CN1649133A - Encapsulation structure and encapsulation method for reducing particle contamination of photosensitive components - Google Patents

Abstract

The present invention provides a packaging structure and packaging method for reducing the contamination of light sensing components by particles. The packaging structure includes a pre-molded upper and lower shells that are embedded with each other, thereby forming a chamber therebetween, in which a light sensing component is placed, and the chamber also includes a material coated outside the light sensing component to absorb particles. The method for forming the packaging structure includes coating the material capable of absorbing particles in the chamber before embedding the upper and lower shells.

Description

Encapsulation structure and encapsulation method for reducing particle contamination of photosensitive components

technical field

The present invention relates to a pre-molding compound assembly structure and packaging method, in particular to a packaging structure and packaging method for reducing particle contamination of photosensitive components.

Background technique

The packaging of the traditional light sensor components is to adopt individual pre-molded shells. Typically, plastic is used as the material of the pre-molded shells. After the plastic shells are combined, a cavity will be formed, and a light sensor component will be placed in the plastic Inside the casing, the individual plastic casings are combined to form a single finished package, so that the photosensitive components are packaged in the cavity.

Methods of assembling plastic housings include bonding and fitting. Fig. 1 is a three-dimensional schematic view of a fitted plastic housing 10, including an upper housing 12 and a lower housing 14, the lower housing 14 includes an inner surface 16 and an outer surface 18, and a photosensitive component 20 is attached to the inner surface, The upper and lower shells 12 and 14 respectively have fitting structures 22 and 24 for engaging to form a single finished package. FIG. 2 is a cross-sectional view of the fitting structure in FIG. 1 . The fitting structures 22 and 24 are respectively located on the upper and lower shells 12 and 14 , and a cavity is formed between the upper and lower shells 12 and 14 after engagement. In the embedded packaging method, since the friction between the embedded structures 22 and 24 will generate fine dust particles, the friction part 26 is the area where the fine dust particles are mainly generated, and it is impossible to strengthen the individual plastic casings in advance after the plastic casings are assembled. Cleaning is used to prevent the generation of particles, so that the particles are sealed in the chamber and may adhere to the photosensitive component 20 due to static electricity or other reasons, which will lead to abnormal light sensing and poor function of the photosensitive component 20 .

In order to solve the above problems, the traditional method is to strengthen the cleaning process of the plastic shell before assembling the plastic shell, such as soaking in chemical liquid, cleaning with ultrasonic waves, spraying with a high-pressure air gun, or combining the above cleaning procedures to remove the shell. Particles on the surface of the body, and at the same time use chemical treatment to make the surface smooth, so as to reduce the particles generated by the friction of the fitting structure, but there are many factors that cause friction and the variation is large, so it is not easy to control the amount of particles generated, which will cause photosensitive components. Yield instability.

Fig. 3 is a schematic perspective view of a known improved packaging structure 100, including an upper casing 102 and a lower casing 104 fit together to form a cavity inside, the lower casing 104 includes an inner surface 108 and an outer surface 110, and an opening The area 106 is located below the fitting structure 112 of the lower housing 104, the opening area 106 communicates with the inner surface 108 and the outer surface 110, and the photosensitive component 114 is attached on the inner surface 108, and is fitted in the upper housing 102 and the lower housing 104 At this time, the fine dust particles generated by friction can be scattered out of the outer surface 110 through the opening area 106, so as to prevent the fine dust particles from adhering in the chamber.

4 is a top view of the lower casing 104 of the package structure 100 in FIG. 3 , the photosensitive element 114 is attached to the inner surface 108 and a protective layer is added thereon, and the hole area 106 is located below the fitting 112 . Since the opening area 106 cannot be applied to all the friction points of the package structure 100 , there are still particles generated in the cavity, resulting in abnormal light sensing and poor function of the light sensing element 114 .

Therefore, it is desirable to provide a packaging structure and a packaging method that reduce the particle contamination of the photosensitive component.

Contents of the invention

The purpose of the present invention is to provide a packaging structure and a packaging method that reduce particle contamination of the photosensitive component, so as to improve the packaging yield of the photosensitive component.

The object of the present invention is to provide a packaging structure and packaging method that reduce the contamination of photosensitive components by particles, so as to reduce the abnormal function of the photosensitive components.

According to the present invention, a packaging structure for reducing photosensitive components from being polluted by particles uses an upper casing and a lower casing with a fitting structure to form a cavity, and the cavity has an attachment area and an adsorption area. A photosensitive component is placed on the attachment area, and a material is coated on the adsorption area to absorb particles.

The method for forming the above packaging structure includes selecting the adsorption area in the cavity and coating the material capable of adsorbing particles on it before the upper and lower shells are fitted together.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of a fitted plastic housing;

Fig. 2 is a sectional view of the mosaic structure of Fig. 1;

FIG. 3 is a perspective view of a known improved package structure;

FIG. 4 is a top view of the lower housing 104 of the packaging structure 100 of FIG. 3;

Fig. 5 is a three-dimensional schematic diagram of the packaging structure of the present invention;

FIG. 6 is a top view of the lower casing 204 of the packaging structure of the present invention;

7 is a schematic diagram of the inner surface 250 of the upper case 202 of the packaging structure of the present invention;

Figure 8 is a side view of the packaging structure of the present invention; and

FIG. 9 is a cross-sectional view of the packaging structure of the present invention.

Explanation of the figure numbers of the attached drawings:

10 Embedded plastic housing

12 upper shell

14 lower shell

16 inner surface

18 outer surface

20 light sensor components

22 chimeric structure

24 chimeric structure

26 Friction parts

100 package structure

102 upper shell

104 lower shell

106 hole area

108 inner surface

110 outer surface

112 chimeric structure

114 light sensor components

200 package structure

202 upper shell

204 lower shell

206 inner surface

208 outer surface

210 adsorption area

212 chimeric structure

214 light sensor components

216 attachment area

250 inner surface

252 chimeric structure

254 chimeric points

256 Materials that can adsorb particles

300 chambers

Detailed ways

For those skilled in the art, the present invention will be more clearly understood from the following detailed description with reference to the accompanying drawings, and the above and other objects and advantages thereof will become more apparent.

5 is a three-dimensional schematic view of the packaging structure 200 of the present invention, including an upper shell 202 and a lower shell 204 to fit each other to form a cavity, the lower shell 204 has an inner surface 206 and an outer surface 208, and an adsorption area 210 is on the inner surface 206 below a fitting structure 212, the photosensitive component 214 is attached on the inner surface 206, when the upper casing 202 and the lower casing 204 are fitted, the particles generated due to friction will be adsorbed The material coated on the area 210 that can absorb the particles is adsorbed, so as to prevent the particles from being scattered randomly and affecting the photosensitive component 214 .

6 is a top view of the lower housing 204. There is an attachment area 216 on the inner surface 206. The photosensitive component 214 is placed on the attachment area 216. The adsorption area 210 is under the fitting structure 212, and the adsorption area 210 A material that can absorb particles is coated on the upper surface to concentrate and absorb particles generated when the upper and lower shells are fitted together. The material for absorbing particles is a polymer material or other materials that can absorb particles, such as silica gel. In different embodiments, the adsorption area 210 may be disposed on any area of the inner surface 206 other than the attachment area 216 , such as an area adjacent to the attachment area 216 .

7 is a schematic diagram of the inner surface 250 of the upper housing 202. The upper housing 202 has a fitting structure 252. Any area on the inner surface 250 can be provided with an adsorption area, and a material that can absorb particles can be coated thereon. .

Fig. 8 is a side view of the packaging structure 200, the upper casing 202 and the lower casing 204 fit together to form a chamber 300, the photosensitive component 214 is attached to the attachment area 216 in the chamber 300, and in the chamber 300 Areas other than the inner attaching area 216 can be used as the adsorption area 210, on which a material capable of adsorbing particles is coated to concentrate the adsorption of particles.

9 is a cross-sectional view of the packaging structure 200. The cavity 300 is formed after the fitting structures 252 and 212 are fitted. Generally speaking, the generation of particles comes from the friction between the fitting structures 252 and 212. Therefore, it is best that the adsorption area 210 is arranged on the fitting side. Under the fitting point 254 of the joining structures 252 and 212, the material 256 capable of adsorbing particles is coated thereon, so that the particles can be adsorbed intensively before the particles are dispersed in the chamber 300, so as to achieve the best effect of adsorbing the particles.

The method of forming the packaging structure 200 is to place the photosensitive component 214 on the attachment area 216 in the chamber 300 before the upper and lower housings 202 and 204 are fitted, and then coat the adsorbable particles in the selective adsorption area 210 in the chamber 300 The material 256 is on it, and finally the upper and lower shells 202 and 204 are fitted together to form a single finished product.

The above description of the preferred embodiments of the present invention is for the purpose of illustration, and is not intended to limit the present invention to the disclosed form. It is possible to modify or change based on the above teachings or learning from the embodiments of the present invention. , the embodiment is to explain the principle of the present invention and to allow those of ordinary skill in the art to use various embodiments to select and describe the present invention in practical applications. to make sure.

Claims (11)

1. one kind is reduced light sensing component by the encapsulating structure of particle contamination, comprising:

Chimeric each other upper shell and lower house form a chamber therebetween, to settle a light sensing component at an adhesion zone; And

One adsorption zone in this chamber, is coated with a material with adsorbent particles on it.

2. encapsulating structure as claimed in claim 1 is characterized in that: this material comprises macromolecular material.

3. encapsulating structure as claimed in claim 2 is characterized in that: this macromolecular material comprises a silica gel.

4. encapsulating structure as claimed in claim 1 is characterized in that: this upper and lower housing comprises that also an embedded structure is chimeric for this upper and lower housing, and this adsorption zone is under this embedded structure.

5. encapsulating structure as claimed in claim 1 is characterized in that: this lower house has an inner surface in this chamber, and this adsorption zone is at the inner surface of this lower house except that adhesion zone.

6. encapsulating structure as claimed in claim 1 is characterized in that: this upper shell has an inner surface in this chamber, and this adsorption zone is on the inner surface of this upper shell.

7. encapsulating structure as claimed in claim 1 is characterized in that: contiguous this adhesion zone of this adsorption zone.

8. one kind is reduced light sensing component by the method for packing of particle contamination, comprises the following steps:

Precasting model one upper shell and a lower house, the two can be chimeric each other to form a chamber betwixt;

Settle a light sensing component in this chamber;

The material that is coated with adsorbable particulate is in this chamber; And

Chimeric this upper shell and lower house.

9. method for packing as claimed in claim 8 is characterized in that: this step that is coated with the material of adsorbable particulate comprises coating one macromolecular material.

10. method for packing as claimed in claim 8 is characterized in that: this step that is coated with the material of adsorbable particulate comprise this material of coating this lower house and or the inner surface of upper shell on.

11. method for packing as claimed in claim 8 is characterized in that: this step that is coated with the material of adsorbable particulate is included in this material of the contiguous coating of this light sensing component.

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