CN1697207A - Light source module - Google Patents

Abstract

A method for combining a light emitting diode assembly and a bearing substrate in a light source module and a structure thereof are provided, wherein the light emitting diode assembly consists of a light emitting diode and a carrier, and a fixing part extends out of the bottom of the carrier to form a leaning surface; the bearing substrate is provided with a through hole with the outer diameter slightly larger than that of the light-emitting diode and smaller than the outer edge of the fixing part, so that when the light-emitting diode component is attached to a heat dissipation part, the bearing substrate can apply pressure to enable the light-emitting diode component and the heat dissipation part to be tightly combined, and the heat dissipation effect is improved.

Description

Light source module

technical field

The invention relates to a light source module, in particular to a combination method and structure of a light emitting diode assembly and a carrier substrate in the light source module.

Background technique

In the known light source module, the assembly method between the LED assembly and the carrier substrate and the steps of pasting the assembled structure on a heat sink can refer to FIGS. 1A to 1C . Referring first to the schematic cross-sectional view shown in FIG. 1A , the light source module is mainly composed of a plurality of LED assemblies 12 and a substrate 11 for carrying the LED assemblies 12 . The substrate 11 has an opposing first surface 111 (bottom surface) and a second surface 112 (top surface), and is formed with a plurality of through holes 113 penetrating through the substrate 11, and a patterned conductive pattern is formed on the first surface 111 of the substrate 11. Line 114.

Continuing to refer to FIG. 1A , each LED assembly 12 is composed of a LED 121 and a carrier 122 , and a plurality of pins 124 electrically connected to the LED 121 are exposed from the sidewall of the carrier 122 .

Referring to FIG. 1B , when the light emitting diode assembly 12 is moved and inserted into the corresponding through hole 113 from the first surface 111 , the light emitting diode 121 penetrates the substrate 11 and protrudes from the second surface 112 , while the exposed pin 124 abuts against the through hole 113 on the surrounding patterned conductive circuit 114; at this time, the pin 124 can be welded on the patterned conductive circuit 114 by using the solder liquid 13 to complete the electrical connection and combination structure between the LED 12 and the substrate 11.

Referring to FIG. 1C , in order to effectively discharge the heat energy generated during the operation of the LED 12 , the soldered LED 12 and the substrate 11 can be flipped 180 degrees, and then the bottom surface of the carrier 122 of the LED 12 is placed against the bottom surface of the substrate 11. On the heat conduction pad 14, and the heat conduction pad 14 contacts with the surface of a heat sink 15 again; When increasing the heat dissipation effect, the pins 124 on the LED 12 are directly subjected to the pressure exerted by the substrate 11 , so the pins 124 are easily deformed and bent, and may even be detached from the patterned conductive circuit 114 to be damaged.

Contents of the invention

In view of the above-mentioned background of the invention, the combined structure of the light emitting diode assembly and the carrier substrate in the light source module cannot be in close contact with the heat sink, hereby provides a combination method between the light emitting diode assembly and the carrier substrate in the light source module and its The purpose of the composite structure is to allow the LED assembly to be closely adhered to the heat sink, and at the same time, the LED assembly itself will not be deformed or damaged.

According to the above purpose, the present invention provides a combination method and structure of a light emitting diode assembly and a carrier substrate in a light source module. In the light emitting diode assembly, a fixing portion extends from the bottom of the carrier for carrying the light emitting diode to form an abutment surface. In addition, a perforation with an outer diameter slightly larger than the outer diameter of the diode and smaller than the outer edge of the fixing part is formed on the carrier substrate. In this way, when the LED component is attached to a heat sink, the substrate can apply a pressure to allow the LED to There is a tighter combination between the components and the heat sink to increase the efficiency of heat dissipation.

Description of drawings

Figures 1A to 1C are the steps of assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink in the known technology;

2A to 2C provide a flow of steps for assembling the light-emitting diode assembly on the carrier substrate and leaning against the heat sink according to a preferred embodiment of the present invention;

FIG. 2D is a schematic perspective view of a light source module assembled according to a preferred embodiment of the present invention;

FIG. 2E is a three-dimensional schematic diagram of a combination of a substrate with through grooves and a light-emitting diode assembly according to other preferred embodiments of the present invention;

FIG. 2F and FIG. 2G are schematic cross-sectional views of forming a reflective sheet on the light source module according to a preferred embodiment of the present invention;

FIG. 2H is a schematic cross-sectional view when a heat sink in the form of a heat sink is formed in the light source module according to other preferred embodiments of the present invention;

FIG. 2I to FIG. 2J are the appearance changes of the fixing part of the light emitting diode assembly provided by the present invention.

Explanation of symbols in the figure:

11 Substrate

111 first surface

112 second surface

113 piercing

114 patterned conductive lines

12 LED components

121 LEDs

122 carrier

124 pins

13 soldering fluid

14 thermal pad

15 heat sink

21 Substrate

211 first surface

212 second surface

213 first piercing

214 patterned conductive lines

215 Grooving

22 LED components

221 LEDs

222 carrier

223 Fixed part

2231 abutment surface

224 pins

23 soldering fluid

24 thermal pad

25 heat sink

26 reflector

261 second piercing

27 cooling fins

Detailed ways

The following is a detailed description of the present invention. The description of the light source module and the light emitting diode assembly itself in the following description does not include detailed structural components and operating principles. The prior art used by the present invention is only emphasized here. Cited to help explain the present invention. Moreover, the drawings related to the light source module in the following texts are not drawn according to the actual scale, and their function is only to express the characteristics of the present invention. Secondly, when each component or structure in the drawings of the embodiments of the present invention is described, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on the number, the spirit of the present invention and The scope of application can be extended to structures where multiple components or structures coexist.

According to a preferred embodiment of the present invention, there is provided a combination method and structure of a light emitting diode component in a light source module and a carrier substrate, and the combined structure can be closely attached to a heat sink. Referring first to the schematic cross-sectional view shown in FIG. 2A , the light source module is mainly composed of a plurality of LED assemblies 22 and a substrate 21 for carrying the LED assemblies. In this embodiment, the substrate 21 can be a printed circuit board or other multi-layer board, which has a first surface 211 (bottom surface) and a second surface 212 (top surface) opposite, and forms a plurality of through the substrate 21 and corresponding The position and number of the first through holes 213 of the LED assembly 22 ; in addition, the patterned conductive circuit 214 formed by copper foil or other conductive layers is exposed on the first surface 211 of the substrate 21 .

Continuing to refer to FIG. 2A, the light emitting diode assembly 22 provided in this embodiment is composed of a light emitting diode 221 and a carrier 222, wherein the outer diameter of the light emitting diode 221 is slightly smaller than the outer diameter of the first through hole 213, but the bottom of the carrier 222 is A fixing portion 223 is formed with an outer edge larger than the outer diameter of the first through hole 213 , and a plurality of pins 224 electrically connected to the LEDs 221 are also exposed from the sidewall of the fixing portion 223 .

Referring to FIG. 2B, when the light emitting diode assembly 22 is moved and inserted into the corresponding first through hole 213 from the first surface 211, the light emitting diode 221 can pass through the first through hole 213 and protrude from the second surface 212 of the substrate 21, and the fixing portion 223 Then it is against the part of the first surface 211 adjacent to the first through hole 213 and cannot be penetrated; in this way, the pin 224 can be soldered to the patterned conductive circuit 214 by using the solder liquid 23 to complete the light emitting diode assembly 22 and the substrate. 21 electrical connections and combination structures.

Referring to FIG. 2C , in order to effectively discharge the heat energy generated when the LED 221 is in operation, in this embodiment, the combined structure of the LED assembly 22 and the substrate 21 is flipped 180 degrees, and then the carrier 222 is directly borrowed from a plurality of thermal pads 24 . The bottom surface is in contact with the surface of a heat sink 25; and since the carrier 222 provided by this embodiment has a fixed portion 223 whose outer edge is larger than the outer diameter of the first through hole 213, a downward pressure can be applied to the substrate 21 in the direction of the arrow to allow There is a tighter combination between the light-emitting diode assembly 22 and the heat sink 25 to increase the heat dissipation effect, and the problem that the pins of the carrier of the known light-emitting diode assembly are deformed or even separated from the patterned conductive circuit due to the pressing down of the substrate can be eliminated. avoid.

The perspective view of the assembled light source module can be referred to FIG. 2D , which shows that each light emitting diode 221 has passed through the corresponding first through hole 213 and protrudes from the second surface 212 of the substrate 21 . In other specific embodiments according to the present invention, the substrate can also be directly formed with through grooves corresponding to a plurality of LED components. For example, referring to FIG. 2E, a through groove 215 is formed on the substrate 21, and the width of the through groove 215 is between between the outer diameter of the light emitting diode 221 and the outer edge of the fixing part 213, so that a plurality of light emitting diodes 221 can simultaneously pass through the slot 215 and protrude from the second surface 212 of the substrate 21, and each light emitting diode assembly The abutting surface 2231 formed by the fixing portion 223 can abut against the periphery of the through groove 215 on the first surface (not shown in the figure) of the substrate 21 .

In addition, referring to FIG. 2F, the present invention may also add a reflector according to the characteristics of the light emitting diode assembly 22 or the needs of the light source module. For example, when the light emitting diode 221 used in this embodiment is a side emitting light emitting diode 22, a reflective sheet 26 (or form a reflective surface) can be pasted on the second surface 212 of the substrate 21, and a plurality of second perforations 261 corresponding to the positions of the first perforations 213 are formed on the reflective sheet 26, and The outer diameter of this second perforation 261 can be selected as shown in the second F figure, which is larger than the outer diameter of the light-emitting diode, so that the light-emitting diode 221 directly passes through the second perforation 261 and protrudes outside the reflector 26; or in accordance with the present invention In other specific embodiments, a second perforation with an outer diameter equal to or smaller than the light-emitting diode is formed on the reflector, as shown in FIG. The phenomenon of light leakage can achieve more efficient light output.

In addition, in other embodiments according to the present invention, in addition to being selected from a heat sink, the heat sink can also be selected from a heat sink 27 (heat sink) as shown in Figure 2H to increase the effect of heat dissipation; and set The heat conduction pad 24 between the bottom surface of each carrier 222 and the heat dissipation fins 27 can also be a whole structure as shown in FIG. 2H .

Referring to FIG. 2I and the second J to FIG. 2J, the light-emitting diode assembly 22 provided in this embodiment has a three-dimensional schematic diagram of different appearance changes, wherein each fixing part 223 is an extension of the bottom of the carrier 222, and its purpose is to produce An abutment surface 2231 is formed by a gap, so that when the light-emitting diode 221 is inserted into the first through hole from above the substrate to allow the light-emitting diode 221 and part of the carrier 222 to pass through, the fixing part 223 whose outer edge is larger than the aperture of the through hole can use this abutment surface 2231 and be against the outside of the first through hole, so that the subsequent welding steps of the pin 224 and the patterned conductive circuit can be carried out smoothly; in addition, when the combined structure of the light emitting diode assembly 22 and the substrate is leaned against the surface of the heat sink by means of the thermal pad Therefore, the pressure exerted by the substrate on the LED assembly 22 will not directly press the pins 224 welded together with the patterned conductive lines. The appearance of the fixing part 223 of the light emitting diode assembly 22 provided by the present invention can be as shown in Figure 2I and Figure 2J, which is a cube or a cylinder, which can form a hole larger than the scope of the perforation (or groove). The same abutting effect can be achieved by abutting against the surface 2231 .

The above-described embodiments are only to illustrate the technical ideas and characteristics of the present invention, and its purpose is to enable those who are familiar with this art to understand the content of the present invention and implement it accordingly, and should not limit the patent scope of the present invention, that is, All equivalent changes or modifications made according to the spirit disclosed in the present invention should still fall within the patent scope of the present invention.

Claims (13)

1. A light source module, characterized in that it comprises: a substrate having a first through hole; and A light-emitting diode component, including a light-emitting diode and a carrier, and the carrier has a fixing part with an outer diameter larger than the outer diameter of the first through hole, wherein the light-emitting diode passes through the first through hole, and the fixing part abuts against the bottom surface of the substrate. 2. The light source module as claimed in claim 1, further comprising a heat sink connected to the bottom surface of the carrier. 3. The light source module as claimed in claim 2, wherein the heat sink comprises a heat sink. 4. The light source module as claimed in claim 2, further comprising a heat conduction pad disposed between the carrier and the heat sink. 5. The light source module as claimed in claim 1, further comprising a reflective sheet disposed on the top surface of the substrate. 6. The light source module according to claim 5, wherein the reflector has a second through hole corresponding to the position of the first through hole, so that the LED can pass through the second through hole and protrude from the reflector . 7. The light source module according to claim 6, wherein the diameter of the second through hole is equal to or smaller than the outer diameter of the LED. 8. A light source module, characterized by comprising: A base plate has a through groove, and the base plate has a first surface and a second surface opposite to each other; and A plurality of light-emitting diode components are arranged corresponding to the groove, wherein each light-emitting diode component is composed of a light-emitting diode and a carrier, and a fixing part whose outer edge is larger than the width of the groove is formed on the bottom of the carrier, so that When the light emitting diode component is inserted into the through groove from the first surface of the substrate, the light emitting diode protrudes from the second surface through the through groove, and the fixing part abuts against the first surface adjacent to the through groove around. 9. The light source module as claimed in claim 8, further comprising a heat sink connected to the bottom surface of the carrier. 10. The light source module as claimed in claim 9, wherein the heat dissipation member comprises a heat sink. 11. The light source module according to claim 9, further comprising a heat conduction pad disposed between the carrier and the heat sink. 12. The light source module according to claim 8, further comprising a reflective sheet disposed on the second surface of the substrate. 13 . The light source module according to claim 12 , wherein the reflective sheet has a through hole corresponding to the LED assembly, so that the light emitting diode can pass through the through hole and protrude from the reflective sheet.

Images