CN1655279A - 在半导体存储器装置中的片内终结上的模式转移电路 - Google Patents
在半导体存储器装置中的片内终结上的模式转移电路 Download PDFInfo
- Publication number
- CN1655279A CN1655279A CNA2004100889040A CN200410088904A CN1655279A CN 1655279 A CN1655279 A CN 1655279A CN A2004100889040 A CNA2004100889040 A CN A2004100889040A CN 200410088904 A CN200410088904 A CN 200410088904A CN 1655279 A CN1655279 A CN 1655279A
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- signal
- odt
- order
- internal control
- transfer gate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims abstract description 11
- 230000004044 response Effects 0.000 claims abstract description 7
- 230000000295 complement effect Effects 0.000 claims description 26
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 230000003139 buffering effect Effects 0.000 description 27
- 239000000872 buffer Substances 0.000 description 20
- 230000000630 rising effect Effects 0.000 description 17
- 230000007423 decrease Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 206010011968 Decreased immune responsiveness Diseases 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
- G11C7/1063—Control signal output circuits, e.g. status or busy flags, feedback command signals
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
- G11C7/1057—Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
- G11C7/222—Clock generating, synchronizing or distributing circuits within memory device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/22—Control and timing of internal memory operations
- G11C2207/2227—Standby or low power modes
Landscapes
- Dram (AREA)
- Logic Circuits (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-0009501A KR100528164B1 (ko) | 2004-02-13 | 2004-02-13 | 반도체 기억 소자에서의 온 다이 터미네이션 모드 전환회로 및 그 방법 |
| KR1020040009501 | 2004-02-13 | ||
| KR10-2004-0009501 | 2004-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1655279A true CN1655279A (zh) | 2005-08-17 |
| CN100476999C CN100476999C (zh) | 2009-04-08 |
Family
ID=34836728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100889040A Expired - Fee Related CN100476999C (zh) | 2004-02-13 | 2004-11-04 | 在半导体存储器装置中的片内终结上的模式转移电路 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7196966B2 (zh) |
| JP (1) | JP4693089B2 (zh) |
| KR (1) | KR100528164B1 (zh) |
| CN (1) | CN100476999C (zh) |
| TW (1) | TWI253084B (zh) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101025995B (zh) * | 2006-01-16 | 2010-04-14 | 海力士半导体有限公司 | 用于控制内建终端的装置 |
| CN1941629B (zh) * | 2005-09-29 | 2010-05-12 | 海力士半导体有限公司 | 控制晶粒内建终端电阻的装置及方法 |
| US7977968B2 (en) | 2005-09-29 | 2011-07-12 | Hynix Semiconductor Inc. | Semiconductor memory device |
| CN101425325B (zh) * | 2007-11-02 | 2012-05-30 | 海力士半导体有限公司 | 用于控制终端阻抗的电路和方法 |
| CN110832585A (zh) * | 2017-08-17 | 2020-02-21 | 美光科技公司 | 高频域的数据输出 |
| CN112951287A (zh) * | 2017-05-29 | 2021-06-11 | 三星电子株式会社 | 控制片内终结器的方法和执行该方法的系统 |
| CN112986797A (zh) * | 2021-02-08 | 2021-06-18 | 昂宝电子(上海)有限公司 | 芯片测试电路及方法 |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7574634B2 (en) * | 2004-06-21 | 2009-08-11 | Micron Technology, Inc. | Real time testing using on die termination (ODT) circuit |
| US7560956B2 (en) * | 2005-08-03 | 2009-07-14 | Micron Technology, Inc. | Method and apparatus for selecting an operating mode based on a determination of the availability of internal clock signals |
| KR100733430B1 (ko) * | 2005-09-29 | 2007-06-29 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 |
| US7365564B2 (en) * | 2005-09-29 | 2008-04-29 | Hynix Semiconductor Inc. | Apparatus and method for controlling on die termination |
| KR100625298B1 (ko) * | 2005-09-29 | 2006-09-15 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 제어 장치 |
| US7429871B2 (en) * | 2005-09-29 | 2008-09-30 | Hynix Semiconductor Inc. | Device for controlling on die termination |
| JP4524662B2 (ja) * | 2005-10-21 | 2010-08-18 | エルピーダメモリ株式会社 | 半導体メモリチップ |
| KR100849065B1 (ko) * | 2005-12-15 | 2008-07-30 | 주식회사 하이닉스반도체 | 동기식 메모리 장치의 드라이버 및 오디티 임피던스 조절방법 |
| TWI323467B (en) | 2005-12-27 | 2010-04-11 | Hynix Semiconductor Inc | On-die termination circuit for semiconductor memory apparatus |
| KR100771868B1 (ko) * | 2006-02-28 | 2007-11-01 | 삼성전자주식회사 | 다이내믹 출력버퍼회로 |
| KR100780949B1 (ko) | 2006-03-21 | 2007-12-03 | 삼성전자주식회사 | 데이터 독출 모드에서 odt 회로의 온/오프 상태를테스트할 수 있는 반도체 메모리 장치 및 odt 회로의상태 테스트 방법 |
| KR100681881B1 (ko) | 2006-04-06 | 2007-02-15 | 주식회사 하이닉스반도체 | 반도체 메모리의 온 다이 터미네이션 장치 및 방법 |
| KR100718049B1 (ko) | 2006-06-08 | 2007-05-14 | 주식회사 하이닉스반도체 | 반도체 메모리의 온 다이 터미네이션 장치 및 그 제어방법 |
| KR100844932B1 (ko) * | 2006-09-27 | 2008-07-10 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 회로를 갖는 반도체메모리소자 |
| KR100851989B1 (ko) | 2006-10-12 | 2008-08-13 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 온도정보 출력회로 및 방법 |
| KR100780962B1 (ko) * | 2006-10-27 | 2007-12-03 | 삼성전자주식회사 | 다이나믹 odt 모드 테스트 방법 및 그 방법을 사용하는odt 모드 테스트 회로 |
| KR100866601B1 (ko) * | 2006-12-04 | 2008-11-03 | 삼성전자주식회사 | 반도체 장치의 종단 저항을 제어할 수 있는 장치 및 방법 |
| KR100807118B1 (ko) * | 2007-01-03 | 2008-02-26 | 주식회사 하이닉스반도체 | 반도체 메모리 소자 |
| KR100880835B1 (ko) | 2007-01-03 | 2009-02-02 | 주식회사 하이닉스반도체 | 메모리장치의 음전압 공급장치. |
| KR20080065100A (ko) * | 2007-01-08 | 2008-07-11 | 주식회사 하이닉스반도체 | 반도체 메모리 소자와 그의 구동 방법 |
| KR100826498B1 (ko) * | 2007-02-09 | 2008-05-02 | 삼성전자주식회사 | 주파수 범위에 따라서 가변되는 파이프 라인 구조를 갖는온 다이 터미네이션 제어회로를 구비하는 반도체 장치 |
| KR100871704B1 (ko) | 2007-02-27 | 2008-12-05 | 삼성전자주식회사 | 반도체 메모리 장치의 온다이 터미네이션 회로, 그의 제어방법 및 odt 동기 버퍼 |
| KR100821585B1 (ko) | 2007-03-12 | 2008-04-15 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 온 다이 터미네이션 회로 |
| KR100857438B1 (ko) | 2007-03-13 | 2008-09-10 | 주식회사 하이닉스반도체 | 전압 생성 회로 및 이를 이용한 반도체 메모리 장치의 기준전압 생성 회로 |
| KR100897255B1 (ko) | 2007-04-12 | 2009-05-14 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 온 다이 터미네이션 회로 및 방법 |
| KR100930399B1 (ko) * | 2007-05-10 | 2009-12-08 | 주식회사 하이닉스반도체 | 반도체 장치의 데이터 출력 드라이빙 회로 |
| KR100853468B1 (ko) * | 2007-07-12 | 2008-08-21 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 장치를 구비하는 반도체메모리소자 및그의 구동방법 |
| KR100929846B1 (ko) * | 2007-10-23 | 2009-12-04 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 제어 회로 |
| KR100863535B1 (ko) * | 2007-11-02 | 2008-10-15 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 장치 및 이를 포함하는 반도체메모리장치 |
| KR100927401B1 (ko) * | 2007-12-12 | 2009-11-19 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 제어회로 및 제어방법 |
| KR100960012B1 (ko) | 2007-12-12 | 2010-05-28 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 제어회로 및 제어방법 |
| US8719606B2 (en) * | 2008-03-31 | 2014-05-06 | Intel Corporation | Optimizing performance and power consumption during memory power down state |
| KR100933676B1 (ko) * | 2008-04-30 | 2009-12-23 | 주식회사 하이닉스반도체 | 캘리브래이션 회로, 이를 포함하는 반도체 메모리장치, 및캘리브래이션 회로의 동작 방법 |
| KR100945813B1 (ko) * | 2008-08-08 | 2010-03-08 | 주식회사 하이닉스반도체 | 반도체 집적회로의 저항값 조정 코드 생성 장치 및 방법 |
| US7869300B2 (en) * | 2009-04-29 | 2011-01-11 | Agere Systems Inc. | Memory device control for self-refresh mode |
| US8139433B2 (en) * | 2009-05-13 | 2012-03-20 | Lsi Corporation | Memory device control for self-refresh mode |
| KR101069678B1 (ko) | 2009-06-16 | 2011-10-05 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 온도 감지 회로 |
| JP5474458B2 (ja) * | 2009-09-10 | 2014-04-16 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びこれを備えるデータ処理システム |
| US9213063B2 (en) | 2014-03-26 | 2015-12-15 | Freescale Semiconductor, Inc. | Reset generation circuit for scan mode exit |
| KR20160076889A (ko) * | 2014-12-23 | 2016-07-01 | 에스케이하이닉스 주식회사 | 반도체장치 및 반도체시스템 |
| US11133042B2 (en) * | 2016-06-27 | 2021-09-28 | SK Hynix Inc. | Semiconductor memory system and semiconductor memory device, which can be remotely initialized |
| US10147471B2 (en) | 2016-08-02 | 2018-12-04 | SK Hynix Inc. | Semiconductor devices and semiconductor systems |
| US11217286B2 (en) * | 2016-06-27 | 2022-01-04 | SK Hynix Inc. | Semiconductor memory device with power down operation |
| US10181346B2 (en) | 2016-08-02 | 2019-01-15 | SK Hynix Inc. | Semiconductor devices and operations thereof |
| KR102592359B1 (ko) * | 2016-06-27 | 2023-10-20 | 에스케이하이닉스 주식회사 | 반도체장치 |
| US12424253B2 (en) * | 2016-08-02 | 2025-09-23 | SK Hynix Inc. | Semiconductor device with power-down signal generation |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0475588B1 (en) | 1990-08-17 | 1996-06-26 | STMicroelectronics, Inc. | A semiconductor memory with inhibited test mode entry during power-up |
| US5134587A (en) | 1990-08-17 | 1992-07-28 | Sgs-Thomson Microelectronics, Inc. | Semiconductor memory with automatic test mode exit on chip enable |
| US6600215B1 (en) | 1998-04-02 | 2003-07-29 | Micron Technology, Inc. | Method and apparatus for coupling a semiconductor die to die terminals |
| JP3880206B2 (ja) * | 1998-07-16 | 2007-02-14 | 富士通株式会社 | 集積回路装置 |
| EP1306849B1 (en) * | 2001-10-19 | 2008-02-27 | Samsung Electronics Co., Ltd. | Devices and methods for controlling active termination resistors in a memory system |
| KR100502408B1 (ko) * | 2002-06-21 | 2005-07-19 | 삼성전자주식회사 | 액티브 터미네이션을 내장한 메모리 장치의 파워-업시퀀스를 제어하는 메모리 시스템과 그 파워-업 및 초기화방법 |
| US6650594B1 (en) * | 2002-07-12 | 2003-11-18 | Samsung Electronics Co., Ltd. | Device and method for selecting power down exit |
| DE10245536B4 (de) | 2002-09-30 | 2005-02-03 | Infineon Technologies Ag | Kalibrieren von Halbleitereinrichtungen mittels einer gemeinsamen Kalibrierreferenz |
| KR100464437B1 (ko) | 2002-11-20 | 2004-12-31 | 삼성전자주식회사 | 온칩 dc 전류 소모를 최소화할 수 있는 odt 회로와odt 방법 및 이를 구비하는 메모리장치를 채용하는메모리 시스템 |
| KR100506976B1 (ko) * | 2003-01-03 | 2005-08-09 | 삼성전자주식회사 | 온다이 터미네이션 회로를 가지는 동기 반도체 메모리 장치 |
-
2004
- 2004-02-13 KR KR10-2004-0009501A patent/KR100528164B1/ko not_active Expired - Lifetime
- 2004-06-28 US US10/879,650 patent/US7196966B2/en not_active Expired - Lifetime
- 2004-06-28 TW TW093118720A patent/TWI253084B/zh not_active IP Right Cessation
- 2004-06-30 JP JP2004195037A patent/JP4693089B2/ja not_active Expired - Fee Related
- 2004-11-04 CN CNB2004100889040A patent/CN100476999C/zh not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1941629B (zh) * | 2005-09-29 | 2010-05-12 | 海力士半导体有限公司 | 控制晶粒内建终端电阻的装置及方法 |
| US7977968B2 (en) | 2005-09-29 | 2011-07-12 | Hynix Semiconductor Inc. | Semiconductor memory device |
| CN101025995B (zh) * | 2006-01-16 | 2010-04-14 | 海力士半导体有限公司 | 用于控制内建终端的装置 |
| US7888963B2 (en) | 2006-01-16 | 2011-02-15 | Hynix Semiconductor Inc. | Apparatus for controlling on-die termination |
| CN101425325B (zh) * | 2007-11-02 | 2012-05-30 | 海力士半导体有限公司 | 用于控制终端阻抗的电路和方法 |
| CN112951287A (zh) * | 2017-05-29 | 2021-06-11 | 三星电子株式会社 | 控制片内终结器的方法和执行该方法的系统 |
| US11475930B2 (en) | 2017-05-29 | 2022-10-18 | Samsung Electronics Co., Ltd. | Method of controlling on-die termination and system performing the same |
| CN110832585A (zh) * | 2017-08-17 | 2020-02-21 | 美光科技公司 | 高频域的数据输出 |
| US10699757B2 (en) | 2017-08-17 | 2020-06-30 | Micron Technology, Inc. | DQS-offset and read-RTT-disable edge control |
| CN110832585B (zh) * | 2017-08-17 | 2021-02-09 | 美光科技公司 | Dqs偏移和read-rtt-off边缘控制 |
| CN112986797A (zh) * | 2021-02-08 | 2021-06-18 | 昂宝电子(上海)有限公司 | 芯片测试电路及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7196966B2 (en) | 2007-03-27 |
| KR20050081315A (ko) | 2005-08-19 |
| KR100528164B1 (ko) | 2005-11-15 |
| US20050180229A1 (en) | 2005-08-18 |
| CN100476999C (zh) | 2009-04-08 |
| TWI253084B (en) | 2006-04-11 |
| JP4693089B2 (ja) | 2011-06-01 |
| JP2005228458A (ja) | 2005-08-25 |
| TW200527444A (en) | 2005-08-16 |
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