CN1767762A - Component delivery device,surface mounting machine and component experiment device - Google Patents

Abstract

The present invention relates to a component conveying device having a buffer function at the tip of an adsorption member, which can judge abnormality caused by a decrease in the buffer function, and take appropriate measures when the abnormality occurs. In the present invention, the top end of the suction nozzle that absorbs electronic components can be shaken relative to the main body of the suction nozzle by a predetermined amount in the direction of going in and out, and is in a protruding state by the pressing action of the spring. The camera (20) of the position of the mouth main body, in addition the controller (30) includes checking whether the top end of the suction nozzle is in the normal range according to the image of the top end of the suction nozzle taken by the camera (20), if it is not in the normal range, it is judged as An abnormal suction nozzle abnormality judging unit (35), and an abnormality processing unit (36) for processing when it is judged to be abnormal.

Description

Component transfer device, surface mounter, and component testing device

technical field

The present invention relates to a component conveying device, a surface mounter and a component testing device to which the device is applied. In the component conveying device, an absorbing part for absorbing electronic components is supported on a head unit in a manner capable of lifting up and down. The top end of the absorbing part It can be shaken, and is in a protruding state through the pressing of the elastic parts.

Background technique

Conventional surface mounting machines generally include a movable head unit that has a suction member (suction nozzle) that adsorbs electronic components. Electronic component. Then the head unit is moved over the printed circuit board held at a prescribed position of the mounter main body, and the attracted electronic components are mounted on the printed circuit board. During adsorption or installation, the adsorption part is lowered from the raised position to the specified adsorption height position or installation height position, and the electronic components are adsorbed or installed. Since the adsorption part has a buffer function, the top part of the adsorption part can be relatively The main body of the suction member is oscillated vertically by a predetermined amount, and protrudes under the pressure of a spring (for example, refer to Japanese Patent Laid-Open Publication No. 2002-151893).

After the adsorption part has a buffer function, it can absorb the positioning error of the device in the height direction, the shape error of the electronic component itself, the warping of the printed circuit board, and the floating of the belt reel in the component supply part. The error of the electronic component and the printed circuit board on which the electronic component is mounted are suppressed from being subjected to physical pressure to achieve high-speed mounting.

However, recently, as electronic components tend to be miniaturized, the shape of the top end of the adsorption member also tends to be miniaturized, so the structure that enables the top end of the adsorption member to have a cushioning function has also become very small. Therefore, even if the above-mentioned parts are made with high processing technology, since the suction part will absorb dust in the air or cream solder on the printed circuit board during use, it will cause wear and tear if it is continuously used, thereby reducing the cushioning function. For example, when absorbing components, the tip of the absorbing member is submerged by an external force, and then cannot return to the original protruding state even if the external force is removed. When such a case occurs, there is a possibility that the adsorption and mounting of the electronic components cannot be performed correctly.

Contents of the invention

The present invention is made in view of the above problems, and an object of the present invention is to provide a component transfer device having a buffer function at the tip of the suction member, which can judge abnormalities caused by a decrease in the buffer function, and take appropriate measures when abnormalities occur.

The component conveying device of the present invention includes a movable head unit; an adsorption member for adsorbing electronic components is supported on the head unit in a liftable manner; shaken by a predetermined amount, and pressed by an elastic member to protrude; a detection unit that detects the position of the tip end of the above-mentioned suction member relative to the main body of the above-mentioned suction member; , it is checked whether the position of the tip portion of the above-mentioned adsorption member is within a preset normal range, and if it is not within the normal range, it is determined that an abnormality has occurred.

With the above-mentioned structure, the external force applied to the top end of the adsorption member is applied to the adsorption component, and the top end of the adsorption member is displaced in the sinking direction, and the external force is released. Returning to the normal range, the suction nozzle abnormality determination unit determines that an abnormality occurs based on the detection by the detection unit. Accordingly, appropriate measures can be taken when an abnormality occurs.

In this invention, the said detection means may have the camera which photographs the front-end|tip part of the said adsorption|suction member from a side. Thereby, the position of the front-end|tip part of an adsorption member with respect to the main body of an adsorption member can be detected with high precision based on the image captured by a camera.

The detection unit may include a distance sensor for detecting a distance from a certain position to the tip end of the adsorption member. Also in this case, the position of the tip portion of the adsorption member relative to the main body of the adsorption member can be detected with high accuracy.

Preferably, in the present invention, an abnormality processing unit may further be included for at least stopping the use of the suction member, replacing the suction member, changing the operation of the suction member, or A disposal of electronic components adsorbed by the adsorption member.

Accordingly, when the nozzle abnormality determination unit determines that an abnormality has occurred, appropriate processing corresponding thereto can be performed.

Preferably, the abnormality processing means causes the reporting means to report the abnormality when the nozzle abnormality determining means determines that the abnormality is abnormal.

Accordingly, the occurrence of an abnormality can be promptly notified to the operator.

The present invention can be effectively applied to surface mount machines. That is, in a surface mounter that transports the components supplied by the component supply unit to the circuit board positioned at the mounting operation position, and mounts the above-mentioned components on the predetermined position of the circuit board, the components are transported from the above-mentioned component supply unit to A unit on a circuit board may include the above-mentioned component transfer device.

In addition, the present invention can also be effectively applied to device testing equipment. That is, in the component testing device that transports the components supplied from the component supply unit to the test unit for various tests, the unit that transports the components from the component supply unit to the test unit may include the component transport device.

From the above description, it can be known that with the present invention, when there is an abnormality that the top end of the adsorption component after the adsorption element cannot return to the normal range, it can be reliably judged to prevent the above-mentioned abnormality from being ignored, and can properly Take appropriate measures to deal with abnormal situations.

Description of drawings

FIG. 1 is a schematic plan view of a surface mounter according to an embodiment of the present invention.

FIG. 2 is a front view in which a part of the surface mounting machine in FIG. 1 is omitted.

Fig. 3 is a side view showing a head unit support member, a head unit and a camera supported thereon.

Fig. 4 is an enlarged front view of the suction nozzle.

Fig. 5 is an image of the vicinity of the tip end of the nozzle captured by a camera, (a) is an image when it is normal, and (b) is an image when it is abnormal.

Fig. 6 is a block diagram of a control system including a controller and the like of the surface mounting machine.

7 is a flowchart of a specific processing example of a nozzle abnormality determination unit and an abnormality processing unit included in the controller shown in FIG. 6 .

FIG. 8 is an explanatory diagram of various cases of exception handling.

Fig. 9 is a schematic diagram of a second embodiment provided with a detection unit, (a) is a front view, and (b) is a side view.

Fig. 10 is a schematic diagram of a third embodiment provided with a detection unit, (a) is a front view, and (b) is a side view.

Fig. 11 is a schematic diagram of a fourth embodiment provided with a detection unit, (a) is a front view, and (b) is a side view.

Fig. 12 is a schematic diagram of the structure when the detection unit adopts a distance sensor, (a) is a front view, and (b) is a side view.

Detailed ways

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 and 2 schematically show a surface mounter according to an embodiment of the present invention. As shown in the figure, a conveyor belt 2 for conveying printed circuit boards is provided on a base 1 of the mounting machine, and a printed circuit board 3 is conveyed on the conveyor belt 2 and stopped at a predetermined mounting operation position.

Component supply units 4 are provided on both sides of the conveyor belt 2 . In these component supply parts 4, a multi-row tape feeder 4a is installed. Each tape feeder 4a draws out from a reel a tape storing and holding small electronic components such as ICs, transistors, and capacitors at predetermined intervals, and the electronic components can be intermittently taken out by the head unit 6 described later.

Above the above-mentioned base 1, a head unit 6 for mounting components is equipped. The head unit 6 can move between the component supply part 4 and the component mounting part where the printed circuit board 3 is located, and can move in the X-axis direction (moving direction of the conveyer belt 2) and the Y-axis direction (normal to the X-axis on the horizontal plane). direction of intersection).

That is, on the base 1, a fixed guide rail 7 extending along the Y-axis direction and a ball screw 8 driven by a Y-axis servo motor 9 are provided. The head unit support member 11 is provided on the above-mentioned fixed guide rail 7. The nut part 12 provided on 11 is screwed with the above-mentioned ball screw shaft 8 . In addition, the support member 11 is provided with a guide member 13 extending in the X-axis direction and a roller screw 14 driven by an X-axis servo motor 15, and the head unit 6 is held on the guide member 13 possibly movable. A nut portion (not shown) provided on the head unit 6 is screwed to the above-mentioned ball screw 14 . Further, the support member 11 moves in the Y-axis direction by the operation of the Y-axis servo motor 9 , and the head unit 6 moves in the X-axis direction relative to the support member 11 by the operation of the axis servo motor 15 .

In addition, encoders 9 a and 15 a are respectively provided in the Y-axis servo motor 9 and the X-axis servo motor 15 to detect the moving position of the head unit 6 .

The head unit 6 is provided with a plurality of attaching heads 16 each having a suction nozzle 17 (suction member) at the tip. The mounting head 16 is driven by a lifting drive unit such as a Z-axis servo motor outside the figure and a rotation drive unit such as an R-axis servo motor, and can be raised and lowered relative to the frame of the head unit 6 (movement in the Z-axis direction). ) and rotate around the central axis of the nozzle (R axis). In this embodiment, six attachment heads 16 are provided.

The suction nozzle 17 can be freely attached to and detached from the head 16 for installation. A plurality of types of suction nozzles 17 are prepared according to the type and size of electronic components to be sucked, so that an appropriate type can be selected and mounted on the mounting head 16 .

The above-mentioned suction nozzle 17, as shown in FIG. elastic parts). The spring 18 is installed between the nozzle body 17a and the upper and lower shutters provided on the nozzle tip 17b, and presses the nozzle tip 17b against the protruding direction of the nozzle body 17a. Therefore, the tip end portion 17b of the suction nozzle maintains a state protruding by a predetermined amount from the nozzle main body 17a in a state where no external force acts on it, and if it is subjected to an external force from the tip side, it will overcome the pressing force of the spring 18 and sink in the direction ( above) displacement.

In addition, in this mounting machine, a detection unit that detects the position of the nozzle tip portion 17b relative to the nozzle body 17a of the nozzle 17 is provided, and in this embodiment, a camera that photographs the nozzle tip portion 17b from the side is provided. 20. This video camera 20, as shown in Figure 3, is positioned at the below of head unit supporting part 11, is installed on the head unit supporting part 11 through mounting part 22, comprises the line sensor 21 that a plurality of imaging elements are arranged in a row, line sensor 21 The direction in which the imaging elements are arranged (the main scanning direction) is the up-down direction. When the head unit 6 moves along the X-axis direction and passes through the middle part of the head unit support member 11, the top end of the suction nozzle 17b faces the camera 20, and is photographed by the camera 20 as the head unit 6 moves along the X-axis direction. The tip of the nozzle.

Fig. 5 (a) (b) shows the image of the suction nozzle tip 17b and its vicinity taken by the above-mentioned camera 20. In these figures, the inside of the image area 25 represented by the solid line is the suction nozzle tip 17b and its vicinity. images nearby. Fig. 5(a) is an image of a normal state in which the nozzle tip 17b protrudes a predetermined amount L from the nozzle body 17a, and Fig. 5(b) is an abnormality in which the nozzle tip 17b protrudes from the nozzle body 17a by a small amount status image.

In addition, in FIG. 1 , 24 is a camera for component recognition. The camera 24 is installed on the base 1 near the component supply part 4, and when the head unit 6 moves over the camera 24 after picking up the component, it takes pictures of the component picked up by the suction nozzle 17 of the mounting head 16 from below. Based on the images captured by the camera 24, component recognition is performed to determine whether the component suction state is good, to detect deviations in component suction positions, and to perform mounting position corrections corresponding to the deviations.

Figure 6 shows the control 30 provided in the mounting machine. The control 30 is composed of a CPU for executing logic operations, a ROM for storing programs, etc., and a RAM for temporarily storing various data. The functional structure includes a main control unit 31, an image processing unit 32, an axis control unit 33, and a memory 34. The main control unit 31 includes a nozzle abnormality determination unit 35 and an abnormality processing unit 36 .

The above-mentioned main control unit 31 collectively controls the image processing unit 32 and the axis control unit 33 according to a program stored in advance. The image processing unit 32 receives a component image captured by the component recognition camera 24 when recognizing a component, and performs predetermined image processing to recognize the shape of the component picked up by the suction nozzle 17 . In addition, when detecting the position of the nozzle tip 17b, the image near the nozzle tip 17b captured by the camera 20 is input, and the shape of the nozzle tip 17b can be recognized by performing predetermined image processing.

The above-mentioned axis control unit 33 controls a servo motor and the like which operate the head unit 6 and the mounting head 16 and the like. For example, when absorbing components, while controlling the X servo motor 15 and Y servo motor 9 to move the head unit 6 above the component supply part 4, the Z-axis servo motor outside the figure is controlled to lower the mounting head 16. After the suction nozzle 17 absorbs the electronic components, the mounting head 16 returns to the raised position. In addition, when the components are mounted, the X servo motor 15 and the Y servo motor 9 are controlled to move the head unit 6 to the top of the printed circuit board 3. Simultaneously, the Z-axis servo motor outside the diagram is controlled to lower the mounting head 16, and return the mounting head 16 to the raised position after the electronic component is mounted on the printed circuit board 3 from the suction nozzle 17.

In addition, the suction nozzle abnormality determination unit 35 included in the above-mentioned main control unit 31 checks whether the position of the suction nozzle top end 17b is within a predetermined position based on the image captured by the camera 20 near the suction nozzle top end 17b as shown in FIG. 5 . Specifically, check whether the protrusion amount of the nozzle tip 17b relative to the nozzle body 17a is within a preset normal range (permissible error range of the specified amount L in FIG. 5( a )). If it is not within the normal range, it is judged to be abnormal.

Furthermore, the abnormality processing unit 36 included in the main control unit 31 causes the alarm display unit 37 (notification unit) to notify the abnormality when the nozzle abnormality determination unit 25 determines that an abnormality has occurred, and simultaneously performs abnormality processing. As the abnormality processing, at least one of stopping the use of the suction nozzle, replacing the suction nozzle, changing the operation of the suction nozzle, or discarding the electronic component picked up by the suction nozzle may be performed. In addition, the above-mentioned alarm display unit 37 only needs to be able to notify the operator of an abnormality, and a display device, an alarm sound generator, an alarm light generator, etc. that display the occurrence of an abnormality on a display interface may be used.

FIG. 7 is a flowchart of a specific example of processing performed by the nozzle abnormality determination unit 35 and the abnormality processing unit 36 . The process shown in this flowchart is started when the mounting head 16 is driven to a predetermined raised position by the lifting drive unit at an appropriate timing other than the time of component suction and component mounting. For example, after component mounting, the head unit 6 moves toward the component supply part 4 in order to attract the next component. In addition, after component suction, you may carry out in the middle of component conveyance which mounts a component on the printed circuit board 3. In addition, the above-mentioned processing may be performed either only when the head unit 6 after mounting components is moving to the component supply unit 4 or when the head unit 6 after picking up components is on the way to transport components.

After the process shown in this flowchart is started, first, the head unit 6 is driven in the X-axis direction, and the nozzle tip end 17b of the suction nozzle 17 passes through the position facing the camera 20, and the camera 20 is used to photograph the suction from the side. Near the tip of the mouth 17b, the image is taken into the controller 30 for recognition (step S1). Then, the nozzle abnormality determination unit 35 checks whether the protrusion amount of the nozzle tip portion 17b relative to the nozzle main body 17a is out of the normal range, thereby determining whether an abnormality occurs (step S2).

When it is judged in step S2 that no abnormality has occurred, this processing ends.

When it is determined in step S2 that an abnormality has occurred, the number n of abnormalities is accumulated (step S3 ), and it is determined whether the number n of abnormalities exceeds a preset limit value nx (step S4 ).

If the number n of abnormalities does not exceed the preset limit value nx, the process goes to step S5, and the drive alarm display unit 37 displays an error indicating that there is an abnormality. Next, in step S6, it is judged whether the suction nozzle 17 holds a component. At this time, the presence or absence of components is judged from the image captured by the camera 20 . Or according to the current operation of the mounting machine, when the suction nozzle 17 is in the middle of component conveyance after absorbing the component, it is judged to be holding the component; Component not held.

When the above-mentioned step S6 is determined as YES, it proceeds to step S7 to determine whether the suction state is normal (whether components can be mounted on the printed circuit board 3 ). This judgment is performed based on an image captured by the aforementioned camera 20 or an image captured by the component recognition camera 24 from below the component picked up by the suction nozzle 17 .

Based on the determination results of steps S6 and S7, the number of abnormalities, etc., an abnormality process is selected from CASE1 to 4 shown in FIG. 8 .

That is, when the suction nozzle 17 does not hold a component (step S6 judges NO), one of CASE1 to 3 is selected (step S8).

Here, CASE1 is to change the program to stop using the suction nozzle 17 judged to be abnormal, and use the remaining normal suction nozzle 17 among the plurality of suction nozzles 17 equipped with the head unit 6 to perform mounting, and redistribute the component to the normal suction nozzle 17, and then continue the operation of the installation machine. In CASE2, the suction nozzle 17 judged to be abnormal is replaced automatically or manually by a spare suction nozzle, and then the operation is continued. In addition, CASE3 is the correction control data, for the suction nozzle 17 determined to be abnormal, change its head descending stroke when absorbing or mounting components, or reduce the descending speed, and then continue the operation of the mounting machine.

The processing selection in step S8 can be preset in a certain situation, or can be selected according to the number of abnormalities n. When selecting according to the number of abnormalities n, for example, set the first and second thresholds n1 and n2 in advance according to the relationship of n1<n2<nx, and select CASE3 when it is less than the first threshold n1. Select CASE2 when it is between the second threshold n2, and select CASE1 when it exceeds the second threshold n2.

In addition, when the suction nozzle 17 holds the component (YES in step S6 ) and the suction posture is normal (YES in step S7 ), one of CASE 3 and 4 is selected (step S9 ).

Here, CASE3 is as described above, and CASE4 is to recover or discard the component sucked by the suction nozzle 17 .

The processing selection in step S9 may be preset in a certain situation, or may be selected according to the number n of abnormalities. When selecting according to the number of abnormalities n, for example, set a threshold value smaller than the threshold value nx, select CASE3 when it is less than the threshold value, and select CASE4 when it exceeds the threshold value.

In addition, when the suction nozzle 17 holds a component (YES in step S6 ) and the suction posture is not normal (NO in step S7 ), the process of CASE4 is performed.

In addition, when it is determined in the above-mentioned step S4 that the number of abnormalities n exceeds the preset limit value nx, the drive alarm display unit 37 displays an error and stops the operation of the mounting machine (step S11).

According to the device of the present embodiment as described above, the top end of the suction nozzle and its vicinity can be photographed from the side by the camera, and the amount of protrusion of the top end of the suction nozzle 17b relative to the main body 17a of the suction nozzle can be checked based on the image, if it is not in the normal range If it is inside, it is judged as an abnormality. Therefore, because the suction nozzle 17 absorbs dust or creamy solder and wears, etc., the cushioning function is low, so that the top end 17b of the suction nozzle after absorbing the component or mounting the component does not return to the normal protruding state, as shown in FIG. 5(b). When you are not in the state, you can make a practical judgment on this.

When the above-mentioned abnormality occurs, the reduction of the cushioning function is compensated by changing the descending stroke or descending speed of the suction nozzle 17 . In addition, it is also possible to replace the suction nozzle 17 to eliminate the abnormality. Alternatively, by stopping the use of the suction nozzles 17 determined to be abnormal and using the remaining normal suction nozzles 17, it is possible to avoid failure to correctly suction or mount electronic components. In addition, when the number of abnormalities increases when the suction nozzle 17 holds the component, the cushioning function will be greatly reduced, and the component may be damaged during mounting, so the recovery and disposal of the component can be performed. Furthermore, when the number of abnormalities increases remarkably, the operation of the mounting machine can be stopped.

In this way, when the suction nozzle does not protrude normally, take measures according to the state of the mounting machine and the number of abnormalities at that time, so as to suppress the occurrence of problems such as component damage and mounting failure caused by the low cushioning function of the suction nozzle.

In addition, the specific structure of the device of the present invention is not limited to the above-mentioned embodiments, and various changes can be made. Other examples will be described below.

(1) In the above-mentioned embodiment, the camera 20 for photographing the top end of the suction nozzle and its vicinity is installed on the head unit support member 11, and it can also be installed on the base 1 of the installation machine as shown in Figure 9(a)(b). Set the camera 40 on it. That is, in this embodiment, the camera 40 including the line sensor 41 is fixed on the base 1 through the supporting table 42 . In this embodiment, the drive of the head unit 6 may be controlled so that the suction nozzle 17 passes the position facing the camera 40, and the vicinity of the tip of the suction nozzle 17 may be photographed by the camera 40 at the same time.

(2) As shown in FIG. 10( a ) ( b ), a camera 50 may be provided on the head unit 6 . That is, in the present embodiment, the camera 50 equipped with the line sensor 51 is installed through the mounting frame 52 so that it can move in the nozzle arrangement direction (X-axis direction) relative to the head unit 6. The driving unit is driven to move in the direction in which the suction nozzles are arranged, and takes pictures of the top end of each suction nozzle 17 and its vicinity.

(3) As shown in FIGS. 11( a ) and ( b ), a plurality of cameras 60 may be provided corresponding to each suction nozzle 17 . That is, in this embodiment, the six cameras 60 corresponding to the six suction nozzles 17 are installed through the installation frame 62 so as to be fixed relative to the head unit 6 . In this case, an area sensor may be used for the camera 60 .

(4) The detection unit for detecting the position of the nozzle tip 17b relative to the nozzle main body 17a is not limited to the above-mentioned cameras 20, 40, 50, 60, and may also be a distance sensor as shown in Fig. 12(a)(b) 70. That is, in the present embodiment, the laser type distance sensor 70 is arranged on the base 1, and when the head unit 6 passes over it, it detects the distance from the position of the distance sensor 70 to the top end of the suction nozzle 17, and obtains accordingly The height position of the tip end portion 17b of the suction nozzle.

(5) In the above-mentioned embodiments, the ball screw 14 and the servo motor 15 are used as the mechanism for moving the head unit 6, and a linear motor (linear motor) can also be used instead.

(6) In each of the above-mentioned embodiments, application to a surface mounter has been described, but the present invention can also be applied to a component testing device for performing various electrical tests on electronic components such as ICs. That is, the device omitted from the illustration has a movable head unit equipped with one or more heads for component mounting. In the test device, the head unit and the suction nozzle of the installation head installed thereon adopt the same structure as that shown in the above-mentioned embodiments, and a camera or a camera that detects the position of the top end of the suction nozzle relative to the suction nozzle main body is installed The detection unit constituted by a distance sensor, and the same suction nozzle abnormality determination unit and abnormality processing unit as those in Fig. 6 are installed in the controller.

Claims (7)

1. component delivery device is characterized in that comprising:

The displaceable head unit;

The adsorption element of stick electronic components, lifting are supported on the above-mentioned head unit possibly, and the top ends of this adsorption element can be shaken with ormal weight along the direction of haunting with respect to the main body of adsorption element, and are pressed by elastomeric element and to be outstanding state;

Detecting unit detects the position of the top ends of above-mentioned adsorption element with respect to above-mentioned adsorption element main body; With

Suction nozzle abnormality juding unit according to the detection of above-mentioned detecting unit, checks whether the position of the top ends of above-mentioned adsorption element is positioned at predefined normal range (NR), does not take place unusually if then be not judged to be in normal range (NR).

2. component delivery device according to claim 1 is characterized in that:

Above-mentioned detecting unit, the video camera with the top ends of taking above-mentioned adsorption element from the side.

3. component delivery device according to claim 1 is characterized in that:

Above-mentioned detecting unit has range sensor, detects the distance of the top ends from certain position to above-mentioned adsorption element.

4. according to each described component delivery device in the claim 1 to 3, it is characterized in that comprising:

Exception processing unit, be judged to be in said suction nozzle abnormality juding unit and take place when unusual, the use of carrying out this adsorption element at least stops, the running change of the replacing of this adsorption element, this adsorption element or the adsorbed electronic component of this adsorption element discarded in a kind of processing.

5. component delivery device according to claim 4 is characterized in that:

Above-mentioned exception processing unit is judged to be in said suction nozzle abnormality juding unit when unusual, makes the circular unit to making circular unusually.

6. surface mounting apparatus, the element conveyance that component feeding portion is supplied with and are installed to said elements on the assigned position of circuit board to the circuit board that is positioned at the installation exercise position, it is characterized in that:

With the unit of element on, comprise each described component delivery device in the claim 1 to 5 from the conveyance of said elements supply unit to circuit board.

7. a component experiment device carries out various tests with the element conveyance that component feeding portion is supplied with to test unit, it is characterized in that:

With the unit of element, comprise each described component delivery device in the claim 1 to 5 from the conveyance of said elements supply unit to test unit.

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