CN1627032A - Thin plate heat pipe and manufacturing method thereof - Google Patents
Thin plate heat pipe and manufacturing method thereof Download PDFInfo
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- CN1627032A CN1627032A CN 200310118555 CN200310118555A CN1627032A CN 1627032 A CN1627032 A CN 1627032A CN 200310118555 CN200310118555 CN 200310118555 CN 200310118555 A CN200310118555 A CN 200310118555A CN 1627032 A CN1627032 A CN 1627032A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000007872 degassing Methods 0.000 claims abstract description 58
- 239000012530 fluid Substances 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims 15
- 238000010276 construction Methods 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000001125 extrusion Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明是在提供一种薄板式热管与其制造方法,该制造方法是先将二金属薄板裁切成可相对结合的一上薄板与一下薄板,在任一薄板的相对周缘位置涂布接着材料后,使该上薄板与该下薄板固结成一形成有中空腔室的薄板组合体,再使该接着材料封合该上薄板与下薄板,续将该中空腔室内充填工作流体后除气,最后进行封口作业;该薄板式热管包括一薄板组合体、一工作流体及一毛细结构。
The present invention provides a thin plate heat pipe and a manufacturing method thereof. The manufacturing method comprises first cutting two metal thin plates into an upper thin plate and a lower thin plate that can be relatively combined, coating an adhesive material on the relative peripheral position of any thin plate, and then consolidating the upper thin plate and the lower thin plate into a thin plate assembly with a hollow chamber, and then sealing the upper thin plate and the lower thin plate with the adhesive material, and then filling the hollow chamber with a working fluid and degassing it, and finally performing a sealing operation; the thin plate heat pipe comprises a thin plate assembly, a working fluid and a capillary structure.
Description
技术领域technical field
本发明涉及一种热管,特别是涉及一种薄板式热管与其制造方法。The invention relates to a heat pipe, in particular to a thin-plate heat pipe and its manufacturing method.
背景技术Background technique
如图1所示,是台湾专利第510490号「热管结构」,为制造该热管10是先建构一具有一开放口(图未示)与界定出一内腔室101的金属中空基管102,再将适量的工作流体103自该开放口注入该中空基管102后,使该中空基管102抽真空后封口(即密封该中空基管102的开放口)。As shown in Figure 1, it is Taiwan Patent No. 510490 "Heat Pipe Structure". In order to manufacture the
但实际上,当该热管10的圆管面贴置在一发温源上(例如一CPU(图未示)的顶平面)时,只可形成小面积的传温面,而有传温效果不佳的缺憾;再者,另一种使用方式,是将多数热管10垂设在一如图2所示的散热鳍片组合体20的一底座201内,借该底座201的底平面202贴置在如图3所示的CPU30上的偌大接触表面积,以加大传温面,如此,虽可解决前述的传温面不足的缺点,但实际上,该CPU30的热温是先借导热效果较差的底座20传温再透过导热效果佳的热管10散温,而仍存有传温效果不佳的缺点。But in fact, when the round pipe surface of the
另外,如图4所示,为一现有平板式热管40,当该平板式热管40贴置在该CPU30上进行传热动作时,虽然,本身具有传温迅速与利用较大传温表面积来加速热传导效果,但实际上,却存有厚度较大而不符『轻、薄』的设计,面对笔记型计算机....等强调轻巧携带的数字设备而言,而有不适用于上述数字设备的内部空间中的缺点,相对限缩其实用价值。In addition, as shown in Figure 4, it is an existing
发明内容Contents of the invention
因此,本发明的目的,是在提供一种薄板式热管的制造方法。Therefore, the object of the present invention is to provide a method for manufacturing a thin-plate heat pipe.
且本发明的另一目的,是在提供一种符合「轻、薄、短、小」特性而具高实用价值的薄板式热管。Another object of the present invention is to provide a thin-plate heat pipe with high practical value that meets the characteristics of "light, thin, short, and small".
依据本发明的薄板式热管的制造方法,适用于金属薄板,包括下列步骤:The manufacturing method of thin-plate heat pipe according to the present invention is applicable to thin metal plates, comprising the following steps:
(A)裁切薄板:将二金属薄板裁切成可相对结合的一上薄板与一下薄板;(A) Cutting the thin plate: cutting the two metal thin plates into an upper thin plate and a lower thin plate that can be combined relatively;
(B)涂布接着材料:在任一薄板的相对周缘位置涂布接着材料;(B) Coating the bonding material: coating the bonding material at the relative peripheral position of any thin plate;
(C)结合薄板:使该上薄板与该下薄板固结成一形成有中空腔室的薄板组合体;(C) Combining thin plates: making the upper thin plate and the lower thin plate consolidated into a thin plate assembly formed with a hollow cavity;
(D)连结薄板:使该接着材料封合该上薄板与下薄板;(D) connecting thin plates: making the adhesive material seal the upper thin plate and the lower thin plate;
(E)充填、除气作业:在该薄板组合体的中空腔室内充填工作流体、除气,使该中空腔室呈真空状态;及(E) Filling and degassing operations: filling and degassing the hollow chamber of the sheet assembly with working fluid, so that the hollow chamber is in a vacuum state; and
(F)封口作业。(F) Sealing operation.
另外,本发明的薄板式热管,包括一薄板组合体、一工作流体及一毛细结构;该薄板组合体包括相对应结合的一上薄板与一下薄板、一由该上薄板与该下薄板包覆界定出的中空腔室,该下薄板具有多数贯穿形成的穿孔,该上薄板具有一位于该上薄板的周边的外环部、一受该外环部围绕且凸隆形成的凸部,及多数对应固结在该下薄板的穿孔的卡块,该凸部具有多数凹陷形成的凹槽,该凹槽的底部恰可卡抵于该下薄板的一顶面,而形成一支撑结构;该工作流体是充填在该薄板组合体的中空腔室内;该毛细结构是形成于该薄板组合体的中空腔室内。In addition, the thin-plate heat pipe of the present invention includes a thin-plate assembly, a working fluid, and a capillary structure; the thin-plate assembly includes an upper thin plate and a lower thin plate that are correspondingly combined, and one is covered by the upper thin plate and the lower thin plate. A hollow chamber is defined, the lower thin plate has a plurality of through-holes formed through it, the upper thin plate has an outer ring portion located at the periphery of the upper thin plate, a convex portion surrounded by the outer ring portion and formed by a bulge, and a plurality of Corresponding to the perforated block fixed on the lower thin plate, the convex part has a groove formed by a plurality of depressions, and the bottom of the groove can just be stuck against a top surface of the lower thin plate to form a supporting structure; the working Fluid is filled in the hollow cavity of the thin plate assembly; the capillary structure is formed in the hollow cavity of the thin plate assembly.
此外,本发明的薄板式热管,包括一薄板组合体、二侧盖、一工作流体及一毛细结构;该薄板组合体为挤压成型的一体式结构体,并包括一界定出一中空腔室的板体、位于该板体的两相反侧的一前开放端与一后开放端,及一垂设在该中空腔室内的支撑结构,该支撑结构是由多数支撑肋条组构成;该二侧盖是分别密封在该薄板组合体的前开放端与后开放端;该工作流体是充填在该薄板组合体的中空腔室内;该毛细结构是形成于该薄板组合体的中空腔室内。In addition, the thin-plate heat pipe of the present invention includes a thin-plate assembly, two side covers, a working fluid, and a capillary structure; the thin-plate assembly is an extruded integral structure, and includes a hollow chamber that defines a a plate body, a front open end and a rear open end located on two opposite sides of the plate body, and a support structure vertically arranged in the hollow chamber, the support structure is composed of a plurality of support rib groups; the two sides The cover is respectively sealed on the front open end and the rear open end of the thin plate assembly; the working fluid is filled in the hollow chamber of the thin plate assembly; the capillary structure is formed in the hollow chamber of the thin plate assembly.
下面结合附图及实施例对本发明进行详细说明。The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
附图说明Description of drawings
图1是台湾专利第510490号「热管结构」的一剖视图。FIG. 1 is a cross-sectional view of Taiwan Patent No. 510490 "Heat Pipe Structure".
图2是台湾专利第510490号「热管结构」的一使用示意图,说明多数热管垂设在一散热鳍片组合体的一底座。FIG. 2 is a schematic diagram of the use of Taiwan Patent No. 510490 "Heat Pipe Structure", illustrating that many heat pipes are vertically arranged on a base of a heat dissipation fin assembly.
图3是台湾专利第510490号「热管结构」的一使用示意图,说明该散热鳍片组合体的一底座贴置在一CPU上。FIG. 3 is a schematic view of the use of Taiwan Patent No. 510490 "Heat Pipe Structure", illustrating that a base of the cooling fin assembly is attached to a CPU.
图4是一现有平板式热管的一使用示意图,说明该平板式热管贴置在一CPU上进行传热动作。FIG. 4 is a schematic view of the use of a conventional flat heat pipe, illustrating that the flat heat pipe is placed on a CPU for heat transfer.
图5是本发明的薄板式热管的第一较佳实施例的一立体分解图,说明一薄板组合体至少包括一上薄板、一下薄板与一充填除气管。5 is a three-dimensional exploded view of the first preferred embodiment of the thin-plate heat pipe of the present invention, illustrating that a thin-plate assembly at least includes an upper thin plate, a lower thin plate and a filling and degassing pipe.
图6是该第一较佳实施例的一立体外观图。FIG. 6 is a perspective view of the first preferred embodiment.
图7是图6中沿线7-7的一组合剖视图。FIG. 7 is a composite cross-sectional view taken along line 7-7 of FIG. 6. FIG.
图8是该第一较佳实施例的一除气加工的使用示意图。FIG. 8 is a schematic view of a degassing process in the first preferred embodiment.
图9是该第一较佳实施例于封口密闭加工的一使用示意图。Fig. 9 is a schematic view of the first preferred embodiment used in the sealing and sealing process.
图10是本发明的薄板式热管的第二较佳实施例的一立体分解图,说明一薄板组合体至少包括一上薄板与一下薄板,该上薄板具有一除气孔。10 is a three-dimensional exploded view of the second preferred embodiment of the thin-plate heat pipe of the present invention, illustrating that a thin-plate assembly includes at least an upper thin plate and a lower thin plate, and the upper thin plate has a degassing hole.
图11是本发明的薄板式热管的第三较佳实施例的一立体分解图,说明该薄板式热管至少包括一薄板组合体、二盖板及一除气充填管,该薄板组合体为挤压成型的一体式金属结构体。Fig. 11 is a three-dimensional exploded view of the third preferred embodiment of the thin-plate heat pipe of the present invention, illustrating that the thin-plate heat pipe at least includes a thin-plate assembly, two cover plates and a degassing filling pipe, and the thin-plate assembly is extruded Compression-formed one-piece metal structure.
图12是该第三较佳实施例的一立体外观图。Fig. 12 is a perspective view of the third preferred embodiment.
图13是图12中沿线13-13的一组合剖视图,说明该薄板组合体的一中空腔室的表面形成有多数直条沟槽。Fig. 13 is an assembled cross-sectional view taken along line 13-13 of Fig. 12, illustrating a plurality of straight grooves formed on the surface of a hollow chamber of the sheet assembly.
图14是本发明的薄板式热管的第四较佳实施例的一立体外观图,说明一薄板组合体的一板体具有一除气孔。14 is a three-dimensional appearance view of the fourth preferred embodiment of the thin-plate heat pipe of the present invention, illustrating that a plate body of a thin-plate assembly has a degassing hole.
图15是本发明的薄板式热管的制造方法的一较佳实施例的一流程图。FIG. 15 is a flow chart of a preferred embodiment of the manufacturing method of the thin-plate heat pipe of the present invention.
图16是该薄板式热管的制造方法的较佳实施例的一动作示意图,说明一上薄板的除气孔,可利用一封口机构达成封口密闭效果,该封口机构包括一腔室、一玻璃、一O型环、一雷射装置、一球体供给装置与一除气装置。Fig. 16 is a schematic diagram of the action of a preferred embodiment of the manufacturing method of the thin-plate heat pipe, illustrating that the degassing hole of the upper thin plate can be sealed by a sealing mechanism, which includes a chamber, a glass, a O-rings, a laser device, a sphere supply device and a degassing device.
具体实施方式Detailed ways
实施例1Example 1
为了方便说明,在以下的实施例,类似的组件,是以相同标号来表示。For convenience of description, in the following embodiments, similar components are denoted by the same reference numerals.
如图5、6、7所示,本发明的薄板式热管1的第一较佳实施例,是包括一薄板组合体2、一工作流体3、一毛细结构。As shown in Figures 5, 6 and 7, the first preferred embodiment of the thin-
该薄板组合体2包括相对应结合的一矩形下薄板21与一上薄板22、一由该下薄板21与该上薄板22包覆界定出的中空腔室23、一斜切45°的角隅24,及一装设在该下薄板21与上薄板22之间,且位于该角隅24并连通该中空腔室23的充填除气管25;该下薄板21具有多数贯穿形成的穿孔211;该上薄板22具有一位于该上薄板22的周边的外环部221、一受该外环部221围绕且凸隆形成的凸部222,及多数对应铆接在该下薄板21的穿孔211的卡块223;该外环部221恰可抵接在该下薄板21的一顶面212;该凸部222具有多数凹陷形成的凹槽2221,该凹槽2221的底部恰可卡抵于该下薄板21的顶面212,而形成一支撑结构;借该充填除气管25而可充填工作流体3于该中空腔室23内,与除气使该中空腔室23呈真空状态。The
该工作流体3为现有具有过热蒸发、遇冷还原特性的流体,是充填在该薄板组合体2的中空腔室23内。The working fluid 3 is an existing fluid with superheated evaporation and cold reduction characteristics, and is filled in the hollow chamber 23 of the
该毛细结构是形成于该薄板组合体2的中空腔室23内;在本实施例中该毛细结构为多数形成在该下薄板21的表面的直条沟槽4、亦可为复式交叉沟槽(图未示),或为一置放在该中空腔室23内的金属网(图未示)。The capillary structure is formed in the hollow chamber 23 of the
另外,如图8所示,在实务上,当该充填除气管25完成除气动作后,是利用一夹具5先夹扁该充填除气管25,再以一裁剪机具6剪断经夹合加工作业所产生的一扁平封口端部(即封嘴部位),并于剪断后施予封口密闭;该封口密闭方式为利用为如图9所示的雷射装置予以焊接密闭,或利用点胶密闭;在此值得一提的是,借该薄板组合体2的角隅24的设计,可使经夹、剪、封口密闭后的充填除气管25,维持该薄板式热管1的外观平整度与不虞被外力碰断,以提高空间排列的实用性;重要的是,该薄板组合体2目前的厚度可达到1.2mm以下,而具『轻、薄』的设计,可适用于笔记型计算机....等数字设备中,极具实用价值;此外,如图6、7所示,当将本发明的薄板式热管1的一底平面11贴置在一CPU(图未示)上时,亦可在远离该底平面11的侧边设置多数散热鳍片(图未示),以辅助散热。In addition, as shown in FIG. 8 , in practice, after the degassing action of the filling and degassing
实施例2Example 2
如图10所示,本发明的薄板式热管1’的第二较佳实施例,其不同于第一较佳实施例的地方在于:该薄板组合体2’未设有如图6所示的充填除气管25,但其上薄板22具有一位于该凸部222的中央位置的除气孔224,及一位于侧边的充填孔(图未示);于实务上,是先利用一充填机(图未示)的充填针灌注该工作流体(图未示)于该薄板组合体2’的中空腔室(图未示)内,再利用一除气机(图未示)接合于该除气孔224后,进行除气作业;当然亦可先除气再充填工作流体;最后利用一雷射装置(图未示)焊接密闭该除气孔224或利用点胶方式密闭该除气孔224,以获致封口气密效果。As shown in Figure 10, the second preferred embodiment of the thin-plate heat pipe 1' of the present invention is different from the first preferred embodiment in that the thin-plate assembly 2' is not provided with the filling as shown in Figure 6
实施例3Example 3
如图11、12所示,本发明的薄板式热管7的第三较佳实施例,包括一薄板组合体8、二侧盖9、一工作流体3及毛细结构。As shown in FIGS. 11 and 12 , the third preferred embodiment of the thin-
搭配如图13所示,该薄板组合体8为挤压成型的一体式金属结构体,并包括一界定出一中空腔室811的板体81、位于该板体81的两相反侧的一前开放端82与一后开放端83、一垂设在该中空腔室811内的支撑结构,及一连通该中空腔室811的充填除气管85,该支撑结构是由多数支撑肋条84组构成。As shown in FIG. 13 , the
该侧盖9包括一圆凹部91,及一远离该圆凹部91的连接部92;该二侧盖9的连接部92是分别套接固定在该薄板组合体8的前开放端82与后开放端83后,再利用一雷射装置(图未示)焊接密闭该连接部92与该开放端82、83的间隙、或利用一磨擦焊接头(图未示)以磨擦焊方式密闭上述的间隙,亦可先置放适量的接着材料于上述间隙后利用一高温炉(图未示)熔焊密闭,以获致封口气密效果;前述的充填除气管85是穿结在其中一侧盖9后伸入该中空腔室811中。The
该工作流体3为现有具有过热蒸发、遇冷还原特性的流体,是充填在该薄板组合体8的中空腔室811内。The working fluid 3 is an existing fluid with superheated evaporation and cold reduction characteristics, and is filled in the hollow chamber 811 of the
该毛细结构是形成于该薄板组合体8的中空腔室811内;在本实施例中该毛细结构为多数形成在该中空腔室811的表面的直条沟槽4,亦可为复式交叉沟槽(图未示)。The capillary structure is formed in the hollow chamber 811 of the
由上述构件组成,可使本发明的薄板式热管7符合『轻、薄』的设计,而可适用于笔记型计算机....等数字设备中,极具实用价值。Composed of the above-mentioned components, the thin-
实施例4Example 4
如图14所示,本发明的薄板式热管7’的第四较佳实施例,其不同于第三较佳实施例的地方在于:该薄板组合体8’未设有如图12所示的充填除气管85,而另设有一位于中央位置且连通该中空腔室(图未示)的除气孔86,及一位于侧边的充填孔(图未示);其除气方式与图10所示的除气孔224雷同,且充填工作流体与封口方式亦属雷同,所以在此不再赘述。As shown in Figure 14, the fourth preferred embodiment of the thin-plate heat pipe 7' of the present invention is different from the third preferred embodiment in that: the thin-plate assembly 8' is not provided with the filling as shown in Figure 12 The
实施例5Example 5
如图15所示,为制造如图5、10所示的薄板式热管1、1’的方法,包括下列步骤120~170:As shown in Figure 15, the method for manufacturing thin-
步骤120为裁切金属薄板:将二金属薄板裁切成可相对结合的一下薄板21与一上薄板22。Step 120 is cutting the metal sheets: cutting the two metal sheets into a
步骤130为涂布接着材料:在该下薄板21的顶面周缘位置涂布接着材料(图未示)。Step 130 is coating an adhesive material: coating an adhesive material (not shown) on the peripheral position of the top surface of the
步骤140为固结薄板:使该下薄板21与该上薄板22固结成一形成有如图7所示的中空腔室23的薄板组合体2;在本实施例中该下薄板21与该上薄板22为铆接固定;该中空腔室23形成有一毛细结构;在本实施例中该毛细结构为多数形成在该下薄板21的表面的直条沟槽4、亦可为复式交叉沟槽(图未示),或为一置放在该中空腔室23内的金属网(图未示)。Step 140 is to consolidate the thin plate: the lower
步骤150为连结薄板:使该接着材料封合该下薄板21与该上薄板22;在本实施例中,可利用一雷射装置(图未示)或一高温炉(图未示)使该接着材料熔焊密闭该下薄板21与该上薄板22的间隙。Step 150 is to connect the thin plates: make the adhesive material seal the lower
步骤160为充填、除气作业:在该薄板组合体2的中空腔室23内充填工作流体、除气,使该中空腔室23呈真空状态;在实务上,该中空腔室23可先充填工作流体再除气,或先除气再充填工作流体;如图5所示的薄板式热管1是利用该充填除气管25进行充填、除气作业;而图10所示的薄板式热管1’则利用位于侧边的充填孔(图未示),与该上薄板22的除气孔224分别进行充填、除气作业。Step 160 is filling and degassing operations: filling and degassing the hollow chamber 23 of the
步骤170为封口作业:使经过充填、除气作业后的中空腔室23恒维持真空状态,即密闭如图5所示的充填除气管25,或密闭如图10所示的除气孔224。Step 170 is the sealing operation: keep the hollow chamber 23 after filling and degassing operations in a constant vacuum state, that is, seal the filling and degassing
实务上,为密闭如图5所示的充填除气管25,是利用一如图8所示的夹具5先夹扁该充填除气管25,再以一裁剪机具6剪断经夹合加工作业所产生的一扁平封口端部(即封嘴部位),并于剪断后施予封口密闭;该封口密闭方式为利用为如图9所示的雷射装置100予以焊接密闭,或利用点胶密闭。In practice, in order to seal the filling and degassing
另外,如图16所示,为密闭如图10所示的除气孔224,可利用一封口机构110达成,该封口机构110包括一套接在该除气孔224上的腔室111、一设置在该腔室111的顶部的玻璃112、一设置在该腔室111的底部的O型环113、一位于该腔室111上方的雷射装置114,及位于该腔室111的两相对外侧的一球体供给装置115与一除气装置116;使用时,该除气装置116透过该腔室111对该薄板组合体2’的中空腔室(图未示)除气后,该球体供给装置115将送出一金属球1151卡抵定位在该除气孔224上,最后利用该雷射装置114焊接密闭该除气孔224,达到封口气密效果;于实务上亦可利用一注胶装置(图未示)灌胶密闭该除气孔224,达到封口气密效果。In addition, as shown in FIG. 16, in order to seal the
此外,为密闭如图10所示的除气孔224,亦可利用一夹扁该除气孔224的夹具(图未示),再利用一雷射装置(图未示)发出一高能量的雷射光在该除气孔224的变形部位上,而可同时扫断、熔接该变形部位的末端段,达到封口气密效果;或利用一压扁该除气孔224的治具(图未示),再利用一雷射装置焊接密闭该除气孔224,达到封口气密效果。In addition, in order to seal the
Claims (26)
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| CN 200310118555 CN1627032A (en) | 2003-12-12 | 2003-12-12 | Thin plate heat pipe and manufacturing method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453957C (en) * | 2006-02-21 | 2009-01-21 | 奇鋐科技股份有限公司 | Flat-plate heat pipe and manufacturing method and packaging unit thereof |
| CN100582635C (en) * | 2005-09-23 | 2010-01-20 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe sealing structure and heat pipe |
| CN101738114B (en) * | 2008-11-25 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Flat plate type heat pipe and manufacture method thereof |
| CN103712497A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin deflector tube |
| CN105592664A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | heat pipe structure |
| CN105588463A (en) * | 2014-10-22 | 2016-05-18 | 奇鋐科技股份有限公司 | Thin heat pipe structure |
| CN105658024A (en) * | 2014-11-13 | 2016-06-08 | 奇鋐科技股份有限公司 | Carrier with heat radiation structure |
| CN105940278A (en) * | 2014-02-04 | 2016-09-14 | Lg电子株式会社 | Mobile terminal |
| TWI642892B (en) * | 2017-11-07 | 2018-12-01 | 奇鋐科技股份有限公司 | Straight-through structure of heat dissipation unit |
| US10473404B2 (en) | 2017-11-14 | 2019-11-12 | Asia Vital Components Co., Ltd. | Straight-through structure of heat dissipation unit |
| CN110953907A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Production method of intermediate product of multiple temperature equalizing plates and temperature equalizing plate |
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2003
- 2003-12-12 CN CN 200310118555 patent/CN1627032A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100582635C (en) * | 2005-09-23 | 2010-01-20 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe sealing structure and heat pipe |
| CN100453957C (en) * | 2006-02-21 | 2009-01-21 | 奇鋐科技股份有限公司 | Flat-plate heat pipe and manufacturing method and packaging unit thereof |
| CN101738114B (en) * | 2008-11-25 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Flat plate type heat pipe and manufacture method thereof |
| CN103712497A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin deflector tube |
| CN105940278A (en) * | 2014-02-04 | 2016-09-14 | Lg电子株式会社 | Mobile terminal |
| CN105588463A (en) * | 2014-10-22 | 2016-05-18 | 奇鋐科技股份有限公司 | Thin heat pipe structure |
| CN105588463B (en) * | 2014-10-22 | 2018-12-07 | 奇鋐科技股份有限公司 | thin heat pipe structure |
| CN105592664A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | heat pipe structure |
| CN105658024A (en) * | 2014-11-13 | 2016-06-08 | 奇鋐科技股份有限公司 | Carrier with heat radiation structure |
| TWI642892B (en) * | 2017-11-07 | 2018-12-01 | 奇鋐科技股份有限公司 | Straight-through structure of heat dissipation unit |
| US10473404B2 (en) | 2017-11-14 | 2019-11-12 | Asia Vital Components Co., Ltd. | Straight-through structure of heat dissipation unit |
| CN110953907A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Production method of intermediate product of multiple temperature equalizing plates and temperature equalizing plate |
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