CN1629770A

CN1629770A - Computer radiating method requiring no fans

Info

Publication number: CN1629770A
Application number: CN 200410053447
Authority: CN
Inventors: 项非; 项炳荣
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-08-05
Filing date: 2004-08-05
Publication date: 2005-06-22

Abstract

This invention relates to a radiation method to PC desk computer system and its quasi-system without using radiating fans, which utilizes radiators made up of the shell to conduct the heat source in the box to the shell radiator for natural radiation.

Description

Computer does not use the heat dissipating method of fan

This method relates to a kind of PC table top computer system and Barebone, relates to a kind of new heat dissipating method about this system.

P.116～118 page PC table top computer system and Barebone (Barebone definition is referring to the international number of the edition of " computer utility digest " domestic number of the edition: CN50-1070/TP: ISSN 1002-1353,2004 the 13rd phases) are referred to as computer in this following instructions.

At present, the heat dissipating method of computer: the forced cooling method that on the GPU of CPU and video card, adds fan with heating radiator (fin of aluminium or other materials system), in the air of transfer of heat to the computer housing, together discharge cabinet with the hot-air in the cabinet with by the heat that power supply produces by the power supply vent port by power supply fan again.Its heat radiation flow process such as Fig. 1.The feature of the method is to use fan, at least will be with 2 fans: 1 cpu fan, 1 power supply fan.The video card that has also will be used fan.But the installation environment in the cabinet limits the calm heat radiation of pyrotoxin eventually.And the rotating speed acceleration circulation of air speed that further improves fan will make noise increase, and influence the life-span of fan simultaneously, increase the maintenance frequency.

In a word, computer uses the physical construction of this rotation of fan, compares its life-span with other electronic components in the computer and will lack a lot, also can increase the burden of power supply simultaneously, and the noise that fan produces is very annoying.

The present invention be a kind of can not only efficiently radiates heat, noiselessness, and not power consumption again, maintenance period are long, without the heat dissipating method of fan.See the heat radiation process flow diagram of Fig. 2.

Heating radiator A in Fig. 2 is promptly shown in Fig. 3 (12).A side or a plurality of side of cabinet are constituted with heating radiator A.The inner heat that produces of computer can pass through casing heating radiator A natural heat dissipation like this.It is as a component part of cabinet simultaneously, and its shape can be fin-type, plate or other Any shape, and can carry out some decorations.

This heat dissipating method can be achieved like this technically:

One .CPU

With CPU on the mainboard and heating radiator A, the one side in cabinet closely contacts, to reach the purpose of direct heat radiation.Use this method in the design of mainboard, will change.Present motherboard design all is placed on all components and parts the method for the one side of mainboard basically, and new heat dissipating method is with the another side of CPU design at mainboard.Like this, there are this one side and the heating radiator A of CPU to be close to mainboard, just can realize that CPU has contacted with the direct of heating radiator A, sees Fig. 4, Fig. 7.(need to transmit two faces of being close to of heat on the technology, between these two surface of contact, coat thermal grease conduction, to improve two heat-conducting effect between the face, as follows.) this method radiating effect is best.Concrete enforcement can adopt the Luo silk fastening, also the method or the additive method that can pin with hasp lock.

Another kind method do not change the existing design of mainboard, but such CPU and heating radiator A just has a segment distance, can not directly contact.The method that solves: this segment distance of CPU and heating radiator A is connected with heat pipe, by heat pipe the heat that CPU produces is transmitted to heating radiator A, sees Fig. 6, Fig. 7.The method need not redesign mainboard, and heat pipe for thermal conductivity is mature technology, implements easy.

Two. video card

The heat dissipating method of video card (being integrated in except the very little video card of integration video card and thermal value on the mainboard) is the same with the second method of mainboard CPU, sees Fig. 5.With the GPU of heat pipe one end connection video card, the other end links to each other with heating radiator A and solves.(non-present some video card on the market adds little heat radiator with heat pipe, directly is fixed on the video card.) adopt the method for this heat pipe heat radiation, the puzzlement that has solved heat dissipation problem for more high performance GPU design from now on.

Three. power supply

Power supply is the separate component that the shell encapsulation is arranged.Fan one in the power supply is the heat radiation for power supply itself, and another vital role is that the air outside hot-air in the whole cabinet and the cabinet is done forced convertion.Now, solved the heat radiation of CPU and GPU, the air themperature in the cabinet is not high, do not need power supply fan and carry out forced convertion, and the natural convection of cabinet inner air and outer air is just passable.Heat dissipation problem with power supply internal heat generation element solves again, and power supply fan just is out of use.

Solving the heat radiation of power supply heater element can be like this: with the outer casing of power supply one side, i.e. and a face of Fig. 8 (15) indication power supply box, its case inboard is that B face and heater element are close to; Its case outside is that C face and heating radiator A install at the cabinet inner close fitting.This side of power supply box constitutes with the material of aluminium or other good heat conductivity.Heater element in the power supply box moves on to the one side that is adjacent to the B face by rearranging of wiring board and comes, and so just can dispel the heat to this approach of heating radiator A by power supply box C face.Another kind method: can not arrange wiring board again, use original radiating mode instead heat pipe for thermal conductivity or other heat-conducting mode, with the heat of heater element be transmitted to power supply box B face this on one side.The method is compared with last method, and last method is simple.

It should be noted that and between power adjustment pipe and B face, to use mica insulation instead.With reliable insulation and the good heat-conducting of assurance with civil power.

Below in conjunction with description of drawings and embodiment patent of the present invention is further specified:

Fig. 1 is the radiating mode process flow diagram that existing computer expert uses.

Fig. 2 is the process flow diagram of this heat dissipating method.

Fig. 3 is a case radiation device A synoptic diagram.

Fig. 4 is the installation diagram of CPU at the another side of mainboard.

Fig. 5 is the heat pipe connection layout of the interior CPU of cabinet and GPU and heating radiator A.

Fig. 6 is that the CPU of Fig. 5 is connected the A-A fragmentary cross-sectional view with the heat pipe of heating radiator A.

Fig. 7 be Fig. 4 CPU and heating radiator A be connected the B-B fragmentary cross-sectional view.

Fig. 8 is the synoptic diagram that power supply box internal heat generation element is arranged the position.

1. power supply boxs, 2. mainboard, 3. heat pipe CPU termination contact block, 4. heat pipe in the drawings, 5. internal memory, 6. heat-pipe radiator A termination contact block, 7. CD-ROM drive position in storehouse, 8. floppy drive position in storehouse, 9. hard disk position in storehouse, 10. video card, 11.GPU, 12. heating radiator A, 13. fixed mount, 14. heat pipe GPU termination contact blocks, 15. power supply box B faces, 16. power adjustment pipes, 17. commutator tube, 18. power supply PCB, 19. cabinet panels, 20.CPU socket, 21. screw, 22. sleeves, 23.CPU.

Specific implementation method: CPU partly sees Fig. 4, Fig. 5, Fig. 6 and Fig. 7.In first method shown in Figure 4, CPU socket (20) is designed into mainboard (2) reverse side, directly use sleeve (22) screens, use Luo silk (21) to fasten again, CPU (23) is close on the heating radiator A (12).

In Fig. 5, the second method shown in Figure 6, with fixed mount (13) that heat pipe CPU termination contact block (3) is fixing, make it closely to contact with CPU (23).Again heat-pipe radiator A termination contact block (6) is fixed on the heating radiator A (12) with the Luo silk.

Video card is partly seen Fig. 5, and is the same with CPU part second method, and heat pipe GPU termination contact block (14) is closely contacted with GPU (11).Again heat-pipe radiator A termination contact block (6) is fixed on the mainboard (12) with the Luo silk.

Power unit is seen Fig. 8, and power adjustment pipe (16) and commutator tube (17) are fastened on power supply box B face (15) with the Luo silk.

Claims

1. a PC table top computer system and heat dissipating method that Barebone adopted is characterized in that: direct thermal contact conductance or connect heat conduction with heat pipe the heat that CPU in the cabinet produces is transmitted on the casing heating radiator.

2. a kind of PC table top computer system that heat dissipating method according to claim 1 adopted and the cabinet of Barebone is characterized in that: a side of cabinet or many sides shell are to be made of the heating radiator that heat sinking function is arranged.

3. a kind of PC table top computer system that heat dissipating method according to claim 1 adopted and the mainboard of Barebone, it is characterized in that: use the another side of the design of the CPU on the mainboard at mainboard, CPU on the mainboard can directly be contacted with the casing heating radiator, and the heat of CPU is transmitted to the mainboard of the method for dispelling the heat on the casing heating radiator.

4. a kind of PC table top computer system that heat dissipating method according to claim 1 adopted and the heat pipe of Barebone, it is characterized in that: connect CPU or GPU to the casing heating radiator, and the heat of CPU or GPU is transmitted to the heat pipe of the method for dispelling the heat on the casing heating radiator.

5. a kind of PC table top computer system that heat dissipating method according to claim 1 adopted and the power supply of Barebone, it is characterized in that: heat radiation does not rely on fan, but the power supply of the method for the heat transferred that produces in the power supply being dispelled the heat to the casing heating radiator by outer casing of power supply.