CN1761845B - Instantaneous heater - Google Patents

Abstract

An instantaneous heater (D) with an electronic control section (S) for a heating module (M) has at least one printed circuit board (P) fixed on the heating module (M) and at least one electronic power element (B) located at a cooling interface (K) with a cold water inlet, wherein a ceramic cooling element (E) is provided at the cooling interface (K) to isolate the power element (B) from the cold water, and the power element (B) is connected without grounding.

Description

instantaneous heater

technical field

The invention relates to a transient heater with an electronic control for a heating module, wherein at least one electronic power element is positioned on the heating module on a cooling connection with a cold water inlet.

The invention also relates to another transient heater with an electronic control part for a heating module, wherein at least one electronic power element is positioned on the heating module at a cooling connection with a cold water inlet and fixed A printed circuit board.

Background technique

In flash heaters known from practice with an electronically controlled part, power elements, such as triacs, are cooled at a cooling connection by incoming cold water in order to prevent such power elements from exceeding approximately 70°C during operation. °C limit temperature. The cooling connection is located in a copper tube circuit provided exclusively for cooling in the area of the cold water inflow, wherein the power element has a spring clip and is pressed onto a flattened contact surface of the copper tube. Because copper tubing is conductive, this power element requires a direct ground connection. This construction principle requires many parts, complex wiring and grounding of each power element. This results in high manufacturing and installation costs. In the electronic control part, usually at least one printed circuit board is arranged, and other control components are also arranged on the printed circuit board if necessary, and the printed circuit board is also fixed to the The heating module is in a fixed position prepared for this purpose. In operation, these dissipating power components are generally positioned at the cooling interface, grounded and connected to the control section. The separate fixing and positioning of the printed circuit boards therefore likewise increases the manufacturing and installation costs.

Contents of the invention

It is an object of the present invention to provide a flash heater of the aforementioned type at reduced cost. This object also includes avoiding grounding costs for cooled power components, or avoiding separate fixtures for printed circuit boards, or both.

A first aspect of this object is achieved by a transient heater of the first type described above. According to the invention, a ceramic cooling element is arranged at the cooling connection, which electrically insulates the power element and physically isolates the power element from the cold water, wherein the ceramic cooling element is installed on the outside of the heating module in a watertight manner to the heating module The cold water in flows between the zones, and the power elements are connected ungrounded.

The second aspect is achieved by the second type of transient heater described above. According to the invention, the power component is positioned at the cooling interface by means of at least one clamping element, with which the printed circuit board is also fastened to the heating module.

These two aspects are realized through the combination of the above two schemes.

The ceramic cooling element electrically insulates the power element, for example a triac, from the water, so that the cooling connection or the power element does not need to be grounded, yet safety does still comply with regulations. Ceramic cooling elements transfer effective heat or cold in order to cool the power components. Therefore, it is better to use ceramic materials with high thermal conductivity; moreover, ceramic materials should have good mechanical properties to ensure the necessary flatness in the contact area of the components, as well as to withstand the fastening force and the thermal influence during operation. The cooling elements can be relatively small, so that the cooling connections can even be arranged to a large extent in a given cold water inflow area without further effort. The ceramic cooling element is suitable for cooling a power element, which is pressed elastically against the cooling element by means of a clamping element. Wherein, the clamping element and, if necessary, an electronic control part printed circuit board carrying the power element can be fixed on the heating module. However, it is also advantageous to use ceramic cooling elements when the printed circuit board is fixed on the heating module in a conventional manner.

If the clamping element, which positions the power element on the cooling connection, also fastens the printed circuit board to the heating module, the production and assembly costs can be significantly reduced, since separate fastening elements are omitted. If the power components are not cooled by a ceramic cooling element, the printed circuit board can also be fastened to the heating module using clamping elements for the power components.

A particularly advantageous embodiment is characterized in that the ceramic cooling element for cooling the power components is advantageously integrated into the heating module in such a way that lines solely for cooling can be dispensed with. The power components, which are suitable for direct mounting on the printed circuit board, are positioned on the cooling element by means of a clamping element and are pressed by the holding element through the printed circuit board onto the cooling element. Finally, the printed circuit board is fixed on the heating module by clamping elements that press the power components onto the cooling element. In order to secure the printed circuit board properly during operation and transport, the auxiliary support should in particular fully satisfy the final positioning of the printed circuit board, which may be equipped with further electronic components.

In a suitable embodiment, the ceramic cooling element is mounted watertight between the outside of the heating module and the cold water inflow area in the heating module. In order to integrate the cooling connection into the heating module, only slight modifications need to be made in the inflow region. There are different options for inserting ceramic cooling elements during or after the molding of the heating module, for example a direct external pressure injection during the injection molding process. Technically speaking, the cooling element can also be inserted easily afterwards by pressing in, welding, gluing or locking. In this case, a seal such as an O-ring should be inserted together.

The power element is preferably in cooling contact with the cooling element via an elastic clamping element. The clamping element can also be used to fasten cooling elements that are only loosely mounted in a water-tight manner. A preferred solution is that the cooling element itself is fastened watertight, while its exposed contact surface for accommodating the power element is easily accessible.

A plate-shaped, disc-shaped or cover-shaped ceramic cooling element can be produced inexpensively and with high integrity and dimensional accuracy. These geometries also have sufficient structural strength, so that mechanical, thermal and hydraulic loads on the cooling element are not problematic. The cover-plate-like contact surface to the power components is easily accessible. There is sufficient active area in the edge region of the cover for fastening and/or sealing.

In order to optimize the cooling effect, it is preferable to arrange the cooling element approximately perpendicular to the inflow direction of the cold water to the cooling connection. This allows efficient transfer of heat from the cooling element to the water. The inflow surface of the cooling element can advantageously be designed, for example, as a concave surface for the liquid flow, in order to reduce the risk of undesired turbulence. The inflow surface can also be structured in such a way that its surface area in contact with the water flow is enlarged, for example, by the provision of ribs, which also facilitate fluid guidance.

In a preferred embodiment, a water chamber with a hole is provided on the heating module, the water chamber has an inflow channel and an outflow channel, which can be connected to the cooling element. A ceramic cooling element is arranged watertight in the bore. The water chamber only slightly alters the cold water inflow area of the heating module. The water chamber can be formed without any problem from the material of the heating module and/or the cold water inflow area, and can accommodate the installed cooling element in an exposed position where it is convenient to install the power element. Said water chamber is preferably located in the group of components of the electronic control part, or vice versa.

An overflow limit is preferably provided in the water chamber, to which the flow-guiding surface is guided, which leads the incoming cold water substantially vertically to the inflow surface of the cooling element and makes the outgoing water Flow out as quickly as possible in order to force a strong fluid dynamic along the inflow surface that is beneficial to the cooling effect.

The clamping element is preferably a U-shaped spring clip, which can be produced cost-effectively, for example, as a bent sheet metal part. However, the clamping element can also be a spring clip with more than two clamping legs and a spring structure for pressing the power element.

An outer support, for example an insert, for example a U-shaped spring clip, is preferably formed on the water chamber for the clamping legs of the clamping element. It should be noted that the printed circuit board may be larger and heavier than the power components, and that another shape, larger and/or stronger clamping element may be used for fixing such a printed circuit board.

A good spring-loaded effect on the power component and/or the printed circuit board can be achieved if the clamping element, designed as a U-shaped spring clip, is bent alternately in and out in the transverse plate.

A longitudinally extending reinforcement bead can be formed in the clamping leg, which is advantageous, for example, in preventing an undesired longitudinal bending or twisting of the clamping leg when mounting spring clips.

The power element to be cooled is generally a triac component, which generates heat during transient heater operation and is cooled by the incoming cold water by means of ceramic cooling elements.

Embodiments of the present invention will be described below in conjunction with the accompanying drawings. The accompanying drawings indicate:

Figure 1 is a schematic cross-sectional view of a part of a transient heater;

Figure 2. Partial perspective view of Figure 1.

1 shows in section a part of a heating module M of a transient heater D with an electronic regulation or control part S, which is composed of two interconnected module moldings 1, 2 (such as injection molded parts) )composition. In the operating state of the transient heater D, the heating module M is covered by a cover F indicated by a dashed line. The heating module M is connected to water inlets and outlets not shown, and is electrically connected to the grid.

The electronic control part S for at least one heating element not shown in the heating module has a printed circuit board P on which the components are mounted and at least one electronic power component B, which in FIG. 1 is mounted on on the printed circuit board P. The power element B is, for example, a triac switching element which generates heat and needs to be cooled when the transient heater D is in operation. For this reason, the power element B is located at the cooling connection K of the heating module M with the cold water inlet. The power component B is held against a ceramic cooling element E by means of at least one clamping element H, which at the cooling connection K electrically insulates the power component B from the water and forms a heat conductor to the water.

In the embodiment shown, the clamping element H acts on the printed circuit board P, so that the power component B is held indirectly via the printed circuit board P against the cooling element E. Here, the clamping element H serves at the same time to fix the printed circuit board P on the heating module M. FIG.

In an alternative, not shown, the clamping element H acts directly on the power element B, which is arranged separately from the printed circuit board P, and presses it against the cooling element E. FIG. At this time, the printed circuit board P is mounted in another way.

The heating module profiles 1 , 2 delimit an inner cold water inflow channel 3 , in which the cold water flows in the direction of the arrow R before heating. The cold water comes from a water chamber 4 , which is preferably integrally formed in the molded part 1 , and which has a bore 5 into which the ceramic cooling element E is inserted, for example by means of an O-ring 13 , in a water-tight manner. The edges of the holes 5 can, for example, be plastically deformed or crimped in order to fix the cooling element E in a leak-tight manner. Alternatively, the cooling element E can also be bonded or molded together during the molding of the molded part 1 , for example by pressure external injection molding. As an alternative, the cooling element E can also be kept sealed only by the clamping force of the clamping element H.

In the water chamber 4 there is formed an inflow channel 6 , for example connected to a cold water inlet not shown, which is separated from an outflow channel 9 by a partition wall 7 which is spaced from the ceramic cooling element E It terminates at an upper overflow limit 8 . The partition wall 7 forms at least a flow-guiding surface oriented substantially perpendicularly to the cooling element E, so that the cold water flow indicated by the circular arc arrow Z acts on the cooling element E as strongly as possible and with less swirling (see FIG. 2 ) .

In the embodiment shown, a support 10, for example a socket, is provided on the profiled part 1 in the vicinity of the water chamber 4 for the holding element H, which is anchored in the operating state shown in FIG. in the socket. For additional fixing of the printed circuit board P, further positioning elements 11 , for example support bases, can be provided on the molded part 1 . Under the action of the clamping force of the clamping element H, the printed circuit board P is mounted on said support base, which preferably also surrounds the printed circuit board P at least from the sides at two corners. The positioning element 11 can have a depth stop 12 for protecting the printed circuit board P. As shown in FIG.

In the installation method shown, the power element B is electrically insulated from water, and the cold water flowing in the heating module M does not need a metal pipeline at the interface K, so the power element B does not need to be grounded separately. The printed circuit board P is usually not grounded inherently.

FIG. 2 shows on an enlarged scale how the ceramic cooling element E in the form of a cover 14 rests with its lower widened cover edge on the O-ring 13 which engages in the seat of the bore 5 . As mentioned above, the cooling element E can be held in its shown sealed position by crimping the edge of the hole or by external injection molding, adhesive bonding or the like. However, the sealing against the cooling element E can also be produced solely by the clamping force of the clamping element H.

The cooling element can also be a small plate or disc made of a ceramic material with good thermal conductivity, instead of the above-mentioned cap shape. In FIG. 2 , the exposed surface of the cooling element E forms a flat contact surface 15 for the power element B, while the inner or lower side of the cover 14 forms an inflow surface, here for example basin-shaped, for the cold water from the inflow channel 6 16. The overflow boundary 8 is situated opposite the inflow surface 16 at a distance selected such that optimum flow conditions exist along the inflow surface 16 for effective heat dissipation.

The clamping element H is a U-shaped spring clamp with a transverse plate 17 and, for example, two clamping legs 19 . The crossbar 17 has a plurality of alternating bends 18 in order to produce the desired spring action. Formed on the clamping legs 19 are eg saw-tooth-shaped locking projections 20 , which are self-anchored in the holder 10 , in which teeth are also made if necessary. The longitudinally extending reinforcement bead 21 increases the structural strength of the clamping leg 19 . The holding element H of FIGS. 1 and 2 is preferably a blank blank bent part made of a suitable metal. The clamping element can also optionally be a plastic molded or composite part.

Claims (38)

1. instantaneous heater (D), this heater has an electronic control part (S) that is used for a heating module (M), wherein upward at least one electronic power element (B) being positioned at one at heating module (M) is with the coolant interface (K) of cold water inlet (Z) to locate, it is characterized in that, locate to be provided with a ceramic cooling element (E) at coolant interface (K), this cooling element makes power component (B) electric insulation ground and isolates with cold water on physics, the outside and the cold water in the heating module that wherein said ceramic cooling element (E) is installed in heating module (M) waterproofly flow between the district, and power component (B) is connected earth-freely.

2. by the described instantaneous heater of claim 1, it is characterized in that this instantaneous heater is the bath heating device.

3. by the described instantaneous heater of claim 1, it is characterized in that described ceramic cooling element (E) is contained between the outside and cold water inlet (Z) of heating module (M) waterproofly.

4. by the described instantaneous heater of claim 1, it is characterized in that described ceramic cooling element (E) is packed in the forming process of heating module (M) or after the moulding.

5. by the described instantaneous heater of claim 1, it is characterized in that described power component (B) keeps cooling to contact by a clamping element (H) and ceramic cooling element (E).

6. by the described instantaneous heater of claim 3, it is characterized in that described ceramic cooling element (E) seals by at least one O RunddichtringO (13).

7. by the described instantaneous heater of claim 1, it is characterized in that described ceramic cooling element (E) is a kind of plate, disk or lid (14), it have a contact-making surface (15) that is used for power component (B) and have one be used for cold water go into stream interface (16).

8. by the described instantaneous heater of claim 1, it is characterized in that described ceramic cooling element (E) is perpendicular to going into the flow path direction layout to the cold water of coolant interface (K).

9. by the described instantaneous heater of claim 1, it is characterized in that, on the heating module (M) in cold water inflow district (Z) hydroecium (4) with hole (5) is set, this hydroecium comprises the flow channel (6) and the flow pass (9) that flows out this hole that flow into this hole (5), and ceramic cooling element (E) is arranged in the hole (5) hermetically.

10. by the described instantaneous heater of claim 9, it is characterized in that, an overflow boundary (8) of going into stream interface (16) spacing distance with cooling element (E) is set between inherent flow channel of hydroecium (4) (6) and flow pass (9).

11. by the described instantaneous heater of claim 5, it is characterized in that, described clamping element (H) is the spring clip of a U-shaped, it has the nip side leg (19) and a transverse slat (17) of at least two band saw profile of tooth projections (20), and this transverse slat can be indirectly or directly is placed on the power component (B).

12. by claim 9 or 11 described instantaneous heaters, it is characterized in that, near hydroecium (4), locate to form bearing into the nip side leg (19) of spring clip (14) at heating module (M).

13. by the described instantaneous heater of claim 1, it is characterized in that, fix a printed circuit board (P).

14., it is characterized in that described clamping element is resilient by the described instantaneous heater of claim 5.

15., it is characterized in that described ceramic cooling element (E) is also undertaken fixing by this clamping element (H) waterproofly by the described instantaneous heater of claim 5.

16. by the described instantaneous heater of claim 7, it is characterized in that, described contact-making surface be the plane and/or leveling.

17., it is characterized in that (5) protrude contact-making surface from the hole by the described instantaneous heater of claim 9.

18. by the described instantaneous heater of claim 10, it is characterized in that, will be directed to this overflow boundary perpendicular to the guide face of going into stream interface (16) orientation.

19., it is characterized in that this spring clip is made as sheet material blanking bending member or carrying material bending member by the described instantaneous heater of claim 11.

20., it is characterized in that described transverse slat is resilient by the described instantaneous heater of claim 11.

21., it is characterized in that described bearing constitutes sleeve (10) by the described instantaneous heater of claim 12.

22., it is characterized in that power component (B) is a triac member by each described instantaneous heater in the claim 1 to 11.

23. instantaneous heater (D), this heater has an electronic control part (S) that is used for a heating module (M), wherein upward at least one electronic power element (B) being positioned at one at heating module (M) is with the coolant interface (K) of cold water inlet (Z) to locate, and fix a printed circuit board (P), it is characterized in that, power component (B) utilizes at least one clamping element (H) to be positioned at coolant interface (K) and locates, and printed circuit board (P) also utilizes this clamping element to be fixed on the heating module (M).

24. by the described instantaneous heater of claim 23, it is characterized in that, in the scope of coolant interface (K), on heating module (M), be provided for the bearing (10) of clamping element (H).

25., it is characterized in that upward being provided with one has a cooling element (E) that is used for the contact-making surface (15) of power component (B) at coolant interface (K) by the described instantaneous heater of claim 24 waterproofly; Power component (B) is installed on the printed circuit board (P), and is pressed to by printed circuit board (P) and clamping element (H) on the contact-making surface (15) of cooling element (E); Contact-making surface (15) is configured for a setting element of printed circuit board (P); And on heating module (M), be provided for other setting element of printed circuit board (P) (11).

26. by the described instantaneous heater of claim 24, it is characterized in that, described clamping element (H) is the spring clip of a U-shaped, it has the nip side leg (19) and a transverse slat (17) of at least two band saw profile of tooth projections (20), and this transverse slat is placed on the power component (B) indirectly or directly.

27., it is characterized in that transverse slat (17) alternately bend into respect to a straight trend and bends by the described instantaneous heater of claim 26.

28. by the described instantaneous heater of claim 26, it is characterized in that, in nip side leg (19), constitute the reinforcing crimping (21) of longitudinal extension.

29., it is characterized in that this instantaneous heater is the bath heating device by the described instantaneous heater of claim 23.

30. by the described instantaneous heater of claim 24, it is characterized in that, in the scope of coolant interface (K), on heating module (M), be provided for the setting element (11) of printed circuit board (P).

31., it is characterized in that described cooling element is ceramic by the described instantaneous heater of claim 25.

32., it is characterized in that described cooling element is arranged in the hole (5) of a hydroecium (4) by the described instantaneous heater of claim 25.

33., it is characterized in that described other setting element is the support plinth form by the described instantaneous heater of claim 25.

34., it is characterized in that described other setting element is furnished with depth stop (12) by the described instantaneous heater of claim 25.

35., it is characterized in that described other setting element is used for the printed circuit board angle by the described instantaneous heater of claim 25.

36., it is characterized in that this spring clip is made as a sheet material blanking bending member or carrying material bending member by the described instantaneous heater of claim 26.

37., it is characterized in that described transverse slat is resilient by the described instantaneous heater of claim 26.

38., it is characterized in that power component (B) is a triac member by each described instantaneous heater in the claim 23 to 37.