CN1657289A - 吐出装置及材料涂敷方法、滤色片基板及装置的制造方法 - Google Patents
吐出装置及材料涂敷方法、滤色片基板及装置的制造方法 Download PDFInfo
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- CN1657289A CN1657289A CN2005100093670A CN200510009367A CN1657289A CN 1657289 A CN1657289 A CN 1657289A CN 2005100093670 A CN2005100093670 A CN 2005100093670A CN 200510009367 A CN200510009367 A CN 200510009367A CN 1657289 A CN1657289 A CN 1657289A
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Images
Classifications
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/14048—Movable member in the chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/28—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes, envelopes, e.g. flat-bed ink-jet printers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/008—Sequential or multiple printing, e.g. on previously printed background; Mirror printing; Recto-verso printing; using a combination of different printing techniques; Printing of patterns visible in reflection and by transparency; by superposing printed artifacts
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- G—PHYSICS
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J11/20—Constructional details
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- H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/42—Fluorescent layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Optical Filters (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004043020 | 2004-02-19 | ||
| JP2004043020A JP4100354B2 (ja) | 2004-02-19 | 2004-02-19 | 材料塗布方法、カラーフィルタの製造方法、エレクトロルミネッセンス表示装置の製造方法、およびプラズマ表示装置の製造方法。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1657289A true CN1657289A (zh) | 2005-08-24 |
| CN100415517C CN100415517C (zh) | 2008-09-03 |
Family
ID=34857998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100093670A Expired - Lifetime CN100415517C (zh) | 2004-02-19 | 2005-02-21 | 吐出装置及材料涂敷方法、滤色片基板及装置的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7381449B2 (zh) |
| JP (1) | JP4100354B2 (zh) |
| KR (1) | KR100658478B1 (zh) |
| CN (1) | CN100415517C (zh) |
| TW (1) | TWI253991B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104511396A (zh) * | 2013-09-30 | 2015-04-15 | 斯克林集团公司 | 涂布装置 |
| CN112406324A (zh) * | 2020-09-29 | 2021-02-26 | 镇江市海络数码科技有限公司 | 一种应用于数码3d印刷的成套设备 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4289172B2 (ja) * | 2004-02-19 | 2009-07-01 | セイコーエプソン株式会社 | 吐出装置 |
| US20090040269A1 (en) * | 2005-12-28 | 2009-02-12 | Sharp Kabushiki Kaisha | Droplet Applicator |
| JP4983059B2 (ja) * | 2006-03-16 | 2012-07-25 | セイコーエプソン株式会社 | 機能液配置方法 |
| KR101492400B1 (ko) * | 2007-12-21 | 2015-02-12 | 도레 엔지니아린구 가부시키가이샤 | 도포장치 및 도포방법 |
| DE102013110695A1 (de) | 2012-10-02 | 2014-04-03 | Samsung Electronics Co., Ltd. | Bildsensor, Verfahren zum Betreiben desselben und Bildverarbeitungssystem mit demselben |
| US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| US12330178B2 (en) | 2012-12-27 | 2025-06-17 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| KR102777021B1 (ko) | 2012-12-27 | 2025-03-05 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
| KR102103684B1 (ko) | 2013-12-12 | 2020-05-29 | 카티바, 인크. | 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06228853A (ja) | 1993-01-29 | 1994-08-16 | Kanai Hiroyuki | 不織布用スプレートラバース装置およびこれを用いた不織布への樹脂散布方法 |
| JP3159919B2 (ja) | 1995-08-01 | 2001-04-23 | キヤノン株式会社 | カラーフィルタの製造装置及び製造方法及び着色むらの低減方法 |
| JP3459812B2 (ja) | 1996-09-30 | 2003-10-27 | キヤノン株式会社 | カラーフィルタの製造方法 |
| JP2000071482A (ja) | 1998-08-28 | 2000-03-07 | Toshiba Tec Corp | カラーインクジェットプリンタ |
| JP4065475B2 (ja) | 1998-09-02 | 2008-03-26 | キヤノン株式会社 | カラーフィルタの製造方法、この製造方法で製造されたカラーフィルタを用いた液晶素子及びインクジェットヘッド |
| JP4065476B2 (ja) * | 1998-11-27 | 2008-03-26 | キヤノン株式会社 | カラーフィルタの製造方法及び表示装置の製造方法 |
| JP2001319567A (ja) * | 2000-02-28 | 2001-11-16 | Ricoh Co Ltd | 電子源基板および該電子源基板を用いた画像表示装置 |
| JP2001261373A (ja) | 2000-03-22 | 2001-09-26 | Central Glass Co Ltd | 薄膜の形成方法および薄膜付き板ガラス |
| JP2002221616A (ja) * | 2000-11-21 | 2002-08-09 | Seiko Epson Corp | カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置、インクジェットヘッドの制御装置、材料の吐出方法及び材料の吐出装置、並びに電子機器 |
| JP2004004803A (ja) | 2000-11-21 | 2004-01-08 | Seiko Epson Corp | 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置、並びに電子機器 |
| JP3804463B2 (ja) | 2001-03-26 | 2006-08-02 | セイコーエプソン株式会社 | プリンタ用マルチヘッドの送り制御方法及び送り制御装置 |
| JP2003084125A (ja) * | 2001-07-04 | 2003-03-19 | Seiko Epson Corp | カラーフィルタの製造方法及び製造装置、液晶表示装置の製造方法及び製造装置、el発光層配設基板の製造方法及び製造装置、el発光装置の製造方法及び製造装置、成膜方法及び成膜装置、電気光学装置及びその製造方法並びに電子機器 |
| CN1232839C (zh) * | 2001-09-28 | 2005-12-21 | 兄弟工业株式会社 | 液滴图案形成装置 |
| JP2003159787A (ja) * | 2001-11-28 | 2003-06-03 | Seiko Epson Corp | 吐出方法およびその装置、電気光学装置、その製造方法およびその製造装置、カラーフィルタ、その製造方法およびその製造装置、ならびに基材を有するデバイス、その製造方法およびその製造装置 |
| US6810919B2 (en) | 2002-01-11 | 2004-11-02 | Seiko Epson Corporation | Manufacturing method for display device, display device, manufacturing method for electronic apparatus, and electronic apparatus |
| JP2003251243A (ja) * | 2002-03-04 | 2003-09-09 | Seiko Epson Corp | 描画方法、描画装置、並びにこれを備えた液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
| JP3988645B2 (ja) | 2002-03-06 | 2007-10-10 | セイコーエプソン株式会社 | 吐出方法、吐出装置、カラーフィルタの製造方法、エレクトロルミネッセンス装置の製造方法、およびプラズマディスプレイパネルの製造方法 |
| JP4014901B2 (ja) * | 2002-03-14 | 2007-11-28 | セイコーエプソン株式会社 | 液滴吐出による材料の配置方法および表示装置の製造方法 |
| JP2004004534A (ja) * | 2003-01-23 | 2004-01-08 | Dainippon Ink & Chem Inc | カラーパターンの印刷方法 |
| JP2005199230A (ja) * | 2004-01-19 | 2005-07-28 | Seiko Epson Corp | 吐出装置、材料塗布方法、カラーフィルタ基板の製造方法、エレクトロルミネッセンス表示装置の製造方法、プラズマ表示装置の製造方法、および配線製造方法 |
| JP4289172B2 (ja) * | 2004-02-19 | 2009-07-01 | セイコーエプソン株式会社 | 吐出装置 |
-
2004
- 2004-02-19 JP JP2004043020A patent/JP4100354B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-16 KR KR1020050012647A patent/KR100658478B1/ko not_active Expired - Fee Related
- 2005-02-16 TW TW094104524A patent/TWI253991B/zh not_active IP Right Cessation
- 2005-02-18 US US11/062,348 patent/US7381449B2/en not_active Expired - Lifetime
- 2005-02-21 CN CNB2005100093670A patent/CN100415517C/zh not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104511396A (zh) * | 2013-09-30 | 2015-04-15 | 斯克林集团公司 | 涂布装置 |
| CN104511396B (zh) * | 2013-09-30 | 2017-04-12 | 斯克林集团公司 | 涂布装置 |
| CN112406324A (zh) * | 2020-09-29 | 2021-02-26 | 镇江市海络数码科技有限公司 | 一种应用于数码3d印刷的成套设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100658478B1 (ko) | 2006-12-19 |
| US20050185007A1 (en) | 2005-08-25 |
| US7381449B2 (en) | 2008-06-03 |
| JP4100354B2 (ja) | 2008-06-11 |
| TWI253991B (en) | 2006-05-01 |
| TW200600362A (en) | 2006-01-01 |
| JP2005230690A (ja) | 2005-09-02 |
| CN100415517C (zh) | 2008-09-03 |
| KR20060041984A (ko) | 2006-05-12 |
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