CN1685463A - Image display device, method of manufacturing a spacer for use in the image display device, and image display device having spacers manufactured by the method - Google Patents

Abstract

An image-displaying device has a first substrate (10) with a fluorescent face and a second substrate. The second substrate is provided spaced apart from and opposite the first substrate, and has electron sources (18) on it. Between the first and second substrates are spacers (30a, 30b) for supporting a load of atmospheric pressure acting on the substrates. The tip portion of the first substrate of and that of the second substrate of each of the spacers are impregnated with an electric conductive material to form electric conductivity-applying portions (31a, 31b), respectively.

Description

Image display device Manufacturing method of spacer used in image display device and image display device having spacer manufactured by the method

technical field

The present invention relates to an image display device having substrates arranged facing each other and a plurality of electron sources located on the inner surface of one of the substrates. The present invention also relates to a method of manufacturing a spacer used in the image display device, and to an image display device having the spacer manufactured by the method.

Background technique

In recent years, there has been demand for image display devices of advanced broadcasting or high-resolution type, which require more stringent screen display performance. To meet these demands, the screen surface must be flat and the resolution improved. Furthermore, these devices must be lightweight and thin.

Flat panel image display devices such as field emission displays (hereinafter referred to as FEDs) have good prospects as image display devices capable of satisfying the above requirements. The FED has a first substrate and a second substrate facing each other with a certain gap therebetween. These substrates have respective peripheral portions connected directly or via side walls shaped as rectangular frames. These substrates thus constitute the vacuum envelope. A phosphor layer is formed on the inner surface of the first substrate. A plurality of electron emission elements are provided on the inner surface of the second substrate, and they serve as an electron source for exciting the fluorescent layer and causing the fluorescent layer to emit light.

A number of spacers or supports are located between the first and second substrates to facilitate supporting atmospheric loads on the substrates. When an image is displayed on the FED, an anode voltage is applied to the phosphor screen, and electron beams emitted from the electron emission element are accelerated by the anode voltage, and as they hit the phosphor screen, the phosphor screen emits light and video images are displayed.

In this type of FED, each electron emission element has a size on the order of micrometers, and the distance between the first substrate and the second substrate is on the order of millimeters. Therefore, such an image display device can achieve higher resolution and is lighter in mass and thinner than cathode ray tubes (CRTs) used as displays of existing television receivers or computers.

An image display device of the above-mentioned type must have practical display performance. For this reason, the anode voltage should preferably be several thousand volts or higher when used with phosphors, similar to that of conventional cathode ray tubes. However, the gap between the first and second substrates cannot be too large in consideration of its resolution and properties and the manufacturability of the support. This gap must be approximately 1mm to 3mm. It is unavoidable that secondary electrons and reflected electrons are generated when electrons emitted from the second substrate impinge on the spacer. Therefore, the separator is charged. Typically, the separator is forward charged at the accelerating voltage of the FED. As a result, the spacer attracts the electron beams emitted from the electron-emitting elements and deflects these electron beams from their original paths. This can cause electrons to erroneously land on the phosphor layer, ultimately reducing the color purity of the displayed image.

In order to reduce the attraction force of electron beams to the spacers, each spacer may exhibit electrical conductivity over its entire surface or a part of its surface. For example, US Patent No. 5,726,529 discloses a structure in which an insulating spacer exhibits electrical conductivity at an end close to the second substrate. Therefore, it is possible to prevent the separator from being charged.

However, if the spacer exhibits electrical conductivity, the inactive current flowing from the first substrate to the second substrate will increase. This increases temperature and increases power consumption. Moreover, the usual process of rendering the separator electrically conductive has to increase the manufacturing cost.

Technical scheme of the present invention

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide an image display apparatus in which electron beams can be prevented from being deviated from their paths, thereby displaying higher-quality images. Another object of the present invention is to provide a method of manufacturing a spacer used in the image display device, and an image display device having a spacer manufactured using the method.

In order to achieve the above object, an image display device according to a solution of the present invention includes: a first substrate having a fluorescent surface; a second substrate facing the first substrate, having a gap, and having a plurality of electron sources, which constituting a surface capable of emitting electron beams to excite fluorescent light; and a plurality of spacers, made of insulating material, disposed between the first substrate and the second substrate, supporting the atmosphere acting on the first substrate and the second substrate Each spacer has a distal portion on the first and second substrates respectively, and the distal portion is filled with conductive material and constitutes a conductive portion.

In the thus constituted image display apparatus, electron beams emitted from each electron source located near a spacer are repelled by the electric field generated by the conductance providing portion provided at the end of the spacer. The electron beam thus propagates along a path deviated from the partition. Then, the electron beam is attracted to the partition and thus propagates along a path close to the partition. Repulsive and attractive forces eliminate the deviation of the electron beam from its path. The electron beams emitted by the electron emitting element finally reach the target position on the phosphor surface. This avoids erroneous landings of the electron beams, thereby degrading the color purity. Therefore, SED can display higher quality images. Therefore, the image display device can display images of improved quality. Furthermore, the increase in temperature and the increase in power consumption can be more controlled than an image display device with an electrically conductive spacer in general.

According to another aspect of the present invention, a method for manufacturing a plurality of partitions in an image display device includes: forming the partitions by using an insulating material; adding a slurry or a solution containing any conductive component to a remote part of each partition; end, and allow the slurry or solution to permeate into the distal end by capillary action; fire each separator that has been infiltrated by the slurry or solution to provide a conductive portion at the distal end that is filled with conductive material clapboard.

According to still another aspect of the present invention, a method of manufacturing a separator includes: forming the separator by using an insulating material; adding a slurry or a solution containing any conductive component to the distal end of the separator; and A heat treatment is performed on the slipped separator to diffuse the conductive component at the distal end of the separator, thereby providing a separator having a conductive portion filled with the conductive material at the distal end.

According to another solution of the present invention, a method for manufacturing a separator includes: preparing a stamp with many through holes for forming the separator; pouring a first slurry that does not contain conductive components into the through holes; pouring a second paste in which a conductive component is dispersed into the through hole, whereby the second paste acts on the first paste; heating the first paste and the second paste, thereby providing a remote The ends have a partition having a conductive portion in which the conductive composition is dispersed.

Brief description of the drawings

1 is a perspective view of a surface emitting display (hereinafter referred to as SED) according to a first embodiment of the present invention;

Fig. 2 is the SED perspective view cut along line II-II in Fig. 1;

Figure 3 is an enlarged cross-sectional view of the SED;

4 is a cross-sectional view showing first and second stampers adhered to a grid in a spacer manufacturing step used in an SED;

5 is a cross-sectional view depicting a stamp filled with spacer material to which UV application and silver paste application have been performed;

Fig. 6 is a sectional view showing removal of a spacer from a die in the spacer manufacturing method;

7 is a cross-sectional view showing a method of manufacturing a spacer used in an SED, which is a second embodiment of the present invention.

Example;

8 is a cross-sectional view explaining a step of adding a solution, the solution containing a conductive component, onto the top of the spacer in the method according to the second embodiment;

Fig. 9 is a sectional view explaining the manufacturing method of the separator used in the SED, which is the third aspect of the present invention.

Example;

10 is a cross-sectional view describing a stamp filled with a first slip and a second slip in a method of manufacturing a separator according to a third embodiment; and

Fig. 11 is a cross-sectional view showing removal of the spacer from the stamp in the spacer manufacturing method according to the third embodiment.

Best Mode for Carrying Out the Invention

Embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are applicable to SEDs which are one type of flat panel image display devices and FEDs.

As shown in FIGS. 1 to 3, the SED includes a first substrate 10 and a second substrate 12, which are rectangular glass plates serving as transparent insulating substrates. These substrates are arranged facing each other with a gap of about 1.0 to 2.0 mm between them. The size of the second substrate 12 is larger than that of the first substrate 10 . The first substrate 10 and the second substrate 12 are bonded together at their peripheral portions by glass side walls 14 shaped as rectangular frames. The thus bonded substrates 10 and 12 make up a planar vacuum envelope 15 .

A phosphor screen 16 or phosphor face is formed on the inner surface of the first substrate 10 . The fluorescent screen 16 is composed of fluorescent layers R, G and G and a black light-shielding layer 11 on the first substrate 10 . When electrons hit the layers, layer R glows red, layer G glows green, and layer B glows blue. Phosphor layers R, G and B are arranged in stripes or dots. A metal case 17 made of aluminum or the like is formed on the phosphor screen 16 . A transparent conductive film, such as ITO, or other color filter films can be interposed between the first substrate 10 and the fluorescent screen 16 .

On the inner surface of the second substrate 12, a large number of surface conduction electron emission elements 18 are provided. They are electron sources and emit electron beams that excite the phosphor layers of the phosphor screen 16 . The electron emission elements 18 are arranged in rows and columns, each forming a pixel. Each electron emission element 18 has an electron emission portion (not shown), and a pair of element electrodes for applying a voltage to the electron emission portion and the like. A large number of wires (not shown) for applying a voltage to the electron emission elements 18 are arranged on the inner surface of the second substrate 12 in a matrix. The wires exit the vacuum envelope 15 at either end.

Side walls 14 serving as connectors are sealed on peripheral end portions of the first substrate 10 and the second substrate 12 using a sealant 20 . Thus, the sidewall 14 is connected to the first and second substrates. For example, the sealant is made of low-melting glass or low-melting metal.

As described in FIGS. 2 and 3 , the SED has a bulkhead assembly 22 . The spacer assembly 22 is located between the first substrate 10 and the second substrate 12 . In this embodiment, the spacer assembly 22 is provided with a plate-shaped grid 24 and a plurality of columnar spacers integrally formed on both surfaces of the grid.

More specifically, the grid 24 has a first surface 24a and a second surface 24b, which are disposed parallel to the substrates. The first surface 24 a faces the inner surface of the first substrate 10 . The second surface 24 b faces the inner surface of the second substrate 12 . The grid 24 is provided with a number of electron beam passage holes 26 and a number of baffle openings 28 . Via holes 26 and openings 28 are formed by etching or similar processes. The electron beam passage holes 26 are arranged to lead to the electron emission elements 18 respectively, and the electron beams emitted by the electron emission elements pass through the corresponding electron beam passage holes. The partition openings 28 are located between the electron beam passage holes 26 and are arranged at a set interval.

The grid 24 is a sheet of iron-nickel metal having a thickness of, for example, 0.1 to 0.25 mm. On the surface of the grid 24, a metal oxide film is formed, which forms a metal film. The metal oxide film is made, for example, of Fe ₃ O ₄ and Fe ₂ NiO ₄ . A high-resistance film is provided at least on the surface of the grid 24, which is located on the second substrate. The high resistance film is formed by applying and firing a high resistance substance made of glass and ceramics. The resistance value of the high resistance film is E+8Ω/□ or more.

The electron beam passage holes 26 are square, for example, each of which has a width of 0.15 mm to 0.25 mm and a length of 0.15 mm to 0.25 mm. The diameter of the partition opening 28 is, for example, approximately 0.2 mm to 0.5 mm. The aforementioned high-resistance film is also provided on the surface of the wall defining the electron beam passage hole 26 .

The first partitions 30a protrude from the first surface 24a of the grid 24 and are integrally formed therewith, overlapping with the corresponding partition openings 28, respectively. The extended end of each first spacer 30 a is adjacent to the inner surface of the first substrate 10 through the metal shell 17 and the black light-shielding layer 11 of the fluorescent screen 16 . The second partitions 30b protrude from the second surface 24b of the grid 24 and are integrally formed therewith, overlapping with the corresponding partition openings 28, respectively. The extended end of each second spacer 30 b abuts on the inner surface of the second substrate 12 . The extended end of the second spacer 30 b is located on the lead 21 provided on the inner surface of the second substrate 12 .

The first spacer 30a and the second spacer 30b are made of an insulating material. The distal end portions of the first spacer 30a and the second spacer 30b contain a conductive material and constitute conductive portions 31a and 31b, respectively. In the conductive parts 31a and 31b, the content of the conductive material gradually decreases from the distal end to the middle, that is, to the grid 24 .

As described below, the conductive portions 31a and 31b generate an electric field. The electric field deflects the electron beams emitted from the electron emission elements 18 away from the first spacer 30a and the second spacer 30b. The conductive material contained in the conductive parts 31a and 31b, for example, can be Ni, In, Ag, Au, Pt, Ir, Ru and W etc. The height of the conductive parts 31a and 31b and the content of the conductive material are determined by the action of the electron beam The repulsive force, that is, the degree to which the electron beam path is corrected is determined.

Each of the first baffles 30a and the second baffles 30b is designed to be tapered such that their diameters decrease from the sides of the grid 24 toward the extended ends. For example, each first partition 30a is formed such that its proximal end on the side of the grid 24 has a diameter of about 0.4 mm, its extended end has a diameter of about 0.3 mm, and its height is about 0.6 mm. Each second partition 30b is formed such that its proximal end on the side of the grid 24 has a diameter of about 0.4 mm, its extended end has a diameter of about 0.25 mm, and its height is about 0.8 mm. Therefore, the height of the second partition 31b is greater than the height of the first partition 31a.

The surface resistance of the first separator 30 a and the second separator 30 b was 5×10 ¹³ Ω. Each baffle opening 28 and the first and second baffles 30a, 30b are aligned with each other. The first bulkhead 30a and the second bulkhead 30b are connected to each other by the bulkhead opening 28 to form a unitary part. The first partition 30a and the second partition 30b are thus integrally formed with the grid 24, and the clamping grid 24 is clamped on both sides.

The spacer assembly 22 constituted as described above is interposed between the first substrate 10 and the second substrate 12 . The first spacer 30a and the second spacer 30b adjoin the inner surfaces of the first substrate 10 and the second substrate 12, respectively, carrying the air load acting on these substrates. Therefore, the spacers 30a and 30b support the air load acting on these substrates, and keep these substrates at a prescribed distance apart.

As shown in FIG. 2 , the SED has a voltage supply unit (not shown) that supplies voltage to the grid 24 and the metal shell 17 of the first substrate 10 . The pressure supply unit is connected with the grid 24 and the metal shell 17 . It supplies a voltage, for example, 12 kv and a voltage equal to or less than 12 kv to the grid 12 and the metal case 17, respectively. The voltage applied to the grid 24 is set to be equal to or greater than the voltage applied to the first substrate 10 .

In order for the SED to display an image, an anode voltage is applied to the phosphor screen 16 and the metal case 17 , which accelerates the electron beam B emitted from the electron emission element 18 to impinge on the phosphor screen 16 . The electron beams activate the phosphor layers of the phosphor screen 16 . This displays the image.

A manufacturing method of the above-mentioned SED type will be explained. To manufacture the separator assembly 22, a grid 24 having a prescribed size, and two first and second stampers 36a and 36b of rectangular plates of almost the same size are prepared. In this case, a thin plate formed of Fe-45-55%Ni with a thickness of 0.12 mm was degreased, washed and dried. Thereafter, electron beam passage holes 26 and spacer openings 28 are formed by etching on the thin plate, thereby providing the grid 24 . The entire grid 24 is oxidized by an oxidation process to form an insulating film on the surface of the grid 24 , on the inner surface of each electron beam passage hole 26 and on the inner surface of each partition opening 28 . Also, a solution having fine antimony oxide particles dispersed therein is sprayed onto the insulating film to form a solution layer. The solution layer is dried and fired, thereby forming a high-resistance film.

As shown in FIG. 4, a first die 36a and a second die 36b serving as a mold are provided with through holes 38a and 38b, respectively. Holes 38a and 38b are used to form partitions, respectively. These through-holes are respectively distributed in alignment with the partition openings 28 of the grid 24 . The first and second stampers 36a and 36b are coated with a resin capable of thermally decomposing at least on the inner surfaces of the through holes 38a and 38b.

The first stamp 36a is positioned on the first surface 24a of the grid 24 using through-holes 38a aligned with the corresponding bulkhead openings 28 of the grid 24 when positioned. Likewise, a second die 36b is positioned on the second surface 24b of the grid 24 using through-holes 38b aligned with the corresponding bulkhead openings 28 of the grid 24 when positioned. The first stamper 36a, the grid 24, and the second stamper 36b are fixed to each other using a clamper (not shown) or the like.

Then, for example, the slip barrier forming material 40 is supplied from the outer surface of the first stamp 36a, filling the through holes 38a of the first stamp 36a, the barrier openings 28 of the grid 24 and the through holes of the second stamp 36b. 38b. A glass frit containing at least an ultraviolet curable binder (organic component) and a glass filler is used as the spacer forming material 40 .

Subsequently, ultraviolet rays (hereinafter referred to as UV) act as radiation on the filled spacer forming material 40 from the outer surface sides of the first and second stamps 36a and 36b, curing the spacer forming material. Thereafter, heat curing treatment may be performed if necessary. Then, the resin applied to the through holes 38a of the first stamper 36a and the through holes 38b of the second stamper 36b is thermally decomposed by heat treatment, forming gaps between the spacer forming material 40 and the through holes shown in FIG. . For example, the screen printing process is performed by applying silver paste or a conductive material to both ends of each layer of the spacer forming material 40, ie, only those portions where the first spacer 30a and the second spacer 30b will be formed. Then, the first and second stamps 36 a and 36 b are removed from the grid 24 .

Next, the grid 24 having the first and second partitions 30a and 30b formed of the partition material 40 is heat-treated in a heating furnace. As a result, the binder evaporates from the separator-forming material. Thereafter, the separator forming material is uniformly fired at a temperature of about 500 to 550° C. for 30 minutes to one hour. The baffle assembly 22 having the first and second baffles 30a and 30b is thus disposed on the grid 24 as shown in FIG. 6 . At this time, the silver component of the silver paste is spread on the distal ends of the first and second spacers 30a and 30b at a distance of about 0.15mm. As a result, the first and second spacers 30a and 30b acquire, asbulgs, the conductive portions 31a and 31b. The conductive portions 31a and 31b contain silver at the distal ends and are integrally formed with the spacers 30a and 30b.

At the same time, the first substrate 10 and the second substrate 12 are prepared. The first substrate 10 has a fluorescent screen 16 and a metal shell 17 . Second substrate 12 has electron emission elements 18 and leads 21 and is connected to side wall 14 .

Then, the spacer assembly 22 constructed as described above is distributed on the second substrate 12 . At this time, the spacer assembly 22 is positioned such that the extended end of the second spacer 30 b is located on the lead 21 . The thus positioned first substrate 10, second substrate 12 and spacer assembly 22 are distributed in the vacuum chamber. The vacuum chamber is evacuated and the first substrate is connected to the second substrate using side walls 14 . Thereby, the SED having the separator assembly 22 can be manufactured.

As shown in FIG. 3, the electron beams B emitted from the electron emission elements 18 located near the second spacer 30b are repelled by the electric field generated by the conductive portion 31b at the distal end portion of the second spacer 30b. Accordingly, the electron beam B propagates toward the electron beam passage hole 26 while traveling in a passage deviated from the second partition. Thereafter, the electron beams B are attracted by the charged second spacers 30b, and travel in channels close to these spacers. Then, the electron beam B is repelled by the electric field generated by the conductive portion 31a constituting the distal end portion of the first spacer 30a. Therefore, the electron beam B propagates toward the fluorescent screen 16 while traveling in a path deviated from the second partition. The repulsive and attractive forces compensate for the electron beam B's deviation from the channel. The electron beams B emitted from the electron emitting elements 18 finally reach the target phosphors of the phosphor screen 16 .

The shorter the distance between the electron emitting element 18 and the spacer, the longer the electron beam travels to the spacer. On the contrary, if the distance between the electron-emitting element and the spacer is sufficiently long, the distance traveled by the electron beams to the spacer is negligibly short. The electron beam keeps moving until the secondary electrons or reflected electrons generated on the surface of the screen hit the spacer and charge the spacer. The acceleration voltage used in the SED is such a value that the emission coefficient of secondary electrons is 1 or more. Therefore, the side walls of the spacer are positively charged and the electron beams are attracted to the spacer.

In this SED, an electric field that repels electron beams from the spacer is not generated through the discharge spacer. On the contrary, the electric field is generated by disposing the conductive portions 31a and 31b at the distal ends of the first and second spacers 30a and 30b, which are located on the first and second substrates 10, respectively. and the vicinity of 12. Thus the height of the conductive portions 31a and 31b can be controlled to vary the strength of the magnetic field and, finally, to control the degree of repulsion.

From this, even if the first and second spacers 30a and 30b are charged and attract the electron beam B, the electron beam B can be prevented from being deviated from the path in the SED. This prevents erroneous landing of the electron beams B, thereby reducing degradation in color purity. Therefore, the SED can display high-quality images.

Among the conductive portions provided on the spacer, the conductive portion 31b provided on the second substrate 12 is located near the electron emission side. The electric field generated by the conductive portion 31b greatly affects the passage of electron beams. That is, the electron beams are sensitive to the electric field generated by the conductive portion 31b. Therefore, even if the height of the conductive portion 31b, as measured by the second substrate 12, changes a little, the path of the electron beam will change a lot. This is why the electron beams emitted from many electron-emitting elements also move by different distances if the conductive portion 31b has acquired different heights during the manufacturing process. Therefore, the passage of electron beams can hardly be precisely controlled using only the conductive portion 31b provided in the vicinity of the second substrate.

However, according to the embodiment of the present invention, the passage of electron beams can be easily controlled with high precision in the SED. This is because the conductive portions 31a and 31b are provided on the distal end portions of the first and second spacers 30a and 30b, respectively, reducing the effect of the conductive portion 31b on the electron beams. The conductive portion 31a with lower sensitivity compensates for the correction of insufficient channels. This enables easy and correct control of the passage of the electron beams.

Therefore, the conductive portions 31a and 31b do not have to be formed with high precision. Therefore, they can be easily manufactured. That is, the conductive portion is provided on the distal end portions of the first spacer 30a and the second spacer 30b, thus obtaining the same effect as that achieved by providing the conductive portion at a precise height only on the side surface of the second substrate 12 .

If the first and second spacers 30a and 30b all exhibit electrical conductivity, the reactive current flowing from the first substrate 10 through the spacers to the second substrate 12 will increase to increase the temperature and increase the power consumption. . Also, the parts of each spacer that are electrically conductive generate gas during operation of the SED, which may cause ions to impinge on electron-emitting elements located near the spacers.

In this embodiment, the first and second partitions 30a and 30b are provided with conductive portions 31a and 31b only at their distal ends, respectively. Each partition is a three-section structure, or a conductor-insulator-conductor unit. Therefore, the separator does not cause an increase in reactive current, an increase in temperature, or collision of ions. The conductive portions 31a and 31b change the electric field around the spacer, enabling easy and accurate control of the path of the electron beams.

An SED according to this embodiment and an SED having spacers each having no conductive portions 31a and 31b were prepared, and they were compared in terms of movement of electron beams. In the SED without the conductive portions 31a and 31b, the electron beam is attracted towards the spacer by about 120 [mu]m. In the SED according to the present embodiment, the moving distance of the electron beam is ±20 μm, and the color purity of the image is improved.

In the SED, the grids 24 are distributed between the first substrate 10 and the second substrate 12, and the height of the first spacer 30a is smaller than the height of the second spacer 30b. Therefore, the grid 24 is closer to the first partition 10 than the second partition 12 . Therefore, even if the first spacer 10 is discharged, the grid 24 can prevent the electron emission elements 18 provided on the second spacer 12 from being damaged by discharge. Thus, the SED has superior performance in preventing discharge and can display images with improved quality.

In the above-structured SED, the height of the first spacer 30a is smaller than the height of the second spacer 30b. Therefore, even if the voltage applied to the grid 24 is higher than the voltage applied to the first substrate 10, the electrons emitted from the electron-emitting elements 18 can reliably reach the phosphor screen.

A method of manufacturing a separator according to a second embodiment of the present invention will be described. A grid 24 having a prescribed size is formed in the same manner as in the method according to the first embodiment. Also, first and second stampers 36a and 36b are prepared. The first stamp 36a is then positioned on the first surface 24a of the grid 24 and positioned with the through holes 38a aligned with the bulkhead openings 28 of the grid 24, as shown in FIG. Likewise, a second die 36b is positioned on the second surface 24b of the grid 24 and is positioned with through-holes 38b aligned with the bulkhead openings 28 of the grid 24 . The first stamper 36a, the grid 24, and the second stamper 36b are fixed to each other using a clamper (not shown) or the like.

Then, for example, the slip barrier forming material 40 is supplied from the outer surface of the first stamp 36a, filling the through holes 38a of the first stamp 36a, the barrier openings 28 of the grid 24 and the through holes of the second stamp 36b. 38b. A glass frit containing at least an ultraviolet curable binder (organic component) and a glass filler is used as the spacer forming material 40 .

Subsequently, UV rays act on the filled spacer-forming material 40 from the outer surface sides of the first and second stamps 36a and 36b, curing the spacer-forming material. Thereafter, heat curing treatment may be performed if necessary. Then, the resin applied to the through holes 38a of the first stamper 36a and the through holes 38b of the second stamper 36b is thermally decomposed by heat treatment, forming gaps between the spacer forming material 40 and the through holes shown in FIG. . Then, the first and second stamps 36 a and 36 b are removed from the grid 24 .

Next, the grid 24 having the first and second partitions 30a and 30b formed of the partition material 40 is heat-treated in a heating furnace. As a result, the binder evaporates from the separator-forming material. Thereafter, a solution composed of very fine silver particles and etradecane solution, for example, acts on the distal end portion of the first spacer 30a and the distal end portion of the second spacer 30b by an inkjet process, as shown in FIG. As shown, while the spacer forming material 40 is still porous before firing. The applied solution penetrates into the distal end portions of the first and second partitions 30a and 30b by capillary action. The depth is about 0.2mm.

Then, the grid 24 having the first and second partitions 30a and 30b is placed on the furnace. The grid 24 is evenly fired at a temperature of about 500 to 550° C. for 30 minutes to one hour. This firing fuses together the glass grains constituting the spacer forming material. Thus, a separator assembly 22 is obtained. At the same time, first and second spacers 30a and 30b having conductive portions 31a and 31b are obtained, as bulgs. The conductive portions 31a and 31b each have a distal end portion containing silver.

Thereafter, the first substrate 10, the spacer assembly 22, and the second substrate 12 are connected together in the same method as in the first embodiment. As a result, an SED having the spacer assembly 22 can be manufactured.

An SED according to this embodiment and an SED having spacers each having no conductive portions 31a and 31b were prepared, and they were compared in terms of movement of electron beams. In the SED without the conductive portions 31a and 31b, the electron beam is attracted towards the spacer by about 120 [mu]m. In the SED according to the present embodiment, the moving distance of the electron beam is ±20 μm, and the color purity of the image is improved.

This embodiment is the same as the first embodiment in terms of other structures. Components that are the same as those in the first embodiment are denoted by the same reference numerals and will not be described in detail. The SED having the separator manufactured by the method according to the second embodiment can obtain the same effect as that of the first embodiment.

A method of manufacturing a separator according to a third embodiment of the present invention will be described. The grid 24 is formed in the same manner as in the method according to the first embodiment. Also, first and second stampers 36a and 36b are prepared. The first stamp 36a is then positioned on the first surface 24a of the grid 24 and positioned with the through-holes 38a aligned with the bulkhead openings 28 of the grid 24, as shown in FIG. Likewise, a second die 36b is positioned on the second surface 24b of the grid 24 and is positioned with through-holes 38b aligned with the bulkhead openings 28 of the grid 24 . The first stamper 36a, the grid 24, and the second stamper 36b are fixed to each other using a clamper (not shown) or the like.

Then, the first slip 40a serving as a spacer forming material is supplied from the outer surface of the first stamp 36a, filling the through holes 38a of the first stamp 36a, the spacer openings 28 of the grid 24 and the second stamp 36b. The through hole 38b. The ends of the through holes 38a and 38b are not filled with the first slip 40a, leaving some spaces in these through holes 38a and 38b. The first slip 40a is an insulating glass slip comprising at least a UV-curable binder and a glass filler. The paste does not contain conductive components.

Subsequently, the second paste 40b serving as a barrier-forming material is supplied from the outer surface of the second stamper 36b to the end portions of the through holes 38a and 38b, over the first paste 40a. The second paste 40b is a glass paste containing a UV-curable binder (organic component), glass filler, and Au particles. The Au microparticles serve as a conductive component.

Next, UV rays are applied to the used first and second slips 40a and 40b from the outer surface sides of the first and second stampers 36a and 36b. The first and second slips 40a and 40b are cured with UV rays. Thereafter, heat curing treatment may be performed if necessary. Then, the resin acting on the through holes 38a of the first stamper 36a and the through holes 38b of the second stamper 36b is thermally decomposed by heat treatment. This forms a gap between the spacer forming material 40 and the through hole. Then, the first and second stamps 36 a and 36 b are removed from the grid 24 .

Next, the grid 24 having the first and second partitions 30a and 30b formed of the first and second slips 40a and 40b is heat-treated in a heating furnace. The binder thus evaporates from the first and second slips 40a and 40b. The adhesive is thereby removed. Also, the first and second slips 40a and 40b are uniformly fired at a temperature of about 500 to 550° C. for 30 minutes to one hour. Thus, a partition assembly 22 is obtained, which has first and second partitions 30a and 30b formed on the grid 24, as shown in FIG. Simultaneously, first and second spacers 30a and 30b, as bulgs, having conductive portions 31a and 31b containing Au diffused at their distal end portions were obtained.

Thereafter, the first substrate 10, the spacer assembly 22, and the second substrate 12 are connected together in the same method as in the first embodiment. As a result, an SED having the spacer assembly 22 can be manufactured.

An SED according to this embodiment and an SED having spacers each having no conductive portions 31a and 31b were prepared, and they were compared in terms of movement of electron beams. In the SED without the conductive portions 31a and 31b, the electron beam is attracted towards the spacer by about 120 [mu]m. In the SED according to the present embodiment, the moving distance of the electron beam is ±20 μm, and the color purity of the image is improved.

The third embodiment is the same as the first embodiment in other configurations. Components that are the same as those in the first embodiment are denoted by the same reference numerals and will not be described in detail. The SED having the separator manufactured by the method according to the third embodiment can obtain the same effect as that of the first embodiment.

The present invention is not limited to the above-described embodiments. Various modifications can be made thereto within the scope of the present invention. For example, the present invention is not limited to image display devices having a grid. It is applicable to an image display device without a grille. In this case, integrally formed spacers may be used, the shape of which may be columnar or plate-shaped, and each spacer is provided with two conductive portions at the distal ends facing the first and second substrates, respectively. Such a device can obtain the same effects as those of the above-described embodiments.

The height of the partitions, dimensions of other components, materials, etc. can be changed if necessary. In the above-described embodiments, the end portion of each spacer provided on the second substrate is located above the lead provided on the second substrate. However, it may be located at any other position as long as it is spaced from the electron-emitting element.

The grid 24 and the first substrate can be set at the same potential. If this is the case, the first spacers may be filled with a conductive material, whereby they all assume electrical conductivity.

In the above-mentioned embodiments, the first and second partitions are respectively provided with conductive distal ends. However, only the second spacer may be provided with the conductive portion at the end facing the second substrate. Using this separator, an SED can be configured.

The electron source is not limited to surface conduction electron-emitting elements. Therefore, the present invention can be applied to any FED using an electron source, such as a field emission element or carbon nanotube, which emits electrons in a vacuum.

Industrial Applicability

The present invention can provide an image display apparatus in which the path of electron beams can be easily controlled without increasing temperature, power consumption, or manufacturing cost, thereby enabling display of higher quality images. The present invention can also provide a method of manufacturing a spacer used in an image display device, and an image display device having a spacer manufactured by the method.

Claims (18)

1. image display comprises:

First substrate has the face;

Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face; With

A plurality of dividing plates are made by insulating material, are arranged between first substrate and second substrate, and the atmospheric loading of supporting role on first substrate and second substrate,

Each dividing plate has distal portion at first and second substrates respectively, distal portion dipping electric conducting material, and form current-carrying part.

2. image display as claimed in claim 1, wherein: the concentration of electric conducting material reduces to its middle part gradually from arbitrary distal portion of dividing plate in the current-carrying part.

3. image display as claimed in claim 1 or 2, wherein: dividing plate is made by the insulating material that comprises glass, and each current-carrying part comprises and has conductivity and be dispersed in metal particle in the glass composition, and the glass composition forms each dividing plate.

4. image display as claimed in claim 1 or 2, wherein: dividing plate is made by the insulating material that comprises glass, and each current-carrying part comprises and has conductivity and be dispersed in metal ingredient in the glass composition, and the glass composition forms each dividing plate.

5. image display as claimed in claim 3, wherein: metal particle is from by Ni, In, Ag, Au, Pt, Ir selects a kind of particulate of metal at least in the group that Ru and W form.

6. image display as claimed in claim 1, wherein: the lead-in wire of a plurality of current potential special uses is arranged on second substrate, and the end that is positioned at each dividing plate on second substrate is distributed on the current potential dedicated pin.

7. image display as claimed in claim 6, wherein: electron source is the electronic emission element of surface conductance.

8. image display as claimed in claim 7, wherein: the current potential dedicated pin is that current potential is acted on lead-in wire on the electron source.

9. image display as claimed in claim 1 or 2, it comprises: tabular grid, be arranged between first and second substrates, have a plurality of electron beam channel holes that electron source provides that are respectively, wherein each dividing plate is fixed on the grid.

10. the manufacture method of a plurality of dividing plates in the image display, this image display comprises: first substrate has the face; Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face; With a plurality of dividing plates, make by insulating material, be arranged between first substrate and second substrate, the atmospheric loading of supporting role on first substrate and second substrate, this method comprises:

By using insulating material to form dividing plate;

The powder slurry or the solution that will comprise arbitrary conductive compositions join on the distal portion of each dividing plate, and make powder slurry or solution rely on capillarity to infiltrate through distal portion;

Fire each dividing plate that powder slurry or solution have permeated, provide a kind of dividing plate that has the current-carrying part of dipping electric conducting material in distal portion with this.

11. the manufacture method of dividing plate as claimed in claim 10, wherein: the powder slurry acts on the distal portion of each dividing plate, provides a kind of dividing plate that has the current-carrying part of dipping electric conducting material in distal portion with this.

12. the manufacture method of the dividing plate that uses in the image display, this image display comprises: first substrate has the face; Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face; With a plurality of dividing plates, make by insulating material, be arranged between first substrate and second substrate, the atmospheric loading of supporting role on first substrate and second substrate, this method comprises:

By using insulating material to form dividing plate;

The powder slurry that will comprise conductive compositions joins on the distal portion of dividing plate; With

The dividing plate that is added with the powder slurry is carried out heat treatment, and the distal portion diffusion conductive compositions at dividing plate provides a kind of dividing plate that has the current-carrying part of dipping electric conducting material in distal portion thus.

13. the manufacture method of dividing plate as claimed in claim 12, wherein: the powder slurry acts on the distal portion of each dividing plate, provides a kind of dividing plate that has the current-carrying part of dipping electric conducting material in distal portion with this.

14. the manufacture method of the dividing plate that uses in the image display, this image display comprises: first substrate has the face; Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face; With a plurality of dividing plates, make by insulating material, be arranged between first substrate and second substrate, the atmospheric loading of supporting role on first substrate and second substrate, this method comprises:

Preparation has the die of a plurality of through holes, is used to form dividing plate;

First powder slurry that does not comprise conductive compositions is filled in the through hole;

Second powder slurry of dispersed electro-conductive composition therein is filled in the through hole, second powder slurry is acted on first powder slurry with this; With

Heat first powder slurry and second powder slurry, provide a kind of thus and have the dividing plate of the current-carrying part of dispersed electro-conductive composition therein in distal portion.

15. the manufacture method of dividing plate as claimed in claim 14, wherein: after first powder slurry is injected in the through hole, second powder slurry is injected into the through hole from the two ends of each through hole, therefore second powder slurry acts on first powder slurry, thus, provide a kind of dividing plate that has the current-carrying part of the composition of diffusion conduction therein in distal portion.

16. an image display comprises:

First substrate has the face;

Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face; With

A plurality of dividing plates by arbitrary described method manufacturing forms as claim 10 to 15, are arranged between first substrate and second substrate atmospheric loading of supporting role on first substrate and second substrate.

17. image display as claimed in claim 16, it comprises tabular grid, and this grid has a plurality of electron beam channel holes that electron source provides that are respectively, and dividing plate is fixed on the grid.

18. an image display comprises:

First substrate has the face;

Second substrate, relative with first substrate, and have the gap, also have a plurality of electron sources, its formation can divergent bundle with the fluorescence excitation face;

Grid is arranged between first and second substrates, forms tabularly, has a plurality of electron beam channel holes that electron source provides that are respectively; With

A plurality of dividing plates, by as claim 10,12 and 14 arbitrary described method manufacturings form, and are arranged between first substrate and second substrate, have current-carrying part and the atmospheric loading of supporting role on first substrate and second substrate in the distal portion that is positioned on second substrate respectively.

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