CN1646661A - 用于集成电路量度的形态精确化 - Google Patents
用于集成电路量度的形态精确化 Download PDFInfo
- Publication number
- CN1646661A CN1646661A CNA03808175XA CN03808175A CN1646661A CN 1646661 A CN1646661 A CN 1646661A CN A03808175X A CNA03808175X A CN A03808175XA CN 03808175 A CN03808175 A CN 03808175A CN 1646661 A CN1646661 A CN 1646661A
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- CN
- China
- Prior art keywords
- signal
- morphological
- data
- precision
- morphological parameters
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
- C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Databases & Information Systems (AREA)
- Software Systems (AREA)
- Mathematical Physics (AREA)
- Data Mining & Analysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
Abstract
Description
Claims (76)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/075,904 US6609086B1 (en) | 2002-02-12 | 2002-02-12 | Profile refinement for integrated circuit metrology |
| US10/075,904 | 2002-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1646661A true CN1646661A (zh) | 2005-07-27 |
| CN100424711C CN100424711C (zh) | 2008-10-08 |
Family
ID=27732454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03808175XA Expired - Fee Related CN100424711C (zh) | 2002-02-12 | 2003-02-10 | 用于集成电路量度的形态精确化 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6609086B1 (zh) |
| EP (1) | EP1483355A4 (zh) |
| JP (1) | JP2005517903A (zh) |
| KR (1) | KR100910003B1 (zh) |
| CN (1) | CN100424711C (zh) |
| AU (1) | AU2003215141A1 (zh) |
| TW (1) | TWI221566B (zh) |
| WO (1) | WO2003068889A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105452963A (zh) * | 2013-08-13 | 2016-03-30 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
| US7945393B2 (en) * | 2002-01-10 | 2011-05-17 | Chemimage Corporation | Detection of pathogenic microorganisms using fused sensor data |
| US7136796B2 (en) * | 2002-02-28 | 2006-11-14 | Timbre Technologies, Inc. | Generation and use of integrated circuit profile-based simulation information |
| US6785009B1 (en) * | 2002-02-28 | 2004-08-31 | Advanced Micro Devices, Inc. | Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes, and systems for accomplishing same |
| US7092110B2 (en) * | 2002-07-25 | 2006-08-15 | Timbre Technologies, Inc. | Optimized model and parameter selection for optical metrology |
| US7330279B2 (en) * | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
| US6842261B2 (en) * | 2002-08-26 | 2005-01-11 | Timbre Technologies, Inc. | Integrated circuit profile value determination |
| US20040090629A1 (en) * | 2002-11-08 | 2004-05-13 | Emmanuel Drege | Diffraction order selection for optical metrology simulation |
| US7072049B2 (en) * | 2003-02-03 | 2006-07-04 | Timbre Technologies, Inc. | Model optimization for structures with additional materials |
| US7394554B2 (en) * | 2003-09-15 | 2008-07-01 | Timbre Technologies, Inc. | Selecting a hypothetical profile to use in optical metrology |
| US7224471B2 (en) * | 2003-10-28 | 2007-05-29 | Timbre Technologies, Inc. | Azimuthal scanning of a structure formed on a semiconductor wafer |
| JP3892843B2 (ja) * | 2003-11-04 | 2007-03-14 | 株式会社東芝 | 寸法測定方法、寸法測定装置および測定マーク |
| US7126700B2 (en) * | 2003-12-12 | 2006-10-24 | Timbre Technologies, Inc. | Parametric optimization of optical metrology model |
| DE60333688D1 (de) | 2003-12-19 | 2010-09-16 | Ibm | Differentielle metrologie für kritische abmessung und überlagerung |
| US7523076B2 (en) | 2004-03-01 | 2009-04-21 | Tokyo Electron Limited | Selecting a profile model for use in optical metrology using a machine learning system |
| US7212293B1 (en) * | 2004-06-01 | 2007-05-01 | N&K Technology, Inc. | Optical determination of pattern feature parameters using a scalar model having effective optical properties |
| KR100625168B1 (ko) * | 2004-08-23 | 2006-09-20 | 삼성전자주식회사 | 기판에 형성된 패턴의 검사방법 및 이를 수행하기 위한검사장치 |
| US7280229B2 (en) * | 2004-12-03 | 2007-10-09 | Timbre Technologies, Inc. | Examining a structure formed on a semiconductor wafer using machine learning systems |
| US7459100B2 (en) * | 2004-12-22 | 2008-12-02 | Lam Research Corporation | Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate |
| US7421414B2 (en) * | 2005-03-31 | 2008-09-02 | Timbre Technologies, Inc. | Split machine learning systems |
| US8112248B2 (en) * | 2005-06-09 | 2012-02-07 | Chemimage Corp. | Forensic integrated search technology with instrument weight factor determination |
| US20090012723A1 (en) * | 2005-06-09 | 2009-01-08 | Chemlmage Corporation | Adaptive Method for Outlier Detection and Spectral Library Augmentation |
| WO2006135806A2 (en) * | 2005-06-09 | 2006-12-21 | Chemimage Corporation | Forensic integrated search technology |
| US7355728B2 (en) * | 2005-06-16 | 2008-04-08 | Timbre Technologies, Inc. | Optical metrology model optimization for repetitive structures |
| US8392012B2 (en) * | 2008-10-27 | 2013-03-05 | Applied Materials, Inc. | Multiple libraries for spectrographic monitoring of zones of a substrate during processing |
| US8260446B2 (en) * | 2005-08-22 | 2012-09-04 | Applied Materials, Inc. | Spectrographic monitoring of a substrate during processing using index values |
| US7305322B2 (en) * | 2006-03-31 | 2007-12-04 | Tokyo Electron Limited | Using a virtual profile library |
| US7487053B2 (en) * | 2006-03-31 | 2009-02-03 | Tokyo Electron Limited | Refining a virtual profile library |
| US7542859B2 (en) * | 2006-03-31 | 2009-06-02 | Tokyo Electron Ltd. | Creating a virtual profile library |
| US20110237446A1 (en) * | 2006-06-09 | 2011-09-29 | Chemlmage Corporation | Detection of Pathogenic Microorganisms Using Fused Raman, SWIR and LIBS Sensor Data |
| US7526354B2 (en) | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Managing and using metrology data for process and equipment control |
| US7525673B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
| US7515283B2 (en) * | 2006-07-11 | 2009-04-07 | Tokyo Electron, Ltd. | Parallel profile determination in optical metrology |
| US7469192B2 (en) * | 2006-07-11 | 2008-12-23 | Tokyo Electron Ltd. | Parallel profile determination for an optical metrology system |
| US20080049214A1 (en) * | 2006-08-28 | 2008-02-28 | Alexei Maznev | Measuring Diffractive Structures By Parameterizing Spectral Features |
| US20080077352A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask profile library |
| US20080074678A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Accuracy of optical metrology measurements |
| US20080076046A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
| US7555395B2 (en) * | 2006-09-26 | 2009-06-30 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask to create a profile library |
| US7763404B2 (en) * | 2006-09-26 | 2010-07-27 | Tokyo Electron Limited | Methods and apparatus for changing the optical properties of resists |
| US20080074677A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
| US7417750B2 (en) * | 2006-11-07 | 2008-08-26 | Tokyo Electron Limited | Consecutive measurement of structures formed on a semiconductor wafer using an angle-resolved spectroscopic scatterometer |
| US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
| US7639351B2 (en) * | 2007-03-20 | 2009-12-29 | Tokyo Electron Limited | Automated process control using optical metrology with a photonic nanojet |
| US7949618B2 (en) * | 2007-03-28 | 2011-05-24 | Tokyo Electron Limited | Training a machine learning system to determine photoresist parameters |
| US7567353B2 (en) * | 2007-03-28 | 2009-07-28 | Tokyo Electron Limited | Automated process control using optical metrology and photoresist parameters |
| US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
| US7372583B1 (en) * | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
| US7483809B2 (en) * | 2007-04-12 | 2009-01-27 | Tokyo Electron Limited | Optical metrology using support vector machine with profile parameter inputs |
| US9151712B1 (en) * | 2007-05-30 | 2015-10-06 | Kla-Tencor Corporation | Rule checking for metrology and inspection |
| TWI416096B (zh) * | 2007-07-11 | 2013-11-21 | Nova Measuring Instr Ltd | 用於監控圖案化結構的性質之方法及系統 |
| US7460237B1 (en) | 2007-08-02 | 2008-12-02 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
| US7761178B2 (en) * | 2008-06-18 | 2010-07-20 | Tokyo Electron Limited | Automated process control using an optical metrology system optimized with design goals |
| KR101616024B1 (ko) * | 2008-10-27 | 2016-04-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 프로세싱 동안에 기판의 분광 사진 모니터링에 있어서의 적합도 |
| US8751033B2 (en) * | 2008-11-14 | 2014-06-10 | Applied Materials, Inc. | Adaptive tracking spectrum features for endpoint detection |
| RU2392687C1 (ru) * | 2009-04-14 | 2010-06-20 | Государственное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" (СПбГЭТУ) | Способ контроля интегральной микросхемы |
| CN106252220B (zh) * | 2010-05-05 | 2019-06-11 | 应用材料公司 | 用于终点检测的动态或适应性追踪光谱特征 |
| US8834229B2 (en) | 2010-05-05 | 2014-09-16 | Applied Materials, Inc. | Dynamically tracking spectrum features for endpoint detection |
| NL2006700A (en) * | 2010-06-04 | 2011-12-06 | Asml Netherlands Bv | Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus. |
| US8954186B2 (en) | 2010-07-30 | 2015-02-10 | Applied Materials, Inc. | Selecting reference libraries for monitoring of multiple zones on a substrate |
| EP2515168B1 (en) * | 2011-03-23 | 2021-01-20 | ASML Netherlands B.V. | Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures |
| CN102289533B (zh) * | 2011-05-09 | 2013-01-09 | 江南大学 | 一种基于几何规划的大规模集成电路回归测试管理方法 |
| US9194692B1 (en) | 2013-12-06 | 2015-11-24 | Western Digital (Fremont), Llc | Systems and methods for using white light interferometry to measure undercut of a bi-layer structure |
| WO2016177548A1 (en) * | 2015-05-07 | 2016-11-10 | Asml Netherlands B.V. | Metrology method and apparatus, computer program and lithographic system |
| KR102124896B1 (ko) | 2015-10-12 | 2020-06-22 | 에이에스엠엘 네델란즈 비.브이. | 처리 파라미터의 간접 결정 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607800A (en) * | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
| US5864633A (en) * | 1996-05-17 | 1999-01-26 | Therma-Wave, Inc. | Method and apparatus for optical data analysis |
| US6483580B1 (en) * | 1998-03-06 | 2002-11-19 | Kla-Tencor Technologies Corporation | Spectroscopic scatterometer system |
| IL123727A (en) * | 1998-03-18 | 2002-05-23 | Nova Measuring Instr Ltd | Method and apparatus for measurement of patterned structures |
| KR100513574B1 (ko) * | 2000-01-26 | 2005-09-09 | 팀버 테크놀로지스, 인코포레이티드 | 신속 정밀한 결합-파 분석을 위한 층 내부의 계산들의 캐싱 |
| US6429943B1 (en) * | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
| US6532076B1 (en) * | 2000-04-04 | 2003-03-11 | Therma-Wave, Inc. | Method and apparatus for multidomain data analysis |
| EP1309849A2 (en) * | 2000-08-10 | 2003-05-14 | Therma-Wave, Inc. | Database interpolation method for optical measurement of diffractive microstructures |
| IL140179A (en) * | 2000-12-07 | 2004-09-27 | Nova Measuring Instr Ltd | Method and system for measuring in patterned structures |
| US6819426B2 (en) * | 2001-02-12 | 2004-11-16 | Therma-Wave, Inc. | Overlay alignment metrology using diffraction gratings |
| EP1370828B1 (en) * | 2001-03-02 | 2016-11-23 | Accent Optical Technologies, Inc. | Line profile asymmetry measurement using scatterometry |
| US6785638B2 (en) * | 2001-08-06 | 2004-08-31 | Timbre Technologies, Inc. | Method and system of dynamic learning through a regression-based library generation process |
| US6898596B2 (en) * | 2001-10-23 | 2005-05-24 | Therma-Wave, Inc. | Evolution of library data sets |
-
2002
- 2002-02-12 US US10/075,904 patent/US6609086B1/en not_active Expired - Lifetime
-
2003
- 2003-02-10 WO PCT/US2003/003955 patent/WO2003068889A1/en not_active Ceased
- 2003-02-10 TW TW092102714A patent/TWI221566B/zh active
- 2003-02-10 AU AU2003215141A patent/AU2003215141A1/en not_active Abandoned
- 2003-02-10 KR KR1020047012519A patent/KR100910003B1/ko not_active Expired - Fee Related
- 2003-02-10 EP EP03710958A patent/EP1483355A4/en not_active Withdrawn
- 2003-02-10 JP JP2003568005A patent/JP2005517903A/ja active Pending
- 2003-02-10 CN CNB03808175XA patent/CN100424711C/zh not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105452963A (zh) * | 2013-08-13 | 2016-03-30 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
| CN105452963B (zh) * | 2013-08-13 | 2017-08-22 | Asml荷兰有限公司 | 用于评价结构的所感兴趣的参数的值的重构品质的方法和检验设备以及计算机程序产品 |
| US9760018B2 (en) | 2013-08-13 | 2017-09-12 | Asml Netherlands B.V. | Method and inspection apparatus and computer program product for assessing a quality of reconstruction of a value of a parameter of interest of a structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200302971A (en) | 2003-08-16 |
| EP1483355A4 (en) | 2007-05-16 |
| KR20040081792A (ko) | 2004-09-22 |
| JP2005517903A (ja) | 2005-06-16 |
| CN100424711C (zh) | 2008-10-08 |
| WO2003068889A8 (en) | 2003-11-13 |
| US6609086B1 (en) | 2003-08-19 |
| KR100910003B1 (ko) | 2009-07-29 |
| TWI221566B (en) | 2004-10-01 |
| WO2003068889A1 (en) | 2003-08-21 |
| AU2003215141A8 (en) | 2003-09-04 |
| AU2003215141A1 (en) | 2003-09-04 |
| EP1483355A2 (en) | 2004-12-08 |
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| C14 | Grant of patent or utility model | ||
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Owner name: TOKYO YILI KECHUANG USA INC. Free format text: FORMER OWNER: TEL TIMBRE TECHNOLOGY INC. Effective date: 20140423 |
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| CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: TEL sound quality technology Address before: California, USA Patentee before: Timbre Technologies, Inc. |
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Effective date of registration: 20140423 Address after: Texas, USA Patentee after: Tokyo Yili Kechuang company in the United States Address before: California, USA Patentee before: TEL sound quality technology |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081008 Termination date: 20170210 |
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| CF01 | Termination of patent right due to non-payment of annual fee |