CN1760092A - Caps for thin plate support containers - Google Patents
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- CN1760092A CN1760092A CN 200410085645 CN200410085645A CN1760092A CN 1760092 A CN1760092 A CN 1760092A CN 200410085645 CN200410085645 CN 200410085645 CN 200410085645 A CN200410085645 A CN 200410085645A CN 1760092 A CN1760092 A CN 1760092A
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Abstract
Description
技术领域technical field
本发明涉及容纳半导体晶片、记忆磁盘、液晶玻璃基板等的薄板的,在保管、运送、制造步骤等中所使用的薄板支持容器用盖体。The present invention relates to a cover body for a thin plate holding container used for storing, transporting, manufacturing steps, etc., for storing thin plates such as semiconductor wafers, memory disks, and liquid crystal glass substrates.
背景技术Background technique
容纳半导体晶片等薄板用来保管、运送的薄板支持容器是众所周知的。Sheet support containers for storing and transporting thin sheets such as semiconductor wafers are known.
该薄板支持容器主要由:容器本体及塞住该容器本体上部开口的盖体构成。容器本体内部设有用来支持半导体晶片等薄板用的构件。在该薄板支持容器中,为防止收容在其内部的半导体晶片等薄板表面被污染,运送时必须保持容器内清洁干净。因此,容器内是密封的。换句话说,是将盖体固定于容器本体上,使容器本体成密封状态。将该盖体固定于容器本体上的构造有各种形式。The thin-plate support container is mainly composed of a container body and a cover that blocks the upper opening of the container body. A member for supporting thin plates such as semiconductor wafers is provided inside the container body. In this sheet supporting container, in order to prevent contamination of the surface of the thin sheet such as a semiconductor wafer accommodated therein, it is necessary to keep the inside of the container clean during transportation. Therefore, the inside of the container is hermetically sealed. In other words, the cover body is fixed on the container body, so that the container body is in a sealed state. There are various configurations for fixing the lid to the container body.
运送到半导体制造工厂等的薄板支持容器,放置在生产线上由专用装置来自动地装卸盖体。Thin plate support containers transported to semiconductor manufacturing plants, etc., are placed on the production line, and the lids are automatically attached and detached by dedicated equipment.
对应于该专用装置的盖体有一种是专利文献1所记载的形态。该盖体1,如图2所示,由本体2、凸轮构件3、闩锁杆4及支点5构成。One of the lids corresponding to this dedicated device is described in Patent Document 1. The cover 1 is composed of a
凸轮构件3是可转动的安装在本体2上。凸轮构件3上设有凸轮部分6。该凸轮部分6上设有长形洞孔状的连结开口部7。The
闩锁杆4的基端部设置有S字形凸轮随动部分8,该S字形凸轮随动部分8嵌合于连结开口部7上捕捉其动作。The base end of the
支点5由设于本体2上的突起构件构成,用来支持闩锁杆4。The
根据该构成,通过凸轮构件3的转动,使得连结开口部7所捕捉到的S字形凸轮随动部分8一方面向图中的右方移动而一方面向上方顶起。由此,闩锁杆4一方面从本体2延伸出,一方面以支点5为中心而转动,将闩锁杆4的前端向下方顶下。According to this configuration, the S-shaped
此时,闩锁杆4的前端嵌合于容器本体侧的孔部而向下方顶下,因而将盖体顶向容器本体侧的进行固定。At this time, the front end of the
(专利文献1)日本专利特开2001-512288号公报(Patent Document 1) Japanese Patent Application Laid-Open No. 2001-512288
发明内容Contents of the invention
但是,如上所述盖体1,因为闩锁杆4的基端部是用凸轮构件3捕捉的一边向外延伸一边向上方顶起,使得闩锁杆4能以支点5为中心而旋转的构成,若换成杠杆原理的话,可以将闩锁杆4的基端作为力点,前端为作用点,支点5成为支点。However, as described above in the cover body 1, since the base end portion of the
在这样的情形下,为了提高容器本体内的密闭性,要将盖体1强力压在容器本体上,因此必须将闩锁杆4的前端强力顶压在容器本体侧的孔部上。In such a case, in order to improve the airtightness of the container body, the lid body 1 must be strongly pressed against the container body, so the front end of the
为实现这样的效果,必须提高凸轮构件3和闩锁杆4的强度。这是因为闩锁杆4前端部和支点5之间的间隔比较长的关系。在此状况下,只要将支点5和闩锁杆4的前端侧错开,即可不需提高凸轮构件3和闩锁杆4的强度,也能将闩锁杆4的前端强力地顶压在容器本体侧的孔部上。To achieve such an effect, it is necessary to increase the strength of the
但是,若使支点5和前端侧错开,就必须将闩锁杆4的基端部向上方推上的距离拉长,因此造成为了保持该推上的距离而必须加厚盖体1厚度的问题。However, if the
此外,盖体内表面通常都设有抵压晶片的压片,从上方抵压住容纳在容器本体内的半导体晶片的进行支持,但是当半导体晶片直径增大时,支持各半导体晶片的力量也需要增加。因此晶片压片所承受的来自半导体晶片的反作用力也跟着增加。而且,在半导体晶片的容纳片数增加的情形下也同样地,会使来自半导体晶片的反作用力增加。其结果,反作用力会使盖体以及晶片压片向外侧弯曲而使晶片压片中央部分的抵压力减弱,因此在来自外部的震动传达到时,会造成半导体晶片旋转的问题。In addition, the inner surface of the cover is usually provided with a pressing piece against the wafer, which supports the semiconductor wafer contained in the container body from above, but when the diameter of the semiconductor wafer increases, the strength of supporting each semiconductor wafer also needs to be increased. Increase. Therefore, the reaction force from the semiconductor wafer that the wafer presser bears also increases. Furthermore, similarly, when the number of accommodated semiconductor wafers increases, the reaction force from the semiconductor wafers increases. As a result, the reaction force bends the cover body and the wafer holder outward to weaken the pressing force of the center of the wafer holder, so when external shock is transmitted, the semiconductor wafer may rotate.
本发明是针对上述问题点而设的,故本发明之目的为:提供一种薄板支持容器用盖体,能够不增加体积而强力可靠地加以固定,即使在来自外部的震动传达到内时也能防止薄板的转动。解决问题的手段The present invention is made in view of the above-mentioned problems. Therefore, the object of the present invention is to provide a cover for a thin-plate support container that can be firmly and reliably fixed without increasing the volume, even when shocks from the outside are transmitted to the inside. Can prevent the rotation of the thin plate. means of solving problems
第1发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:具备能轻易对上述容器本体进行固定及固定解除的可装卸的简易装卸机构,该简易装卸机构,具备:接合构件,能够伸出而接合于上述容器本体侧;推出构件,能够跟该接合构件连结而伸出缩入;前端侧凸轮,在利用上述推出构件推出上述接合构件时,将上述接合构件的前端侧顶向一边;以及基端侧凸轮,在推出上述接合构件时,将上述接合构件的基端侧顶向另一边。The cover body for a sheet-holding container of the first invention is a cover body for a sheet-holding container that closes the container body of a sheet-holding container containing a plurality of sheets and is conveyed therein, and is characterized in that: A detachable simple loading and unloading mechanism for fixing and releasing the fixing. The simple loading and unloading mechanism includes: an engaging member capable of extending out and engaging with the container body side; a pushing member capable of being connected with the engaging member to extend and retract; a side cam that pushes the front end side of the above-mentioned joint member to one side when the above-mentioned joint member is pushed out by the above-mentioned push-out member; .
根据上述构成,在用推出构件将接合构件推出时,前端侧凸轮将接合构件的前端侧顶向一边,同时基端侧凸轮也将接合构件的基端侧顶向另一侧。如此,盖体即可固定于容器本体侧上。According to the above configuration, when the joint member is pushed out by the pushing member, the front cam pushes the front end side of the joint member to one side, and the proximal cam also pushes the proximal side of the joint member to the other side. In this way, the cover body can be fixed on the side of the container body.
第2发明的薄板支持容器用盖体,特征是在第1发明的薄板支持容器用盖体中的,上述前端侧凸轮,具备将上述接合构件的前端侧顶向一边的斜面。The lid body for a thin-plate holding container according to the second invention is characterized in that in the lid body for a thin-plate holding container according to the first invention, the front end side cam has an inclined surface pushing the front end side of the joining member to one side.
根据上述构成,用前端侧凸轮的斜面,即可将接合构件的前端侧顶向一边,接合在容器本体侧上。According to the above configuration, the front end side of the joining member can be pushed to one side by the inclined surface of the front end side cam, and joined to the container main body side.
第3发明的薄板支持容器用盖体,特征是在第1或第2发明的薄板支持容器用盖体中,上述基端侧凸轮,具备将上述接合构件的基端侧顶向另一边的斜面。The lid body for a thin-plate holding container according to the third invention is characterized in that in the lid body for a thin-plate holding container according to the first or second invention, the base end side cam is provided with a slope that pushes the base end side of the joining member toward the other side. .
根据上述构成,用基端侧凸轮的斜面,即可将接合构件的基端侧顶向另一边,接合在容器本体侧上。According to the above configuration, the base end side of the joint member can be pushed to the other side by the inclined surface of the base end side cam, and joined to the container body side.
第4发明的薄板支持容器用盖体,特征是在第1到第3发明中任一的薄板支持容器用盖体中,其中上述接合构件的前端侧,设有接合构件的旋转的支点部。A cover for a thin-plate holding container according to a fourth invention is characterized in that in the cover for a thin-plate holding container according to any one of the first to third inventions, a fulcrum for rotation of the joining member is provided on the front end side of the joining member.
根据上述构成,接合构件以支点部为中心而旋转。支点部因为设在接合构件的前端侧,根据杠杆原理可以将盖体强力顶压于容器本体上。According to the above configuration, the joint member rotates around the fulcrum. Since the fulcrum is provided on the front end side of the joining member, the lid can be strongly pressed against the container body by the principle of leverage.
第5发明的薄板支持容器用盖体,特征是在第1到第4发明中任一的薄板支持容器用盖体中,上述简易装卸机构,设为可自由装卸,同时其构成零件也组装为可分开拆解。The lid body for thin-plate holding containers of the fifth invention is characterized in that in any one of the lid bodies for thin-plate holding containers of the first to fourth inventions, the above-mentioned simple attachment and detachment mechanism is set to be freely attachable and detachable, and its constituent parts are also assembled as Can be disassembled separately.
根据上述构成,在清洗的时候,可轻易拆卸分解成各构成零件的取出,并分别清洗。如此,不但可将所有角落清洗干净,同时还可迅速干燥。According to the above structure, when cleaning, it can be easily disassembled and disassembled to take out the constituent parts and clean them separately. In this way, not only can all corners be cleaned, but also dry quickly.
第6发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有能用来对容纳于上述容器本体内薄板进行支持的薄板抵压件,该薄板抵压件具有相互交替配置的支持片。A cover for a sheet-holding container according to the sixth invention is a cover for a sheet-holding container that closes the container body of a sheet-holding container containing a plurality of sheets and is transported, and is characterized in that: A thin plate pressing member for supporting the thin plate in the above-mentioned container body, the thin plate pressing member has supporting pieces arranged alternately.
根据上述构成,互相交替配置的支持片即可支持薄板周围边缘。此时,薄板周围边缘上通过各支持片相互交替顶接,可靠地进行支持。According to the above configuration, the supporting pieces arranged alternately can support the peripheral edge of the thin plate. At this time, the surrounding edges of the thin plate are connected alternately with each other through the supporting pieces, so as to be reliably supported.
第7发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于支持容纳在上述容器本体内的薄板的薄板抵压件,上述薄板抵压件,由具有相互交替配设的支持片的两个顶接片,和弹性支持该各顶接片的弹性支持板部所组成,上述弹性支持板部安装为可支持各顶接片之间以及两侧,同时,各顶接片之间的弹性支持板部,以稍微浮起的状态来支持各顶接片。A lid for a thin plate holding container according to a seventh invention is a lid for a thin plate holding container that closes the container body of a thin plate supporting container that contains a plurality of thin plates and is transported, and is characterized in that: The thin plate resisting part of the thin plate in the container body, the thin plate resisting part is composed of two top joints with supporting plates arranged alternately, and an elastic support plate part elastically supporting the top joints. The elastic support plate part is installed to support between each top piece and both sides, and at the same time, the elastic support plate part between each top piece supports each top piece in a slightly floating state.
根据上述构成,因为将各顶接片之间的弹性支持板部以距离安装面稍微浮起的状态,支持顶接片,所以通常可以用并不太强的力量来支持薄板。在薄板支持容器不小心掉落等情形发生等,受到来自外部的较大冲击时,各顶接片之间的弹性支持板部与支持面顶接,而强力地支持各顶接片。如此,即可保护薄板不受强力冲击影响。According to the above configuration, since the elastic supporting plate portion between the top tabs supports the top tabs in a state slightly raised from the mounting surface, the thin plate can usually be supported with not too strong force. When the thin-plate supporting container is accidentally dropped, etc., and receives a large impact from the outside, the elastic support plate portion between the top pieces contacts the support surface to strongly support the top pieces. In this way, the sheet can be protected from strong impacts.
第8发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有盖体固定件,在安装在上述容器本体上的状态下从外侧覆盖的进行固定。The cover body for a sheet-holding container according to the eighth invention is a cover body for a sheet-holding container for sealing a container body of a sheet-holding container containing a plurality of sheets inside for transportation, and is characterized in that a cover fixing member is provided, In the state attached to the above-mentioned container body, it is covered and fixed from the outside.
根据上述构成,可以将盖体固定件安装在容器本体上的支持盖体。如此,即使掉落等强烈冲击发生,盖体也不会离开容器本体。According to the above configuration, the cover fixing member can be attached to the support cover on the container body. In this way, even if a strong impact such as dropping occurs, the lid body will not separate from the container body.
第9发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内的薄板进行支持的薄板抵压件,该薄板抵压件具有多数并列配设而且分别直接顶接上述多片薄板的顶接片,上述并列的各顶接片,形成为使位于中央侧的部分比位于其两侧的部分,更向上述薄板侧隆起。A cover for a sheet-holding container according to a ninth invention is a cover for a sheet-holding container that closes the container body of a sheet-holding container containing a plurality of sheets and is transported, and is characterized in that: The thin plate resisting part supported by the thin plate in the container body, the thin plate resisting part has a plurality of top joints arranged in parallel and directly connected to the plurality of thin plates respectively, and each of the above parallel top joints is formed so that it is located in the center The part on the side protrudes toward the side of the thin plate more than the parts located on both sides.
根据上述构成,配设为中央侧比两侧更向薄板侧隆起的各顶接片,可吸收盖体的弯曲,而用均等的力量来支持各薄板。According to the above configuration, the top tabs arranged so that the central side protrudes toward the thin plate side more than the two sides can absorb the bending of the lid body and support the thin plates with equal force.
第10发明的薄板支持容器用盖体,特征是在第9发明的薄板支持容器用盖体中,上述薄板抵压件,具备:固定于盖体内表面侧上的基端支持部以及由该基端支持部所支持而分别支持上述各顶接片一端的多个弹性支持板部,支持着上述各顶接片的各弹性支持板部,形成为使位于中央侧的上述顶接片比位于其两侧的上述顶接片,更向上述薄板侧隆起。The cover body for a thin-plate holding container according to the tenth invention is characterized in that in the cover body for a thin-plate holding container according to the ninth invention, the above-mentioned thin plate pressing member includes: a base end support portion fixed on the inner surface side of the cover; A plurality of elastic support plate parts supported by the end support part and respectively supporting one end of each of the above-mentioned top tabs supports each elastic support plate part of each of the above-mentioned top tabs, and is formed so that the above-mentioned top tabs positioned at the central side are larger than those positioned at the other top tabs. The above-mentioned top tabs on both sides further protrude toward the above-mentioned thin plate side.
根据上述构成,各弹性支持板部,因为在并列配设的各顶接片当中,中央侧比两侧更向薄板侧隆起的进行支持,所以能够吸收盖体的弯曲,而用均等的力量来支持各薄板。According to the above-mentioned structure, each elastic support plate portion, because among each top tab that arranges side by side, center side is more than both sides protrudes toward thin plate side and supports, so can absorb the bending of lid body, and with equal strength Each sheet is supported.
第11发明的薄板支持容器用盖体,特征是在第9发明的薄板支持容器用盖体中,上述薄板抵压件,具备:固定于盖体内表面侧的基端支持部,由该基端支持部所支持而分别支持上述顶接片一端的多个一侧弹性支持板部,以及分别支持上述各顶接片另一端而顶接于上述盖体内表面侧的多个另一侧弹性支持板部,支持着上述各顶接片的各个一侧弹性支持板部以及另一侧弹性支持板部其中之一或两者,形成为使位于中央侧的上述顶接片比位于其两侧的上述顶接片,更向上述薄板侧隆起。The lid body for a thin-plate holding container of the eleventh invention is characterized in that in the lid body for a thin-plate holding container of the ninth invention, the above-mentioned thin plate pressing member is provided with a base end support portion fixed on the inner surface side of the lid, and the base end The supporting part is supported by a plurality of one-side elastic support plate parts that respectively support one end of the above-mentioned top tabs, and a plurality of other-side elastic support plates that respectively support the other ends of the above-mentioned top tabs and are connected to the inner surface of the above-mentioned cover. One or both of the one-side elastic support plate part and the other side elastic support plate part supporting each of the above-mentioned top tabs are formed so that the above-mentioned top tab on the central side is larger than the above-mentioned top tab on both sides. The top tab further bulges toward the side of the sheet.
根据上述构成,因为一侧的弹性支持板部或者另一侧支持板部,在并列配设的各顶接片当中,中央侧比两侧更向薄板侧隆起的进行支持,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。According to the above-mentioned structure, because the elastic support plate portion on one side or the support plate portion on the other side, among the top tabs arranged in parallel, the central side is more raised to the thin plate side than the two sides to support, so the cover can be absorbed. The bending of each sheet is supported with equal force.
第12发明的薄板支持容器用盖体,特征是在第9发明的薄板支持容器用盖体中,上述薄板抵压件,具备:固定于盖体内表面侧的基端支持部,由该基端支持部所支持而分别支持上述各顶接片一端的多个一侧弹性支持板部,分别支持上述各顶接片另一端而顶接于上述盖体内表面侧的多个另一侧弹性支持板部,以及设于上述盖体内表面侧而顶接于上述另一侧弹性支持板部以支持该另一侧支持板部的支持用凸条,上述支持用凸条以及另一侧弹性支持板部其中之一或两者,形成为使位于中央侧的上述顶接片比位于其两侧的上述顶接片,更向上述薄板侧隆起。The cover body for a thin-plate holding container according to the twelfth invention is characterized in that in the cover body for a thin-plate holding container according to the ninth invention, the above-mentioned thin plate pressing member is provided with a base end support portion fixed on the inner surface side of the cover, and the base end Supported by the supporting part and respectively supporting a plurality of one-side elastic support plates at one end of each of the above-mentioned top tabs, respectively supporting the other ends of each of the above-mentioned top tabs and a plurality of other-side elastic support plates that are abutted on the inner surface of the above-mentioned cover. part, and the support ridge provided on the inner surface of the cover and abutted against the other side elastic support plate to support the other side support plate, the support ridge and the other side elastic support plate One or both of them are formed so that the above-mentioned top tab located on the central side is more raised toward the side of the thin plate than the above-mentioned top tabs located on both sides thereof.
根据上述构成,因为支持用凸条或者另一侧支持板部,在并列配设的各顶接片当中,中央侧比两侧更向薄板侧隆起的进行支持,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。According to the above-mentioned structure, because the supporting protruding line or the other side supporting plate part, among the top tabs arranged in parallel, the central side is more raised to the thin plate side than the two sides to support, so the bending of the cover can be absorbed. Instead, each sheet is supported with an equal force.
第13发明的薄板支持容器用盖体,特征是在第9到第12发明中任一的薄板支持容器用盖体中,上述顶接片具有倾斜角度为40°~44°的V字形沟槽。A cover body for a thin-plate holding container according to a thirteenth invention is characterized in that in any one of the cover body for a thin-plate holding container according to any one of the ninth to twelfth inventions, the above-mentioned top tab has a V-shaped groove with an inclination angle of 40° to 44°. .
根据上述构成,因为薄板的边缘部,嵌合于具有倾斜角度为40°~44°的V字形沟槽,所以该V字形沟槽可抓住薄板边缘,更可靠地支持各薄板。According to the above configuration, since the edges of the thin plates are fitted into the V-shaped grooves having an inclination angle of 40° to 44°, the V-shaped grooves can catch the edges of the thin plates and support the thin plates more reliably.
第14发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内薄板进行支持的薄板抵压件,该薄板抵压件具有:两个基端支持部,固定于盖体内表面侧;顶接片,沿上述薄板周围边缘配设有多数个并直接顶接于该薄板上;两个弹性支持板部,分别由上述各基端支持部所支持而能支持上述多个顶接片当中的两端的顶接片的外侧端;连接支持板部,将上述各顶接片之间互相连接的支持各顶接片;以及,支持用构件,防止沿该连接支持板部的上述盖体内表面的位移发生,并容许在上述盖体内表面的垂直方向上的变动。A cover for a sheet-holding container according to a fourteenth invention is a cover for a sheet-holding container that closes the container body of a sheet-holding container containing a plurality of sheets and is transported, and is characterized in that: The thin plate resisting part supported by the thin plate in the container body, the thin plate resisting part has: two base end support parts, fixed on the inner surface side of the cover; Connected to the thin plate; two elastic support plate parts are respectively supported by the above-mentioned base end support parts and can support the outer ends of the two ends of the above-mentioned top joint pieces; connect the support plate parts, and the above-mentioned Each of the top tabs is connected to each other to support the top tabs; and, the supporting member prevents the displacement of the inner surface of the above-mentioned cover along the connecting support plate portion, and allows the variation in the vertical direction of the inner surface of the above-mentioned cover. .
根据上述构成,多片顶接片当中,两端的顶接片的外侧端,用弹性支持板部进行支持,各顶接片之间则用连接支持板部进行支持,同时,用支持用构件来支持该连接支持板部,而能使各顶接片可靠地支持薄板的周围边缘。尤其,各顶接片之间,是用支持用构件进行支持的连接支持板部来支持,故可防止各顶接片沿盖体内表面位移,可靠地支持薄板。According to the above structure, among the multi-piece top tabs, the outer ends of the top tabs at both ends are supported by the elastic support plate portion, and the connection support plate portion is used to support the respective top tabs. Supporting the connection support plate portion enables each top tab to reliably support the peripheral edge of the thin plate. In particular, the top tabs are supported by the connecting support plate portion supported by the supporting member, so that the top tabs are prevented from being displaced along the inner surface of the cover, and the thin plate is reliably supported.
第15发明的薄板支持容器用盖体,特征是在第14发明的薄板支持容器用盖体中,上述支持用构件,具备可个别支持上述各连接支持板部的支持用肋,使其不沿上述盖体内面发生位移。The lid body for thin-plate holding containers of the fifteenth invention is characterized in that in the lid body for thin-plate holding containers of the fourteenth invention, the above-mentioned supporting members are provided with supporting ribs capable of individually supporting each of the above-mentioned connection supporting plate parts so that they do not follow the Displacement occurs on the inside of the above-mentioned cover body.
根据上述构成,因用支持用肋来支持连接支持板部,故可防止各顶接片沿盖体内面位移,可靠地支持薄板。According to the above structure, since the connecting support plate portion is supported by the supporting rib, displacement of each top piece along the inner surface of the cover can be prevented, and the thin plate can be supported reliably.
第16发明的薄板支持容器用盖体,特征是在第14发明的薄板支持容器用盖体中,上述支持用构件,具备嵌合突起,用来嵌合于设在上述连接支持板部上的嵌合孔,来防止上述连接支持板部沿上述盖体内表面发生位移,并容许其在上述盖体内面垂直方向上的变动。The cover body for thin-plate holding containers of the sixteenth invention is characterized in that in the cover body for thin-plate holding containers of the fourteenth invention, the above-mentioned support members are provided with fitting protrusions for fitting into the connecting support plate parts. The fitting hole is used to prevent the above-mentioned connecting support plate from being displaced along the inner surface of the above-mentioned cover, and to allow its variation in the vertical direction on the inner surface of the above-mentioned cover.
根据上述构成,嵌合突起可嵌合于设在连接支持板部的嵌合孔内,而对连接支持板部进行支持,故可防止各顶接片沿盖体内表面位移,可靠地支持薄板。According to the above structure, the fitting protrusions can be fitted into the fitting holes provided in the connection support plate to support the connection support plate, so that the displacement of the top tabs along the inner surface of the cover can be prevented, and the thin plate can be reliably supported.
第17发明的薄板支持容器用盖体,特征是在第14发明的薄板支持容器用盖体中,上述连接支持板部用来支持上述顶接片的弹性力,比上述弹性支持板部用来支持上述顶接片的弹性力更为强力。The lid body for thin-plate holding containers of the seventeenth invention is characterized in that in the lid body for thin-plate holding containers of the fourteenth invention, the elastic force used by the above-mentioned connecting support plate portion to support the above-mentioned top tab is larger than that used by the above-mentioned elastic support plate portion. The elastic force supporting the above-mentioned top tab is stronger.
根据上述构成,因连接支持板部用来支持顶接片的弹性力更强,故可消除薄板抵压件的中央部和端部之间弹性力(支持力)的差异,而使抵压薄板的力量在整体上都能平均,更可靠地支持薄板。According to the above structure, since the elastic force of the connecting support plate portion for supporting the top tab is stronger, the difference in elastic force (supporting force) between the central portion and the end portion of the thin plate pressing member can be eliminated, and the thin plate can be pressed against. The force can be averaged as a whole, and the thin plate can be supported more reliably.
第18发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内薄板进行支持的薄板抵压件,该薄板抵压件具有直接的顶接上述薄板的支持该薄板的顶接片,该顶接片,具有与上述薄板的边缘部嵌合的V字沟,该V字沟的倾斜角设定为20°-60°。A lid for a thin plate holding container according to an eighteenth invention is a lid for a thin plate holding container that closes the container body of a thin plate holding container that contains a plurality of thin plates and is transported, and is characterized in that: A thin-plate pressing member for supporting the thin plate in the container body, the thin-plate pressing member has a top piece that directly abuts the above-mentioned thin plate and supports the thin plate, and the top joint has a V-shaped joint that fits with the edge of the above-mentioned thin plate groove, the inclination angle of the V-shaped groove is set to 20°-60°.
根据上述构成,将上述顶接片的V字沟与薄板嵌合,该薄板的边缘部切入V字沟。此时,V字沟的倾斜角设定为20°-60°,通过薄板的边缘部切入V字沟的进行支持。进而,将顶接片从薄板脱离的时候,切入V字沟的薄板,并不与V字沟拉出的,平滑的分离。V字沟的倾斜角设定为20°以下的话,在将顶接片从薄板脱离的时候,会使得薄板从V字沟中拉出的掉出来。V字沟的倾斜角设定为60°以上的话,朝向顶接片的V字沟的薄板的缺口不够使得产生旋转。将V字沟的倾斜角设定为20°-60°,能够兼有防止朝向薄板的V字沟的缺口导致的旋转,和平滑的分离的效果。According to the above configuration, the V-shaped groove of the above-mentioned top tab is fitted into the thin plate, and the edge portion of the thin plate is cut into the V-shaped groove. At this time, the inclination angle of the V-shaped groove is set at 20°-60°, and the edge of the thin plate is cut into the V-shaped groove for support. Furthermore, when the top tab is separated from the thin plate, the thin plate cut into the V-shaped groove is not pulled out from the V-shaped groove, and is separated smoothly. If the inclination angle of the V-shaped groove is set to be less than 20°, when the top tab is separated from the thin plate, the thin plate will be pulled out from the V-shaped groove and fall out. If the inclination angle of the V-shaped groove is set to be more than 60°, the notch of the thin plate facing the V-shaped groove of the top tab is not enough to cause rotation. Setting the inclination angle of the V-shaped groove to 20°-60° can prevent rotation due to the notch of the V-shaped groove facing the thin plate and achieve smooth separation.
第19发明的薄板支持容器用盖体,特征是在第18发明的薄板支持容器用盖体中,上述V字沟上,具有在将上述薄板的边缘部嵌合的状态下该薄板的边缘部和该V字沟的底部之间具有间隙。A cover body for a thin-plate holding container according to a nineteenth invention is characterized in that in the cover body for a thin-plate holding container according to the eighteenth invention, the V-shaped groove has an edge portion of the thin plate in a state where the edge portion of the thin plate is fitted. There is a gap between it and the bottom of the V-shaped groove.
根据上述构成,顶接片的V字沟与薄板嵌合,该薄板的边缘部切入V字沟,此时,由于薄板的边缘部和V字沟的底部之间具有间隙使得相互之间不发生接触,能够将薄板的边缘部与V字沟的倾斜面强力抵压的进行安装。如此,能够通过将薄板切入V字沟的可靠地进行支持。According to the above structure, the V-shaped groove of the top tab is fitted into the thin plate, and the edge of the thin plate is cut into the V-shaped groove. At this time, there is no gap between the edge of the thin plate and the bottom of the V-shaped groove. In contact, the edge of the thin plate can be strongly pressed against the inclined surface of the V-shaped groove for installation. In this way, it is possible to securely support by cutting the thin plate into the V-shaped groove.
第20发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内薄板进行支持的薄板抵压件,该薄板抵压件具有直接的顶接上述薄板的支持该薄板的顶接片,该顶接片,具有与上述薄板的边缘部的边缘角相同的倾斜角度的V字沟,同时,在该V字沟与上述薄板的边缘部嵌合的状态下该薄板的边缘部和上述V字沟的底部之间具有间隙。A lid for a thin plate holding container according to a twentieth invention is a lid for a thin plate holding container that closes the container body of a thin plate holding container that contains a plurality of thin plates and is transported, and is characterized in that: A thin plate pressing member for supporting the thin plate in the container body, the thin plate pressing member has a top piece directly abutting against the thin plate to support the thin plate, and the top joint has the same edge angle as the edge portion of the above thin plate The V-shaped groove at an inclined angle also has a gap between the edge of the thin plate and the bottom of the V-shaped groove in a state where the V-shaped groove is fitted with the edge of the thin plate.
根据上述构成,顶接片的V字沟与薄板嵌合,该薄板的边缘部的边缘角与V字沟的倾斜角度匹配,在大面积范围内进行接触。此时,由于薄板的边缘部和V字沟的底部之间具有间隙使得相互之间不发生接触,能够让薄板的边缘部和V字沟的倾斜面在大面积范围进行接触的状态下强力抵压的安装。According to the above configuration, the V-shaped groove of the top tab fits into the thin plate, and the edge angle of the edge portion of the thin plate matches the inclination angle of the V-shaped groove, thereby making contact over a large area. At this time, since there is a gap between the edge of the thin plate and the bottom of the V-shaped groove so that there is no contact with each other, it is possible to forcefully resist the edge of the thin plate and the inclined surface of the V-shaped groove in a large area. pressure installation.
第21发明的薄板支持容器用盖体,特征是在第20发明的薄板支持容器用盖体中,上述顶接片的V字沟的倾斜角度设定为44°。The lid body for thin-plate holding containers of the 21st invention is characterized in that in the lid body for thin-plate holding containers of the 20th invention, the inclination angle of the V-shaped groove of the top tab is set to 44°.
根据上述构成,边缘角度设定为44°的薄板,与设定为44°的倾斜角度的顶接片的V字沟嵌合,薄板的边缘部和V字沟之间匹配,以大面积范围进行接触的状态下强力抵压的安装。According to the above-mentioned structure, the thin plate whose edge angle is set to 44° is fitted with the V-shaped groove of the top piece whose inclination angle is set to 44°, and the edge of the thin plate matches the V-shaped groove to achieve a large-area range. Mounting with strong pressure while in contact.
第22发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内薄板进行支持的薄板抵压件,将该薄板抵压件顶接上述薄板的支持该薄板的时候,因它的反作用力而向外侧变形的中央部上,预先形成有朝向上述容器本体侧的凹陷,使得能够抵消该变形。A cover body for a thin plate holding container according to a twenty-second invention is a cover body for a thin plate holding container for closing a container body of a thin plate holding container containing a plurality of thin plates inside for transportation, and is characterized in that: The thin plate supporting part for supporting the thin plate in the container body, when the thin plate supporting part is pressed against the thin plate supporting the thin plate, the central part deformed outward due to its reaction force is formed in advance toward the above container body. The indentation of the side makes it possible to counteract this deformation.
根据上述构成,通过使得薄板支持容器用盖体的中央部隆起,在用薄板抵压件与薄板顶接的支持该薄板的时候,能够吸收它的反作用力。在支持薄板的时候的反作用力使得薄板支持容器用盖体的中央部向外侧变形,该弯曲使得预先凹陷的中央部成为平坦的状态而抵消,能够以平均的力支持整个薄板。According to the above configuration, by raising the central portion of the cover for the thin plate supporting container, when the thin plate is supported by the thin plate pressing member in contact with the thin plate, the reaction force thereof can be absorbed. The reaction force when supporting the thin plate deforms the central portion of the lid for the thin plate supporting container outward, and this bending cancels out by making the pre-depressed central portion flat, so that the entire thin plate can be supported with an average force.
第23发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为:备有用于对容纳于上述容器本体内薄板进行支持的薄板抵压件,将该薄板抵压件顶接上述薄板的支持该薄板的时候,将因它的反作用力而向外侧变形的周围的增强用凸缘,预先形成为朝向上述容器本体侧弯曲,使得能够抵消该变形。A cover body for a thin plate holding container according to the twenty-third invention is a cover body for a thin plate holding container that closes the container body of a thin plate supporting container containing a plurality of thin plates and is transported, and is characterized in that: When the thin plate supporting member supported by the thin plate in the container body is pressed against the thin plate supporting the thin plate, the surrounding reinforcement flange deformed outward due to its reaction force is formed in advance as Bending toward the above-mentioned container body side makes it possible to counteract this deformation.
根据上述构成,通过将薄板支持容器用盖体的周围的增强用凸缘进行预先的弯曲,在用薄板抵压件与薄板顶接的支持该薄板的时候,能够吸收它的反作用力。支持薄板的时候的反作用力使得增强用凸缘向外侧变形,该变形使得预先形成为弯曲的增强用凸缘成为直线形状而抵消,能够以平均的力支持整个薄板。According to the above configuration, by pre-bending the reinforcing flange around the thin plate supporting container lid, the reaction force can be absorbed when the thin plate is supported by the thin plate pressing member in contact with the thin plate. The reaction force at the time of supporting the thin plate deforms the reinforcing flange outward, and this deformation cancels out the previously curved reinforcing flange into a straight shape, so that the entire thin plate can be supported with an average force.
第24发明的薄板支持容器用盖体,是将内部容纳有多片薄板的进行搬运的薄板支持容器的容器本体塞住的薄板支持容器用盖体,其特征为在周围形成的增强用凸缘上加入增强构件的嵌入(insert)成形。A cover body for a sheet-supporting container according to a twenty-fourth invention is a cover body for a sheet-holding container that closes the container body of a sheet-holding container containing a plurality of sheets and is conveyed therein, and is characterized in that it has a reinforcing flange formed around it. Adding reinforcement components to the insert (insert) forming.
根据上述构成,由于在薄板支持容器用盖体的周围形成的增强用凸缘上加入增强用构件的嵌入(insert)成形,在用薄板抵压件与薄板顶接的支持该薄板的时候,能够抵抗它的反作用力,能够以平均的力支持整个薄板。According to the above structure, since the reinforcement flange formed around the cover of the thin plate supporting container is insert-molded with a reinforcing member, when the thin plate is supported by the thin plate pressing member in contact with the thin plate, it is possible to Resists its reaction force and can support the entire sheet with an average force.
发明效果Invention effect
如同以上所详述,如使用本发明的薄板支持容器,可获得以下功效:As described in detail above, if the thin plate support container of the present invention is used, the following effects can be obtained:
(1)因为接合构件是用杠杆原理推出,故可将生产线用盖体强力并可靠地固定于容器本体上。(1) Since the engaging member is pushed out using the principle of leverage, the cover for the production line can be firmly and securely fixed to the container body.
(2)因为简易装卸机构可轻易拆卸分解成各构成零件,在清洗时可卸下取出的各零件分别清洗,不但可将所有角落清洗干净,也可迅速干燥。(2) Because the simple loading and unloading mechanism can be easily disassembled and disassembled into various components, the parts can be removed and cleaned separately during cleaning, not only can clean all corners, but also dry quickly.
(3)因为互相交替配设支持片,薄板周围边缘上有各支持片相互交替顶接,所以能够可靠地进行支持。(3) Since the supporting pieces are arranged alternately, and the supporting pieces are alternately abutted against each other on the peripheral edge of the thin plate, it can be reliably supported.
(4)因为并列的各顶接片当中,位于中央侧的比位于两侧的更向薄板侧隆起,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。(4) Among the side-by-side top tabs, the center side bulges toward the sheet side more than the side pieces, so the bending of the lid can be absorbed, and the sheets can be supported with an equal force.
(5)因为各弹性支持板部,在并列的配设的各顶接片当中,位于中央侧的比位于两侧的更向薄板侧隆起,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。(5) Since each elastic supporting plate portion, among the top pieces arranged side by side, is located on the central side is more raised toward the thin plate side than on both sides, it can absorb the bending of the cover body and use equal force to support each sheet.
(6)因为一侧的弹性支持板部或者另一侧弹性支持板部,在并列的配设的各顶接片当中,位于中央侧的比位于两侧的更向薄板侧隆起,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。(6) Because the elastic support plate portion on one side or the elastic support plate portion on the other side, among the top pieces arranged side by side, the one on the central side is raised toward the thin plate side than the ones on both sides, so it can absorb The bending of the cover body supports each thin plate with equal strength.
(7)因为支持用凸条或者另一侧弹性支持板部,在并列的配设的各顶接片当中,位于中央侧的比位于两侧的更向薄板侧隆起,故可吸收盖体的弯曲,而用均等的力量来支持各薄板。(7) Because of the protruding ribs for support or the elastic support plate portion on the other side, among the top tabs arranged in parallel, the one located on the central side is more raised toward the thin plate side than the ones located on both sides, so that the cover body can be absorbed. bend, while supporting each sheet with equal force.
(8)因各顶接片之间的连接支持板部,是通过支持用构件进行支持的,故可防止各顶接片沿盖体内表面位移,可靠地支持薄板。(8) Since the connecting support plate portion between the top pieces is supported by the supporting member, the displacement of the top pieces along the inner surface of the cover can be prevented, and the thin plate can be reliably supported.
(9)因以支持用肋来支持连接支持板部,故可防止各顶接片沿盖体内表面位移,可靠地支持薄板。(9) Since the connecting support plate portion is supported by the supporting rib, displacement of each top piece along the inner surface of the cover can be prevented, and the thin plate can be reliably supported.
(10)因嵌合突起部分可嵌合于设在连接支持板部的嵌合孔内,而对连接支持板部进行支持,故可防止各顶接片沿盖体内表面位移,可靠地支持薄板。(10) Since the fitting protrusions can be fitted into the fitting holes provided on the connection support plate to support the connection support plate, it is possible to prevent the displacement of each top piece along the inner surface of the cover and reliably support the thin plate .
(11)因连接支持板部用来支持顶接片的弹性力更强,故可消除薄板抵压件的中央部和端部之间的支持力的差异,而使抵压薄板的力量在整体上都能平均,更确实的支持薄板。(11) Since the elastic force used to support the top tab by connecting the supporting plate part is stronger, the difference in supporting force between the central part and the end of the thin plate pressing part can be eliminated, so that the force against the thin plate is integrated in the whole It can be averaged and support the thin plate more reliably.
(12)由于顶接片的V字沟的倾斜角设定为20°-60°,薄板的边缘部切入V字沟的进行支持,防止了薄板的旋转。进而,将顶接片从薄板脱离的时候,也能够将切入V字沟的薄板,不从V字沟中拉出的,平滑的分离。如此,能够可靠地支持薄板,同时,容易的卸下盖体。(12) Since the inclination angle of the V-shaped groove of the top tab is set at 20°-60°, the edge of the thin plate is cut into the V-shaped groove for support, preventing the rotation of the thin plate. Furthermore, when the top tab is separated from the thin plate, the thin plate cut into the V-shaped groove can be smoothly separated without being pulled out from the V-shaped groove. In this way, the thin plate can be reliably supported, and at the same time, the cover can be easily detached.
(13)由于薄板的边缘部和顶接片的V字沟的底部之间具有间隙,V字沟与薄板嵌合的时候,薄板的边缘部和V字沟的底部相互不发生接触,使得薄板的边缘部和V字沟的倾斜面强力抵压的安装。如此,将薄板切入V字沟的可靠地支持。(13) Since there is a gap between the edge of the thin plate and the bottom of the V-shaped groove of the top tab, when the V-shaped groove and the thin plate are fitted, the edge of the thin plate and the bottom of the V-shaped groove do not contact each other, so that the thin plate The edge part and the inclined surface of the V-shaped groove are strongly pressed against the installation. In this way, the v-shaped groove is reliably supported when the thin plate is cut.
(14)由于顶接片,备有具有与薄板的边缘角相同的倾斜角度的V字沟,同时,在该V字沟与上述薄板的边缘部嵌合的状态下该薄板的边缘部和上述V字沟的底部之间具有间隙,使得薄板的边缘部的边缘角和V字沟的倾斜角度相匹配的以较大面积范围的进行接触,根据薄板的边缘部和V字沟的底部之间的间隙,将薄板的边缘部和V字沟强力抵压的安装。换句话说,即使顶接片没有强力抵压的安装在薄板上,也能够将薄板的边缘部强力抵压的安装在V字沟的倾斜面上。其结果是,即使薄板抵压件用不怎么强的抵压安装薄板,也能够通过该薄板抵压件可靠地支持该薄板,防止振动等导致的薄板的旋转。如此,不必增强盖体的强度,即使用不怎么强的力将盖体安装在容器本体上也能够可靠地支持薄板。(14) Since the top tab is provided with a V-shaped groove having the same inclination angle as the edge angle of the thin plate, at the same time, the edge of the thin plate and the above-mentioned There is a gap between the bottom of the V-shaped groove, so that the edge angle of the edge of the thin plate and the inclination angle of the V-shaped groove match to make contact in a larger area, according to the gap between the edge of the thin plate and the bottom of the V-shaped groove Install by firmly pressing the edge of the sheet against the V-shaped groove. In other words, even if the top tab is not installed on the thin plate with strong pressure, the edge of the thin plate can be installed on the inclined surface of the V-shaped groove with strong pressure. As a result, even if the thin plate pressing member is attached to the thin plate with a weak pressing force, the thin plate can be reliably supported by the thin plate pressing member and rotation of the thin plate due to vibration or the like can be prevented. In this way, the thin plate can be reliably supported even if the lid is attached to the container body with a moderate force without increasing the strength of the lid.
(15)由于顶接片的V字沟的倾斜角度设定为44°,该V字沟,与边缘角设定为44°的薄板匹配,以较大的面积范围进行接触的强力抵压的安装。其结果是,即使薄板抵压件用不怎么强的抵压安装薄板,也能通过该薄板抵压件可靠地支持薄板,防止振动等导致的薄板的旋转。如此,即使盖体用不怎么强的抵压安装在容器本体上,也能够可靠地支持薄板,防止振动等导致的薄板的旋转。如此,不必增强盖体的强度,即使用不怎么强的力将盖体安装在容器本体上也能够可靠地支持薄板。(15) Since the inclination angle of the V-shaped groove of the top contact piece is set to 44°, the V-shaped groove matches the thin plate whose edge angle is set to 44°, and contacts with a large area range for strong resistance Install. As a result, even if the thin plate pressing member is attached to the thin plate with not so strong pressing force, the thin plate can be reliably supported by the thin plate pressing member and rotation of the thin plate due to vibration or the like can be prevented. In this way, even if the cover body is attached to the container body with a weak pressing force, the thin plate can be reliably supported and rotation of the thin plate due to vibration or the like can be prevented. In this way, the thin plate can be reliably supported even if the lid is attached to the container body with a moderate force without increasing the strength of the lid.
(16)由于薄板支持容器用盖体的中央部凹陷,通过上述凹陷抵消了在薄板抵压件与薄板顶接的支持该薄板的时候的反作用力导致的薄板支持容器用盖体的中央部的变形,能够用均匀的力支持整个薄板,所以能够防止振动等导致的薄板的旋转。(16) Since the central part of the lid body for the thin plate supporting container is depressed, the depression in the central portion of the lid body for the thin plate supporting container caused by the reaction force when the thin plate pressing member abuts against the thin plate and supports the thin plate is offset. Deformation can support the entire sheet with a uniform force, so rotation of the sheet due to vibration, etc., can be prevented.
在薄板支持容器用盖体的周围的增强用凸缘向上述容器本体侧变形的场合也是,通过向上述容器本体侧的变形抵消了在薄板抵压件与薄板顶接的支持该薄板的时候的反作用力导致的增强用凸缘的弯曲,能够用均匀的力支持整个薄板,所以能够防止振动等导致的薄板的旋转。Also in the case where the reinforcement flange around the lid of the thin plate supports the container is deformed toward the container body, the deformation to the container body cancels the effect of supporting the thin plate when the thin plate pressing member abuts against the thin plate. The bending of the reinforcing flange due to the reaction force can support the entire sheet with a uniform force, so that the rotation of the sheet due to vibration or the like can be prevented.
(17)由于本体部的周围的增强用凸缘上加入了增强用构件的形成嵌入(insert)的进行增强,在薄板抵压件支持薄板的时候,抵抗它的反作用力的用均匀的力支持整个薄板,所以能够防止振动等导致的薄板的旋转。(17) Since the strengthening flange around the main body is formed by adding a reinforcing member to insert (insert) for reinforcement, when the thin plate pressing member supports the thin plate, it is supported by a uniform force against its reaction force The entire thin plate, so it is possible to prevent the rotation of the thin plate caused by vibration or the like.
附图说明Description of drawings
图1为显示本发明第1实施例的生产线用盖体的部分立体图。FIG. 1 is a partial perspective view showing a production line cover according to a first embodiment of the present invention.
图2为显示先前技术的薄板支持容器用盖体的侧面剖面图。Fig. 2 is a side sectional view showing a prior art lid for a sheet-supporting container.
图3为显示本发明第1实施例的薄板支持容器的立体图。Fig. 3 is a perspective view showing a thin plate holding container according to the first embodiment of the present invention.
图4为显示本发明第1实施例的薄板支持容器在取下盖体时的立体图。Fig. 4 is a perspective view showing the thin-plate holding container according to the first embodiment of the present invention when the cover is removed.
图5为显示本发明第1实施例的薄板支持容器的盖体支承部分的立体图。Fig. 5 is a perspective view showing a cover support portion of the thin-plate holding container according to the first embodiment of the present invention.
图6为显示本发明第1实施例的薄板支持容器的盖体承受部的部分剖面图。Fig. 6 is a partial sectional view showing a lid receiving portion of the thin-plate holding container according to the first embodiment of the present invention.
图7为显示本发明第1实施例的生产线用盖体的上面立体图。Fig. 7 is a top perspective view showing a production line cover according to the first embodiment of the present invention.
图8为显示本发明第1实施例的生产线用盖体的下面立体图。Fig. 8 is a bottom perspective view showing a production line cover according to the first embodiment of the present invention.
图9为显示本发明第1实施例的接合构件的上面立体图。Fig. 9 is a top perspective view showing the joining member according to the first embodiment of the present invention.
图10为显示本发明第1实施例的接合构件的下面立体图。Fig. 10 is a bottom perspective view showing the joining member according to the first embodiment of the present invention.
图11为显示本发明第1实施例的接合构件的侧面剖面图。Fig. 11 is a side sectional view showing a joining member according to a first embodiment of the present invention.
图12为显示本发明第1实施例的推出构件的上面立体图。Fig. 12 is a top perspective view showing the push-out member according to the first embodiment of the present invention.
图13为显示本发明第1实施例的推出构件的下面立体图。Fig. 13 is a bottom perspective view showing the push-out member according to the first embodiment of the present invention.
图14为显示本发明第1实施例的推出构件的俯视图。Fig. 14 is a plan view showing the push-out member of the first embodiment of the present invention.
图15为显示本发明第1实施例的推出构件的内面图。Fig. 15 is an internal view showing the push-out member of the first embodiment of the present invention.
图16为显示本发明第1实施例的保持盖的上面立体图。Fig. 16 is a top perspective view showing the holding cap of the first embodiment of the present invention.
图17为显示本发明第1实施例的保持盖的下面立体图。Fig. 17 is a bottom perspective view showing the holding cap of the first embodiment of the present invention.
图18为显示本发明第1实施例的盖体压件的上面立体图。Fig. 18 is a top perspective view showing the lid pressing part of the first embodiment of the present invention.
图19为显示本发明第1实施例的盖体压件的下面立体图。Fig. 19 is a perspective view showing the bottom of the cover pressing member according to the first embodiment of the present invention.
图20为显示本发明第1实施例的晶片抵压件的侧面图。Fig. 20 is a side view showing the wafer holding member according to the first embodiment of the present invention.
图21为显示本发明第1实施例的晶片抵压件的立体图。Fig. 21 is a perspective view showing a wafer holding member according to the first embodiment of the present invention.
图22为显示本发明第1实施例的晶片抵压件的立体图。Fig. 22 is a perspective view showing a wafer holding member according to the first embodiment of the present invention.
图23为显示本发明第1实施例的盖体固定件的立体图。FIG. 23 is a perspective view showing the cover fixing member according to the first embodiment of the present invention.
图24(A)~(D)为显示本发明第1实施例的简易装卸机构动作的模式图。24(A)-(D) are schematic diagrams showing the operation of the simple loading and unloading mechanism of the first embodiment of the present invention.
图25为显示本发明第1实施例第1变形例的晶片抵压件的侧面图。Fig. 25 is a side view showing a wafer holding member according to a first modification of the first embodiment of the present invention.
图26为显示本发明第1实施例第1变形例的晶片抵压件的立体图。Fig. 26 is a perspective view showing a wafer holding member according to a first modification of the first embodiment of the present invention.
图27为显示本发明第1实施例第1变形例的晶片抵压件的立体图。Fig. 27 is a perspective view showing a wafer holding member according to a first modification of the first embodiment of the present invention.
图28为显示本发明第1实施例第2变形例的晶片抵压件的立体图。Fig. 28 is a perspective view showing a wafer holding member according to a second modified example of the first embodiment of the present invention.
图29为显示本发明第1实施例第2变形例的晶片抵压件的前视图。Fig. 29 is a front view showing a wafer holding member according to a second modification of the first embodiment of the present invention.
图30为显示本发明第1实施例第3变形例的晶片抵压件的立体图。Fig. 30 is a perspective view showing a wafer holding member according to a third modification of the first embodiment of the present invention.
图31为显示本发明第1实施例第3变形例的晶片抵压件的重要部位剖面图。Fig. 31 is a cross-sectional view showing important parts of a wafer holding member according to a third modified example of the first embodiment of the present invention.
图32为显示本发明第1实施例第4变形例的晶片抵压件的立体图。Fig. 32 is a perspective view showing a wafer holding member according to a fourth modification of the first embodiment of the present invention.
图33为显示本发明第1实施例第4变形例的晶片抵压件的前视图。Fig. 33 is a front view showing a wafer holding member according to a fourth modification of the first embodiment of the present invention.
图34为显示本发明第2实施例的晶片抵压件的重要部位立体图。Fig. 34 is a perspective view showing important parts of a wafer holding member according to a second embodiment of the present invention.
图35为显示本发明第2实施例的包含晶片抵压件的盖体内面立体图。Fig. 35 is a perspective view showing the inner surface of the cover including the wafer holding member according to the second embodiment of the present invention.
图36为显示本发明第2实施例的包含晶片抵压件的盖体内面的部分立体图。36 is a partial perspective view showing the inner surface of the cover including the wafer holding member according to the second embodiment of the present invention.
图37为显示本发明第2实施例的卸下晶片抵压件后的盖体内面状态的重要部分立体图。37 is a perspective view of important parts showing the state of the inner surface of the cover with the wafer holding member removed according to the second embodiment of the present invention.
图38为显示本发明第2实施例的卸下晶片抵压件后的盖体内面状态的部分立体图。38 is a partial perspective view showing the state of the inner surface of the cover with the wafer holding member removed according to the second embodiment of the present invention.
图39为显示本发明第2实施例的支持用肋剖面状态的立体图。Fig. 39 is a perspective view showing a sectional state of a support rib according to a second embodiment of the present invention.
图40为显示本发明第2实施例的晶片抵压件的重要部分扩大图。Fig. 40 is an enlarged view of important parts showing a wafer holding member according to a second embodiment of the present invention.
图41为显示本发明第2实施例的晶片抵压件的顶接片的重要部分扩大图。Fig. 41 is an enlarged view of important parts showing the top tab of the wafer holding member according to the second embodiment of the present invention.
图42为显示本发明第2实施例的晶片抵压件的顶接片的重要部分扩大图。Fig. 42 is an enlarged view of important parts showing the top tab of the wafer holding member according to the second embodiment of the present invention.
图43为显示本发明第2实施例的晶片抵压件的顶接片的重要部分剖面图。Fig. 43 is a sectional view of important parts showing the top tab of the wafer holding member according to the second embodiment of the present invention.
图44为显示本发明第2实施例变形例的重要部分立体图。Fig. 44 is a perspective view of important parts showing a modified example of the second embodiment of the present invention.
图45为显示本发明第2实施例变形例的重要部分剖面图。Fig. 45 is a sectional view of important parts showing a modified example of the second embodiment of the present invention.
(附图标记说明)(Description of Reference Signs)
1 盖体1 cover
2 本体2 body
3 凸轮构件3 cam member
4 闩锁杆4 Latch lever
5 支点5 pivot
6 凸轮部分6 cam part
7 连结开口部7 Link opening
8 S字形凸轮随动部分8 S-shaped cam follower part
11 薄板支持容器11 thin plate support container
12 容器本体12 container body
12A、12B、12C、12D 侧壁部12A, 12B, 12C, 12D side wall
12E 底板部12E bottom plate
12F 开口12F opening
13 薄板支持部13 thin plate support part
14 运送用盖体14 Cover for transportation
15 生产线用盖体15 cover for production line
16 顶端凸缘16 Top flange
17 搬运用把手17 Handles for carrying
21 盖体承接部21 Cover receiving part
21A 垂直板部21A vertical plate
21B 水平板部21B Horizontal deck
21C 密封沟槽21C sealing groove
22 舌簧片22 tongue reed
23 第一被嵌合部23 The first embedded part
24 第二被嵌合部24 The second part to be fitted
26 运输用简易装卸机构26 Simple loading and unloading mechanism for transportation
30 本体部30 Body
31 舌簧片承受部31 Reed receiving part
32 简易装卸机构32 Simple loading and unloading mechanism
33 凹部33 concave part
34 开口34 opening
36 旋转支持轴36 Rotary support shaft
37 挡止件37 stopper
37A 承受部37A receiving part
38 接合爪38 engaging claw
39 基端下侧凸轮39 base end lower side cam
39A 斜面39A inclined plane
40 前端侧凸轮40 front side cam
40A 斜面40A inclined plane
40B 嵌合凹部40B Fitting recess
42 接合构件42 joint member
43 推出构件43 Launch components
44 凸轮机构44 cam mechanism
45 保持盖45 retaining cover
46 盖板压件46 cover plate press
51 连结轴51 connecting shaft
52 基端侧滑动接面52 Sliding joint on base end side
53 基端上侧凸轮53 base end upper side cam
53A 斜面53A inclined plane
54 上侧沟部54 upper side groove
55 支点部55 fulcrum
55A 前端侧滑动接面55A front side sliding joint
56 前端嵌合部56 Front end fitting part
57 基端侧板部57 base end side plate
58 前端侧板部58 front side panel
61 顶板部61 top plate
62 键沟62 keyway
63 旋转筒部63 rotating barrel
64 长孔部64 long hole
64A 一端部64A One end
64B 另一端部64B The other end
64C 壁面64C wall
65 系合片65 Series Composite Films
65A 突起部65A Protrusion
66 缺口66 gaps
69 顶压凸轮的突起69 The protrusion of the pressing cam
71 推出构件保持部71 push out member holding part
72 接合构件保持部72 Joint member holding part
74 周边板74 peripheral board
75 顶板75 top plate
76 键孔76 keyhole
78 侧板78 side panels
78A 宽幅部78A wide part
78B 窄幅部78B Narrow section
79 顶板79 top plate
80 支持用突起80 Protrusions for support
81 缝隙81 Gap
82 隆起部82 Elevation
82A 中央隆起片82A Central raised piece
82B 左右接合片82B left and right joint piece
85 侧板85 side panels
86 顶板86 top plate
86A 十字状缺口86A Cross-shaped notch
87 上侧支持板片87 Upper support plate
88 下侧支持板片88 Lower support plate
88A 楔子88A Wedge
91 晶片抵压件91 wafer pressure piece
92 基端支持部92 base end support
93 弹性支持板部93 Elastic support plate part
93A 第一支持板片93A The first support plate
93B 第二支持板片93B Second support plate
94 顶接片94 Top tab
94A 第一顶接片94A First top tab
94B 第二顶接片94B Second top tab
96 角块96 corner blocks
96A 倾斜面96A inclined surface
96B 顶接面96B top joint
97 支持爪97 Support claw
100 盖体固定件100 cover fixing parts
101 支持板部101 support plate
102 钩部102 hook
103 嵌合突起103 Chimeric protrusions
110 基端支持部110 base end support
111 弹性支持板部111 Elastic support plate part
112 顶接片112 Top tab
112A 倾斜面112A inclined surface
112B 顶接面112B top joint
113 支持爪113 Support claw
115 角块115 corner blocks
115A 顶接面115A top junction
120 半导体晶片120 semiconductor wafers
121 晶片抵压件121 wafer pressure piece
122 基端支持部122 base end support
123 弹性支持板部123 Elastic support plate part
124 顶接片124 top tab
124A V字型嵌合沟124A V-shaped fitting groove
125 连接支持板部125 Connect the support board
125A、125B 纵向板部125A, 125B longitudinal plate
125C 横向板部125C Transverse plate
126 支持用肋126 Support ribs
127 盖体127 cover body
128 钩状支持部128 hook support
129、130 支持壁部129, 130 support wall
131 支持用凸条131 Ribs for support
133 支持板片133 support pattern
134 分隔板片134 Partition plates
141 崁合孔141 combined hole
142 崁合突起142 Coupling protrusions
S 间隙S gap
具体实施方式Detailed ways
以下,基于附图说明本发明的实施例。本发明的薄板支持容器,是使用在容纳半导体晶片、记忆磁盘、液晶玻璃基板等的薄板的保管、运送、生产线等过程中的容器。此外,在此是以容纳半导体晶片的薄板支持容器为例进行说明。塞住薄板支持容器的盖体,分为运送用盖体及生产线上用盖体而分开使用。Hereinafter, embodiments of the present invention will be described based on the drawings. The sheet supporting container of the present invention is a container used in processes such as storage, transportation, and production line of thin sheets containing semiconductor wafers, memory disks, liquid crystal glass substrates, and the like. In addition, the thin-plate support container which accommodates a semiconductor wafer is demonstrated here as an example. Caps for plugging thin plate support containers are divided into transport caps and production line caps and used separately.
第1实施例first embodiment
本实施例的薄板支持容器11,如图3~8所示,是由:内部可容纳多片半导体晶片(并未图示)的容器本体12、分别设在该容器本体12内相对的两侧壁上用来从两侧支持容纳于内部的半导体晶片的2个薄板支持部13、塞住容器本体12的运送用盖体14和生产线用盖体15、以工厂内搬运装置(并未图示)的腕部所握持住的顶端凸缘16、以及作业员用手搬运薄板支持容器11时所抓握的搬运用手把17所构成。The thin
容器本体12如图3、4所示,整体是大致形成立方体。此容器本体12在纵向放置的状态(图3、4所示之状态),是由形成周围四面壁的4片侧壁部12A、12B、12C、12D和底板部12E所构成,其上部设有开12F。此容器本体12在半导体晶片生产线等上和晶片搬运用机器人(并未图示)相对而进行安装时是呈横向放置。此横向放置状态下作为底部的侧壁部12A的外侧,设有用来为薄板支持容器11定位的装置(并未图示)。在横向放置状态下作为顶板部的侧壁部12A的外侧上安装有可自由装卸的顶端凸缘16。在横向放置状态下作为横向壁部的侧壁部12C、12D的外侧上则安装有可自由装卸的握持搬运用手把17。As shown in FIGS. 3 and 4 , the
容器本体12的各侧壁部12A、12B、12C、12D的上端部,如图5和图6所示,设有用来嵌合盖体4的盖体承接部21。此盖体承接部21是将容器本体12的上端部扩张到盖体4的尺寸大小而形成。如此,盖体4即可嵌合于盖体承接部21的垂直板部21A的内侧,顶接于水平板部21B,而可安装在盖体承接部21上。此外,水平板部21B上也于其整个周围边缘上设有一整圈密封沟槽21C,安装于运送用盖体14的下侧面上的舌簧片22则嵌合的使薄板支持容器11的内部密封。盖体承接部21的四个角落的垂直板部21A的内侧面设有第一被嵌合部23,用来将后述运输用简易装卸机构26的盖体接合爪(并未图示)嵌合的将运送用盖体14固定于容器本体12侧上。该第一被嵌合部23,是使垂直板部21A凹陷成四角形状而形成,使盖体接合爪可以嵌合在其内侧上表面。The upper ends of the
此外,在各第一被嵌合部23附近设第二被嵌合部24。此第二被嵌合部24是在生产线上所使用。第二被嵌合部24嵌合有生产线用盖体15的简易装卸机构32的接合构件42,将生产线用盖体15固定于容器本体12侧。In addition, a second fitted
运送用盖体14是公知的盖体。此运送用盖体14呈盘状,使其中央部呈圆桶状向上拱起,以避免接触到容纳于内部的半导体晶片的上部。The
运送用盖体14的四角,如图3、4所示,设有运输用简易装卸机构26,可将运送用盖体14自由装卸的固定在容器本体12上。此运输用简易装卸机构26具备有盖体接合爪(并未图示),呈由运送用盖体14周边突起的状态。此盖体接合爪形成为能够嵌合于第一被嵌合部23上。The four corners of the
生产线用盖体15,是可将运送来的薄板支持容器11的容器本体12原封不动直接使用在工厂内的生产线上的盖体。此生产线用盖体15是和上述薄板支持容器11分别单独设置的制品而放置在半导体制造工厂等地。生产线用盖体15如图7、8所示,由本体部30、盖板(并未图示)和简易装卸机构32所构成。The
本体部30整体为薄壁的大致形成四角形状同时它的周围形成增强用凸缘,在容器本体12的盖体承接部21装上的状态下并不突出于外部。本体部30下部周围安装有舌簧片承受部31。此舌簧片承受部31上设有(并未图示)的舌簧片,在本体部30安装在盖体承接部21上的状态下,嵌合于密封沟槽21C而使得容器本体12内能被密封。此外,舌簧片和运送用盖体14的舌簧片22同样可配合密封沟槽21C的形状而适当形成。The
生产线用盖体15的本体部30当中,较长方向的两侧(图7中为左上、右下方向两侧)的端部上,分别设置有可安装简易装卸机构32的凹部33。此凹部33是将本体部30端部大致呈长方形凹陷而形成的。凹部33的长方向两端部(图7中右上、左下方向两端部)上,设有可让后述的接合构件42的前端嵌合部56进出的开口34。此开口34所设置的位置,是在本体部30嵌合于盖体承接部21的状态下,可和盖体承接部21的第二被嵌合部24匹配的位置。凹部33底部上分别安装有:旋转支持轴36、挡止件37、接合爪38、基端下侧凸轮39、前端侧凸轮40。凹部33安装有可自由装卸的盖板。此盖板在清洗设于凹部33内的简易装卸机构32时可以卸下。In the
旋转支持轴36是用来支持如后所述的推出构件43而使其能旋转的构件。旋转支持轴36是设为由底部隆起成圆柱状。此旋转支持轴36,嵌合于推出构件43的旋转筒部63,支持住推出构件43而使其能够旋转。挡止件37是将推出构件43以保持在所定角度旋转的状态下进行支持的构件。此挡止件37在旋转支持轴36周围的两处,由底部上升的板状构件所构成。使此板状构件弯曲形成承受部37A。将推出构件43的系合片65的突起部65A嵌合于此承受部37A,即可以用预定的角度支持推出构件43。The
接合爪38,是用于将后述的盖板压件46固定于凹部33底部的构件。因为盖板压件46分别安装在凹部33的长方向两侧上,配合于此接合爪38也在凹部33较长方向两侧上分别各安装6个。接合爪38是以L字型的构件构成,能让盖板压件46的下侧支持板片88嵌合。The engagement claw 38 is a member for fixing a
基端下侧凸轮39和前端侧凸轮40是构成后述的凸轮机构44的构件。此外,基端下侧凸轮39和后述的基端上侧凸轮53,构成了在接合构件42推出时,将接合构件42的基端侧向下推压的基端侧凸轮。The base-end
基端下侧凸轮39,如图1以及图7所示,是伴随接合构件42的推出,而用来将其基端侧推向(推下)另外一方(图1的下方)的构件。此基端下侧凸轮39分别设在旋转支持轴36两侧。基端下侧凸轮39的侧面剖面形状大致成三角形,具备有使得接合构件42的基端侧能上下的斜面39A。此斜面39A精加工成镜面,以减少和接合构件42的基端侧滑动接面52之间的摩擦阻力。As shown in FIGS. 1 and 7 , the base end
前端侧凸轮40,是伴随接合构件42的推出,而用来将其前端嵌合部56顶向(往上推)一侧(图1的上方)的构件。此前端侧凸轮40是在凹部33的长方向两端部,以面对开口34的状态而设置。前端侧凸轮40的侧面剖面形状大致成三角形,具备有能将接合构件42的前端侧向上方举上的斜面40A。此斜面40A精加工成镜面,以减少其和接合构件42的支点部55的前端侧滑动接面55A之间的摩擦阻力。斜面40A上端部设置有嵌合凹部40B。此嵌合凹部40B是将接合构件42的支点部55嵌合的部分。The front
凹部33内设有简易装卸机构32。此简易装卸机构32是使得生产线用盖体15能够轻易装卸于容器本体12的装置。简易装卸机构32,如图1所示,由接合构件42、推出构件43、凸轮机构44、保持盖45、以及盖板压件46所构成。A simple loading and
接合构件42,是用于在生产线用盖体15装在容器本体12的盖体承接部21上的状态下,从本体部30的开口34伸出,嵌合于盖体承接部21的第二被嵌合部24的构件。此接合构件42,如图1、图9~图11所示,由连结轴51、基端侧滑动接面52、基端上侧凸轮53、上侧沟部54、支点部55、前端嵌合部56、基端侧板部57、以及前端侧板部58所构成。The engaging
连结轴51,嵌合于后述的推出构件43的长孔部64,是用来将推出构件43和接合构件42互相连结的构件。连结轴51形成为圆棍状,在接合构件42的基端部上朝向上侧而设。The
基端侧滑动接面52,可滑动的接于基端下侧凸轮39的斜面39A,是用来使接合构件42的基端部上下运动的部分。此基端侧滑动接面52,是将接合构件42的基端部下侧斜向切削而形成。基端侧滑动接面52,精加工成镜面,以减少其和基端下侧凸轮39的斜面39A之间的摩擦阻力。在将此基端侧滑动接面52可滑动的接于基端下侧凸轮39的斜面39A的状态下,通过推出接合构件42的方法,将接合构件42的基端部向下方抵压,通过将接合构件42收进的方法,将接合构件42的基端部向上方顶起。The base end side sliding
基端上侧凸轮53,是和基端下侧凸轮39一同,使接合构件42的基端部上下动作的部分。此基端上侧凸轮53,是在杠杆原理中的着力点的部分。此外,连结轴51并非作为杠杆原理的着力点,而仅仅是在接合构件42出入动作时接受长方向力量的部分。The proximal
基端上侧凸轮53,设置于接合构件42的基端部附近朝向上侧处。基端上侧凸轮53的侧面剖面形状大致成三角形状,具备可使接合构件42的基端侧上下的斜面53A而构成。此基端上侧凸轮53的斜面53A,和基端下侧凸轮39的斜面39A同样的,精加工成镜面,以便和后述的保持盖45侧的顶压凸轮的突起69滑接。基端上侧凸轮53的斜面53A,设定为和基端下侧凸轮39的斜面39A大致平行。如此,在顶压凸轮的突起69和基端上侧凸轮53的斜面53A滑接的状态下,将接合构件推出时,用顶压凸轮的突起69顶压基端上侧凸轮53的使得接合构件42的基端部向下方压下。此外,当接合构件42被收入时,基端侧滑动接面52被抵压在基端下侧凸轮39的斜面39A上,而使接合构件42的基端部被向上方顶起。The proximal
支点部55,是支持接合构件42的前端部而成为旋转中心的部分。此支点部55,是作为杠杆原理的支点部分。支点部55,在接合构件42的前端附近下侧,形成大致成直角的尖角。此尖角的支点部55的顶点部分上形成有前端侧滑动接面55A。此前端侧滑动接面55A,是滑接于前端侧凸轮40的斜面40A,用来使接合构件42的前端嵌合部56上下动作的部分。前端侧滑动接面55A,是将支点部55的顶点部分斜向切削形成的。前端侧滑动接面55A,精加工成镜面,以减少其和前端侧凸轮40的斜面40A之间的摩擦阻力。此前端侧滑动接面55A滑接于前端侧凸轮40的斜面40A的状态下,利用接合构件42的推出动作,将接合构件42的前端嵌合部56抵压向上方,而利用接合构件42收回的动作,则将接合构件42前端部顶向下方顶压。The
并且,支点部55,嵌合于前端侧凸轮40的嵌合凹部40B,即可以此嵌合凹部40B为中心而旋转。Further, the
前端嵌合部56,从凹部33的开口34向外部伸出,是直接嵌合于盖体承接部21的第二被嵌合部24的部分。此前端嵌合部56,是杠杆原理中的作用点。为了使前端嵌合部56在嵌合于盖体承接部21的第二被嵌合部24状态下,能够充分发挥能力,故设在距离支点部55非常近的位置。The front
基端侧板部57和前端侧板部58,是支持接合构件42而用于容许其来回运动的构件。The base end
推出构件43,是连结于接合构件42而用于使接合构件42伸出收入动作的构件。此推出构件43,可旋转的安装于凹部33的旋转支持轴36上。推出构件43,如图1、7、12~15所示,由顶板部61、键沟62、旋转筒部63、长孔部64、以及系合片65所构成。The push-
顶板部61大致形成为圆盘形。在和此顶板部61相对的两处所,开设有用来设置系合片65的缺口66。The
键沟62,是在用盖体装卸装置(并未图标),自动的装卸生产线用盖体15之际,用来嵌合装置的闩锁键的构槽。此键沟62,设于顶板部61的上侧面的中心。The keyway 62 is a groove for fitting the latch key of the device when the
旋转筒部63,是用于将推出构件43可旋转的安装于凹部33的旋转支持轴36上的构件。此旋转筒部63,设于顶板部61下侧面的中央部。并且使键沟62位于此旋转筒部63的中心。The
长孔部64,是用来将推出构件43的转动,变换成接合构件42的出入动作的部分。长孔部64分别设置在和顶板部61相对的两处所。此长孔部64的一端部64A在顶板部61的中心附近,另一端部64B则在比较远处,构成螺旋的一部分。接合构件42的连结轴51在和长孔部64的一端部64A嵌合时,接合构件42被拉进,而在另一端部64B嵌合时,接合构件42则伸出。The
长孔部64当中在顶板部61的下侧面上,设有平缓倾斜的壁面64C。此壁面64C,在长孔部64的一端部64A和顶板部61的下侧面同样高度上,设定为越接近另一端部就会越高。这是因为要将接合构件42和推出构件43可靠地连结的原因。换句话说,接合构件42的连结轴51在长孔部64的另一端部64B嵌合而伸出的状态下,因为接合构件42的基端部被向下方推压,即使在此基端部被压下的状态下,连结轴51也能可靠地嵌合于长孔部64。In the
系合片65,是支持推出构件43使其只能旋转预定角度的构件。系合片65,分别设在和顶板部61周围边缘相对的两处所。系合片65,由从顶板部61开始沿着周围边缘延伸的板状构件所构成。系合片65的前端部,设有嵌合于挡止件37的承受部37A的突起部65A。并且,系合片65具有弹性,弹性的支持突起部65A。此突起部65A嵌合于挡止件37的承受部37A,即可在推出构件43旋转所定角度时(使得接合构件42伸出而将生产线用盖体15固定于容器本体12上的角度)进行支持。The
凸轮机构44,是用推出构件43将伸出的接合构件42的前端嵌合部56嵌合于盖体承接部21的第二被嵌合部24的状态下,顶接于此第二被嵌合部24的上表面的,将生产线用盖体15压下的固定于容器本体12侧的构件。此凸轮机构44,可将用推出构件43伸出的接合构件42的前端嵌合部56向上压的顶接于第二被嵌合部24上表面的同时,根据将基端部向下顶压的方法中的杠杆原理将生产线用盖体15压下并固定于容器本体12侧。凸轮机构44,由基端下侧凸轮39、基端上侧凸轮53、基端侧滑动接面52、顶压凸轮的突起69、前端侧凸轮40以及前端侧滑动接面55A所构成。附带说明,基端下侧凸轮39、基端上侧凸轮53、基端侧滑动接面52、前端侧凸轮40以及前端侧滑动接面55A都和上述相同。The
顶压凸轮的突起69,顶接于基端上侧凸轮53的斜面53A,是用来随着接合构件42的推出而将接合构件42的基端部压下的构件。此顶压凸轮的突起69,设在保持盖45的下侧面。具体而言,是在将接合构件42的基端侧滑动接面52滑接于基端下侧凸轮39的斜面39A的状态下,设置为使得顶压凸轮的突起69和基端上侧凸轮53的斜面53A之间毫无间隙的滑接的位置上。The
保持盖45,是用来保持接合构件42和推出构件43的构件。保持盖45,如图16、17所示,由推出构件保持部71和接合构件保持部72所构成。The holding
推出构件保持部71,用于支持推出构件43同时容许其转动的构件。此推出构件保持部71,由周边板74和顶板75所构成。周边板74覆盖推出构件43的周边的形成。顶板75则覆盖推出构件43的上侧的形成。顶板75的中央部,设有和推出构件43的键沟62同样大小的键孔76。此键孔76,在顶板75覆盖住推出构件43的状态下,和推出构件43的键沟62匹配。如此,接合构件42在收进的状态下,键沟62和键孔76即可匹配。The push-out
接合构件保持部72,是在容许接合构件42的那种来回运动的状态下用来支持接合构件42的构件。此接合构件保持部72,分别设在推出构件保持部71的左右两侧。各接合构件保持部72,由侧板78和顶板79所构成。The joining
侧板78,是为从左右支持接合构件42基端附近用的构件。侧板78由宽幅部78A和窄幅部78B所构成。宽幅部78A是接合构件42的基端侧板部57插入的部分。窄幅部78B则为插入接合构件42的基端侧板部57和前端侧板部58之间的部分。The
顶板79,用来从上侧支持接合构件42的构件。此顶板的下侧面的基端部,设有上述的顶压凸轮的突起69。顶板79的下侧面的前端,设有嵌合于接合构件42的上侧沟部54的支持用突起80。在顶板的前端侧设有缝隙81,此缝隙81的前端设有隆起部82。此隆起部82,由中央隆起片82A和左右接合片82B所构成,而由缝隙81弹性的进行支持。此隆起部82的中央隆起片82A和左右接合片82B,通过嵌合于盖板压件46的十字状缺口86A的方式,在保持盖45和盖板压件46之间定位。The
盖板压件46,如图1、18、19所示,是用来将保持盖45固定于生产线用盖体15的凹部33上的构件。具体而言,两个盖板压件46分别支持住接合构件保持部72,而将保持盖45固定于凹部33上。此盖板压件46,由侧板85、顶板86、上侧支持板片87和下侧支持板片88所构成。The
各侧板85分别覆盖住接合构件42左右两边,容许接合构件42的来回动作。顶板86在一体地支持各侧板85的同时,也覆盖接合构件42的上侧,容许接合构件42的来回动作。上侧支持板片87,是从下侧支持住保持盖45的接合构件保持部72的顶板79的构件。接合构件保持部72的顶板79,是以盖板压件46的顶板86和上侧支持板片87从上下分别支持住。下侧支持板片88,是用来将盖板压件46固定于凹部33的部分。下侧支持板片88在各侧板85的下端部分别设有三个。各下侧支持板片88,通过嵌合于设在凹部33上的接合爪38的方式,将盖板压件46固定于凹部33上。各下侧支持板片88上都分别设有楔子88A,以使接合爪38更容易嵌合。Each
运送用盖体14和生产线用盖体15的下侧面,如图20、21、22所示,设有晶片抵压件91作为薄板固定用。此晶片抵压件91,是用来从上侧支持住容纳于容器本体12内的多片半导体晶片的构件。晶片抵压件91由基端支持部92、弹性支持板部93以及顶接片94所构成。As shown in FIGS. 20 , 21 , and 22 , wafer holding members 91 are provided on the undersides of the
基端支持部92,是用于支持弹性支持板部93和顶接片94的构件。基端支持部92横跨晶片抵压件91的全部长度而形成为四角棒状,固定于盖体的下侧面。The base end support portion 92 is a member for supporting the elastic support plate portion 93 and the top piece 94 . The base end support portion 92 is formed in the shape of a square bar across the entire length of the wafer hold-down member 91 and is fixed to the lower surface of the cover.
弹性支持板部93,是用于弹性的支持顶接片94的构件。弹性支持板部93并列设置的数目和容纳于容器本体12内的半导体晶片片数相当。各弹性支持板部93,在横列排列成一列的状态下分别固定在基端支持部92上。弹性支持板部93,由侧面形状弯曲成S字型的第一支持板片93A、以及弯曲成U字型的第二支持板片93B所构成。第一支持板片93A的基端部固定于基端支持部92上,前端部则固定在第一顶接片94A上。第二支持板片93B,它的基端部通过第一顶接片94A而和第一支持板片93A连结成一体,前端部则固定有第二顶接片94B。The elastic support plate portion 93 is a member for elastically supporting the top tab 94 . The number of elastic supporting plate parts 93 arranged in parallel is equivalent to the number of semiconductor chips accommodated in the
顶接片94,是用于直接支持各半导体晶片的构件。各顶接片94,由第一顶接片94A和第二顶接片94B所构成,从两处所分别支持住半导体晶片。各顶接片94由两个角块96和作为交互交替配设的支持片的支持爪97所构成。The top tab 94 is a member for directly supporting each semiconductor wafer. Each top tab 94 is composed of a first top tab 94A and a second top tab 94B, and supports the semiconductor wafer from two places respectively. Each top piece 94 is composed of two corner pieces 96 and supporting claws 97 as supporting pieces arranged alternately.
角块96,具备倾斜面96A和顶接面96B。倾斜面96A,是在两个角块96互相相对安装的状态下形成为可向外侧打开,让半导体晶片周围边缘部可轻易插入两个角块96之间。顶接面96B,是在两个角块96相对安装的状态下,构成具有一定幅宽(比半导体晶片厚度稍微宽一点的幅度)的沟槽而形成。The corner block 96 has an inclined surface 96A and a contact surface 96B. The inclined surface 96A is formed so as to be opened outward when the two corner blocks 96 are installed facing each other, so that the peripheral edge of the semiconductor wafer can be easily inserted between the two corner blocks 96 . The top junction surface 96B is formed by forming a groove with a certain width (a width slightly wider than the thickness of the semiconductor wafer) in a state where the two corner blocks 96 are mounted opposite to each other.
支持爪97,是用于直接接触半导体晶片周围边缘部而进行支持的构件。此支持爪97,分别设于各角块96的顶接面96B上。支持爪97是用细长形的凸条构成,此支持爪97分别交替配设在相对的各顶接面96B上。具体而言,通过在其中之一的顶接面96B两端设两个支持爪97,而在另一顶接面96B中央则设一个支持爪97的方式,使得相对的各支持爪97互相交替配设。各支持爪97用弹性材料形成,可弹性地支持半导体晶片周围边缘部。两个顶接面96B之间的幅宽因为仅仅比半导体晶片厚度稍微宽一点,故配设于各顶接面96B上的支持爪97前端的间隔则比半导体晶片厚度稍微窄一点。因此,半导体晶片在插入各支持爪97之间时,将互相交替配设的弹性材料构成的各个支持爪97稍微压扁一点而插入。如此,互相交替配设的支持爪97即可可靠地支持住半导体晶片的周围边缘部。The support claws 97 are members for directly contacting and supporting the peripheral edge of the semiconductor wafer. The supporting claws 97 are respectively disposed on the top joint surfaces 96B of the corner blocks 96 . The supporting claws 97 are made of elongated protrusions, and the supporting claws 97 are arranged alternately on the opposing top contact surfaces 96B. Specifically, two support claws 97 are set at both ends of one of the top joint surfaces 96B, and one support claw 97 is set at the center of the other top joint surface 96B, so that the opposite support claws 97 alternate with each other. Equipped. Each support claw 97 is formed of an elastic material, and can elastically support the peripheral edge of the semiconductor wafer. Since the width between the two top joints 96B is only slightly wider than the thickness of the semiconductor wafer, the distance between the front ends of the supporting claws 97 disposed on each top joint 96B is slightly narrower than the thickness of the semiconductor wafer. Therefore, when the semiconductor wafer is inserted between the supporting claws 97, the supporting claws 97 made of elastic materials arranged alternately are slightly crushed and inserted. In this way, the supporting claws 97 arranged alternately can reliably support the peripheral edge of the semiconductor wafer.
在生产线用盖体15外侧,设有如图23所示的盖体固定件100。此盖体固定件100,是用于防止生产线用盖体15从容器本体12上脱落的构件。盖体固定件100由:支持板部101、钩部102以及嵌合突起103所构成。On the outside of the
支持板部101,是用来支持钩部102和嵌合突起103的构件。在支持板部101的两端部分别设置钩部102。用此钩部102来钩住容器本体12的凸缘。The support plate portion 101 is a member for supporting the hook portion 102 and the fitting protrusion 103 . Hook portions 102 are respectively provided at both end portions of the support plate portion 101 . The flange of the
嵌合突起103设于支持板部101的一侧面上。嵌合突起103形成为和键沟62同样形状,通过键孔76而嵌合于键沟62。嵌合突起103设置有两个,分别位于和两个键沟62匹配的位置上。如此,即可使钩部102在钩住容器本体12的凸缘的状态下,使得各嵌合突起103嵌合于各键沟62内而将推出构件43固定住。这是因为,在薄板支持容器运输过程中,要防止推出构件43因震动或者冲击而转动,造成对生产线用盖体15的容器本体12的固定松脱之故。The fitting protrusion 103 is provided on one side surface of the support plate portion 101 . The fitting protrusion 103 is formed in the same shape as the key groove 62 and fitted into the key groove 62 through the
如以上说明构成的薄板支持容器11,可如下所说明那样的使用:The thin-
在从容器本体12将生产线用盖体15取下的时候,将闩锁键嵌合于键沟62而进行旋转。如此,即可从图24(A)的状态,转动推出构件43而使得接合构件42逐渐收入。如此,接合构件42的支点部55的前端侧滑动接面55A即可滑动接于前端侧凸轮40的斜面40A,如图24(B)、(C)、(D)所示,将前端嵌合部56向下压下。在此同时,接合构件42的基端侧滑动接面52滑动接于基端下侧凸轮39的斜面39A,而将接合构件42的基端部向上顶起。如此,前端嵌合部56即可完全容纳于本体部30内。而且,生产线用盖体15也可从容器本体12取下。When removing the production line cover 15 from the
在将生产线用盖体15安装于容器本体12时,在盖体承接部21上安装生产线用盖体15的,将闩锁键嵌合于键沟62而进行旋转。如此即可和上述说明相反的,将接合构件42从本体部30压出。此时,接合构件42的支点部55滑动接于前端侧凸轮40的斜面40A而将前端嵌合部56向上方顶起。而且,基端上侧凸轮53的斜面53A也顶接于顶压凸轮的突起69,将接合构件42的基端部向下压。如此,接合构件42的基端侧滑动接面52即可沿着基端下侧凸轮39的斜面39A而顶向下方。When attaching the
接合构件42的支点部55上,将前端侧滑动接面55A嵌合于嵌合凹部40B,使得接合构件42以嵌合凹部40B为中心而旋转。On the
在接合构件42的基端部中,在基端侧滑动接面52滑动接于基端下侧凸轮39的斜面39A的同时,顶压凸轮的突起69也顶接于基端上侧凸轮53的斜面53A,而将接合构件42的基端部向下压下。In the base end portion of the engaging
如此,接合构件42,以嵌合于嵌合凹部40B的支点部55为支点,发挥杠杆作用,在前端嵌合部56嵌合于盖体承接部21的第二被嵌合部24的状态下,将生产线用盖体15向容器本体12侧强力压下的固定。In this way, the
在将生产线用盖体15安装于容器本体12的状态下,装上盖体固定件100。具体而言,是将钩部102钩上容器本体12的凸缘部。如此,即可使得嵌合突起103嵌合于键沟62而将推出构件43进行固定。In a state where the
在容器本体12的内部,半导体晶片的周围边缘部嵌合于顶接片94。顶接片94中,使半导体晶片的周围边缘部嵌入互相交替配设的支持爪97之间,用各支持爪97可靠地进行支持。Inside the
在薄板支持容器11受到来自外部的强烈冲击时,因为接合构件42可藉由杠杆原理来将生产线用盖体15强力顶向容器本体12,故生产线用盖体15不会从容器本体12脱落。而且,因为以盖体固定件100将推出构件43固定,故也不会发生推出构件43转动而使得接合构件42从第二被嵌合部24上脱落的情况。When the
另一方面,薄板支持容器11内的半导体晶片,因为嵌合于晶片抵压件91的顶接片94,且用互相交替配设的支持爪97从两侧支持,故半导体晶片也不会从顶接片94脱落。并且,顶接片94因为由弹性支持板部93支持,故第一支持板片93A和第二支持板片93B可以用本身的弹性,抵于生产线用盖体15下侧面而支持住半导体晶片,防止半导体晶片的破损。On the other hand, the semiconductor wafer in the thin
在清洗的时候,通过错开盖板压件46而从接合爪38取下的方式,简易装卸机构32,即可使接合构件42、推出构件43、凸轮机构44、保持盖45以及盖板压件46全部分开,而能各自的进行清洗并干燥。When cleaning, by staggering the
如上所述,依照薄板支持容器11,可实现以下功效:As described above, according to the
(1)因为利用杠杆原理来将接合构件42推出,故可强力并且可靠地将生产线用盖体15固定于容器本体12。(1) Since the engaging
(2)因为简易装卸机构的各构成零件都能轻易分解,故在清洗的时候,可将卸下的各构成零件进行分解,不但能彻底清洗每个角落,也能迅速进行干燥。(2) Since the parts of the simple loading and unloading mechanism can be easily disassembled, the disassembled parts can be disassembled during cleaning, which can not only clean every corner thoroughly, but also dry quickly.
(3)因为支持爪97互相交替配设,故各支持爪97对半导体晶片的周围边缘分别交替顶接,而能更可靠地进行支持。(3) Since the supporting claws 97 are arranged alternately, each supporting claw 97 alternately butts against the peripheral edge of the semiconductor wafer, thereby enabling more reliable support.
(第2实施例)(second embodiment)
接下来,就本发明第2实施例进行说明。本实施例,是改良晶片抵压件。Next, a second embodiment of the present invention will be described. This embodiment is an improved wafer holding member.
薄板支持容器在运送途中会因为种种因素造成震动。这些震动传达于半导体晶片时,半导体晶片可能因此产生旋转,是非常不利的。因此,在薄板支持容器可能发生震动的情形下时,即可使用本实施例的晶片抵压件(薄板抵压件)。基于图34~图43,说明本实施例的晶片抵压件121。附带说明,除了晶片抵压件121之外,因为都和上述第1实施例的薄板支持容器11同样,故同样构件都使用同样的附图标记而省略其说明。Sheet support containers are subject to vibration due to various factors during transportation. When these vibrations are transmitted to the semiconductor wafer, the semiconductor wafer may rotate accordingly, which is very unfavorable. Therefore, the wafer pressing member (thin plate pressing member) of this embodiment can be used in a situation where the thin plate holding container may vibrate. The
晶片抵压件121,如图40所示,由基端支持部122、弹性支持板部123、顶接片124、连接支持板部125以及支持用肋126所构成。As shown in FIG. 40 , the
基端支持部122,是用来直接支持分别设于晶片抵压件121两端的两个弹性支持板部123的构件。基端支持部122不但形成四角棒状,也跨越晶片抵压件121长方向的全长(图35的上下方向)而形成。盖体127的下侧面分别设有两个钩状支持部128。基端支持部122嵌入各钩状支持部128,而固定于盖体内面侧。The base
弹性支持板部123是用来弹性支持顶接片124的外侧端的构件。两个弹性支持板部123,有和容纳于容器本体12内的半导体晶片120片数同样的数量而并列的设置。各弹性支持板部123,在横向并列成一列的状态下分别固定于基端支持部122。弹性支持板部123弯曲成侧面形状成S字型而构成。两个弹性支持板部123的基端部分别固定于两个基端支持部122上,其前端部分别安装有顶接片124,并弹性地支持各顶接片124。The elastic
顶接片124,是直接顶接于各半导体晶片120的周围边缘部的用来直接支持各半导体晶片120的构件。各顶接片124的一侧面,设有如图42和图43所示的嵌合半导体晶片120的V字型嵌合沟124A。此嵌合沟124A成为两阶段的V字沟。第一段是具有角度124°的和缓倾斜的沟槽。第二段则为具有角度44°倾斜的沟槽。如此,在半导体晶片120边缘接触到第一段沟槽时,此半导体晶片120边缘受到和缓的斜坡导引而进入第二段沟槽,以此第二段沟槽来支持半导体晶片120。第二段沟槽的底部,形成和半导体晶片120厚度大致相同宽幅的平坦面状。此第二段沟槽的倾斜角度和底部的幅度,是配合半导体晶片120边缘的尺寸而形成的。因为半导体晶片120的边缘被截角成44°的缘角,故沟槽的倾斜角度也设定为44°。并且,沟槽底部的宽度,也配合半导体晶片120边缘的尺寸而形成。如此,第二段沟槽,即可抓住半导体晶片120的边缘部,而在更大面积上接触半导体晶片120并可靠地进行支持,震动时也能抑制半导体晶片120旋转。附带说明,第二段沟槽,配合半导体晶片120的边缘角而设定为44°,不过因为顶接片124材质的关系,也可稍微设定为较狭窄的角度。具体而言,依照弹性力的不同而适度的设定在40°~44°左右的范围内均可。不过因为第二段沟槽的角度太窄的话,就会夹死半导体晶片120的边缘部,在抬起盖体127的时候会产生连同半导体晶片120也一起抬起的情况,故将半导体晶片120设定为不会夹死半导体晶片120的角度。此外,在半导体晶片120的斜角角度不同的情形,或者半导体晶片120之外的其它薄板等情形下,可以配合将角度适当的设定在20°~60°左右的范围内。The
嵌合沟124A的底部,如图40和图41所示,设定为沿半导体晶片120的外周围边缘形状的角度,也就是设定成半导体晶片120的外周围边缘的切线方向,如同后述,弹性力和晶片抵压件121的弯曲度成比例增强,因此各顶接片124压住半导体晶片120的力量整体都很平均。换句话说,两个顶接片124的其中之一变化量增加的话,因此变化量增强而使另一顶接片124侧的弹性力增强而将半导体晶片120略为压下,最后让两个顶接片124的弹性力在同样强度的点上平衡,因此结果使得左右两侧可自动调整成同样的弹性力。并且,在盖体127安装于容器本体12上的状态下,设定在嵌合沟124A的大致中央部附近(图41中的接点A)的和底部接触。The bottom of the
连接支持板部125,是用来将两个顶接片124互相连接而进行支持的构件。连接支持板部125的两端部分别连接于各顶接片124而弹性地支持各顶接片124。连接支持板部125弯曲成侧面大致成U字状形成。具体而言,由两侧的纵向板部125A、125B和横向板部125C所构成。纵向板部125A、125B配设在和盖体127的内表面垂直的方向,几乎完全不弯曲的支持各顶接片124。The connection
横向板部125C可弹性的弯曲。连接支持板部125的弹性支持各顶接片124的功能,主要由横向板部125C担当。横向板部125C的两端在分别连接纵向板部125A、125B的状态下,沿着盖体127的内表面的方向配设。横向板部125C,它的中央部是以后述的支持用凸条131所支持,以该支持用凸条131为中心而使其两端部弯曲。The
横向板部125C的变形所发生的弹性力(即连接支持板部125用来支持顶接片124的弹性力),设定为比弹性支持板部123支持顶接片124的弹性力更强。如此,两个顶接片124的内侧端以较强的弹性力支持,而外侧端则以较弱的弹性力支持。而且,两个顶接片124的嵌合沟124A的底部,如同上述,是配设在半导体晶片120的外周围边缘的切线方向上。如此,晶片抵压件121对于半导体晶片120的支持力,设定为随着半导体晶片120的移动量(震动量)成比例增强。换句话说,在一般的状态下,如图41中的实线所示,半导体晶片120在嵌合沟124A底部大致中央部附近(图41中的接点A)接触而进行支持。半导体晶片120发生震动的话,以连接支持板部125的强力弹性力所支持的顶接片124内侧端几乎不发生变化,而由弹性支持板部123的较弱弹性力所支持的外侧端则大幅变化,如图41中的双点虚线所示,半导体晶片120(图41中的接点B侧)由嵌合沟124A底部的支持移动到其内侧端侧。如此,半导体晶片120的震动量较小(晶片抵压件121的弯曲量也较小)的时候,半导体晶片120以其外侧端侧(图41中的接点A侧)接触嵌合沟124A而由较弱的弹性力所支持,当半导体晶片120的震动量增大(晶片抵压件121的弯曲量也增大)时,半导体晶片120的接触点就移动到嵌合沟124A的内侧端侧(图41中的接点B侧)而由强力的弹性力所支持。并且,半导体晶片120的接触点朝内侧端侧移动的移动量越大,加诸于连接支持板部125的力也比弹性支持板部123大的越多,而弹性力也越增强,因此能更有效率的抑制半导体晶片120的震动。The elastic force generated by the deformation of the
支持用肋126,是用来支持连接支持板部125防止在沿着盖体内表面的方向上的位移的支持用构件。支持用肋126,设于如图34~图40所示的盖体127内表面的中央部。支持用肋126设为能够整个覆盖所有配有多数的晶片抵压件121的连接支持板部125。具体而言,设定为:能够将按所容纳的半导体晶片120的片数的份并列设置的连接支持板部125全部嵌合的长度。支持用肋126用两个支持壁部129、130所构成。The
各支持壁部129、130互相相对平行设置。各支持壁部129、130由支持板片133和分隔板片134所构成。The
支持板片133是用来支持连接支持板部125的纵向板部125A、125B,使其不向半导体晶片120的圆周方向(图40的左右方向)位移的构件。支持板片133通过直接支持住连接支持板部125的纵向板部125A、125B的方法,间接支持顶接片124使其不在半导体晶片120的圆周方向上发生位移。The
分隔板片134,是用来将多数配设的连接支持板部125个别区隔的板片。各分隔板片134,分别设置于最外侧以及各连接支持板部125之间。如此,各分隔板片134可在宽度方向上从两侧支持各连接支持板部125。如此,各分隔板片134通过直接支持连接支持板部125的方法,而间接支持顶接片124,使其在和半导体晶片120圆周方向的正交方向上不会发生位移。The
通过上述支持板片133和分隔板片134的方法,可由周围(和容纳于容器本体12内的半导体晶片120的圆周方向的正交方向)夹住连接支持板部125而分别进行支持的方式,防止沿连接支持板部125盖体内表面方向的位移发生,而能允许盖体内表面在垂直方向的变动。By means of the
支持板片133以及分隔板片134,和连接支持板部125之间,设定开有很微小的间隙,在小幅震动的时候可以避免接触。换句话说,半导体晶片120在只有很微小幅度震动时,连接支持板部125可以略弯曲吸收震动而不会和支持板片133、分隔板片134接触。在震动加剧时,因为经各顶接片124而使连接支持板部125震动剧烈,连接支持板部125即可和支持板片133、分隔板片134接触而进行支持。Between the
支持用肋126的两个支持壁部129、130之间,设有如图34、图37~图39所示的支持用凸条131。支持用凸条131,是用于直接顶接各连接支持板部125的进行支持的构件。具体而言,各连接支持板部125的横向板部125C中央部分顶接于支持用凸条131而被支持,横向板部125C的两端部可自由弯曲。支持用凸条131,在互相相对而平行设置的两个支持壁部129、130之间的中央部上,设为和支持壁部129、130平行并且大致相同长度。Between the two
支持用凸条131,成如图38以及图39所示。换句话说,形成的顶接片124中央侧(图38的a侧)较厚而两侧(图38的b侧)较薄,使得位于中央侧的顶接片124,比位于两侧的顶接片124,较朝向半导体晶片120侧隆起。在本实施例中,整体成弓状弯曲形成。如此,晶片抵压件121装于盖体127的状态下,和各连接支持板部125之间的间隔,如图39所示,设定为两侧较宽而中央侧较窄。此支持用凸条131的具体尺寸,依照盖体127的弯曲量而适当的设定。The
支持用凸条131之所以要如此形成,是依如下的理由。若在容器本体12内容纳了多片半导体晶片120的状态下安装上盖体127的话,对盖体127会发生一定的反作用力。装于盖体内表面的晶片抵压件121,因为对每片半导体晶片120都分别以一定的力量支持,故当半导体晶片120的直径加大而对该片半导体晶片120的支持力越大,或者片数越多的话,回压晶片抵压件121的反作用力也会越大。此反作用力,使得装上晶片抵压件121的盖体127稍微向外侧弯曲。而且,盖体127向外侧弯曲的话,以晶片抵压件121支持半导体晶片120的力量在中央部就会随之减弱。为了消除这样的支持半导体晶片120的力量不均匀的问题,设置了支持用凸条131。中央侧较厚的支持用凸条131可以吸收盖体127的弯曲,使得晶片抵压件121能以均等的力量支持各半导体晶片120。The reason why the supporting
以上所构成的薄板支持容器可作用如下:The thin plate supporting container formed above can function as follows:
在容器本体12内容纳多片半导体晶片120的状态下,安装上盖体127的话,晶片抵压件121就嵌合于各半导体晶片120。具体而言,各顶接片124的嵌合沟124A会分别嵌合于各半导体晶片120的周围边缘,将各半导体晶片120的周围边缘引导到嵌合沟124A的底部。此时,在半导体晶片120的边缘部嵌合于第二段沟槽内的状态下,第二段沟槽,抓住半导体晶片120的边缘部,而能以大面积接触半导体晶片120而可靠地进行支持。各顶接片124,则以弹性支持板部123和连接支持板部125进行支持。When the
弹性支持板部123,在其基端部用固定于盖体127内表面的基端支持部122支持的状态下,以其前端部来弹性的支持各顶接片124的外侧端。连接支持板部125,在支持用肋126支持住其中央部的状态下,以其两侧端部弹性地支持各顶接片124的内侧端。The elastic
并且,弯曲成弓状的支持用凸条131,在吸收盖体127弯曲的状态下,支持各顶接片124。如此,各顶接片124即可以均等的力量支持各半导体晶片120。In addition, the arch-shaped
此外,各顶接片124的内侧端是以比较强力的弹性力所支持,其外侧端则以比较弱的力量弹性的支持。此时,各顶接片124,在其嵌合沟124A底部沿各半导体晶片120周围边缘的切线方向的状态和各半导体晶片120接触,同时自动调整使两个顶接片124的弹性力成为同样强度而使得抵压住半导体晶片120整体的力量都能均等,更加稳定的支持住半导体晶片120。In addition, the inner end of each
在薄板支持容器运送等状态中,如薄板支持容器发生震动,则各半导体晶片120也会发生震动。而且,各顶接片124也会随着半导体晶片120的震动而震动。When the thin-plate support container vibrates during transport of the thin-plate support container, each semiconductor wafer 120 also vibrates. Moreover, each
此时,震动较小的情形,因为各顶接片124的振幅较小,故半导体晶片120和顶接片124的接点在外侧(例如图41中的接点A附近),主要是弹性支持板部123发生弯曲,以较弱的弹性力支持之。At this moment, when the vibration is small, because the vibration amplitude of each
震动强烈时,各顶接片124的振幅也较大,但随着顶接片124大幅震动而使得半导体晶片120和各顶接片124之接点朝向内侧(例如图41中的接点B附近)移动,相应于此移动量而使连接支持板部125作用的力量比弹性支持板部123大,弹性力也加强。因此,半导体晶片120要大幅震动的时候,顶接片124就会以强力的弹性回压而抑制住半导体晶片120的震动。如此,依照震动的强烈程度,支持半导体晶片120的力量也自动变化,而能可靠地支持半导体晶片120。When the vibration is strong, the vibration amplitude of each
其结果,所有半导体晶片120都能以均等的力量支持,同时对于来自外部的震动,也能将半导体晶片120的震动抑制到最小限度,而能防止半导体晶片120的旋转。As a result, all the semiconductor wafers 120 can be supported with an equal force, and at the same time, the vibration of the semiconductor wafers 120 can be suppressed to a minimum and the rotation of the semiconductor wafers 120 can be prevented.
变形例Variation
(1)在上述第1实施例中,是用基端支持部92、弹性支持板部93、以及顶接片94来构成品片抵压件91,而如图25、26、27所示,则以基端支持部110、弹性支持板部111以及顶接片112所构成。弹性支持板部111,是将基端部固定于基端支持部110的状态下支持顶接片112的一端。并且,从顶接片112另一端将弹性支持板部111在生产线用盖体15下侧面上延伸的形成的。顶接片112上的倾斜面112A和顶接面112B,和上述实施例的倾斜面96A和顶接面96B具备大致同样的功能。支持爪113,是相对分别交替各配设三个。此支持爪113的数目,依需要而设定。(1) In the above-mentioned first embodiment, the base end support portion 92, the elastic support plate portion 93, and the top joint piece 94 are used to form the product sheet pressing member 91, and as shown in FIGS. 25, 26, and 27, Then, it is composed of the base
这样的构成,也和上述实施例具有同样作用、可获得同样功效。Such a constitution also has the same effect as the above-mentioned embodiment, and can obtain the same effect.
(2)在上述第1实施例中,晶片抵压件91是为单边支持构造,也可例如图28、图29所示之双边支持构造。弹性支持板部安装为能支持顶接片之间以及两侧,同时,各顶接片之间的弹性支持板部,在距离生产线用盖体15下侧面仅仅离开间隙S的状态下支持各顶接片。(2) In the above-mentioned first embodiment, the wafer holding member 91 is a unilateral supporting structure, but it can also be a bilateral supporting structure as shown in Fig. 28 and Fig. 29, for example. The elastic support plate portion is installed to support between the top tabs and both sides, and at the same time, the elastic support plate portion between the top tabs supports each top plate at a distance from the lower side of the production
如此,各顶接片之间的弹性支持板部,在距离安装面仅有很小距离的状态下支持住顶接片,因此通常是以并不太强的力量来支持薄板。在例如不小心将薄板支持容器掉落等情形,遭到来自外部的强大冲击时,间隙S的缓冲消失而使各顶接片之间的弹性支持板部顶接于支持面,强力的支持住各顶接片。如此即可保护薄板不受冲击的影响。In this way, the elastic support plate portion between the top tabs supports the top tabs with only a small distance from the mounting surface, so the thin board is usually supported with a not too strong force. For example, when the thin-plate support container is accidentally dropped, when a strong impact from the outside is received, the buffer of the gap S disappears, so that the elastic support plate between the top pieces is connected to the support surface, and it is strongly supported. Each top tab. This protects the sheet from impacts.
(3)在上述第1实施例中,是用支持爪97来支持半导体晶片,也可以角块来支持。如图30、31所示,和上述实施例同样的,将两个角块115相对的状态下,互相交替配置。换句话说,两个相对配置的一组角块115互相保持一定间隔距离,四组一个单位分别排列,同时也互相交替配置。并且,一组角块115当中的各顶接面115A,分别设定为对垂直面呈20°倾斜以及呈4°倾斜。而且,顶接于半导体晶片的一侧设定为4°角。如此,半导体晶片的周围边缘即可用一侧4°(两侧为8°)的角度挟持,而不使半导体晶片发生滑动的就能可靠地进行支持。(3) In the above-mentioned first embodiment, the semiconductor wafer is supported by the support claws 97, but it may be supported by corner blocks. As shown in FIGS. 30 and 31 , the two
在此情形下,各角块也可设置成如图32、33所示。这是和基于上述图28、29所说明的例子几乎同样的构成,也可发挥同样作用及功效。In this case, each corner block can also be arranged as shown in Figures 32 and 33 . This is almost the same configuration as the example described above with reference to FIGS. 28 and 29 , and can also exhibit the same action and effect.
(4)在上述第1实施例中,是用在生产线上使用的薄板支持容器用盖体的例子说明,而在保管、运送等情形下也都同样能使用。此等场合也可发挥与上述实施例同样作用及功效。(4) In the above-mentioned first embodiment, the lid body for the thin-plate support container used in the production line was described as an example, but it can be used in storage, transportation, and the like in the same way. In these occasions, the same function and effect as those of the above-mentioned embodiments can also be brought into play.
(5)在上述第1实施例中,是在生产线用盖体15上设有两个简易装卸机构32为例说明,而依照规格等条件,也可设一个、或者三个以上。(5) In the above-mentioned first embodiment, two simple loading and
(6)在上述第1实施例中,是用薄板支持容器用盖体使用于容纳半导体晶片的容器为例加以说明,但并不限于半导体晶片,容纳其它薄板的容器也可同样使用。此情形也发挥和上述实施例同样作用及功效。(6) In the above-mentioned first embodiment, the cover body for the thin plate supporting container is used as an example to describe the container for accommodating semiconductor wafers, but it is not limited to semiconductor wafers, and containers for accommodating other thin plates can also be used in the same way. This situation also brings into play the same effect and effect as the above-mentioned embodiment.
(7)在上述第1实施例以及变形例中,是用晶片抵压件作为支持容纳在容器本体内的薄板的薄板压件,使用于上述实施例的薄板支持容器11,但本发明并不限于此例,其它构造的薄板支持容器也都可使用。此情形,也可发挥和上述实施例同样作用及功效。(7) In the above-mentioned first embodiment and the modified example, the wafer holding member is used as the thin-plate holding member for supporting the thin plate contained in the container body, and is used in the thin-
(8)在上述第1实施例中,是将盖体固定件100使用于薄板支持容器11,但本发明并不限于此例,其它构造的薄板支持容器也都可使用。此情形,也可发挥和上述实施例同样作用及功效。(8) In the above-mentioned first embodiment, the lid holder 100 is used for the thin
(9)在上述第2实施例中,是设置了两个晶片抵压件121的顶接片124,但是也可设置三个以上。设置三个以上顶接片124的情形,在各顶接片124之间设有连接支持板部125和支持用肋126。此情形,也可发挥和上述实施例同样作用及功效。(9) In the above-mentioned second embodiment, two
(10)在上述第2实施例中,是用支持用凸条131来支持横向板部125C,但也可在横向板部125C中央部设支持用突起。在设支持用突起的情形下,支持用凸条131也可设也可不设。支持用突起,在设有支持用凸条131的情形,顶接于支持用凸条131,而在不设支持用凸条131的情形,则顶接于盖体127内表面,以支持横向板部125C。(10) In the above-mentioned second embodiment, the
在不设支持用凸条131的情形,横向板部125C中央部支持用突起的高度,如上述第2实施例,设定为中央侧比两侧高。而在设有支持用凸条131的情形,则设定横向板部125C中央部的支持用突起和支持用凸条131两者的高度总合,使其中央侧比两侧高度高。此情形,也可发挥和上述第2实施例同样作用及功效。When the
(11)在上述第2实施例中,顶接片124的嵌合沟124A是成V字状的形成,但也可如上述第1实施例的顶接片94般,对顶接片124配备互相交替配设的支持片。换句话说,第2实施例的顶接片124,也可如同第1实施例的顶接片94那样,用两个角块96和互相交替配设的支持爪97(支持片)构成。如此,互相交替配设的支持片对半导体晶片120的周围边缘互相交替顶接,即可可靠地支持半导体晶片120。其结果,对于来自外部的震动,可将半导体晶片120的震动抑制在最小限度内,而且还能可靠地防止半导体晶片120旋转。(11) In the above-mentioned second embodiment, the
(12)用来支持晶片抵压件121的顶接片124的构成,并不限于第2实施例,也可是其它构成。例如可以使位于中央侧的顶接片124比位于两侧的,更向半导体晶片120侧隆起而配设的构成。(12) The configuration of the
例如,也可形成弹性支持板部123,使得位于中央侧的顶接片124比位于两侧的顶接片124更向半导体晶片120侧隆起配设,也可配设弹性支持板部123或者连接支持板部125的其中之一或两者,使得位于中央侧的顶接片124比位于两侧的顶接片124更向半导体晶片120隆起。For example, the elastic
(13)在上述第2实施例中,是用支持用肋126来支持连接支持板部125,但是也可以突起来支持。具体而言,如图44所示,通过与设于连接支持板部125上的嵌合孔141嵌合的,防止沿连接支持板部125盖体内表面的位移而容许其在盖体内面垂直方向上变动的嵌合突起142,来支持连接支持板部125。此情形,也可发挥和上述第2实施例同样作用及功效。(13) In the above-mentioned second embodiment, the connection
(14)上述第2实施例中,顶接片124的V字状的嵌合沟124A的底部形成为平坦面状,且与半导体晶片120的厚度大致相同,但如图45所示那样的底部形成的很细也可以。具体而言,顶接片151具有V字沟151A,其具有与半导体晶片152的边缘部的边缘角44°相同的倾斜角度44°。此外,此V字状沟151A,还可以设定为2段的角度,或者1段的角度。(14) In the above-mentioned second embodiment, the bottom of the V-shaped
此V字状沟151A的底部,形成的比半导体晶片152的热度还薄。如此,在半导体晶片152嵌合入V字状沟151A的状态下,在该半导体晶片152的边缘部和上述V字沟151A的底部之间形成间隙153,通过上述V字状沟151A的倾斜面支持半导体晶片152。此时,由于半导体晶片152的边缘部的边缘角与顶接片151的V字状沟151A的倾斜角都是44°,半导体晶片152的边缘部和V字状沟151A的倾斜面能够以较大的面积接触。The bottom of the V-shaped groove 151A is formed thinner than the temperature of the semiconductor wafer 152 . In this way, in the state where the semiconductor wafer 152 is fitted into the V-shaped groove 151A, a gap 153 is formed between the edge portion of the semiconductor wafer 152 and the bottom of the above-mentioned V-shaped groove 151A. A semiconductor wafer 152 is supported. At this time, since the edge angle of the edge portion of the semiconductor wafer 152 and the inclination angle of the V-shaped groove 151A of the top tab 151 are both 44°, the edge portion of the semiconductor wafer 152 and the inclination surface of the V-shaped groove 151A can be compared with each other. Large area contact.
并且,由于在半导体晶片152的边缘部和V字状沟151A的底部之间存在间隙153,不是直接的支持半导体晶片152的边缘部,结果是把半导体晶片152的边缘部V字状的嵌入V字沟151A。如此,将半导体晶片152的边缘部强力的顶压安装到V字沟151A的倾斜面上。And, since there is a gap 153 between the edge of the semiconductor wafer 152 and the bottom of the V-shaped groove 151A, the edge of the semiconductor wafer 152 is not directly supported. As a result, the edge of the semiconductor wafer 152 is embedded in a V shape. Word groove 151A. In this way, the edge portion of the semiconductor wafer 152 is strongly pressed against the inclined surface of the V-shaped groove 151A.
结果是,即使将薄板抵压件用不怎么强的抵压安装到半导体晶片152上,也能够用此薄板抵压件的顶接片151可靠地支持半导体晶片152,防止振动等导致的半导体晶片152的旋转。如此,将盖体用不怎么强的按压安装在容器本体上也能够可靠地支持半导体晶片152,防止振动等导致的半导体晶片152的旋转。如此,不用增加盖体的强度。如此,能够轻易的进行盖体的装卸工作的自动化。As a result, even if the thin-plate pressing member is mounted on the semiconductor wafer 152 with not so strong pressing force, the semiconductor wafer 152 can be reliably supported by the top tab 151 of the thin-plate pressing member, preventing damage to the semiconductor wafer caused by vibration or the like. 152 spins. In this way, the semiconductor wafer 152 can be reliably supported even when the lid is attached to the container body without a strong pressure, and the rotation of the semiconductor wafer 152 due to vibration or the like can be prevented. In this way, there is no need to increase the strength of the cover. In this way, it is possible to easily automate the work of attaching and detaching the cover.
此外,顶接片151的V字状沟151A的倾斜角设定为20°-60°,也能够获得与上述同样的作用,效果。此情况下,半导体晶片152嵌合于顶接片151的V字状沟151A,该半导体晶片152的边缘部嵌入V字状沟151A中。此时,V字状沟151A得倾斜角设定为20°-60°,能够可靠而且轻易的进行半导体晶片152的支持和装卸。换句话说,将半导体晶片152嵌合在V字状沟151A上,将半导体晶片152的边缘部嵌入V字状沟151A的进行支持。此时,将V字状沟151A的倾斜角设定为60°以上的话,半导体晶片152向V字状沟151A的嵌入不够导致产生旋转。实际上,从V字状沟151A的倾斜角设定为60°的实验看来,很少发生由于外部传来的振动导致的旋转。倾斜角超过60°的话,就容易发生外部传来的振动导致的旋转。并且,在将顶接片151从半导体晶片152上脱离的时候,也不用将嵌入V字状沟151A的半导体晶片152,从V字状沟151A上拉出的,可以平滑的分离。此时,V字状沟151A的倾斜角设定在20°以下的话,在顶接片151从半导体晶片152上脱离的时候,会发生将半导体晶片152从V字状沟151A上拉出的将该半导体晶片152取下的情况。实际上,从将V字状沟151A的倾斜角设定为20°的实验看来,半导体晶片152很少发生将半导体晶片152从V字状沟151A上拉出的,将半导体晶片152从容器本体上取下。倾斜角在20°以下的话,容易发生拉出的情况。In addition, if the inclination angle of the V-shaped groove 151A of the top contact piece 151 is set to 20°-60°, the same functions and effects as above can be obtained. In this case, the semiconductor chip 152 is fitted into the V-shaped groove 151A of the top tab 151 , and the edge portion of the semiconductor chip 152 is fitted into the V-shaped groove 151A. At this time, the inclination angle of the V-shaped groove 151A is set to 20°-60°, so that the semiconductor wafer 152 can be reliably and easily supported, loaded and unloaded. In other words, the semiconductor wafer 152 is fitted into the V-shaped groove 151A, and the edge portion of the semiconductor wafer 152 is fitted into the V-shaped groove 151A for support. At this time, if the inclination angle of the V-shaped groove 151A is set to be 60° or more, the fitting of the semiconductor wafer 152 into the V-shaped groove 151A is insufficient and rotation occurs. In fact, from experiments in which the inclination angle of the V-shaped groove 151A was set to 60°, rotation due to vibration transmitted from the outside rarely occurred. If the inclination angle exceeds 60°, rotation due to external vibration is likely to occur. Moreover, when the top tab 151 is separated from the semiconductor wafer 152, it is not necessary to pull the semiconductor wafer 152 embedded in the V-shaped groove 151A out from the V-shaped groove 151A, and it can be smoothly separated. At this time, if the inclination angle of the V-shaped groove 151A is set below 20°, when the top tab 151 is detached from the semiconductor wafer 152, the semiconductor wafer 152 will be pulled out from the V-shaped groove 151A. The semiconductor wafer 152 is removed. In fact, from the experiment in which the inclination angle of the V-shaped groove 151A is set to 20°, the semiconductor wafer 152 rarely pulls the semiconductor wafer 152 from the V-shaped groove 151A, and the semiconductor wafer 152 is pulled out of the container. Remove from the body. If the inclination angle is less than 20°, it is easy to pull out.
由此,优选将V字状沟151A的倾斜角设定为20°-60°。如此,能够兼有防止半导体晶片152的向V字状沟151A的嵌入导致的旋转,和平滑的分离的效果。Therefore, it is preferable to set the inclination angle of the V-shaped groove 151A to 20°-60°. In this manner, it is possible to simultaneously prevent rotation of the semiconductor wafer 152 due to fitting into the V-shaped groove 151A and achieve smooth separation.
如此,在可靠地支持半导体晶片152的同时,还能够轻易的进行盖体的装卸,实现盖体的装卸的自动化。In this way, while reliably supporting the semiconductor wafer 152, the cover can be easily attached and detached, and the automation of the cover's attachment and detachment is realized.
此外,在V字状沟151A的倾斜角设定为20°-60°的同时,优选在半导体晶片152的边缘部和顶接片151的V字状沟151A的底部之间设置间隙。此情况下,将半导体晶片152嵌合在V字状沟151A上时,使得半导体晶片152的边缘部和V字状沟151A的底部相互不发生接触的,强力抵压的安装半导体晶片152的边缘部和V字状沟151A的倾斜面,将半导体晶片152嵌入V字状沟151A的可靠地支持。而且,上述方法也能够轻易的装卸。In addition, while the inclination angle of the V-shaped groove 151A is set to 20°-60°, it is preferable to provide a gap between the edge of the semiconductor wafer 152 and the bottom of the V-shaped groove 151A of the top tab 151 . In this case, when the semiconductor chip 152 is fitted on the V-shaped groove 151A, the edge of the semiconductor chip 152 and the bottom of the V-shaped groove 151A are not in contact with each other, and the edge of the semiconductor chip 152 is strongly pressed. portion and the inclined surface of the V-shaped groove 151A to securely support the semiconductor wafer 152 embedded in the V-shaped groove 151A. Moreover, the above method can also be easily attached and detached.
(15)上述第2实施例中,盖体127的支持用凸条131的中央侧设置的厚吸收了盖体127的弯曲,晶片抵压件121用均等的力支持各半导体晶片120,还可以对盖体127自身进行改良。(15) In the above-mentioned second embodiment, the thickness provided on the central side of the
具体而言,平板状的盖体127的中央部向容器本体侧凹陷,抵消各半导体晶片120导致的弯曲。换句话说,将盖体127安装在容器本体上时,各半导体晶片120,回压盖体127的使它的中央部向外侧弯曲,预先将盖体127的中央部形成向上述容器本体侧的凹陷来抵消此弯曲。如此,盖体127的中央部向外侧弯曲的时候,此弯曲通过凹陷的吸收形成平坦的状态而抵消,能够通过晶片抵压件用均等的力支持所有各个半导体晶片120。Specifically, the center portion of the
该盖体127的中央部向容器本体侧的凹陷的尺寸,相应于半导体晶片120的片数等引起的不同的发作用力等等条件进行设定。此外,凹陷的形状,也可以相应于球面状,椭圆体,非球面状等的反作用力等导致的变形的状态,根据能够用抵消它们的均等的力来支持半导体晶片120的状态适当的设定。如此,能够用均等的力支持所有各半导体晶片120,防止振动等导致的半导体晶片120的旋转。此外,此情况下,盖体127的支持用凸条131,设定为两端侧和中央侧具有同样的厚度。而且,盖体127的弯曲,用盖体127的中央部的凹陷和支持用凸条131的厚度两者来吸收,还可以对这些盖体127的中央部的凹陷和支持用凸条131的厚度的两者进行调整。The size of the recess of the central part of the
还可以使盖体127的周围的增强用凸缘弯曲。换句话说,各半导体晶片120产生的反作用力,在盖体127的周围形成的增强用凸缘造成的变形,还可以用预先形成向容器本体侧的弯曲来抵消该增强用凸缘的变形。It is also possible to bend the reinforcement flange around the
薄板抵压件顶接于半导体晶片120的支持半导体晶片120的时候,它的反作用力也使得形成在盖体周围的增强用凸缘也向外侧变形,通过将此增强用凸缘预先向容器本体侧的弯曲,来吸收该向外侧的变形。换句话说,预先弯曲的增强用凸缘相对于向外侧的变形将其抵消形成直线状,用均匀的力支持所有各半导体晶片120。增强用凸缘的具体的尺寸,与盖体127的中央部的场合相同的,适当的设置为能够吸收变形将其抵消的的尺寸和形状。还可以将增强用凸缘的弯曲的形态,和上述盖体127的中央部凹陷的形态,以及调整支持用凸条131的厚度的形态进行适当的组合。When the thin plate pressing member abuts against the supporting semiconductor wafer 120 of the semiconductor wafer 120, its reaction force also makes the reinforcing flange formed around the cover body deform outwardly, and the reinforcing flange is preliminarily deformed to the container body side. to absorb the outward deformation. In other words, the pre-bent reinforcing flange is linearly offset against the outward deformation, and supports all the semiconductor wafers 120 with a uniform force. The concrete size of the reinforcing flange is the same as that of the central part of the
而且,还可以在盖体127的周围形成的增强用凸缘上加入增强构件的进行嵌入(insert)成形。如此,增加了增强用凸缘的强度,能够抵抗各半导体晶片120的反作用力,用均匀的力支持所有各半导体晶片120。此情况下也是,可以将在增强用凸缘中加入增强构件的增强的形态,和增强用凸缘弯曲的形态,和上述盖体127的中央部凹陷的形态,以及调整支持用凸条131的厚度的形态进行适当的组合。Furthermore, it is also possible to insert a reinforcing member into a reinforcing flange formed around the
这些情况下,也能获得和上述各实施例同样的作用,效果。Even in these cases, the same actions and effects as those of the above-mentioned embodiments can be obtained.
Claims (24)
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| CN 200410085645 CN1760092B (en) | 2004-10-14 | 2004-10-14 | Lid for thin plate support container |
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| CN 201010521491 Division CN102001482B (en) | 2004-10-14 | 2004-10-14 | Cover body for thin-plate supporting container |
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| CN1760092A true CN1760092A (en) | 2006-04-19 |
| CN1760092B CN1760092B (en) | 2010-12-22 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339777A (en) * | 2010-07-15 | 2012-02-01 | 家登精密工业股份有限公司 | Wafer Constraints for Cassettes |
| CN101855716B (en) * | 2007-11-09 | 2012-07-11 | 信越聚合物株式会社 | Retainer and substrate storing container |
| CN102569138A (en) * | 2010-12-10 | 2012-07-11 | 台湾积体电路制造股份有限公司 | Wafer box |
| CN103828033A (en) * | 2011-08-12 | 2014-05-28 | 恩特格里公司 | Wafer carrier |
| JP2017107956A (en) * | 2015-12-09 | 2017-06-15 | 信越ポリマー株式会社 | Substrate storage container |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4995430A (en) * | 1989-05-19 | 1991-02-26 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
| US5711427A (en) * | 1996-07-12 | 1998-01-27 | Fluoroware, Inc. | Wafer carrier with door |
| US5931512A (en) * | 1997-07-23 | 1999-08-03 | Industrial Technology Research Institute | Latch mechanism for wafer container |
| US5957292A (en) * | 1997-08-01 | 1999-09-28 | Fluoroware, Inc. | Wafer enclosure with door |
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2004
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101855716B (en) * | 2007-11-09 | 2012-07-11 | 信越聚合物株式会社 | Retainer and substrate storing container |
| CN102339777A (en) * | 2010-07-15 | 2012-02-01 | 家登精密工业股份有限公司 | Wafer Constraints for Cassettes |
| CN102339777B (en) * | 2010-07-15 | 2013-09-11 | 家登精密工业股份有限公司 | Wafer limiting piece of wafer box |
| CN102569138A (en) * | 2010-12-10 | 2012-07-11 | 台湾积体电路制造股份有限公司 | Wafer box |
| CN102569138B (en) * | 2010-12-10 | 2016-05-11 | 台湾积体电路制造股份有限公司 | wafer box |
| CN103828033A (en) * | 2011-08-12 | 2014-05-28 | 恩特格里公司 | Wafer carrier |
| CN106941087A (en) * | 2011-08-12 | 2017-07-11 | 恩特格里斯公司 | Chip carrier |
| US10147624B2 (en) | 2011-08-12 | 2018-12-04 | Entegris, Inc. | Wafer carrier |
| CN106941087B (en) * | 2011-08-12 | 2020-03-10 | 恩特格里斯公司 | wafer carrier |
| JP2017107956A (en) * | 2015-12-09 | 2017-06-15 | 信越ポリマー株式会社 | Substrate storage container |
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