CN1754934A - 丙烯酸类阻燃粘合剂组合物和丙烯酸类阻燃粘合片材 - Google Patents
丙烯酸类阻燃粘合剂组合物和丙烯酸类阻燃粘合片材 Download PDFInfo
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- CN1754934A CN1754934A CNA2005101071448A CN200510107144A CN1754934A CN 1754934 A CN1754934 A CN 1754934A CN A2005101071448 A CNA2005101071448 A CN A2005101071448A CN 200510107144 A CN200510107144 A CN 200510107144A CN 1754934 A CN1754934 A CN 1754934A
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Abstract
提供一种丙烯酸类阻燃粘合剂组合物,该组合物包括:(A)100质量份包含羧基且玻璃化转变温度为5-30℃的丙烯酸类聚合物,(B)1-20质量份可熔型酚醛树脂,(C)1-20质量份环氧树脂,(D)0.1-5质量份固化促进剂,(E)数量足以在排除组分(F)的整个组合物中产生15-40质量%的溴含量的溴基阻燃剂,和(F)10-100质量份无机填料。也提供一种包含粘合剂层的丙烯酸类粘合片材,所述粘合剂层包括该组合物以及使用此丙烯酸类粘合片材粘合两个基材的方法。丙烯酸类粘合片材显示优异的粘合性、耐热性、可加工性、操作性和阻燃性,并且该丙烯酸类粘合剂组合物用于生产这种粘合片材。
Description
技术领域
本发明涉及丙烯酸类粘合片材,该丙烯酸类粘合片材显示优异的粘合性、耐热性、可加工性、操作性和阻燃性,并可有利地用于柔性印刷电路板等,以及用于生产这种粘合片材的丙烯酸类粘合剂组合物和使用此丙烯酸类粘合片材粘合两个基材的方法。
背景技术
近年来,电子器件的微型化和重量降低,以及电路密度的增加持续进展,并且对包括4个或更多个柔性印刷电路板(以下称为FPC)的重迭层的多层FPC的需求持续增加。通过使用粘合片材将2个或更多个单面铜箔或双面铜箔FPC层压在一起,由此形成多层结构来生产多层FPC。用于FPC此种层合的粘合片材必须满足某些特性如粘合性、耐热性、可加工性、操作性和阻燃性的要求水平,并且热切需要这些特性的进一步改进。
通常,广泛用于FPC的粘合片材的例子包括丙烯腈丁二烯橡胶(以下称为NBR)粘合片材和丙烯酸类粘合片材。
NBR粘合片材显示非常良好的可加工性,但由于热降解倾向于易于降低粘合强度(专利参考文献1)。此外,丙烯酸类粘合片材显示优异的粘合性,但要忍受差的可加工性,要求在高温下压制很长时间,以及差的耐热性(专利参考文献2)。
因此,获得同时满足所有上述要求的特性的粘合片材经证明是特别困难的。
[专利参考文献1]JP 7-93497 B2
[专利参考文献2]EP 0 201 102 A2
发明内容
本发明的目的是提供解决上述问题和显示优异粘合性、耐热性、可加工性、操作性和阻燃性的丙烯酸类粘合片材,以及用于生产这种粘合片材的丙烯酸类粘合剂组合物和使用此丙烯酸类粘合片材粘合两个基材的方法。
为达到以上目的进行了深入研究,由此本发明的发明人能够完成本发明。换言之,本发明提供一种丙烯酸类阻燃粘合剂组合物,该组合物包括:
(A)100质量份包含羧基并且玻璃化转变温度为5-30℃的丙烯酸类聚合物,
(B)1-20质量份可熔型酚醛树脂,
(C)1-20质量份环氧树脂,
(D)0.1-5质量份固化促进剂,
(E)数量足以在排除组分(F)的整个组合物中产生15-40质量%的溴含量的溴基阻燃剂,和
(F)10-100质量份无机填料。
此外,本发明的第二方面提供一种包含粘合剂层的丙烯酸类粘合片材,该粘合剂层包括以上组合物。
本发明的第三方面提供使用以上丙烯酸类粘合片材粘合两个基材的方法。
通过使用本发明的丙烯酸类粘合剂组合物,可以生产丙烯酸类粘合片材,该粘合片材包含粘合剂层,并且显示优异的粘合性、耐热性、可加工性、操作性和阻燃性,所述粘合剂层包括所述组合物。此粘合剂组合物的短期压制能够制备具有用于FPC,且特别是多层FPC的优异粘合性和耐热性的粘合片材,意味着该组合物是特别有用的。
具体实施方式
以下是本发明的更详细描述。
本发明的组合物包括下述组分(A)到(F)。在本说明书中,丙烯酸酯和甲基丙烯酸酯,及丙烯腈和甲基丙烯腈分别使用属类术语“(甲基)丙烯酸酯”和”(甲基)丙烯腈”表示。
<(A)包含羧基的丙烯酸类单体>
组分(A)的丙烯酸类聚合物包含羧基,并且玻璃化转变温度为5-30℃。此玻璃化转变温度优选为10-25℃。倘若玻璃化转变温度为5-30℃,则包含粘合剂层的下述粘合片材显示令人满意的强度,该粘合剂层包括组合物,并且在一些情况下,粘合片材可能能够在临时紧固之后再连接,显示出优异的操作性能。如果玻璃化转变温度小于5℃,则得到具有相当厚度和低膜强度的粘合片材,意味着操作性能差。此外,如果玻璃化转变温度超过30℃,则粘合片材显示差的粘合性。使用差示扫描量热计(DSC)测量玻璃化转变温度。
此组分的丙烯酸类聚合物的例子是包括如下物质的共聚物:
(a)(甲基)丙烯酸酯,和
(b)包含可聚合不饱和双键的羧酸单体。
-(a)(甲基)丙烯酸酯
上述(甲基)丙烯酸酯赋予获得的粘合片材柔韧性。此(甲基)丙烯酸酯的例子包括丙烯酸酯和甲基丙烯酸酯两者。丙烯酸酯的具体例子包括丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸异丁酯、丙烯酸异戊酯、丙烯酸正己酯、丙烯酸异辛酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸异壬酯、丙烯酸正癸酯和丙烯酸异癸酯。甲基丙烯酸酯的具体例子包括甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸异丁酯、甲基丙烯酸异戊酯、甲基丙烯酸正己酯、甲基丙烯酸异辛酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸正辛酯、甲基丙烯酸异壬酯、甲基丙烯酸正癸酯和甲基丙烯酸异癸酯。在这些物质中,其中烷基中碳原子数目是1-12,和优选1-4的(甲基)丙烯酸烷基酯是特别需要的。这些(甲基)丙烯酸酯可以单独,或以两种或多种不同化合物的组合使用。
此(甲基)丙烯酸酯的数量,具体地组分(A)的丙烯酸类聚合物中的含量典型地为50-80质量%,和优选55-75质量%。对于在此范围内的数量,粘合片材的柔韧性优异,并且在压制加工期间组合物的泛出较少可能发生。
-(b)包含可聚合不饱和双键的羧酸单体
包含可聚合不饱和双键的上述羧酸单体赋予本发明组合物粘合性,同时在加热期间也起交联点的作用。此羟酸单体的例子包括丙烯酸、甲基丙烯酸、巴豆酸、马来酸、富马酸和衣康酸,但优选丙烯酸和甲基丙烯酸。这些羧酸单体可以单独,或以两种或多种不同化合物的组合使用。
包含可聚合不饱和双键的此羧酸单体的数量,具体地组分(A)的丙烯酸类聚合物中的含量典型地为2-10质量%,和优选2-8质量%。对于在此范围内的数量,粘合片材显示优异的耐热性和柔韧性水平。具体地,组合物中的交联水平是适当的和合适的,并且粘合片材对于目标粘附体的亲合力是有利的,意味着在粘合片材的加工期间,片材的粘合剂层不可能出现起泡或砂眼,甚至在加热固化处理或焊剂浴处理时。
除上述单体(a)和(b)以外,组分(A)也可包含其它单体,该其它单体包含可聚合不饱和双键,并且这些其它单体的例子包括(甲基)丙烯腈、乙烯、苯乙烯、丁二烯和甲基乙烯基酮。
-优选共聚物的例子-
此组分的丙烯酸类聚合物的优选例子是包括上述单体(a)和(b)以及(c)(甲基)丙烯腈的共聚物。以下是此单体(c)的描述。
-(c)(甲基)丙烯腈
上述(甲基)丙烯腈包括丙烯腈和甲基丙烯腈,并且它们也可组合使用。(甲基)丙烯腈赋予粘合片材耐热性、粘合性和耐化学品性。
在此优选的共聚物中,单体(a)的数量优选为50-80质量%,和甚至更优选55-75质量%。单体(b)的数量优选为2-10质量%,和甚至更优选2-8质量%。单体(c)的数量优选为15-45质量%,和甚至更优选20-40质量%。在这些各自范围内的数量能够实现粘合片材耐热性和柔韧性的进一步改进。
共聚物可以是仅包括单体(a)到(c)的共聚物,或也可以是还包括其它包含可聚合不饱和双键的单体的共聚物。
以使用凝胶渗透色谱(GPC,相对聚苯乙烯参考物计算)测量值报导的组分(A)的丙烯酸类聚合物的重均分子量优选为100,000-1,000,000,和甚至更优选300,000-600,000。此外,可以使用常规溶液聚合、乳液聚合、悬浮聚合或本体聚合方法制备丙烯酸类聚合物。
组分(A)的丙烯酸类聚合物可以单独,或以两种或多种不同聚合物的组合使用。
<(B)可熔型酚醛树脂>
组分(B)的可熔型酚醛树脂赋予丙烯酸类粘合片材热固性性能、粘合性和耐热性。可熔型酚醛树脂的具体例子包括使用苯酚或双酚A,烷基苯酚如对叔丁基苯酚、辛基苯酚、或对枯基苯酚、或对苯基苯酚或甲酚作为原料制备的可熔型酚醛树脂。
组分(B)的共混数量必须为1-20质量份,和优选为1-15质量份,和甚至更优选1-10质量份,相对每100质量份组分(A)。如果酚树脂的共混数量小于1质量份,得到具有不令人满意热固性性能的产物。如果共混数量超过20质量份,则粘合片材的粘合性可能劣化。
组分(B)的可熔型酚醛树脂可以单独,或以两种或多种不同树脂的组合使用。
<(C)环氧树脂>
组分(C)的环氧树脂赋予丙烯酸类粘合片材热固性性能和粘合性。此环氧树脂优选在每个分子中包含平均至少2个,和更优选平均2-4个环氧基团,并且环氧当量优选为100-1,000,和更优选100-500。如果每个分子中环氧基团的数目和环氧当量均满足以上优选的范围,则获得的粘合片材不仅显示优异的粘合性,而且显示令人满意的反应性(即热固性性能)。此外,分子主链也可包括磷原子、硫原子和氮原子等。
此组分的环氧树脂的例子包括双酚A型环氧树脂和双酚F型环氧树脂或其氢化产物,苯酚线性酚醛清漆型环氧树脂、甲酚线性酚醛清漆型环氧树脂、缩水甘油胺型环氧树脂和脂族环氧树脂。
组分(C)的共混数量必须为1-20质量份,和优选为1-15质量份,相对每100质量份组分(A)。如果共混数量小于1质量份,得到具有不令人满意热固性性能的产物。如果共混数量超过20质量份,粘合片材经受过度的交联和显示对目标粘附体的差亲合力,意味着当加工粘合片材时,片材的粘合剂层在热固化处理或焊剂浴处理时易于起泡或出现砂眼。
组分(C)的环氧树脂可以单独,或以两种或多种不同树脂的组合使用。
<(D)固化促进剂>
对于组分(D)的固化促进剂没有特定的限制,只要它促进环氧树脂和固化剂之间的反应。此固化促进剂的合适例子包括叔胺和咪唑。合适叔胺的具体例子包括三乙胺、苄基二甲胺和α-甲基苄基二甲胺。此外,合适咪唑的具体例子包括2-甲基咪唑、2-十一烷基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、1-氰基乙基-2-十一烷基咪唑和1-氰基乙基-2-苯基咪唑。另外,也可以使用通过在咪唑和1,2,4-苯三甲酸之间形成盐而被赋予潜在性能(即热敏感性)的化合物,或其中将三嗪主链引入到咪唑中的化合物。在这些物质中,优选咪唑,并特别优选2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑和1-氰基乙基-2-十一烷基咪唑。
组分(D)的共混数量必须为0.1-5质量份,和优选为0.5-3质量份,相对每100质量份组分(A)。如果此共混数量小于0.1质量份,则不仅不能获得令人满意的固化促进效果,而且也可能劣化粘合片材的耐热性。如果共混数量超过5重量份,则不仅不能获得固化促进效果的进一步改进,而且也可能劣化粘合片材的粘合性和耐热性等。
组分(D)的固化促进剂可以单独,或以两种或多种不同化合物的组合使用。
<(E)溴基阻燃剂>
组分(E)的溴基阻燃剂包括溴,并赋予粘合片材阻燃性。为保证粘合片材阻燃性的更优异水平,溴基阻燃剂优选在室温(25℃)下为固体,并优选具有高熔点,具体地熔点为至少200℃,且更优选300℃或更高。
此外,溴基阻燃剂中溴含量越高,必须加入以赋予粘合片材优异阻燃性的数量越小,因此,溴含量优选至少为50质量%,和更优选至少为60质量%,和甚至更优选为65-85质量%。倘若溴含量在此范围内,可以赋予粘合片材优异的阻燃性水平,而不降低粘合片材的粘合性或耐热性。能够满足熔点和溴含量两者的上述优选范围的溴基阻燃剂是特别需要的。
具体的例子包括亚乙基双(四溴邻苯二甲酰亚胺)、十溴二苯基醚、四溴邻苯二甲酸酐和十溴二苯基乙烷,并且市售材料的例子包括商标Pyroguard SR-600A(溴化芳族化合物,由Daiichi Kogyo Seiyaku Co.,Ltd.制造,熔点:280℃,溴含量:80质量%),Saytex BT-93(亚乙基双(四溴邻苯二甲酰亚胺),由Albemarle Corporation制造,熔点:456℃,溴含量:67.2质量%),和Plasafety EB-10(十溴二苯基醚,由Manac Inc.制造,熔点:306℃,溴含量:83质量%)。
组分(E)的共混数量必须足以保证在排除组分(F)的整个组合物中溴含量为15-40质量%,和优选15-25质量%。如果此溴含量小于15质量%,粘合片材的阻燃性可能不足。如果溴含量超过40质量%,则粘合片材的粘合性和耐热性等可能劣化。组分(E)在本发明组合物中的实际共混数量依赖于使用的组分(E)的溴含量而变化,但典型地,30-100质量份每100质量份组分(A)的数量能够达到上述类型的溴含量。
组分(E)的溴基阻燃剂可以单独,或以两种或多种不同化合物的组合使用。
<(F)无机填料>
组分(F)的无机填料用作阻燃助剂,进一步改进粘合片材的耐热性。无机填料优选具有电绝缘性能和比可熔型酚醛树脂(B)高的弹性水平,并且合适的例子包括粉状填料如氢氧化铝、氢氧化镁、滑石、氧化铝、氧化镁、二氧化硅、二氧化钛、硅酸钙、硅酸铝、碳酸钙、粘土、氮化硅、碳化硅、硼酸铝和合成云母等;短纤维性填料如玻璃、石棉、岩石棉和芳酰胺;及碳化硅、氧化铝和硼酸铝等的晶须。
组分(F)的共混数量必须为10-100质量份,和优选为15-90质量份,相对每100质量份组分(A)。如果此共混数量小于10质量份,则可能不能实现填料的阻燃助剂功能,并且粘合片材的耐热性可能不足。如果共混数量超过100质量份,则粘合片材的粘合性和耐热性等可能劣化。
组分(F)的无机填料可以单独,或以两种或多种不同填料的组合使用。
<其它组分>
除上述的组分(A)到(F)以外,也可以加入其它的非必要组分,条件是它们的加入不损害本发明的效果。例如,也可以加入包括三氧化二锑,以及磷基和氮基阻燃剂的一种或多种其它阻燃剂,它们强化阻燃性性能。
<组合物制备>
此外,以上组分(A)到(F)和任何其它组分可用于在没有溶剂的情况下生产粘合片材,尽管也可以在有机溶剂中溶解或分散组分,由此以溶液或分散体(以后简称为溶液)的形式制备组合物。合适有机溶剂的例子包括N,N-二甲基乙酰胺、甲乙酮、N,N-二甲基甲酰胺、环己酮、N-甲基-2-吡咯烷酮、甲苯、甲醇、乙醇、异丙醇、丙酮和四氢呋喃,并且其中优选甲乙酮、甲苯、环己酮和四氢呋喃,并特别优选甲乙酮、甲苯和四氢呋喃。这些有机溶剂可以单独,或以两种或多种不同溶剂的组合使用。
可以使用罐式球磨机、球磨机、均化机或超级碾磨机等将组合物的每种以上组分和有机溶剂混合在一起。
<粘合片材>
本发明的粘合片材包含粘合剂层(如膜等),该粘合剂层包括组合物,该组合物包括每种上述的组分,该粘合片材也可以在粘合剂层的一侧或两侧上包括保护层。在干燥状态下粘合剂层的厚度典型地为10-100μm,并优选为15-75μm。
-保护层
对上述的保护层没有特定的限制,条件是它能够剥离而不损害粘合剂层,并且合适膜的典型例子包括塑料膜如聚乙烯(PE)膜、聚丙烯(PP)膜、聚甲基戊烯(TPX)膜、脱模剂涂覆的聚对苯二甲酸乙二醇酯(PET)膜、和其中PP粘合到PET一个表面或两个表面上的膜,以及其中一个或多个这些膜涂覆在基础纸(纸材料)的一个表面或两个表面上的剥离片材。
-生产方法
例如,可以通过将上述组合物模塑成膜状形式,或通过将组合物涂覆到保护层上,干燥组合物,并随后在顶部粘合另一个保护层而制备上述粘合片材。
以下描述制备包括有机溶剂的粘合剂组合物的方法,它代表本发明的优选实施方案,然后采用保护层使用此粘合剂组合物生产粘合片材。首先,将通过将每种要求的组分和有机溶剂混合在一起以液体形式制备的粘合剂组合物,使用逆辊涂布机或逗点涂布机等涂布到保护层上。然后使带有涂覆粘合剂组合物的保护层通过在线干燥器,和在60-140℃下加热短时间(例如2-10分钟),由此除去有机溶剂,和干燥组合物以形成半固化状态,和得到包括在保护层的一个表面上形成的粘合剂层的粘合片材。然后使用辊层压器将此粘合片材的粘合剂层卷缩和层压到另一个保护层上,由此形成包括在粘合剂层两个表面上的保护层的粘合片材。术语“半固化状态”表示从粘合剂组合物是干燥的到在部分组合物中开始固化反应之间的任何状态。
-粘合方法
上述粘合片材可用于粘合两个基材。对于此目的,首先将粘合片材夹入两个基材之间以形成层压材料。然后,固化粘合片材以粘合两个基材。
对基材的材料没有特别限制。其例子包括聚酰亚胺膜和电解铜箔。两个基材的材料可以彼此相同或不同。
例如,可以通过在140-200℃和优选160-180℃的温度下,优选在垂直于所述层压材料表面的方向上对所述层压材料施加压力下加热所述层压材料而固化粘合片材。压力可以为1-6MPa并优选为2-5MPa。如果温度和压力在这些范围内,两个基材可以容易地通过具有优异剥离强度水平(粘合性)的固化粘合片材粘合。固化时间可以为约0.5-约2小时。
实施例
以下是使用一系列实施例的对本发明更详细的描述,但是这些实施例决不限制本发明的范围。用于实施例的组分(A)到(F)和其它组分的具体情况如下所述,并且在实施例中用于测量重均分子量和玻璃化转变温度的条件也如下所述。
<粘合剂组合物的结构组分>
[(A)丙烯酸类聚合物]
(a)丙烯酸丁酯,丙烯酸乙酯
(b)甲基丙烯酸
(c)丙烯腈
[(B)可熔型酚醛树脂]
(1)Phenolite J-325(商标名)(可熔型酚醛树脂,由Dainippon Inkand Chemicals Inc.制造,理论OH当量=65)
(2)Phenolite 5592(商标名)(环氧改性的可熔型酚醛树脂,由Dainippon Ink and Chemicals Inc.制造,理论OH当量=72)
[(C)环氧树脂]
(1)Epikote 1001(商标名)(双酚A型环氧树脂,由Japan EpoxyResins Co.,Ltd.制造,环氧当量:450-500,每个分子的环氧基团数目:2)
(2)Epikote 154(商标名)(苯酚线性酚醛清漆型环氧树脂,由JapanEpoxy Resins Co.,Ltd.制造,环氧当量:176-180,每个分子的环氧基团数目:3.5-4)
(3)Epikote 604(商标名)(缩水甘油胺型环氧树脂,由Japan EpoxyResins Co.,Ltd.制造,环氧当量:110-130,每个分子的环氧基团数目:4)
[(D)固化促进剂]
(1)Curezol 2E4MZ(商标名)(2-乙基-4-甲基咪唑,由ShikokuCorporadon制造)
(2)Curezol C11Z-CN(商标名)(1-氰基乙基-2-十一烷基咪唑,由Shikoku Corporation制造)
[(E)溴基阻燃剂]
(1)Saytex BT-93(商标名)(亚乙基双(四溴邻苯二甲酰亚胺),由Albemarle Corporation制造,熔点:456℃,溴含量:67.2质量%)
[(F)无机填料]
(1)氢氧化铝
[(其它)其它组分]
-酚醛清漆型酚醛树脂
(1)Phenolite TD-2093(商标名)(酚醛清漆型酚醛树脂,由DainipponInk and Chemicals Inc.制造,理论OH当量=104)
-阻燃助剂
(2)Patox-MF(商标名)(三氧化二锑,由Nippon Seiko Co.,Ltd.制造)
<测量条件>
1.重均分子量
-GPC;商标名:HLC-8020,由Tosoh Corporation制造
-柱;商标名:TSK凝胶,GMHXL(2个柱),由Tosoh Corporation制造,THF,相对于聚苯乙烯参考物计算
2.玻璃化转变温度
-差示扫描量热计;商标名:DSC-200,由Seiko Instruments Inc.制造,升温速率:5℃/分钟
<实施例1-8,对比例1-8>
将单体(a)到(c)以表1和2字段中所示的共混数量混合在一起,并在每种情况下制备组分(A)的丙烯酸类聚合物的15质量%甲乙酮(MEK)溶液。随后,取丙烯酸类聚合物的数量(即不包括MEK的质量)为100质量份,通过以表1和2字段中所示的共混数量加入粘合剂组合物的其它组分,并随后使用常规方法混合而制备粘合剂组合物1-8和C1-C8。
将这些粘合剂组合物中的每种以足够的数量涂覆到保护层上以产生厚度为25μm的干燥涂层。随后,通过在120℃下加热10分钟除去包含在粘合剂组合物中的有机溶剂(MEK),由此形成在一个表面上带有保护层的半固化粘合剂组合物。然后将单独的保护层卷缩在粘合剂组合物(即粘合剂层)上,由此制备粘合片材1-8和C1-C8。
<测量和评价方法>
1.剥离强度(粘合性的测量)
将除去保护层的粘合片材的两个表面夹在两个单面FPC基材的聚酰亚胺膜(商标名:Kapton 50H,由DuPont Corporation制造,厚度:43.5μm)之间,然后通过在160℃的温度下施加3MPa的压力40分钟压制加工获得的结构物。将获得的加制产物切割成10mm的宽度,得到剥离强度(聚酰亚胺-聚酰亚胺)测量样品。
此外,将除去保护层的另一个粘合片材夹在一个表面上厚度为35μm的电解铜箔的抛光表面和另一个表面上厚度为25μm的聚酰亚胺膜(商标名:Kapton 100H,由DuPont Corporation制造)之间,然后通过在160℃的温度下施加3MPa的压力40分钟压制加工获得的结构物。将获得的加制产物切割成10mm的宽度,得到剥离强度(聚酰亚胺-铜箔)测量样品。
剥离强度的测量根据JIS C6471,通过以90°的角度和50mm/分钟的速度拉样品,由此剥离铜箔或单面FPC基材(即聚酰亚胺膜)而进行。
2.焊剂耐热性(常规条件,水分吸收)
将以与上述“1.剥离强度”中相同的方式制备的剥离强度(聚酰亚胺-铜箔)测量样品用作焊剂耐热性测量样品。根据JIS C6471,将包括粘合在一起的电解铜箔和聚酰亚胺膜的样品切割成25mm正方形,由此得到样品试样。
通过在焊剂浴中漂浮样品30秒,并随后测量在粘合剂层上不出现砂眼或变色的最高温度而测量焊剂耐热性(常规条件)。此外,也通过将样品试样在90%RH和40℃的条件下放置1小时,然后在焊剂浴上漂浮此样品,并随后测量在粘合剂层上不出现砂眼或变色的最高温度而测量焊剂耐热性(水分吸收)。
3.阻燃性
通过蚀刻以与上述“1.剥离强度”中相同方式制备的剥离强度(聚酰亚胺-铜箔)测量样品的铜箔的整个表面而制备阻燃性评价样品。
使用此样品,根据UL94评价阻燃性。如果样品显示与UL94标准的VTM-O类别对应的阻燃性,则使用评价“VTM-O”记录它,而如果样品燃烧,则使用评价“燃烧”记录它。
4.粘合片材的操作性能
-(4-1)粘合片材从保护层的脱离性
当从粘合片材除去保护层时,如果能够除去保护层而不引起粘合片材中的变形,则脱离性评价为“良好”,而如果发生变形如伸长,则脱离性评价为“差”。
-(4-2)粘合片材再连接性
再连接性表示将粘合片材粘合到膜等上,除去片材,然后再连接它的能力。换言之,再连接性描述的是即使需要除去已经粘合到膜等上的粘合片材以进行位置等的稍小调节时,能够再连接片材的性能。测试粘合片材对单面FPC聚酰亚胺膜表面的再连接性,并将显示有利再连接性的片材记录为“A”,而将粘性高并且不可能再连接的片材记录为“B”。
<粘合剂组合物共混数量,测试结果>
表1
| 实施例 | ||||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | |||
| A | 丙烯酸类聚合物(质量份) | (a)丙烯酸丁酯 | 70 | 65 | 10 | 65 | 65 | 65 | 65 | 65 |
| (a)丙烯酸乙酯 | 50 | |||||||||
| (b)甲基丙烯酸 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | ||
| (c)丙烯腈 | 25 | 30 | 35 | 30 | 30 | 30 | 30 | 30 | ||
| [玻璃化转变温度(℃)] | 6 | 15 | 28 | 15 | 15 | 15 | 15 | 15 | ||
| [重均分子量] | 470,000 | 380,000 | 450,000 | 380,000 | 380,000 | 380,000 | 380,000 | 380,000 | ||
| B | 可熔型酚醛树脂(质量份) | Phenolite J-325 | 2.0 | 5.0 | 10 | 12 | 5.0 | 5.0 | ||
| Phenolite 5592 | 12 | 12 | ||||||||
| C | 环氧树脂(质量份) | Epikote 1001 | 5.0 | 10 | 15 | 18 | 10 | 10 | ||
| Epikote 154 | 8.0 | |||||||||
| Epikote 604 | 5.0 | |||||||||
| D | 固化促进剂(质量份) | Curezol 2E4MZ | 1.0 | 1.0 | 1.0 | 1.0 | ||||
| Curezol C11Z-CN | 1.0 | 1.0 | 1.0 | 1.0 | ||||||
| E | 溴基阻燃剂(质量份) | Saytex BT-93 | 40 | 40 | 40 | 40 | 40 | 40 | 80 | 35 |
| F | 无机填料(质量份) | 氢氧化铝 | 40 | 40 | 40 | 40 | 40 | 40 | 20 | 65 |
| 其它 | 阻燃助剂(质量份) | Patox-MF | 5.0 | 5.0 | ||||||
| 性能 | 溴含量(质量%)(*1) | 18.2 | 17.2 | 16.2 | 15.7 | 16.7 | 17.0 | 26.7 | 15.1 | |
| 剥离强度(N/cm) | 聚酰亚胺-铜箔 | 16 | 15 | 16 | 15 | 14 | 15 | 16 | 16 | |
| 聚酰亚胺-聚酰亚胺 | 16 | 15 | 17 | 15 | 15 | 16 | 16 | 15 | ||
| 焊剂耐热性(℃) | 常规条件 | 320 | 330 | 320 | 330 | 320 | 320 | 320 | 330 | |
| 水分吸收 | 280 | 290 | 280 | 280 | 280 | 280 | 280 | 290 | ||
| 阻燃性 | UL94 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | |
| 粘合片材 | 脱离性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | |
| 再连接性 | A | A | A | A | A | A | A | A | ||
*1:排除组分(F)的整个组合物中溴含量(质量%)
表2
| 对比例 | ||||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | |||
| A | 丙烯酸类聚合物(质量份) | (a)丙烯酸丁酯 | 75 | 65 | 65 | 65 | 65 | 65 | 65 | |
| (a)丙烯酸乙酯 | 65 | |||||||||
| (b)甲基丙烯酸 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | ||
| (c)丙烯腈 | 20 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | ||
| [玻璃化转变温度(℃)] | 0 | 32 | 15 | 15 | 15 | 15 | 15 | 15 | ||
| [重均分子量] | 420,000 | 490,000 | 380,000 | 380,000 | 380,000 | 380,000 | 380,000 | 380,000 | ||
| B | 可熔型酚醛树脂(质量份) | Phenolite J-325 | 5.0 | 5.0 | 25 | 12 | 5.0 | 5.0 | 5.0 | |
| C | 环氧树脂(质量份) | Epikote 1001 | 10 | 10 | 10 | 18 | 25 | 10 | 10 | 10 |
| D | 固化促进剂(质量份) | Curezol 2E4MZ | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | |
| E | 溴基阻燃剂(质量份) | Saytex BT-93 | 40 | 40 | 40 | 40 | 40 | 40 | 120 | |
| F | 无机填料(质量份) | 氢氧化铝 | 40 | 40 | 40 | 40 | 40 | 40 | 120 | |
| 其它 | 酚醛清漆酚醛树脂(质量份) | Phenolite TD-2093 | 5.0 | |||||||
| 性能 | 溴含量(质量%)(*1) | 17.2 | 17.2 | 17.2 | 14.6 | 15.1 | 17.4 | 34.2 | 0 | |
| 剥离强度(N/cm) | 聚酰亚胺-铜箔 | 15 | 7 | 6 | 9 | 8 | 16 | 6 | 10 | |
| 聚酰亚胺-聚酰亚胺 | 15 | 6 | 6 | 8 | 7 | 15 | 5 | 10 | ||
| 焊剂耐热性(℃) | 常规条件 | 320 | 310 | 290 | 280 | 280 | 290 | 290 | 300 | |
| 水分吸收 | 280 | 270 | 250 | 240 | 240 | 240 | 240 | 260 | ||
| 阻燃性 | UL94 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | VTM-0 | 燃烧 | |
| 粘合片材 | 脱离性 | 差 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | |
| 再连接性 | B | A | A | A | A | A | A | A | ||
*1:排除组分(F)的整个组合物中溴含量(质量%)
<评价>
由表1(实施例1-8)显而易见,包含粘合剂层的粘合片材显示优异的剥离强度(粘合性)、焊剂耐热性(耐热性)、可加工性、操作性和阻燃性水平,所述粘合剂层包括本发明的粘合剂组合物。此外,组合物也显示优异的可加工性,能够在短时间内甚至在不被认为是高温的温度下压制加工。
相反,由表2(对比例1-8)显而易见,包含粘合剂层的粘合片材在至少一种如下性能中显示不良表现:剥离强度(粘合性)、焊剂耐热性(耐热性)、可加工性、操作性和阻燃性,所述粘合剂层包括不满足本发明所有条件的粘合剂组合物。
Claims (7)
1.一种丙烯酸类阻燃粘合剂组合物,包括:
(A)100质量份包含羧基且玻璃化转变温度为5-30℃的丙烯酸类聚合物,
(B)1-20质量份可熔型酚醛树脂,
(C)1-20质量份环氧树脂,
(D)0.1-5质量份固化促进剂,
(E)数量足以在排除组分(F)的整个组合物中产生15-40质量%的溴含量的溴基阻燃剂,和
(F)10-100质量份无机填料。
2.根据权利要求1的组合物,其中所述丙烯酸类聚合物(A)是包括如下物质的共聚物:
(a)(甲基)丙烯酸酯,
(b)包含可聚合不饱和双键的羧酸单体,和
(c)(甲基)丙烯腈。
3.根据权利要求2的组合物,其中所述丙烯酸类聚合物(A)是包括50-80质量%所述单体(a),2-10质量%所述单体(b),和15-45质量%所述单体(c)的共聚物。
4.根据权利要求1的组合物,其中所述环氧树脂(C)在每个分子中包含平均至少2个环氧基团,并显示100-1,000的环氧当量。
5.根据权利要求1的组合物,其中所述溴基阻燃剂(E)的溴含量为至少50质量%,且熔点为至少200℃。
6.一种包含粘合剂层的丙烯酸类粘合片材,所述粘合剂层包括权利要求1的组合物。
7.一种粘合两个基材的方法,包括如下步骤:
在所述两个基材之间夹入根据权利要求6的丙烯酸类粘合片材和
固化所述丙烯酸类粘合片材。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106168054A (zh) * | 2016-08-30 | 2016-11-30 | 河北建筑工程学院 | 带干字型连接件预制剪力墙板的连接构造及其施工方法 |
| CN108410370A (zh) * | 2018-03-26 | 2018-08-17 | 广东生益科技股份有限公司 | 一种丙烯酸酯胶粘剂及其制备方法和用途 |
| CN111341950A (zh) * | 2020-03-31 | 2020-06-26 | 常州斯威克光伏新材料有限公司 | 一种聚合物锂离子电池的包装膜 |
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| JP4600640B2 (ja) * | 2003-11-10 | 2010-12-15 | 信越化学工業株式会社 | アクリル系接着剤シート |
| US7931830B2 (en) * | 2004-03-31 | 2011-04-26 | Endicott Interconnect Technologies, Inc. | Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| JP5173166B2 (ja) * | 2006-08-14 | 2013-03-27 | スリーエム イノベイティブ プロパティズ カンパニー | 粘着性フィルム剥離方法 |
| KR100838461B1 (ko) * | 2007-01-24 | 2008-06-16 | 율촌화학 주식회사 | 표면 보호 필름 |
| KR101053081B1 (ko) * | 2008-06-10 | 2011-08-01 | 토암산업(주) | 천연 수지를 이용한 기능성 접착제 조성물 |
| ITMI20121178A1 (it) * | 2012-07-05 | 2014-01-06 | Prysmian Spa | Cavo elettrico resistente a fuoco, acqua e sollecitazioni meccaniche |
| CN116102995B (zh) * | 2022-12-13 | 2023-11-03 | 广东东溢新材料科技有限公司 | 一种环氧改性丙烯酸酯胶黏剂及其制备方法 |
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| US3674743A (en) * | 1965-08-09 | 1972-07-04 | Atlantic Richfield Co | Elastomers from polyhydroxy polydienes |
| AT352842B (de) * | 1977-06-06 | 1979-10-10 | Herberts & Co Gmbh | Waesseriges ueberzugsmittel, insbesondere fuer die elektro-tauchlackierung, sowie verfahren zu seiner herstellung |
| US4360560A (en) * | 1979-03-08 | 1982-11-23 | Dynamit Nobel Aktiengesellschaft | Base material for the production of printed circuits and process for the preparation of the base material |
| GB2048271B (en) * | 1979-03-15 | 1983-08-03 | Mitsui Toatsu Chemicals | Phenolic resin epoxide rubber compositions |
| US4786675A (en) * | 1984-12-21 | 1988-11-22 | Nippon Zeon Co., Ltd. | Sealed semiconductor containing an epoxy resin composition |
| WO1988005455A1 (fr) * | 1987-01-27 | 1988-07-28 | Toyo Seikan Kaisha, Ltd. | Peinture a l'eau du type emulsion et procede de production et d'application de cette peinture |
| US4963602A (en) * | 1989-11-13 | 1990-10-16 | Hi-Tek Polymers, Inc. | Aqueous epoxy resin-acrylic resin coating compositions containing also phenoxy, novolac and resole resin combination |
| JP3175979B2 (ja) * | 1992-09-14 | 2001-06-11 | 株式会社東芝 | 樹脂封止型半導体装置 |
| US5977263A (en) * | 1992-12-10 | 1999-11-02 | 3M Innovative Properties Company | Thermal transfer compositions, articles and graphic articles made with same |
| JPH07314603A (ja) * | 1993-12-28 | 1995-12-05 | Nippon Denkai Kk | 銅張積層体、多層プリント回路板及びそれらの処理方法 |
| TWI299748B (en) * | 2000-02-15 | 2008-08-11 | Hitachi Chemical Co Ltd | Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition |
| JP3504635B2 (ja) * | 2001-06-07 | 2004-03-08 | サントリー株式会社 | 金属容器 |
| US6737163B2 (en) * | 2002-05-31 | 2004-05-18 | Ppg Industries Ohio, Inc. | Low-cure powder coatings and methods for using the same |
| JP4600640B2 (ja) * | 2003-11-10 | 2010-12-15 | 信越化学工業株式会社 | アクリル系接着剤シート |
-
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- 2005-09-28 CN CNA2005101071448A patent/CN1754934A/zh active Pending
- 2005-09-28 KR KR1020050090554A patent/KR20060051762A/ko not_active Withdrawn
- 2005-09-28 US US11/236,525 patent/US20060069201A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106168054A (zh) * | 2016-08-30 | 2016-11-30 | 河北建筑工程学院 | 带干字型连接件预制剪力墙板的连接构造及其施工方法 |
| CN108410370A (zh) * | 2018-03-26 | 2018-08-17 | 广东生益科技股份有限公司 | 一种丙烯酸酯胶粘剂及其制备方法和用途 |
| CN108410370B (zh) * | 2018-03-26 | 2021-05-11 | 广东生益科技股份有限公司 | 一种丙烯酸酯胶粘剂及其制备方法和用途 |
| CN111341950A (zh) * | 2020-03-31 | 2020-06-26 | 常州斯威克光伏新材料有限公司 | 一种聚合物锂离子电池的包装膜 |
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| US20060069201A1 (en) | 2006-03-30 |
| TW200617123A (en) | 2006-06-01 |
| KR20060051762A (ko) | 2006-05-19 |
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