), Mg (magnesium), Co (cobalt), W (tungsten), Mn (manganese), Cr (chromium), Be (beryllium), Ti (titanium), Au (gold), Ag (silver), Fe (iron), stainless steel, carbon steel, Fe (iron) alloy, Ni (nickel alloy), etc. Metals used on metal plates or metal foils or alloys of two or more types are foamed metals.

In addition, fiber metal is a structure in which filamentary metal is woven so as to have cushioning properties. When bonding cylindrical ceramics 15 and terminal electrodes 16, a cylindrical ceramic 13 that forms a micro-gap M may be pressed. Metals of tight and deformable nature. As specific fiber metals, fiber metals such as Ti (titanium), Al (aluminum), C (carbon), and stainless steel are known, and metals or two or more types of metals used on the above-mentioned metal plates or metal foils can also be used. alloys of fiber metals.

In addition, suitable solders for the buffer member 17 include, for example, Ag (silver)-Cu (copper), Ag (silver)-Cu (copper)-In (indium), Ag (silver)-Cu (copper)-Sn (tin) etc.

In the surge absorber 10 having the above-mentioned structure, since the end surface 11a of the surge absorbing element 11 and the terminal electrode 16 are sealed in a state where the buffer member 17 is compressed, there is no gap, and reliable contact can be made to conduct electricity. . That is, since the dimensional error between the surge absorbing element 11 and the cylindrical ceramic 15 can be absorbed by the deformation of the buffer member 17, no gap is generated between the end surface 11a on which the conductive film 12 is formed and the terminal electrode 16.

Therefore, stable discharge performance with little variation among products can be obtained, and a high-quality surge absorber 10 in terms of durability and reliability can be produced. In addition, since the dimensional tolerances of the surge absorbing element 11 and the cylindrical ceramic 15 are relaxed, an effect of reducing manufacturing costs can be obtained.

In addition, in the above-mentioned embodiment shown in FIG. 1A, the surge absorbing element 11 and the buffer member 17 are in direct contact with each other. However, the first modification shown in FIG. 1B or the structure shown in FIG. 1C can also be made. The structure of the second modified example.

In surge absorber 10 ′ according to the first modified example shown in FIG. 1B , buffer member 17 expands in the peripheral direction and is provided so as to be sandwiched between end surface 15 a of cylindrical ceramic 15 and terminal electrode 16 .

In the surge absorber 10'' of the second modified example shown in FIG. 1C, cap electrodes 18 are press-fitted into both ends of the surge absorbing element 11 in the first modified example described above.

Hereinafter, a second embodiment having the above-mentioned cushioning member 17 will be described with reference to FIG. 3 . In addition, the same part as the said embodiment is attached|subjected with the same code|symbol, and the detailed description is abbreviate|omitted.

In the present embodiment, buffer members 17A are integrally provided on both end faces of the surge absorbing element 11A instead of a separate buffer member 17 . This cushioning member 17A is a structure in which both end surfaces of the surge absorbing element 11A manufactured in the same manner as in the above-mentioned embodiment are bonded or the like to be integrated.

At this time, the surge absorber 11A is inserted into the hollow portion 15b of the cylindrical ceramic 15, and since the number of individual components is reduced, the group device of the surge absorber 10 sealed with the terminal electrode 16 together with the sealing gas G Homework made easy.

In addition, due to the presence of the buffer member 17A, the contact with the terminal electrode becomes reliable, and a stable discharge start voltage can be obtained.

Next, a third embodiment in which the above-mentioned cushioning member 17 is provided will be described with reference to FIG. 4 . In addition, the same part as the said embodiment is attached|subjected with the same code|symbol, and the detailed description is abbreviate|omitted.

In this embodiment, the cap electrodes 18 are press-fitted on both ends of the surge absorbing element 11 . Also, a buffer member 17B is provided between the cap electrode 18 and the terminal electrode 16 . Protrusions 19 having a height h are provided on this buffer member 17B so as to hold the outer peripheral surfaces of the cap electrodes 18 at both ends of the surge absorbing element 11 . That is, both end portions of the surge absorbing element 11 (in this case, the cap electrodes 18 ) are held so as to be embedded in the buffer member 17B of the raised portion 19 formed by melting. In addition, the height of the raised portion 19 is a dimension from the end surface of the terminal electrode 16 to the uppermost portion of the raised portion.

In addition, if solder is used as buffer material 17B, both end surfaces 15a of cylindrical member 15 and terminal electrodes 16 can be sealed while maintaining the surge absorbing element. Furthermore, when using the surge absorbing element 11 without the cap electrode 18 (see FIG. 1A and FIG. 1B ), it is also possible to provide the raised portion 19 with a height h to maintain the outer peripheral surfaces at both ends.

In this way, if the structure in which both ends of the surge absorbing element 11 are held by the raised portions 19, the surge absorbing element can be securely fixed in addition to the function as the above-mentioned cushioning material. Thus, since the surge absorbing element 11 and the terminal electrode 16 are reliably and stably contacted through the buffer material, the discharge start voltage is stabilized.

In addition, since the protrusion having a height h of at least 0.01 mm or more is provided, it has been confirmed by experiments that the surge absorbing element can be securely fixed even in a vibration-generating use environment.

In the surge absorber 10 described so far, the cylindrical ceramic 15 is a cylindrical square prism, but the present invention is not limited thereto, and may be a cylindrical column, a triangular prism, or a polygonal prism, for example. In addition, the surge absorbing element 11 based on the cylindrical ceramics 13 is not limited to the cylindrical shape, and may be various columnar shapes such as quadrangular prisms, plate shapes, etc., or may be formed together with the shape of the cylindrical ceramics 15. Choose appropriately.

Furthermore, the structure of the present invention is not limited to the above-mentioned embodiments. For example, a buffer member is provided between the cap electrode and the terminal electrode that are press-molded at both ends of the surge absorbing element, within the scope that does not exceed the gist of the present invention. , can be changed appropriately.

Hereinafter, a fourth embodiment of the surge absorber of the present invention will be described with reference to FIGS. 5A and 5B.

The surge absorber 21 of this embodiment is a discharge-type surge absorber using a micro-gap, which is provided with a cylindrical ceramic ( insulating member) 24; at both ends of the cylindrical ceramic 24, a pair of terminal electrodes 25 in contact with the oppositely arranged conductive film 23; and the pair of terminal electrodes are arranged at both ends, and the cylindrical ceramic 24 is The composition of the cylindrical ceramic (insulating tube) 27 sealed inside with a sealing gas 26 such as Ar (argon) is adjusted in order to obtain desired electrical characteristics.

The cylindrical ceramics 24 are formed of an insulating ceramic material such as a mullite sintered body, and TiN (titanium nitride) produced by a thin film formation technique such as a physical vapor deposition (PVD) method or a chemical vapor deposition (CVD) method is formed on the surface. ) etc. as a conductive film.

Discharge gaps 22 with a width of 0.01 to 1.5 mm and a number of 1 to 100 discharge gaps 22 are formed by laser cutting, mechanical cutting, etching, etc., and in this embodiment, one discharge gap 22 of 150 μm is formed.

The pair of terminal electrodes 25 are formed of a metal such as Kovar (registered trademark), which is an alloy of Fe (iron), Ni (nickel), and Co (cobalt).

The pair of terminal electrodes 25 have outer edge portions 25A connected to the end faces 27A of the cylindrical ceramics 27, and silver-containing solder 28 is applied to one surface thereof.

The solder 28 includes: a filling portion (filling material) 210 as a conductive portion filling the gap 29 formed on the contact surface between the pair of terminal electrodes 25 and the end surface 24a of the cylindrical ceramic 24; The holding part (holding member) 211 holding the outer peripheral surface of the cylindrical ceramics 24 is held at both ends. This gap 29 is a gap formed between the pair of terminal electrodes 25 and the columnar ceramic 24 due to unevenness caused by dimensional accuracy, scratches, deformation during processing, and the like.

The holding portion 211 is formed by a bump, and is used to cover the outer peripheral surface of the cylindrical ceramic with the solder 28 when the terminal electrode 25 is in contact with the cylindrical ceramic 24 .

The height h of the bulge of the holding portion 211 is the dimension from the end surface of the terminal electrode 25 to the uppermost portion of the bulge, and since the uppermost portion forms the main discharge portion, it is defined based on predetermined life characteristics.

The cylindrical ceramic 27 has a rectangular cross-section, and the external dimensions of both end surfaces coincide with the outer peripheral dimensions of the terminal electrodes 25 . The cylindrical ceramic 27 is made of insulating ceramic such as Al ₂ O ₃ (aluminum oxide), and is formed by electroplating Ni (nickel) after performing a metallization treatment such as Mo (molybdenum)-W (tungsten) on both end surfaces. metallization layer.

Hereinafter, a method of manufacturing the sheet-type surge absorber 21 of the present embodiment having the above-mentioned structure will be described.

First, on one side of the terminal electrode 25 , a sufficient amount of solder 28 is applied to form the holding portion 211 , and the cylindrical ceramic 24 is placed on the central region of the terminal electrode and the terminal electrode 25 is brought into contact with the cylindrical ceramic 24 . Then, the end surface of the cylindrical ceramic 27 is placed on the outer edge portion 25A.

In addition, solder 28 is provided on the other end surface of the cylindrical ceramic 27, and the other terminal electrode 25 is placed thereon as a temporarily bonded state.

Next, the sealing step of sealing the cylindrical ceramic 24 together with Ar gas by the pair of terminal electrodes 25 and the cylindrical ceramic 27 will be described.

The elements in the temporarily bonded state as described above are heat-treated in an Ar (argon) atmosphere to melt the solder to bond the terminal electrode 25 and the cylindrical electrode ceramic 27 . At this time, the solder 28 is melted to fill the filled portion 210 , that is, the gap 29 existing between the end surface 24 a of the cylindrical ceramic 24 and the terminal electrode 25 . Moreover, the holding part 211 formed by the surface tension of the solder 28 embeds and holds both end parts of the columnar ceramics 24 .

Here, the pressure of the sealing gas 26 is set within a range of 1 Torr to 600 Torr in the cooling step. Therefore, in the cooling step, a force in the compression direction is generated on the terminal electrode 25 .

Thereafter, the sheet-type surge absorber 21 is manufactured by Ni (nickel) and Sn (tin) plating.

The surge absorber 21 manufactured in this way is shown in the example of FIG. The outside of the terminal electrode 25 can be used.

According to this surge absorber 21, solder used as a conductive filling material fills the gap formed on the contact surface between the terminal electrode 25 and the end surface 24a of the cylindrical ceramic 24 due to dimensional accuracy, flaws, deformation during processing, and the like. The gap 29 increases the contact area between the terminal electrode 25 and the cylindrical ceramic 24 . As a result, sufficient ohmic contact between the terminal electrodes and the conductive film 23 can be obtained, and electrical characteristics such as the discharge breakdown voltage of the surge absorber 21 can be stabilized.

In addition, by fixing the columnar ceramic 24 around the center and the periphery of the terminal electrode 25 by the holding portion 211 , the discharge start voltage can be stabilized and the life of the surge absorber 21 can be extended.

In addition, since the pressure of the sealing gas 26 sealed between the pair of terminal electrodes 25 and the cylindrical ceramic 27 is 1 Torr to 600 Torr, a force in the compressive direction is generated against the terminal electrodes 25, and the ohmic contact between the terminal electrodes 25 and the conductive coating becomes weak. It is more reliable, and at the same time, after the cooling process is finished, the slow leakage of air flowing in from between the terminal electrode 25 and the cylindrical ceramic 27 can be avoided.

Hereinafter, a fifth embodiment of the surge absorber of the present invention will be described with reference to FIGS. 7A and 7B.

In addition, the basic structure of the embodiment described here is the same as that of the fourth embodiment described above, and is a structure in which other elements are added to the above fourth embodiment. In addition, in FIGS. 7A and 7B , the same components as those in FIGS. 5A and 5B are given the same reference numerals, and description thereof will be omitted.

The difference between the fourth embodiment and the fifth embodiment is that, corresponding to the structure in which the surge absorber 21 in the fourth embodiment is in direct contact with the cylindrical ceramic 24 and the terminal electrode 25, the surge absorber in the fifth embodiment In the device 220, the cylindrical ceramic 24 is configured to be in contact with the terminal electrode 25 through a pair of cap electrodes (metal members) 221 formed into a bowl shape.

The pair of cap electrodes 221 has a hardness lower than that of the cylindrical ceramics 24, is plastically deformable, is made of metal such as stainless steel, and has a substantially U-shaped cross section at the outer periphery.

Furthermore, on the surfaces of the pair of cap electrodes 221, an oxide film 222 having an average film thickness of 0.01 μm or more is formed by oxidation treatment.

The solder 28 includes: a filling portion 210 that fills the gap 29 formed on the contact surface between the pair of terminal electrodes 25 and the end surface 221 a of the cap electrode 221 ; and an outer peripheral surface that holds the cap electrode 221 at both ends of the cap electrode 221 The holding part 211. In addition, the height h of the holding portion 211 is formed to be lower than the height of the cap electrode 221 . Accordingly, the opposing surfaces of the cap electrodes 221 become the main discharge surfaces 221A.

Hereinafter, a method of manufacturing surge absorber 220 having the above-mentioned structure will be described.

First, an oxide film 222 having an average film thickness of 0.01 μm or more is formed on the surfaces of the pair of cap electrodes 221 by, for example, performing oxidation treatment at 500° C. for 30 minutes in the air.

Then, a pair of cap electrodes 221 are fitted to both ends of the cylindrical ceramic 24, and the surge absorber 220 is manufactured in the same manner as in the fourth embodiment.

This surge absorber 220 has the same functions and effects as those of the surge absorber 1 of the fourth embodiment described above. Since the oxide film 222 with an average thickness of 0.01 μm or more is formed on the cap electrode 221 by oxidation treatment, the main discharge can be reduced. The surface 221A has chemical (thermodynamic) stable characteristics in the high-temperature region. In addition, since the adhesion between the oxide film 222 and the cap electrode 221 is good, the properties of the oxide film 222 can be fully utilized. Therefore, even if the cap electrode 221 is at a high temperature during the main discharge, scattering of the metal component of the cap electrode to the micro-gap 222 and the inner wall of the cylindrical ceramic 227 can be sufficiently suppressed. As a result, a long life of the surge absorber can be realized.

In addition, this invention is not limited to the said Example, Various changes can be added in the range which does not deviate from the summary of this invention.

For example, the conductive film may be Ag (silver), Ag (silver)/Pd (palladium) alloy, SnO ₂ (tin oxide), Al (aluminum), Ni (nickel), Cu (copper), Ti (titanium) , Ta (tantalum), W (tungsten), SiC (silicon carbide), BaAl, C (carbon), Ag (silver)/Pt (platinum) alloy, TiO ₂ (titanium oxide), TiC (titanium carbide), TiCN ( titanium carbonitride), etc.

In addition, the terminal electrodes may be Cu (copper) or Ni (nickel)-based alloys, and the metallized layers on both ends of the cylindrical ceramic may be Ag (silver), Cu (copper), or Au (gold).

In addition, the composition of the sealing gas can be adjusted to obtain the desired electrical characteristics, for example, it can be atmospheric air, or Ar (argon), N ₂ (nitrogen), Ne (neon), He (helium), Xe (xenon) , H ₂ (hydrogen), SF ₆ , CF ₄ , C ₂ F ₆ , C ₃ F ₈ , CO ₂ (carbon dioxide) and their mixtures.

Hereinafter, a sixth embodiment of the surge absorber of the present invention will be described with reference to FIGS. 8A and 8B.

The surge absorber 31 of this embodiment is a discharge-type surge absorber using a so-called micro-gap, and is provided with a cylindrical ceramic ( insulating member) 34; a pair of terminal electrodes 35 in contact with the conductive film 33 arranged oppositely at both ends of the cylindrical ceramic 34; and by arranging the pair of terminal electrodes 35 at both ends, the cylindrical ceramic 34 and A sealing gas 36 such as Ar (argon) is sealed together with a cylindrical ceramic (insulating tube) 37 inside, and the composition and the like of the sealing gas 36 are adjusted so that desired electrical characteristics and the like are obtained.

The cylindrical ceramic 34 is made of a ceramic material such as mullite sintered body, and TiN (titanium nitride) etc. thin film as the conductive coating 33.

Laser cutting, mechanical cutting, etching and other processing methods are used to form 1 to 100 discharge gaps 32 with a width of 0.01 to 1.5 mm, but in this embodiment, one discharge gap 32 with a width of 150 μm is formed.

A pair of terminal electrodes 35 are formed of Kovar (registered trademark) which is an alloy of Fe (iron), Ni (nickel) and Co (cobalt), and each has The formed solder 38 is bonded to the peripheral portion 35A of the end surface 37A of the cylindrical ceramic 37 .

In addition, the pair of terminal electrodes 35 and the end faces 34a of the cylindrical ceramics 34 are bonded with active silver solder (conductive portion) 39, which is a conductive adhesive composed of Ag (silver)-Cu (copper)-Ti (titanium), respectively. catch.

Further, the outer peripheral surfaces of both ends of the columnar ceramic 34 are held by glass material (holding portion) 310 which is difficult to wet the conductive film 33 , terminal electrode 35 , solder 38 and active silver solder 39 . The height h of the bulge of the glass material 310 is the dimension from the end surface of the terminal electrode 35 to the uppermost part of the bulge, which is equal to or greater than the average thickness of the solder, and is used to sufficiently fix the cylindrical ceramic 34 .

The cylindrical ceramic 37 has a rectangular cross-section, and the external dimensions of both end surfaces coincide with the outer peripheral dimensions of the terminal electrodes 35 . The cylindrical ceramics 37 are made of insulating ceramics such as Al ₂ O ₃ (aluminum oxide), and on both ends thereof, a metallization treatment such as Mo (molybdenum)-W (tungsten) is performed, and then Ni (nickel) is plated. , thus forming a metallization layer.

Hereinafter, a method of manufacturing the sheet-type surge absorber 31 of the present embodiment having the above-mentioned structure will be described.

First, active silver solder 39 is applied to the central area of the terminal electrode 35 , the cylindrical ceramic 34 is placed on the central area, and the terminal electrode 35 is brought into contact with the cylindrical ceramic 34 . Then, a glass material 310 is applied to the peripheral portion of the central region. Further, solder 38 is applied to the outer edge portion 35A, and the end surface of the cylindrical ceramic 37 is placed on the outer edge portion 35A.

Solder 38 is provided on the other end surface of cylindrical ceramic 37, and another terminal electrode 35 coated with active silver solder 39, glass material 310 and solder 38 is placed on it to form a temporary bonding state.

Next, the sealing step of sealing the columnar ceramic 34 inside together with Ar (argon) gas with the pair of terminal electrodes 35 and the cylindrical ceramic 37 will be described.

The elements in the temporary bonded state as described above are heat-treated in an Ar (argon) atmosphere to melt the solder 38 , the active silver solder 39 and the glass material 310 . The terminal electrode 35 is bonded to the cylindrical ceramic 37 by melting the solder 38 . In addition, the terminal electrode 35 is bonded to the cylindrical ceramic 34 by melting the active silver solder 39 . Furthermore, since the glass material 310 is melted, the raised portions formed of the glass material 310 bury and hold both ends of the columnar ceramic 34 .

Here, the pressure of the sealing gas 36 is set within a range of 1 Torr to 600 Torr in the cooling step. Therefore, in the cooling step, a force in the compressive direction is generated on the terminal electrode 35 .

Thereafter, by Ni (nickel) plating and Sn (tin) plating, the chip-type surge absorber 31 is fabricated.

The surge absorber 31 manufactured in this way is the same as the surge absorber 21 of the above-mentioned fourth embodiment. For example, as shown in FIG. On the surface 37B, the outer surfaces of the substrate B and the pair of terminal electrodes 35 are soldered and fixed with solder S, and then used.

According to this surge absorber 31 , by bonding the terminal electrode 35 and the end surface 34 a of the cylindrical ceramic 34 with the active silver solder 39 , the terminal electrode 35 and the cylindrical ceramic 34 are in reliable contact. Therefore, sufficient ohmic contact between the terminal electrode 35 and the conductive film 33 can be obtained, and electrical characteristics such as the discharge start voltage of the surge absorber 31 can be stabilized.

In addition, by fixing the cylindrical ceramic 34 with the glass material 310 to the central portion and the peripheral portion of the terminal electrode, the discharge start voltage can be stabilized and the life of the surge absorber 31 can be extended. Here, since the glass material 310 hardly wets the conductive film 33 , the terminal electrode 35 , the solder 38 and the active silver solder 39 , the columnar ceramic 34 is securely fixed.

In addition, by setting the pressure of the sealing gas 36 sealed between the pair of terminal electrodes 35 and the cylindrical ceramic 37 at 1 Torr to 600 Torr, a force in the direction of compression is generated on the terminal electrodes 35, and the terminal electrodes 35 and the conductive film can be bonded together. The ohmic contact between 33 is more reliable, and at the same time, slow leakage of air flowing in from between the terminal electrode 35 and the insulating tube 34 can be avoided after the cooling process is completed.

Furthermore, in this embodiment, the holding member holding the cylindrical ceramic 34 may be the same material as the solder material 38 or the active silver solder 39 . At this time, since the uppermost part of the height h of the bulge becomes the main discharge part, it is defined according to predetermined life characteristics.

Hereinafter, a seventh embodiment of the surge absorber of the present invention will be described with reference to FIGS. 9A and 9B.

In addition, the embodiment described here has the same basic structure as that of the above-mentioned sixth embodiment, but other elements are added to the above-mentioned sixth embodiment. Therefore, in FIGS. 9A and 9B , the same structural members as those in FIGS. 8A and 8B are assigned the same symbols, and description thereof will be omitted here.

The difference between the seventh embodiment and the sixth embodiment is that, corresponding to the structure in which the cylindrical ceramic 34 of the surge absorber 31 in the sixth embodiment is in direct contact with the terminal electrode 35, the surge absorber 31 in the seventh embodiment is different from the sixth embodiment. In the structure of the surge absorber 320 , the columnar ceramic 34 is in contact with the terminal electrode 35 through a pair of cap electrodes (metal members) 321 forming a bowl shape.

The pair of cap electrodes 321 have a lower hardness than cylindrical ceramics, are plastically deformable, are made of metal such as stainless steel, and have a substantially U-shaped cross section at the outer peripheral portion.

Furthermore, on the surfaces of the pair of cap electrodes 321, an oxide film 322 having an average film thickness of 0.01 μm or more is formed by performing oxidation treatment. In addition, the surface facing the cap electrode 321 serves as the main discharge surface 321A.

Furthermore, the height h of the glass material 310 is the same as that of the sixth embodiment above, and is equal to or greater than the average thickness of the solder 38, so that the cylindrical ceramic 34 and the cap electrode 321 can be sufficiently fixed.

Hereinafter, a method of manufacturing the surge absorber 320 of the present embodiment having the above structure will be described.

First, an oxide film 322 having an average film thickness of 0.01 μm or more is formed on the surfaces of the pair of cap electrodes 321 by, for example, performing oxidation treatment at 500° C. for 30 minutes in the air.

Then, a pair of cap electrodes 321 are fitted to both ends of the cylindrical ceramic 34, and the surge absorber 320 is manufactured in the same manner as in the sixth embodiment.

This surge absorber 320 has the same functions and effects as those of the surge absorber 31 of the sixth embodiment described above, and by forming an oxide film 322 with an average thickness of 0.01 μm or more on the cap electrode 321 by oxidation treatment, the main discharge can be suppressed. The surface 321A is chemically (thermodynamically) stable in a high-temperature region. In addition, since the adhesion between the oxide film 322 and the cap electrode is good, the properties of the oxide film 322 can be fully utilized. Therefore, even if the cap electrode 321 is at a high temperature during the main discharge, scattering of the metal component of the cap electrode 321 to the micro-gap 32, the inner wall of the cylindrical ceramic 37, and the like can be sufficiently suppressed. As a result, the life of the surge absorber is extended.

Furthermore, in this embodiment, like the above-mentioned sixth embodiment, the holding member holding the cylindrical ceramic 34 may be made of the same material as the solder 38 or the active silver solder 39 . At this time, the height h of the raised portion is formed to be lower than the height of the cap electrode, so that the main discharge surface 321A becomes the main discharge portion.

In addition, this invention is not limited to the said Example, Various changes are possible in the range which does not deviate from the summary of this invention.

For example, the adhesive is not limited to active silver solder as long as it is conductive and can bond cylindrical ceramics and terminal electrodes, or cap electrodes and terminal electrodes.

Also, the conductive film may be Ag (silver), Ag (silver)/Pd (palladium) alloy, SnO ₂ (tin oxide), Al (aluminum), Ni (nickel), Cu (copper), Ti (titanium ), Ta (tantalum), W (tungsten), SiC (silicon carbide), BaAl, C (carbon), Ag (silver)/Pt (platinum) alloy, TiO ₂ (titanium oxide), TiC (titanium carbide), TiCN (titanium carbonitride), etc.

In addition, the terminal electrode may be a Cu (copper) or Ni (nickel) alloy, or Kovar (registered trademark) which is an alloy of Fe (iron), Ni (nickel), and Co (cobalt), for example.

The metallized layers on both ends of the cylindrical ceramics can be Ag (silver), Cu (copper), Au (gold) and the like.

In addition, the composition of the sealing gas is adjusted to obtain the desired electrical characteristics, for example, it can be atmospheric (air), or Ar (argon), N ₂ (nitrogen), Ne (neon), He (helium), Xe ( Xenon), H ₂ (hydrogen), SF ₆ , CF ₄ , C ₂ F ₆ , C ₃ F ₈ , CO ₂ (carbon dioxide) and their mixed gases.

Claims (17)

1. surge absorber wherein is provided with: make discharging gap cut apart conductive cell envelope and the insulating component that forms between the centre; The relative pair of terminal electrode that disposes and contact with this insulating component with described conductive cell envelope; And by disposing described pair of terminal electrode at two ends, described insulating component and sealing gas together are sealed in inner insulating properties pipe,

At least between described conductive cell envelope and described terminal electrode, be provided with current-carrying part.

2. surge absorber as claimed in claim 1 is characterized in that, is provided with: make described discharging gap cut apart described conductive cell envelope and the described insulating component of the column that forms between the centre on side face; The a pair of described terminal electrode relative at the two ends of described insulating component with described conductive cell envelope; And described insulating component and described sealing gas together be sealed in inner described insulating properties pipe,

Contain filler as the conductivity of described current-carrying part with the gap landfill between described conductive cell envelope and the described terminal electrode.

3. surge absorber as claimed in claim 1 is characterized in that, is provided with: make described discharging gap cut apart described conductive cell envelope and the described insulating component of the column that forms between the centre on side face; The a pair of described terminal electrode relative at the two ends of described insulating component with described conductive cell envelope; And described insulating component and described sealing gas together be sealed in inner described insulating properties pipe,

Between described conductive cell envelope and described terminal electrode, hardware is set, and contains filler as the conductivity of described current-carrying part with the gap landfill between described hardware and the described terminal electrode.

4. as claim 2 or 3 described surge absorbers, it is characterized in that, be provided with: from described terminal electrode at the inboard of described insulating properties pipe and at the axial outstanding and retaining member that forms, keep described insulating component.

5. as claim 2 or 3 described surge absorbers, it is characterized in that: the pressure of described sealing gas is negative pressure.

6. surge absorber as claimed in claim 1 is characterized in that, is provided with: make described discharging gap cut apart described conductive cell envelope and the described insulating component of the column that forms between the centre on side face; The a pair of described terminal electrode relative at the two ends of described insulating component with described conductive cell envelope; And by be somebody's turn to do with scolder welding described terminal electrode is configured in two ends, described insulating component and described sealing gas together are sealed in the described insulating properties pipe of inside,

Be used as the bonding described terminal electrode of bonding agent and the described conductive cell envelope of the conductivity of described current-carrying part.

7. surge absorber as claimed in claim 1 is characterized in that, is provided with: make described discharging gap cut apart described conductive cell envelope and the described insulating component of the column that forms between the centre on side face; Two ends and the opposed a pair of described terminal electrode of described conductive cell envelope at described insulating component; By being somebody's turn to do described terminal electrode is configured in two ends, described insulating component and described sealing gas together is sealed in inner described insulating properties pipe with the scolder welding,

Between described conductive cell envelope and described terminal electrode, hardware is set, is used as the bonding described hardware of bonding agent and the described terminal electrode of the conductivity of described current-carrying part.

8. as claim 6 or 7 described surge absorbers, it is characterized in that: described scolder forms with different materials with described bonding agent.

9. as claim 6 or 7 described surge absorbers, it is characterized in that, be provided with: from described terminal electrode at the inboard of described insulating properties pipe and at the axial outstanding and retaining member that forms, keep described insulating component.

10. surge absorber as claimed in claim 9 is characterized in that: described retaining member uses identical with described scolder, different with described bonding agent material to form.

11. surge absorber as claimed in claim 9 is characterized in that: described retaining member uses identical with described bonding agent, different with described scolder material to form.

12. surge absorber as claimed in claim 9 is characterized in that: described retaining member uses the material different with described bonding agent and described scolder to form.

13. as claim 6 or 7 described surge absorbers, it is characterized in that: the pressure of described sealing gas is negative pressure.

14. surge absorber as claimed in claim 1 is characterized in that, is provided with: on side face, make described discharging gap cut apart described conductive cell envelope and the column that forms or tabular described insulating component between the centre; The a pair of described terminal electrode relative at the two ends of described insulating component with described conductive cell envelope; And described insulating properties pipe,

Between described conductive cell envelope and described terminal electrode, be provided as the buffer component of the conductivity of described current-carrying part.

15. surge absorber as claimed in claim 14 is characterized in that: described buffer component is any one in metallic plate or metal forming, foaming metal, fibre metal or the scolder.

16. surge absorber as claimed in claim 14 is characterized in that: on described buffer component, the protrusion in order to the two ends outer peripheral face that keeps described insulating component is set.

17. the manufacture method of surge absorber as claimed in claim 14, it is characterized in that: between the end face of the described conductive cell envelope that is inserted into described insulating properties pipe inside and described terminal electrode, described buffer component is set, described terminal electrode is bonded in the two ends of described insulating properties pipe and seals described insulating properties pipe.

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