CN1749811A - Panel for display device and manufacture method thereof - Google Patents

Abstract

A display device panel and a manufacturing method thereof, the display device panel comprising: a substrate; a sidewall element formed on the substrate and having a plurality of openings; a sidewall element formed into the plurality of openings and representing the color of incident light a plurality of color filters; and at least one inspection pattern for checking misalignment of the color filters.

Description

Display device panel and manufacturing method thereof

This application claims the priority and benefit of Korean Patent Application No. 10-2004-0073823 filed on September 15, 2004 and Korean Patent Application No. 10-2004-0092606 filed on November 12, 2004, which are hereby incorporated by reference are incorporated by reference as if set forth herein.

Background technique

The invention relates to a display device panel and a manufacturing method thereof.

technical field

Flat panel displays, such as organic electroluminescent displays ("OLEDs"), plasma display panels ("PDPs"), and liquid crystal displays ("LCDs"), are becoming popular.

The PDP device displays images using plasma generated by gas discharge. OLED devices display images by applying an electric field to specific light emitting or polymeric molecules. The LCD device displays images by applying an electric field to a liquid crystal layer located between two panels and adjusting the strength of the electric field to adjust light transmittance through the liquid crystal layer.

Among the above-mentioned flat panel displays, each of LCD and OLED displays includes a plurality of pixels having switching elements, display signal lines having gate lines and data lines, and color filters representing colors. OLEDs may also include organic light emitting layers instead of color filters.

Recently, various processes such as inkjet printing have been developed for forming color filters and organic light emitting layers, and are replacing photolithography.

Inkjet printing includes depositing a photoresist such as a black matrix on an insulating substrate, forming openings corresponding to pixels by exposing and developing the photoresist, and depositing ink for color filters into the openings. In the inkjet printing process, since coating, exposure, development, etc. are not necessary, the manufacturing cost can be reduced, and the manufacturing process can be simplified by eliminating them.

Inks for color filters are liquid-phase compositions including pigments, solvents, and dispersants. It is difficult to deposit the desired amount of ink into fine or small openings. It is difficult to calculate the distance to the desired deposition point to deposit the ink. As ink is deposited, it spreads freely within the opening, making it difficult to determine misalignment. Therefore, when the ink is deposited imprecisely, the ink spreads between adjacent color filters, which degrades the image quality of the display device.

Contents of the invention

The purpose of the present invention is to solve the problems of conventional techniques.

Additional features of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

The invention discloses a display device panel, comprising: a substrate; a sidewall element formed on the substrate and having a plurality of openings; a plurality of color filters formed into the plurality of openings; and at least one inspection Pattern to check for color filter misalignment.

The present invention also discloses a method of manufacturing a panel of a display device, comprising: depositing ink into an inspection pattern; inspecting the position of the deposited ink in the inspection pattern; adjusting the position of the substrate or the inkjet printing device head so that the aligning the center of the deposited ink with the center point of the inspection pattern; and depositing the ink into the opening.

The present invention also discloses a display device panel, comprising: a substrate; a side wall element disposed on the substrate and comprising a plurality of openings; a plurality of organic light elements respectively disposed in the plurality of openings and representing colors emitters; and inspection patterns for checking misalignment of organic light emitters.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are provided to provide further explanation of the invention as claimed.

Description of drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated into and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Figure 1 is a top view of a panel according to an embodiment of the invention.

FIG. 2 is a top view of an inspection pattern formed on a panel according to an embodiment of the present invention.

3 is a top view of an inspection pattern with ink droplets deposited thereon, according to an embodiment of the present invention.

4 is a top view of color filters and alignment patterns formed on a panel according to another embodiment of the present invention.

Fig. 5 is a perspective view of an inkjet printing apparatus used during manufacture of a panel according to an embodiment of the present invention.

6 is a top view of a head of an inkjet printing apparatus according to an embodiment of the present invention.

FIG. 7 shows a process of aligning heads using an alignment pattern before forming color filters during manufacture of the panel shown in FIG. 4 .

FIGS. 8A, 8B, 8C and 8D each show an example of a misalignment shape occurring in an alignment pattern during manufacture of the panel shown in FIG. 4 .

FIG. 9 is a cross-sectional view of an LCD having a panel according to an embodiment of the present invention.

10 is a layout diagram of an OLED TFT array panel according to an embodiment of the present invention.

11 and 12 are sectional views of the TFT array panel shown in Fig. 10 taken along line XII-XII'.

Detailed ways

The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the drawings, the thickness of layers and regions are exaggerated for clarity. Throughout the drawings, the same drawing references refer to the same elements. It will be understood that when an element such as a layer, film, region, substrate, or panel is referred to as being "on" another element, that element can be directly on the other element or intervening elements may be present. However, when an element is referred to as being "directly on" another element, there are no intervening elements present.

A display device panel and a manufacturing method thereof according to embodiments of the present invention are described below with reference to the accompanying drawings.

Figure 1 is a top view of a panel according to an embodiment of the invention. FIG. 2 is a top view of an inspection (alignment) pattern formed on a panel according to an embodiment of the present invention. 3 is a top view of an inspection (alignment) pattern on which ink droplets are deposited, according to an embodiment of the present invention.

Referring to FIG. 1 , the display device panel includes: an insulating substrate 210; a light blocking member 220 configured, for example, formed on the insulating substrate 210 and having openings corresponding to pixels; and a plurality of color filters The device 230 is formed in the plurality of openings of the photoresisting element 220 . For example, the color filter 230 may represent one of three primary colors including red, green, and blue. The photoresisting member 220 prevents or greatly reduces light leakage between adjacent pixels to improve brightness, and also functions as a side wall to receive or contain ink for color filters when the panel is manufactured.

The photoresist element 220 can be formed by forming a metal film such as Cr on the substrate 210 using a vacuum deposition process, coating a photoresist resin on the metal film, and patterning the photoresist resin using a photolithography process. (patterning), and etch Cr by using a photoresist resin as a mask. Alternatively, the photoresist element 220 may be formed by depositing a high molecular weight resin liquid onto the substrate 210 and performing spin coating, or by other methods.

When manufacturing the color filter 230, an inspection (or alignment) pattern 240 is formed in an area outside or around the deposition area of the color filter 230, for example, at an edge portion of the photoresist element 220, so as to accurately inspect the ink deposition position. . In FIG. 1 , the check pattern 240 is shown as an opening having a substantially circular shape, however, the check pattern may be formed of various shapes. Each check pattern 240 may have a protruding portion protruding or extending substantially in a horizontal direction and/or a vertical direction.

The center point A of the check pattern 240 is set along the same line as the center point B of the color filter 230 . The center point A of the inspection pattern 240 and the center point B of all the color filters 230 deposited along the same row are deposited along the line I-I', as shown in FIG. 1 . If the respective center points A and B are not deposited along the I-I' line, the ink for the color filter 230 may not be accurately deposited, which may reduce the reliability of the alignment inspection performed using the inspection pattern 240.

At least one inspection pattern 240 may be disposed along an edge portion of the photoresist member 220 , and at least one inspection pattern 240 may be disposed on an area outside or around the photoresist member 220 . The interval between ink supply nozzles (not shown) for deposition and the interval between color filters 230 may be determined by calculation. Thus, when the ink deposition position is accurately detected through one inspection pattern 240 and the position of the ink supply nozzle is defined according to the detection result, ink can be deposited into the opening of the photoresist member 220 . There may be multiple inspection patterns 240 to improve inspection accuracy. In addition, a check pattern 240 may be provided for each color filter row or column having the same color.

The inspection pattern 240 may be formed in various ways according to an ink supply device or an ink deposition manner.

The inner dimensions of the individual check patterns may vary; however, their dimensions are preferably larger than those of the ink diffusion regions.

When the photoresist 220 includes an organic polymer compound, the inspection pattern 240 may be formed by exposing and developing only the positive or negative photoresist 220 . However, when the photoresist member 220 is composed of an inorganic material, the inspection pattern 240 may be formed on the photoresist member 2220 by exposing, developing, and etching after depositing a separate photoresist film.

As shown in FIG. 2, each inspection pattern 240 may include a first alignment line 240a formed in an ink ejection direction, and a second alignment line 240b at a central point A perpendicular to the first alignment line 240a. For example, the first alignment line 240a and the second alignment line 24b may intersect and form a t-like shape. A protruding portion of the inspection pattern 240 is deposited along each of the first alignment line 240a and the second alignment line 240b. The protruding portion is used to guide the up-down and left-right positional relationship, so that the ink deposition state can be more easily determined. Alignment lines 240a and 240b include a plurality of alignment graduations 240c. The ink deposition position is calculated from the alignment lines 240a and 240b in order to check or locate misalignment of the deposited ink. Thus, precise positional adjustment of ink supply nozzles (not shown) is possible. It should be understood that the first alignment line 240a and the second alignment line 240b may be formed of various shapes.

For example, the first alignment line 240 a and the second alignment line 240 b may be patterned simultaneously with the inspection pattern 240 , or may be patterned after the inspection pattern 240 is formed. To simplify the manufacturing process, the alignment lines 240a and 240b and the inspection pattern 240 are preferably formed simultaneously.

The first alignment line 240a and the second alignment line 240b may have an embossed pattern or an intaglio pattern. The surface height of alignment lines 240a and 240b may be equal to the surface height of photoresist element 220 to prevent free flow of deposited ink.

A color filter forming method according to an embodiment of the present invention will be described below with reference to FIG. 3 .

A head with ink supply nozzles attached to an inkjet printing device is aligned on a substrate 210 having a photoresist element 220 and a plurality of inspection patterns 240 . The inkjet printing device deposits ink droplets 235 into each inspection pattern 240 through ink supply nozzles.

Then, the inkjet printing apparatus detects the position of the deposited ink 235 with reference to the inspection pattern 240, adjusts the head or ink supply nozzle position so that the center point C of the deposited ink 235 is aligned with the center point A of the inspection pattern 240, thereby Defines the reference ink deposition location. The inkjet printing apparatus deposits the ink 235 into the opening of the photoresist member 220 formed along the same extension line as the inspection pattern 240 according to the reference ink deposition position. The opening of the photoresist element 220 (refer to FIG. 1 ) is formed by exposure and development to receive the deposited ink 235 . After the curing operation, the deposited ink 235 becomes a color filter.

The inkjet printing apparatus may simultaneously deposit ink into all inspection patterns 240, or may deposit ink simultaneously into inspection patterns corresponding to the same color. One check pattern 240 may be formed per color.

The number of inspection patterns 240 and their arrangement may vary with the arrangement of the color filters 230 .

A color filter and a check pattern according to an embodiment of the present invention are described below with reference to FIG. 4 .

4 is a top view of color filters and alignment patterns formed on a panel according to an embodiment of the present invention.

Referring to the embodiment shown in FIG. 4 , the structure of the display device panel 200 is basically the same as the display panel shown in FIGS. 1 to 3 . The panel 200 includes: a photoresist element 220 having openings corresponding to pixels and formed on an insulating substrate 210; a plurality of color filters 230 formed on the openings; and formed outside the color filters 230 or A plurality of inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ on the surrounding substrate 210 portion.

Different from the embodiments shown in FIG. 1 , FIG. 2 and FIG. 3 , color filters 230, such as red, green, and blue primary color color filters 230, are preferably arranged sequentially on the display panel in a substantially vertical direction. 200 on. As shown in FIG. 4 , inspection patterns 240R, 240G, 240B, 240R', 240G', and 240B' are disposed on an outer region of the photoresist member 220 outside the color filter 230 and near the periphery of the substrate 210.

The inspection patterns 240R, 240G, 240B, 240R', 240G', and 240B' are arranged on both sides of the substrate 210 relative to the photoresist element 220, and close to extension lines of openings arranged substantially in the same row in the horizontal direction. The substantially horizontal centerlines of the inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ are the same as the centerline of the color filter 230 . The respective inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ may be formed with respect to a row of color filters, and these inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ may include Inspection patterns 240R and 240R' for a red color filter, inspection patterns 240G and 240G' for a green color filter, and inspection pattern 240B for a blue color filter and 240B'. Since the respective inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ are larger than the color filter 230, for example, at least about 1.5 times larger, the respective inspection patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ The check patterns 240R, 240G, 240B, 240R′, 240G′, and 240B′ of the same color are sequentially arranged on top of each other, and the center lines are substantially in the vertical direction.

The shape of the color filter 230 and the shape or number of the inspection patterns 240R, 240G, 240B, 240R', 240G', and 240B' may vary. The inspection patterns 240R, 240G, 240B, 240R', 240G', and 240B' may also be arranged in a different manner.

Inspection patterns 240R, 240G, 240B, 240R', 240G' and 240B' may be formed together with the photoresist member 220. Referring to FIG. The inspection patterns 240R, 240G, 240B, 240R', 240G', and 240B' may be formed by drawing or patterning another thin film before forming the photoresist member 220.

The display panel may be a color filter panel having only color filters. The photoresist element 220 prevents light leakage between adjacent pixels to improve brightness. When the display device is a liquid crystal display (LCD) or an organic electroluminescence display (OLED), the display panel should be a thin film transistor array panel or a common electrode panel. The photoresist member 220 functions as a sidewall for accommodating ink for color filters when the display panel is manufactured.

An inkjet printing apparatus for forming a color filter according to another embodiment of the present invention will be described below with reference to FIGS. 5 and 6 .

FIG. 5 is a perspective view of an inkjet printing apparatus used to manufacture a panel according to an embodiment of the present invention. 6 is a top view of a head of an inkjet printing apparatus according to an embodiment of the present invention.

As shown in FIGS. 5 and 6, the inkjet printing apparatus includes: a stage 500 on which an insulating substrate of a display panel 200 is placed; a head unit 700; and a transfer unit 300 for transferring the head unit 700 to a predetermined position.

The head unit 700 includes a head 400 and at least one ink supply nozzle attached to or connected to the head 400 . The head unit 700 may deposit the ink 235 for the color filter on the substrate 210 through the ink supply nozzles #1 to #n.

To form the color filter 230 on the operatively placed substrate 210 , the inkjet printing apparatus deposits ink 235 through the ink supply nozzles #1 to #n while transferring the head unit 700 in the X direction using the transfer unit 300 . Thus, ink 235 is deposited on the substrate 210 to form the color filter 230 on the substrate 210 . The size of the substrate 210 may be increased, but the number of ink supply nozzles #1 to #n and the size of the head 400 are defined or set to a predetermined amount. Thus, the head unit 700 repeatedly transfers the entire substrate 210 to form all the color filters 230 because not all the color filters 230 are formed by one scan.

The transfer unit 300 includes: a support unit 310 for keeping the head unit 700 at a predetermined distance from the substrate 210; a transfer part 330 for performing transfer in the X and Y directions; and a raising unit 340 for raising the head unit 700.

The head 400 of the above-described head unit 700 supports ink supply nozzles #1 to #n, and may include three heads for red, green, and blue, respectively. The head 400 may have a bar-like shape, however it is not limited to this shape. Ink supply nozzles #1 to #n are provided on the entire surface of the head 400 .

For example, when there are three heads, the heads are equally spaced apart and parallel to each other. Multiple heads can be arranged separately by moving horizontally, vertically, and rotationally.

The head 400 is inclined at a certain predetermined angle θ with respect to the Y direction. For example, since the nozzle pitch (the distance between adjacent nozzles) and the pixel pitch (the distance between adjacent pixels to be printed) are different, by rotating the head 400 by a certain predetermined angle θ, the nozzles #1 to The interval between adjacent ink droplets deposited by #n is consistent with the pixel pitch.

A method of forming a color filter using an inkjet printing apparatus according to an embodiment of the present invention will be described below with reference to FIG. 7 . A method of forming one color filter is described below, however, it should be understood that this method is applicable to other color filters.

FIG. 7 shows a process of aligning heads using an alignment pattern before forming color filters when manufacturing the display panel shown in FIG. 4 .

As shown in FIG. 7 , the panels 200 are aligned and placed on a stage 500 . The panel 200 includes: a photoresist layer 220 having a plurality of openings 221 in positions corresponding to a plurality of pixels; and inspection patterns 240 and 240'. The inkjet printing apparatus transfers the head unit 700 using the transfer unit 300 and deposits ink droplets 235 into the inspection pattern 240 according to the position information of the inspection pattern 240 that has been stored therein. It should be understood that the above process can be performed on one color filter, or can be performed on multiple color filters such as two or three color filters at the same time.

The inkjet printing apparatus detects the position of the center point C of the deposited ink 235 and adjusts the position of the head 700 or the first ink supply nozzle #1 accordingly to align the center point C with the center point A of the inspection pattern 240 . The inkjet printing device preferably adjusts nozzle #1. The above alignment is repeated for the remaining inspection patterns 240 and 240' disposed on both sides of the stage with respect to the photoresist member 220, and the remaining nozzles #2 to #n. In addition, in order to check misalignment between nozzles #1 to #n and substrate 210, two or more inspection patterns 240 and 240' may be selected to check misalignment between nozzles #1 to #n and . The selected check patterns 240 and 240' are preferably located on opposite sides of the stage, corresponding to A.

Then, the inkjet printing apparatus adjusts the positions of the nozzles #1 to #n or the substrate 210 according to the adjusted positions so as to deposit ink into the openings 221 while the head unit 700 is transferred.

The inkjet printing apparatus may simultaneously deposit ink into a plurality of inspection patterns 240 to check for misalignment. The inkjet printing device can deposit ink simultaneously into the check pattern of the same color. For example, one inspection pattern 240 may be formed with respect to each row of color filters having the same color.

The number of inspection patterns 240 and their arrangement may vary depending on the arrangement of the color filters 230 .

The misalignment shape and the change of the misalignment shape according to the embodiment of the present invention will be described below with reference to FIGS. 8A , 8B, 8C and 8D.

8A, 8B, 8C, and 8D show examples of misaligned shapes that occur in alignment patterns when the panel shown in FIG. 4 is manufactured.

As shown in FIG. 8A , the misalignment distance of the center point C of the deposited ink 235 relative to the center point A of the inspection pattern 240 in the X-axis direction is d1. The misalignment can be changed to adjust the initial fixed position of the head 400 by a distance d1.

As shown in FIG. 8B , the misalignment distance of the center point C of the deposited ink 235 relative to the center point A of the inspection pattern 240 in the Y-axis direction is d2. The misalignment can be changed in order to adjust the initial fixed position of the substrate 210 or stage 500 by a distance d2.

As shown in the left diagram of FIG. 8C , the center point C of the deposited ink 235 coincides with the center point A of the inspection pattern 240 . However, as shown in the right diagram of FIG. 8C, when the ink 235' is deposited into the second inspection pattern 240' through another nozzle such as the second nozzle #2 formed on the head 400, the center of the deposited ink 235' The point C' does not coincide with the center point A' of the inspection pattern 240'. Therefore, since the tilt angle of the head 400 is misaligned, the misalignment is changed to adjust the tilt angle of the head 400 .

As shown in the left diagram of FIG. 8D , the center point C of the deposited ink 235 coincides with the center point A of the inspection pattern 240 . However, as shown in the right diagram of FIG. 8D , the misalignment distance of the center point C' of the ink 235' deposited into another inspection pattern 240' relative to the center point A' of the inspection pattern 240' in the Y-axis direction is d4. Therefore, since the tilt angle of the substrate 210 or the stage 500 is misaligned, the misalignment is changed to adjust the tilt angle of the substrate 210 or the stage 500 .

An LCD having a display panel according to an embodiment of the present invention is described below with reference to FIG. 9 . FIG. 9 is a cross-sectional view of an LCD having a panel according to an embodiment of the present invention.

As shown in FIG. 9 , the LCD includes a thin film transistor (TFT) array panel 100 , a common electrode panel 200 , and a liquid crystal (LC) layer 3 between the panels 100 and 200 .

A plurality of gate electrodes 124 are formed on the insulating substrate 110 . Each gate electrode 124 is connected to one of a plurality of gate lines (not shown) transmitting a gate signal. A gate insulating layer 140 is formed on the gate lines. Semiconductors 151 and 154 composed of hydrogenated amorphous silicon (abbreviated as “a-Si”) are formed on the gate insulating layer 140 .

A plurality of ohmic contacts 161 , 163 and 165 , which may be composed of silicide or n+ hydrogenated a-Si doped with a large amount of N-type impurities, may be formed on the semiconductor 154 .

A plurality of data lines 171 and a plurality of drain electrodes 175 may be formed on the ohmic contacts 161 , 163 and 165 and on the gate insulating layer 140 , respectively. The data line 171 and the drain electrode 175 are separated from the gate line.

The gate electrode 124 , the source electrode 173 connected to the gate line, the drain electrode 175 , and the semiconductor 154 form a TFT having a channel formed in the semiconductor 154 between the source electrode 173 and the drain electrode 175 .

The ohmic contacts 161, 163 and 165 intervene only between the lower semiconductor 154 and the data line 171 and the upper drain electrode 175, and reduce contact resistance therebetween.

A passivation layer 180 may be formed on exposed portions of the data line 171 , the drain electrode 175 and the semiconductor 154 .

The passivation layer 180 may be composed of: a photosensitive organic material having good planarity characteristics; a low dielectric insulating material having a dielectric constant lower than 4.0, such as a- Si:C:O and a-Si:O:F; or inorganic materials such as silicon nitride.

The passivation layer 180 has a plurality of contact holes 185 exposing the drain electrode 175 . A plurality of pixel electrodes 190 preferably composed of indium tin oxide (ITO) or indium zinc oxide (IZO) are formed on the passivation layer 180 . Alternatively, when the LCD is a reflective LCD, the pixel electrode 190 may be composed of a transparent conductive polymer or an opaque reflective metal.

The pixel electrode 190 and the common electrode 270 form a capacitor called a "liquid crystal capacitor" that stores an applied voltage after the TFT is turned off. Additional capacitors called "storage capacitors" can be connected in parallel with the liquid crystal capacitors to increase voltage storage capacity.

The common electrode panel 200 is described below.

The photoresist element 200 for preventing light leakage may be formed on an insulating substrate 210 such as transparent glass. The photoresistive element 220 may include a plurality of openings facing the pixel electrode 190 , and the photoresistive element 220 may have substantially the same shape as the pixel electrode 190 . Alternatively, the photoresist element 220 may include a portion corresponding to the data line 171, and a portion corresponding to the TFT. A plurality of color filters 230 may be formed on the substrate 210 and may be disposed substantially in a region surrounded by the photoblocking member 220 .

An overcoat 250 may be formed on the color filter 230 . A common electrode 270 , which may be composed of a transparent conductive material such as ITO and IZO, may be formed on the overcoat layer 250 .

Alignment layers 11 and 21 are formed on the inner surface of the TFT array panel 100 . A common electrode panel 200 thin film transistor and polarizers 12 and 22 are attached on the outer surfaces of the panels 100 and 200, respectively.

The OLED TFT array panel according to the embodiment of the present invention will be described below with reference to FIGS. 10, 11 and 12.

10 is a layout diagram of an OLED TFT array panel according to an embodiment of the present invention. 11 and 12 are sectional views of the TFT array panel shown in Fig. 10 taken along line XII-XII'.

A barrier film 111, which may be composed of silicon nitride (SiNx) or silicon oxide (SiOx), is formed on an insulating substrate 110, which may be composed of transparent glass or plastic. The barrier film 111 may have a double-layer structure or a multi-layer structure.

Pairs of first and second semiconductor islands 151 a and 151 b , which may be composed of polysilicon, are formed on the barrier film 111 . Each of the semiconductor isolated regions 151a and 151b includes a plurality of extrinsic regions having N-type or P-type conductive impurities, and at least one intrinsic region hardly including any conductive impurities.

Regarding the first semiconductor isolated region 151 a, the extrinsic region includes first source/drain regions 153 a and 155 a and an intermediate region 1535 doped with N-type impurities and separated from each other. The intrinsic region includes a pair of first channel regions 154a1 and 154a2 located between the extrinsic regions 153a, 1535 and 155a.

Regarding the second semiconductor isolated region 151b, the extrinsic region includes second source/drain regions 153b and 155b doped with P-type impurities and separated from each other. The intrinsic region includes a second channel region 154b located between the second source/drain regions 153b and 155b, and a storage region 157 extending or protruding upward from the second source/drain region 153b.

The extrinsic regions may further include lightly doped regions (not shown) between the channel regions 154a1, 154a2, and 154b and the source/drain regions 153a, 155a, 153b, and 155b. The lightly doped regions may be replaced by compensation regions substantially free of impurities.

Alternatively, the extrinsic regions 153a and 155a of the first semiconductor isolated region 151a may be doped with P-type impurities, and the extrinsic regions 153b and 155b of the second semiconductor isolated region 151b may be doped with N-type impurities. The P-type impurity may be boron (B) gallium (Ga) or the like, and the N-type impurity may be phosphorous (P), arsenic (As) or the like.

A gate insulating layer 140 , which may be composed of silicon nitride or silicon oxide, is formed on the semiconductor isolated regions 151 a and 151 b and the barrier film 111 .

A plurality of gate conductors including a plurality of gate lines 121 having a plurality of first control electrodes 124 a and a plurality of second control electrodes 124 b are formed on the gate insulating layer 140 .

The gate lines 121 for transmitting gate signals (gate signals) extend substantially laterally. The first control electrode 124a extends or protrudes upward from the gate line 121 and intersects the first semiconductor isolation region 151a such that the first control electrode 124a overlaps the first channel regions 154a1 and 154a2. Each gate line 121 may include an end portion having a region sufficient to contact another layer or an external driving circuit. The gate line 121 may be connected to a gate driving circuit (not shown) for generating a gate signal. The gate driving circuit and the gate lines 121 may be integrated on the substrate 110 .

The second control electrode 124b is separated from the gate line 121, and overlaps the second channel region 154b. The second control electrode 124b extends to form a storage electrode 127 overlapping the storage region 157 of the second semiconductor isolation region 151b.

The gate conductors 121 and 124b may be composed of the following metals: aluminum-containing metals, such as aluminum and aluminum alloys (e.g., Al-Nd); silver-containing metals, such as silver and silver alloys; copper-containing metals, such as copper and copper alloys; Metals such as molybdenum and molybdenum alloys; chromium; tantalum; titanium;

The gate conductors 121 and 124b may have a multilayer structure including two films different in physical properties. One film may be composed of low resistivity metals including aluminum-containing metals, silver-containing metals and copper-containing metals in order to reduce signal delay or voltage drop. The other film may consist of a material, such as molybdenum-containing metals, chromium, tantalum or titanium, that has good physical, chemical and electrical contact properties with other materials such as ITO or IZO. For example, the combination may be a lower chromium film and an upper aluminum (alloy) film, and a lower aluminum (alloy) film and an upper molybdenum (alloy) film. However, the gate conductors 121 and 124b may be composed of other metals and conductors. The sides of the gate conductors 121 and 124b are inclined with respect to the surface of the substrate, and the inclination angle thereof varies approximately in the range of 30-80 degrees.

An interlayer insulating film 160 may be formed on the gate conductors 121 and 124b. The interlayer insulating film 160 may be composed of an inorganic insulator such as silicon nitride and silicon oxide, an organic insulator, or a low dielectric insulator. Organic insulators or low-k insulators preferably have a dielectric constant below about 4.0 and include a-Si:C:O and a-Si:O:F formed by PECVD. An organic insulator used for the interlayer insulating film 160 may have photosensitivity, and the interlayer insulating film 160 may have a plane.

The interlayer insulating film 160 has a plurality of contact holes 164 exposing the second control electrode 124b. In addition, the interlayer insulating film 160 and the gate insulating layer 140 have a plurality of contact holes 163a, 163b, 165a, and 165b exposing the source/drain regions 153a, 153b, 155a, and 155b, respectively.

A plurality of data conductors including a plurality of data lines 171 , a plurality of driving voltage lines 172 and a plurality of first and second output electrodes 175 a and 175 b are formed on the interlayer insulating film 160 .

The data lines 171 for transmitting data signals extend substantially longitudinally and intersect the gate lines 121 . Each data line includes a plurality of first input electrodes 173a connected to the first source/drain regions 153a through contact holes 163a. Each data line 171 may include an end portion having a region sufficient to contact another layer or an external driving circuit. The data line 171 may be connected to a data driving circuit (not shown) for generating data signals, and the data driving circuit may be integrated on the substrate 110 .

The driving voltage line 172 for transmitting the driving voltage extends substantially in the longitudinal direction and intersects the gate line 121 . Each of the driving voltage lines 172 includes a plurality of second input electrodes 173b connected to the second source/drain regions 153b through the contact holes 163b. The driving voltage line 171 overlaps the storage electrode 127, and the driving voltage line 171 may be interconnected.

The first output electrode 175 a is separated from the data line 171 and the driving voltage line 172 , and is connected to the first source/drain region 155 a through the contact hole 165 a and connected to the second control electrode 124 b through the contact hole 164 .

The second output electrode 175b is separated from the data line 171, the driving voltage line 172 and the first output electrode 175a, and is connected to the second source/drain region 155b through the contact hole 165b.

The data conductors 171, 172, 175a and 175b may be composed of high melting point metals such as molybdenum, chromium, titanium, tantalum or alloys thereof. The data conductors 171, 172, 175a, and 175b may have a multilayer structure including a high-melting-point metal film and a low-resistivity film. For example, the multilayer structure may be a double-layer structure including a lower chromium film and an upper aluminum (alloy) film, or a double-layer structure including a lower molybdenum (alloy) film and an upper aluminum (alloy) film. The multi-layer structure may be a three-layer structure of a lower molybdenum (alloy) film, a middle aluminum (alloy) film and an upper molybdenum (alloy) film.

Similar to the gate conductors 121 and 124b, the data conductors 171, 172, 175a, and 175b have sloped edge profiles, and their slope angles are approximately 30-80 degrees.

A passivation layer 180 may be formed on the data conductors 171, 172, 175a and 175b. The passivation layer 180 may have a thickness of about 1.0 to 10.0 micrometers, and the passivation layer may be composed of an organic insulator capable of providing a planar surface, such as polyimide or poly-acryl. It should be understood that the passivation layer 180 may be composed of an inorganic insulator, another organic insulator, or a low dielectric insulator.

The passivation layer 180 has a plurality of contact holes 185 exposing the second output electrode 175b. The passivation layer 180 may further have a plurality of contact holes (not shown) exposing the ends of the data lines 171, and the passivation layer 180 and the interlayer insulating film 160 may have a plurality of contact holes exposing the ends of the gate lines 121. (not shown).

A plurality of pixel electrodes 191 may be sequentially formed on the passivation layer 180 . The pixel electrode 191 is connected to the second output electrode 175 b through the contact hole 185 .

The pixel electrode 191 may be composed of a reflective conductor, such as chromium, aluminum, silver, or alloys thereof, having a visible light reflectance greater than about 70%. The thickness of the pixel electrode 91 may be about 10 nm to 500 nm.

A plurality of auxiliary electrodes (not shown), which may be composed of a material having a higher work function (eg, higher than about 5 eV) than the pixel electrode 191 , such as ITO or IZO, may be formed on the pixel electrode 191 to enhance electron injection.

A plurality of contact assistants (not shown) or connection elements (not shown) may be formed on the passivation layer 180 such that they are connected to exposed ends of the gate lines 121 or the data lines 171 .

A spacer 361 may be formed on the passivation layer 180 . The spacer 361 surrounds the pixel electrode 191 to define the opening 365, and may be composed of an organic or inorganic insulating material. The spacer 361 may be composed of a photosensitive material with carbon black, so that the spacer 361 functions as a photoresist member, and the formation of the spacer 361 may be simplified.

A plurality of light emitting elements 370 may be formed on the pixel electrode 191 and disposed in the opening 365 defined by the partition 361 . Each light emitting element 370 can be made of organic material that emits a certain color, such as one of the three primary colors of red, green, and blue light. The OLED display displays an image by spatially adding monochromatic light emitted from the light emitting element 370 .

Each light emitting element 370 may have a multilayer structure including an emission layer (not shown) for emitting light, and an auxiliary layer (not shown) for improving light emission efficiency of the emission layer. The auxiliary layer may include an electron transport layer (not shown) and a hole transport layer (not shown) for improving the balance of electrons and holes, and an electron injection layer (not shown) and a hole layer for improving electron and hole injection. Inject layer (not shown).

The common electrode 270 is formed on the light emitting element and the spacer 361 . The common electrode 270 is supplied with a common voltage, and may be composed of a transparent material such as ITO or IZO.

In the above-mentioned OLED display, the first semiconductor isolated region 151a, the first control electrode 124a connected to the gate line 121, the first input electrode 153a connected to the data line 171, and the first output electrode 155a are formed with the first The switching TFT Qs of the channel formed in the channel regions 154a1 and 154a2 of the semiconductor isolation region 151a. Similarly, the second semiconductor isolated region 151b, the second control electrode 124b connected to the first output electrode 155a, the second input electrode 153b connected to the driving voltage line 172, and the second output electrode 155b connected to the pixel electrode 191, form A driving TFT Qd having a channel formed in the second channel region 154b of the second semiconductor isolation region 151b. The pixel electrode 191, the light emitting element 370, and the common electrode 270 form an organic light emitting diode that uses the pixel electrode 191 as an anode and uses the common electrode 270 as a cathode, and vice versa. The overlapping portion of the storage electrode 127, the driving voltage line 172, and the storage region 157 forms a storage capacitor Cst.

The switching TFT Qs transmits a data signal from the data line 171 in response to a gate signal from the gate line 121. The driving TFT Qd, upon receiving the data signal, drives a current having an amplitude depending on the voltage difference between the second control electrode 124b and the second output electrode 175b. After the switch TFT Qs is turned off, the voltage difference between the second control electrode 124b and the second input electrode 173b is stored in the storage capacitor Cst and maintained. The light emitting diode emits light with intensity depending on the current driven by the driving TFT Qd. Monochromatic light from light-emitting diodes is spatially added to display an image.

The OLED display including the opaque pixel electrode 191 and the transparent common electrode 270 according to the above-described embodiments of the present invention emits light toward the top of the substrate 110 and is called a top-emitting OLED display. The present invention is also applicable to a bottom emission OLED display that includes the transparent pixel electrode 191 and the opaque common electrode 270 and emits light toward the bottom of the substrate 110 .

The semiconductor isolated regions 151a and 151b may be composed of amorphous silicon without an intrinsic region. Ohmic contacts (not shown), which may be composed of amorphous silicon doped with a large amount of N-type impurities, may be disposed between the semiconductor isolation regions 151a and 151b and the data conductors 171, 172, 175a and 175b.

The first and second control electrodes 124a and 124b may be disposed under the semiconductor isolated regions 151a and 151b, respectively, and the gate insulating layer 140 is disposed between the semiconductor isolated regions 151a and 151b and the first and second control electrodes 124a and 124b. between. The data conductors 171 , 172 , 173 b and 175 b may be directly disposed on the gate insulating layer 140 .

In addition, the data conductors 171, 172, 173b, and 175b may be disposed under the semiconductor isolation regions 151a and 151b, and may be electrically connected with the semiconductor isolation regions 151a and 151b.

According to at least the above-described embodiments of the present invention, by correcting the misalignment of the position of the deposited ink, the ink is accurately deposited into the corresponding pixel, thereby reducing the spread of ink between adjacent color filters and improving the performance of the display device. Image Quality.

It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit or scope of the inventions. Thus, it is to be understood that the present invention includes the modifications and variations of this invention that come within the scope of the appended claims and their equivalents.

Claims (26)

1. A display device panel, comprising: Substrate; a sidewall element disposed on the substrate and having a plurality of openings; a plurality of color filters disposed in the plurality of openings; and At least one check pattern for checking misalignment of color filters. 2. The panel of claim 1, wherein the inspection pattern is provided on an edge portion of the sidewall member or an edge portion of the substrate. 3. The panel of claim 1, wherein the side wall member is a light blocking member. 4. The panel of claim 1, wherein the center of the check pattern is positioned along the same line as the center of each color filter arranged along the same row. 5. The panel of claim 1, wherein the inspection pattern is substantially circular and includes a plurality of alignment lines having a plurality of graduations. 6. The panel of claim 1, wherein the alignment lines intersect each other. 7. The panel of claim 1, wherein the inspection pattern is larger than ink droplets. 8. The panel of claim 1, wherein each color filter represents one of red, green or blue. 9. The panel of claim 8, wherein at least one check pattern is arranged for each row of color filters having the same color. 10. The panel of claim 1, wherein the panel is a liquid crystal display panel. 11. The panel of claim 10, further comprising: Multiple signal lines; a plurality of transistors connected to a plurality of signal lines; and A plurality of pixel electrodes, the plurality of pixel electrodes are electrically connected to a plurality of signal lines through a plurality of transistors. 12. A method of manufacturing a display device panel, comprising: depositing ink into the inspection pattern; Inspecting the location of deposited ink in the inspection pattern; adjusting the position of the substrate or inkjet printing device head so that the center of the deposited ink is aligned with the center point of the inspection pattern; and Ink is deposited into the opening. 13. The method of claim 12, wherein the ink has one of red, green and blue. 14. The method of claim 12, wherein the sidewall elements are photoresist elements. 15. The method of claim 12, wherein the panel is a liquid crystal display panel or an organic electroluminescent display panel. 16. The method of claim 12, the panel comprising: Multiple signal lines; a plurality of transistors connected to a plurality of signal lines; and A plurality of pixel electrodes, the plurality of pixel electrodes are electrically connected to a plurality of signal lines through a plurality of transistors. 17. A display device panel, comprising: Substrate; a sidewall element disposed on the substrate and comprising a plurality of openings; a plurality of organic light emitters respectively disposed in the plurality of openings and representing colors; and Check pattern for checking misalignment of organic light emitters. 18. The panel of claim 17, wherein the inspection pattern is provided on an edge portion of the sidewall member or an edge portion of the substrate. 19. The panel of claim 17, wherein the inspection pattern center is located along the same line as the center of each organic light emitter arranged along the same row. 20. The panel of claim 17, wherein the inspection pattern is substantially circular and includes a plurality of alignment lines having a plurality of graduations. 21. The panel of claim 17, wherein the alignment lines intersect each other. 22. The panel of claim 17, wherein the inspection pattern is larger than ink droplets. 23. The panel of claim 17, wherein each organic light emitter represents one of red, green or blue. 24. The panel of claim 17, wherein at least one inspection pattern is arranged for each row of organic light emitters having the same color. 25. The panel of claim 17, wherein the panel is an organic electroluminescent display panel. 26. The panel of claim 25, further comprising: Multiple signal lines; a plurality of transistors connected to a plurality of signal lines; and A plurality of pixel electrodes, the plurality of pixel electrodes are electrically connected to a plurality of signal lines through a plurality of transistors.

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