CN1672933A - Microfluid ejection device and method for improving microfluid ejection quality - Google Patents
Microfluid ejection device and method for improving microfluid ejection quality Download PDFInfo
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Abstract
Description
技术领域technical field
本发明是关于一种微流体喷射装置及改善微流体喷射品质的方法,特别是有关于一种进行微流体喷射装置内加热装置的电阻值检测,并调整输出驱动讯号,以改善微流体喷射品质的方法。The present invention relates to a micro-fluid ejection device and a method for improving the quality of micro-fluid ejection, in particular to a method for detecting the resistance value of a heating device in a micro-fluid ejection device and adjusting the output drive signal to improve the quality of micro-fluid ejection Methods.
背景技术Background technique
目前流体喷射装置大多运用于喷墨头、燃料喷射器等组件上,其中喷墨头更是大量的使用热气泡驱动式设计。At present, fluid ejection devices are mostly used in components such as inkjet heads and fuel injectors, among which inkjet heads are mostly designed with thermal bubble driving.
图1显示一种传统的美国专利6,102,530的单基片的流体喷射装置1,其以一硅基底10作为本体,且在硅基底10上形成一结构层12,而在硅基底10和结构层12之间形成一流体腔14,用以容纳流体26;而在结构层12上设有一第一加热器20、以及一第二加热器22,第一加热器20用以在流体腔14内产生一第一气泡30,第二加热器22用以在流体腔14内产生一第二气泡32,以将流体腔14内的流体26射出。Fig. 1 shows a kind of traditional U.S. Patent 6,102,530 single-substrate
由于单基片的流体喷射装置1具有虚拟气阀(virtual valve)的设计,并拥有高排列密度、低交互干扰、低热量损失的特性,且无须另外利用组装方式接合喷孔片,因此可以降低生产成本。Because the single-substrate
然而,单基片的流体喷射装置1对加热器电阻的要求却相当严格。于前段工艺中的电阻层工艺,同一喷墨芯片中各个加热器的电阻值可能存在相当的差距,而超出制造规格,即影响微流体装置的喷射品质,并导致制造良品率降低。However, the single-substrate
请参阅图2,一控制器在接收及处理打印数据后,传送一打印控制讯号至一喷墨头驱动线路。一控制电压电源供应器提供一控制电压Vs至喷墨头驱动线路,控制电压Vs的大小由控制电压电源供应器所控制。由控制器所控制的喷墨头驱动线路提供一驱动电压脉冲VP至一热驱式喷墨头的加热器电阻,进行流体喷射。美国专利5,526,027公开一种流体喷射装置,利用喷墨芯片的温度感测电阻(temperature sensing resistor),做为喷墨芯片中各加热器电阻的参考值,进而对所述芯片做最佳化的喷墨条件设定。Please refer to FIG. 2 , after receiving and processing printing data, a controller sends a printing control signal to an inkjet head driving circuit. A control voltage power supply provides a control voltage Vs to the inkjet head driving circuit, and the magnitude of the control voltage Vs is controlled by the control voltage power supply. The inkjet head driving circuit controlled by the controller provides a driving voltage pulse VP to the heater resistor of a thermally driven inkjet head for fluid ejection. U.S. Patent No. 5,526,027 discloses a fluid ejection device, which uses the temperature sensing resistor of the inkjet chip as a reference value for the resistance of each heater in the inkjet chip, and then optimizes the jetting of the chip. Ink condition setting.
美国专利6,244,682的单基片的流体喷射装置,以一光学扫描机构,对喷墨芯片的所打印的图形结果,进行光学检测。并利用上述检测结果与原先的设定的打印条件进行比对,以做为最佳喷墨条件的设定及校正标准。The single-substrate fluid ejection device of US Patent No. 6,244,682 uses an optical scanning mechanism to perform optical detection on the printed graphic results of the inkjet chip. And use the above detection results to compare with the original set printing conditions, as the setting and calibration standard of the best inkjet conditions.
就技术观点而言,上述传统技术的范畴,均认定在喷墨芯片内所有加热体的电阻值均处于一特定电阻值范围内,所进行的喷墨条件调整。事实上,喷墨芯片内的各加热器原本即可能因工艺因素而彼此之间存在电阻值差异,在使用一段时间后,因各加热体阻值的差异所造成的打印瑕疵,亦愈发明显,导致打印品质的下降。From a technical point of view, in the scope of the above-mentioned traditional technologies, it is assumed that the resistance values of all heating elements in the inkjet chip are within a specific resistance value range, and the inkjet conditions are adjusted. In fact, the heaters in the inkjet chip may have different resistance values due to process factors. After a period of use, the printing defects caused by the differences in the resistance values of the heating elements will become more and more obvious. , leading to a decrease in print quality.
发明内容:Invention content:
有鉴于此,本发明的目的在于测量喷墨芯片中各加热器的电阻值范围,将所述加热器的电阻值的检测结果与标准操作电阻值比较,做为整体或个别调整输出驱动讯号的依据。In view of this, the object of the present invention is to measure the resistance value range of each heater in the inkjet chip, compare the detection result of the resistance value of the heater with the standard operating resistance value, and adjust the output driving signal as a whole or individually. in accordance with.
根据上述目的,本发明提供一种改善微流体喷射品质的方法,包括下列步骤:提供一微流体喷射装置,具有至少一组可供流体加热的加热器,以及与加热器对应的喷孔。借由一加热器检测装置,检测加热器的电阻值,并将加热器的电阻值的检测结果与标准操作电阻值比较。以及当检测的电阻值高于标准操作电阻值时,利用一讯号控制组件,对微流体喷射装置内所有加热体,进行调整输出驱动讯号,以改善微流体喷射品质。According to the above purpose, the present invention provides a method for improving the quality of microfluid ejection, comprising the following steps: providing a microfluid ejection device having at least one set of heaters for fluid heating, and nozzle holes corresponding to the heaters. By means of a heater detection device, the resistance value of the heater is detected, and the detection result of the resistance value of the heater is compared with the standard operation resistance value. And when the detected resistance value is higher than the standard operating resistance value, a signal control component is used to adjust and output drive signals to all heating elements in the microfluid ejection device, so as to improve the microfluid ejection quality.
根据上述目的,本发明提供一种改善微流体喷射品质的方法,包括下列步骤:提供一微流体喷射装置,具有至少一组可供流体加热的加热器,以及与加热器对应的喷孔,借由一加热器检测装置,检测各个所述加热器的电阻值,并将各个所述加热器的电阻值的检测结果与标准操作电阻值比较。以及利用一讯号控制组件,对电阻值高于标准电阻值的所述加热器,进行输出调整驱动讯号,而对电阻值等于标准电阻值的所述加热器,维持原标准操作驱动讯号以改善微流体喷射品质。According to the above object, the present invention provides a method for improving the quality of microfluid ejection, comprising the following steps: providing a microfluid ejection device with at least one set of heaters for fluid heating, and nozzle holes corresponding to the heaters, by The resistance value of each of the heaters is detected by a heater detection device, and the detection result of the resistance value of each of the heaters is compared with a standard operating resistance value. and using a signal control component to output an adjustment drive signal to the heater whose resistance value is higher than the standard resistance value, and to maintain the original standard operation drive signal for the heater whose resistance value is equal to the standard resistance value to improve micro Fluid jet quality.
根据上述目的,本发明提供一种微流体喷射装置,包括至少一可供流体加热的加热器,一加热器检测装置,与所述加热器电性连接以检测所述加热器的电阻值,一比较器,以比较所述加热器的电阻值的检测结果与一标准操作电阻值,以及一讯号控制装置,当所述加热器的电阻值高于所述标准操作电阻值时,提供调整的驱动讯号输入所述加热器。According to the above purpose, the present invention provides a microfluid ejection device, comprising at least one heater capable of heating the fluid, a heater detection device electrically connected to the heater to detect the resistance value of the heater, a a comparator for comparing the detection result of the resistance value of the heater with a standard operating resistance value, and a signal control device for providing adjusted driving when the resistance value of the heater is higher than the standard operating resistance value A signal is input to the heater.
以下配合附图以及优选实施例,更详细地说明本发明。The present invention will be described in more detail below in conjunction with the accompanying drawings and preferred embodiments.
附图说明Description of drawings
图1是传统单基片的流体喷射装置的示意图;1 is a schematic diagram of a conventional single-substrate fluid ejection device;
图2是传统流体喷射装置示意方块图;Fig. 2 is a schematic block diagram of a conventional fluid ejection device;
图3是显示本发明的示意方块图;Figure 3 is a schematic block diagram showing the present invention;
图4是显示本发明的第一实施方式的示意方块图;Figure 4 is a schematic block diagram showing a first embodiment of the present invention;
图5是显示本发明的第二实施方式的示意方块图;以及Figure 5 is a schematic block diagram showing a second embodiment of the present invention; and
图6显示根据本发明的微流体喷射装置。Figure 6 shows a microfluid ejection device according to the present invention.
符号说明Symbol Description
传统部分(图1)Traditional part (Figure 1)
1~流体喷射装置;10~硅基底;12~结构层;14~流体腔;20~第一加热器;22~第二加热器;26~流体。1~fluid ejection device; 10~silicon substrate; 12~structural layer; 14~fluid cavity; 20~first heater; 22~second heater; 26~fluid.
本发明部分(图3~5)Part of the present invention (Fig. 3-5)
1~流体喷射装置;2~微流体加热器(电阻);3~电阻测量装置;4~讯号控制单元;5~电阻值异常的加热器;6~电阻值正常的加热器;7~调整后驱动条件;8~原标准驱动条件;600~微流体喷射装置;610、610a、610b~加热器;620~加热器检测装置;630~比较器;640~讯号控制装置。1~fluid injection device; 2~microfluid heater (resistance); 3~resistance measuring device; 4~signal control unit; 5~heater with abnormal resistance value; 6~heater with normal resistance value; 7~after adjustment Driving conditions; 8~original standard driving conditions; 600~microfluid injection device; 610, 610a, 610b~heater; 620~heater detection device; 630~comparator; 640~signal control device.
具体实施方式:Detailed ways:
对热驱式微流体喷射装置而言,加热器的电阻对微液滴喷射影响甚巨。根据本发明的优选实施方式,进行测试的微流体喷射装置具有100~200组加热器。第S1~S5组微流体喷射装置是加热器的电阻值为正常范围的微流体喷射装置,其电阻值范围大抵介于60~65欧姆(Ohm)。当驱动电压为12伏特(V)时,通过各个加热器的电流值约160~170毫安(mA),电路的导线电阻值约10欧姆(Ohm)。于此条件下,以1.2微秒(μs)的加热时间,配合喷孔尺寸的适当设计(直径约16~18微米(μm)),所喷出微流体液滴的体积范围约5~6(pico-liters,pl)。此时假定流体的密度与水的密度相当,且流体的表面张力为26~30达因/厘米(dyne/cm),黏度系数为1~2分泊(cp)。For thermally driven microfluidic ejection devices, the resistance of the heater has a great influence on the ejection of microdroplets. According to a preferred embodiment of the present invention, the tested microfluid ejection device has 100-200 sets of heaters. The micro-fluid ejection devices of groups S1-S5 are micro-fluid ejection devices with a heater resistance value in a normal range, and the resistance value range is approximately 60-65 ohms (Ohm). When the driving voltage is 12 volts (V), the current value passing through each heater is about 160-170 milliamps (mA), and the resistance value of the wire of the circuit is about 10 ohms (Ohm). Under these conditions, with a heating time of 1.2 microseconds (μs) and an appropriate design of the nozzle hole size (diameter of about 16-18 microns (μm)), the volume of the ejected microfluidic droplets ranges from about 5 to 6 ( pico-liters, pl). At this time, it is assumed that the density of the fluid is equivalent to that of water, and the surface tension of the fluid is 26-30 dyne/cm (dyne/cm), and the viscosity coefficient is 1-2 decipoise (cp).
相对的,第S6~S12组微流体喷射装置是加热器的电阻值为高于正常范围的微流体喷射装置,其电阻值范围大抵介于60~95欧姆(Ohm),其中电阻值超过65欧姆(Ohm)以上的占整体比例范围约5%~22%。其检测的电阻值为原标准电阻值的100-160%。根据本发明的一实施方式,将第1~12组微流体喷射装置施以相同的驱动条件:驱动电压12伏特(V)时,通过各个加热器的电流值约160~170毫安(mA),电路的导线电阻值约10欧姆(Ohm),以及加热时间1.2微秒(μs)。进行微流体喷射装置所喷射微液滴体积测试。测试结果详见于表1,其中若微流体喷射装置内各个喷孔所喷射微液滴体积达5~6(pico-liters,p1)占整体比例95%者以○表示,占整体比例90%~94%者以△表示,占整体比例85%~89%者以☆表示,占整体比例80%~84%者以☆☆表示。In contrast, the micro-fluid ejection devices of groups S6-S12 are micro-fluid ejection devices whose resistance value of the heater is higher than the normal range. (Ohm) or more accounts for about 5% to 22% of the overall proportion. The detected resistance value is 100-160% of the original standard resistance value. According to one embodiment of the present invention, the first to twelfth groups of microfluid ejection devices are subjected to the same driving conditions: when the driving voltage is 12 volts (V), the current value through each heater is about 160 to 170 milliamperes (mA) , the wire resistance of the circuit is about 10 ohms (Ohm), and the heating time is 1.2 microseconds (μs). The volume test of the micro-droplets ejected by the micro-fluid ejection device is carried out. The test results are shown in Table 1 in detail, wherein if the volume of micro-droplets sprayed by each nozzle hole in the microfluid ejection device reaches 5-6 (pico-liters, p1) accounting for 95% of the overall proportion, it is represented by ○, accounting for 90% of the overall proportion ~94% is represented by △, 85%~89% is represented by ☆, and 80%~84% is represented by ☆☆.
表1
由表1的结果,可验证微流体喷射装置内各个加热器电阻值的差异,对微液滴喷射品质的影响。From the results in Table 1, it can be verified that the difference in the resistance value of each heater in the micro-fluid ejection device affects the quality of micro-droplet ejection.
表2是针对各个微流体喷射装置进行驱动条件改变。根据本发明的一优选实施方式,驱动条件的改变是以延长加热时间的方式改变。依序延长加热时间0.2微秒(μs)做为改善喷射结果的变因,随着加热的时间的调升,各微流体喷射装置的喷射结果的良率亦随的提升。此结果确定了,延长加热时间确能改善喷墨品质。虽然本发明所公开的改善微流体喷射装置的喷射品质的方法,是使用延长加热时间,然而应了解的是,本方法并非限定本发明,其它方式,例如利用提高驱动电压或提高驱动电流,亦可达到本发明的目的。例如,提高驱动电压为原先的标准驱动电压的100-120%时,亦可达到提升喷射效率的结果。Table 2 changes the driving conditions for each microfluid ejection device. According to a preferred embodiment of the present invention, the driving condition is changed by extending the heating time. Sequentially prolonging the heating time by 0.2 microseconds (μs) is used as a variable to improve the ejection result. As the heating time is increased, the yield rate of the ejection result of each microfluid ejection device is also increased. This result confirms that extending the heating time does improve the inkjet quality. Although the method for improving the ejection quality of the microfluid ejection device disclosed in the present invention is to prolong the heating time, it should be understood that this method is not limited to the present invention, and other methods, such as increasing the driving voltage or increasing the driving current, can also be used. The object of the present invention can be achieved. For example, when the driving voltage is increased to 100-120% of the original standard driving voltage, the injection efficiency can also be improved.
表2
虽然借由延长加热时间,可改善微流体喷射装置的喷墨品质,但相对衍生的问题为如何界定合理的延长加热时间范围。因为过长的加热时间除影响微流体喷射装置的操作频率外,亦可能对原有正常的加热体产生影响。过长的加热时间会导致正常的加热器温度过高,致使加热器使用寿命缩短。而对喷射品质也有可能造成流体喷射量过多的现象。表3是针对原电阻值正常的微流体喷射装置,在不同的加热时间下,针对流体喷射量的测试结果。由表3的结果显示,在加热时间为2微秒(μs)的条件时,确实有原先喷射正常的微流体喷射装置发生不正常的喷射状况。Although the inkjet quality of the microfluid ejection device can be improved by extending the heating time, a relatively derived problem is how to define a reasonable range for extending the heating time. Because too long heating time not only affects the operating frequency of the microfluid ejection device, but also may affect the original normal heating body. Excessive heating time will cause the normal heater temperature to be too high, resulting in a shortened heater life. And it may also cause excessive fluid injection to the injection quality. Table 3 is the test results of the fluid injection volume under different heating times for the microfluid ejection device with normal original resistance value. The results in Table 3 show that when the heating time is 2 microseconds (μs), there are indeed abnormal ejection conditions in the microfluid ejection device that originally ejected normally.
表3
图3是显示本发明的示意方块图。当进行流体喷射时,位于微流体喷射装置1内的各个微流体发射器(例如,电阻)2,会先借由阻值测量装置3,对每个加热器的电阻进行阻值测量,各加热器的电阻值的分布范围,若符合预先设定的规格范围内,则启动原先设定的标准驱动条件。若否,则讯号控制单元4则进行流体喷射的驱动讯号调整,最后将此修正后的讯号送入流体喷射装置,以获得优选的喷射结果。Fig. 3 is a schematic block diagram showing the present invention. When performing fluid ejection, each microfluid emitter (for example, resistor) 2 located in the
第一实施例first embodiment
图4是显示本发明的第一实施方式的示意方块图。根据前述的测试结果,在进行流体喷射之前,本发明的一优选实施方式是采取先测量微流体喷射装置内各加热器的电阻值的分布范围,若符合预先设定的规格范围内,则启动原先设定的标准驱动条件。若否,则对所述微流体喷射装置的所有加热器调整驱动条件,以改善喷射品质。请参阅图4,在经过测量微流体喷射装置内各加热器的电阻值的分布范围得到电阻值异常的加热器5及电阻值正常的加热器6。对所述微流体喷射装置的所有加热器调整驱动条件7,进行喷射动作,以改善微流体喷射装置的喷射品质。Fig. 4 is a schematic block diagram showing a first embodiment of the present invention. According to the aforementioned test results, before fluid injection, a preferred embodiment of the present invention is to first measure the distribution range of the resistance value of each heater in the microfluid injection device, and if it meets the preset specification range, start Originally set standard driving conditions. If not, adjusting driving conditions for all heaters of the microfluid ejection device to improve ejection quality. Please refer to FIG. 4 , the
第二实施例second embodiment
图5是显示本发明的第二实施方式的示意方块图。在本实施例中,若针对微流体喷射装置的所有加热器调整驱动条件,以改善喷射品质根据前述的测试结果。虽可维持优选的喷射效率,然而在延长加热时间的情况下,致使原先喷射正常的加热器发生不正常的喷射状况。因此,在进行流体喷射的前,本发明的另一优选实施方式是采取先测量微流体喷射装置内各加热器的电阻值,仅针对超出标准的加热器,调整驱动条件,以改善喷射品质。请参阅图4,在经过测量微流体喷射装置内各加热器的电阻值的分布范围得到电阻值异常的加热器5及电阻值正常的加热器6。接着,仅对微流体喷射装置中的超出规格的加热器调整驱动条件7,而符合标准规格的加热器,仍以原先设定的标准驱动条件8,进行喷射动作,以改善微流体喷射装置的喷射品质。虽然本实施方式较前实施例略增步骤,但能兼顾改善微流体喷射装置的喷射品质及维持使用寿命。Fig. 5 is a schematic block diagram showing a second embodiment of the present invention. In this embodiment, if the driving conditions are adjusted for all the heaters of the microfluid ejection device to improve the ejection quality according to the aforementioned test results. Although the preferred injection efficiency can be maintained, in the case of prolonging the heating time, abnormal injection conditions will occur in the heaters that originally sprayed normally. Therefore, before fluid injection, another preferred embodiment of the present invention is to first measure the resistance value of each heater in the microfluid injection device, and only adjust the driving conditions for heaters that exceed the standard, so as to improve the injection quality. Please refer to FIG. 4 , the
图6显示根据本发明的微流体喷射装置。微流体喷射装置600是由至少一可供流体加热的加热器610、一加热器检测装置620、一比较器630及一讯号控制装置640所构成。加热器检测装置620与加热器610电性连接,并借由一电流讯号检测加热器的电阻值。然后将检测的送比较器630与标准操作电阻值比较。当检测的电阻值高于所述标准操作电阻值时,即借由讯号控制装置640调整输入所述加热器的驱动讯号。根据本发明的另一优选实施方式,讯号控制装置640对电阻值高于所述标准操作电阻值的所述加热器610a,进行输出调整驱动讯号,而对电阻值等于所述标准操作电阻值的所述加热器610b,维持原标准操作驱动讯号。Figure 6 shows a microfluid ejection device according to the present invention. The
虽然本发明所公开的微流体喷射装置是使用于文字或影像的数据打印处理,然而应了解的是,此应用并非限定本发明,利用本发明改善微流体喷射装置的喷射品质的方法,亦可应用于其它用途。例如,于另一实施方式中,此微流体喷射装置可用做燃料喷射系统,或生物医学科技的药剂注射装置。Although the micro-fluid ejection device disclosed in the present invention is used for data printing processing of text or images, it should be understood that this application is not limited to the present invention, and the method for improving the ejection quality of the micro-fluid ejection device of the present invention can also be used for other purposes. For example, in another embodiment, the microfluid injection device can be used as a fuel injection system, or a drug injection device for biomedical technology.
本发明的优点在于提供一种微流体喷射装置及改善微流体喷射装置的喷射品质的方法,在微流体喷射装置中的部分加热器的电阻值超出标准操作范围时,利用电阻值侦测装置及讯号控制单元,针对微流体喷射装置的全部或部分(缺陷)加热器,调整驱动条件,以改善微流体喷射装置的喷射品质。The advantage of the present invention is to provide a microfluid ejection device and a method for improving the ejection quality of the microfluid ejection device. When the resistance value of some heaters in the microfluid ejection device exceeds the standard operating range, the resistance value detection device and The signal control unit adjusts the driving conditions for all or some (defective) heaters of the microfluid ejection device, so as to improve the ejection quality of the microfluid ejection device.
因此,在一定的讯号调整范围内,除了可有效提升原微流体喷射装置的使用效率,并不会对原先正常的加热器产生负面的影响。Therefore, within a certain signal adjustment range, in addition to effectively improving the use efficiency of the original microfluid injection device, it will not have a negative impact on the original normal heater.
虽然本发明已以优选实施例公开如上,然其并非用以限定本发明,任何业内人士,在不脱离本发明的精神和范围内,当可作更动与润饰,因此本发明的保护范围当视权利要求书所界定者为准。Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person in the industry can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be The claims shall prevail.
Claims (19)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488720A (en) * | 2014-06-20 | 2017-03-08 | 宝洁公司 | Method of delivering a dose of a fluid composition from a microfluidic delivery cartridge |
| CN107618264A (en) * | 2016-07-15 | 2018-01-23 | 佳能株式会社 | Liquid jet method, liquid injection apparatus and jet head liquid |
| CN109130502A (en) * | 2017-06-15 | 2019-01-04 | 佳能株式会社 | Semiconductor device, liquid discharging head and liquid discharge apparatus |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488720A (en) * | 2014-06-20 | 2017-03-08 | 宝洁公司 | Method of delivering a dose of a fluid composition from a microfluidic delivery cartridge |
| CN107618264A (en) * | 2016-07-15 | 2018-01-23 | 佳能株式会社 | Liquid jet method, liquid injection apparatus and jet head liquid |
| CN107618264B (en) * | 2016-07-15 | 2020-04-14 | 佳能株式会社 | Liquid ejecting method, liquid ejecting apparatus, and liquid ejecting head |
| CN109130502A (en) * | 2017-06-15 | 2019-01-04 | 佳能株式会社 | Semiconductor device, liquid discharging head and liquid discharge apparatus |
| CN109130502B (en) * | 2017-06-15 | 2020-11-03 | 佳能株式会社 | Semiconductor device, liquid discharge head, and liquid discharge apparatus |
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