CN1690437A - Pump, cooler, and electronic device - Google Patents

Abstract

According to one embodiment, a pump housing (101) includes a heat absorbing plate (122) thermally coupled to a CPU (31); and a pump chamber (118). An impeller, rotated by a motor (103), is located in the pump chamber (118). At least a portion of the pump casing (101) is made of resin containing at least one of: a metal filler; a filler of a material having a lower coefficient of linear expansion than the resin; and a filler having a lower water vapor penetration than the resin. The filler of the transparent material.

Description

Pumps, coolers, and electronics

technical field

Embodiments of the present invention relate to a pump applied to a liquid cooling type cooler that cools a heat generating element such as a central processing unit (CPU) by using a liquid coolant. The invention also relates to a cooler with such a pump, and an electronic device with such a cooler.

Background technique

As processing speed and versatility increase, CPUs used in electronic devices generate ever-increasing heat during operation. In recent years, by taking countermeasures against such heat generation, electronic devices have been put into use for cooling CPUs by using a liquid coolant having a specific thermal coefficient significantly higher than that of air. Cooling of this electronic device is performed by a so-called liquid cooling type cooler.

Here, as this type of cooler equipped in an electronic device, a cooler having a contact heat exchange pump has been proposed. The contact heat exchange pump is in close contact with a heat-generating electronic part such as a CPU, thereby exchanging heat between the heat-generating electronic part and liquid refrigerant to cool the heat-generating electronic part and circulate the liquid coolant.

A contact heat exchange pump has a housing cover; a pump housing with a heat absorbing surface thermally coupled (thermally connected) to the heat generating electronics; and a pump chamber. The casing cover tightly closes the pump chamber. The pump casing and casing cover are made of high thermal conductivity materials, such as copper or aluminum, to speed up heat transfer. One such contact heat exchange pump is disclosed in Japanese Patent No. 3452059.

In the case of parts such as pump casings, casing covers etc. produced by die casting eg copper or aluminum. Die casting manufacturing costs are higher than manufacturing using resin injection molding. In addition, this type of pump is usually configured such that the rotor is placed in the pump chamber, and the stator is placed outside the pump chamber through the casing cover. An electric motor with a rotor and a stator rotates an impeller disposed in the pump chamber. For this structure, in order to optimally rotate the impeller, ie, to optimally drive the motor, the case cover between the rotor and the stator is preferably an insulating material. Therefore, there has arisen a need to form the above-mentioned pump casing and casing cover from a resin material.

However, in a structure in which the pump casing, casing cover, etc. are made of resin, loss with the coolant is more likely to occur than in a structure in which the pump casing, casing cover, etc. are made of copper or aluminum. More particularly, liquid coolant in the pump chamber is more likely to evaporate or leak, for example, from the component itself or through the seal between the pump casing and the casing cover.

Contents of the invention

An object of the present invention is to provide a pump that can prevent coolant from evaporating or coolant from leaking, so that a heat-generating device can be optimally cooled for a long time.

Another object of the present invention is to provide a cooler with a pump.

Another object of the present invention is to provide an electronic device with a cooler.

To achieve these objects, according to a first aspect of the present invention, there is provided a pump comprising: an impeller; and a pump casing connected to the impeller, the pump casing comprising a plurality of parts including a The housing, at least one of the plurality of parts is made of a resin comprising at least one of: (i) a metal filler; (ii) a filler of a material having a lower coefficient of linear expansion than the resin; and (iii) a filler of a material having a lower water vapor transmission rate than the resin.

In order to achieve these objects, according to a second aspect of the present invention, there is provided a cooler comprising: a heat radiation part; a pump for forcibly circulating coolant to the heat radiation part, which includes a pump housing and is rotatably connected to an impeller of a pump casing, the pump casing comprising a plurality of parts including: (a) a first casing cover; (b) a main body base portion connected to the first casing cover, including an inlet pipe and an outlet pipe; and (c) A heat absorbing plate thermally coupled (thermally connected) to the main body base, wherein at least two of the first case cover, the main body base, and the heat absorbing plate are made of a resin containing at least one of: ( i) a metal filling; (ii) a filling of a material having a lower linear expansion coefficient than the resin; and (iii) a filling of a material having a lower water vapor transmission rate than the resin; the first pipe, connecting To the outlet pipe of the pump and the heat radiation part, the first pipe conveys the coolant heated at the pump to the heat radiation part; and the second pipe, connected to the pump inlet pipe and the heat The coolant cooled by the radiant section is sent to the pump.

In order to achieve these objects, according to a third aspect of the present invention, there is provided an electronic device including: a heat generating unit used in a first housing; and a cooler including a pump including a pump housing and rotatably connected to the An impeller for circulating a coolant of a pump casing comprising: a casing cover made of a resin containing at least one of: (i) a metal filler; (ii) having a lower linear expansion than the resin and (iii) a filler of a material having a lower water vapor transmission rate than the resin; and a main body base part, which is connected to the case cover, is made of the resin, and includes an inlet pipe and an outlet Tube.

According to the present invention, in the pump, the cooler, and the electronic device having the pump, at least a part (part) of the pump housing is made of resin containing one of the following: metal filler, having a lower A filler of a material with a coefficient of linear expansion, and a filler of a material with a lower water vapor transmission rate than the resin. Thus, it is possible to cool the heat-generating device for a long time.

Additional features and advantages of the invention are set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention to those skilled in the art. The objects and advantages of the invention can be understood and obtained by means of the methods and structures particularly pointed out hereinafter.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the embodiments of the invention and together with the foregoing general description and the detailed description of the embodiments given below, serve to explain the principles of the invention.

FIG. 1 is a perspective view illustrating a portable computer according to an embodiment of the present invention;

Fig. 2 is a perspective view of the portable computer shown in Fig. 1 viewed from the exhaust port side of the first casing;

3 is a plan view illustrating an exemplary embodiment of a cooler installed in a first housing;

Figure 4 is an exploded perspective view of an exemplary embodiment of a pump;

Figure 5 is a perspective view of the pump of Figure 4 with the second housing cover removed; and

6 is a sectional view showing a positional relationship between a CPU mounted on a printed circuit board and a pump.

Detailed ways

Embodiments of the present invention will be described below with reference to FIGS. 1 to 6 .

1 and 2 show a portable computer 1 as an electronic device. The portable computer 1 has a computer main body 2 and a display unit 3 . The main computer 2 has a first casing 10 . The first housing 10 has a bottom wall 11a, an upper wall 11b, a front wall 11c, left and right side walls 11d and 11e, and a rear wall 11f.

Referring to FIG. 1 , the upper wall 11 b has a hand rest 12 and a keyboard stand 13 . The keyboard support part 13 is arranged at the rear part of the palm rest 12 . The keyboard 14 is installed in the keyboard holder part 13 . The front wall 11 c , the left and right side walls 11 d and 11 e , and the rear wall 11 f form a peripheral wall along the periphery of the first housing 10 . Referring to FIG. 2, a plurality of exhaust ports 15 are formed in the peripheral wall of the first housing 10, such as in the rear wall 11f. The exhaust ports 15 are arranged in a row along the width direction of the first housing 10 .

Referring to FIG. 1 again, the display unit 3 has a second housing 20 and a liquid crystal display panel 21 as a display panel. The LCD panel 21 is accommodated in the second housing 20. The LCD panel 21 has a screen 21a for displaying images. The screen 21 a of the liquid crystal display panel 21 is exposed from the second housing 20 through the opening 22 formed on the front plane of the second housing 20 .

The second housing 20 is supported on the rear end of the first housing 10 via a hinge (not shown). Thus, the display unit 3 is rotatable between a closed position and an open position. The closed position is a position where the display unit 3 is folded up to cover the hand rest 12 and the keyboard 14 (see FIG. 2 ). The open position is the position where the display unit 3 is rotated upwards, so that the palm rest 12, the keyboard 14, and the screen 21a are exposed (see FIG. 1 ).

Referring next to FIG. 3 , a printed circuit board 30 is disposed in the first housing 10 . More specifically, as shown in FIG. 6 , the printed circuit board 30 is disposed parallel to the bottom wall 11 a of the first housing 10 . The CPU 31, as a heat generating unit, is mounted on the upper surface of the printed circuit board 30. According to one embodiment of the present invention, the CPU 31 constitutes a microprocessor, which plays the role of the core function of the portable computer 1. According to another embodiment of the present invention, CPU 31 may constitute a digital signal processor, an application-specific integrated circuit, a controller, and the like.

The CPU 31 has a base 32 and an integrated circuit (IC) chip 33 disposed generally at the central portion of the upper surface of the base 32 . With increasing processing speed and multi-functionality, the IC chip 33 generates a large amount of heat during operation, and thus needs to be cooled in order to maintain stable operation.

Referring back to FIG. 3, the portable computer 1 has a liquid cooling type cooler 40 for cooling the CPU 31 by using a liquid coolant such as antifreeze. The cooler 40 is provided in the first housing 10 . The cooler 40 has the following components: a pump 100 serving as both a heat absorbing portion and a heat exchanger; a heat radiation portion 50 ; a circulation path 60 ; and an electric fan 70 .

As shown in FIGS. 3 to 6 , the pump 100 causes forced circulation and flow of liquid coolant in the circulation passage 60 . The pump 100 has a pump casing 101 serving also as a heat sink; an impeller 102 ; a motor 103 having a rotor 103 a and a stator 103 b ; and a control board 104 .

The pump housing 101 has a housing 110 , a first housing cover 111 , and a second housing cover 112 . The housing 110 has a flat book-like shape, is larger than the CPU 31, and has a recess 113 that opens upward.

The housing 110 has a frame-shaped main body base portion 121 constituting a side wall (side surface) of the housing 110; and a heat absorbing plate 122 serving as a heat absorbing portion through which the downwardly opened The end of the opening is a liquid-tight member. That is, the main body base part 121 defines the side surfaces of the recessed part 113 , and the heat absorbing plate 122 defines the bottom surface of the recessed part 113 . In other words, the concave portion 113 is defined by the inner surface of the main body base portion 121 and the upper surface of the heat absorbing plate 122 . The heat absorbing plate 122 simultaneously serves as the bottom wall of the recess 113 facing the CPU 31. The lower surface of the heat absorbing plate 122 is formed as a substantially flat heat absorbing surface 122a. The O-ring 124 is interposed between the main body base 121 and the heat absorbing plate 122 . The main body base part 110 may be a unitary structure.

The first case cover 111 blocks the opening end of the concave portion 113 . The O-ring 123 is disposed between the housing 110 and the first case cover 111 . The upper surface of the first case cover 111 has: a stator accommodating recess 115 for accommodating the stator 103b; and a control board accommodating recess 116 for accommodating the control board 104 .

The inside of the pump housing 101 , that is, the area surrounded by the recess 113 and the first housing cover 111 is partitioned by an annular partition 117 into a pump chamber 118 and a liquid storage tank 119 . The partition wall 117 is integrated with the housing 110 (in this embodiment, with the main body base portion 121 ). The pump chamber 118 is provided adjacent to the side of one of the four corners of the pump casing 101 . More particularly, the center position of the pump chamber 118 is offset relative to the center position of the pump housing 101 . The sump 119 is used to store liquid coolant for surrounding the pump chamber 118 from the remaining three of the four corners of the pump casing 101 .

Furthermore, an inlet pipe 131 and an outlet pipe 132 are provided in the housing 110 (in this embodiment, the main body base portion 121 ). The inlet pipe 131 and the outlet pipe 132 are arranged horizontally and separated from each other. The upstream end of the inlet pipe 131 protrudes outward through the side wall of the housing 110 (in this embodiment, the main body base portion 121 ). The downstream end of the inlet pipe 131 is open to the inside of the liquid storage tank 119 and is opposed to the communication opening 130 formed in the partition wall 117 . Although not shown, a gas-liquid separation space is provided between the downstream end of the inlet pipe 131 and the communication opening 130 . Even if the pump casing 101 changes its orientation, the gap is always below the liquid level of the liquid coolant stored in the sump 119 .

The downstream end of the outlet pipe 132 protrudes outward through the side wall of the housing 110 (in this embodiment, the main body base portion 121 ), and is located adjacent to the upstream end of the inlet pipe 131 . The upstream end of the outlet tube 132 extends through the side wall 117 and is open to the interior of the pump chamber 118 .

The disc-shaped impeller 102 conveys the liquid coolant from the inside of the pump housing 101 to the outside thereof (circulation passage 60 ), and is provided in the pump chamber 118 . The impeller 102 is made of a resin material (hereinafter simply referred to as "resin"), and has a rotation shaft 102a at its rotation center. The rotation shaft 102a is disposed between the first case cover 111 and the heat absorption plate 122 to extend therethrough such that the rotation shaft 102a is supported by the first case cover 111 and the heat absorption plate 122 and is rotatable.

The motor 103 rotatably drives the impeller 102 . The rotor 103a, constituting a part of the motor 103, has magnets magnetized with multiple positive poles and multiple negative poles, and has a ring shape. The rotor 103 a is disposed in the pump chamber 118 and fixed to the upper surface of the impeller 102 in a direction axially aligned with the impeller 102 .

The stator 103 b , which constitutes a part of the motor 103 , is disposed in a stator accommodating recess 115 formed on the upper surface of the first case cover 111 . The stator 103b should be arranged in association with the rotor 103a passing through the first case cover 111 . In this way, the stator accommodating recess 115 is provided at a position associated with the rotor 103a. More specifically, the central portion of the stator accommodating recess 115 is deviated relative to the central portion of the first case cover 111 . The control board accommodating recess 116 is provided at a position where the stator accommodating recess 115 is not provided.

The open end of the recess 113 is blocked by the first case cover 111 so that the stator accommodating recess 115 enters the inside of the rotor 103a. More specifically, the stator 103b is coaxially disposed inside the rotor 103a passing through the first case cover 111 . The stator 103b is electrically connected to the control board 104 .

The stator 103b is turned on while the portable computer 1 is turned on. By this conduction, a rotating magnetic field is generated in the circumferential direction of the stator 103 b, and the magnetic field is magnetically coupled with the rotor 103 . Next, a torque in the circumferential direction of the impeller 102 is generated between the stator 103b and the rotor 103a, thereby rotating the impeller 102 .

The second case cover 112 is fixed on the upper surface of the first case cover 111 . The stator 103b and the control board 104 are covered by the second case cover 112 . The second case cover 112 is used to suppress leakage, evaporation, etc. of the coolant, and may be omitted.

Materials used to form the pump casing 101 will be described below. As described above, the first case cover 111 is disposed between the rotor 103a and the stator 103b. If the first case cover 111 is made of conductive material, there will be a danger of affecting the operation of the rotor 103a. If the first case cover 111 is made of a metal material, the pump 100 will likely become heavy. Thus, according to one embodiment of the present invention, at least the first casing cover 111 of the pump casing 101 is preferably made of resin.

The main body base portion 121 has a relatively complicated structure. Thus, if the main body base portion 121 is made of a metallic material, the die-casting molding cost and its manufacturing cost will likely be high. If the main body base portion 121 is made of a metallic material, the pump 100 will likely become heavy. Therefore, according to an embodiment of the present invention, the main body base portion 121 is also made of a resin material.

In this embodiment, at least a part (that is, components) of the pump casing 101 includes, for example, the main body base 121 and the first casing cover 111, made of resin containing at least one of the following: metal filling material, a filler of a material having a lower linear expansion coefficient than the resin, and a filler of a material having a lower water vapor transmission rate than the resin. This makes it possible to obtain the pump 100 that is easy to manufacture, low in cost, light in weight, and can suppress reduction of liquid coolant due to evaporation, leakage, and the like. Therefore, it is possible to obtain the pump 100 which can be cooled optimally for a long time.

More specifically, many metals have not only high conductivity, but also low linear expansion coefficient and water vapor transmission rate. Therefore, the main body base portion 121 and the first case cover 111 are made of resin containing this type of metal filler. This makes it possible to obtain the main body base portion 121 and the first case cover 111 having a lower coefficient of linear expansion than the case of being made of only resin. Therefore, the difference in linear expansion coefficient between the first case cover 111 and the main body base 121 , and the difference in linear expansion coefficient between the main body base 121 and the heat absorbing plate 122 can be reduced. Thus, leakage of liquid coolant through the gap formed between the first case cover 111 and the main body base portion 121 and the gap formed between the main body base portion 121 and the heat absorbing plate 122, both of which are due to linear expansion, can be suppressed. due to the difference in coefficients.

Furthermore, since the main body base portion 121 and the first case cover 111 are made of resin containing this type of metal filler, they have a lower water vapor transmission rate. Thus, evaporation of the liquid coolant from the pump casing 101 can be suppressed.

In addition, since the main body base portion 121 and the first case cover 111 are made of resin containing this type of metal filler, it exhibits a more robust structure compared with the structure of the main body base portion 121 and the first case cover 111 made of only resin. High thermal conductivity. Thus, heat generated in the CPU 31 can be quickly transferred to the liquid coolant.

In addition, since the main body base portion 121 and the first casing cover 111 are made of resin containing this type of metal filler, the pump casing 101 is lighter in weight than the case of being made of only a metal material.

Fillers such as copper, aluminum, or aluminum alloys may be suitable for this type of metal filler.

When the main body base part 121 and the first case cover 111 are made of a resin containing a metal filler having a lower linear expansion coefficient than the resin, the main body base part 121 and the first case cover 111 will have a lower linearity than the resin. Coefficient of expansion. This can reduce the difference in linear expansion coefficient between the first case cover 111 and the main body base 121 , and the difference in linear expansion coefficient between the main body base 121 and the heat absorbing plate 122 . Thus, leakage of the liquid coolant through the gap formed between the first case cover 111 and the main body base portion 121 and the gap formed between the main body base portion 121 and the heat absorbing plate 122 can be suppressed.

Furthermore, when the main body base portion 121 and the first case cover 111 are made of a resin containing a metal filler having a lower water vapor transmission rate than the resin, the main body base portion 121 and the first case cover 111 will have The water vapor transmission rate is lower when the elements 121 and 111 are only made of resin. Thus, evaporation of the liquid coolant from the pump casing 101 can be suppressed. Thus, heat generated in the CPU 31 can be quickly conducted to the liquid coolant through, for example, the heat absorbing plate 122.

In addition, when the main body base portion 121 and the first case cover 111 are made of a resin containing a metal filler having a lower linear expansion coefficient than the resin, or a metal filler having a lower water vapor transmission rate than the resin , compared with the case where the main body base portion 121 and the first case cover 111 are made of only metal materials, the pump case 101 can be lighter in weight.

Not only metals, but also most carbon and ceramic materials have low linear expansion coefficient and water vapor transmission rate. Thus, any filler made of a material having a lower linear expansion coefficient than a resin, or a material having a lower water vapor transmission rate than a resin, such as a metal filler, a carbon filler, a semiconductor filler, or a ceramic filler , are suitable for use. Examples of ceramic fillers include, but are not limited to or limited to, alumina (alumina) fillers or aluminum nitride.

As the resin containing the filler, for example, polycarbonate or ABS resin can be used. In the case of using the above resin, the strength required for the pump chamber 101 can be maintained.

The following are the respective coefficients of linear expansion for the various materials:

Semiconductor silicon: 3ppm/℃

Ceramic (alumina): 7ppm/℃

Carbon: 2 to 7ppm/°C

Copper: 17ppm/℃

Aluminum: 22ppm/℃

Polycarbonate: 70ppm/℃

ABS resin: 74ppm/℃

On the other hand, in order to cool the CPU 31 optimally, the heat absorbing plate 122 is preferably made of a metal material having a high thermal conductivity. As an example, the heat absorbing plate 122 is made of, for example, copper with high thermal conductivity. Because in this embodiment, when the housing 110 is formed by being divided into the main body base portion 121 and the heat absorbing plate 122, the heat absorbing plate 122 may be selectively made of a high thermal conductivity material.

In addition, the second case cover 112 is preferably made of a metal material, so as to further suppress the effects of leakage and evaporation of the liquid coolant related to the second case cover 112 . According to one embodiment, the second case cover 112 is made of a material such as aluminum or an aluminum alloy.

The pump 100 is provided on the printed circuit board 30 in such a manner that the CPU 31 is covered from the top of the CPU 31. Referring to FIG. 6 , the pump housing 101 of the pump 100 is fixed to the bottom wall 11 a of the first housing 10 together with the printed circuit board 30 . The bottom wall 11 a has protrusions 17 at positions corresponding to the four corners of the pump casing 101 . The convex portion 17 protrudes upward from the bottom wall 11a. A printed circuit board 30 is superimposed on the top surfaces of these protrusions 17 . In FIG. 6 , reference numeral 34 denotes a reinforcing plate for reinforcing the printed circuit board 30 from the lower surface of the printed circuit board 30 .

The pump 100 is mounted to the bottom wall 11a of the first case 10 to cover the CPU 31 from above the CPU 31 by employing the below-described fitting mechanism. Recesses 141 are provided in respective four corners of the pump housing 101 . The bottom wall (the corner of the heat absorbing plate 122 ) defining the recess 141 has a through hole 142 for allowing a cylindrical insert 143 to pass through. Each cylindrical insert 143 has a protrusion 143a protruding outside in the horizontal direction of the circumferential direction at the upper edge. In addition, the cylindrical insert 143 has a groove portion 143b formed along the circumferential direction.

The pump 100 abuts against the CPU 31 by means of the mounting mechanism in the following manner. First, the cylindrical insert 143 is passed through the coil spring 144 . The cylindrical insert 143 is inserted from the upwardly open open end of the concave portion 141 of the first case cover 111 , the groove portion 143b being located at a position lower than the heat absorbing surface 122a of the pump 100 . A fall-off prevention c-ring 145 is attached to the groove portion 143b. Thus, the cylindrical insert 143 is mounted to the pump 100 in a state where the protrusion 143 a is urged by the coil spring 144 to be separated from the bottom wall defining the recess 141 .

Conductive grease (not shown) is applied to the upper surface of the IC chip 33 , and the heat absorbing surface 122 a of the pump casing 101 is disposed at a position opposite to the IC chip 33 . A screw 146 passing through the cylindrical insert 143 is screwed into the protrusion 17 formed on the printed circuit board 30 . Thus, the cylindrical insert 143 is fixed to the protrusion 17 , and the pump 100 is pressed against the IC chip 33 by the elastic force of the coil spring 144 . Thus, the IC chip 33 is thermally coupled to the heat absorbing surface 122a of the pump housing 101 through conductive grease.

In the portable computer 1 , the pump 100 is fixed to the printed circuit board 30 so that the center of the pump case 101 (the center of the heat absorbing surface 122 a ) is aligned with the center of the IC chip 33 . However, the center (rotation shaft 102 a ) of the impeller 102 is deviated from the center of the pump casing 101 . Therefore, the center of the IC chip 33 is deviated from the center of the impeller 102 opposed thereto with the pump casing 101 interposed therebetween. This arrangement enables the liquid coolant to absorb as much heat as possible from the IC chip 33 . That is, according to one embodiment of the present invention, the IC chip 33 is opposed to the position where the liquid coolant flows quickly while the pump housing 101 is inserted therebetween so that the liquid coolant absorbs as much heat as possible. It is known that the flow of liquid coolant generated by the rotation of the rotor 103a will become faster the farther it is from the center of the impeller 102 . Therefore, with the above structure, more heat of the IC chip 33 is absorbed into the liquid coolant.

As shown in FIG. 3 , the heat radiation portion 50 has a heat radiation portion main body 51 and a plurality of heat radiation sheets 57 thermally coupled with the heat radiation portion main body 51 . The heat radiation portion main body 51 is constituted by piping through which a liquid coolant flows. The heat radiation part main body 51 has a coolant inlet 54 and a coolant outlet (disposed on the depth side of the coolant inlet when viewed through the paper of FIG. 3 , although it is not shown), so that the coolant flows inward flow.

According to one embodiment of the present invention, the heat radiation part main body 51 is made of a substantially U-shaped pipe. One open end of the pipe serves as the coolant inlet 54 and the other open end of the pipe serves as the coolant outlet. Therefore, the pipe (heat radiation portion main body 51 ) of the heat radiation portion 50 constitutes a part of a circulation passage 60 (which will be described in more detail below).

The heat radiation sheet 57 is made of a metal material having excellent thermal conductivity, such as aluminum alloy or copper material. The heat radiation sheet 57 forms a rectangular plate. The heat radiation sheets 57 are arranged parallel to each other and spaced apart from each other. The heat radiation sheet 57 is welded to the heat radiation section main body 51 .

The heat radiation part 50 is disposed in the first casing 10 , wherein the heat radiation sheet 57 is located at a position opposite to the exhaust port 15 of the first casing 10 . According to one embodiment of the present invention, a pair of brackets 58 are welded to the heat radiation part 50 . Each bracket 58 is fixed to a protrusion (not shown) protruding from the bottom plate 11 a of the first housing 10 by screws. In this way, the heat radiation portion 50 is fixed to the bottom wall 11 a of the first housing 10 .

The circulation passage 60 has a first duct 61 , a second duct 62 , and a duct (heat radiation unit main body 51 ) belonging to the heat radiation unit 50 . That is, the heat radiation part main body 51 functions as the heat radiation part 50 and the circulation passage 60 at the same time. The first pipe 61 connects the outlet pipe 132 of the pump 100 to the coolant inlet 54 of the heat radiation part 50 . The second pipe 62 connects the inlet pipe 131 of the pump 100 and the coolant outlet of the heat radiation part 50 . Thus, the liquid coolant passes through the first and second pipes 61 and 62 , and circulates between the pump 100 and the heat radiation part 50 .

The electric fan 70 blows cold air to the heat radiation part 50 and is arranged directly in front of the heat radiation part 50 . The electric fan 70 has a fan case 71 and a centrifugal impeller 72 provided in the fan case 71 . The fan case 71 has an outlet 71a for drawing out cooling air. The outlet 71 a is connected to the heat radiation portion 50 through a pipe 73 .

The impeller 72 is driven by a motor (not shown), for example, when the portable computer 1 is turned on and when the temperature of the CPU 31 reaches a predetermined level. Thus, cool air is delivered from the outlet 71 a of the fan case 71 to the heat radiation portion 50 .

The operation of the cooler 40 will be described below.

During the use of the portable computer 1, the IC chip 33 of the CPU 31 generates heat. The heat generated by the IC chip 33 is transferred to the pump housing 101 through the heat absorbing surface 122 a of the pump 100 . The recess 113 (the pump chamber 118 and the sump 119 ) of the pump casing 101 is filled with liquid coolant so that the liquid coolant absorbs much of the heat transmitted to the pump casing 101 .

When the portable computer 1 is powered on, current is supplied to the stator 103b of the motor 103 . Therefore, torque is generated between the stator 103b and the rotor 103a, so that the rotor 103a drives the impeller 102 to rotate. With the rotation of the impeller 102 , the liquid coolant in the pump chamber 118 is pressurized and drawn out from the outlet pipe 132 , and at the same time, is introduced into the heat radiation portion 50 from the coolant inlet 54 through the first pipe 61 . The liquid coolant heated by heat exchange in the pump housing 101 flows from the coolant inlet 54 to the coolant outlet side, during which heat of the IC chip 33 is absorbed by the liquid coolant and transferred to the heat radiation fins 57 .

During use of the portable computer 1 , cool air flows from the outlet 71 a of the fan case 71 to the heat radiation portion 50 by the rotation of the impeller 72 of the electric fan 70 . Cool air 57 passes between heat radiation fins 57 adjacent to each other. Thereby, components such as the heat radiation sheet 57 and the heat radiation section main body 51 are cooled. Then, when the cold air flows in this way, most of the heat transferred to the heat radiation sheet 57 and the heat radiation portion main body 51 is discharged from the exhaust port 15 to the outside of the first housing 10 .

The liquid coolant cooled in the heat radiation part 50 is introduced into the inlet pipe 131 of the pump casing 101 through the second pipe 62 . The liquid coolant returns to the sump 119 from the inlet pipe 131 . When sucked into the pump chamber 118 , the liquid coolant thus returned to the reservoir 119 absorbs heat from the IC chip 33 again.

During the repetition of the operation cycle, the heat of the IC chip 33 is continuously transferred to the heat radiation portion 50 , loaded on the cool air flowing through the heat radiation portion 50 , and thereby discharged to the outside of the first case 10 .

As described above, in the pump 100, the cooler 40, and the portable computer 1 having the pump 100 according to the present embodiment, at least one part (part) of the pump casing 101 is made of resin containing at least one of the following: (1) a metal filler; (2) a filler of a material having a lower linear expansion coefficient than the resin; and (3) a filler of a material having a lower water vapor transmission rate than the resin. Therefore, evaporation, or leakage of the coolant is suppressed, so that the CPU 31 is ideally cooled for a longer period of time.

In the pump 100 of the present embodiment, when the main body basic portion 121 and the first case cover 111 are made of resin containing at least one of metal filler, carbon filler, and ceramic filler, the main body basic portion 121 and the The first casing cover 111 is not limited to the above-mentioned filler material, and other parts of the pump casing 101 may be formed of side (other) filler materials. For example, the heat absorbing plate 122 and the second case cover 112 may be made of resin containing the above-mentioned filler. The main body base part 121 may be made of a material such as a metal material having a high thermal conductivity to enhance the heat exchange effect in the pump casing 101 .

The housing 110 may be made of resin except for the portion (part) of the heat absorbing surface 122a. In this case, parts of the housing 110 other than the heat absorbing portion including the heat absorbing surface 122a may also be made of a resin containing a filler material having a lower coefficient of linear expansion than the resin and/or having a lower linear expansion coefficient than the resin. Resin filler material with lower water vapor transmission rate.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (20)

1. A pump, characterized in that comprising: impeller (102); and a pump casing (101) connected to the impeller, the pump casing (101) comprising a plurality of parts including a casing (110) connected to a first casing cover (111), the plurality of At least one of the parts is made of a resin containing at least one of: (i) a metal filler; (ii) a filler of a material having a lower coefficient of linear expansion than the resin; and (iii) ) a filler of a material having a lower water vapor transmission rate than the resin. 2. The pump according to claim 1, characterized in that, the first casing cover (111) of the pump casing (101) is made of the resin. 3. The pump according to claim 2, characterized in that said plurality of components of said pump housing (101) further comprises a main body base (121) and a suction shaft thermally coupled to said main body base (121). A hot plate (122), said main body base (121) is also made of said resin. 4. The pump according to claim 1, characterized in that said plurality of components of said pump housing (101) further comprises a main body base (121) and a suction body thermally coupled to said main body base (121). A hot plate (122), the main body base (121) is made of the resin. 5. The pump according to claim 1, characterized in that said plurality of components of said pump housing (101) comprises a main body base (121) and a heat absorber thermally coupled to said main body base (121) A plate (122), said heat absorbing plate (122) being made of said resin. 6. The pump according to claim 1, characterized in that the impeller (102) is located in a recess (113) formed inside the pump casing (101 ), and all of the pump casing (101 ) The first case cover (111) covers the opening of the recess (113). 7. The pump according to claim 1, further comprising a motor (103) for rotating the impeller (102). 8. The pump according to claim 7, characterized in that, the motor (103) comprises: a rotor (103a), located in the housing (110); and a stator (103b), coaxially located in the rotor (103a) to generate a magnetic field for rotating the impeller (102). 9. The pump of claim 1, wherein at least one of said plurality of components is made of said resin containing a non-metallic filler having a higher density than said resin. Low coefficient of linear expansion. 10. The pump of claim 1 , wherein at least one of said plurality of components is made of said resin containing a non-metallic filler having a higher density than said resin. Low water vapor transmission rate. 11. The pump of claim 1, wherein at least one of said plurality of components is made of said resin containing a metal filler having a lower water vapor transmission rate. 12. A cooler, characterized in that it comprises: Heat radiation part (50); A pump (100) for forcedly circulating coolant to the heat radiation part (50), the pump (100) comprising a pump housing (101) and an impeller ( 102), the pump casing (101) includes a plurality of parts, the plurality of parts including: (a) a first casing cover (111); (b) a main body base (121), which is connected to the first a shell cover (111), including an inlet pipe (131) and an outlet pipe (132); and (c) a heat absorbing plate (122), which is thermally coupled to the main body base (121); wherein the first shell At least two of the cover (111), the main body base (121), and the heat absorbing plate (122) are made of resin, and the resin contains at least one of the following: (i) metal filler; ( ii) a filling of a material having a lower coefficient of linear expansion than the resin; and (iii) a filling of a material having a lower water vapor transmission rate than the resin; The first pipeline (61), connected to the outlet pipe (132) of the pump (100) and the heat radiation part (50), the first pipeline (61) will be at the pump (100) The heated coolant is sent to the heat radiation part (50); and a second pipe (62) is connected to the inlet pipe (131) of the pump (100) and the heat radiation part (50), so that The second pipe (62) transmits the coolant cooled by the heat radiation part (50) to the pump (100). 13. The cooler according to claim 12, characterized in that, the heat radiation part (50) comprises: A third pipe (51), comprising a first opening (54) connected to the first pipe (61) and a second opening connected to the second pipe (62); and a plurality of heat radiation fins (57) , thermally coupled to the third pipeline (51). 14. The cooler according to claim 12, characterized in that, the first casing cover (111) and the main body basic part (121) of the pump casing (101) are made of the resin. 15. The cooler according to claim 12, characterized in that the pump (100) further comprises a motor (103) for rotating the impeller (102). 16. The cooler according to claim 12, characterized in that at least two of the first shell cover (111), the main body base (121), and the heat absorbing plate (122) are made of made of said resin containing a metal filler having a lower coefficient of linear expansion than said resin. 17. The cooler according to claim 12, characterized in that at least two of the first shell cover (111), the main body base (121), and the heat absorbing plate (122) are made of The resin contains a metal filler having a lower water vapor transmission rate than the resin. 18. An electronic device, characterized in that it comprises: a heat generating unit (31) used in the first housing (10); and a cooler (40) comprising a pump (100) comprising a pump housing (101) and rotatably connected to the pump housing ( 101), the impeller for circulating the coolant, the pump housing (101) comprising: a case cover (111) made of a resin containing at least one of (i) a metal filler, (ii) a filler of a material having a lower coefficient of linear expansion than the resin, and (iii) ) a filler of material having a lower water vapor transmission rate than the resin; and A main body base (121), which is connected to the case cover (111), is made of the resin, and includes an inlet pipe (131) and an outlet pipe (132). 19. The electronic device according to claim 18, wherein the cooler (40) comprises: A heat radiation part (50), comprising a pipe (51) and a plurality of heat radiation sheets (57) thermally coupled to the pipe (51), the pipe (51) including a first opening (54) and a second opening; A first pipe (61) connected between (i) the outlet pipe (132) located in the main body basic part (121) of the pump (100) and (ii) the heat radiation part (50) between said first openings (54) of said ducts (51 ), said first ducts (61 ) for conveying coolant heated at said pump (100) to said ducts (51 ); as well as A second pipe (62) connected to (i) the inlet pipe (131) in the main body base (121) of the pump (100) and (ii) the heat radiation portion (50) The second opening of the pipe (51), the second pipe (62) conveys the coolant cooled by the plurality of heat radiation fins (57) to the pump (100). 20. The electronic device according to claim 18, characterized in that, the pump (100) of the cooler (40) further comprises a motor (103) for rotating the impeller (102).

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