CN1670950A - Integrated heat-pipe radiator with outside diversion - Google Patents

Abstract

A radiator with integrated heat pipes for external conduction, which includes a closed vacuum box for absorbing heat. On the surface of the vacuum box, there are more than one vacuum heat dissipation plates connected up through the bottom end and the inner cavity of the vacuum box; The gap between the vacuum cooling plates constitutes a cooling fluid channel; heat dissipation fins are welded between the vacuum cooling plates; liquid working medium is filled in the vacuum box; the inner surface of the vacuum box and the inner wall of the vacuum cooling plate are laid with A liquid-absorbing core absorbs liquid; the end surface of the cooling fluid channel is fixedly covered with a baffle; fins are arranged in the cooling fluid channel along the flow direction of the cooling fluid. The utility model forms a channel that can control the directional flow of the cooling fluid on the outside of the vacuum box filled with liquid working medium through a plurality of vacuum heat dissipation plates and baffle plates, which changes the traditional heat dissipation method and improves the heat transfer of the radiator efficiency.

Description

Outer flow guide integrated heat pipe radiator

technical field

The invention relates to a heat pipe radiator, in particular to an outer diversion integrated heat pipe radiator with a three-dimensional condensation heat dissipation network, which is made by guiding the flow direction of cooling fluid, with heat pipes as the main body and cooling fins as auxiliary strengthening means.

Background technique

With the rapid development of electronics and power technology, especially with the substantial increase in the integration of integrated circuits, the heat dissipation of electronic components has become one of the important issues restricting the operating speed and output power of electronic equipment.

Taking the computer CPU chip as an example, its integration level has increased by nearly 20,000 times in 30 years, and the heat flow generated by it has reached the level of 100W/cm ² .

As we all know, the reliability and life of a computer are closely related to its working temperature, and the higher the integration of the chip, the higher the heat it generates. If the heat cannot be dissipated in time, the reliability of the computer will be greatly reduced. The magnitude is reduced, and even the normal operation may not appear. For computer development and research institutions, if they cannot effectively solve the heat generated by chips and other electronic components during work, they will not be able to develop faster, higher power, and smaller data processing equipment.

At present, the heat dissipation method of computers and electronic components is usually to install a comb-shaped heat dissipation plate made of aluminum alloy on the body of a chip or other electronic components to create a large heat dissipation area. At the same time, a fan is used to dissipate the heat. thereby lowering the temperature. Although this method is simple in structure and low in cost, it can only be applied to heat dissipation of components in electronic equipment with low computing speed and low power.

In 1998, the Sandia National Laboratory of the United States used heat pipe technology to dissipate heat from computer chips and achieved good results.

FIG. 1 shows a currently used heat dissipation device using a heat pipe, which includes a frame 1 . A plurality of heat dissipation fins 2 made of thin metal sheets and densely distributed are tightly installed on the bottom plate of the frame body 1 . A heat pipe 3 (the number of heat pipes can be two or three) is horizontally arranged on the inner bottom plate of the frame body 1 . The heat pipe 3 passes through the bottom of the cooling fins 2 , stretches upwards and turns 180 degrees to penetrate the top of the cooling fins 2 . All the cooling fins 2 are closely attached to the heat pipes 3 . The heat pipe 3 is placed with a liquid working medium that is vaporized when heated and pre-condensed. When the frame body 1 is installed on the chip, the heat generated by the chip vaporizes the liquid working medium in the heat pipe 3 lying on the inner bottom plate of the frame body 1, and the heat enters the upper part of the cooling fin 2 along with the vaporized liquid working medium. In the heat pipe 3 , it condenses when it encounters condensation, and the heat is dissipated to the outside through the cooling fins 2 . When the forced air cooling fan 4 is installed on the top of the cooling fins 2, the heat can be dissipated more easily.

Because the heat pipe has extremely high heat transfer efficiency, the heat generated by the chip can be quickly transferred to the distant heat dissipation fins to achieve the purpose of heat dissipation. This method has higher heat dissipation efficiency than the previous comb-shaped heat dissipation plate method. Because the temperature of the heat sink on the comb-shaped heat sink is often at a position farther away from the chip, the temperature is lower, and the temperature near the bottom of the chip is higher, this temperature gradient phenomenon wastes a large amount of heat dissipation area, therefore, there will be no High heat dissipation efficiency, and the use of heat pipes can overcome the shortcomings of poor heat dissipation effect of the comb-shaped heat dissipation plate.

Although the heat pipe cooling device shown in Figure 1 has a good heat dissipation effect, because its own structure is based on a solid radiator, the heat pipe is only used to strengthen the rib efficiency of the heat dissipation fins of the radiator, and cannot fully utilize the heat pipe. The advantages of compactness, lightness, and high-efficiency heat transfer are mainly manifested in the following shortcomings: there are high thermal resistances between the heat source and the base plate, between the heat pipe and the base plate, and between the heat pipe and the fins. At the same time, considering the radiator In terms of strength, fins cannot be made very thin, and thicker fins not only waste materials, occupy limited space, but also cannot obtain more heat dissipation area, so this method still cannot meet the needs of ultra-large integrated circuits, high-power The heat dissipation requirements of electronic devices and high-speed chips limit its application.

To sum up, providing a heat dissipation device with higher heat dissipation efficiency is a strong guarantee for the manufacture of high-power, high-speed electronic equipment and larger-scale integrated circuit chips, and it is also one of the problems that people in the industry need to solve urgently.

Contents of the invention

The purpose of the present invention is to provide a radiator with integrated heat pipes for external conduction for the lack of high-efficiency heat dissipation devices in the current electronic and electric power manufacturing technology fields, which cannot further improve the operating speed and output power of electronic components and circuit chips. The principle of heat transfer of heat pipes, by optimizing the layout of the cooling fluid channels outside the heat-absorbing end and the heat-dissipating end, an integrated heat pipe electronic radiator with heat pipes as the main body and heat dissipation fins as the means of heat transfer enhancement is realized, which is the same size as other Compared with the traditional heat pipe cooling device, it has greater heat dissipation efficiency.

The purpose of the present invention is achieved through the following technical solutions:

A radiator with integrated heat pipes for external conduction, which includes a closed vacuum box for absorbing heat. On the surface of the vacuum box, there are more than one vacuum heat dissipation tubes that communicate with the inner cavity of the vacuum box through the bottom end. plate. The gaps between the vacuum cooling plates form cooling fluid channels. Fins for enlarging the heat dissipation area are also welded between the vacuum heat dissipation plates.

The vacuum box is filled with a liquid working fluid that vaporizes when heated and condenses when cooled. A liquid-absorbing core capable of absorbing liquid is laid on the inner surface of the vacuum box body and the inner wall of the vacuum cooling plate. The end surface of the cooling fluid channel is fixedly covered with a baffle, and the width of the baffle is smaller than the width of the end surface, so that the outlet of the cooling fluid is formed between the baffle and the vacuum box, and the top surface of the cooling fluid channel It becomes the inlet of the cooling fluid; the fins are arranged in the cooling fluid channel along the flow direction of the cooling fluid.

When in use, the heating electronic components are closely attached to the bottom of the vacuum box body, and a cooling fan blowing downward is installed on the top of the vacuum cooling plate. The heat generated by the heating electronic components is transmitted into the vacuum box body. The liquid working medium is vaporized when it is heated, and the heat is transferred to the vacuum cooling plate and outwards through the welded fins. At the same time, the cooling fan blows cold air down into the cooling fluid channel. Under the blocking of the baffle, the cold air flow can only be discharged from the outlet close to the vacuum box body.

The surface of the vacuum box is a place with a relatively high temperature, and setting the cooling fluid outlet here can more effectively improve the heat dissipation efficiency, and the fins are arranged along the flow direction of the cooling fluid, so that the cold air flow can flow in the cooling fluid channel Smoothly discharge and take away the heat from the surface of the fins.

The vacuum box body can be made of materials with good thermal conductivity, and its shape can be rectangular, circular or any other shape.

In the above arrangement, the vacuum cooling plate can be arranged parallel to the surface of the vacuum box body, or it can be arranged radially outwards from the center of the surface of the vacuum box body.

In order to keep the heat dissipation of the vacuum cooling plates uniform, one or more connecting pipes can be arranged on the top of the vacuum cooling plates to make the vacuum cooling plates communicate with each other.

In order to facilitate the smooth flow of cold air flow and facilitate production and processing, the fins can be divided into upper and lower sections. The upper section is perpendicular to the inlet end surface of the cooling fluid; the lower end is perpendicular to the outlet end surface of the cooling fluid, and the upper and lower fins do not intersect. When the cold air flow enters the cooling fluid channel from the inlet, it is blown vertically to the surface of the vacuum box under the diversion action of the upper fins, and the cold air flow is turned vertically and discharged from the outlet under the diversion action of the lower fins. In this process, the cold air flow can dissipate the heat to the greatest extent.

In the above technical solution, the baffle plate can also be fixedly covered on the top surface of the cooling fluid passage, that is, the top surface of the vacuum cooling plate, so that the two end surfaces of the cooling fluid passage form the outlet or inlet of the cooling fluid. Such arrangement can satisfy the requirement that the cooling fan is arranged on the side, so that the cold air flow can enter the channel from one end surface of the cooling fluid channel and be discharged from the other end surface. In this scheme, the sides of the fins can be welded on the surface of the vacuum box body and arranged parallel to the vacuum heat dissipation plate, or welded on the surface of the vacuum heat dissipation plate and arranged parallel to the surface of the vacuum box body.

The liquid-absorbing core used in the above-mentioned technical solution may be composed of multi-layer fiber braided nets or multi-layer wire nets, or may be a plate-shaped body with micropores made by powder sintering. It can also be a strip-shaped body made of a metal or organic material thin sheet through reciprocating continuous bending or bending, and be attached to the inner wall of the housing by welding or bonding.

In production, when the vacuum box body adopts the injection molding process, in order to reduce the thermal resistance between the surface of the heating electronic component and the bottom surface of the vacuum box body, and improve the heat conduction efficiency, it is possible to fix on the bottom surface of the vacuum box body. Heat conduction plate with closely fitted heat dissipation surface. The heat conduction plate can be fixed in the way of embedding the bottom of the vacuum box, or a special depression for embedding the heat dissipation surface of the heating electronic component can be set on the bottom of the vacuum box, and the heat conduction plate can be used as the bottom of the special depression.

In addition, in order to further improve heat dissipation efficiency, the above-mentioned technical solution can also be combined with the manufacture of heating electronic components, and openings can also be provided on the bottom of the vacuum box, and if the size matches the openings, the surface is provided with integrated electronic circuits or electronic components. The device substrate of the core is embedded in the opening, so that the integrated electronic circuit or the inner core of the electronic element is located in the vacuum box. The periphery of the device substrate is tightly sealed with the vacuum box. The lead wires of the inner core of the integrated electronic circuit or electronic component are arranged on the surface of the device substrate outside the vacuum box.

In this solution, the wick is electrically insulating and is laid on the inner core of the integrated electronic circuit or electronic component. The liquid working fluid is an electrical insulating material, and is chemically and electrically compatible with the inner core material of the integrated electronic circuit or electronic component.

Through the joint manufacture of heating electronic components and vacuum box, the heat conduction resistance is overcome, and the heat generated by the heating electronic components during operation is directly transmitted through the vaporization of liquid working fluid, achieving the best heat dissipation effect.

From the above technical solutions, it can be seen that the present invention forms a channel that can control the directional flow of cooling fluid through a plurality of vacuum cooling plates and baffles on the outside of the vacuum box filled with liquid working medium, which changes the distribution of the traditional single heat pipe. The setting method greatly improves the heat dissipation efficiency of the heating electronic components, and lays the foundation for the future manufacture of large-scale integrated circuit chips and the development and manufacture of high-speed electronic equipment, high-power electronics, and electrical equipment, and has great practicality. value.

Description of drawings

Fig. 1 is the structure schematic diagram of heat pipe radiator commonly used at present;

FIG. 2 is a schematic three-dimensional structure diagram of the first embodiment provided by the present invention;

Fig. 3 is a side sectional view of the embodiment shown in Fig. 2;

Fig. 4 is the setting position figure of liquid-absorbent core in the embodiment shown in Fig. 2;

Fig. 5 is a schematic diagram of the embodiment shown in Fig. 2 in use;

Fig. 6 is a schematic structural view of fins in the embodiment shown in Fig. 2;

Fig. 7 is a schematic structural view of the reinforcing plate in the embodiment shown in Fig. 2;

Figure 8 is a schematic structural view of the liquid-absorbent core involved in the present invention;

Fig. 9 is another schematic structural view of the liquid-absorbent core involved in the present invention;

Fig. 10 is a schematic structural diagram of a "U"-shaped liquid-absorbent core made of bent sheets according to the present invention;

Fig. 11 is a schematic structural diagram of a "V" shaped liquid-absorbent core made of bent sheets according to the present invention;

Fig. 12 is a structural schematic diagram of an "Ω"-shaped liquid-absorbent core bent from a thin sheet according to the present invention;

Fig. 13 is a schematic structural view of the embodiment shown in Fig. 2 with a connecting pipe added;

Fig. 14 is a schematic three-dimensional structure diagram of the second embodiment provided by the present invention;

Fig. 15 is a schematic diagram of an installation method of fins in the second embodiment shown in Fig. 14;

Fig. 16 is a schematic diagram of another installation method of fins in the second embodiment shown in Fig. 14;

Fig. 17 is a front view of the second embodiment shown in Fig. 14;

Fig. 18 is a schematic structural view of adding a connecting pipe in the second embodiment shown in Fig. 14;

Fig. 19 is a schematic perspective view of the third embodiment provided by the present invention;

Fig. 20 is a cross-sectional structure diagram of the fourth embodiment provided by the present invention;

Fig. 21 is a cross-sectional structure diagram of the fifth embodiment provided by the present invention.

Detailed ways

Hereinafter, the present invention will be further described in detail through specific embodiments and in conjunction with the accompanying drawings.

Embodiment one

FIG. 2 is a schematic diagram of the external structure of a preferred embodiment provided by the present invention. It includes a sealed vacuum box body 10 for absorbing heat, and the vacuum box body 10 is filled with a liquid working fluid (not shown in the figure) that vaporizes when heated and condenses when condensed. On the surface of the vacuum box body 10 , three parallel vacuum cooling plates 11 are erected and fixed. The bottom of the vacuum cooling plate 11 communicates with the inner cavity of the vacuum box body 10 . The gaps between the vacuum cooling plates 11 form cooling fluid passages. Fins 20 for enlarging the heat dissipation area are also welded between the vacuum heat dissipation plates 11 . The fins 20 are disposed in the cooling fluid channel in a dense arrangement of multiple fins.

The two end faces of the cooling fluid channel are fixedly covered with baffles 30 respectively, and the width of the baffles 30 is smaller than the width of the end faces, so that the outlet 22 of the cooling fluid is formed between the baffles 30 and the vacuum box body 10, and makes The top end face of the cooling fluid channel becomes the inlet 21 for the cooling fluid.

The internal structure of this embodiment is shown in FIG. 3 . A liquid-absorbing core 40 capable of absorbing the liquid working medium 13 is laid on the inner surface of the vacuum box body 10 . The liquid-absorbing core 40 can be laid by welding or bonding, and is extended and laid on the inner wall of the vacuum cooling plate 11, as shown in FIG. to the inner walls of the vacuum cooling panels 11 on both sides, while the inner walls of the vacuum cooling panels 11 in the middle are not laid.

When heated, the liquid working medium 13 vaporizes and sends heat into the vacuum cooling plate 11 , and when cooled, the heat released is transformed into a liquid and flows back into the vacuum box body 10 . When the electronic equipment of this embodiment is installed in an inclined or inverted state, the liquid-absorbing core 40 can absorb the liquid working medium 13 and send it to the heat-absorbing end in the vacuum box body 10, thereby not affecting the normal operation of this embodiment. Work.

As shown in FIG. 3 and FIG. 4 , the arrangement of the fins 20 is in accordance with the flow direction of the cooling fluid. In the setting, the fins 20 are divided into upper and lower sections, wherein the upper section is arranged vertically perpendicular to the inlet 21 of the cooling fluid; the lower section is arranged horizontally perpendicular to the outlet 22 of the cooling fluid, and the upper and lower sections of fins are not intersect to form a right angle.

FIG. 5 is a schematic diagram of the use status of this embodiment. When in use, this embodiment is installed on the surface of an integrated chip (such as a CPU), and a cooling fan 4 is installed on the top of the vacuum cooling plate. The cold air enters the cooling fluid channel from top to bottom along the direction of the arrow in the figure. Under the blocking of the baffle plate 30, the cold air passes through a turning point and is divided into left and right two routes and discharged from two outlets 22.

In this embodiment, in order to increase the heat dissipation area and strength, auxiliary fins 201 may be added between each fin 20 , as shown in FIG. 6 for a schematic diagram of the partial structure of the fins. The auxiliary fins 201 are manufactured by bending thin copper sheets and welded between the fins 20 .

The fins can also be made into a wave shape, thereby increasing the heat dissipation area, and multiple groups of through holes and multiple vertical thorns can also be distributed on the surface of the fins. When the cold air flows through, it causes turbulent flow, which makes the heat dissipation effect better. No auxiliary fins are added between the fins 20 in FIG. 3 , but the fins 20 are wave-shaped and have a plurality of vertical thorns 202 on the surface. The setting of the vertical thorns 202 can be combined with opening the through holes, that is, when punching and opening the through holes, the punched metal sheet is turned up to form the vertical thorns.

Auxiliary fins 201 are added between the fins 20 in FIG. 4 (see the lower fins, the auxiliary fins on the upper fins are not shown).

In order to improve heat dissipation efficiency and reduce thermal resistance, the walls of the vacuum cooling plate and the vacuum box are usually made relatively thin during manufacture. In order to increase the strength, a reinforcing plate can be added in the present invention, as shown in FIG. 7 . In this embodiment, the outer contour of the reinforcing plate 14 is the same as the inner cross-sectional shape of the vacuum box body 10 and the vacuum heat dissipation plate 11, and its outer periphery is respectively fixed on the inner walls of the vacuum box body 10 and the vacuum heat dissipation plate 11, and the middle part can be opened One or more holes to ensure the flow of liquid working fluid. According to needs, a multi-layer reinforcing plate 14 can also be added.

The absorbent core 40 used in the present invention can be made in various forms. Shown in Figure 8 is to adopt multi-layer wire mesh 41 to weld and lay up to form. There are abundant gaps between the multi-layer wire mesh 41 and itself, which can produce better liquid adsorption effect.

FIG. 9 is a partial schematic diagram of a porous liquid-absorbing core manufactured by powder sintering process. The liquid-absorbing core relies on micropores 42 inside and on the surface to generate capillary force to absorb liquid.

Figure 10 shows a strip-shaped liquid-absorbing core made of thin metal sheets with good thermal conductivity according to the "U" shape by reciprocating and continuous bending. A plurality of "U"-shaped grooves are formed in the strip-shaped liquid-absorbing core. A hole 43 is opened on the surface of the metal sheet of the strip-shaped liquid-absorbing core. The hole 83 can be a long hole or a round hole or a convex or concave slit. The strip-shaped liquid-absorbing core can be welded on the inner wall of the vacuum box body and the vacuum cooling plate. Compared with the above-mentioned other liquid-absorbing cores, it not only has good capillary adsorption, but also because it is a good conductor of heat, it can directly participate in heat conduction when in use, and can quickly transfer heat to distant places. The liquid working medium is transferred and vaporized and dissipated in a larger area through the holes 43 on its surface. Therefore, it has a better heat dissipation effect than the above-mentioned multi-layer wire mesh liquid-absorbent core and the porous liquid-absorbent core manufactured by the powder sintering process.

The liquid-absorbing core can also be made as shown in Figure 11. The metal sheet is made by reciprocating and continuous bending according to the "V" shape; it can also be made as shown in Figure 12. The metal sheet is made by reciprocating and continuous bending according to the "Ω" shape. In Fig. 11 and Fig. 12, holes 43 are opened on the surface of the liquid-absorbing core for the vaporization of the liquid working medium through the surface.

Through the hole 43 and the multiple "U"-shaped grooves, multiple "V"-shaped grooves, and multiple "Ω"-shaped grooves that are naturally formed in Figures 10, 11, and 12, it is convenient to make the liquid working medium inside extend.

In order to facilitate the vaporization and expansion of the liquid working medium, the ports of the "U"-shaped groove, the "V"-shaped groove and the "Ω"-shaped groove can also be closed.

The above embodiment can also be further improved, as shown in FIG. 13 . In the figure, two connecting pipes 15 are arranged on the top of the vacuum cooling plate, and the connecting pipes 15 make the vacuum cooling plates communicate with each other, and can balance the pressure of the vaporized liquid working medium in the top of the vacuum cooling plate during heat dissipation. This ensures uniform heat transfer.

The vacuum box body involved in the present invention can be made of materials with good thermal conductivity, and its shape can be rectangular, circular or other shapes, see Embodiment 2.

Embodiment two

The structure of the circular vacuum box embodiment is shown in FIG. 14 . In the figure, the vacuum box body 10 is circular, and the vacuum cooling plates 11 are radially arranged with the center of the surface of the vacuum box body 10 as the center of the circle. In this embodiment, the vacuum cooling plate 11 is made into long and short forms. Wherein, the short vacuum heat dissipation plate 11 is arranged near the periphery of the vacuum box body 10, so that the vaporized liquid working fluid entering the vacuum heat dissipation plate 11 is relatively uniform. The baffle 30 is arranged on the outer upper part of the vacuum cooling plate 11 around its circumference, and the width of the baffle 30 is smaller than the height of the vacuum cooling plate 11, so that an outlet 22 of cooling fluid is formed between it and the vacuum box body 10, and the vacuum cooling plate The top of 11 is the inlet 21 for cooling fluid. When a cooling fan blowing downward is installed on the top of the vacuum cooling plate 11 and started, the cold wind can blow to the surface of the vacuum box body 10 and then be discharged through the outlet 22 .

In this embodiment, the arrangement of the fins can take various forms, as shown in FIG. 15 and FIG. 16 . The fins 20 in FIG. 15 are made of thin metal sheets, and are arranged between the vacuum cooling plates 11 in a distribution manner of concentric circles. The fins 20 in Fig. 16 are similar to the vacuum heat sink 11, and are arranged radially between the short vacuum heat sink 11 and the center, and between the vacuum heat sink 11 and between the vacuum heat sink 11 and the fins 20. The thin copper sheet is bent and welded with auxiliary fins 201 .

The fins in this embodiment also adopt the upper and lower section arrangement in the above embodiment, as shown in FIG. 17 . The upper section (not shown in the figure) is arranged vertically perpendicular to the inlet 21 of the cooling fluid; the lower section is arranged horizontally perpendicular to the outlet 22 of the cooling fluid, and the upper and lower sections of fins do not intersect inside, forming a right angle.

Similar to the above embodiment, in order to balance the pressure of the vaporized liquid working medium in the top of the vacuum cooling plate and ensure uniform heat transfer, this embodiment can also add a connecting pipe, the structure of which is shown in FIG. 18 . The communication pipe 15 is circular and connects between the vacuum heat dissipation plates 11 to balance the internal pressure of each vacuum heat dissipation plate 11 .

The present invention can also be made into another form, see embodiment three.

Embodiment Three

As shown in Figure 19. One difference between this embodiment and Embodiment 1 is: the baffle plate 30 is fixedly covered on the top surface of the cooling fluid passage, that is, the top of the vacuum cooling plate 11, so that the end surface of the cooling fluid passage forms the outlet 22 and the inlet of the cooling fluid. twenty one. Another difference is that the fins 20 are all horizontally arranged in one section, and are arranged on the surface of the vacuum cooling plate 11 by welding their sides. Any end of the end faces of the cooling fluid channel can be installed with a cooling fan, and regardless of the blowing direction of the cooling fan, the fins 20 are arranged downstream of the wind direction.

In this embodiment, the fins can also be vertically and parallelly arranged, one side of which is welded on the surface of the vacuum box, and the other side is fixed by the connecting pipe 15, and a plurality of fins made of metal materials can also be arranged in the cooling fluid channel formed by it. The manufactured thin-walled heat pipe passes through the fins and is welded with the fins, and its end is fixed on the surface of the vacuum heat dissipation plate, and the thin-walled heat pipe communicates with the inside of the vacuum heat dissipation plate.

Embodiment Four

Fig. 20 is a schematic structural diagram of another embodiment provided by the present invention. This embodiment has the same overall structure as the first embodiment above, and the difference is that: the bottom surface of the vacuum box body 10 is provided with an external heat-generating electronic component. A special recess 101 is embedded, and the bottom surface of the special recess 101 is a heat conducting plate 102 with low thermal resistance. When in use, the heat dissipation surface of the heating electronic component is closely attached to the surface of the heat conducting plate 102 . When the vacuum box body 10 is made of plastic materials, this method will not reduce the heat conduction efficiency between the heating electronic components and the vacuum box body 10, and is also conducive to mass production.

Embodiment five

Figure 21 shows a preferred combination of a large scale integrated circuit chip provided by the present invention

Embodiment structure schematic diagram.

In this embodiment, on the basis of referring to Embodiment 4, an opening is set at the bottom of the vacuum box body 10, and a device substrate 103 matching its size is embedded in the opening. The periphery of the device substrate 103 is in contact with the vacuum box body 10. The bottom surface is tightly sealed.

The surface of the device substrate 103 located inside the vacuum box 10 is pre-installed with an integrated electronic circuit 104 , and the lead wires 105 of the integrated electronic circuit 104 are arranged on the surface of the device substrate 103 located outside the vacuum box 10 . The liquid working medium in the vacuum box body 10 is an electrical insulating material, and is chemically and electrically compatible with the integrated electronic circuit 104 .

In this embodiment, the integrated electronic circuit chip is directly manufactured in the vacuum box, which completely eliminates the influence of thermal resistance on heat dissipation, thereby maximizing the heat dissipation efficiency. It will become a larger-scale, higher-speed and higher-power One of the directions of research and development of integrated circuit chips. Not only that, this embodiment can also be used to manufacture high-power transistors, and the heat generated by high-power transistors can be efficiently dissipated only by directly manufacturing the inner core of the high-power transistors in the vacuum box.

Finally, it should be noted that the above embodiments are only used to illustrate and not limit the technical solutions of the present invention, although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: the present invention can still be modified Or an equivalent replacement, any modification or partial replacement without departing from the spirit and scope of the present invention shall fall within the scope of the claims of the present invention.

Claims (18)

1, a kind of outside water conservancy diversion integrated heat pipe radiator, it comprises an enclosed vacuum box body that is used to absorb heat, and erects on the surface of vacuum box body to be installed with more than one by the vacuum heating panel of bottom with the perforation of described vacuum box intracoelomic cavity; Crack between the vacuum heating panel constitutes cooling channels; Also welding is provided with the fin that is used to enlarge area of dissipation between the vacuum heating panel; Be filled with in the vacuum box body and meet the heat vaporization, meet the liquid working substance of condensation knot, it is characterized in that: be laid with on the inwall of the inner surface of described vacuum box body and described vacuum heating panel can adsorptive liquid wick; Fixedly be coated with flow-stopping plate on the end face of described cooling channels, the width of this flow-stopping plate makes the outlet that forms cooling fluid between flow-stopping plate and the vacuum box body less than the width of described end face; The top end face of described cooling channels is the inlet of cooling fluid; Described fin is arranged in the cooling channels along the flow direction of cooling fluid.

2, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum box body is rectangle or circle or the hexagonal body that adopts the good made of heat conductivility.

3, the outside according to claim 1 and 2 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum heating panel be arranged in parallel in described vacuum box surface or is that the center of circle is outwards with the setting of radiation form with center, described vacuum box surface.

4, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum heating panel top also is provided with and makes the communicating pipe that is interconnected between the vacuum heating panel, this communicating pipe is one or one or more.

5, according to claim 1 or 2 or 4 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is divided into upper and lower two sections settings, and wherein, epimere is perpendicular to the entrance face of described cooling fluid; The lower end is perpendicular to the exit end face of described cooling fluid, and upper and lower two sections fins are non-intersect.

6, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described flow-stopping plate can also fixedly cover on the top end face of described cooling channels, makes the outlet or the inlet of the end face formation cooling fluid of described cooling channels; Described fin is arranged on the surface of described vacuum heating panel or vacuum box body by its side welding.

7, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described wick is made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen, or adopts the powder sintered plate body made from micropore.

8, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described wick is to be bent continuously or crooked made shoestring by reciprocal by metal or organic material thin slice; Described sheet surface is offered porose, and by welding or bonding being sticked on the inwall of described housing.

9, the outside according to claim 7 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described shoestring, is made and forms a plurality of " U " shape groove or " V " shape groove or " Ω " shape groove in this shoestring according to " U " font or " V " font or " Ω " shape back and forth bends or bending is made by described thin slice.

10, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be installed with one or more layers stiffener in the described vacuum box body, this stiffener stretches in the described vacuum heating panel, and its end face is fixedlyed connected with the inwall of vacuum box body and the inwall of vacuum heating panel.

11, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be provided with the thin-walled heat pipe that one or more are made by metal material in the described cooling channels, this thin-walled heat pipe passes described fin, and with the welding of described fin, its end is fixed on the surface of vacuum heating panel or vacuum box body, and with described vacuum heating panel and vacuum box body internal run-through.

12, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is the waveform that sheet metal is made.

13, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is that sheet metal bends the radiating fin group that is constituted continuously according to " Z " font.

14, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin surface offers the via hole that the described cooling fluid of more than one confession passes, perhaps the perpendicular upright thorn that can cause described cooling fluid turbulent flow that is provided with on its surface.

15, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be welded with the auxiliary heat dissipation sheet that improves radiating efficiency between the described fin, this auxiliary heat dissipation sheet is along the flow direction setting of cooling fluid.

16, according to claim 1 or 2 or 4 or 6 or 8 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described vacuum box bottom is installed with one or more heat-conducting plates that can fit tightly with the radiating surface of outside heat-generating electronic elements, this heat-conducting plate embeds described vacuum box bottom, or is opened in the bottom surface that described vacuum box bottom is used to embed the special use depression of heat-generating electronic elements radiating surface.

17, the outside according to claim 15 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described heat-conducting plate is rectangle or the circle of being made by the metallic plate with good heat conductive performance or organic soft board.

18, according to claim 1 or 2 or 4 or 6 or 8 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described vacuum box bottom also offers one or more perforate, embed the device substrate that is complementary with its size, the periphery of this device substrate and the tight sealing-in of vacuum box bottom in this perforate; The surface that described device substrate is positioned at described vacuum box body is provided with the inner core of integrated electronic circuit or electronic component; The lead-foot-line of the inner core of described integrated electronic circuit or electronic component is arranged on the surface that described device substrate is positioned at the external side of vacuum box; Described wick is on the inner core of electric insulation and be laid in described integrated electronic circuit or electronic component; Described liquid working substance is an electrical insulating material, and compatible with the inner core material chemistry of described integrated electronic circuit or electronic component, electric compatible.

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