CN1744110A - Memory card - Google Patents

Abstract

The present invention provides a memory card of a subminiature, thin size provided with a mechanism for preventing erroneous insertion into a memory card slot. A multi-function memory card includes a card body and a cover for accommodating the card body. The card body is made of a mold resin encapsulating a plurality of semiconductor chips mounted on the main surface of the wiring substrate. The card body is accommodated into the cover with the back surface of the wiring substrate facing outward. Guide grooves are provided on both side surfaces of the cover to prevent the card from being inserted upside down. Further, a projection is provided on the rear edge of the cover to prevent the card from being inserted in an incorrect direction.

Description

storage card

Cross References to Related Applications

This application claims priority from Japanese Patent Application No. 2004-257244 filed on September 3, 2004 and Japanese Patent Application No. 2004-129602 filed on April 26, 2004. Here, the contents thereof are incorporated into this application by reference.

technical field

The present invention relates to a memory card, and more particularly, to a technology effectively applied to a memory card used as an ultra-small, thin-sized memory card inserted into a card slot of a communication portable terminal device such as a cellular phone.

Background technique

In addition to telephony functions, cellular phones have functions such as Internet connection, mail transmission, image capture, and navigation. Recently, a security function has been added, and an example of this includes a contactless IC card.

With the multifunctionalization of cellular phones as described above, devices that promote multifunctionalization through miniaturization and reduction in size have also been developed in the field of cards used as cards inserted into memory card slots of cellular phones. Various cards.

Patent International Publication No. WO01/84490 (Patent Reference 1) discloses this type of memory card seeking multi-functionalization.

multifunctional

[Patent Reference 1]

Patent International Publication No.WO01/84490

Contents of the invention

Like various types of memory cards, a memory card for insertion into a memory card slot of a cellular phone generally has a configuration in which a resin-encapsulated semiconductor chip mounted on a wiring substrate is accommodated in a resin-made case. A label with a description of product name, manufacturer, storage capacity, etc. is provided on the surface of the case, and thereby external connection terminals connected to connector terminals in the memory card slot are provided on the back surface thereof.

When this type of memory card is inserted into the memory card slot of a cellular phone, users may misorient the card (front or back, or front or back) so that they may often insert the card in the wrong orientation. Insert a memory card. When the card is inserted in the wrong direction, the connector terminal in the slot is bent or the external connection terminal of the card and the connector terminal not corresponding to this external connection terminal come into contact with each other, thus causing damage or damage to the circuit in the semiconductor chip Shortcomings. Specifically, the miniaturization of cards makes it very difficult to determine which direction is front or rear or which direction is front or back. Therefore, it is a fundamental problem in the development of memory cards to provide a mechanism capable of surely preventing erroneous insertion into a memory card slot.

Further, this type of memory card is used by cellular phone users who frequently insert and remove the card from the slot. Therefore, it is also an essential subject to provide a mechanism for maintaining connection reliability between the connector terminals in the slot and the external connection terminals of the card over a long period of time.

Also, this type of memory card requires miniaturization and size reduction, and requires multifunctionality. In order to satisfy this opposite requirement, a technique is required in the card manufacturing process to mount a plurality of semiconductor chips on a wiring substrate, each of which has a reduced size of not more than 100 micrometers by polishing its back surface, and requires In the development of the card structure, semiconductor chips can be layered as much as possible within a limited size.

An object of the present invention is to provide a memory card having a mechanism capable of surely preventing erroneous insertion into a memory card slot.

Another object of the present invention is to provide a memory card capable of maintaining connection reliability with connector terminals in a memory card slot over a long period of time.

Another object of the present invention is to provide a multifunctional memory card having a card structure capable of increasing the number of semiconductor chips to be mounted.

The above-mentioned object and other objects of the present invention and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

The following is a brief summary of typical inventions among the inventions disclosed in this specification.

A memory card according to the present invention includes: a sheet-shaped card body in which a semiconductor chip mounted on the other surface of a wiring substrate having one surface on which a plurality of external connection terminals is formed is encapsulated with resin; A groove on one surface thereof for accommodating a card body, wherein the card body is accommodated in the groove of the cover member so as to expose one surface of the wiring substrate, two corner portions on one side of the cover member as a leading edge when the card is inserted are provided Rounding processing, stepping guide grooves are formed on both side parts of the cover member so that the width of one surface is different from the width of the other surface and a protruding portion protruding in a direction perpendicular to one surface is formed as a trailing edge when inserting a card the other side of the cover assembly.

Effects obtained by typical inventions among the inventions disclosed in this application will be briefly explained below.

The present invention can realize a memory card having a mechanism capable of positively preventing erroneous insertion into a memory card slot.

The present invention can realize a memory card capable of maintaining connection reliability with connector terminals in a memory card slot over a long period of time.

The present invention can realize a memory card having a card structure capable of increasing the number of layered semiconductor chips.

Description of drawings

1 is a plan view showing the appearance of the back surface of a multi-function memory card according to one embodiment of the present invention;

2 is a plan view showing the appearance of the front surface of a multi-function memory card according to one embodiment of the present invention;

3 is a cross-sectional view of the main parts of a multi-function memory card according to an embodiment of the present invention;

Fig. 4 represents the block diagram of the system example of the multi-function memory card according to one embodiment of the present invention;

5 is a view for explaining functions of external connection terminals of a multi-function memory card according to one embodiment of the present invention;

6 is a view for explaining a positional relationship between external connection terminals of a multi-function memory card and connector terminals of a memory card slot according to one embodiment of the present invention;

7 is a view for explaining a positional relationship between external connection terminals of a multifunction memory card and connector terminals of a memory card slot according to a comparative example;

8 is a cross-sectional view showing the structure of a guide groove provided on a multi-function memory card according to an embodiment of the present invention;

9 is a sectional view showing a state where a multi-function memory card is inserted into a connector of a memory card slot according to an embodiment of the present invention;

10 is a cross-sectional view showing an example of a position of a guide groove provided on a multi-function memory card according to an embodiment of the present invention;

11 is a sectional view showing another example of the position of a guide groove provided on a multi-function memory card according to an embodiment of the present invention;

12 is a plan view showing the front surface of a multi-function memory card according to one embodiment of the present invention;

13 is a side view showing a multi-function memory card according to one embodiment of the present invention;

14 is a side view showing a multi-function memory card according to one embodiment of the present invention;

15 is a side view showing a multi-function memory card according to one embodiment of the present invention;

16 is a plan view showing a front surface of a multi-function memory card according to one embodiment of the present invention;

17 is a side view showing a multi-function memory card according to one embodiment of the present invention;

18 (a) and FIG. 18 (b) are views for explaining an erroneous contact prevention mechanism of an external connection terminal of a multi-function memory card and a connector terminal of a memory card slot according to an embodiment of the present invention;

19 is a plan view showing the appearance of the back surface of a multi-function memory card according to another embodiment of the present invention;

20 is a plan view showing the appearance of the front surface of a multi-function memory card according to another embodiment of the present invention;

21 is a view for explaining an erroneous contact prevention mechanism of an external connection terminal of a multi-function memory card and a connector terminal of a memory card slot according to another embodiment of the present invention;

22 is a plan view showing a state in which a multi-function memory card according to another embodiment of the present invention is inserted into a connector;

23 is a plan view showing a state in which a multi-function memory card according to another embodiment of the present invention is inserted into a connector;

24 is a plan view showing a state in which a multi-function memory card according to another embodiment of the present invention is inserted into a connector;

25 is a view explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

26 is a view for explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

27 is a view for explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

28 is a view for explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

29 is a view for explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

30 is a view for explaining a method for connecting a card body to a cover of a multi-function memory card according to another embodiment of the present invention;

31 is a plan view showing an arrangement of external connection terminals of a multi-function memory card according to another embodiment of the present invention;

32 is a plan view showing the appearance of the front surface of an adapter into which a multi-function memory card is inserted according to another embodiment of the present invention;

33 is a plan view showing the appearance of the back surface of the adapter into which the multi-function memory card is inserted according to another embodiment of the present invention;

34 is a plan view showing a wiring pattern for connecting the external connection terminals of the multi-function memory card and the corresponding external connection terminals at the adapter;

35 is a plan view showing an arrangement of opening portions of connectors provided on an adapter into which a multi-function memory card is inserted according to another embodiment of the present invention;

36 is a plan view showing a protection chip provided on an adapter into which a multi-function memory card is inserted according to another embodiment of the present invention.

Detailed ways

Embodiments of the present invention will be explained in detail below by referring to the accompanying drawings. It should be noted that the same reference numerals are assigned to the same components to omit repeated explanations thereof in all the drawings for explaining the embodiments.

Example 1

The memory card according to the present embodiment is an ultra-small, large-capacity multifunctional memory card having a security function in addition to a storage function. It is used to be inserted into memory card slots such as third generation cellular phones.

1 and 2 are plan views showing the appearance of the multifunction memory card according to this embodiment, wherein FIG. 1 shows a surface on which external connection terminals are formed, and FIG. 2 shows the opposite surface. Further, Fig. 3 is a sectional view showing the main part of the memory card. It should be noted that the surface on which the external connection terminals are formed is referred to as the rear surface, and the surface shown in FIG. 2 is referred to as the front surface.

A multifunction memory card 1 according to this embodiment includes a card body 1A and a cover (casing) 1B for accommodating the card body. The card body 1A includes a wiring substrate 2 made of glass epoxy resin, a plurality of semiconductor chips (3C, 3F, 3M) mounted on the main surface of the wiring substrate, and a molding resin 4 for encapsulating these semiconductor chips (3C, 3M, 3F). . The semiconductor chips ( 3C, 3M, 3F ) and wirings formed on the wiring substrate and not shown are electrically connected by bonding wires 6 .

A plurality of (for example, 20) external connection terminals 5 are formed on the back surface of the wiring substrate 2 . These external connection terminals 5 are arranged in two rows along the short side direction of the wiring substrate 2 . Further, the external connection terminals 5 are electrically connected to the semiconductor chips ( 3C, 3M, 3F) through wirings and bonding wires 6 formed on the wiring substrate 2 . In order to facilitate testing, a plurality of test terminals 7 are arranged on the back surface of the wiring substrate 2 in addition to the external connection terminals 5 . An effective arrangement of the test terminals 7 is: the test terminals 7 are placed between the external connection terminals 5 arranged in two rows.

A groove (recessed portion) having approximately the same size as that of the card body 1A is formed on the back surface of the cover 1B. The card body 1A is housed in this groove with the back surface of the wiring substrate 2 facing the outside, and bonded to the cover 1B by an adhesive. The depth of the groove for accommodating the card body 1A is approximately equal to the thickness of the card body 1A, whereby the back surface of the cover 1B and the back surface of the wiring substrate 2 form substantially the same plane. The planar shape of the card body 1A is, for example, a rectangle having a long side of 14 mm and a short side of 11 mm. Further, the thickness of the card body 1A including the wiring substrate 2 and the molding resin 4 is 0.8 mm.

Molding resin 4 for encapsulating semiconductor chips (3C, 3M, 3F) mounted on the main surface of wiring substrate 2 is made of thermosetting epoxy resin including crystal filler. On the other hand, the cover 1B for accommodating the card body 1A is composed of a compact made of thermoplastic resin having lower frictional resistance and hardness than those of the thermosetting epoxy resin forming the molding resin 4 . Although not shown, in the case of an actual product, a label with a description of the product name, manufacturer, storage capacity, etc. is set to the front surface of the cover 1B corresponding to the front surface of the multifunction memory card 1 (shown in FIG. 2 ). on the surface. Alternatively, such information can sometimes be printed on the front surface of the cover 1B.

The outer dimensions of the cover 1B for accommodating the card body 1A have a long side of 16 mm and a short side of 12.5 mm. At one side (one of a pair of short sides) of the cover 1B is provided a protruding portion 1C as a wrong insertion prevention mechanism for inserting the multifunction memory card 1 in the correct direction into the slot of the cellular phone. The protruding portion 1C was formed linearly from one end to the other end of the side and had a thickness of 0.7 mm.

The thickness of the cover 1B is 1.6 mm at the portion where the protruding portion 1C is provided, and 1.2 mm at the portion for accommodating the card body 1A. The card body 1A is covered by the cover 1B so that the size of the multi-function memory card 1 is equal to that of the cover 1B. As described above, the multi-function memory card including the card body 1A and the cover 1B is very small and thin in size, having a long side of 16 mm, a short side of 12.5 mm, and a thickness of 1.2 mm (only the portion where the protruding portion 1C is formed The thickness is 1.6mm).

The manufacture of the multifunction memory card 1 uses a large wiring substrate having, for example, several tens of times the area of the wiring substrate 2 . This large wiring base has formed thereon a plurality of wiring pattern units required for the wiring base 2 in a matrix. When manufacturing the multifunction memory card 1, semiconductor chips (3C, 3M, 3F) are first mounted on each unit of the large wiring base, and then, the wiring patterns of the large wiring base and the semiconductor chips (3C, 3M, 3F) are passed The bonding wire 6 is electrically connected. Then, the large wiring substrate is set in a molding resin mold made of an upper mold and a lower mold to encapsulate all semiconductor chips (3C, 3M, 3F) with the molding resin 4 . Then, this large wiring substrate and molding resin 4 are cut and separated by using a cutting blade, thereby obtaining a large number of card bodies 1A having the aforementioned external dimensions and rectangular parallelepiped shape. On the other hand, thermoplastic resin is injected into a casting resin mold different from the above-mentioned mold to thereby form the cover 1B. Then, the card body 1A is housed in the groove of the cover 1B, and the two are bonded by an adhesive. Adopting a method in which semiconductor chips (3C, 3M, 3F) are mounted in each unit of a large wiring base and all resin encapsulated, and then the large wiring base and the molding resin 4 are cut, the card body 1A can be improved. productivity and reduce its manufacturing cost.

Also, in order to simplify the operation for joining the cover 1B and the card body 1A, a double-sided adhesive tape is stuck on the surface of the casting resin 4 removed from the casting resin mold, and then, the large wiring substrate, the casting resin 4 and the double-sided The tape is cut at the same time. This can provide the card body 1A in which the double-sided adhesive tape is stuck on the surface of the molding resin 4 , whereby the two can be joined only by accommodating the card body 1A into the groove of the cover 1B. Note that when cutting the large wiring substrate, the molding resin 4 and the double-sided tape at the same time, it is necessary to rotate the cutting blade from the front surface of the double-sided tape to the direction toward the back surface of the large wiring substrate. This can remove from the dicing blade the adhesive bonded to the blade when cutting the double-sided tape when dicing the molding resin 4 and the large wiring substrate, which makes it possible to prevent damage caused by the stickiness of the adhesive on the dicing blade. Deterioration in cutting operations.

Next, the system configuration of the multifunction memory card 1 according to this embodiment will be explained. The multifunction memory card 1 according to this embodiment has, for example, six semiconductor chips (3C, 3M, 3F) on the first surface of the wiring substrate 2 constituting a part of the card body 1A. Among the six semiconductor chips (3C, 3M, 3F), one semiconductor chip 3C constitutes an interface controller, and one semiconductor chip 3M constitutes an IC card microcomputer as a security controller. The remaining four semiconductor chips 3F constitute a memory. Four semiconductor chips 3F constituting the memory are layered on the wiring substrate 2 and bonded to each other by an adhesive. The semiconductor chip 3C constituting the interface controller and the semiconductor chip 3M constituting the IC card microcomputer have a smaller area than the semiconductor chip 3F constituting the memory so that they are arranged side by side on the uppermost semiconductor chip 3F, and are bonded to by an adhesive. The uppermost semiconductor chip 3F.

FIG. 4 is a block diagram showing a system example of the multifunction memory card 1 composed of the aforementioned three types of semiconductor chips (3C, 3F, 3M). The memory formed on the semiconductor chip 3F includes, for example, a flash memory which is an electrically erasable and writable nonvolatile memory. The memory cell of the flash memory includes, for example, a MISFET having a stacked gate structure with a floating gate or a MISFET having an ONO (oxide-nitride-oxide) gate insulating film and a selection transistor portion. A MISFET with a split-gate structure in the memory transistor part. The memory capacity of the flash memory formed on one semiconductor chip 3F is, for example, 4 Gbit. Therefore, the multifunction memory card 1 having four semiconductor chips 3F according to this embodiment has a large-capacity memory of 4Gbits x 4 = 2Gbytes (16Gbits).

The interface controller formed on the semiconductor chip 3C has a plurality of interface control methods in which it controls the operation of the external interface and the operation of the memory interface for the memory (semiconductor chip 3F) by a control method according to an instruction from the outside. The memory card interface mode is consistent with the interface specifications of various simple memory cards. For example, the interface controller realizes the function of the memory card controller through program control for supporting the memory card interface specification. Furthermore, after downloading from the network and adding a control program, that is, firmware, to the interface controller, it is possible to support a predetermined memory card interface specification. Further, after the execution of the predetermined program is prohibited through the license information obtained from the network, the predetermined memory card interface specification may be made unavailable.

The aforementioned interface controller has the function of identifying the interface control mode of the memory card interface according to the command received from the outside or sent to the outside through the external connection terminal 5 or the state of the bus, and the function of changing the bus width according to the identified memory card interface control mode. The function of data format conversion by the recognized memory card interface control method, the power on/reset function, the function of interface control through the IC card microcomputer formed on the semiconductor chip 3M, and the interface through the memory formed on the semiconductor chip 3F The function of control, the function of power voltage conversion, etc.

The IC card microcomputer formed on the semiconductor chip 3M as a security controller is connected to the interface controller formed on the semiconductor chip 3C and the dedicated external connection terminal 5 according to the signal state of the external connection terminal 5 or Security processing is performed from an operation command given from the interface controller (semiconductor chip 3C). The IC card microcomputer is provided with, for example, a function usable for electronic settlement services authorized by an evaluation/certification organization of ISO/IEC15408. Further, it is possible to make the IC card microcomputer work with the memory by using the memory card interface. This allows connection between, for example, an antenna of a cellular phone and an IC card microcomputer, thereby enabling a non-contact interface similar to a non-contact type IC card, so that the cellular phone can be used as a round-trip pass or a debit card. The antenna may be formed on the surface of the wiring substrate 2 or the cover 1B.

FIG. 5 shows an example of the functions of the external connection terminals 5 arranged at the back surface of the wiring substrate 2 constituting a part of the card body 1A. Each of the 20 external connection terminals 5 (No. 1 to No. 20) includes a dedicated terminal for each interface control mode and a common terminal shared by each interface control mode. DAT2, DAT0, DAT1, DAT4/D3, DAT5/D2, DAT6/SDIO/D0, and DAT7/D1 are data terminals, respectively. Further, CD/DAT3 is the card detection/data terminal, CMD is the command input/output terminal, Vcc is the power supply terminal, Vss is the ground terminal of the circuit, CLK/SCLK is the clock input terminal, I/O-ic is dedicated to the IC card The input/output terminals of the microcomputer, LA and LB are external antenna connectors, INS is a terminal for detecting insertion and extraction, BS is a bus state terminal, Vcc-ic is a power supply terminal dedicated to an IC card microcomputer and CLK -ic is a clock input terminal dedicated to the IC card microcomputer.

The aforementioned external connection terminal 5 includes copper (Cu) similar to the wiring formed on the wiring substrate 2, and its surface is plated with nickel (Ni) and gold (Au). As shown in FIG. 1 , each of the two external connection terminals 5 constituting a power supply terminal (Vcc) and a ground terminal (Vss) is longer in length than the other external connection terminals 5 . This is a configuration in which, when the multifunction memory card 1 is mounted in a slot of a cellular phone, it enables the power terminal (Vcc) and the ground terminal (Vss) to be quickly connected to the connector terminals included in the slot. contacts to supply power before various signals are supplied to the semiconductor chips ( 3C, 3F, 3M) through other external connection terminals 5 . Failure of the semiconductor chips (3C, 3F, 3M) is thereby prevented.

Explained later are the structural features of the multifunction memory card 1 according to this embodiment As described above, the multifunction memory card 1 in this embodiment has a structure including semiconductor chips (3C, 3F, 3M) of the wiring substrate 2 and the card body 1A of the molding resin 4 encapsulating these semiconductor chips (3C, 3F, 3M) are covered with a cover 1B made of thermoplastic resin, wherein only the external connection terminals 5 are formed thereon The back surface of the card body 1A is exposed outside.

As described above, in order to reduce the difference in coefficient of thermal expansion between the semiconductor chips (3C, 3F, 3M) and the molding resin 4, the molding resin 4 used as a material for encapsulating the semiconductor chips (3C, 3F, 3M) includes a large amount of filler such as Quartz filling. The resin cast product with a large amount of inorganic filler mixed therein has increased frictional resistance with connector terminals and has high hardness compared to a resin cast product without filler or a cast product including a small amount of filler. Therefore, when it rubs against the connector terminals, there arises a problem of causing great damage to the connector terminals. In view of this, the multifunctional memory card 1 of this embodiment has a structure in which the card body 1A is covered with a cover 1B made of a thermoplastic resin whose hardness is lower than that of the molding resin 4, and does not include a filler or has less Due to the filler capacity of the molding resin 4, the molding resin 4 made of thermosetting resin, having increased frictional resistance and having high hardness is not exposed to the leading edge of the card. This can create a structure in which when the multifunction memory card 1 is inserted into the slot of the cellular phone, the terminals of the connector included in the slot do not come into contact with the molding resin 4 . Specifically, the terminals of the connector contact the leading edge of the cover 1B made of soft thermoplastic resin to be displaced, and then, contact the external connection terminals 5, thereby there is no chance of causing damage caused by when they contact the hard molding resin 4. damage or wear. Therefore, connection reliability between the connector terminal and the external connection terminal 5 can be maintained for a long time. Note that a film made of soft thermoplastic resin may be covered on the surface portion of the cover 1B that contacts the connector terminals as a countermeasure against damage or abrasion on the connector terminals caused by contacting the multi-function memory card 1 . In this case, the cover 1B may be molded from a thermosetting resin.

Explained next is a erroneous insertion prevention mechanism when the multifunction memory card 1 according to this embodiment is installed into a slot of a cellular phone.

When a memory card is installed in the memory card slot of a cellular phone or a digital camera, for example, users may make a mistake in the orientation of the card (front or The memory card is inserted in the wrong direction. If the memory card inserted in the wrong direction is partially inserted into the slot, the user feels sure that the card is inserted in the correct direction, so that the user further inserts the memory card to the bottom. Consequently, the connector terminals in the slots become bent, or the external connection terminals of the card and the connector terminals not corresponding to the external connection terminals mistakenly contact each other, thus leaving a disadvantage of deteriorating or damaging the circuits in the semiconductor chip. The multifunction memory card 1 according to this embodiment has smaller external dimensions than conventional memory cards, so that the aforementioned erroneous insertion is prone to occur. Taking this into consideration, the multifunction memory card 1 of this embodiment has a mechanism capable of positively preventing erroneous insertion as described below.

As described above, the multifunction memory card 1 of this embodiment is provided with the protruding portion 1C on one side of the cover 1B so that only the portion provided with the protruding portion 1C is thicker than the other portions. Further, since this protruding portion 1C is provided only on the cover surface of the cover 1B, the front surface of the multi-function memory card 1 is flatter than the back surface.

When the multifunction memory card 1 is inserted into the slot of the cellular phone, the direction of front or rear and the direction of front or back can be correctly judged by confirming the indentation/protrusion on the surface with fingers. Further, the height of the opening portion of the connector included in the slot is made smaller than the thickness of the cover 1B provided with the protruding portion 1C, whereby there is no possibility that the memory card inserted in the wrong direction partially enters the slot. chance, because even though the user may have made a mistake in the orientation of the card and they tried to insert the memory card in the wrong orientation, the protrusion 1C cannot be inserted into the connector.

The protruding portion 1C provided on the cover 1B is used not only to prevent erroneous insertion as described above, but also to pull out the multi-function memory card 1 from the slot. Specifically, the multi-function memory card 1 has very small dimensions in length and width, and also has a very thin thickness, so that it is very difficult to quickly pull out the multi-function memory card 1 from the slot. However, providing a part of the cover 1B with the protruding portion 1C thicker than the other portion allows the protruding portion 1C to be exposed to the outside of the connector even when the multi-function memory card 1 is installed in the slot, whereby it can be pinched by fingers. Pull out the protruding part 1C to quickly pull out the multi-function memory card 1 from the slot. In this case, providing elongated slots 9 on the front surface of the multi-function memory card 1 relative to the position of the protruding portion 1C as shown in FIGS. 2 and 3 further facilitates extraction from the slot. Also, the sectional shape of the protruding portion 1C located at the corner portion on the terminal side is processed to be rounded or beveled. When the size of the rounded portion or the beveled portion of the protruding portion 1C located at the corner portion is made smaller, the card pulling operation becomes easier. For example, preferably, the radius of curvature or the size of the sectional shape of the protruding portion 1C at the corner portion on the terminal side is made larger than the radius of curvature or the size of the sectional shape of the leading edge of the card.

Although the protruding portion 1C may be formed on the front surface (labeled surface) of the cover 1B, if it is formed on the back surface (the surface exposing the external connection terminals 5), the multifunction memory card 1 is more easily made into a thin size. In the case where the protruding portion 1C is formed on the front surface of the cover 1B, for example, the maximum thickness of the multifunction memory card 1 becomes the thickness (1.6 mm) of the cover 1B at the portion where the protruding portion 1C is provided and the thickness of the cover 1B at the portion where the protruding portion 1C is provided. The sum of the thicknesses of the exposed external connection terminals 5 at the back surface of the On the other hand, when the protruding portion 1C is formed on the back surface of the cover 1B, the maximum thickness of the multifunction memory card 1 is determined only by the thickness of the cover 1B at the portion where the protruding portion 1C is formed. Specifically, the maximum thickness of the multi-function memory card 1 is equal to the thickness (1.6 mm) of the cover 1B at the portion where the protruding portion 1C is formed.

Further, when the protruding portion 1C is formed at the back surface of the cover 1B, as shown in FIG. generated between 5 and terminal 11. Therefore, deterioration of the terminal 11 can be prevented, so that reliability of connection between the external connection terminal 5 and the terminal 11 can be ensured over a long period of time. On the other hand, assume that the protruding portion 1C is formed at the front surface of the cover 1B. In the case of limited design size, it is very difficult to ensure the distance that the terminal 11 can translate between the external connection terminal 5 and the terminal 11 when the multi-function memory card 1 is inserted into the slot of the cellular phone. Therefore, it is necessary to increase the height of the connector 10 as shown in FIG. 7 to form this space, so that the size of the connector 11 becomes large. Even when the multifunction memory card 1 of this embodiment is connected to a conversion adapter that needs to be inserted into a connector designed for a memory card slot of another standard, for the same reason, the size of the conversion adapter can be adjusted by The back surface of the cover 1B is made small by forming the protruding portion 1C.

As shown in FIG. 8 and FIG. 2, step guide grooves 12 are formed on both side surfaces (both side surfaces on the long side) of the cover 1B in the multifunction memory card 1 of this embodiment. Each guide groove 12 is formed along a side surface of the front surface of the cover 1B, and has a width and a height of 0.55 mm, respectively. Guide grooves 12 are provided on both side surfaces of the front surface of the cover 1B so that the width of the front surface of the cover 1B is narrower than the width of the back surface by 0.55 mm x 2 = 1.1 mm. The guide groove 12 is provided to prevent the multifunction memory card 1 from being inserted upside down when it is inserted into the slot of the cellular phone.

As shown in FIG. 9, the top plate 13 of the connector 10 into which the multifunction memory card 1 is inserted is provided with a cutout 14 having a width larger than that of the front surface of the cover 1B and smaller than that of the back surface of the cover 1B. The cutout 14 is provided on the top plate 13 of the connector 10, whereby even if the user tries to insert the multifunction memory card 1 upside down into the connector 10, the back surface of the cover 1B having a wider width cannot enter into it. In the notch 14, it is possible to surely prevent wrong insertion.

Further, when the multifunction memory card 1 is inserted into the connector 10 provided with the above-mentioned cutout 14 on the top plate 13 , the top surface of the multifunction memory card 1 is equal to the top plate 13 in height. On the other hand, when the multi-function memory card 1 is inserted into another connector whose top plate is not provided with a cutout, the multi-function memory card 1 cannot be inserted into this connector unless the thickness of the multi-function memory card 1 is made smaller than that of the connector. The thickness of the top plate 13 is smaller, assuming that the height of the connector is equal to the connector 10 . Specifically, when the multi-function memory card 1 is inserted into a connector whose top plate 13 is provided with the cutout 14, the thickness of the cover 1B can be made larger than the thickness of the top plate 13, so that the card body accommodated in the cover 1B The thickness of 1A can be greater than the thickness of the top plate 13 . This makes it possible to increase the number of laminations of semiconductor chips mounted on the wiring substrate 2, whereby the large capacity and multifunctionalization of the multifunctional memory card 1 can be promoted. When the thickness of the top plate 13 is set to 0.15 mm to 0.2 mm, for example, a space in which a semiconductor chip having a thickness of about 70 μm to 80 μm can be layered can be secured.

Guide grooves 12 on both side surfaces of the cover 1B may be formed on the back surface of the cover 1B. However, forming the guide groove 12 on the front surface is advantageous in securing a range in which the wiring substrate 2 can be accommodated, and thus, in obtaining a large capacity and multiple functions of the multifunctional memory card 1 . Specifically, when the guide groove 12 is formed on the front surface of the cover 1B as shown in FIG. 10, the width of the card body 1A accommodated on the back surface of the cover 1B is not limited by the guide groove. On the other hand, when the guide groove 12 is formed on the back surface of the cover 1B as shown in FIG. The area of a semiconductor chip on a wiring substrate is limited.

As shown in FIGS. 12 and 13, the multifunction memory card 1 of this embodiment has corner portions on both sides of one side, that is, the leading edge when inserted into a slot of a cellular phone, which is processed into a circle. shape. This rounding process is provided not only at the corner portion on the back surface of the cover 1B but also at the corner portion on the front surface of the cover 1B where the guide groove 11 is formed. For example, the radius of curvature (R ₁ ) at the back surface of the cover 1B is 1.5 mm, and the radius of curvature (R ₂ ) at the front surface having the guide groove 11 formed thereon is 1.0 mm.

On the other hand, the rounding process whose curvature radius is larger as described above is not provided at the corner portions on both sides of the side that is the rear edge when the multifunction memory card 1 is inserted into the slot. Therefore, there is a large difference in shape between the leading edge and the rear edge of the cover 1B, whereby the position of the leading edge can be easily recognized at a glance when the multifunction memory card 1 is inserted into the slot. Further, the rounded-shaped corner portion with a large radius of curvature provides easy turning when it comes into contact with the inner wall of the connector. Therefore, smooth insertion can be obtained even if the insertion angle is shifted to one side. In order to surely obtain the aforementioned effect, it is necessary to set the curvature radius (R ₁ , R ₂ ) to be at least larger than the width (W=0.55mm) of the guide groove 12 .

As shown in FIG. 14, beveling processing is provided at one side of the cover 1B that is a leading edge when the multifunction memory card 1 is inserted into the slot of the cellular phone, whereby the sectional shape of the leading edge is formed into a tapered shape. . This allows smooth insertion even if the insertion angle is shifted in the vertical direction when the multifunction memory card 1 is inserted into the slot.

Although the above-mentioned beveling treatment can be provided at one side of the front surface of the cover 1B or at one side of the rear surface, a good effect can be obtained by providing the beveling treatment on both surfaces. Further, as the beveling size (C ₁ ) becomes larger, better effects can be obtained. Therefore, for example, it is necessary to set the chamfering dimension (C ₁ ) larger than the chamfering dimension (C ₂ ) of the protruding portion _1C formed on the rear edge of the cover 1B. As shown in Figure 15, rounding instead of beveling may be provided on the leading edge. Also in this case, when the radius of curvature is set large, insertion becomes easy.

As disclosed in FIG. 14 or FIG. 15, both the card extraction operation and the card insertion operation can be facilitated by the cross-sectional shape of the leading edge of the card having a corner that is smaller than that on the terminal side of the protruding portion 1C. The section shape of the part has a larger slope or a larger radius of curvature.

As shown in FIGS. 16 and 17, the multifunction memory card 1 in this embodiment is provided with notched grooves 15 on both side surfaces (both side surfaces on the long side) of the cover 1B. Each notch groove 15 is a semi-elliptical or rectangular groove extending from the front surface to the back surface of the cover 1B, one end of which ends at the surface of the guide groove 12 . The notch groove may be formed on only one side of the cover.

As described above, the external connection terminals 5 are arranged in two rows on the back surface of the multifunction memory card 1 . Therefore, when the terminal 11 of the connector 10 that should be connected to the external connection terminal 5 that is positioned at the rear row is inserted into or pulls out the process of the connector 10 with the multifunction memory card 1, it is mistakenly connected with the external connection terminal 5 that is positioned at the front row. When contacted, an inappropriate signal is input to the circuit of the semiconductor chip (3C, 3F, 3M), resulting in an error. In extreme cases, the circuit may be damaged.

The multifunction memory card 1 according to this embodiment includes a cover 1B whose surface is made of resin so that static electricity is easily generated. Therefore, when the multifunction memory card 1 is inserted into the connector 10, there is a concern that static electricity on the cover 1B may enter the semiconductor chip (3C, 3F, 3M) through the terminal 11 of the connector 10. In consideration of this factor, the lengths of the two external connection terminals 5 constituting the power supply terminal (Vcc) and the ground terminal (Vss) are made longer than the lengths of the other external connection terminals 5 as described above in order to supply the semiconductor as quickly as possible. The chips (3C, 3F, 3M) are powered, thereby transferring charges flowing into the semiconductor chips (3C, 3F, 3M) through other external connection terminals 5 to the power supply terminal (Vcc) or the ground terminal (Vss). However, if static electricity enters the semiconductor chip (3C, 3F, 3M) before power is supplied to the semiconductor chip (3C, 3F, 3M) due to wrong contact with the terminal 11 that does not correspond to the external connection terminal 5, then every The ESD protection element provided on each semiconductor chip (3C, 3F, 3M) does not function sufficiently so that it cannot eliminate the ESD charge, thereby damaging the circuit. Further, if an erroneous contact with a terminal 11 not corresponding to the external connection terminal 5 occurs when the multifunction memory card 1 is pulled out with the power of the cellular phone turned on, an inappropriate signal is supplied to the semiconductor chip (3C, 3F , 3M), causing failures such as write errors.

The notch grooves 15 that are provided on both side surfaces of the cover 1B are for preventing errors with the terminals 11 that do not correspond to the external connection terminals 5 when the multifunction memory card 1 is inserted into or pulled out of the slot of the cellular phone. touch.

As shown in FIG. 18 , among the plurality of terminals 11 formed in the connector 10 into which the multifunction memory card 1 is inserted, the terminals 11 that should be connected to the external connection terminals 5 located in the rear row are passed through the terminals 11 mounted to one end portion thereof. The cam 16 controls whether or not to make contact with the external connection terminal 5 . As shown in Figure 18 (a), when the multi-function memory card 1 is inserted into the connector 10, the tip of the cam 16 comes into contact with the guide groove 12 of the cover 1B to be pressed down, and due to this downward movement , the terminal 11 that should be connected to the external connection terminal 5 located in the rear row is pressed down. The cam 16 is urged upward by an unillustrated spring provided on a part thereof, but its upward movement is limited during when its tip comes into contact with the guide groove 12 . Therefore, when the external connection terminals 5 located in the front row pass above these terminals 11, the tip of the cam 16 is brought into contact with the guide groove 12, and thus the external connection terminals 5 located in the previous row passing above these terminals 11 The connecting terminals do not come into contact with terminal 11 because they are pressed down. Next, as shown in FIG. 18 (b), when the leading edge of the multi-function memory card 1 is fully inserted into the connector 10, the external connection terminal 5 located in the front row reaches the position of the connector 10 that should be connected thereto, and The external connection terminals 5 located in the rear row reach a position above the terminals 11 to which they should be connected. In this case, the notched groove 15 formed on the side surface of the cover 1B reaches the position of the tip of the cam 16 , whereby the tip of the cam 16 does not come into contact with the guide groove 12 . By this, the cam 16 whose upward movement is restricted by the guide groove 12 is raised upward by the spring pressure, thereby bringing the terminal 11 raised upward together with the movement of the cam 16 into contact with the external connection terminal 5 located in the rear row.

On the other hand, when the multi-function memory card 1 inserted into the connector 10 is pulled out, the tip of the cam 16 inserted into the notch groove 15 is first pressed down by contact with the guide groove 12, and then With this movement, the terminals 11 that are in contact with the external connection terminals 5 located in the rear row are pressed down so as not to come into contact with the external connection terminals 5 . Therefore, similar to the case of insertion, erroneous contact with the terminal 11 that does not correspond to the external connection terminal 5 can be surely prevented.

Note that the aforementioned notch groove 15 may be formed on only one side surface at only one place, but the movement of the cam 16 can be controlled with high precision by providing the notch groove 15 at both side surfaces of the cover 1B.

Therefore, the multifunctional memory card 1 constructed as described above has the advantages of a relatively simple manufacturing process and high productivity. Specifically, the card body 1A can be mass-produced by a simple process in which semiconductor chips (3C, 3F, 3M) are mounted on the above-mentioned large wiring substrate to perform wiring bonding, and the semiconductor chips (3C, 3F, 3M) are molded with resin 4 After encapsulation, cut the large wiring substrate. Therefore, the productivity is very high. Further, the above-mentioned protruding portion 1C, guide groove 12, notched groove 15, or rounding or bevelling can be simply realized by molding the cap 1B made of thermoplastic resin. The operation for accommodating the card body 1A into the cover 1B is very simple because the two are merely engaged.

On the other hand, if additional processing is performed on the card body 1A obtained from a large wiring substrate to form the protruding portion 1C, the guide groove 12, or the notch groove 15, or the rounding process and the beveling process are performed on the card body 1A, manufacturing Processes become more complex, reducing productivity. On the other hand, the protruding portion 1C, the guide groove 12, or the notch groove 15 are formed therein, or the rounding process or the beveling process is performed by using a mold for encapsulating a semiconductor chip mounted on a wiring substrate with a cast film resin. In the case of , the production process becomes very simple. However, the hard molding resin made of thermoplastic resin is exposed to the outside, so that problems of shortened service life of the connector or deterioration of connection reliability with the connector cannot be avoided.

Example 2

19 and 20 are plan views showing the appearance of the multifunction memory card according to this embodiment, wherein FIG. 19 shows the surface (back surface) in which external connection terminals are formed, and FIG. 20 shows the opposite surface (front surface).

In the multifunction memory card 1 according to this embodiment, the notched grooves 15 formed on both side surfaces of the cover 1B are arranged in the vicinity of the external connection terminals 5 located in the rear row. Specifically, the two notch grooves 15 are positioned so as to be translated towards the rear edge compared to Embodiment 1, and further, they are arranged so as to be equidistant from the rear edge of the cover 1B.

As described above, the notch groove 15 is provided for preventing erroneous contact with the terminal 11 not corresponding to the external connection terminal 5 when the multifunction memory card 1 is inserted into or pulled out of the slot of the cellular phone. Preventing erroneous contact with terminals can prevent malfunctions such as writing errors, and can also prevent short-circuiting or damage of the drive circuit of the input/output interface.

When the notch groove 15 is arranged near the rear edge of the cover 1B, the arm length of the cam 16 that controls whether to contact the terminal 11 provided in the connector 10 where the multi-function memory card 1 is inserted can be as shown in FIG. 21 It is shorter than that in Embodiment 1 (see Figure 18). This realizes a compactly designed cam mechanism in the connector 10 , thereby enabling miniaturization of the connector 10 . Further, the back surface of the multifunction memory card 1 is hardly inclined relative to the surface having the terminals on which the connector 10 is formed, because the two notch grooves 15 are arranged to be equidistant from the rear edge of the cover 1B. Therefore, the external connection terminals 5 located in the rear row and the terminals 11 of the connector 10 can come into uniform contact with each other. More preferably, the notch grooves 15 are arranged at a position closer to the rear edge relative to the external connection terminals 5 located in the front row and closer to the external connection terminals 5 located in the rear row than the external connection terminals 5 located in the front row .

Further, the multifunction memory card 1 according to this embodiment is provided with a non-slip groove 17 having almost the same shape as the notched groove 15 on one side surface of the cover 1B. This anti-slip groove 17 is arranged close to the leading edge of the cover 1B relative to the notch groove 15 .

22 to 24 are plan views each showing a state in which the multi-function memory card 1 is inserted into the connector 10. As shown in FIG. Note that the top plate 13 of the connector 10 is not shown in FIGS. 22 and 23 .

Anti-slip claws 18 are provided on one side surface of the connector 10 . As shown in FIG. 23 , when the leading edge of the multi-function memory card 1 is inserted into one end of the connector 10 , the tip of the anti-slip claw 18 is inserted into the anti-slip groove 17 . Providing the above-mentioned anti-slip mechanism can prevent the multi-function memory card 1 from easily slipping out of the connector 10 .

Similar to the multifunction memory card 1 in Embodiment 1, the multifunction memory card 1 according to this embodiment is provided with a Grading guide groove 12. The notch groove 15 and the anti-slip groove 17 are formed by cutting out a part of the guide groove 12 . By adopting this structure, there is no chance that the cam 16 in the notch groove 15 or the anti-skid claw 18 in the anti-skid groove 17 protrudes above the guide groove 12 . Therefore, when the multifunction memory card 1 is inserted into the connector 10, the back surface of the cover 1B and the top surface of the top plate 13 are equal in height (see FIG. 9). A guide groove 12 is provided on the back surface of the cover 1B, and a notch groove 15 and an anti-skid groove 17 are formed on a part of the guide groove 12, so that the thickness of the connector 10 can be reduced.

Further, almost all surfaces of the guide groove 12 are covered by the top plate 13 . Because the guide groove 12 is formed continuously from the leading edge to the vicinity of the rear edge of the cover 1B, so when the multifunction memory card 1 is installed in the connector 10, the two sides of the multifunction memory card 1 as shown in FIG. The side surfaces are almost completely covered by the top plate. Therefore, even when the notch groove 15 and the anti-skid groove 17 are formed on the guide groove 12 and the cutout 14 is formed on the top plate 13 for the back surface of the cover 1B and the top surface of the top plate 13 to have the same height, the The area of the multifunction memory card 1 is easily determined by the top plate 13, whereby the multifunction memory card 1 can be mounted to the connector 10 with certainty. More preferably, the guide groove 12 extends longer toward the rear edge than the external connection terminals 5 located in the rear row. Because the guide groove 12 extends longer toward the rear edge than the external connection terminals 5 located in the rear row, the top plate 13 covering the guide groove 12 fixes the position of the external connection terminals 5 located in the rear row, thereby The connection with the connector 10 can be fixed.

Explained next is a method for connecting the card body 1A to the cover 1B of the multi-function memory card 1 .

The first method is that, as shown in FIG. 25 , an adhesive 20 is applied to the back surface of the cover 1B in advance, and the card body 1A is inserted into the cover 1B as shown in FIG. 26 . In this case, an adhesive 20 can be applied to the card body 1A. However, after the card body 1A is installed in the cover 1B, this method requires a measure for fixing the card body 1A using any method to prevent the card body 1A from coming off from the cover 1B until the adhesive 20 hardens. Therefore, this method consumes much time to attach the card body 1A to the cover 1B.

Taking this into consideration, as shown in FIG. 27, resin projections 21 are formed in advance around the groove of the cover 1B made of thermoplastic resin, in which the card body 1A is pushed into the cover by using the elastic deformation of the projections 21 as shown in FIG. 1B slot. This allows the card body 1A to be held by the protrusion 21 without requiring measures for preventing the card body 1A from coming off from the cover 1B until the adhesive 20 is hardened. The protrusion 21 may be resin molded integrally with the cover 1B.

Further, as shown in FIGS. 29 and 30 , for example, a caulking method may be employed in which after the card body 1A is inserted into the cover 1B by a general method, the cover 1B is softened and deformed by using a jig 22 with an ultrasonic generating mechanism. around the groove so that the card body 1A is inserted into the cover 1B. It should be noted that the process for applying the adhesive 20 can be omitted in the case of employing the methods shown in FIGS. 27 to 30 .

Example 3

Fig. 31 is a plan view of the multifunctional memory card according to this embodiment, wherein in order to provide interchangeability to different types of memory cards having different standards, the arrangement of the external connection terminals 5 is changed, and Fig. 32 and Fig. 33 are the multifunctional memory cards of the multifunctional memory card. A plan view of the adapter into which the functional memory card is inserted, wherein FIG. 32 shows the front surface side and FIG. 33 shows the back surface side (surface on which external connection terminals are formed).

The adapter 30 shown in FIGS. 32 and 33 has the same external dimensions and external connection terminals 31 as those of memory cards called "Memory Stick Duo" produced by Sony Corporation (hereinafter simply referred to as Memory Stick) to provide Interchangeability with this memory stick. The memory stick has 10 external connection terminals, so that the adapter 30 also has 10 external connection terminals 31 (#1 to #10). In the multifunction memory card 1 according to this embodiment used to be inserted into this adapter 30, only 10 external connection terminals 5 (#1 to #10) on the leading side are used when inserted into the adapter 30, and The 10 external connection terminals 5 at the rear edge are not used. The ten external connection terminals 5 at the rear edge can be used as extension terminals of the memory stick, or as terminals for functions other than the memory stick.

The adapter 30 is made of a resin composition having a rectangular planar shape. A cutout 32 is formed on one of the four corner portions. The adapter 30 is inserted into the card slot of the cellular phone by turning the short side provided with the cutout 32 towards the leading edge.

The adapter 30 includes therein a connector 33 into which the multifunction memory card 1 is inserted. As shown in FIG. 32 , a cutout 34 for the connector 33 is formed on the front surface of the adapter 30 at which the labeled surface of the multifunction memory card 1 inserted into the connector 33 is exposed.

The connector 33 has a structure similar to the connector 10 in Embodiment 1 and Embodiment 2, except that the number of terminals 35 is ten. In order for the surface with the label of the multifunction memory card 1 to become equal in height to the front surface of the adapter 30, its size is reduced.

When the multi-function memory card 1 is inserted into the adapter 30, the direction of the multi-function memory card 1 is determined so that the 10 external connection terminals 5 of the multi-function memory card 1 do not pass through the 10 external connection terminals 5 as shown in Figure 34. The wiring 36 connecting the terminal 5 and the corresponding ten external connection terminals 31 at the adapter 30 .

Because the opening portion for the connector 33 is arranged at the long side (the side parallel to the insertion direction) of its adapter 30, there is no possibility that the multi-function memory card 1 is inserted from the card slot of the cellular phone when the multi-function memory card 1 is inserted into the card slot. Opportunity to expose multifunction memory card 1. Therefore, there is no chance that the multifunction memory card 1 is mistakenly pulled out from the adapter 30 or that the multifunction memory card 1 falls out of the adapter 30 .

When the opening portion for the connector 33 is arranged at the short side at the rear edge of the adapter 30 as shown in FIG. Possibility to pull out from the adapter 30. In this case, in order to overcome the disadvantage that the multi-function memory card 1 falls out of the adapter 30 , the anti-slip pawl 18 explained in Embodiment 2 may be provided at the connector 33 of the adapter 30 .

In order to prevent the situation that the power supply is cut off suddenly in the process of using the cellular phone, as shown in FIG. IC circuit (protection chip 37) and capacitor for emergency power supply. According to this, when the battery of the cellular phone is removed or the adapter 30 is pulled out from the card slot of the cellular phone by mistake, a signal to report that the power is turned off or a command for starting forced termination is provided from the protection chip 37 to the multiplexer. function of the semiconductor chip in the memory card 1, and can provide emergency power (Vcc, Vss) through the protection chip 37, thereby being able to prevent failure of the semiconductor chip.

The invention achieved by the inventors has been specifically explained above based on the embodiments, but the present invention is not limited to the above-described embodiments, and various modifications can of course be made without departing from the spirit and scope of the invention.

Although the above-described embodiments describe a multifunctional memory card having a memory card function and an IC card function, the card is not limited to a card having these functions. For example, the present invention can be applied to cards having various functions such as a card having only a memory card function, a card having only an IC card function, a card including a semiconductor chip other than a memory card function or an IC card function, and the like. Various modifications in the kind, number and combination of semiconductor chips mounted on the wiring substrate are possible according to the function of the card. For example, for a card that only has the function of a memory card, its system can operate through one or more memory interfaces with electrically erasable and writable non-volatile memories formed thereon and for controlling memory chips. The memory chip of the interface controller chip is configured. Further, various modifications can also be made in the number of external connection terminals 5 . For example, when the required number of external connection terminals 5 is small, all the external connection terminals 5 may be formed in one row.

According to the memory card of the present invention, different functions can be realized by changing the type or combination of semiconductor chips mounted on the wiring substrate of the card body, so that it can be widely used not only in multi-function memory cards, but also in Other multi-function cards, communication cards, I/O cards, etc.

Claims (23)

1. a storage card comprises:

Sheet card body wherein is installed in and has its top and form the semi-conductor chip of another surface of wiring substrate on a surface of a plurality of external connection terminals with resin-encapsulated; And

The sheet cover has formed above one surface, as to be used to hold described card body groove,

Wherein said card body is contained in the described groove of described cover, so that expose a surface of described wiring substrate, and

The outstanding outshot in a wherein said surface is formed on when plug-in card the side as the described cover of trailing edge.

2. according to the storage card of claim 1,

Wherein said semi-conductor chip comprises having first semi-conductor chip that forms electric erasable and writeable nonvolatile memory therein and have second semi-conductor chip that is formed for therein controlling for the memory interface interface operable controller of described nonvolatile memory, and

Wherein described second semi-conductor chip and described first semi-conductor chip are carried out lamination with on another surface that is installed in described wiring substrate.

3. according to the storage card of claim 2, wherein said semi-conductor chip further comprises the 3rd semi-conductor chip, and the 3rd semi-conductor chip has the IC-card microcomputer that the conduct that forms therein is used for carrying out according to the operational order that provides from described interface controller the safety governor of safe handling.

4. according to the storage card of claim 1, wherein said cover is formed by resin, and this resin is littler than the frictional resistance of the resin of the described semi-conductor chip of encapsulation with the frictional resistance of bonder terminal.

5. according to the storage card of claim 4, wherein said cover is formed by thermoplastic resin, and the resin that encapsulates described a plurality of semi-conductor chips is formed by thermosetting resin.

6. according to the storage card of claim 1, the described a plurality of external connection terminals that wherein are formed on described wiring substrate top comprise the first terminal group of arranging along perpendicular to card insertion direction, and along arranging and be arranged in before the described the first terminal group perpendicular to card insertion direction or afterwards second terminal group.

7. according to the storage card of claim 1,

The leading edge of the described cover of the leading edge in the time of wherein will be as plug-in card forms has sphering section shape or inclined-plane section shape.

The corner part that wherein will be formed on the described outshot of a surface of described cover forms has sphering section shape or inclined-plane section shape, and

Wherein than the corner part of described outshot, the described leading edge of described cover is processed into bigger rounded form or inclined-plane shape.

8. according to the storage card of claim 7,

Wherein the classification guide channel is formed on the limit part of described cover, makes that the width on a surface is different with another surperficial width, and

It is bigger than another surperficial width that the described classification guide channel that wherein is formed on the limit part of described cover is formed the width that makes a surface.

9. according to the storage card of claim 1, the radius-of-curvature that wherein is positioned at described cover two corner part offices on one side is bigger than the radius-of-curvature as two corner part offices of the another side of described trailing edge when card inserts.

10. storage card according to Claim 8, the radius-of-curvature that wherein is positioned at described cover two corner part offices on one side is bigger than the width of the described guide channel of two limit parts that are formed on described cover.

11. according to the storage card of claim 10,

Wherein the classification guide channel is formed on the part place, two limits of described cover, so that the width on a surface is different with another surperficial width, and

Two corner parts that provide sphering to handle are provided an end of described each guide channel that wherein is formed on the part place, two limits of described cover, and the radius-of-curvature of an end of described each guide channel is bigger than the width of the described guide channel that is positioned at part place, two limits.

12. according to the storage card of claim 10, one side wherein along providing the inclined-plane processing as the described cover of described leading edge when the plug-in card.

13., wherein on two surfaces of described cover, provide the processing of described inclined-plane according to the storage card of claim 12.

14. according to the storage card of claim 12,

Wherein the described outshot at described cover provides the inclined-plane processing, and inclined-plane length is bigger than the inclined-plane length of the inclined-plane processing that provides in described teat office in the inclined-plane processing that described cover provides on one side.

15. storage card according to Claim 8, wherein the recess groove is formed on the part of described guide channel of two limit parts of described cover.

16. according to the storage card of claim 1, one side wherein handle along the sphering that provides when the plug-in card as the described cover of described leading edge.

17. according to the storage card of claim 15,

The described a plurality of external connection terminals that wherein are formed on described wiring substrate top comprise along the first terminal group of arranging perpendicular to card insertion direction with along arranging and be arranged in before the described the first terminal group perpendicular to card insertion direction or afterwards second terminal group, and

Distance between wherein said recess groove and described second terminal group is littler than the distance between described recess groove and the described the first terminal group.

18. according to the storage card of claim 17, wherein provide described recess groove, and described recess groove is to being arranged in the equidistant position of described trailing edge with described cover so that on one of them of two limit parts of described cover, form a recess groove.

19. storage card according to Claim 8 wherein is provided with anti-slip tank on a part that is formed on the described guide channel on two limit parts of described cover, to prevent from described connector landing.

20. according to the storage card of claim 1, wherein said card body is contained in the described groove of described cover by the ca(u)lk method.

21. according to the storage card of claim 1, further comprise adapter, this adapter comprises the external connection terminals that the described external connection terminals of connector that described storage card is installed on it and described card body is electrically connected.

22. according to the storage card of claim 21, the opening portion of wherein said connector is arranged in perpendicular to the side on the direction of described adapter direction of insertion.

23. according to the storage card of claim 21, wherein said adapter has built-in power supply unit with the described semi-conductor chip power supply in the described storage card that is installed to described connector.

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