CN1621448A - Silicone rubber composition for electrode circuit protection, electrode circuit protection material, and electric and electronic parts - Google Patents
Silicone rubber composition for electrode circuit protection, electrode circuit protection material, and electric and electronic parts Download PDFInfo
- Publication number
- CN1621448A CN1621448A CNA2004100852991A CN200410085299A CN1621448A CN 1621448 A CN1621448 A CN 1621448A CN A2004100852991 A CNA2004100852991 A CN A2004100852991A CN 200410085299 A CN200410085299 A CN 200410085299A CN 1621448 A CN1621448 A CN 1621448A
- Authority
- CN
- China
- Prior art keywords
- rubber composition
- circuit protection
- electrode circuit
- component
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 40
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 title claims description 19
- 229910001410 inorganic ion Inorganic materials 0.000 claims abstract description 14
- -1 polysiloxane Polymers 0.000 claims description 122
- 229920001296 polysiloxane Polymers 0.000 claims description 59
- 229920001971 elastomer Polymers 0.000 claims description 50
- 125000003342 alkenyl group Chemical group 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 22
- 239000003054 catalyst Substances 0.000 claims description 19
- 238000009833 condensation Methods 0.000 claims description 14
- 230000005494 condensation Effects 0.000 claims description 14
- 150000004678 hydrides Chemical class 0.000 claims description 14
- 229910000077 silane Inorganic materials 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- 230000007062 hydrolysis Effects 0.000 claims description 11
- 238000006460 hydrolysis reaction Methods 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 125000005372 silanol group Chemical group 0.000 claims description 10
- 150000001451 organic peroxides Chemical class 0.000 claims description 8
- 229910052787 antimony Inorganic materials 0.000 claims description 7
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 150000001450 anions Chemical group 0.000 claims 1
- 238000005342 ion exchange Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 22
- 238000005260 corrosion Methods 0.000 abstract description 14
- 230000007797 corrosion Effects 0.000 abstract description 14
- 238000003860 storage Methods 0.000 abstract description 4
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 239000011253 protective coating Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000005486 sulfidation Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 27
- 125000000217 alkyl group Chemical group 0.000 description 19
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 18
- 229920002554 vinyl polymer Polymers 0.000 description 18
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 17
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 12
- 239000000377 silicon dioxide Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 238000005984 hydrogenation reaction Methods 0.000 description 11
- 125000003545 alkoxy group Chemical group 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 10
- 229960001866 silicon dioxide Drugs 0.000 description 9
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- 125000004423 acyloxy group Chemical group 0.000 description 5
- 238000007259 addition reaction Methods 0.000 description 5
- 125000003302 alkenyloxy group Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005660 chlorination reaction Methods 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 5
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 5
- 238000005987 sulfurization reaction Methods 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 4
- HOPKHJSQWOIIQO-UHFFFAOYSA-N C[SiH2]C.[O] Chemical compound C[SiH2]C.[O] HOPKHJSQWOIIQO-UHFFFAOYSA-N 0.000 description 4
- 229910004283 SiO 4 Inorganic materials 0.000 description 4
- GJWAPAVRQYYSTK-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)amino]-dimethylsilicon Chemical compound C[Si](C)N[Si](C)C GJWAPAVRQYYSTK-UHFFFAOYSA-N 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 3
- 150000001449 anionic compounds Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000006038 hexenyl group Chemical group 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- 229910001412 inorganic anion Inorganic materials 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000005502 peroxidation Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical compound C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 241000723346 Cinnamomum camphora Species 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Natural products CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- PMDCZENCAXMSOU-UHFFFAOYSA-N N-ethylacetamide Chemical compound CCNC(C)=O PMDCZENCAXMSOU-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 125000005336 allyloxy group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- RJCQBQGAPKAMLL-UHFFFAOYSA-N bromotrifluoromethane Chemical compound FC(F)(F)Br RJCQBQGAPKAMLL-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 229960000846 camphor Drugs 0.000 description 2
- 229930008380 camphor Natural products 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N dimethylacetone Natural products CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 125000005469 ethylenyl group Chemical group 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000001327 prunus amygdalus amara l. extract Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- OMSXMOJHPOJGHP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy heptaneperoxoate Chemical compound CCCCCCC(=O)OOOC(C)(C)C OMSXMOJHPOJGHP-UHFFFAOYSA-N 0.000 description 1
- VMFJVWPCRCAWBS-UHFFFAOYSA-N (3-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 VMFJVWPCRCAWBS-UHFFFAOYSA-N 0.000 description 1
- ZRIPJJWYODJTLH-UHFFFAOYSA-N (4-benzylphenyl)-(4-chlorophenyl)methanone Chemical compound C1=CC(Cl)=CC=C1C(=O)C(C=C1)=CC=C1CC1=CC=CC=C1 ZRIPJJWYODJTLH-UHFFFAOYSA-N 0.000 description 1
- VXMQKONTARQGPP-UHFFFAOYSA-N (ethoxyamino)oxyethane Chemical compound CCONOCC VXMQKONTARQGPP-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- XXPDIMCYYQKHBX-UHFFFAOYSA-N 1,3-diaminooxy-2-hydroxyguanidine Chemical compound O(N)NC(=NO)NON XXPDIMCYYQKHBX-UHFFFAOYSA-N 0.000 description 1
- WIHIUTUAHOZVLE-UHFFFAOYSA-N 1,3-diethoxypropan-2-ol Chemical compound CCOCC(O)COCC WIHIUTUAHOZVLE-UHFFFAOYSA-N 0.000 description 1
- LVQFKRXRTXCQCZ-UHFFFAOYSA-N 1-(2-acetylphenyl)ethanone Chemical compound CC(=O)C1=CC=CC=C1C(C)=O LVQFKRXRTXCQCZ-UHFFFAOYSA-N 0.000 description 1
- JYAQYXOVOHJRCS-UHFFFAOYSA-N 1-(3-bromophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(Br)=C1 JYAQYXOVOHJRCS-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- IHEDBVUTTQXGSJ-UHFFFAOYSA-M 2-[bis(2-oxidoethyl)amino]ethanolate;titanium(4+);hydroxide Chemical compound [OH-].[Ti+4].[O-]CCN(CC[O-])CC[O-] IHEDBVUTTQXGSJ-UHFFFAOYSA-M 0.000 description 1
- JGWUKKFNKOUBPW-UHFFFAOYSA-N 2-ethenyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[SiH]1O[SiH2]O[SiH2]O[SiH2]O1 JGWUKKFNKOUBPW-UHFFFAOYSA-N 0.000 description 1
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- IAGCDJZAYOZMCS-UHFFFAOYSA-N 2-hydroxypropanoic acid;titanium Chemical compound [Ti].CC(O)C(O)=O IAGCDJZAYOZMCS-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
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- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
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- FTITZOMVBYFKFR-UHFFFAOYSA-N C(C)C(=O)CC.C(C)C1=C(C=CC=C1)CC Chemical compound C(C)C(=O)CC.C(C)C1=C(C=CC=C1)CC FTITZOMVBYFKFR-UHFFFAOYSA-N 0.000 description 1
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- UPWGGXLAZRGSTI-UHFFFAOYSA-N CCCC[Zr](CCCC)(CCCC)CCCC Chemical compound CCCC[Zr](CCCC)(CCCC)CCCC UPWGGXLAZRGSTI-UHFFFAOYSA-N 0.000 description 1
- QGCJTHLZNYNUKO-UHFFFAOYSA-N CN(C)C.N[SiH3] Chemical compound CN(C)C.N[SiH3] QGCJTHLZNYNUKO-UHFFFAOYSA-N 0.000 description 1
- WLGXLJGGAGAIDP-UHFFFAOYSA-N CN(C)C.[SiH3]Cl Chemical compound CN(C)C.[SiH3]Cl WLGXLJGGAGAIDP-UHFFFAOYSA-N 0.000 description 1
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- 239000005977 Ethylene Substances 0.000 description 1
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 241000863032 Trieres Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- VMFNFNLGPLHBNJ-UHFFFAOYSA-M azanium benzyl(triethyl)azanium diacetate Chemical compound C(C)(=O)[O-].[NH4+].C(C1=CC=CC=C1)[N+](CC)(CC)CC.C(C)(=O)[O-] VMFNFNLGPLHBNJ-UHFFFAOYSA-M 0.000 description 1
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- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 description 1
- ZPECUSGQPIKHLT-UHFFFAOYSA-N bis(ethenyl)-dimethoxysilane Chemical compound CO[Si](OC)(C=C)C=C ZPECUSGQPIKHLT-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
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- 125000000753 cycloalkyl group Chemical group 0.000 description 1
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- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
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- 238000009826 distribution Methods 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
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- 210000000981 epithelium Anatomy 0.000 description 1
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- 235000019439 ethyl acetate Nutrition 0.000 description 1
- BOIMYFSVSNOKFY-UHFFFAOYSA-N ethyl-dimethoxy-(7-oxabicyclo[4.1.0]heptan-6-ylmethoxy)silane Chemical compound C1CCCC2OC21CO[Si](OC)(OC)CC BOIMYFSVSNOKFY-UHFFFAOYSA-N 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229960001708 magnesium carbonate Drugs 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- VMESOKCXSYNAKD-UHFFFAOYSA-N n,n-dimethylhydroxylamine Chemical compound CN(C)O VMESOKCXSYNAKD-UHFFFAOYSA-N 0.000 description 1
- NCCHARWOCKOHIH-UHFFFAOYSA-N n-methylbenzamide Chemical compound CNC(=O)C1=CC=CC=C1 NCCHARWOCKOHIH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PODAMDNJNMAKAZ-UHFFFAOYSA-N penta-2,3-diene Chemical compound CC=C=CC PODAMDNJNMAKAZ-UHFFFAOYSA-N 0.000 description 1
- TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical class CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
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- C—CHEMISTRY; METALLURGY
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Abstract
A silicone rubber composition for protecting an electrode circuit, characterized in that: the curable silicone rubber composition comprises 100 parts by mass of a curable silicone rubber composition and (B) 0.1 to 50 parts by mass of an inorganic ion exchanger as essential components. The silicone rubber composition of the present invention has low elasticity, cures at low temperature heating, room temperature storage or ultraviolet irradiation, and has excellent resistance to sulfidation corrosion, and therefore is useful, for example, as a protective coating agent for liquid crystal electrodes, PDP electrodes, plasma display electrodes, and protective coating agents for various electrical and electronic parts.
Description
Technical field
The present invention relates to be used for protecting metal electric, the electronic component telegraph circuit not to be subjected to the silicon rubber composition for electrode circuit protection of sulfide corrosion, electrode circuit protection material and electric, electronic component.
Background technology
In recent years, in electric, electronic component, the metal electrode circuit has been become big problem by sulfurations such as the vulcanizing agent of the sulfide in the atmosphere, rubber item, emission gases.
In this case; as protecting materials; metal-powders such as alkaline inorganic fillers such as interpolation lime carbonate or copper powder (patent documentation 1,2: the spy opens 2003-096301 communique, special former 2003-324171 number) have been proposed so far; but adopt this protecting materials in the past; exist preventing the corrosion of metal electrode circuit, prevent the inadequate problem in sulfuration aspect.
Patent documentation 1: the spy opens the 2003-096301 communique
Patent documentation 2: special former 2003-324171 number
Summary of the invention
Therefore, though problem of the present invention be to provide in the presence of sulfide also can the guard electrode circuit metal not be protected by sulfuration, corrosive silicon rubber composition for electrode circuit protection, electrode circuit protection material and telegraph circuit not cure, corrosive is electric, electronic component.
The present inventor has carried out research with keen determination in order to solve above-mentioned problem; it found that: for curable silicone rubber composition; by cooperating inorganic ion exchanger; particularly inorganic anion exchanger composed or inorganic zwitter-ion permutoid (amphoteric exchanger); in the presence of sulfide, can prevent the sulfuration of metal; corrosion; in this case; as operable curable silicone rubber composition; can use and to make it the solidified Thermocurable silicone rubber composition by the siloxanes that contains vinyl is reacted under the platinum family series catalysts with the siloxanes that contains the hydrogenation silyl; in the presence of condensation catalyst, make the siloxanes that contains silanol group and alkoxyl group carry out condensation reaction and solidified room temperature curing type rubber composition; and in substituting group, has a ultraviolet hardening rubber composition that has added Photoepolymerizationinitiater initiater in the polymkeric substance of acryl; the organic peroxide curing type rubber composition, thus the present invention finished.
Therefore, the invention provides silicon rubber composition for electrode circuit protection, it is characterized in that: with
(A) curable silicone rubber composition 100 mass parts,
(B) inorganic ion exchanger 0.1～50 mass parts is must component.In addition, the invention provides electrode circuit protection material that the cured article by above-mentioned silicon rubber composition for electrode circuit protection constitutes and electric, the electronic component that coats the guard electrode circuit with the cured article of this silicon rubber composition for electrode circuit protection.
Rubber composition of the present invention is because low elasticity; under low-temperature heat, room temperature placement or uviolizing, solidify and anti-sulphur corrosion excellence, therefore useful for the protection coating agent and the various protection coating agent electric, electronic component of for example liquid crystal electrode, PDP electrode, plasma display electrode.
Embodiment
Silicon rubber composition for electrode circuit protection of the present invention has cooperated inorganic ion exchanger in curable silicone rubber composition, but this curable silicone rubber composition uses known material.
Specifically, as the rubber composition that uses among the present invention, can enumerate the organopolysiloxane composition of addition curable, ultraviolet hardening, electron(beam)curing type, organic peroxide curing type, condensation cured type etc.As the addition curable rubber composition, for example can enumerate to make in the middle of molecular chain two ends, the molecular chain in the presence of the platinum family series catalysts or to have the straight chain shape diorganopolysiloxaneand of alkenyl such as vinyl in the middle of molecular chain two ends and the molecular chain and organic hydride polysiloxane reaction (hydrosilylation addition reaction) and the addition curable rubber composition that obtains.As the ultraviolet hardening rubber composition, it can be made of any consolidated structures for using the ultraviolet energy solidified rubber composition of wavelength 200～400nm basically.Specifically; be included in the acryl type siloxane that added Photoepolymerizationinitiater initiater in the organopolysiloxane with acryl or methacryloyl, in the organopolysiloxane that contains sulfydryl and organopolysiloxane, added with alkenyls such as vinyl Photoepolymerizationinitiater initiater sulfydryl-vinyl addition polymerization class, used the platinum family series catalysts identical with the Thermocurable addition reaction-type the addition reaction class, have in the organopolysiloxane of epoxy group(ing) and added cationoid polymerisation class of salt catalyst etc., can use any.As electron(beam)curing type rubber composition, can use having the organopolysiloxane irradiation electron rays of free-radical polymerised group, make any rubber composition of its solidified by radical polymerization.In addition, as the organic peroxide curing type rubber composition, can be set forth in organo-peroxide and have the rubber composition that makes the above-mentioned straight chain shape diorganopolysiloxaneand that contains alkenyl carry out radical polymerization down and obtain.As condensation cured type rubber composition, for example can enumerate and in the presence of condensation catalysts such as organotin series catalysts, make the end capped diorganopolysiloxaneand of two terminal silanol groups and organic hydride polysiloxane or tetraalkoxysilane, the reaction of water-disintegrable silane such as organotrialkoxysilane or its partial hydrolysis condenses and the rubber composition that obtains, in the presence of condensation catalysts such as organotin series catalysts, make the two terminal tri-alkoxy siloxyies of using, the organic siloxy-of dialkoxy, tri-alkoxy silicomethane oxygen ethyl, the organic silicomethane oxygen of dialkoxy ethyl etc. contains the siloxy-of alkoxyl group or contains the reaction of the end capped diorganopolysiloxaneand of alkoxy silicane oxyalkyl and the rubber composition that obtains etc.
More specifically say, as the addition curable rubber composition, can enumerate particularly by
(a) contain more than 2 organopolysiloxane with Siliciumatom bonded alkenyl in 1 molecule,
(b) have more than 2 and organic hydride polysiloxane Siliciumatom bonded hydrogen atom (being the SiH yl) in 1 molecule, wherein, with Siliciumatom bonded hydrogen atom be 0.1～5.0 with respect to the mol ratio in (a) component with Siliciumatom bonded alkenyl,
(c) the platinum family series catalysts of catalytic amount
The addition curable rubber composition that constitutes.
Be used for containing in 1 molecule (a) component of addition curable rubber composition more than 2 organopolysiloxane with Siliciumatom bonded alkenyl, be known organopolysiloxane as the stock polymer of addition curable rubber composition, weight-average molecular weight is generally about 3000～300000, has 100～1000000mPas under the preferred normal temperature (25 ℃), the organopolysiloxane that especially preferably has 200～100000mPas left and right sides viscosity can use the organopolysiloxane shown in the following average group accepted way of doing sth (1).
R
1aSiO
(4-a)/2(1)
(in the formula, R
1Be the C that is same to each other or different to each other
1～10, preferred C
1～8Non-replacement or 1 valency alkyl of replacement, a is 1.5～2.8, the positive number of preferred 1.8～2.5, more preferably 1.95～2.05 scopes.)
As above-mentioned R
1Shown and 1 valency alkyl non-replacement of Siliciumatom bonded or replacement, can enumerate for example methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, the tertiary butyl, amyl group, neo-pentyl, hexyl, cyclohexyl, octyl group, nonyl, alkyl such as decyl, phenyl, tolyl, xylyl, aryl such as naphthyl, benzyl, styroyl, aralkyl such as hydrocinnamyl, vinyl, allyl group, propenyl, pseudoallyl, butenyl, hexenyl, cyclohexenyl, alkenyls such as octenyl, part or all of the hydrogen atom of these groups is by fluorine, bromine, halogen atoms such as chlorine, the group that cyano group etc. replace, for example chloromethyl, chloropropyl, bromotrifluoromethane, trifluoro propyl, cyanoethyl etc.
In this case, necessarily, R
1In at least 2 (be preferably C especially for alkenyl
2～3Group, C more preferably
2～6Group).In addition, the content of alkenyl preferably with the whole organic groups of Siliciumatom bonded in (be in the above-mentioned average group accepted way of doing sth (1) as R
1Non-replacement or 1 valency alkyl of replacement in) be 0.01～20 mole of %, be preferably 0.1～10 mole of % especially.This alkenyl can combine with the Siliciumatom of molecule chain end, also can combine with molecular chain intermediary Siliciumatom, can also combine with both, but from the curing speed of composition, the aspects such as rerum natura of cured article, the organopolysiloxane that uses among preferred the present invention contains the Siliciumatom bonded alkenyl with molecule chain end at least.
The structure of above-mentioned organopolysiloxane is generally main chain by diorganosiloxane repeating unit ((R
1)
2SiO
2/2The unit) constitute, molecule chain end is by three organic radical siloxy-((R
1)
3SiO
1/2The unit) the end capped diorganopolysiloxaneand that has straight chain structure basically, but also can be partly for containing R
1SiO
3/2Unit and SiO
4/2Unitary branch-like structure, ring texture etc.
The substituting group of Siliciumatom is essentially above-mentioned any group, as alkenyl, and preferred vinyl, as other substituting group, preferable methyl, phenyl.
As the example of (a) component, can enumerate the compound shown in the following general formula etc.
R in the above-mentioned general formula and R
1Identical, but do not contain alkenyl.M, n are the integer of m 〉=1, n 〉=0, and m+n is that to make the molecular weight of this organopolysiloxane or viscosity be the number of above-mentioned value.
(b) the organic hydride polysiloxane of component is to have more than 2 and organic hydride polysiloxane Siliciumatom bonded hydrogen atom (SiH yl) in 1 molecule.Here, (b) component and (a) component reaction, play the effect of linking agent, there is no particular restriction for its molecular structure, can use in the past the material of for example wire made, ring-type, branch-like, tridimensional network various structures such as (arborescens), but must in 1 molecule, have more than 2 with Siliciumatom bonded hydrogen atom (SiH yl), preferably have 2～200, more preferably have 3～100.As the organic hydride polysiloxane, can use material shown in the following average group accepted way of doing sth (2).
R
2 bH
cSiO
(4-b-c)/2??(2)
In following formula (2), R
2Be C
1～10Non-replacement or 1 valency alkyl of replacement, as this R
2, can enumerate with above-mentioned formula (1) in R
1Identical group.In addition, b is 0.7～2.1, and c is 0.001～1.0, and for b+c satisfies 0.8～3.0 positive number, preferred b is 1.0～2.0, and c is 0.01～1.0, and b+c is 1.5～2.5.
At least contain 2, preferred 3 above SiH bases in 1 molecule, can be positioned at molecule chain end, any position of molecular chain intermediary, or be positioned at this two kinds of positions.In addition, the molecular structure of this organic hydride polysiloxane can be for straight chain shape, ring-type, branch-like, tridimensional network any, but wish that it is that Siliciumatom number (or polymerization degree) in 1 molecule is generally 2～300, the room temperature (25 ℃) that is preferably about 4～150 is the organic hydride polysiloxane of liquid down.
Organic hydride polysiloxane as formula (2), particularly, for example can enumerate 1,1,3, the 3-tetramethyl disiloxane, 1,3,5, the 7-tetramethyl-ring tetrasiloxane, three (hydrogenation dimethylsilane oxygen base) methyl-monosilane, three (hydrogenation dimethylsilane oxygen base) phenyl silane, the hydrogenated methyl cyclopolysiloxane, hydrogenated methyl siloxanes-dimethyl siloxane cyclocopolymer, the end capped hydrogenated methyl polysiloxane of two terminal trimethylsiloxy, two terminal trimethylsiloxy end-blocking dimethyl siloxane-hydrogenated methyl silicone copolymers, the end capped dimethyl polysiloxane of two terminal dimethyl hydrogenation siloxyies, the end capped dimethyl siloxane of two terminal dimethyl hydrogenation siloxyies-hydrogenated methyl silicone copolymers, the end capped hydrogenated methyl siloxanes of two terminal trimethylsiloxy-diphenyl siloxane multipolymer, the end capped hydrogenated methyl siloxanes-diphenyl siloxane of two terminal trimethylsiloxy-dimethylsiloxane copolymer, the end capped hydrogenated methyl siloxanes-methylphenyl siloxane of two terminal trimethylsiloxy-dimethylsiloxane copolymer, the end capped hydrogenated methyl siloxanes-dimethyl siloxane of two terminal dimethyl hydrogenation siloxyies-diphenyl siloxane multipolymer, the end capped hydrogenated methyl siloxanes-dimethyl siloxane of two terminal dimethyl hydrogenation siloxyies-methylphenyl siloxane multipolymer, by (CH
3)
2HSiO
1/2Unit and (CH
3)
3SiO
1/2Unit and SiO
4/2The multipolymer that the unit constitutes, by (CH
3)
2HSiO
1/2Unit and SiO
4/2The multipolymer that the unit constitutes, by (CH
3)
2HSiO
1/2Unit and SiO
4/2Unit and (C
6H
5)
3SiO
1/2The multipolymer that the unit constitutes etc.
Addition that should (b) component, for Siliciumatom bonded hydrogen atom be 0.1～5.0 normal amount with respect to the mol ratio in 1 (a) component with Siliciumatom bonded alkenyl, preferred 0.5～3.0 equivalent, more preferably 0.8～2.0 normal scope.When than 0.1 equivalent after a little while, it is low that cross-linking density became, to the thermotolerance generation detrimentally affect of solidified silicon rubber.In addition, when for a long time,, also thermotolerance is produced detrimentally affect owing to dehydrogenation reaction produces the problem of foaming than 5.0 equivalents.
(c) the platinum family series catalysts of component is as promoting (a) component and (b) catalyzer of the curing addition reaction (hydrosilylation) of component.The platinum family series catalysts can use known material, but preferably uses platinum or platinic compound.Platinic compound can be enumerated the complex compound etc. of pure modifier, chlorination platinic acid and alkene, aldehyde, vinylsiloxane or the acetylene series alcohols etc. of platinum black, platinum chloride, chlorination platinic acid, chlorination platinic acid.
The use level of this platinum family series catalysts can suitably increase and decrease according to desirable curing speed, and for (a) component, the platinum amount is generally 0.1～1000ppm, the scope of preferred 1～200ppm.
As the ultraviolet hardening rubber composition, particularly, can enumerate
(d) ultraviolet reactive organopolysiloxane,
(e) Photoepolymerizationinitiater initiater
The ultraviolet hardening rubber composition that constitutes.
(d) the ultraviolet reactive organopolysiloxane of component, in the ultraviolet hardening rubber composition, play a role as stock polymer usually, be not particularly limited, at least have 2 in preferred 1 molecule, more preferably have 2～20, especially preferably have the organopolysiloxane of 2～10 ultraviolet reactive groups.In addition, in above-mentioned polymer molecule, exist a plurality of above-mentioned ultraviolet reactive groups can be all identical, also can be different.
Organopolysiloxane with above-mentioned ultraviolet reactive group, in the middle of its molecule chain end and/or the molecular chain, preferably molecular chain two ends have ultraviolet reactive group at least.As this ultraviolet ray reactive group; can enumerate for example alkenyloxies such as vinyl, allyl group, propenyl, vinyloxy group, allyloxy, propenyloxy group, different propenyloxy group; unsaturated group of aliphatic series such as acryl, methacryloyl; sulfydryl; epoxy group(ing); the hydrogenation silyl, preferred acryl, methacryloyl, sulfydryl, epoxy group(ing), hydrogenation silyl, more preferably acryl, methacryloyl.
The viscosity of above-mentioned organopolysiloxane is not particularly limited, and is down that more preferably 100～10000000mPas is preferably 100～100000mPas especially more than the 25mPas at 25 ℃ preferably.
The preferred main chain of this organopolysiloxane is made of the diorganosiloxane repeating unit basically, molecular chain two is terminal with end capped straight chain structures of three organic radical silyl substituted alkyls such as three organic radical siloxyies or three organic radical silyl ethyls, also can partly contain trifunctional siloxane unit or SiO
2Branch-like structures such as unit.
As a preferred configuration of (d) component, can enumerate for example following general formula (3a)
[in the formula, R
3Identical or different, be 1 valency alkyl of non-replacement or replacement, R
4Identical or different, for having the group of ultraviolet reactive group, R
5For having the group of ultraviolet reactive group, m is 5～1000 integer, and n is 0～100 integer, and p is 0～3 integer, and q is 0～3 integer, p+q+n 〉=2.]
Or following general formula (3b)
[in the formula, R
3, R
4And R
5Identical or different separately, with middle define identical of above-mentioned formula (3a), definition is identical in m, n, p and q and the above-mentioned formula (3a), and k is 2～4 integer, and r and s are respectively 1～3 integer, pr+qs+n 〉=2.]
Shown organopolysiloxane with at least 2 ultraviolet reactive groups.
Above-mentioned formula (3a) and (3b) in, R
3For not having ultraviolet reactive group, be generally C
1～20, preferred C
1-10, more preferably C
1～81 valency alkyl.As R
31 shown valency alkyl, can enumerate for example methyl, ethyl, propyl group, butyl, sec.-propyl, isobutyl-, the tertiary butyl, hexyl, the 2-ethylhexyl, the 2-ethyl-butyl, alkyl such as octyl group, cyclohexyl, cycloalkyl such as cyclopentyl, alkenyls such as hexenyl, phenyl, tolyl, xylyl, naphthyl, aryl such as xenyl, benzyl, aralkyl such as styroyl, with part or all of the carbon atom bonded hydrogen atom of these groups by halogen atom, cyano group, amino, the group that carboxyl etc. replace, or has a group of above-mentioned functional group, chloromethyl for example, trifluoro propyl, the 2-cyanoethyl, 3-cyanogen propyl group etc., preferable methyl, phenyl, more preferably methyl.In addition, can be at above-mentioned R
3Have alkylsulfonyl more than a kind or 2 kinds, ehter bond (O-), carbonyl etc. in the skeleton of 1 shown valency alkyl.
Above-mentioned formula (3a) and (3b) in, as R
4And R
5Shown in have the ultraviolet reactive group that group contained of ultraviolet reactive group; can enumerate for example alkenyloxies such as vinyl, allyl group, propenyl, vinyloxy group, allyloxy, propenyloxy group, different propenyloxy group; unsaturated group of aliphatic series such as acryl, methacryloyl; sulfydryl, epoxy group(ing), hydrogenation silyl etc.; preferred acryl, methacryloyl, sulfydryl, epoxy group(ing), hydrogenation silyl, more preferably acryl, methacryloyl.Therefore, R
4And R
5Shown in have the group of ultraviolet reactive group; can be above-mentioned illustrative 1 valency group with ultraviolet reactive group; can enumerate for example vinyl; allyl group; 3-glycidoxy propyl group; 2-(3; the 4-epoxycyclohexyl) ethyl; the 3-methacryloxypropyl; 3-acryloxy propyl group; 3-mercapto propyl group; two (2-methacryloxy oxyethyl group) the methyl-silicane bases of 2-{ } ethyl; 2-{ (2-methacryloxy oxyethyl group) dimetylsilyl } ethyl; two (2-acryloyl-oxy base oxethyl) the methyl-silicane bases of 2-{ } ethyl; 2-{ (2-acryloyl-oxy base oxethyl) dimetylsilyl } ethyl; 2-{ two (1; 3-dimethyl allene acyloxy-2-propoxy-) methyl-silicane base } ethyl; 2-{ (1; 3-dimethyl allene acyloxy-2-propoxy-) dimetylsilyl } ethyl; two (1-acryloxy-3-methacryloxy-2-propoxy-) the methyl-silicane bases of 2-{ } ethyl; 2-{ (1-acryloxy-3-methacryloxy-2-propoxy-) dimetylsilyl } ethyl etc.; preferred 3-methacryloyl propyl group; 3-acryloxy propyl group; two (2-methacryloxy oxyethyl group) the methyl-silicane bases of 2-{ } ethyl; 2-{ (2-methacryloxy oxyethyl group) dimetylsilyl } ethyl; two (2-acryloyl-oxy base oxethyl) the methyl-silicane bases of 2-{ } ethyl; 2-{ (2-acryloyl-oxy base oxethyl) dimetylsilyl } ethyl; 2-{ two (1; 3-dimethyl allene acyloxy-2-propoxy-) methyl-silicane base } ethyl; 2-{ (1; 3-dimethyl allene acyloxy-2-propoxy-) dimetylsilyl } ethyl; two (1-acryloxy-3-methacryloxy-2-propoxy-) the methyl-silicane bases of 2-{ } ethyl; 2-{ (1-acryloxy-3-methacryloxy-2-propoxy-) dimetylsilyl } ethyl; more preferably 3-acryloxy propyl group; two (2-methacryloxy oxyethyl group) the methyl-silicane bases of 2-{ } ethyl; 2-{ (2-methacryloxy oxyethyl group) dimetylsilyl } ethyl; 2-{ (2-acryloyl-oxy base oxethyl) dimetylsilyl } ethyl; two (1,3-dimethyl allene acyloxy-2-propoxy-) the methyl-silicane bases of 2-{ } ethyl; two (1-acryloxy-3-methacryloxy-2-propoxy-) the methyl-silicane bases of 2-{ } ethyl.Above-mentioned R
4And R
5Can be identical, also can be different.
In above-mentioned formula (3a) with (3b), m is preferably 10～800, more preferably 50～500 integer.N is preferably 0～50, more preferably 0～20 integer.In above-mentioned formula (3b), k is preferably 2 or 3.P is preferably 0～2 integer, and more preferably 1 or 2.Q is preferably 0～2 integer, and more preferably 1 or 2.R and s are preferably 1 or 2 respectively.In addition, above-mentioned formula (3a) and (3b) shown in organopolysiloxane, as mentioned above,, therefore in formula (3a), must make p+q+n 〉=2 owing to have at least 2 above-mentioned ultraviolet reactive groups, in formula (3b), must make pr+qs+n 〉=2.
As above-mentioned formula (3a) or the concrete example of the organopolysiloxane (3b), can enumerate material for example shown below.
[in the formula, R
690% be methyl, 10% is phenyl]
(e) Photoepolymerizationinitiater initiater of component has the photopolymerisable effect that promotes above-mentioned (d) component middle-ultraviolet lamp reactive group.Be not particularly limited as this Photoepolymerizationinitiater initiater; can enumerate for example methyl phenyl ketone; Propiophenone; benzophenone; キ サ Application ト one Le; Off Le オ レ イ Application; phenyl aldehyde; anthraquinone; triphenylamine; the 4-methyl acetophenone; 3-amylbenzene ethyl ketone; the 4-methoxyacetophenone; the 3-bromoacetophenone; 4-allyl benzene ethyl ketone; to diacetyl benzene; the 3-methoxy benzophenone; 4-methyldiphenyl ketone; the 4-chlorobenzophenone; 4; 4 '-dimethoxy-benzophenone; 4-chloro-4 '-benzyl benzophenone; 3-chlorine xanthone; 3; 9-dichloro xanthone; 3-chlorine 8-nonyl xanthone; bitter almond oil camphor; benzoin methyl ether; the bitter almond oil camphor butyl ether; two (4-dimethylaminophenyl) ketone; benzyl methoxyl group acetal; the 2-clopenthixal ketone; the diethylbenzene ethyl ketone; the 1-hydroxycyclohexylphenylketone; 2-methyl-(4-(methylthio group) phenyl)-2-morpholinyl-1-propane; 2; 2-dimethoxy-2-phenyl methyl phenyl ketone; diethoxy acetophenone etc.; preferred benzophenone; the 4-methoxyacetophenone; 4-methyldiphenyl ketone; diethoxy acetophenone; 1-hydroxycyclohexylphenylketone, more preferably diethoxy acetophenone; the 1-hydroxycyclohexylphenylketone.
Above-mentioned Photoepolymerizationinitiater initiater can use a kind separately, also can more than 2 kinds and use.(e) use level of component is not particularly limited, and with respect to (d) component 100 mass parts, is generally 0.01～10 mass parts, preferred 0.1～3 mass parts, more preferably 0.5～3 mass parts.If this use level is 0.01～10 mass parts, the solidification compound that then makes preparation solidifies and physical property excellences such as the intensity of the curing rubber that obtains and tensile strength.
As the organic peroxide curing type rubber composition, particularly, can enumerate by
(f) contain in 1 molecule more than 2 with the organopolysiloxane of Siliciumatom bonded alkenyl,
(g) organo-peroxide
The organic peroxide curing type rubber composition of forming.
As organic peroxide curing type rubber composition main component (stock polymer)
(f) component is a following average group accepted way of doing sth (4)
R
7 dSiO
(4-d)/2??(4)
(in the formula, R
7Expression replaces or unsubstituted 1 valency alkyl, R
70.0001～10 mole of % be alkenyl, and 80 moles of % above be methyl.D is 1.9～2.4 positive number.) shown in 1 molecule on average have the organopolysiloxane of 2 alkenyls at least.
Here, R
7Be the C that is same to each other or different to each other
1～10, preferred C
1～8The 1 valency alkyl that does not replace or replace, d is 1.9～2.4, and is preferred 1.95～2.05, more preferably the positive number of 1.98～2.02 scopes.As above-mentioned R
7The shown 1 valency alkyl that does not replace or replace with the Siliciumatom bonded is with the R of an above-mentioned average group accepted way of doing sth (1)
1Identical, can enumerate methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, the tertiary butyl, amyl group, neo-pentyl, hexyl, cyclohexyl, octyl group, nonyl, alkyl such as decyl, phenyl, tolyl, xylyl, aryl such as naphthyl, benzyl, styroyl, aralkyl such as hydrocinnamyl, vinyl, allyl group, propenyl, pseudoallyl, butenyl, hexenyl, cyclohexenyl, alkenyls such as octenyl, part or all of the hydrogen atom of these groups is by fluorine, bromine, halogen atoms such as chlorine, the group that cyano group etc. replace, for example chloromethyl, chloropropyl, bromotrifluoromethane, halogen-substituted alkyls such as trifluoro propyl or cyanoethyl etc.
In this case, R
7In at least 2 be necessary for alkenyl (preferred C
2～8Alkenyl, more preferably C
2～6Alkenyl).In addition, the content of alkenyl is preferably at whole organic radicals (being the above-mentioned 1 valency alkyl that does not replace or replace) R
7In be 0.0001～10 mole of %, be preferably 0.001～5 mole of % especially.This alkenyl can combine with the Siliciumatom of molecule chain end, also can combine with molecular chain intermediary Siliciumatom, perhaps combines with both.
There is no particular restriction for the polymerization degree, can use under the normal temperature to aqueous that mean polymerisation degree is 50～20000 usually so that give birth to gelationus material, preferred 100～10000, and more preferably about 100～2000.
In addition, the structure of this organopolysiloxane is that main chain is by diorganosiloxane repeating unit (R basically
7 2SiO
2/2) constitute, have molecular chain two ends by three organic radical siloxy-(R
7 3SiO
1/2) or hydroxyl two organic radical siloxyies ((HO) R
7 2SiO
1/2) end capped straight chain structure, can partly be branch-like structure, ring texture etc. also.
As the organo-peroxide of (g) component, in the organic peroxide curing type organopolysiloxane composition, can use known substances in the past for catalyzer as the crosslinking reaction that promotes (f) component.Can enumerate for example benzoyl peroxide, peroxidation 2,4-dichloro-benzoyl, peroxidation are to toluyl, peroxidation o-methyl-benzene formyl, 2,4-two cumene peroxide, 2,5-dimethyl-two (2, the 5-t-butyl peroxy) hexane, ditertiary butyl peroxide, t-butylperoxyl benzoate, 1,1-two (t-butyl peroxy carboxyl) hexane etc., but be not limited to these materials.
In addition, the addition of organo-peroxide is a catalytic amount, can suitably select according to curing speed, is generally 0.1～10 mass parts, the scope of preferred 0.2～2 mass parts for (f) component 100 mass parts.
As condensation cured type rubber composition, particularly, can enumerate by
(h) in 1 molecule preferably molecular chain two ends have at least 2 silanol groups (being that Siliciumatom is in conjunction with hydroxyl) or Siliciumatom in conjunction with the organopolysiloxane of hydrolization group,
(i) as the water-disintegrable silane of any component or its partial hydrolysis condenses,
(j) condensation catalyst of any component of conduct
The condensation cured type rubber composition of forming.
(h) component is the stock polymer of condensation cured type rubber composition, molecular chain two ends have silanol group or with the organopolysiloxane of Siliciumatom bonded hydrolization group in, as the hydrolization group beyond the silanol group, can enumerate for example acetoxyl group, hot acyloxy, acyloxy such as benzoyloxy, the dimethyl ketone oximido, the methyl ethyl ketone oximido, ketoxime bases (being inferior aminooxy) such as metacetone oximido, methoxyl group, oxyethyl group, alkoxyl groups such as propoxy-, methoxy ethoxy, ethoxy ethoxy, alkoxyl group alkoxyl groups such as methoxy propoxy, vinyloxy group, different propenyloxy group, 1-ethyl-alkenyloxies such as 2-ethylene methacrylic oxygen base, dimethylamino, diethylin, fourth amino, amino such as hexamethylene amino, the diformazan aminooxy, aminooxy such as diethyl aminooxy, N-methylacetamide base, N-ethyl acetamide base, amide group such as N-methyl-benzamide base.
Preferred these hydrolization groups, for example with the tri-alkoxy siloxy-, dialkoxy organic radical siloxy-, three acyloxy siloxyies, two acyloxy organic radical siloxyies, Sanya aminooxy siloxy-(being triketone oximido siloxy-), two inferior aminooxy organic radical siloxyies, three alkenyloxy siloxyies, two alkenyloxy organic radical siloxyies, tri-alkoxy siloxy-ethyl, dialkoxy organic radical siloxy-ethyl etc. contains the siloxy-of 2 or 3 hydrolysis decomposability groups or contains the forms such as silicomethane oxyalkyl of 2 or 3 hydrolysis decomposability groups, is positioned at molecular chain two ends of straight chain shape diorganopolysiloxaneand.
As with other Siliciumatom bonded 1 valency alkyl, can enumerate with above-mentioned addition curable rubber composition in as R in (a) component average group accepted way of doing sth (1) of stock polymer
1The 1 valency alkyl that does not replace or replace that shown group is identical.
As the concrete example of this organopolysiloxane, can enumerate for example end capped dimethyl polysiloxane of molecular chain two terminal silanol groups, the end capped dimethyl siloxane of molecular chain two terminal silanol groups-methylphenyl siloxane multipolymer, the end capped dimethyl siloxane of molecular chain two terminal silanol groups-diphenyl siloxane multipolymer, the end capped dimethyl polysiloxane of molecular chain two terminal trimethoxy siloxyies, the end capped dimethyl siloxane of molecular chain two terminal trimethoxy siloxyies-methylphenyl siloxane multipolymer, the end capped dimethyl siloxane of molecular chain two terminal trimethoxy siloxyies-diphenyl siloxane multipolymer, the end capped dimethyl polysiloxane of molecular chain two terminal methyl group dimethoxy siloxyies, the end capped dimethyl polysiloxane of molecular chain two terminal triethoxy-silicane oxygen bases, the dimethyl polysiloxane of molecular chain two terminal 2-trimethoxy siloxy-ethyl cappings etc.These can use a kind separately, also can be used in combination more than 2 kinds.
(i) contain (promptly at least 1 of at least 3 silane that combine hydrolization group with Siliciumatom or its partial hydrolysis condenses in 1 molecule of component, the remaining organopolysiloxane of preferred hydrolization group more than 2) for playing the component of solidifying agent effect, when the stock polymer of (h) component contains at least 2 silanol groups in 1 molecule beyond with Siliciumatom bonded hydrolization group the time, can be omitted in the cooperation in the composition.As above-mentioned silane, preferred formula: R
8 eSiX
4-e(in the formula, R
8Be to replace or unsubstituted 1 valency alkyl, X is a hydrolization group, and e is 0 or 1) shown in silane.As above-mentioned R
8, alkyl such as special preferable methyl, ethyl, alkenyls such as vinyl, allyl group, propenyl, aryl such as phenyl.As above-mentioned X, can enumerate with above-mentioned (h) component in as and the identical group of the illustrative group of Siliciumatom bonded hydrolization group, can enumerate for example alkoxyl group, alkenyloxy, ketoxime base, acyloxy, amino, aminooxy etc.
As the concrete example of this silane or its partial hydrolysis condenses, can enumerate for example Union carbide A-162, vinyltriethoxysilane, vinyltriacetoxy silane, tetraethoxy etc. and their partial hydrolysis condenses.These can use a kind separately, also can be used in combination more than 2 kinds.
In this composition, the content of above-mentioned silane or its partial hydrolysis condenses, usually relative (h) component 100 mass parts are preferably 0.01～20 mass parts, are preferably 0.1～10 mass parts especially.If this contains the lower limit of the above-mentioned scope of quantity not sufficient, then the storage stability of Zhi Bei composition reduces, or has the cementability downward trend, on the other hand, if surpass the upper limit of above-mentioned scope, the tendency that then exists the curing of the composition of preparation significantly to slow down.
In addition, (j) condensation catalyst of component is any composition, when above-mentioned silane or its partial hydrolysis condenses for example have aminooxy, amino, ketoxime base etc., can not use.As this condensation catalyst, can enumerate for example organic titanate such as tetrabutyl titanate, titanium isopropylate; Diisopropoxy two (methyl aceto acetate) closes titanium, diisopropoxy two (ethyl acetoacetic ester) closes organic titanium huge legendary turtle compounds such as titanium; Tri acetylacetonato closes aluminium, three (methyl aceto acetate) and closes organo-aluminium compounds such as aluminium; Four (methyl ethyl diketones) close organic zirconates such as zirconium, tetrabutyl zirconium; Organo-tin compounds such as two sad two fourth tin, dibutyl tin dilaurate, two (2-ethylhexanoate) two fourth tin; The metal-salt of organic carboxyl acids such as naphthenic acid tin, oleic acid tin, butyric acid tin, cobalt naphthenate, Zinic stearas; Amine compound and salt thereof such as hexylamine, phosphoric acid lauryl amine; Quaternary ammonium salts such as benzyl triethyl ammonium ammonium acetate; Alkali-metal lower aliphatic hydrochlorate such as Potassium ethanoate, lithium nitrate; Dialkyl group oxyamines such as dimethyl hydroxyl amine, diethyl oxyamine; Contain the silicoorganic compound of guanidine radicals etc.These can use a kind separately, also can be used in combination more than 2 kinds.
In this composition, when using the condensation catalyst of above-mentioned (j) component, there is no particular restriction for its use level, can be significant quantity as catalyzer, usually with respect to (h) component 100 mass parts, be preferably 0.01～20 mass parts, be preferably 0.1～10 mass parts especially.When using this catalyzer, if the lower limit that contains the above-mentioned scope of quantity not sufficient of this catalyzer, then since the composition that the difference of linking agent kind prepares sometimes can not solidify fully, on the other hand, if surpass the upper limit of above-mentioned scope, then the storage stability of the composition of preparation descends sometimes.
(B) component that contains in the silicon rubber composition for electrode circuit protection of the present invention is an inorganic ion exchanger, is preferably inorganic anion exchanger composed or inorganic zwitter-ion permutoid.
As inorganic ion exchanger, can enumerate for example following compound.Aluminosilicate such as natural zeolite, synthetic zeolite; Metal oxide such as aluminum oxide, magnesium oxide; Oxyhydroxide or hydrous oxides such as oxidizing aqueous titanium, oxidizing aqueous bismuth, oxidizing aqueous antimony; Acid-salt such as zirconium phosphate, titanium phosphate; Basic salt or compound hydrous oxides such as hydrotalcite; Assorted Tripyrophosphoric acid classes such as phospho-molybdic acid antimony; Or six cyano group iron (III) salt or six cyano group zinc etc., wherein, the viewpoint of the ionic impurity under resistance to chemical reagents and the moisture-proof condition can be the oxyhydroxide or the hydrous oxide of metal, preferred oxidizing aqueous titanium, oxidizing aqueous bismuth, oxidizing aqueous antimony etc.
Wherein, preferred anionic exchange and do not contain bismuth system, the aluminium system of antimony, the inorganic ion exchanger of zirconium system.As the preferred concrete example of the inorganic ion exchanger of (B) component, can enumerate the IXE of East Asia synthetic (strain), trade(brand)name comprises IXE500, IXE530, IXE550, IXE700, IXE700F, IXE800 etc.In addition, can illustrative hydrotalcite-based compound as other inorganic ion exchangers, for having the compound that contains magnesium, aluminium of laminate structure, trade(brand)name comprises KW2200, KW2100, DHT-4A, DHT-4B, DHT-4C (consonance chemical industry (strain) system) etc., the corrosion that hydrotalcite produces about sulfide, to compare its patience poor with the oxyhydroxide of the above-mentioned bismuth system of not containing antimony, aluminium system, zirconium system or hydrous oxide.These inorganic ion exchangers preferably use below the 5 μ m in this purposes, are generally 0.01～5 μ m, the median size of preferred especially 0.1～5 μ m.In addition, above-mentioned various inorganic ion exchangers can use a kind separately, also can more than 2 kinds and use.
In addition, this median size for example can be used the particle size distribution device that adopts laser diffractometry etc. etc., obtains as weighed average (or intermediate value footpath) etc.
(B) inorganic ion exchanger of component can add 0.1～50 mass parts with respect to curable silicone rubber composition 100 mass parts as above-mentioned (A) component, can add 0.5～30 mass parts especially.If this use level is very few, then foreign ion absorption capture weak effect reduces if cross the mechanical property of the silicon rubber that this composition is solidified and prepare, and is therefore not preferred.
Can in silicon rubber composition for electrode circuit protection of the present invention, cooperate above-mentioned composition in addition as required.For example be used for the thermal expansivity, physical strength, thermotolerance, resistance to chemical reagents, flame retardant resistance, the combustion coefficient of expansion, gas permeation rate of the cured article of shrinking percentage when solidifying and preparation and (B) precipitation of component prevent to wait the suitably various additives of adjustment.As these any compositions, can enumerate inanimate matter weighting agent, thermotolerance rising agent, platinum control agent (addition reaction control agent), the polymerization in addition of (B) component and forbid agent (prolonging agent working life) etc.In addition, can cooperate to give bonding principal component, for example organoalkoxysilane (for example tetraalkoxysilane and/or its hydrolytic condensate) or following illustrative silane coupling agent etc.
Here, the inanimate matter weighting agent is a material of giving physical strengths such as hardness that rubber composition is decided and tensile strength.As weighting agent, can be normally used material in the rubber composition.Specifically, can enumerate silica-based weighting agents such as silicon-dioxide that pyrogenic silica (smog matter silicon-dioxide) for example, crystallinity silicon-dioxide (quartz powder), precipitation threshold silicon-dioxide, hydrophobization handle, silicon-dioxide aerosol, can enumerate glass fibre, titanium oxide, lime carbonate, magnesiumcarbonate etc. in addition, these materials can use a kind separately, also can make up more than 2 kinds.As this examples of material, in silica-based weighting agent, as wetting ability silicon-dioxide, can enumerate Aerosil 130,200,300 (Japanese Aerosil society, Degussa society system), CabosilMS-5, MS-7 (Cabot society system), RheorosilQS-102,103 (moral mountain Cao Da society system), NipsilLP (Japanese silicon-dioxide corporate system) etc.In addition, as hydrophobic silica, can enumerate AerosilR-812, R-812S, R-972, R-974 (Degussa society system), RheorosilMT-10 (moral mountain Cao Da society system), NipsilSS series (Japanese silicon-dioxide corporate system), as crystallinity silicon-dioxide, can enumerate Network リ ス ラ イ ト, Minusil, Imisil etc.The use level of weighting agent is preferably 5～300 mass parts with respect to (a) component 100 mass parts, more preferably 20～200 mass parts.
As the thermotolerance rising agent, can use titanium oxide, cerium oxide, cerous hydroxide, ferric oxide (red iron oxide) etc.These components can be used separately or and use.As red iron oxide, preferably use black oxidation iron oxide red (Fe
3O
4), the red (Fe of red iron oxide
2O
3).
These inanimate matter weighting agents can directly use, and can be that coupling agent, dimethyl polysiloxane, stearic acid etc. carry out using after the surface treatment with silane, silazane, titanic acid ester also.
In this case, as silane be, silazane is a coupling agent, can enumerate hexamethyldisilazane, the divinyl TMDS tetramethyldisilazane, organosilicon ammonia alkanes such as six organic radical disilazane such as phenylbenzene TMDS tetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxy silane, divinyl dimethoxy silane, vinyl three (methoxy ethoxy) silane etc. contains the alkoxyl silicone alkanes of vinyl, organochlorines such as trimethylammonium chlorosilane are for silicane, aminosilane classes such as trimethylammonium aminosilane, glycidoxy-propyltrimethoxy silane, the epoxypropoxy methyldiethoxysilane, (epoxycyclohexyl) ethyl trimethoxy silane etc. contains the alkoxyl silicone alkanes of epoxy functional group, methyl allyl acyloxypropyl trimethoxysilane, methacryloxypropyl triethoxyl silane etc. contains the alkoxyl silicone alkanes of (methyl) acryloxy functional groups, dimethyldimethoxysil,ne, trimethylethoxysilane and r-chloropropyl trimethoxyl silane etc. contain the alkoxyl silicone alkanes of not replacement or halogen-substituted alkyl etc.
In addition; as titanic acid ester is coupling agent, can enumerate titanium isopropylate, tetra-n-butyl titanate, butyl (tetra) titanate dimer, metatitanic acid four stearyl esters, triethanolamine titanate, etheric acid titanium, methyl aceto acetate and close titanium, lactic acid titanium, octylene glycol titanate, sec.-propyl three stearyl-titanic acid ester, sec.-propyl three (dodecyl) benzenesulfonyl titanic acid ester, sec.-propyl three (dioctylphyrophosphoric acid ester) titanic acid ester, two (dioctylphyrophosphoric acid ester) oxo acetic ester titanic acid ester, two (dioctylphyrophosphoric acid ester) ethylidene titanic acid ester etc.
As the addition reaction control agent, can enumerate the organopolysiloxane that the vinyl cyclotetrasiloxane contains vinyl like this, cyanacrylate, the toxilic acid alkyl ester, acetylene series alcohols and silane thereof, silicone-modified thing, hydroperoxide, Tetramethyl Ethylene Diamine, benzotriazole and their mixture etc.
Forbid agent (prolonging agent working life) as polymerization, can enumerate quinhydrones, methoxyl group quinhydrones etc.
There is no particular restriction for the manufacture method of rubber composition of the present invention, can be with known method manufacturing.
Be cured under the corresponding known moulding of kind of composition employing of the present invention and its curable silicone rubber composition, curing, the condition of cure, the cured article of preparation is (H under harsh condition for example
2When S atmosphere) carrying out the electrode test of flat-panel monitor, give very high erosion resistance.
In addition, silicon rubber composition for electrode circuit protection of the present invention for the sulfuration of the metallic circuit that prevents flat-panel monitors such as metallic circuit, particularly LCD, PDP, organic EL etc., corrosion effectively.In this case,, adopt, form 10～1000 μ m, the particularly epithelium of 100～500 μ m, its solidified method at the circuit part coating above-mentioned composition that should protect as guard method.
Embodiment
Below enumerate embodiment and comparative example the present invention is carried out specific description, but the present invention is not limited to following embodiment.In addition, in the following example, " part " expression " mass parts ", Me represents methyl, Et represents ethyl.
Embodiment 1
At following formula (i)
(wherein, add following formula (ii) in 100 parts of the end capped dimethyl polysiloxanes of two terminal ethylenyl groups dimethylsilane oxygen bases shown in L=450)
(wherein, L=10, the octanol modified solution of the organic hydride polysiloxane M=8) and 0.05 part of chlorination platinic acid, it is 1.5 that the amount of organic hydride polysiloxane makes the mol ratio of the vinyl in SiH base and the above-mentioned dimethyl polysiloxane (i) that contains vinyl, in 100 parts of rubber compositions that fully stirs preparation, add 10 parts of IXE500 (East Asia synthetic (strain) system, the bismuth that does not contain antimony is inorganic anion exchanger composed), modulate aqueous rubber composition.Said composition is solidified.
According to JIS K6301 the rerum natura of the cured article of preparation is measured.In addition, hardness adopts spring loaded A type trier.It the results are shown in table 1.
In addition, will be placed on the glass substrate having implemented silver plated substrate on the copper, be coated with the above-mentioned composition of thick 0.3mm in the above, it was solidified 1 hour, make assess sample.This assess sample is put into the encloses container of 2 liters of volumes, in this encloses container, put into (NH simultaneously
4)
2S 20g and H
2O 10g is producing H
2Under the air-tight state of S gas, place the time shown in the table 2 down, the corrosion production of having implemented silver plated substrate on copper is estimated at 23 ℃.The results are shown in table 2.
Embodiment 2
In 100 parts of above-mentioned two end capped dimethyl polysiloxanes of terminal ethylenyl groups dimethylsilane oxygen base (i), add above-mentioned organic hydride polysiloxane (ii) and the octanol modified solution of 0.05 part of chlorination platinic acid, it is 1.5 that the amount of organic hydride polysiloxane makes the mol ratio of the vinyl in SiH base and the above-mentioned dimethyl polysiloxane (i) that contains vinyl, in 100 parts of rubber compositions that fully stirs preparation, add 20 parts of IXE530, modulate aqueous rubber composition.Said composition is solidified.
Identical with embodiment 1, the rerum natura and the corrosion test of the cured article of mensuration preparation.
Embodiment 3
In following formula (iii)
(wherein, L=450) add 0.1 part of titanium chelate catalyzer (trade(brand)name TC-750) in 100 parts of the end capped dimethyl polysiloxanes of two terminal trimethoxy siloxyies shown in, in 100 parts of rubber compositions that fully stirs preparation, add 5 parts of IXE500, modulate aqueous rubber composition.
Except solidifying, measure the rerum natura and the corrosion test of cured article similarly to Example 1 at 23 ℃/50%RH, under 24 hours.
Embodiment 4
(iii) add 0.1 part of titanium chelate catalyzer (trade(brand)name TC-750) in 100 parts at the end capped dimethyl polysiloxane of above-mentioned two terminal trimethoxy siloxyies, in 100 parts of rubber compositions that fully stirs preparation, add 30 parts of IXE500, modulate aqueous rubber composition.
Except solidifying, measure the rerum natura and the corrosion test of cured article similarly to Example 1 at 23 ℃/50%RH, under 24 hours.
Embodiment 5
In following formula (iv)
Shown in mix 2 parts of 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone, 2 in 100 parts of the buttery organopolysiloxanes; 4,1 part, 10 parts IXE530 of the partial hydrolysis condenses of 1 part of 6-trimethylbenzoyl phenylbenzene, tetramethoxy-silicane (methoxyl group siloxane oligomer) and following formula are (v)
0.1 part of shown titanium chelate, preparation radiation-curable organopolysiloxane composition.
Except (illumination: 80W/cm in the stove that possesses 2 metal halide mercuryvapour lamps
2), to said composition shine ultraviolet ray in 2 seconds (energy: 800mJ) be cured outside, measure the rerum natura and the corrosion test of cured article in the same manner with embodiment 1.
Comparative example 1
In embodiment 1,, prepare identical aqueous rubber composition except not adding the IXE530.Similarly to Example 1 said composition is tested.
Comparative example 2
In embodiment 3,, prepare identical aqueous rubber composition except not adding the IXE530.Similarly to Example 3 said composition is tested.
Comparative example 3
In embodiment 5,, prepare identical aqueous rubber composition except not adding the IXE530.Similarly to Example 5 said composition is tested.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 | Comparative example 2 | Comparative example 3 | ||
| Curing characteristics | Hardness (A type) | ????22 | ????30 | ????20 | ????30 | ????48 | ????20 | ????17 | ????45 |
| Elongation (%) | ????150 | ????100 | ????100 | ????80 | ????60 | ????130 | ????150 | ????50 | |
| Tensile strength (MPa) | ????0.8 | ????0.7 | ????0.8 | ????1.3 | ????1.0 | ????0.7 | ????0.5 | ????1.0 | |
Table 2
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 | Comparative example 2 | Comparative example 3 | ||
| Storage period | ????0hr | ??○ | ??○ | ??○ | ??○ | ??○ | ????○ | ????○ | ????○ |
| ????2hr | ??○ | ??○ | ??○ | ??○ | ??○ | ????△ | ????△ | ????△ | |
| ????4hr | ??○ | ??○ | ??○ | ??○ | ??○ | ????× | ????× | ????× | |
| ????10hr | ??○ | ??○ | ??○ | ??○ | ??○ | ????× | ????× | ????× | |
| ????24hr | ??○ | ??○ | ??○ | ??○ | ??○ | ????× | ????× | ????× | |
Zero: do not have corrosion △: a part of variable color *: become black (corrosion fully)
Claims (10)
1, silicon rubber composition for electrode circuit protection is characterized in that: with
(A) curable silicone rubber composition 100 mass parts,
(B) inorganic ion exchanger 0.1～50 mass parts is must component.
2, the described silicon rubber composition for electrode circuit protection of claim 1, wherein curable silicone rubber composition is
(a) contain more than 2 organopolysiloxane with Siliciumatom bonded alkenyl in 1 molecule,
(b) have more than 2 and organic hydride polysiloxane Siliciumatom bonded hydrogen atom in 1 molecule, wherein, with Siliciumatom bonded hydrogen atom be 0.1～5.0 with respect to the mol ratio in (a) component with Siliciumatom bonded alkenyl,
(c) the addition curable rubber composition of the platinum family series catalysts of catalytic amount formation.
3, the described silicon rubber composition for electrode circuit protection of claim 1, wherein curable silicone rubber composition is
(d) ultraviolet reactive organopolysiloxane,
(e) the ultraviolet hardening rubber composition of Photoepolymerizationinitiater initiater formation.
4, the described silicon rubber composition for electrode circuit protection of claim 1, wherein curable silicone rubber composition is
(f) contain in 1 molecule more than 2 with the organopolysiloxane of Siliciumatom bonded alkenyl,
(g) the organic peroxide curing type rubber composition of organo-peroxide formation.
5, the described silicon rubber composition for electrode circuit protection of claim 1, wherein curable silicone rubber composition is
(h) have at least in 1 molecule two silanol groups or with the organopolysiloxane of Siliciumatom bonded hydrolization group,
(i) as the water-disintegrable silane of any component or its partial hydrolysis condenses,
(j) the condensation cured type rubber composition of the condensation catalyst formation of any component of conduct.
6, each described silicon rubber composition for electrode circuit protection of claim 1～5, wherein (B) component is anion ion exchange body or zwitter-ion permutoid.
7, each described silicon rubber composition for electrode circuit protection of claim 1～5, wherein (B) component is the inorganic ion exchanger that does not contain antimony of bismuth system, aluminium system or zirconium system.
8, each described silicon rubber composition for electrode circuit protection of claim 1～5, wherein (B) component is the oxyhydroxide or the hydrous oxide of metal.
9, electrode circuit protection material, its cured article by each described silicon rubber composition for electrode circuit protection of claim 1～8 constitutes.
10, electric, electronic component, wherein telegraph circuit coats protection with the cured article of each described silicon rubber composition for electrode circuit protection of claim 1～8.
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| DE10062181A1 (en) * | 2000-12-14 | 2002-07-04 | Wacker Chemie Gmbh | Curable organopolysiloxane compositions |
| JP2002275446A (en) * | 2001-03-21 | 2002-09-25 | Showa Denko Kk | Adhesive composition for surface implementation |
| JP2002371195A (en) * | 2001-06-18 | 2002-12-26 | Kyocera Chemical Corp | Resin composition for sealing and semiconductor-sealed device |
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| JP2003138098A (en) * | 2001-10-30 | 2003-05-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
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| JP2004115583A (en) * | 2002-09-24 | 2004-04-15 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
| JP4530137B2 (en) * | 2003-09-17 | 2010-08-25 | 信越化学工業株式会社 | Organopolysiloxane composition for sealing and sealing precision electronic parts, corrosion prevention or delay method for precision electronic parts, and silver-containing precision electronic parts |
-
2003
- 2003-10-14 JP JP2003354122A patent/JP4645793B2/en not_active Expired - Fee Related
-
2004
- 2004-06-25 TW TW093118657A patent/TW200513498A/en not_active IP Right Cessation
- 2004-10-13 KR KR1020040081642A patent/KR101092092B1/en not_active Expired - Fee Related
- 2004-10-14 CN CNB2004100852991A patent/CN100513485C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060274A (en) * | 2010-04-22 | 2014-09-24 | 日本化药株式会社 | Silver anti-tarnishing agent, silver anti-tarnishing resin composition, silver anti-tarnishing method, and light-emitting diode using same |
| CN104025726A (en) * | 2012-02-10 | 2014-09-03 | 三菱树脂株式会社 | Surface protection film, substrate for mounting light-emitting element, and light source device |
| CN116134104A (en) * | 2020-07-22 | 2023-05-16 | 信越化学工业株式会社 | Anti-sulfur coating material, cured product of anti-sulfur coating material, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200513498A (en) | 2005-04-16 |
| TWI335348B (en) | 2011-01-01 |
| CN100513485C (en) | 2009-07-15 |
| JP2005120155A (en) | 2005-05-12 |
| KR20050036749A (en) | 2005-04-20 |
| JP4645793B2 (en) | 2011-03-09 |
| KR101092092B1 (en) | 2011-12-12 |
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