CN1743495B - Organic matter vaporization plating device - Google Patents

Abstract

An organic matter evaporation device, which vapor-deposits organic matter in a state where the substrate is roughly vertically erected to form an organic thin film, is applicable to large substrates, and can form an organic thin film with a uniform thickness. The organic substance vapor deposition device of the present invention has: a cavity, which constitutes a housing and maintains the substrate at an angle of 70° to 110° relative to the ground; Consists of at least one organic matter storage location; an organic matter nozzle part, which sprays the organic matter vapor-deposited on the above-mentioned substrate; a connecting line, which connects the above-mentioned organic matter nozzle part and the organic matter storage part; a conveying device, which can make the above-mentioned organic matter storage part, organic matter At least the above-mentioned organic substance nozzle among the nozzle part and the connection line moves in the vertical direction.

Description

Organic vapor deposition device

technical field

The present invention relates to an organic material vapor deposition device for forming organic thin films such as organic semiconductor elements. Organic vapor deposition device for organic thin film with uniform thickness.

Background technique

In general, organic thin films of organic semiconductor devices including organic electroluminescent devices (OLED, Organic light Emitting Device) etc. are largely different in the method of evaporating low-molecular organic substances from vacuum to form organic thin films, And a method of dissolving a high molecular weight organic substance in a solvent, using spin coating, dip coating, micro-resist plating, inkjet printing, etc. to form an organic thin film.

When a thin film made of a low-molecular organic substance is produced under vacuum by the above-mentioned method, a shadow mask pattern (shadow mask pattern) having an opening of a shape to be formed is arranged in front of the substrate, and the film is evaporated on the substrate Organic substances, organic thin films are fabricated on the above-mentioned substrates.

As a method for producing an organic thin film composed of the above-mentioned low-molecular organic substance, there are methods using a point-type organic substance vapor deposition source, a method using a line-type organic substance vapor deposition source, and the like.

But, when using above-mentioned such point-type or line-type organic source thing evaporation source to form organic thin film on large-scale substrate, the distance between above-mentioned substrate and evaporation source increases simultaneously, the distance between above-mentioned substrate and evaporation source An increase in the distance causes a decrease in the uniformity of the organic thin film formed on the above-mentioned substrate.

In addition, when the distance between the above-mentioned substrate and the evaporation source increases, the organic matter evaporated from the above-mentioned evaporation source is evaporated in a vacuum chamber outside the above-mentioned substrate, so that the loss of the organic matter increases. Considering that the above-mentioned organic matter is expensive, Then, there is a problem that the manufacturing cost increases.

In addition, in order to ensure the uniformity of the organic thin film, the above-mentioned mask pattern and the evaporation source form a predetermined angle, and the organic thin film can be formed. At this time, when the mask pattern and the evaporation source form a predetermined angle, there is a problem that a shadow effect caused by the mask pattern occurs, and it is difficult to obtain an organic thin film having a desired shape.

When the evaporation source and the nozzle are integrated, there is a problem that deformation due to heat of the substrate and mask pattern may occur due to heat.

In addition, in the case of a large substrate, there is a problem that the uniformity of the thin film differs between the center portion and the edge portion of the substrate due to the sagging phenomenon of the substrate.

Conventional organic vapor deposition devices employ a method of moving the substrate in order to uniformly vapor-deposit organic matter, but there is a problem that the size of the chamber becomes very large when the substrate is moved.

In the case of the conventional organic substance vapor deposition apparatus, when the above-mentioned organic substance vapor deposition apparatus is used, organic substance particles enter the gaps between the components, and leakage of the organic substance occurs. If the heater is contaminated by leakage of such organic substances, there is a problem that the heater may be short-circuited.

When the heater is short-circuited and the heater is switched, since the heater is integrated with the organic substance vapor deposition source, switching is difficult, and switching operation takes a long time.

Contents of the invention

The present invention is developed to solve the above-mentioned problems of the prior art, and its purpose is to provide an organic substance evaporation device, which can vapor-deposit organic substances in a state where the substrate is erected approximately vertically to form an organic thin film, which can be applied to large-scale substrate, and can form an organic film of uniform thickness.

Another object of the present invention is to provide an organic substance evaporation device, which vapor-deposits organic substances in a state where the substrate is roughly vertically erected to form an organic thin film, which is applicable to large substrates and can form an organic thin film with a uniform thickness. Separation of the organic matter storage part and the organic matter nozzle minimizes deformation of the substrate and mask pattern.

Another object of the present invention is to provide an organic substance vapor deposition apparatus having a heater that can be separated independently and a nozzle unit integrated with a splash guard.

In order to achieve the above object, the organic matter vapor deposition device of the present invention has: a cavity, which constitutes a housing, and maintains the substrate at an angle of 70° to 110° relative to the ground; an organic matter vapor deposition source, which consists of an organic matter storage unit, an organic matter Consists of a guide path, a heater, an internal heat reflection plate, an external cooling plate, and an organic nozzle, and is used to vapor-deposit organic matter on the substrate to form an organic thin film; organic matter evaporation source conveying device, which can make the organic matter vapor-deposit The source moves vertically.

Ideally, the organic matter storage unit is divided into a plurality of units.

Preferably, the organic matter guide path is a movement path of organic matter particles evaporated from the organic matter storage unit.

Preferably, the organic matter guide path maintains the final moving direction of the organic matter particles at an angle of -20° to 20° with respect to the ground.

Preferably, the heater is provided outside the organic matter storage portion and the organic matter guide path, and heats the organic matter storage portion and the organic matter guide path.

Desirably, the internal heat reflective plate is located on the outside of the heater.

Ideally, the external cooling plate is located outside the internal heat reflecting plate to prevent the heat inside the organic matter evaporating part from being transferred to the outside, and the external cooling plate preferably uses a refrigerant to cool the external heat reflecting plate.

Preferably, the organic substance vapor deposition source further includes a measurement sensor positioned at a front end of the organic substance nozzle portion in an organic substance jetting direction to measure a vapor deposition rate and a vapor deposition thickness of the organic substance vapor-deposited on the substrate.

It is desirable to also have means for doping impurities in the organic matter.

In addition, the organic matter evaporation device of the present invention has: a cavity, which constitutes a housing, and maintains the substrate at an angle of 70° to 110° relative to the ground; a plurality of organic matter evaporation sources, which evaporate on the substrate. The coating material forms a thin film, formed in the evaporation material storage part, the evaporation material guide path, the heater for heating the evaporation material storage part and the evaporation material guide path, and formed in the evaporation material storage part and the evaporation material guide. An internal heat reflection plate for reflecting heat on the outside of the road, an external cooling plate provided outside the internal heat reflection plate and cooling the internal heat reflection plate, and an evaporation substance nozzle part; organic matter evaporation source conveying device , which can move the vapor deposition source in the vertical direction.

The plurality of evaporation sources contain mutually identical organic matter, and a uniform organic thin film can be formed on a substrate, especially a large substrate.

In addition, the plurality of evaporation sources are preferably composed of a first evaporation source and a second evaporation source, and more ideally, the first evaporation source is a raw material evaporation source for a thin film on a substrate, and the The second vapor deposition source is an impurity vapor deposition source for containing impurities in the thin film for improving the characteristics of the thin film.

Preferably, the spray angles of the multiple different organic matter evaporation sources can be adjusted.

In addition, the organic matter evaporation device of the present invention includes: a chamber that constitutes a housing and supports a substrate; at least one organic matter evaporation source that has an organic matter storage portion that stores organic matter and is partially opened, and a portion that is open to the organic matter storage portion A nozzle unit for spraying organic substances, a casing covering the organic substance storage unit, and a heater unit interposed between the organic substance storage unit and the casing are connected.

An organic substance vapor deposition source transport device capable of vertically moving the organic substance vapor deposition source may also be provided.

Preferably, at least one of the organic substance storage unit and the nozzle unit is made of graphite.

The nozzle unit includes: an organic substance nozzle that sprays organic substance particles onto the substrate; and a splash prevention film that prevents the organic substance in the organic substance storage unit from being splashed.

Preferably, the heater unit has a heating wire of a heat source and a heating wire support that prevents the heating wire from hanging down.

The organic matter evaporation source may also have an internal heat reflection plate installed on the inner wall of the housing.

The organic substance vapor deposition source may further include a heat blocking device attached to the substrate-direction outer surface of the nozzle portion.

The organic matter evaporation source can also have a cooling device arranged on the outer wall of the shell.

In addition, the organic substance vapor deposition device of the present invention includes: a chamber, which constitutes a housing and supports a substrate organic substance vapor deposition source, has an organic substance storage part that stores organic substances and is partially opened, and is connected to the opening part of the organic substance storage part to spray The nozzle part of the organic matter, the shell covering the form of the organic matter storage part, the heater part between the organic matter storage part and the shell; the organic matter vapor deposition source conveying device, which can make the organic matter vapor deposition source vertically direction to move.

Preferably, the heater unit has a heating wire of a heat source and a heating wire support for preventing the heating wire from hanging down, and is constituted by a structure covering a heater tunnel (heater tuble 1 ) in the form of the organic matter storage unit.

As described above, according to the present invention, it is possible to provide an organic substance vapor deposition apparatus that vapor-deposits organic substances in a state where the substrate is erected approximately vertically to form an organic thin film, which is applicable to a large substrate and can form a uniform thickness. The organic thin film separates the organic material storage part from the organic material nozzle, and minimizes the deformation of the substrate and mask pattern.

According to the present invention, there can be provided an organic substance vapor deposition device having an independently separable heater unit and a nozzle unit integrated with a splash guard.

As described above, the present invention has been described with reference to preferred embodiments, but those skilled in the art can make various modifications and changes to the present invention without departing from the spirit and scope of the present invention.

Description of drawings

FIG. 1 is a schematic diagram illustrating an organic vapor deposition device according to an embodiment of the present invention:

2a to 2b are schematic diagrams illustrating an organic substance vapor deposition device according to an embodiment of the present invention.

Fig. 3 is a schematic diagram for illustrating an organic vapor deposition device according to another embodiment of the present invention:

4 is a schematic diagram illustrating an organic vapor deposition device according to another embodiment of the present invention;

5a to 5b are diagrams illustrating an organic substance vapor deposition device according to another embodiment of the present invention;

Fig. 6 is a schematic view illustrating an organic vapor deposition device according to another embodiment of the present invention:

Fig. 7a is a longitudinal sectional view illustrating an organic matter vapor deposition source of an organic matter vapor deposition device according to another embodiment of the present invention;

Fig. 7b is a diagram of an organic matter storage unit, a nozzle unit and a heater unit limited to an organic matter evaporation device according to another embodiment of the present invention;

Fig. 7c is a schematic diagram of an enclosure limited to an organic matter evaporation device according to another embodiment of the present invention;

Fig. 7d is a diagram of a cooling device limited to an organic matter evaporation device according to another embodiment of the present invention.

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the drawings, the same reference symbols denote the same constituent elements.

FIG. 1 is a schematic diagram illustrating an organic substance vapor deposition apparatus according to one embodiment of the present invention.

Referring to Fig. 1, the organic matter evaporation device 100 of the embodiment of the present invention comprises: a chamber 110, which constitutes the casing of the above-mentioned organic matter evaporation device 100; an organic matter evaporation source 120, which is used for spraying Organic matter particles; an organic matter evaporation source conveying device 130, which can move the above-mentioned organic matter evaporation source 120 in a vertical direction.

The chamber 110 makes the substrate S to be vapor-deposited with organic substances approximately vertical, and ideally maintains an angle of 70° to 110° with the ground. In addition, it is preferable that the chamber 110 is a vacuum chamber.

The above-mentioned organic matter evaporation source 120 includes: an organic matter storage part 121, which receives the organic matter evaporated on the above-mentioned substrate 110; an organic matter nozzle part 122, which sprays the organic matter evaporated from the above-mentioned organic matter storage part 121 onto the above-mentioned substrate S; A connection line 123, which connects the above-mentioned organic substance storage part 121 and the organic substance nozzle part 122, and constitutes the moving path of the above-mentioned vapor-deposited organic substance; a measuring device 124, which measures the vapor-deposition rate and The thickness of the organic matter.

The organic substance vapor deposition source transport device 130 is configured to have a moving device capable of vertically moving at least the organic substance nozzle portion 122 in the organic substance vapor deposition source 120 . At this time, the above-mentioned organic matter evaporation source conveying device 130 is a vertical conveying device suitable for use in the above-mentioned chamber 110 maintained in vacuum, and it also has a conveying speed adjustment mechanism (not shown), which can adjust the above-mentioned organic matter evaporation source 120. The moving speed of at least the above-mentioned organic matter nozzle part 122.

Reference symbol M in the figure is a mask pattern for determining the shape of the organic substance vapor-deposited on the above-mentioned substrate S. As shown in FIG.

2a and 2b are schematic diagrams for explaining an organic substance vapor deposition device according to an embodiment of the present invention, and are views limited to a substrate and an organic substance vapor deposition source for vapor deposition of organic substances.

Referring to Fig. 2a and Fig. 2b, the organic substance evaporation source 120 of the organic substance evaporation device 110 according to one embodiment of the present invention includes: an organic substance storage part 121, which consists of at least one organic substance storage position 121a which receives the organic substance evaporated on the substrate S Composition; the organic matter nozzle part 122, which sprays the organic matter vapor-deposited on the substrate S; the connection line 123, which connects the above-mentioned organic matter nozzle part 122 and the organic matter storage part 121; The evaporation rate of the organic matter and the thickness of the organic matter.

The organic substance storage unit 121 is composed of at least one organic substance storage location 121 a for storing the organic substance vapor-deposited on the substrate S. As shown in FIG. The above-mentioned organic matter storage part 121 is a part that heats the organic matter storage location 121a to evaporate the organic matter particles. The above-mentioned organic matter storage part 121 is usually located inside the above-mentioned cavity 110, but the organic matter storage part 121 of the present invention may also be located outside the above-mentioned cavity 110. That is, the position of the above-mentioned organic matter storage unit 121 is configured so that it can be located at all positions inside or outside the cavity 110 .

The organic substance nozzle part 122 is a part for spraying the organic substance particles evaporated from the above-mentioned organic substance storage part 121 onto the above-mentioned substrate S, not shown in the figure. The structure of the spray nozzle is uniform. In addition, the organic substance nozzle part 122 may have a baffle structure in which the organic substance evaporated from the organic substance storage part 121 is not completely evaporated into a particle state, but further maintains the agglomerated state of a plurality of organic substance particles. The organic matter in the form of a cluster is broken into the state of organic matter particles, and the size of the organic matter particles sprayed on the substrate S is made uniform.

The connection line 123 connects the organic matter storage unit 121 and the organic matter nozzle unit 122 , and transports the organic matter particles evaporated from the organic matter storage unit 121 to the organic matter nozzle unit 122 . The temperature of the connection line 123 can be controlled to prevent condensation of organic matter particles evaporated from the organic matter storage unit 121 . In addition, in order to minimize the above-mentioned coagulation of organic particles, individual control with two or more regions may be performed. In addition, when the organic matter storage unit 121 is located outside the chamber 110 , the connection line 123 connecting the organic matter storage unit 121 and the organic matter nozzle unit 122 is connected to the outside of the chamber 110 . In addition, the connection line 123 is configured in the form of a corrugated tube because it can move the organic substance nozzle unit 122 in the vertical direction.

The measuring device 124 measures the vapor deposition rate and the thickness of the organic matter deposited on the substrate S, and is located at the front end of the organic matter nozzle 122 in the direction of organic matter ejection, and is integrated with the organic matter nozzle 122 . When the above-mentioned measuring device 124 moves the above-mentioned organic substance nozzle part 122 in order to form an organic thin film on the above-mentioned substrate S, it moves together with the above-mentioned organic substance nozzle part 122 to measure the vapor deposition rate of the organic substance vapor-deposited on the above-mentioned substrate S, and control The amount of organic matter evaporated in the above-mentioned organic matter storage unit 121 .

The method of forming an organic thin film using the organic substance vapor deposition apparatus 100 described above is as follows.

First, the substrate S is installed in the cavity 110 of the above-mentioned organic matter evaporation apparatus 100 so that it is approximately perpendicular to the ground, preferably maintained at an angle of 70°-110° to the ground.

Next, heating the organic matter storage part 121 located inside or outside the cavity 110 and composed of at least one organic matter storage location for receiving the organic matter, to vaporize the organic matter in the state of organic matter particles.

The evaporated organic particles move to the organic nozzle unit 122 via the connection line 123 between the organic storage unit 121 and the organic nozzle unit 122 , and are sprayed onto the substrate S through the organic nozzle unit 122 .

At this time, the organic matter evaporated from the organic matter storage part 121 is not completely evaporated into a particle state, but the organic matter maintained in a bundled form of agglomerated organic matter particles collides with the partition wall of the organic matter nozzle part 122, and is further broken into organic matter. particle state, thereby making the size of the organic particles sprayed on the substrate S uniform.

In addition, the connection line 123 between the organic matter storage unit 121 and the organic matter nozzle unit 122 and the organic matter nozzle unit 122 are heated by an auxiliary heater so that the evaporated organic matter particles are not condensed.

In addition, at least the organic nozzle part 122 can be moved in the organic vapor deposition source 120 by the organic matter vapor deposition source conveying device 130, and the organic matter particles can be uniformly sprayed onto the substrate S to form an organic substance on the substrate S. uniform organic film.

On the other hand, FIG. 3 is a schematic diagram illustrating an organic substance vapor deposition apparatus according to another embodiment of the present invention, and is a diagram limited to a substrate and an organic substance vapor deposition source for vapor deposition of organic substances.

Referring to FIG. 3 , the organic matter evaporation device in other embodiments of the present invention is similar to the organic matter evaporation device shown in FIG. 1 , FIG. 2 a and FIG. 2 b . The only difference is that the organic substance vapor deposition source 200 of the above-mentioned organic substance vapor deposition apparatus is constituted by a plurality of organic substance storage units 210 and a plurality of organic substance nozzle units 220 .

That is, the organic substance evaporation source 200 of the organic substance evaporation device according to another embodiment of the present invention has the following structure: a plurality of organic substance storage parts 210, which are composed of at least one organic substance storage position for receiving the organic substance vapor-deposited on the substrate S, located at Inside or outside of the cavity of the above-mentioned organic substance vapor deposition device; a plurality of organic substance nozzle parts 220, which respectively correspond to the above-mentioned organic substance storage part 210; a plurality of connection lines 230, which connect the above-mentioned organic substance nozzle parts 220 and the organic substance storage part 210; 240, which is provided at the front end of each of the organic substance nozzles 220 in the direction in which the organic substance is sprayed, and measures the vapor deposition rate of the organic substance vapor-deposited on the substrate S.

The organic matter vapor deposition source 200 of the above-mentioned organic matter vapor deposition device has a plurality of organic matter storage parts 210 and a plurality of organic matter nozzle parts 220, so even if there is no moving device for moving the above-mentioned organic matter nozzle parts 220, it can be roughly Evaporate organic matter on a vertically erected large substrate, and more uniformly vapor-deposit organic matter with the above-mentioned moving device.

4 is a schematic diagram illustrating an organic substance vapor deposition apparatus according to another embodiment of the present invention, and is a diagram limited to a substrate for vapor deposition of organic substances and an organic substance vapor deposition source.

Referring to FIG. 4 , the organic matter evaporation device in other embodiments of the present invention is similar to the organic matter evaporation device shown in FIG. 1 , FIG. 2 a and FIG. 2 b . The only difference is that the organic substance vapor deposition source 300 of the above organic substance vapor deposition device is composed of at least one organic substance storage unit 310 and a plurality of organic substance nozzles 320 corresponding to any one of the organic substance storage units 310 .

That is, the organic substance vapor deposition source 300 of the organic substance vapor deposition device according to another embodiment of the present invention has the following structure: an organic substance storage unit, which is composed of at least one organic substance storage position for receiving the organic substance vapor-deposited on the substrate S, and is located in the above-mentioned organic substance vapor deposition region. inside or outside of the device; a plurality of organic matter nozzles, which spray organic matter particles onto the substrate; a plurality of connection lines, which connect the above-mentioned organic matter nozzles and organic matter storage parts; measuring devices, which are provided in each of the above-mentioned organic matter nozzles The front end of the organic matter spraying direction of the part is measured to measure the vapor deposition rate of the organic matter vapor-deposited on the substrate.

The above-mentioned organic matter evaporation device corresponds to more than or equal to two organic matter nozzles in one organic matter storage position.

That is, one organic substance storage position corresponds to a plurality of organic substance nozzles, and the organic substance is vapor-deposited on the substantially vertically erected substrate to form an organic thin film.

As described above, the organic vapor deposition device according to the embodiment of the present invention shown in FIGS. 1 to 4 sprays organic particles in a vertically erected state to form an organic thin film. The drooping shape of the bottom, therefore, can be applied to large substrates.

In addition, the organic substance storage part and the organic substance nozzle part can be separated, the deformation of the substrate and the mask pattern due to heat can be prevented, and an organic thin film with uniform particle distribution of the organic substance can be formed on the substrate.

Impurities for improving the characteristics of the organic thin film can be implanted using substances different from the organic substances stored in the plurality of organic substance storage parts.

As a mask for forming the above-mentioned organic thin film, in the current trend of using the existing fine metal mask (finemetal mask), since the organic matter is sprayed approximately perpendicular to the above-mentioned substrate S, it has the ability to ensure uniform step coverage. (Step Kabari ッ リ ッ ジ) advantages.

Since the above-mentioned organic matter evaporation source 120, 200, 300 is moved by the above-mentioned organic matter evaporation source conveying device 130, and the organic matter is vapor-deposited on the above-mentioned substrate S, it is different from the existing organic matter evaporation source conveying device, and the substrate is used. The size of the cavity 11O can be reduced to within about 75% compared with the case of vapor-depositing organic substances in the organic substance vapor deposition apparatus 100 in which S moves.

On the other hand, FIG. 5 a and FIG. 5 b are diagrams for explaining an organic matter vapor deposition device according to another embodiment of the present invention, and FIG. 5 a is a longitudinal sectional view of an organic matter vapor deposition source of an organic matter vapor deposition device according to another embodiment of the present invention, 5b is a cross-sectional view of an organic substance vapor deposition source of an organic substance vapor deposition device according to another embodiment of the present invention.

5a and 5b, the organic matter evaporation source 400 of the organic matter evaporation device in other embodiments of the present invention is composed of an organic matter storage unit 410, an organic matter guiding path 420, a heater 430, an internal heat reflection plate 440, an external cooling plate 450, an organic matter The nozzle unit 460 and the measuring device 470 are configured.

The organic substance storage unit 410 stores organic substances that are materials of the organic thin film formed on the substrate S, and is preferably composed of a crucible divided into at least one unit 410a.

The organic substance guide path 420 is used to convey the organic substance particles evaporated from the organic substance storage unit 410 to the organic substance nozzle unit 460 and to determine a moving path of the organic substance particles. In further detail, in order to vaporize the organic particles upward from the organic storage part 410 and deposit organics on the substantially vertically erected substrate S, the final moving path of the organic particles must be substantially horizontal. Therefore, It is necessary to maintain the end of the organic matter guide path 420 at an angle of -20° to 20° with the ground. That is, the final movement path of the above-mentioned organic particles is guided so as to maintain an angle of -20° to 20° with the ground. In addition, the middle portion of the organic matter guide path 420 is formed obliquely at a predetermined angle, and part of the organic matter in the form of clusters among the organic matter evaporated from the organic matter storage unit 410 collides with the inner wall of the guide path and is broken into organic matter particles. Accordingly, the organic matter in the form of bundles is smoothly and uniformly mixed inside the organic matter guide path 420 , and the organic matter is prevented from being solidified on the substrate S to be vapor-deposited.

The heater 430 is provided outside the organic matter storage part 410 and the organic matter guide path 420 , and is used to heat the organic matter storage part 410 and the organic matter guide path 420 . That is, the organic substance storage unit 41O is heated to evaporate the organic substance in the particle state of the organic substance, and the evaporated organic substance particles are heated without condensing in the organic substance guide path 420 .

The internal heat reflection plate 440 is disposed outside the heater 430 to increase the thermal efficiency of the organic matter evaporation source 400 , and is configured in multiple stages to absorb heat capacity inside the organic matter evaporation source 400 .

The external cooling plate 450 is located outside the internal heat reflection plate 440 to prevent the heat inside the organic matter evaporation source 400 from being transferred to the outside. The above-mentioned external cooling plate 450 cools the internal heat reflection plate 440 using refrigerant.

The organic substance nozzle unit 460 has a function of spraying the organic substance particles evaporated from the organic substance storage portion 410 and flowing in through the organic substance guide path 420 onto the substantially vertically erected substrate S, and determining the position of the organic substance particles on the substrate S. Form of vapor deposition and distribution on the substrate S. In addition, the above-mentioned organic substance nozzle unit 460 is preferably in a form in which the spray angle can be adjusted when spraying the organic substance particles. The state of spraying organic matter particles can be adjusted by opening the organic matter nozzle part 460 , so the organic matter in the organic matter storage location 410 can be controlled to evaporate uniformly.

The measuring device 410 has a function of measuring the vapor deposition rate and thickness of the organic matter vapor-deposited on the substrate S erected at an angle of 70° to 110° relative to the ground. In addition, the measurement device 410 is located at the front end portion of the organic substance nozzle unit 460 in the organic substance injection direction, and is integrated with the organic substance nozzle unit 460 .

On the other hand, as shown in FIG. 5 b , the organic matter storage unit 410 is divided into at least one unit 410 a, and organic matter is stored in each unit 410 a. In addition, heaters 430 are evenly distributed around the organic matter storage unit 410 .

In the case of evaporating the organic matter in the organic matter storage unit 410, when the organic matter storage unit 410 is constituted by one unit, the difference in the evaporation rate of the organic matter due to the position occurs due to the difference in the temperature distribution inside the organic matter storage unit 410. The difference in evaporation rate caused by such positions reduces the uniform injection of impurities and the uniformity of the organic thin film, but by dividing the above-mentioned organic material storage part 410 into a plurality of units 410a, the organic material evaporation rate in the above-mentioned organic material storage part 410 can be made uniform.

A method of forming an organic thin film using an organic substance vapor deposition apparatus having an organic substance vapor deposition source according to another embodiment of the present invention described above is as follows.

First, the substrate S is installed in the chamber of the above-mentioned organic substance vapor deposition apparatus 100 so that it is kept approximately perpendicular to the ground, preferably at an angle of 70° to 110° with the ground.

Next, the organic substance storage unit 41O that receives the organic substance from the organic substance vapor deposition source 400 is heated by the heater 430 .

At this time, the organic matter stored in each unit in the crucible of the organic matter storage unit 41O is evaporated into a state of organic matter particles by the heater 430 .

The vaporized organic particles flow into the organic nozzle part 460 through the organic guide path 420 . At this time, the movement path of the organic matter particles is determined by the shape of the organic matter guide path 420 . Since the end of the organic matter guiding path 420 is maintained at an angle of -20° to 20° with the ground, the final moving path of the organic particles in the organic matter evaporation source 400 is maintained at an angle of -20° to 20° with the ground. . In addition, the organic matter guide path 420 prevents the organic matter evaporated from the organic matter storage unit 410 from being completely evaporated into a particle state, but keeps the organic matter in a bundled form of agglomerated organic matter particles and the organic matter in the organic matter guide path 420. The inner wall collides and breaks into organic particles, thereby making the size of the organic particles sprayed onto the substrate S uniform. In addition, the heater 430 outside the organic matter guide path 420 does not condense the evaporated organic matter particles in the organic matter guide path 420 .

The organic particles flowing into the organic nozzle part 460 are vapor-deposited on the substrate S through the organic nozzle part 460 to form an organic thin film. At this time, the organic material evaporation source 400 is moved in the vertical direction by the organic material evaporation source conveying device 130, and organic material particles are evaporated on the substrate S maintained at an angle of 70° to 100° with the ground to form an organic thin film. In addition, since the final moving path of the organic particles is maintained at an angle of -20° to 20° with the ground, when the organic particles are sprayed onto the substrate S through the organic nozzle part 460, the organic particles will form an angle with the ground. Spray at an angle of -20° to 20°. In addition, when the organic matter particles are vapor-deposited on the substrate S, the form of the organic matter particles vapor-deposited on the substrate S is adjusted by the form of opening the organic matter nozzle portion 460 .

On the other hand, the measuring device 470 provided at the front end of the organic substance nozzle 460 in the direction of spraying the organic substance measures the evaporation rate of the organic substance vapor-deposited on the substrate S while the organic substance is vapor-deposited on the substrate S. Plating rate and vapor deposition thickness of organic matter. Therefore, reproducibility of uniform thickness of the organic thin film can be achieved by controlling the vapor deposition rate of the organic substance particles and the vapor deposition thickness of the organic substance during the formation of the organic thin film using the measuring device 470 described above.

FIG. 6 is a schematic diagram illustrating an organic substance vapor deposition apparatus according to another embodiment of the present invention.

With reference to Fig. 6, the organic matter vapor deposition device of other embodiment of the present invention has following structure: As shown in Fig. source transporter.

As an example, the above-mentioned multiple different evaporation sources may be composed of a first organic material evaporation source 400A and a second organic material evaporation source 400B, and the first organic material evaporation source 400A and the second organic material evaporation source 400B contain the same organic matter, By moving at predetermined intervals from each other, a uniform organic thin film can be deposited on the substrate. It is advantageous especially when using a large substrate to vapor-deposit an organic thin film.

Alternatively, the above-mentioned multiple different organic matter evaporation sources are composed of the first organic matter evaporation source 400A and the second organic matter evaporation source 400B, and any one of the above-mentioned first organic matter evaporation source 400A and the second organic matter evaporation source 400B Evaporation sources, for example, the first organic matter evaporation source 400A is an organic matter evaporation source that sprays organic matter as an organic thin film raw material on the above-mentioned substrate S, and the second organic matter evaporation source 400B is used to improve the above-mentioned organic thin film. Organic vapor deposition source of impurities characteristic of organic thin films.

At this time, in order to contain organic substances in the organic thin film, the above-mentioned first organic substance evaporation source 400A and second organic substance evaporation source 400B can adjust the spraying angle so that before evaporating substances on the above-mentioned substrate S, within a certain area mix.

In addition, by installing a measuring device capable of measuring the vapor deposition rate and the vapor deposition thickness of each organic substance at the front end of the spraying direction of the nozzles of the first organic substance vapor deposition source 400A and the second organic substance vapor deposition source 400B, the substrate S can be During the formation of the organic thin film containing impurities, the deposition rate and the thickness of the organic matter can be controlled to control the content of impurities contained in the organic thin film.

As mentioned above, as shown in FIG. 5a, FIG. 5b and FIG. 6, the organic matter vapor deposition apparatus 100 according to other embodiments of the present invention prevents heat from being released to other than the organic matter nozzle part 460 through the above-mentioned internal heat reflection plate 400 and the external cooling plate 450. outside, thereby minimizing the thermal influence on the above-mentioned substrate S and mask pattern M. That is, deformation of the above-mentioned substrate S and mask pattern M due to heat can be prevented.

Fig. 7 a～Fig. 7 d are the figures for explaining the organic substance vapor deposition source of the organic substance vapor deposition device of other embodiment of the present invention, and Fig. 7 a is the vertical sectional view of the organic matter vapor deposition source of the organic substance vapor deposition device of other embodiment of the present invention, Fig. 7b is a schematic view of the organic matter storage part, nozzle part and heater part of the organic matter evaporation device limited to other embodiments of the present invention, and Fig. 7c is a schematic view of the shell of the organic matter vapor deposition device limited to other embodiments of the present invention , FIG. 7d is a diagram of a cooling device limited to an organic vapor deposition device according to another embodiment of the present invention.

Referring to FIGS. 7a to 7d, the above-mentioned organic matter evaporation source 500 of the organic matter evaporation device 100 according to an embodiment of the present invention has the following structure: an organic matter storage part 510, which stores organic matter, and has a partial opening; a nozzle part 520, which is connected to the above-mentioned organic matter The opening part of the storage part 510 is connected to inject organic matter; the casing 530 is in a form covering the organic substance storage part 510;

The organic substance storage unit 510 stores organic substances, which are raw materials of the organic thin film to be vapor-deposited on the substrate S, and is generally composed of a crucible. In addition, the above-mentioned organic substance storage unit 510 may be made of graphite (graphite) or its equivalent having excellent thermal conductivity, but the material is not limited to this material in the present invention.

The nozzle unit 520 has a function of spraying organic particles evaporated from the organic storage unit 310 onto the substrate S standing approximately vertically, and determining the vapor deposition and distribution pattern of the organic particles on the substrate S. At this time, the nozzle unit 520 has a form in which an organic nozzle 521 and a splash-proof film 525 are integrated, wherein the organic nozzle 521 sprays organic particles evaporated from the organic storage part 510 onto the substrate S, and the splash-proof film 525 It prevents the organic matter from evaporating into organic matter particles from the above-mentioned organic matter storage unit 510 and splashing in a cluster form. In addition, the above-mentioned nozzle part 520 may be made of graphite (graphite) or its equivalent having excellent thermal conductivity, but in the present invention, it is not limited to this material. In addition, since the injection state of the organic matter particles can be adjusted by opening the nozzle portion 520, the organic matter in the organic matter storage portion 51O can be controlled to evaporate uniformly.

The housing 530 covers the organic matter storage unit 510 and isolates the organic matter storage unit 510 from the external environment.

The heater unit 540 is interposed between the organic matter storage unit 510 and the housing 530 , and is used for evaporatively heating the organic matter in the organic matter storage unit 510 . At this time, the heater unit 540 includes a heating wire 541 which is a heat source capable of evaporating the organic matter, and a heating wire support 545 formed of a rib (Rib) to prevent the heating wire 541 from hanging down. In other words, the heater part 540 has a structure of a heater run (heater runne1) composed of a heating wire 541 and a heat wire support 545, and the heater run (heater runne1) covers the organic matter storage part 510. Therefore, since the heater unit 540 is not integrated with or mounted on other components in the organic substance vapor deposition source 500 , especially the organic substance storage unit 510 , it can be separated and replaced independently.

In addition, the organic substance evaporation source 500 may further have an internal heat reflection plate 550 installed on the inner wall of the casing 530 . The internal heat reflection plate 550 reflects heat generated from the heater part 540 to increase heat exchange of the heater part 540 .

The organic substance vapor deposition source 500 may further include a heat blocking device 560 mounted on the outer surface of the nozzle unit 520 along the substrate S direction. The heat blocking device 560 prevents heat from being released through the nozzle portion 520 and affecting the substrate S.

The organic substance evaporation source 500 may also have a cooling device 570 provided on the outer wall of the casing 530 . The cooling device 570 prevents heat generated from the heater unit 540 from being discharged to the outside via the casing 530 .

On the other hand, the organic substance vapor deposition source 500 may include a measuring device for measuring the vapor deposition rate and the vapor deposition thickness of the organic substance vapor-deposited on the substrate S, not shown.

As mentioned above, the organic matter evaporation source 500 of the above-mentioned organic matter evaporation device shown in Fig. 7a～Fig. The nozzle part 520 is inserted into the opening of the part 510, and the heater part 540 is inserted into the housing 530 to form a structure in which the organic matter storage part 510, the nozzle part 520 and the heater part 540 are easily disassembled and assembled.

On the other hand, the method of forming an organic thin film using the organic substance vapor deposition apparatus 100 having the above-mentioned organic substance vapor deposition source 500 is as follows.

First, the substrate is installed in the chamber 110 of the organic substance vapor deposition apparatus 100 so as to be approximately perpendicular to the ground, preferably at an angle of 70° to 110° to the ground.

Next, the heater unit 540 heats the organic substance storage unit 510 that receives the organic substance to be vapor-deposited on the substrate S of the organic substance vapor deposition source 500 . At this time, the organic matter stored in the organic matter storage portion 510 is heated by the heater portion 540, and evaporated in the state of organic matter particles.

The evaporated organic particles flow into the nozzle 520 , are sprayed through the nozzle portion 520 , and are vapor-deposited on the substrate S. As shown in FIG. At this time, the organic particles vapor-deposited on the substrate S pass through the mask pattern M to determine their vapor-deposited shape.

At this time, the organic substance vapor deposition source 500 can be transported by the transport device 130 to vapor-deposit the organic substance on the substrate S, and more uniform organic substance vapor deposition can be performed.

On the other hand, since the nozzle unit 520 integrates the organic substance nozzle 52l and the splash guard 525, organic particles are not evaporated from the organic substance storage portion 51O, and the organic substance in a bunch form can be prevented from being splashed.

The nozzle portion 520 is made of a material having excellent thermal conductivity such as graphite, and can prevent the organic particles sprayed through the nozzle portion 520 from agglomerating without providing another heating device.

In addition, when the organic material particles are deposited on the substrate S, the form of the organic material particles deposited on the substrate S is adjusted by the form of the organic material nozzle 321 opening the organic material nozzle part 520 .

On the other hand, since the organic matter vapor deposition source also has a measuring device (not shown), it is possible to measure the vapor deposition rate of the organic matter vapor-deposited on the above-mentioned substrate S and the organic matter vapor deposition rate during the vapor-deposition of the above-mentioned organic matter on the above-mentioned substrate S. The evaporation thickness. Therefore, when forming an organic thin film using the measuring device 580 described above, by controlling the vapor deposition rate of the organic substance particles and the vapor deposition thickness of the organic substance, reproducibility of the uniform thickness of the organic thin film can be realized.

Claims (23)

1. organic matter vaporization plating device is characterized in that having: constitute the chamber of housing, it makes substrate keep 70 °～110 ° angle with respect to ground; The organic matter vaporization plating source, it is made of organism storage part, organism guiding road, well heater, internal heat reflector, exterior cooling plate and organism nozzle, is used for evaporation organism on described substrate and forms organic film; Organic matter vaporization plating source transporter, it moves in the vertical direction described organic matter vaporization plating source,

Wherein, described organism guiding road is the mobile route from the organism particle of described organism storage part evaporation, described well heater is located at the outside on organism storage part and organism guiding road, heat described organism storage part and organism guiding road, described internal heat reflector is than outer setting of described well heater, described exterior cooling plate is positioned at the outside of described internal heat reflector, prevents the heat passage to outside of inside, described organic matter vaporization plating source.

2. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described organism storage part is divided into a plurality of unit.

3. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described organism guiding road makes the final travel direction of organism particle keep-20 °～+ 20 ° angle with respect to ground.

4. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described exterior cooling plate uses refrigerant cools internal heat reflector.

5. organic matter vaporization plating device as claimed in claim 1, it is characterized in that, described organic matter vaporization plating source also has determination sensor, and it is positioned at the front end of the organism injection direction of described organism spray nozzle part, measures organic evaporation rate and the evaporation thickness of evaporation on described substrate.

6. organic matter vaporization plating device as claimed in claim 1 is characterized in that, also has the device that is used at described organism impurity.

7. organic matter vaporization plating device is characterized in that having: the chamber, and it constitutes housing, makes substrate keep 70 °～110 ° angle with respect to ground; A plurality of organic matter vaporization platings source, its evaporation material and form film on described substrate, by the well heater on evaporation material storage part, evaporation material guiding road, the described evaporation material storage part of heating and evaporation material guiding road, be formed at the outside of described evaporation material storage part and evaporation material guiding road and be used for the internal heat reflector of reverberation, exterior cooling plate and the evaporation material spray nozzle part of being located at the outside of described internal heat reflector and cooling off described internal heat reflector constitutes; Organic matter vaporization plating source running gear, it moves in the vertical direction described vapor deposition source, and wherein, described evaporation material guiding road is the mobile route from the evaporation material particle of described evaporation material storage part evaporation.

8. organic matter vaporization plating device as claimed in claim 7 is characterized in that, described a plurality of vapor deposition source evaporations are identical organism mutually.

9. organic matter vaporization plating device as claimed in claim 7 is characterized in that, described a plurality of vapor deposition source are made of the first organic vapor deposition source and the second organic vapor deposition source.

10. organic matter vaporization plating device as claimed in claim 9, it is characterized in that, the described first organic matter vaporization plating source is the starting material vapor deposition source of film on substrate, and the described second organic matter vaporization plating source is to contain the impurity vapor deposition source that is useful on the impurity that improves described film characteristics in described film.

11. organic matter vaporization plating device as claimed in claim 7 is characterized in that, spray angle can be regulated in described a plurality of different organic matter vaporization plating sources.

12. organic matter vaporization plating device as claimed in claim 7, it is characterized in that, described organic matter vaporization plating source also has determination sensor, and it is positioned at the organism injection direction front end of described organism spray nozzle part, measures organic evaporation rate and the evaporation thickness of evaporation on described substrate.

13. an organic matter vaporization plating device is characterized in that, comprising: the chamber, it constitutes housing and support substrate; At least one organic matter vaporization plating source, it has the organism storage part of storage organism and a part of opening, be connected with the part of described organism storage part opening and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell, compare described well heater portion, locate to be provided with the internal heat reflector for more outer.

14. organic matter vaporization plating device as claimed in claim 13 is characterized in that, also has the organic matter vaporization plating source transporter that described organic matter vaporization plating source is moved in the vertical direction.

15. organic matter vaporization plating device as claimed in claim 13 is characterized in that, at least one in described organism storage part and the described spray nozzle part is made of graphite.

16. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described spray nozzle part has: the organism nozzle, and it sprays the organism particle on described substrate; The splashproof film, its organism that prevents described organism storage part splashes.

17. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described well heater portion has the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down.

18. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the internal heat reflector that is installed on described outer casing inner wall.

19. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the hot cut-off of the substrate direction exterior face that is installed on described spray nozzle part.

20. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the refrigerating unit of being located at described outer shell outer wall.

21. an organic matter vaporization plating device is characterized in that it comprises: the chamber, it constitutes housing and support substrate; The organic matter vaporization plating source, it has the organism storage part of storage organism and local opening, be connected with the opening portion of described organism storage part and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell; Organic matter vaporization plating source transporter, it can make described organic matter vaporization plating source move in the vertical direction, and compares described well heater portion, locates to be provided with the internal heat reflector for more outer.

22. organic matter vaporization plating device as claimed in claim 21 is characterized in that, described spray nozzle part has: the organism nozzle, and it sprays the organism particle on described substrate; The splashproof film, its organism that prevents described organism storage part splashes.

23. organic matter vaporization plating device as claimed in claim 21 is characterized in that, described well heater portion comprises the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down, constitutes the structure of the well heater passage of the form that covers described organism storage part.

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