CN1629736A - 用于感光体层的溶胶-凝胶法 - Google Patents
用于感光体层的溶胶-凝胶法 Download PDFInfo
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- CN1629736A CN1629736A CN200410081816.8A CN200410081816A CN1629736A CN 1629736 A CN1629736 A CN 1629736A CN 200410081816 A CN200410081816 A CN 200410081816A CN 1629736 A CN1629736 A CN 1629736A
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- layer
- sol
- gel
- photoreceptor
- transport layer
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Abstract
一种光电导成像元件包括空穴阻挡层、发光层、电荷传输层和任选的外涂层,其中电荷传输层和任选的外涂层中的至少一个层以溶胶-凝胶法形成。
Description
发明领域
本发明涉及用于形成感光体层的溶胶-凝胶法,以及包括这种层的感光体。更具体的讲,本发明涉及用于形成感光体结构层,尤其是电荷转移层和外涂层的溶胶-凝胶法,以及由此形成的层和感光体。
相关技术描述
静电印刷术还称静电摄影印刷术或电子照相印刷术,该领域中,静电印刷板或静电印刷鼓也称感光体或成像元件,其包括光电导绝缘层,并按下述方式成像:首先将静电荷均匀沉积在感光体的成像表面上,然后将感光体暴露于某种形式的激活的电磁辐射下,如暴露于光或激光光源下,这样就选择性地驱散印刷板照射区域内的电荷,而在非照射区域内留下静电潜像。通过将细分散的验电标记粒子或调色剂沉积在成像表面上,可使该静电潜像随后显影成可见图像。
总的说来,层状感光成像元件在许多美国专利,如美国专利No.4,265,900中有所描述,其中阐述了由发光层(photogeneratinglayer)和芳基胺类空穴传输层组成的成像元件。例如,分散在聚碳酸酯,如MAKROLON中、由芳基二胺组成的电荷传输层是已知的。发光层组分的例子包括三方硒、金属酞菁、氧钒基酞菁和不含金属的酞菁。另外,美国专利No.3,121,006中描述了一种复合静电印刷光电导元件,其由分散在电绝缘有机树脂粘合剂中的光电导无机化合物细分散粒子组成。’006专利中公开的粘合剂材料可包括基本上不能产生任何有效距离传输的树脂、光电导粒子产生的注入电荷载体。
最近,人们已将有机感光体,即,在电荷发生层和/或传输层内使用有机化合物的感光体用于性能改进。这种有机感光体通常可带来以下改进效果:电荷接收更好、光谱灵敏度变宽、成本降低且更易于制造。但是,这种有机感光体通常还会带来负面效果:主要由于磨损率和磨擦率增加而使操作寿命缩短。
发明概述
虽然带有各种电荷传输层的成像元件,尤其是带有空穴传输分子的空穴传输层材料,包括分散在树脂粘合剂,如聚碳酸酯中的芳胺的成像元件已在本领域中有所公开,并且适用于其意图的目的,但仍需要改进成像元件,尤其是层状元件,使其具有化学和机械方面都很稳固的传输层。而且,还需要层状成像元件内的各层彼此可充分粘合,从而使这种元件可不断地用于重复的成像体系中而不产生层分离。进一步还需要提供具有预期机械特性的光电导成像元件。相信本发明的实施方案可满足这些以及其它一些需要。
为了解决上述问题和需要,本发明提供了感光体结构,其中感光体的一个或多个层,例如电荷运输层和外涂层通过溶胶-凝胶法形成。
本发明在实施方案中提供了一种光电导成像元件,其包括:空穴阻挡层、发光层、电荷传输层和任选的外涂层,其中电荷传输层和任选的外涂层中的至少一个层以溶胶-凝胶法形成。
典型实施方案详述
本发明的各方面均涉及光电导成像元件,其由一个或多个溶胶-凝胶法形成的层组成。根据本发明,光电导成像元件可具有本领域已知的和上述参考文献中所述的各种层结构中的任一种结构。例如,光电导成像元件可包括一种或多种已知的各种层,该层包括但不限于,防卷曲背涂层、支撑基底、导电基底、导电水平面、阻挡层、粘合层、电荷发生层、可与电荷发生层分离开来或可与电荷发生层结合起来的电荷传输层、外涂层等。
因此,本发明的光电导成像元件可由支撑基底、空穴阻挡层、光电发生层、电荷运输层和任选的外涂层组成,其中至少一个层,如电荷运输层或外涂层,通过溶胶-凝胶法制备。支撑基底可以为,例如但不限于,金属、导电聚合物或绝缘聚合物,每种物质的厚度都约30微米-约500微米。支撑基底上可任选涂覆有导电层,厚度任选为约0.01微米-约1微米。如果希望,成像元件还可进一步包括位于元件上面的涂覆顶层,其优选但不必须用溶胶-凝胶法形成。
溶胶-凝胶法为本领域的公知技术,基于已知方法和已经公开的内容可进行本发明的应用。相应地,本发明感光体的至少一个层包括有机-无机复合结构,通常其特征为:该无机玻璃状聚合物具有分散于或渗透入和/或化学键合入无机聚合物网络中的有机材料。
有机-无机复合结构包括玻璃状的聚合物,如无机氧化硅聚合物,例如氧化硅玻璃结构。通过溶胶-胶凝(或“溶胶-凝胶”)法制备该玻璃状聚合物,在该过程中,在水和醇存在下,烷氧基硅,例如原硅酸四乙酯(下文中为“TEOS”)发生水解,之后进行缩聚反应。例如,在C.J.Brinker和G.Scherer,溶胶-凝胶科学:The Physics andChemistry of So1-Ge1 Processing(Academic Press,Boston,1990)中教导了形成溶胶-凝胶的一般方法。这种将可互溶的单相液体溶液变为两相物质的两步反应法称作“溶胶-凝胶转变”。通常,TEOS/水/醇混合物水解慢。但是,水解速率是溶液pH的函数,因此,可通过加入酸或碱作为催化剂进行控制。反应混合物还可包括其它物质,如有机单体或聚合物,或其它添加剂,其可化学键合入玻璃状聚合物网络中,也可被捕获在玻璃状聚合物结构中。根据本发明,虽然碳原子可包括在整个结构,例如在侧基中,玻璃状聚合物网络本身不包括任何碳原子。
正如溶胶-凝胶领域中已知的,溶液pH会影响形成的玻璃状聚合物凝胶的性质。碱性溶液中的聚合反应通常使生成的凝胶相对多孔并且半透明,并且其进一步的特征为:SiO2簇彼此联结形成凝胶。相反,酸性溶液中的聚合反应通常生成透明的聚合物凝胶,其特征为:非常细小的孔隙(即,微孔),和均匀、线性的分子,该分子在随后的、相对低温(如,约800℃)的烧结过程中聚结形成高密度(完全致密)物质。
溶胶-凝胶法形成的聚合物凝胶为两相物质,表示为“醇凝胶”,其中一相含有固体硅氧烷骨架网络(即,(-Si-O-Si-)n),而水相在孔中含有水和醇。一旦形成醇凝胶,则通过缓慢加热凝胶蒸发出挥发性物质,如醇来进行干燥。醇凝胶的干燥应缓慢进行,因为快速干燥会产生不均匀的凝胶收缩,其会在得到的干燥醇凝胶(干凝胶)中引起裂缝。在小孔中具有高液体含量的凝胶中尤其应该注意裂缝。在这种情况下,如果干燥得太快,则小孔不能足够快地适应液体的排出,从而导致所得干凝胶中产生裂缝。
通过自然蒸发而适当驱除挥发性物质,则形成的聚合物凝胶包括一种两相的、刚性的干凝胶(一种含有氧化物骨架和微孔的凝胶)。最终的玻璃产物中具有的孔数和孔尺寸(以及因此,最终的玻璃产物的密度)是加热速率、最终烧结温度以及干凝胶保持在最终烧结温度下的时间的函数。
虽然上面针对硅-基材料讨论了溶胶-凝胶法,但本发明的溶胶-凝胶法和层并不限于这种硅材料。而且,本发明的溶胶-凝胶法可提供任何适当的和希望的聚合氧化物结构。因此,例如,所得无机玻璃聚合物可形成为Al、B、Si、Sn、Ti、Zr等的氧化物。优选材料包括,但不限于,氧化硅、二氧化钛、氧化铝、氧化锆和磷酸铝。
可使用任何已知的或后研制的希望的材料作为适当的溶胶-凝胶材料前体。例如,含有烷氧基甲硅烷基或羟基甲硅烷基的适用于本发明的已知化合物包括:烷基三烷氧基硅烷,例如,苯基三甲氧基硅烷、甲基三甲氧基硅烷、甲基三乙氧基硅烷、3-缩水甘油氧基丙基三甲氧基硅烷、3-三氟丙基三甲氧基硅烷、甲基丙烯酰氧基丙基三乙氧基硅烷、三乙氧基甲硅烷基异丁基-POSS(POSS是多面的低聚硅倍半氧烷)、八(三氯甲硅烷基乙基)-POSS等;四烷氧基硅烷,例如,四甲氧基硅烷(“TMOS”)、四乙氧基硅烷(“TEOS”)和TEOS的低聚缩合物,例如硅酸乙酯40、四异丙氧基硅烷、四丙氧基硅烷、四异丁氧基硅烷、四丁氧基硅烷等。其它硅氧烷化合物包括,但不限于,双(三乙氧基甲硅烷基)甲烷、1,9-双(三乙氧基甲硅烷基)壬烷、二乙氧基二氯硅烷、三乙氧基氯硅烷等。其它适当的溶胶-凝胶前体材料包括,但不限于,异丙氧基钛(IV)、甲氧基钛(IV)、二异丙氧基双(乙酰乙酸乙酯)合钛酸盐、三乙醇胺钛酸盐、三乙醇胺锆酸盐、仲丁氧基铝等。
在进行溶胶-凝胶法的过程中,通常使用酸催化剂来加速溶胶-凝胶反应。可用的适当的酸包括,但不限于,无机酸,如盐酸、氢氟酸、硫酸、硝酸等;有机酸,如乙酸、三氟乙酸、草酸、甲酸、羟基乙酸、乙醛酸等;或聚合酸,如聚(丙烯酸)、聚(氯乙烯-共-醋酸乙烯-共-马来酸)等;其混合物等。这些酸可以按各种强度使用,和/或可以用水稀释。
为了提供希望的涂布层溶液以制备根据本发明的感光体,溶胶-凝胶法中还可包括适当的添加剂。因此,例如,当溶胶-凝胶法用于制备电荷传输层时,可在适当的有机粘合材料存在下进行溶胶-凝胶法,电荷传输材料就存在于反应混合物中。同样,当溶胶-凝胶法用于制备外涂层时,可在反应混合物中存在适当的有机粘合材料和其它常用添加剂的情况下进行溶胶-凝胶法。当这些添加材料包括在反应混合物中时,其通常并不被限制在玻璃状聚合物结构本身内,而是均匀地分散或渗入聚合物内,或作为侧基或作为缠结物质。
根据本发明,由包括水解和缩合反应的溶胶-凝胶法形成的感光体层优选原位形成。也就是说,各种溶胶-凝胶反应组分及其它的层材料添加剂可被预混合,使各种溶胶-凝胶组分在涂布溶液中原位进行水解反应,之后优选先不进行溶胶-凝胶反应或方法本身的缩合反应,直到原位形成(包括涂布和热干燥)感光体层。因此,优选将各种溶胶-凝胶反应组分和其它的层材料添加剂一起用作层涂层,然后使溶胶-凝胶反应继续进行以形成终产物层。但是,如果希望的话,在实施方案中,可在将材料涂布在基底形成感光体层之前进行溶胶-凝胶反应。
通常,本发明的感光体可包括上面讨论的、感光体结构中常用的各种层中的任意一种层。因此,根据本发明的实施方案,提供了一种电子照相成像元件,其通常至少包括基底层、空穴阻挡层、电荷发生层、电荷传输层和任选的外涂层。在实施方案中,空穴阻挡层、电荷发生层和电荷传输层可合并为单一的层。这些成像元件可按各种已知方法中的任何一种方法制造。
通常,静电摄影成像元件是本领域所公知的。静电摄影成像元件,包括本发明的静电摄影成像元件,可以通过各种适当技术中的任意方法进行制备,条件是用作电荷传输层或外层的物质包括本发明的降低表面能的空穴运输聚合物添加剂。
支撑基底可以是不透明或基本透明的,并且可以包括许多具有需要的机械性质的适当材料。基底可另外装有导电表面。因此,基底可包括电绝缘或导电材料,如无机或有机组合物层。作为绝缘材料,可使用用于此目的的已知的各种树脂粘合剂,包括聚酯、聚碳酸酯,如双酚聚碳酸酯、聚酰胺、聚氨酯、聚苯乙烯等。电绝缘或导电基底可为刚性或挠性,并且可具有任意个数的不同外形,例如圆柱、片、卷轴、环形挠性带等。
支撑基底表面可包括贯穿基底厚度的导电材料,或包括自支撑材料上的导电材料层或涂层。导电层厚度可在实质上很宽的范围内变化,这取决于感光体所希望的透明度和挠性。挠性导电层可为导电金属层,例如,可通过任意适当的涂层技术,如真空沉积技术成型于基底上。
空穴阻挡层可应用于基底的导电表面上。通常,带正电荷的感光体的电子阻挡层使空穴从感光体成像表面迁移至导电层。一些材料可形成既具有粘合剂层功能又具有电荷阻挡层功能的层。常用的阻挡层包括聚乙烯丁缩醛、有机硅烷、环氧树脂、聚酯、聚酰胺、聚氨酯、硅氧烷等。聚乙烯丁缩醛、环氧树脂、聚酯、聚酰胺和聚氨酯还可作为粘合剂层。粘合剂层和电荷阻挡层优选干燥厚度为约20埃-约2,000埃。
尤其优选将美国专利No.4,464,450中描述的硅烷反应产物作为阻挡层物质,因为其环稳定性得以扩展。常用的可水解硅烷包括3-氨基丙基三乙氧基硅烷、N-氨基乙基-3-氨基丙基三甲氧基硅烷、N-2-氨基乙基-3-氨基丙基三甲氧基硅烷、N-2-氨基乙基-3-氨基丙基三(乙基乙氧基)硅烷、对氨基苯基三甲氧基硅烷、3-氨基丙基二乙基甲基硅烷、(N,N’-二甲基-3-氨基)丙基三乙氧基硅烷、3-氨基丙基甲基二乙氧基硅烷、3-氨基丙基三甲氧基硅烷、N-甲基氨基丙基三乙氧基硅烷、甲基[2-(3-三甲氧基甲硅烷基丙基氨基)乙基氨基]-3-丙酸酯、(N,N’-二甲基-3-氨基)丙基三乙氧基硅烷、N,N-二甲基氨基苯基三乙氧基硅烷、三甲氧基甲硅烷基丙基二亚乙基三胺及其混合物。
通常,水解硅烷与金属氧化物层的反应产物形成厚度约为2 0埃-约2,000埃的阻挡层时,可获得满意的结果。
优选的空穴阻挡层包括水解硅烷与金属水平面层的氧化表面之间的反应产物。氧化表面经真空沉积后再暴露于空气时自然成型于大部分金属水平面层上。空穴阻挡层可按任何适当的常用技术进行施加,例如,喷涂、浸涂、拉杆涂敷、照相凹板式涂敷、逆转辊涂布、真空沉积、化学处理等。为了便于获得薄层,阻挡层优选以稀溶液形式施加,涂层沉积后再用常用技术,如真空、加热等方法将溶剂除去。空穴阻挡层应为连续的,并优选干燥后的厚度小于约0.2微米,因为厚度太大会导致不希望的高残余电压。
空穴阻挡层还可为颗粒,其中的颜料粒子被分散在聚合物粘合剂中。颜料包括,但不限于,二氧化钛、氧化锌、氧化锡及其它金属氧化物。聚合物粘合剂可包括,但不限于,例如,酚醛树脂、聚(乙烯丁缩醛)、聚酰胺及其它聚合物。颜料/粘合剂的重/重比为约30/70-约80/20。阻挡层厚度为约1μm-约30μm。
可将任选的粘合剂层施加于阻挡层。
任何适当的发光层都可施加于任选的粘合剂层上,之后再按照下述方法涂刷上邻接的空穴运输层,或者也可以按照相反顺序施加这些层。
可使用多-发光层组合物,其中光电导层提高或降低发光层的性能。如果希望,也可使用本领域已知的其它适当的发光物质。
由于对白光具有敏感性,因此特别优选包括含有光电导材料的粒子或层的电荷发生粘合剂层,该光电导材料为例如,氧钒基酞菁、不含金属的酞菁、苯并咪唑二萘嵌苯、无定型硒、三方硒、硒合金,如硒-碲、硒-碲-砷、砷化硒等及其混合物。也优选氧钒基酞菁、不含金属的酞菁和碲的合金,因为这些材料可带来对红外光具有敏感性的益处。
可将形成粘合剂材料的任何适当的聚合物薄膜用作发光粘合剂层中的基质。
存在于树脂粘合剂组合物中的发光组合物或颜料量可以不同,但通常将约5%体积-约90%体积的发光颜料分散在约10%体积-约95%体积的树脂粘合剂中,并且优选将约20%体积-约30%体积的发光颜料分散在约70%体积-约80%体积的树脂粘合剂组合物中。在一个实施方案中,约8%体积的发光颜料分散在约92%体积的树脂粘合剂组合物中。
含有光电导组合物和/或颜料和树脂粘合剂材料的发光层优选厚度为约0.1微米-约5.0微米,最优选厚度为约0.3微米-约3微米。发光层的厚度与粘合剂含量有关。粘合剂含量越高的组合物通常需要越厚的发光层。只要能实现本发明的目的,厚度也可在此范围之外。
活性电荷运输层可包括用作添加剂的、分散在电惰性聚合材料中使这些材料电活性的活化化合物。可将这些化合物加入到不能支持发光空穴从发光物质注入、并且不能完全运输这些空穴的聚合材料中。这样就会将电惰性聚合物质转变为这样的材料:其能够支持发光空穴从发光材料的注入,并且能够传输这些空穴使其通过活性层,从而使表面电荷在活性层上放电。特别优选的、可在本发明的多层光电导体中使用的传输层包括约25%-约75%重量的至少一种电荷传输芳基胺类化合物,和约75%-约25%重量的形成树脂的、芳基胺类可溶于其中的聚合膜。
形成电荷传输层的混合物优选包括一种或多种具有下列通式化合物的芳基胺类化合物:
其中,R1和R2为芳香基团,选自取代或未取代的苯基、萘基和聚苯基,并且R3选自取代或未取代的芳基、具有1-约18个碳原子的烷基和具有约3-约18个碳原子的脂环族化合物。取代基优选应不含如NO2基团、CN基团等的吸电子基团。
上面结构式所表示的、用于能够支持电荷发生层产生的发光空穴的注入,并且能够运输空穴使其通过电荷传输层的运输的电荷芳基胺类的例子包括:双(4-二乙基氨基-2-甲基-苯基)苯基-甲烷、4’,4-双(二乙基氨基)-2’,2-二甲基三苯基甲烷、N,N’-双(烷基苯基)-[1,1’-联苯基]-4,4’-二胺(其中烷基为,例如甲基、乙基、丙基、正丁基等)、N,N’-二苯基-N,N;-双(氯苯基)-[1,1’-联苯基]-4,4’-二胺、N,N’-二苯基-N,N’-双(3-甲基苯基)-(1,1’-联苯基)-4,4’-二胺、N,N’-二苯基-N,N’-双(3-羟基苯基)-(1,1’-联苯基)-4,4’-二胺、三甲苯胺、N’N-双(3,4-二甲基苯基)-1-氨基联苯基等,其分散在惰性树脂粘合剂中。
可将任何适当的惰性树脂粘合剂应用于本发明的感光体中。常用的惰性树脂粘合剂包括聚碳酸酯树脂、聚醚碳酸酯、聚酯、聚芳基化物、聚丙烯酸酯、聚醚、聚砜等。重均分子量可为约20,000-约150,000。
可使用任何适当和传统的技术进行混合,之后将电荷传输层涂覆混合物施加于电荷发生层。但是,为了给本发明带来改进效果,通过将混合物涂覆在电荷发生层上,并继续进行溶胶-凝胶法以提供含有电荷传输层组分的交联玻璃状聚合物结构,从而将电荷传输层涂覆混合物施加于电荷发生层。
传输层厚度优选约10-约50微米,但也可使用此范围外的厚度。传输层应为绝缘体:在没有光照的情况下,置于传输层上的静电荷不被传导,足以防止其上形成和保留静电潜像。通常,传输层与电荷发生层的厚度比优选为约2∶1-200∶1,一些情况下,可大至约为400∶1。
优选的电惰性树脂材料为重均分子量为约20,000-约150,000,更优选为约50,000-约120,000的聚碳酸酯树脂。最优选作为电惰性树脂材料的物质为分子量约35,000-约40,000的聚(4,4’-异亚丙基-二亚苯基碳酸酯),可作为Lexan 145购自General ElectricCompany;分子量约40,000-约45,000的聚(4,4’-异亚丙基-二亚苯基碳酸酯),可作为Lexan 141购自General Electric Company;分子量约50,000-约120,000的聚碳酸酯树脂,可作为Makrolon购自Farbenfabricken Bayer A.G.,和分子量约20,000-约50,000的聚碳酸酯树脂,可作为Merlon购自Mobay Chemical Company;聚(4,4’-亚环己基二苯基碳酸酯)(聚碳酸酯Z),聚(4,4’-异亚丙基-3,3’-二甲基-二苯基-碳酸酯);聚(4,4’-二苯基-甲基苯基-碳酸酯)等。二氯甲烷和一氯苯和四氢呋喃(THF)溶剂为优选的电荷传输层涂覆混合物的组分,用于充分溶解所有的组分。
具有至少两个电操作层的光敏元件的例子包括电荷发生体层和含有二胺的运输层元件。感光体可包括,例如,夹在导电表面和上述电荷传输层之间的电荷发生层,或夹在导电表面和电荷发生层之间的电荷传输层。
特别优选的多层光电导体包括电荷发生层,其包括光电导材料和成膜粘合剂临近的传输层,以及电活性小分子。优选的运输层包括分子量为约20,000-约120,000的聚碳酸酯树脂材料,且分散在约25-75%重量的一种或多种下列通式的化合物中:
其中X为具有1-约4个碳原子的烷基,Y为H或具有1-4个碳原子的烷基。
可将其它层,例如常用的导电接地片安装在接近电荷传输层之处,沿着该区的边缘与导电层、阻挡层、粘合层或电荷发生层接触,以助于感光体导电层与地面或电偏压的连接。导电接地片层包括成膜聚合物粘合剂和导电粒子。任何适当的导电粒子都可用于导电接地片层中。导电接地片厚度优选可为约7微米-约42微米,最优选为约14微米-约2 7微米。但是,并非所用感光体都使用导电接地片。如果存在导电接地片,其可作为外层连接于或邻接于其它外层,其可为含有成膜聚合物的电荷发生层、电荷传输层、外涂层或介电层。
如果使用包括成膜聚合物粘合剂的外涂层,其应为外层,其中可加入降低表面能的空穴传输聚合物添加剂。不含有降低表面能的空穴传输聚合物添加剂的外涂层在本领域是公知的,并且其为电绝缘的或轻微空穴传输的。将外涂层用于本发明的感光体上时,其应为连续的。外涂层优选厚度约2微米-约8微米,更优选为约3微米-约6微米。最佳厚度范围为约3微米-约5微米。
可使用任何适当和传统的技术进行混合,之后将外涂层涂覆混合物施加于底涂层,例如电荷传输层上。但是,为了给本发明带来改进效果,通过将混合物涂覆在层上,并继续进行溶胶-凝胶法以提供含有外涂层组分的交联玻璃状聚合物结构,从而将外涂层涂覆混合物施加于底涂层上。
在某些情况下,任选可将抗卷曲涂层施加于与感光体的成像面相对的面上,以提高平直度和/或耐磨损性。
本发明还包括成像和印刷装置,以及用此处公开的光电导成像元件产生图像的方法。
本发明公开了溶胶-凝胶法用于形成感光体外层(如电荷传输层和/和外涂层)的应用。出人意料地发现,这种施加感光体层的溶胶-凝胶法提供了改进的耐磨性。常用的改进耐磨性的方法是将硬的惰性颗粒(如氧化硅、氧化铝和二氧化钛)和/或低表面能颗粒(如聚四氟乙烯(PTFE)微粒)分散在电荷传输层或外涂层中。但是,这种分散体很难于制备,并且有效寿命短。此外,主要由于接触面积小,颗粒和感光体层之间的粘合性弱。
在本发明中,溶胶-凝胶反应组分与常用的感光体层材料混合。溶胶-凝胶反应组分在涂层溶液中原位水解。不涉及分散体,制备简单并且得到的均匀溶液的有效寿命更长。涂覆后,将方法中使用的溶剂蒸发出来,则形成希望的薄膜。在干燥过程中,溶胶-凝胶反应组分原位发生缩合反应,则形成有机-无机相互渗透的网络,其不可预料地提供了更好的耐磨性、选择性控制及其它优越性。选择氟化溶胶-凝胶反应组分,如三氟丙基三甲氧基硅烷可使耐磨性得到改进的外层的表面能得到降低。
实施例
实施例1:
按照下面方法制备示意性的本发明的感光成像元件。
由二甲苯/1-丁醇(wt/wt=50/50)中的二氧化钛(TiO2 STR-60N,Sakai)、氧化硅(P-100,Esprit)和酚醛树脂(Varcum 29159,OxyChem)组成的分散体制造空穴阻挡层。二氧化钛、氧化硅、酚醛树脂的重量比为52/10/38。将直径为30mm的铝鼓基底在含有涂覆溶液的浸涂罐中浸涂,并在145℃下干燥45分钟。所得的干燥阻挡层的厚度约为4.0微米。将15克氯化镓酞菁颗粒分散在10克VMCH(购自UnionCarbide Co.)在368克2∶1(重量)的二甲苯和乙酸正丁酯混合物中形成的溶液中,从而制得电荷发生剂涂覆分散体。用Dynomill研磨机(KDL,购自GlenMill),以0.4-微米的锆球研磨该分散体4小时。然后用电荷发生剂涂覆分散体浸涂带有空穴阻挡层的鼓。所得涂覆鼓经空气干燥形成0.2~0.5-微米厚的电荷发生层。
制备电荷传输层涂覆溶液:将聚(4,4’-二苯基-1,1’-环己烷碳酸酯)(PCZ400,购自Mitsubishi Gas Chemical Company,Inc.)粘合剂、N,N’-二苯基-N,N’-双(3-甲基苯基)-[1,1’-联苯基]-4,4’-二胺,及2,6-二叔丁基-4-甲酚(BHT,抗氧化抑制剂)(全部按重量比60∶40∶1),混入四氢呋喃(THF)和甲苯(重量比为70∶30)混合溶剂中。固体含量约22-wt%。向400g制备的电荷运输层涂覆溶液中加入20g四乙氧基硅烷(TEOS)。加入盐酸(HCl)酸化的水作为溶胶-凝胶催化剂。水与TEOS及HCl与TEOS的摩尔比分别为5∶1和0.05∶1。溶液滚动混合24小时,得到均匀混合物,无需考虑分散体稳定性。用Tsukiage涂布机以环涂法将所得的有机-无机电荷运输涂覆溶液应用于涂覆鼓上。干燥涂覆鼓并在120℃下固化1小时,形成24微米厚的电荷传输层。
为了比较,除省去四乙氧基硅烷(TEOS)和酸化水外,其余按同样方式制备参考成像元件。
确定成像元件的静电印刷电性质:黑暗中,用电晕放电装置对其表面进行静电充电,直至经连接静电计的电容偶极探针测定表面能已达约500伏的初始值(V0)。黑暗中停止5秒后,充电元件表面能达到一定值,该值称作无光显影潜能(Vddp),然后暴露于过滤氙灯的光线下。观察到,由于光放电效应而使表面能降至背景潜能(Vbg)。按照(V0-Vddp)/0.5计算暗衰变(伏/秒)。按照100%×(Vddp-Vbg)/Vddp计算光放电百分率。用曝光表测定暴露过程中光放电成像元件所用的光能。成像元件的感光性可用E1/2进行描述,由无光显影潜能获得50%光放电所需的曝光能量的量(尔格/cm2)。感光性越高,E1/2值越小。改进静电印刷成像元件效果所希望的是高电荷接受、低暗衰变和高感光性(较低的E1/2值)。
下表概述了试验成像元件的电试验和磨损试验结果。所用的暴光波长为670纳米。
| 元件 | Vdepl | DiThk | dV/dx | V(4.26) | 暗衰变 | 磨损率a |
| 对照元件 | 10 | 7.8 | -140 | 160 | 12 | 80 |
| 带有溶胶-凝胶电荷运输层的元件 | 7 | 7.5 | -136 | 168 | 8 | 65 |
a单位为nm/1000循环
这些结果说明,具有溶胶-凝胶形成的电荷传输层的本发明感光体提供的结果相当于常用的浸涂电荷传输层。但是,分析显示:溶胶-凝胶形成的层提供更低的磨损率,更高的硬度、压缩强度、热变形温度和平稳响应(plateau response),以及更低的热膨胀系数。
实施例2:
按照下面方法制备第二个示意性的本发明的感光成像元件。
按照上述实施例1的控制元件制备三个感光体。制备后,每个感光体包括铝鼓、空穴阻挡层、电荷发生层和电荷传输层。
制备外涂层:在400克无水乙醇中混和60克Aquazol 50(聚(乙基呃唑啉),M.W.=50,000,Polymer Chemisry Innovations,Inc.)和40克N,N’-二苯基-N,N’-双(3-羟基)-(1,1’-联苯基)-4,4’-二胺。
将20克四乙氧基硅烷(TEOS)与盐酸(HCl)酸化水一起加入作为溶胶-凝胶催化剂。水与TEOS及HCl与TEOS的摩尔比分别为5∶1和0.05∶1。将溶液滚动混和24小时,得到均匀混合的混合物,无需考虑分散体的稳定性。
用Tsukiage涂覆法将如此制得的有机-无机外涂层溶液施加到一个感光体试样中,涂至目标厚度4微米。120℃下将涂覆的鼓烘干1小时。三个元件的直径如下:
| 元件 | 是否存在外涂层 | CTL+OCL厚度(μm) |
| 对照组1 | 否 | 24.1+0 |
| 对照组2 | 否 | 20.8+0 |
| 实施例2 | 是 | 21.0+4.0 |
确定成像元件的静电印刷电性质:在黑暗中,通过用电晕放电装置对其表面进行静电充电,直至经连接静电计的电容偶极探针测定表面能已达约500伏的初始值(V0)。黑暗中停止5秒后,充电元件表面能达到一定值,该值称作黑暗显影潜能(Vddp),然后暴露于来自过滤氙灯的光线下。观察到,由于光放电效应而使表面能降至背景潜能(Vbg)。按照(V0-Vddp)/0.5计算暗衰变(伏/秒)。按照100%×(Vddp-Vbg)/Vddp计算光放电百分率。用曝光表测定暴露过程中光放电成像元件所用的光能。成像元件的感光性可用E1/2进行描述,由无光显影潜能获得50%光放电所需的曝光能量的量(尔格/cm2)。感光性越高,E1/2值越小。改进静电印刷成像元件效果所希望的是高电荷接受、低暗衰变和高感光性(较低的E1/2值)。
下表概述了试验成像元件的电试验和磨损试验结果。所用的曝光波长为670纳米。
| 元件 | Vdepl | DiThk | V(0) | V(4.26) | dV/dx | V删除 | 暗衰变 |
| 对照组1 | 9 | 8.1 | 509 | 108 | -159 | 43 | 7 |
| 对照组2 | 7 | 6.8 | 501 | 109 | -144 | 38 | 7 |
| 具有溶胶-凝胶外涂层的元件 | 23 | 7.2 | 494 | 105 | -149 | 42 | 7 |
这些结果表明,具有溶胶-凝胶外涂层的本发明的感光体提供的结果相当于常用的没有外涂层的感光体。也就是说,带有外涂层的元件可产生相当的电结果,但给元件提供了额外的耐磨保护。
Claims (2)
1.一种光电导成像元件,包括:
空穴阻挡层;
发光层;
电荷传输层;和
任选的外涂层;
其中电荷传输层和任选的外涂层中的至少一个层以溶胶-硅胶法形成。
2.一种形成光电导成像元件的方法,包括:
将空穴阻挡层施加于基底上;
将发光层施加于所述的空穴阻挡层上;
将电荷传输层施加于所述的发光层上;和
任选地将外涂层施加于所述的电荷传输层上;
其中电荷传输层和任选的外涂层中的至少一个层以溶胶-硅胶法形成。
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| CN101293188B (zh) * | 2006-04-28 | 2012-04-11 | 施乐公司 | 流化床反应装置和使用该装置的方法 |
| CN116835537A (zh) * | 2023-06-09 | 2023-10-03 | 先导薄膜材料(广东)有限公司 | 一种高纯硒靶坯、平面靶及高纯硒靶坯、平面靶制备方法 |
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