CN1671805B - 烧结温度低的导电纳米油墨及其制备方法 - Google Patents
烧结温度低的导电纳米油墨及其制备方法 Download PDFInfo
- Publication number
- CN1671805B CN1671805B CN03815904XA CN03815904A CN1671805B CN 1671805 B CN1671805 B CN 1671805B CN 03815904X A CN03815904X A CN 03815904XA CN 03815904 A CN03815904 A CN 03815904A CN 1671805 B CN1671805 B CN 1671805B
- Authority
- CN
- China
- Prior art keywords
- described method
- metal
- homogenizing mixture
- organic solvent
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
| 体系 | 制剂 | 电阻,Ω/平方 | 电阻率,Ωcm | 烧结温度,℃ |
| 1 | P0010 | 0.7 | 2.84E-4 | 120 |
| l | P0010 | 0.05 | 2.03E-5 | 300 |
| 3 | Cl16 | 2.8 | 6.72E-5 | 120 |
| 3 | Cl16 | 1.17 | 2.93E-5 | 300 |
| 2 | Cl21 | 0.255 | 3.09E-4 | 100 |
| 银块* | 0.004 | 1.95E-5 | 120 | |
| 银块* | 0.0045 | 2.14E-5 | 220 |
Claims (16)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39312302P | 2002-07-03 | 2002-07-03 | |
| US60/393,123 | 2002-07-03 | ||
| PCT/IL2003/000554 WO2004005413A1 (en) | 2002-07-03 | 2003-07-03 | Low sintering temperatures conductive nano-inks and a method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1671805A CN1671805A (zh) | 2005-09-21 |
| CN1671805B true CN1671805B (zh) | 2010-05-26 |
Family
ID=30115548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN03815904XA Expired - Fee Related CN1671805B (zh) | 2002-07-03 | 2003-07-03 | 烧结温度低的导电纳米油墨及其制备方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2005531679A (zh) |
| KR (1) | KR20060012545A (zh) |
| CN (1) | CN1671805B (zh) |
| AU (1) | AU2003237578A1 (zh) |
| WO (1) | WO2004005413A1 (zh) |
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| DE69819740T2 (de) | 1997-02-24 | 2004-09-30 | Superior Micropowders Llc, Albuquerque | Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte |
| US7364782B2 (en) | 2000-07-24 | 2008-04-29 | High Voltage Graphics, Inc. | Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film |
| US7344769B1 (en) | 2000-07-24 | 2008-03-18 | High Voltage Graphics, Inc. | Flocked transfer and article of manufacture including the flocked transfer |
| AU2003258991A1 (en) | 2002-07-03 | 2004-01-23 | High Voltage Graphics, Inc. | Flocked stretchable design or transfer |
| US7585349B2 (en) | 2002-12-09 | 2009-09-08 | The University Of Washington | Methods of nanostructure formation and shape selection |
| GB0300529D0 (en) * | 2003-01-10 | 2003-02-12 | Qinetiq Nanomaterials Ltd | Improvements in and relating to ink jet deposition |
| US7393576B2 (en) | 2004-01-16 | 2008-07-01 | High Voltage Graphics, Inc. | Process for printing and molding a flocked article |
| US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
| JP2007527102A (ja) * | 2004-02-18 | 2007-09-20 | バージニア テック インテレクチュアル プロパティーズ インコーポレーテッド | 相互接続用のナノスケールの金属ペーストおよび使用方法 |
| US8257795B2 (en) | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
| JP4721677B2 (ja) * | 2004-09-06 | 2011-07-13 | 株式会社秀峰 | 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体 |
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| JP4756628B2 (ja) * | 2004-12-01 | 2011-08-24 | 三井金属鉱業株式会社 | 水系itoインク |
| JP4799881B2 (ja) | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
| US20060163744A1 (en) * | 2005-01-14 | 2006-07-27 | Cabot Corporation | Printable electrical conductors |
| WO2006076613A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Metal nanoparticle compositions |
| US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
| US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
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| KR100726592B1 (ko) * | 2005-12-23 | 2007-06-12 | 재단법인 포항산업과학연구원 | 무기 전도성 잉크용 나노(nano) 동(Cu)분말 제조방법 |
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| JP5096735B2 (ja) | 2006-12-05 | 2012-12-12 | Jx日鉱日石エネルギー株式会社 | ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子 |
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| CN105579533B (zh) | 2013-08-16 | 2020-04-14 | 汉高知识产权控股有限责任公司 | 亚微米银颗粒油墨组合物、方法和用途 |
| CN103525199B (zh) * | 2013-10-24 | 2015-12-02 | 北京印刷学院 | 一种可免加热后处理纳米尺度铜油墨的制备方法 |
| CA3055013C (en) | 2017-04-04 | 2021-08-03 | W. L. Gore & Associates Gmbh | Dielectric composite with reinforced elastomer and integrated electrode |
| CA3097213C (en) | 2018-05-08 | 2023-03-07 | Mark D. Edmundson | Flexible and durable printed circuits on stretchable and non-stretchable substrates |
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| CN112136367A (zh) | 2018-05-08 | 2020-12-25 | W.L.戈尔及同仁股份有限公司 | 用于皮肤应用的柔性印刷电路 |
| KR102490064B1 (ko) * | 2020-11-27 | 2023-01-19 | 한국전자기술연구원 | 전도성 잉크 조성물 및 이를 이용한 전도성 기판 |
| CN113831864A (zh) * | 2021-11-11 | 2021-12-24 | 苏州诺菲纳米科技有限公司 | 单层纳米银线可剥导电胶及其制备方法 |
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2003
- 2003-07-03 KR KR1020047021518A patent/KR20060012545A/ko not_active Ceased
- 2003-07-03 AU AU2003237578A patent/AU2003237578A1/en not_active Abandoned
- 2003-07-03 CN CN03815904XA patent/CN1671805B/zh not_active Expired - Fee Related
- 2003-07-03 WO PCT/IL2003/000554 patent/WO2004005413A1/en not_active Ceased
- 2003-07-03 JP JP2004519139A patent/JP2005531679A/ja active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1671805A (zh) | 2005-09-21 |
| WO2004005413A1 (en) | 2004-01-15 |
| JP2005531679A (ja) | 2005-10-20 |
| KR20060012545A (ko) | 2006-02-08 |
| AU2003237578A1 (en) | 2004-01-23 |
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